A fast-recovery diode frame structure with high heat dissipation

Abstract

The present invention discloses a fast recovery diode frame structure with high heat dissipation, including a frame substrate and a positioning part. The frame substrate and the positioning part are connected by a locking mechanism. Among them, a diode installation groove for diode encapsulation is provided on the top surface of the frame substrate, and a heat dissipation part for diode heat dissipation is provided on the ground surface of the frame substrate; the heat dissipation part includes a plurality of wiring holes, the wiring holes penetrate through the frame substrate, and air convection is formed between multiple adjacent wiring holes through a convection channel for heat dissipation of the diode in the diode installation groove. By providing a diode installation groove on the front surface of the frame substrate for the installation of the fast recovery diode, and providing a heat dissipation part on the back surface of the frame substrate, heat dissipation fins are arranged in the heat dissipation part, the heat dissipation fins are connected to heat dissipation columns, the heat dissipation columns are connected to a heat conduction plate in the wiring holes, and multiple wiring holes are connected through the convection channel, effectively improving the air convection effect at the bottom of the frame substrate and improving the heat dissipation performance of the diode frame structure.

Description

Technical Field

[0001] The present invention relates to the technical field of diodes, and particularly to a fast recovery diode frame structure with high heat dissipation. Background Art

[0002] In real life, a diode is an electronic device made of semiconductor materials (such as silicon, selenium, germanium, etc.). It has the property of unidirectional conductivity, that is, when a forward voltage is applied to the anode and cathode of the diode, the diode conducts. When a reverse voltage is applied to the anode and cathode, the diode is cut off. Therefore, the conduction and cut-off of the diode are equivalent to the on and off of a switch.

[0003] The diode is one of the earliest semiconductor devices, and its applications are very extensive. Especially in various electronic circuits, by reasonably connecting diodes with components such as resistors, capacitors, and inductors to form circuits with different functions, various functions such as rectifying alternating current, detecting modulated signals, limiting and clamping, and stabilizing the power supply voltage can be achieved. Whether in a common radio circuit or in other household electrical appliance products or industrial control circuits, the trace of the diode can be found.

[0004] During the use of the installation frame of the existing diode structure, it does not have a heat dissipation function, resulting in poor heat dissipation effect of the diode, reducing the service efficiency of the diode. At the same time, the disassembly and assembly of the existing diode installation frame are carried out by bonding or riveting and covering for encapsulation, resulting in inconvenient maintenance, disassembly, and assembly of the diode frame structure. Summary of the Invention

[0005] The purpose of the present invention is to provide a fast recovery diode frame structure with high heat dissipation. By opening a diode installation slot on the front surface of the frame substrate for installing the fast recovery diode, a heat dissipation part is opened on the back surface of the frame substrate, heat dissipation fins are arranged in the heat dissipation part, the heat dissipation fins are connected to heat dissipation columns, the heat dissipation columns are connected to a heat conduction plate in the wire holes, and multiple wire holes are communicated through a convection channel, effectively improving the air convection effect at the bottom of the frame substrate and enhancing the heat dissipation performance of the diode frame structure. At the same time, the positioning part is covered on the frame substrate through a locking mechanism, realizing the quick disassembly and assembly of the positioning part on the frame substrate, and facilitating the maintenance, disassembly, and assembly of the fast recovery diode.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A fast recovery diode frame structure with high heat dissipation, including a frame substrate and a positioning part, wherein the frame substrate and the positioning part are connected through a locking mechanism;

[0008] Among them, a diode installation slot for diode encapsulation is opened on the top surface of the frame substrate, and a heat dissipation part for diode heat dissipation is opened on the bottom surface of the frame substrate;

[0009] The heat dissipation part includes a plurality of wire holes, which penetrate through the frame substrate, and air convection is formed between adjacent wire holes through a convection channel for dissipating heat of the diode in the diode mounting groove.

[0010] As a further solution of the present invention: the heat dissipation part is an inwardly concave rectangular groove structure, and heat dissipation fins are arranged inside the rectangular groove of the heat dissipation part.

