A plastic encapsulation tooling and its process

Abstract

The present invention discloses a plastic encapsulation tooling and its process, which relates to the technical field of chip plastic encapsulation. It includes a plastic encapsulation platform. On one side of the plastic encapsulation platform, there is a feeding conveyor belt for feeding chips, and on the other side, there is a feeding plate for feeding plastic encapsulation housings. A positioning groove for plastic encapsulation is opened on the plastic encapsulation platform. Among them, a driving plate is arranged on the plastic encapsulation platform, and the driving plate is connected to a driving mechanism that drives it to reciprocate horizontally in the horizontal direction. One end of the driving plate facing the plastic encapsulation platform is provided with a first cylinder, the first cylinder is connected to a chip feeding mechanism, and the other end is provided with a second cylinder, and the second cylinder is connected to a plastic encapsulation housing feeding mechanism. The chip feeding mechanism is driven by the driving mechanism to be transferred onto the plastic encapsulation platform. The chip is transferred into the plastic encapsulation housing by the first cylinder for assembly and then undergoes plastic encapsulation treatment. The feeding of the chip and the plastic encapsulation housing is realized through the synchronous cooperation of the two feeding mechanisms, and the feeding efficiency is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of chip plastic encapsulation, and specifically relates to a plastic encapsulation tooling and its process. Background Art

[0002] In the related art, when an integrated circuit chip plastic encapsulation device performs plastic encapsulation on a circuit chip, first, a mold is placed at the position for placing the chip on a substrate through a grasping component, and then the chip is placed through the grasping component, thereby facilitating the plastic encapsulation operation. The substrate, the mold, and the chip are synchronously conveyed below the grasping component, and the mold and the chip are sequentially grasped and installed by the left and right movement of the grasping component.

[0003] In the prior art, a patent document with the publication number CN114628287A discloses an integrated circuit chip plastic encapsulation device, and simultaneously discloses a protective cover component, a moving component, and a plastic encapsulation component. The protective cover component includes a bottom plate, a protective cover, and three conveyor belt mechanisms. The moving component includes a sliding member, a transmission member, a moving seat, and a driving motor. When the driving motor is turned on, the driving motor drives the second rotating shaft to rotate, and the transmission screw and the first rotating shaft rotate with the second rotating shaft. According to the principle of screw transmission, the transmission screw drives the moving seat to move along the sliding rod; however, in the actual application process, only one set of grasping devices is used to simultaneously grasp the housing and the chip to be encapsulated. On the one hand, this will cause low grasping efficiency. On the other hand, since the sizes of the chip and the housing are different, it is necessary to adjust the grasping angle of the grasping device during the grasping process, making the operation difficulty of the equipment higher. Summary of the Invention

[0004] The purpose of the present invention is to provide a plastic encapsulation tooling and its process to solve the following technical problems:

[0005] On the one hand, it will cause low grasping efficiency. On the other hand, since the sizes of the chip and the housing are different, it is necessary to adjust the grasping angle of the grasping device during the grasping process, making the operation difficulty of the equipment higher.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A plastic encapsulation tooling includes a plastic encapsulation platform. A feeding conveyor belt for feeding chips is arranged on one side of the plastic encapsulation platform, and a feeding plate for feeding plastic encapsulation shells is arranged on the other side.

[0008] A positioning groove for plastic encapsulation is opened on the plastic encapsulation platform.

[0009] Among them, a driving plate is arranged on the plastic encapsulation platform, and the driving plate is connected to a driving mechanism that drives it to reciprocate horizontally.

[0010] One end of the driving board facing the direction of the plastic encapsulation platform is provided with a first air cylinder, the first air cylinder is connected to the chip loading mechanism, and the other end is provided with a second air cylinder, and the second air cylinder is connected to the plastic encapsulation housing loading mechanism.

[0011] Preferably, the plastic encapsulation housing includes a set of square frames, and convex limiting parts are arranged on the square frames.

[0012] Preferably, the chip loading mechanism includes a vacuum chuck arranged at the driving end of the first air cylinder, and a plurality of groups of suction cups are arranged in a circumferential array at the bottom of the vacuum chuck.

[0013] Preferably, the plastic encapsulation housing loading mechanism includes a positioning disc arranged at the driving end of the second air cylinder, four groups of limiting plates are arranged in a circumferential array at the bottom of the positioning disc, and a supporting plate is rotatably arranged at the bottom of one side of each group of limiting plates close to each other;

[0014] Wherein, a limiting seat perpendicular to the limiting plate is further arranged at the bottom of the supporting plate.

