Positioning mechanism and positioning method of quartz wafer stacking machine

Abstract

This invention discloses a positioning mechanism and method for a quartz wafer stacking machine, belonging to the technical field of automated wafer production equipment. The invention includes a conveying body, a storage bin, an eccentric positioning wheel, an introduction guide plate, a reference platform, and sensors. The positioning method employs an extraction-positioning-fitting workflow to achieve automatic extraction, precise positioning, and guide plate fitting of the wafer fixture. Specifically, the conveying body automatically extracts the fixture assembly with the wafer from the storage bin; the positioning wheel drives the fixture assembly to rotate and adjust to the precise position; the constraint mechanism within the storage bin prevents fixture displacement; the introduction guide plate is hinged to the reference platform, providing a certain degree of freedom; the positioning hole and guide cap achieve high-precision alignment; the sensor detects the positioning status in real time; and finally, automatic fitting is performed. The entire positioning process is fully automated and mechanized, requiring no manual intervention, greatly improving efficiency and enhancing positioning accuracy and stability.

Description

Technical Field

[0001] This invention relates to the field of automated production equipment for quartz crystal resonators, and in particular to a fully automated mechanized positioning mechanism and its supporting positioning method for achieving high-precision positioning of quartz wafers in a wafer stacking machine. Background Technology

[0002] The production process of quartz crystal resonators typically includes the following steps: base and cover fabrication → wafer fabrication → wafer arrangement → cleaning → coating → adhesive application → curing → fine-tuning → soldering → aging → reflow soldering → leak detection → testing → printing and tape packaging → packaging → warehousing. Initially, the wafer arrangement process involved manual placement using a vacuum pen to pick up and place the wafers in a grid-like tray. While manual wafer picking was less labor-intensive, it required handling in a delicate environment, and small tools like tweezers could easily scratch the wafers, affecting their specifications. Currently, automated wafer arrangement machines are used in quartz crystal resonator production, such as the high-efficiency automatic wafer arrangement machine with authorization number CN212862951U and the wafer positioning mechanism of the wafer arrangement machine with authorization number CN 112934754 B. However, these automated devices still require significant manual intervention in each process. Specifically, before wafer arrangement, operators need to perform the following preparatory work:

[0003] 1. Remove the storage cartridge from the film setter;

[0004] 2. Manually assemble the positioning piece, skeleton, lower mask plate, and lower cover plate of wafer jig 01 layer by layer;

[0005] 3. Manually attach the guide plate 02 to the positioning piece;

[0006] 4. Place the assembled wafer jig 01 into the wafer jig base 03 to form an empty jig assembly 04;

[0007] 5. Manually push multiple empty fixture assemblies 04 into the storage box;

[0008] 6. Return the storage box filled with Assembly 04 to the automatic settling machine.

[0009] After these preparatory steps are completed, the film setter can operate automatically. However, even after automatic film settling is complete, operators still need to perform the following follow-up procedures:

[0010] 1. Carefully remove the fixture assembly 04 containing the chip, taking care to prevent the chip from falling out;

[0011] 2. Carefully peel the guide plate 02 off the wafer jig 01 with your fingers;

[0012] 3. If the chip dislocates during this process, a suction pen is needed to reposition and fix it.

[0013] 4. Finally, manually assemble the top cover of the wafer jig 01 to complete the loading.

[0014] It is evident that current automated wafer stacking machines still require frequent manual intervention in wafer clamping and positioning, which is not only inefficient but also prone to wafer misalignment and damage. Extensive human activity also increases costs and disrupts the cleanroom environment. Therefore, it is necessary to develop a new positioning mechanism and method for quartz wafer stacking machines to reduce manual operation, improve work efficiency, reduce waste, and minimize the impact on the cleanroom environment. Summary of the Invention

[0015] To address the aforementioned problems, this invention provides a positioning mechanism for a quartz wafer stacking machine. This mechanism assists the stacking machine in achieving a fully automated operation process from automatic extraction of wafers from the wafer fixture to precise mechanized positioning. It breaks through the limitations of traditional technologies that require a large amount of manual operation, thereby improving not only operational efficiency but also positioning accuracy and stability.

[0016] The objective of this invention is achieved through the following technical solution: a positioning mechanism for a quartz wafer stacking machine, comprising: a conveying body that enters and exits the stacking station;

[0017] The conveying body has at least one recess for placing a wafer jig, the recess being hollow and having multiple holes that connect to the internal cavity;

[0018] An inlet guide plate is disposed above the conveying body. The inlet guide plate can move up and down above the recess via a lifting mechanism to fit against the wafer clamp.

[0019] Two reference platforms with internal cavities are set at the wafer stacking station. When the conveying body arrives at the wafer stacking station, the two reference platforms are respectively located on one side of the conveying body. An eccentric positioning wheel connected to a gear is rotatably mounted above the reference platforms. The rotation of the eccentric positioning wheel changes the relative position of the wafer clamp to adjust the alignment relationship between the wafer clamp and the guide plate.