[0011] As a further solution of the present invention: the diode is encapsulated in the diode mounting groove to form a diode package body, a heat conducting plate is arranged at the bottom of the diode package body, and the heat conducting plate covers the wire hole in the diode mounting groove.

[0012] As a further solution of the present invention: heat dissipation columns are arranged in the wire holes, the upper ends of the heat dissipation columns abut against the heat conducting plate, and the lower ends of the heat dissipation columns are connected to the heat dissipation fins.

[0013] As a further solution of the present invention: wire grooves for wiring are formed on the frame substrate and on the transverse sides of the diode mounting groove.

[0014] As a further solution of the present invention: heat dissipation channels are formed on the peripheral side surfaces of the frame substrate and around the heat dissipation part.

[0015] As a further solution of the present invention: a limiting hole is formed on one side inside the diode mounting groove, and a clamping groove is formed on the other side inside the diode mounting groove.

[0016] As a further solution of the present invention: a handle groove is formed on the top surface of the positioning part, and a packaging groove is formed below the handle groove;

[0017] The locking mechanism includes a pin shaft fixedly arranged inside the handle groove, a sleeve is rotatably connected to the pin shaft, a handle and a connecting plate are fixedly arranged on the outer circumferential surface of the sleeve, a clamping block is slidably connected to the end of the connecting plate, and the clamping block moves horizontally under the action of elastic force in the packaging groove to complete the assembly of the clamping block and the clamping groove.

[0018] As a further solution of the present invention: the connecting plate is in a U-shaped structure, and return grooves are formed on both sides of the connecting plate, and the return grooves on both sides of the connecting plate are slidably connected to the connecting columns on both sides of the clamping block.

[0019] As a further solution of the present invention: guide rods are arranged horizontally at the four corners inside the packaging groove, a sliding block is slidably connected to the four guide rods, one side of the sliding block is fixedly connected to the clamping block, and a spring is connected to the other side of the sliding block, and the end of the spring away from the sliding block is connected to the bottom of the packaging groove.

[0020] The beneficial effects of the present invention:

[0021] (1) The present invention provides a fast-recovery diode mounting structure. A diode mounting groove is formed on the front side of the frame substrate for mounting the fast-recovery diode. A heat dissipation part is formed on the back side of the frame substrate, and a heat sink is arranged inside the heat dissipation part. The heat sink is connected to heat dissipation columns, and the heat dissipation columns are connected to a heat conduction plate through wire holes. Multiple wire holes are connected through a convection channel, effectively improving the air convection effect at the bottom of the frame substrate and enhancing the heat dissipation performance of the diode frame structure.

[0022] (2) By forming heat dissipation channels around the heat dissipation part, the present invention can further improve the air circulation performance of the heat dissipation part.

[0023] (3) By arranging wire grooves on both sides of the diode mounting groove, the wiring of the fast-recovery diode frame structure becomes more regular.

[0024] (4) When the locking mechanism of the present invention is in use, pulling the handle causes the handle to drive the sleeve to rotate counterclockwise on the pin shaft, making the connecting plate drive the clamping block to move towards one end of the bottom of the encapsulation groove. The connecting columns on both sides of the clamping block move in the loop groove of the connecting plate, compressing the spring by the clamping block, and the clamping block is removed from the clamping groove, thereby realizing the disassembly and assembly of the positioning part on the frame substrate and making the disassembly and assembly of the fast-recovery diode frame structure more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The following further describes the present invention with reference to the accompanying drawings.

[0026] Figure 1 FIG. 1 is a perspective view of the present invention;

[0027] Figure 2 FIG. 2 is a perspective view of the frame substrate of the present invention;

[0028] Figure 3 FIG. 3 is a front view of the frame substrate of the present invention;

[0029] Figure 4 FIG. 4 is a bottom view of the frame substrate of the present invention;

[0030] Figure 5 FIG. 5 is a schematic structural view of the encapsulation hole in the present invention;

[0031] Figure 6 FIG. 6 is a schematic structural view of the locking mechanism in the present invention.