[0015] Preferably, four groups of grooves are correspondingly opened on the periphery of the positioning groove, and the groove depth of the grooves is greater than the groove depth of the positioning groove.

[0016] Preferably, a convex supporting part is arranged at the corner of the groove wall in the positioning groove, a first through hole is opened in the supporting part, the first through hole is communicated with a first pipeline arranged on the plastic encapsulation platform, the first pipelines of the second two groups on the same side are connected to a second pipeline, and the second pipeline is connected to the plastic encapsulation liquid conveying mechanism;

[0017] Wherein, a second through hole communicated with the first through hole is correspondingly arranged on the plastic encapsulation housing.

[0018] Preferably, the plastic encapsulation liquid conveying mechanism includes a piston cylinder arranged at the bottom of the plastic encapsulation platform, a liquid inlet pipe on one side of the piston cylinder is communicated with the bottom of the liquid storage tank, and the other side of the piston cylinder is communicated with the second pipeline through a liquid conveying pipe;

[0019] Wherein, a piston is arranged in the piston cylinder, and the piston is connected to a pushing mechanism for driving it to reciprocate in the piston cylinder.

[0020] Preferably, the pushing mechanism includes a push rod fixed to the piston, and the push rod extends into the groove;

[0021] Wherein, a return spring is arranged on the push rod.

[0022] Preferably, a plurality of groups of air grooves are further arranged in the positioning groove, and the air grooves are connected to a hot air blower through an air cylinder.

[0023] A plastic encapsulation process includes the following steps:

[0024] S1. The driving mechanism drives the driving board to move, so as to move the plastic encapsulation housing loading mechanism onto the loading board;

[0025] S2. Start the second cylinder to drive it closer to the loading plate, and the plastic package housing loading mechanism positions and fixes the plastic package housing.

[0026] S3. The second cylinder drives the plastic package housing loading mechanism to reset. The driving mechanism drives the plastic package housing loading mechanism to move to the plastic encapsulation platform, and the second cylinder is started to place the positioned plastic package housing into the positioning groove.

[0027] S4. The plastic encapsulation liquid delivery mechanism is delivered to the plastic package housing through the second pipeline, the first pipeline, the first through hole, and the second through hole.

[0028] S5. Synchronously start the first cylinder to drive the chip loading mechanism above the loading conveyor belt to position and fix the chip.

[0029] S6. The driving end of the first cylinder resets. The driving mechanism drives the chip loading mechanism to move to the plastic encapsulation platform, and the chip is transferred into the plastic package housing through the first cylinder.

[0030] S7. After the chip is assembled into the plastic package housing, start the hot air blower and deliver it to the positioning groove through the air duct and the air slot.

[0031] Advantages of the present invention:

[0032] In the present invention, the chip loading mechanism is just located above the loading conveyor belt. Start the first cylinder to drive the chip loading mechanism above the loading conveyor belt to position and fix the chip. Secondly, the first cylinder resets. The driving mechanism drives the chip loading mechanism to move to the plastic encapsulation platform, and the chip is transferred into the plastic package housing through the first cylinder. After assembly, plastic encapsulation treatment is carried out. The feeding of the chip and the plastic package housing is realized through the synchronous cooperation of the two feeding mechanisms, and the feeding efficiency is higher.

[0033] When placing the plastic package housing in the present invention, the plastic encapsulation liquid delivery mechanism is delivered to the plastic package housing through the second pipeline, the first pipeline, the first through hole, and the second through hole. Then, when the chip is placed in the plastic package housing, the effect of automatic plastic encapsulation can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will be further described below with reference to the drawings.

[0035] Figure 1 is the structural schematic diagram of a plastic encapsulation tooling of the present invention Figure 1 ;

[0036] Figure 2 is the structural schematic diagram of a plastic encapsulation tooling of the present invention Figure 2 ;

[0037] Figure 3 is the structural schematic diagram of a plastic encapsulation tooling of the present invention Figure 3 ;

[0038] Figure 4 is a schematic diagram of the structure of a plastic encapsulation tooling of the present invention Figure 4 ;

[0039] Figure 5 is a schematic diagram of the structure of a plastic encapsulation housing in a plastic encapsulation tooling of the present invention;

[0040] Figure 6 is a schematic diagram of the structure of a positioning plate in a plastic encapsulation tooling of the present invention;

[0041] Figure 7 is a schematic diagram of the structure of a plastic encapsulation platform in a plastic encapsulation tooling of the present invention;

[0042] Figure 8 is a schematic diagram of the structure of a chip support in a plastic encapsulation tooling of the present invention Figure 1 ;

[0043] Figure 9 is a schematic diagram of the structure of a chip support in a plastic encapsulation tooling of the present invention Figure 2 。

[0044] In the figure: 1, plastic encapsulation platform; 2, loading plate; 3, hot air blower; 4, synchronous belt box; 5, loading conveyor belt; 6, positioning plate; 7, liquid storage tank; 8, chip; 101, positioning groove; 102, air groove; 103, support part; 104, groove; 105, air cylinder; 106, first pipeline; 107, second pipeline; 108, infusion tube; 109, piston cylinder; 201, L-shaped clamping plate; 202, support pillar; 401, driving plate; 402, first air cylinder; 403, second air cylinder; 404, vacuum plate; 405, suction cup; 601, limiting plate; 602, supporting plate; 603, limiting seat; 604, elastic pad; 701, push rod; 702, first through hole; 801, plastic encapsulation housing; 802, limiting part; 803, second through hole. Specific embodiments

[0045] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0046] Embodiment 1

[0047] Please refer to Figures 1 - 2As shown in the figure, the present invention is a plastic encapsulation tooling, including a plastic encapsulation platform 1. On one side of the plastic encapsulation platform 1, a feeding conveyor belt 5 for feeding chips 8 is arranged, and on the other side, a feeding plate 2 for feeding plastic encapsulation housings 801 is arranged. In an implementation manner of this embodiment, the feeding conveyor belt 5 is sleeved on two groups of driving rollers, and one side of the driving rollers is connected to a motor device that drives it to rotate, and the chips 8 to be plastic encapsulated are sequentially placed on the feeding conveyor belt 5 and conveyed towards the feeding end.

[0048] Meanwhile, the plastic encapsulation housing 801 to be plastic encapsulated is placed on the surface of the feeding plate 2 manually or by a feeding manipulator. In this implementation manner, the area of the feeding plate 2 is smaller than the area of the plastic encapsulation housing 801.

[0049] On the plastic encapsulation platform 1, a positioning groove 101 for plastic encapsulation is provided. Among them, a driving plate 401 is arranged on the plastic encapsulation platform 1, and the driving plate 401 is connected to a driving mechanism that drives it to reciprocate horizontally.

[0050] One end of the driving plate 401 facing the plastic encapsulation platform 1 is provided with a first cylinder 402, and the first cylinder 402 is connected to a chip feeding mechanism. The other end is provided with a second cylinder 403, and the second cylinder 403 is connected to a plastic encapsulation housing feeding mechanism.

[0051] Specifically, in this implementation manner, when feeding the chip 8 and the plastic encapsulation housing 801, first, the driving mechanism drives the driving plate 401 to move, so as to move the plastic encapsulation housing feeding mechanism to the feeding plate 2. Then, the second cylinder 403 is started to drive it to approach the feeding plate 2, and the plastic encapsulation housing 801 is positioned and fixed through the plastic encapsulation housing feeding mechanism. Then, the second cylinder 403 drives the plastic encapsulation housing feeding mechanism to reset. Secondly, the driving mechanism drives the plastic encapsulation housing feeding mechanism to move to the plastic encapsulation platform 1. Again, the second cylinder 403 is started to place the positioned plastic encapsulation housing 801 into the positioning groove 101.

[0052] Meanwhile, the chip feeding mechanism is just located on the feeding conveyor belt 5. The first cylinder 402 is started to drive the chip feeding mechanism above the feeding conveyor belt 5 to position and fix the chip 8. Secondly, the first cylinder 402 resets. The driving mechanism drives the chip feeding mechanism to move to the plastic encapsulation platform 1, and the chip is transferred into the plastic encapsulation housing 801 through the first cylinder 402 for assembly and then plastic encapsulated. In this embodiment, the feeding of the chip 8 and the plastic encapsulation housing 801 is realized through the synchronous cooperation of two groups of feeding mechanisms, and the feeding efficiency is higher.