[0032] In the figures: 1. Frame substrate; 101. Diode mounting groove; 102. Wire groove; 103. Limit hole; 104. Heat dissipation part; 105. Heat dissipation channel; 106. Wire hole; 107. Convection channel; 108. Heat dissipation column; 109. Heat sink; 110. Heat conduction plate; 111. Diode package;

[0033] 2. Positioning part; 201. Encapsulation hole; 202. Handle groove; 203. Encapsulation groove;

[0034] 3. Locking mechanism; 301. Pin shaft; 302. Handle; 303. Connecting plate; 304. Return-shaped groove; 305. Guide rod; 306. Spring; 307. Slide block; 308. Block; 309. Connecting column; 310. Card slot. Detailed implementation manner

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0036] Please refer to Figures 1-6 As shown, the present invention is a fast-recovery diode frame structure with high heat dissipation. A positioning part 2 is covered on the top surface of the frame substrate 1. The positioning part 2 is connected to the frame substrate 1 through a locking mechanism 3. A plurality of diode encapsulation bodies 111 are arranged between the frame substrate 1 and the positioning part 2;

[0037] Among them, referring to Figure 3 , the diode encapsulation body 111 includes a diode body. The diode body is encapsulated on a heat conduction plate 110 to form the diode encapsulation body 111. The diode encapsulation body 111 is in a columnar structure;

[0038] Referring to Figure 2 , the frame substrate 1 is in a rectangular parallelepiped structure. A diode installation groove 101 is opened on the top surface of the frame substrate 1. The diode installation groove 101 is in a rectangular structure. A plurality of diode encapsulation bodies 111 and heat conduction plates 110 are arranged inside the diode installation groove 101. The diode encapsulation bodies 111 are erected on the heat conduction plates 110;

[0039] Among them, a plurality of wire grooves 102 are opened on the transverse two sides of the frame substrate 1 and located in the diode installation groove 101. The wire grooves 102 are in a square structure for laying wires in electronic components. Among them, the wire grooves 102 on the transverse two sides of the frame substrate 1 can be symmetrically arranged or asymmetrically arranged;

[0040] Referring to Figures 2-4 , a heat dissipation part 104 is opened on the bottom surface of the frame substrate 1. The heat dissipation part 104 is an inwardly concave rectangular frame groove. A heat dissipation fin 109 is fixedly arranged inside the rectangular frame groove of the heat dissipation part 104. And the heat dissipation fin 109 is arranged at a certain interval from the top surface of the heat dissipation part 104, which can ensure the air circulation between the heat dissipation part 104 and the heat dissipation fin 109 and improve the heat dissipation effect;

[0041] On the groove surface of the diode mounting groove 101 of the frame substrate 1 and directly below the heat conducting plate 110, a wiring hole 106 is opened. The wiring hole 106 penetrates through the frame substrate 1, and a heat dissipation column 108 is arranged inside the wiring hole 106. The top end of the heat dissipation column 108 abuts against the bottom surface of the heat conducting plate 110, and the bottom end of the heat dissipation column 108 abuts against the heat sink 109;

[0042] Among them, a plurality of wiring holes 106 on the frame substrate 1 communicate with each other. That is, a convection channel 107 is opened between adjacent wiring holes 106 to realize the mutual circulation of the heat of the heat dissipation columns 108 in each wiring hole 106 and improve the overall heat dissipation effect;

[0043] Refer to Figure 4 , a plurality of groups of heat dissipation channels 105 are opened at the bottom of the frame substrate 1 and around the heat dissipation part 104. The heat dissipation channels 105 are used for the air circulation between the heat dissipation part 104 and the outside;

[0044] And by opening heat dissipation channels 105 around the entire frame substrate 1 to form convection, the overall heat dissipation and ventilation effect is better;

[0045] The heat dissipation channel 105 can be a square channel, a circular channel or other irregular channels, as long as it can realize the convective ventilation of the heat dissipation part 104;

[0046] Refer to Figure 1 , Figure 5 , the positioning part 2 covers the diode mounting groove 101 of the frame substrate 1. A plurality of packaging holes 201 are opened on the top surface of the positioning part 2. The packaging holes 201 penetrate through the positioning part 2. The packaging holes 201 are also used for the heat dissipation of the diode package 111;

[0047] Among them, the packaging hole 201 is composed of an upper trumpet-shaped structure and a lower cylindrical structure. The upper end of the trumpet-shaped structure has a small opening, and the lower end has a large opening. The inner diameter of the cylindrical structure is the same as the inner diameter of the trumpet-shaped structure;

[0048] Among them, the diode package 111 has a columnar structure. The number of packaging holes 201 on the positioning part 2 is the same as the number of diode packages 111 in the frame substrate 1, and the positions correspond one by one. Each packaging hole 201 is directly above the diode package 111. The packaging hole 201 is sleeved on the diode package 111, so that the top of the diode package 111 passes through the cylindrical structure of the packaging hole 201 and abuts against the lower part of the trumpet-shaped structure;

[0049] That is, through the penetrating encapsulation holes 201, the top heat dissipation of the diode package 111 can be achieved. By setting the upper part of the encapsulation holes 201 in a horn-shaped structure with a small upper opening and a large lower opening, it can also prevent impurities such as dust from entering the inside of the frame substrate 1 through the encapsulation holes 201, and improve the service life of the diode body inside the frame substrate 1;

[0050] Among them, referring to Figure 1 、 Figure 2 、 Figure 6 On one side inside the frame substrate 1, a limiting hole 103 is provided, and on the other side inside the frame substrate 1, a clamping groove 310 is provided;

[0051] During use, through the locking mechanism 3, the limiting block on one side of the positioning part 2 is clamped into the limiting hole 103, and the clamping block 308 on the other side of the positioning part 2 is inserted into the clamping groove 310, so as to realize the locking and fixing of the positioning part 2 on the frame substrate 1;

[0052] Among them, on one side of the top of the positioning part 2, a handle groove 202 is provided, and directly below the handle groove 202, an encapsulation groove 203 is provided, and the handle groove 202 and the encapsulation groove 203 are communicated;

[0053] Referring to Figure 6 Inside the handle groove 202, a pin shaft 301 is provided. A sleeve is provided on the pin shaft 301. On one side of the sleeve, a handle 302 is provided, and on the other side of the sleeve, a connecting plate 303 is provided. The handle 302 and the connecting plate 303 form a V-shaped structure on the sleeve;

[0054] Inside the encapsulation groove 203, four guide rods 305 are provided. A sliding block 307 is slidably arranged on the four guide rods 305. One side of the sliding block 307 is fixedly connected with a spring 306, and the other end of the spring 306 is fixedly arranged on the inner bottom surface of the encapsulation groove 203;

[0055] On the other side of the sliding block 307, a clamping block 308 is fixedly arranged. At the middle positions of the front and rear sides of the clamping block 308, connecting columns 309 are fixedly arranged;

[0056] The connecting plate 303 is in a U-shaped structure. On the plate surfaces on both sides of the connecting plate 303, return-shaped grooves 304 are provided. The return-shaped grooves 304 on the plate surfaces on both sides of the connecting plate 303 are clamped on the clamping block 308, so that during the horizontal movement of the clamping block 308, the connecting columns 309 on both sides of the clamping block 308 slide in the return-shaped grooves 304 of the connecting plate 303;

[0057] During use, pull the handle 302, causing the handle 302 to drive the sleeve to rotate counterclockwise on the pin shaft 301, causing the connecting plate 303 to drive the latch 308 to move towards one end of the bottom of the encapsulation groove 203, causing the connecting columns 309 on both sides of the latch 308 to move within the return groove 304 of the connecting plate 303, causing the latch 308 to compress the spring 306, and the latch 308 to move out of the card slot 310, thereby realizing the disassembly and assembly of the positioning portion 2 on the frame substrate 1.