[0053] Embodiment 2

[0054] On the basis of Embodiment 1, please refer to Figures 3 - 5, the plastic package housing 801 includes a set of square frames, and raised limiting parts 802 are arranged on the square frames; specifically, the chip 8 is assembled with the plastic package housing 801, limited by the limiting parts 802, and carried by the direction frame at the bottom;

[0055] The driving mechanism includes a synchronous belt box body 4 arranged on the plastic packaging platform 1. Rotating rollers are arranged in the synchronous belt box body 4 to be relatively rotatable. One side of the rotating roller is connected to the motor device, and belts fixed to the driving plate 401 are sleeved on both sides of the rotating rollers; in this embodiment, the motor device drives the rotating rollers to rotate, and the two rotating rollers drive the driving plate 401 to rotate through the belts during the rotation process;

[0056] The chip loading mechanism includes a vacuum chuck 404 arranged at the driving end of the first cylinder 402. A plurality of groups of suction cups 405 are arranged in a circumferential array at the bottom of the vacuum chuck 404; specifically, in this embodiment, the vacuum chuck 404 is connected to a vacuum pump or a negative pressure pump through a hose; it can be explained that when fixing the chip 8, the first cylinder 402 first drives the vacuum chuck 404 to move so that the suction cups 405 contact the chip 8, and then a negative pressure is generated at the vacuum chuck 404 and the suction cups 405 through the vacuum pump or the negative pressure pump to realize the adsorption and fixation of the chip 8;

[0057] The plastic package housing loading mechanism includes a positioning plate 6 arranged at the driving end of the second cylinder 403. Four groups of limiting plates 601 are arranged in a circumferential array at the bottom of the positioning plate 6. A support plate 602 is rotatably arranged at the bottom of each group of limiting plates 601 on the side close to each other. Among them, a limiting seat 603 perpendicular to the limiting plate 601 is also arranged at the bottom of the support plate 602; specifically, in this embodiment, the limiting seat 603 is fixedly arranged on one side of the limiting plate 601, so that the maximum rotation angle of the support plate 602 with respect to the limiting plate 601 is 90°, and the support plate 602 can only rotate in the direction towards the positioning plate 6 and cannot rotate in the direction away from the positioning plate 6;

[0058] It can be explained that when fixing the plastic package housing 801 on the loading plate 2, the second cylinder 403 drives the positioning plate 6 to move towards the plastic package housing 801. The support plate 602 contracts towards the limiting plate 601 under the abutting action of the edge of the chip 8. As the limiting plate 601 continues to move downward, the support plate 602 resets to support the chip 8;

[0059] As a further solution of this embodiment, please refer to Figures 6 - 7 , elastic pads 604 are pasted on the side walls of each group of limiting plates 601 close to each other; specifically, in this embodiment, the elastic pads 604 can be made of rubber pads; it can be explained that when the support plate 602 rotates towards the limiting plate 601 and rotates to be parallel to the limiting plate 601, a compressive force will be applied to the elastic pad 604 to cause its elastic deformation, and this elastic force can drive the support plate 602 to quickly reset;

[0060] Further, four groups of grooves 104 are correspondingly formed on the peripheral side of the positioning groove 101, and the groove depth of the groove 104 is greater than that of the positioning groove 101. It can be explained that when placing the plastic package housing 801, each group of supporting plates 602 first sinks into the groove 104. As the supporting plate 602 continues to move downward, under the abutting action of one side of the edge of the groove wall of the positioning groove 101, the supporting plate 602 continues to rotate towards the direction of the limiting plate 601 and disengages from the chip 8, so that the chip 8 falls into the positioning groove 101, and then the second cylinder 403 withdraws the supporting plate 602;

[0061] Please refer to Figures 8 - 9 , a convex supporting portion 103 is arranged at the corner of the groove wall in the positioning groove 101. A first through hole 702 is formed in the supporting portion 103, and the first through hole 702 is communicated with the first pipeline 106 arranged on the plastic packaging platform 1. The first pipelines 106 of the second two groups on the same side are connected to the second pipeline 107, and the second pipeline 107 is connected to the plastic packaging liquid conveying mechanism. Among them, a second through hole 803 communicated with the first through hole 702 is correspondingly arranged on the plastic package housing 801. It can be explained that when placing the plastic package housing 801, the plastic packaging liquid conveying mechanism transports the plastic packaging liquid to the plastic package housing 801 through the second pipeline 107, the first pipeline 106, the first through hole 702 and the second through hole 803. Therefore, when the chip 8 is placed in the plastic package housing 801, the effect of automatic plastic packaging can be achieved.