[0058] When specifically assembling the fast recovery diode frame structure with high heat dissipation, the following steps are included:

[0059] S1: Place the diode on the heat conducting plate 110, and realize the encapsulation of the diode on the heat conducting plate 110 through an adhesive substance, so that a cylindrical diode encapsulation body 111 is formed on the heat conducting plate 110, and a plurality of diode encapsulation bodies 111 and the heat conducting plate 110 are erected on the groove surface of the diode installation groove 101;

[0060] Among them, the adhesive substance includes epoxy resin or soft solder;

[0061] Among them, when using epoxy resin for encapsulation, the positioning portion 2 can also be pre-installed on the frame substrate 1, and the diode can be encapsulated by injecting epoxy resin into the encapsulation hole 201;

[0062] S2: Insert the heat dissipation column 108 into the wiring hole 106 at the bottom of the frame substrate 1, connect the upper end of the heat dissipation column 108 to the bottom surface of the heat conducting plate 110, and connect the lower end of the heat dissipation column 108 to the top surface of the heat sink 109, so that the heat dissipation column 108 realizes guiding the heat of the heat conducting plate 110 to the heat sink 109, realizing heat dissipation of the diode;

[0063] Among them, the heat sink 109 is welded or riveted to the inner side wall of the rectangular groove of the heat dissipation portion 104, and the plurality of wiring holes 106 are connected through the convection channel 107, thereby realizing multi-channel heat dissipation and improving the heat dissipation quality of the frame substrate 1.

[0064] S3; Snap the limit block on one side of the positioning part 2 into the limit hole 103, pull the handle 302, so that the handle 302 drives the sleeve to rotate counterclockwise on the pin shaft 301, so that the connecting plate 303 drives the clamping block 308 to move towards one end of the bottom of the encapsulation groove 203, so that the connecting columns 309 on both sides of the clamping block 308 move in the return groove 304 of the connecting plate 303, so that the clamping block 308 compresses the spring 306, and the distance between the end face of the clamping block 308 and the inner side surface of the frame substrate 1 is 1-2 mm. When the clamping block 308 moves to a position flush with the clamping groove 310, push the handle 302, so that the handle 302 drives the sleeve to rotate clockwise on the pin shaft 301, so that the connecting plate 303 drives the clamping block 308 to move away from one end of the bottom of the encapsulation groove 203, so that the connecting columns 309 on both sides of the clamping block 308 move in the return groove 304 of the connecting plate 303, and the clamping block 308 is inserted into the clamping groove 310, completing the capping installation of the positioning part 2 on the frame substrate 1;

[0065] Among them, the encapsulation hole 201 is sleeved on the diode encapsulation body 111 during the capping process, and the heat is dissipated through the encapsulation hole 201, realizing the two-way heat dissipation of the frame substrate 1. At the same time, the horn-shaped structure above the encapsulation hole 201 can also prevent dust and other impurities from entering the inside of the frame substrate 1 through the encapsulation hole 201, improving the service life of the diode body inside the frame substrate 1.

[0066] The above has described a specific embodiment of the present invention in detail, but the above content is only the preferred embodiment of the present invention and cannot be considered as limiting the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the present invention application should still fall within the scope covered by the patent of the present invention.