[0062] The plastic packaging liquid conveying mechanism includes a piston cylinder 109 arranged at the bottom of the plastic packaging platform 1. One side of the piston cylinder 109 is communicated with the bottom of the liquid storage tank 7 through a liquid inlet pipe. A one-way valve for only inlet liquid is arranged between the liquid inlet pipe and the piston cylinder 109. The other side of the piston cylinder 109 is communicated with the second pipeline 107 through a liquid delivery pipe 108. A one-way valve for only discharging liquid is arranged between the liquid delivery pipe 108 and the piston cylinder 109. Among them, a piston is arranged in the piston cylinder 109, and the piston is connected to a pushing mechanism for driving it to reciprocate in the piston cylinder 109. It can be explained that since the liquid delivery pipe 108 is located at the bottom of the liquid storage tank 7, the plastic packaging liquid in the liquid storage tank 7 falls into the piston cylinder 109 through the liquid delivery pipe 108 under the action of gravity. When the pushing mechanism drives the piston to move and compress in the piston cylinder 109, the plastic packaging liquid is pressed into the second pipeline 107 through the liquid delivery pipe 108;

[0063] The pushing mechanism includes a push rod 701 fixed to the piston. The push rod 701 extends into the groove 104. Among them, a return spring is arranged on the push rod 701. One end of the return spring is fixed to the plastic packaging platform 1, and the other end is fixed to the piston cylinder 109. It can be explained that when placing the plastic package housing 801, the process of the supporting plate 602 embedding into the groove 104 synchronously drives the push rod 701 to move. When the supporting plate 602 is withdrawn, the return spring drives it to reset;

[0064] The bottom of the loading plate 2 is provided with struts 202. Among them, four groups of L-shaped clamping plates 201 for limiting the plastic package housing 801 are arranged on the peripheral side of the loading plate 2, and the L-shaped clamping plates 201 are fixed to the struts 202.

[0065] In addition, several groups of air channels 102 are arranged in the positioning groove 101, and the air channels 102 are connected to the hot air blower 3 through air ducts 105. It can be explained that after the chip 8 is assembled in the plastic package housing 801, the hot air blower 3 is started, and the hot air is conveyed to the positioning groove 101 through the air ducts 105 and the air channels 102. Since the limiting part 802 protrudes to a certain height, a drying cavity can be formed to improve the bonding efficiency between the chip 8 and the plastic package housing 801.

[0066] A plastic packaging process includes the following steps:

[0067] S1. The driving mechanism drives the driving plate 401 to move, so as to move the plastic package housing feeding mechanism onto the loading plate 2;

[0068] S2. Start the second cylinder 403 to drive it to approach the loading plate 2, and the plastic package housing feeding mechanism positions and fixes the plastic package housing 801;

[0069] S3. The second cylinder 403 drives the plastic package housing feeding mechanism to reset, the driving mechanism drives the plastic package housing feeding mechanism to move to the plastic packaging platform 1, and the second cylinder 403 is started to place the positioned plastic package housing 801 into the positioning groove 101;

[0070] S4. The plastic packaging liquid feeding mechanism is conveyed to the plastic package housing 801 through the second pipeline 107, the first pipeline 106, the first through hole 702 and the second through hole 803;

[0071] S5. Synchronously start the first cylinder 402 to drive the chip feeding mechanism above the loading conveyor belt 5 to position and fix the chip 8;

[0072] S6. The driving end of the first cylinder 402 resets, the chip feeding mechanism is driven by the driving mechanism to move to the plastic packaging platform 1, and the chip 8 is moved into the plastic package housing 801 by the first cylinder 402;

[0073] S7. After the chip 8 is assembled in the plastic package housing 801, the hot air blower 3 is started, and the hot air is conveyed to the positioning groove 101 through the air ducts 105 and the air channels 102.