Claims

1. A fast-recovery diode frame structure with high heat dissipation, characterized in that, It includes a frame substrate (1) and a positioning part (2), and the frame substrate (1) and the positioning part (2) are connected by a locking mechanism (3); Wherein, a diode mounting groove (101) for diode packaging is provided on the top surface of the frame substrate (1), and a heat dissipation part (104) for diode heat dissipation is provided on the bottom surface of the frame substrate (1); The heat dissipation part (104) includes a plurality of wire holes (106), the wire holes (106) penetrate through the frame substrate (1), and air convection is formed between adjacent wire holes (106) through a convection channel (107) for heat dissipation of the diode in the diode mounting groove (101); A heat dissipation column (108) is arranged in the wire hole (106), the upper end of the heat dissipation column (108) abuts against a heat conduction plate (110), and the lower end of the heat dissipation column (108) is connected to a heat sink (109); Insert a heat dissipation column into the wire hole at the bottom of the frame substrate, connect the upper end of the heat dissipation column to the bottom surface of the heat conduction plate, and connect the lower end of the heat dissipation column to the top surface of the heat sink, so that the heat dissipation column guides the heat of the heat conduction plate to the heat sink to realize heat dissipation of the diode; A plurality of packaging holes are provided on the top surface of the positioning part, and the packaging holes penetrate through the positioning part; The packaging hole is composed of an upper trumpet-shaped structure and a lower cylindrical structure. The upper end opening of the trumpet-shaped structure is small, the lower end opening is large, and the inner diameter of the cylindrical structure is the same as that of the trumpet-shaped mechanism; Each packaging hole is located directly above the diode package, and the packaging hole is sleeved on the diode package, so that the top of the diode package passes through the cylindrical structure of the packaging hole and abuts against the lower part of the trumpet-shaped structure; The top heat dissipation of the diode package can be realized through the penetrating packaging hole.

2. The fast recovery diode frame structure with high heat dissipation according to claim 1, characterized in that, The heat dissipation part (104) is an inwardly concave rectangular groove structure, and a heat sink (109) is arranged inside the rectangular groove of the heat dissipation part (104).

3. The fast recovery diode frame structure with high heat dissipation according to claim 2, characterized in that The diode is packaged in the diode mounting groove (101) to form a diode package (111). A heat conduction plate (110) is arranged at the bottom of the diode package (111), and the heat conduction plate (110) covers the wire hole (106) in the diode mounting groove (101).

4. A fast-recovery diode frame structure with high heat dissipation according to claim 1, characterized in that, Wire grooves (102) for wiring are provided on the frame substrate (1) and on the lateral sides of the diode mounting groove (101).

5. A fast recovery diode frame structure with high heat dissipation according to claim 1, characterized in that, Heat dissipation channels (105) are provided on the peripheral side surfaces of the frame substrate (1) and around the heat dissipation part (104).

6. The fast recovery diode frame structure with high heat dissipation according to claim 1, characterized in that, A limiting hole (103) is provided on one side inside the diode mounting groove (101), and a clamping groove (310) is provided on the other side inside the diode mounting groove (101).

7. The fast-recovery diode frame structure with high heat dissipation according to claim 6, characterized in that A handle groove (202) is provided on the top surface of the positioning part (2), and a packaging groove (203) is provided below the handle groove (202); The locking mechanism (3) includes a pin shaft (301) fixedly arranged inside the handle groove (202). A sleeve is rotatably connected to the pin shaft (301). A handle (302) and a connecting plate (303) are fixedly arranged on the outer circumferential surface of the sleeve. A clamping block (308) is slidably connected to the end of the connecting plate (303). The clamping block (308) moves horizontally under the action of elastic force in the encapsulation groove (203) to complete the assembly of the clamping block (308) and the clamping groove (310).

8. A fast-recovery diode frame structure with high heat dissipation according to claim 7, characterized in that, The connecting plate (303) is in a U-shaped structure, and return grooves (304) are formed on both sides of the connecting plate (303). The return grooves (304) on both sides of the connecting plate (303) are slidably connected to the connecting columns (309) on both sides of the clamping block (308).

9. The fast-recovery diode frame structure with high heat dissipation according to claim 8, characterized in that, Guide rods (305) are arranged horizontally at the four corners inside the encapsulation groove (203). A sliding block (307) is slidably connected to the four guide rods (305). One side of the sliding block (307) is fixedly connected to the clamping block (308). The other side of the sliding block (307) is connected to a spring (306). One end of the spring (306) away from the sliding block (307) is connected to the bottom of the encapsulation groove (203).

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