[0074] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, as well as a specific orientation structure and operation. Therefore, it should not be construed as a limitation to the present invention. In addition, "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0075] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0076] The above has described in detail an embodiment of the present invention, but the content described is only a preferred embodiment of the present invention and cannot be considered as used to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A plastic encapsulation tooling, comprising a plastic encapsulation platform (1), on one side of the plastic encapsulation platform (1), there is arranged a feeding conveyor belt (5) for feeding chips (8), and on the other side, there is arranged a feeding plate (2) for feeding plastic encapsulation housings (801); It is characterized in that on the plastic encapsulation platform (1), there is opened a positioning groove (101) for plastic encapsulation; wherein, a driving plate (401) is arranged on the plastic encapsulation platform (1), and the driving plate (401) is connected with a driving mechanism for driving it to reciprocate horizontally; at one end of the driving plate (401) facing the plastic encapsulation platform (1), a first cylinder (402) is arranged, the first cylinder (402) is connected with a chip feeding mechanism, and at the other end, a second cylinder (403) is arranged, the second cylinder (403) is connected with a plastic encapsulation housing feeding mechanism; The chip feeding mechanism includes a vacuum chuck (404) arranged at the driving end of the first cylinder (402), and a plurality of groups of suction cups (405) are arranged in a circumferential array at the bottom of the vacuum chuck (404); The plastic encapsulation housing feeding mechanism includes a positioning disc (6) arranged at the driving end of the second cylinder (403), and four groups of limiting plates (601) are arranged in a circumferential array at the bottom of the positioning disc (6), and a supporting plate (602) is rotatably arranged at the bottom of each group of limiting plates (601) on the side close to each other; wherein, a limiting seat (603) perpendicular to the limiting plate (601) is further arranged at the bottom of the supporting plate (602); four groups of grooves (104) are correspondingly opened on the periphery of the positioning groove (101), and the groove depth of the grooves (104) is greater than the groove depth of the positioning groove (101).

2. A plastic encapsulation tooling according to claim 1, It is characterized in that the plastic encapsulation housing (801) includes a square frame, and a protruding limiting part (802) is arranged on the square frame.

3. A plastic encapsulation tooling according to claim 1, It is characterized in that a protruding supporting part (103) is arranged at the corner of the groove wall in the positioning groove (101), a first through hole (702) is opened in the supporting part (103), the first through hole (702) is communicated with a first pipeline (106) arranged on the plastic encapsulation platform (1), the first pipelines (106) of the two groups on the same side are connected with a second pipeline (107), and the second pipeline (107) is connected with a plastic encapsulation liquid conveying mechanism; wherein, a second through hole (803) communicated with the first through hole (702) is correspondingly arranged on the plastic encapsulation housing (801).

4. A plastic encapsulation tooling according to claim 3, It is characterized in that the plastic encapsulation liquid conveying mechanism includes a piston cylinder (109) arranged at the bottom of the plastic encapsulation platform (1), a liquid inlet pipe on one side of the piston cylinder (109) is communicated with the bottom of a liquid storage tank (7), and the other side of the piston cylinder (109) is communicated with the second pipeline (107) through an infusion pipe (108); wherein, a piston is arranged in the piston cylinder (109), and the piston is connected with a pushing mechanism for driving it to reciprocate in the piston cylinder (109).

5. A plastic encapsulation tooling according to claim 4, It is characterized in that The driving mechanism includes a push rod (701) fixed to the piston, and the push rod (701) extends into the groove (104); Wherein, a return spring is provided on the push rod (701).

6. A plastic encapsulation tooling according to claim 1, Characterized in that, A number of groups of air grooves (102) are also arranged in the positioning groove (101), and the air grooves (102) are connected to a hot air blower (3) through an air cylinder (105).

7. A plastic encapsulation process applied to a plastic encapsulation tooling according to any one of claims 1-6, Characterized in that, It includes the following steps: S1. The driving mechanism drives the driving plate (401) to move, so as to move the plastic encapsulation housing feeding mechanism onto the feeding plate (2); S2. Start the second cylinder (403) to drive it to approach the feeding plate (2), and the plastic encapsulation housing feeding mechanism positions and fixes the plastic encapsulation housing (801); S3. The second cylinder (403) drives the plastic encapsulation housing feeding mechanism to reset, the driving mechanism drives the plastic encapsulation housing feeding mechanism to move to the plastic encapsulation platform (1), and start the second cylinder (403) to place the positioned plastic encapsulation housing (801) into the positioning groove (101); S4. The plastic encapsulation liquid conveying mechanism is conveyed to the plastic encapsulation housing (801) through the second pipeline (107), the first pipeline (106), the first through hole (702) and the second through hole (803); S5. Synchronously start the first cylinder (402) to drive the chip feeding mechanism above the feeding conveyor belt (5) to position and fix the chip (8); S6. The driving end of the first cylinder (402) resets, drives the chip feeding mechanism to move to the plastic encapsulation platform (1) through the driving mechanism, and conveys the chip (8) into the plastic encapsulation housing (801) through the first cylinder (402); S7. After the chip (8) is assembled in the plastic encapsulation housing (801), start the hot air blower (3), and convey it into the positioning groove (101) through the air cylinder (105) and the air grooves (102).

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