[0020] Preferably, the eccentric positioning wheel rotates via the following mechanism: a gear is installed in the eccentric positioning wheel, along with a positioning cylinder and a rack. The positioning cylinder pushes the rack to move, and the rack meshes with the gear, causing the eccentric positioning wheel to rotate. This mechanism achieves precise rotation control of the positioning wheel, enabling accurate positioning of the wafer fixture.

[0021] Preferably, the guide plate is hinged to the reference platform via a connecting rod. The guide plate has positioning holes, and the eccentric positioning wheel has a guide cap. The positioning holes cooperate with the guide caps to achieve alignment between the guide plate and the wafer fixture. This gives the guide plate a certain degree of freedom, which is beneficial for its fit with the wafer fixture. It also achieves precise alignment between the guide plate and the wafer fixture.

[0022] Preferably, the lifting mechanism is a lifting cylinder, which drives the guide plate to move up and down. The guide plate and the eccentric positioning wheel cooperate to achieve the fit between the guide plate and the wafer fixture.

[0023] Preferably, the system further includes a sensor disposed on one side of the conveying body for detecting whether the wafer jig has entered a predetermined position. This enables the detection of whether the wafer jig has reached the correct position, improving positioning accuracy.

[0024] To address the aforementioned problems, this invention also provides a positioning method using the positioning mechanism of the quartz wafer stacking machine described above. This method is used in conjunction with a storage cassette having a constraint mechanism for placing fixtures, and includes the following steps:

[0025] A. Extraction Step: Start the power source to drive the conveyor body into the wafer jig storage box, and the conveyor body drags and extracts the wafer jig from the storage box;

[0026] B. Positioning Step: Activate the rotation mechanism of the positioning wheel to drive the positioning wheel to rotate, thereby changing the relative position of the wafer clamp on the transfer body;

[0027] C. Bonding Step: Start the lifting mechanism to drive the guide plate to descend. The guide plate cooperates with the positioning wheel to achieve alignment and bonding with the wafer fixture.

[0028] The constraint mechanism prevents the wafer jig from shifting during extraction, ensuring the extraction effect.

[0029] Preferably, the extraction step specifically includes: adjusting the position of the wafer jig using the conveying mechanism of the wafer jig storage box; the conveying body horizontally entering the storage box and gripping the outer edge of the wafer jig; driving the conveying body horizontally exiting the storage box to complete the extraction of the wafer jig. Regarding the coordination of the various mechanisms: the entire process from wafer jig extraction to positioning and bonding is automated, improving production efficiency.

[0030] Preferably, before the extraction step, the method further includes: providing a constraint mechanism in the storage box, using the constraint mechanism of the wafer jig storage box to constrain the position of the wafer jig, so as to prevent the wafer jig from moving during the extraction process.

[0031] Preferably, the positioning step specifically includes: using the rotation mechanism of the eccentric positioning wheel to drive the eccentric positioning wheel to rotate at a predetermined angle; the guide cap of the eccentric positioning wheel cooperates with the positioning hole of the guide plate to achieve precise positioning of the wafer fixture.

[0032] Preferably, the bonding step specifically includes: the guide plate is hinged to the reference platform, giving the guide plate a certain degree of freedom; the positioning hole of the guide plate cooperates with the guide cap of the eccentric positioning wheel to achieve initial alignment; the guide plate continues to descend and bond with the surface of the wafer fixture.

[0033] Preferably, the method further includes: using a transfer mechanism to load the wafer into the wafer fixture; using a visual inspection mechanism to inspect the quality of the wafer; and using an assembly mechanism to complete the post-processing of the wafer fixture. This improves product quality control capabilities and yield.

[0034] Preferably, the method is suitable for the automated production of quartz wafers.

[0035] In summary, the present invention has the following advantages compared with the prior art:

[0036] 1) Setting an eccentric positioning wheel to precisely adjust the position of the wafer fixture, and cooperating with the guide plate for contact positioning, ensures positioning accuracy and solves the problem of wafer misalignment caused by inaccurate positioning in the prior art.

[0037] 2) The guide plate is hinged to the reference platform to achieve degree of freedom adjustment, which is conducive to precise fitting with the wafer fixture and improves positioning reliability.

[0038] 3) The positioning hole and guide cap work together to achieve high-precision alignment, meet the positioning accuracy requirements of the wafer, and avoid positioning offset.

[0039] 4) The extraction-positioning-fitting process in the positioning method realizes fully automatic positioning operation without human intervention, thus solving the problem of a large amount of manual operation.

[0040] 5) The positioning method, combined with the storage box constraint mechanism, improves positioning stability.

[0041] 6) The positioning method achieves precise positioning, ensuring the wafer stacking quality of each wafer and solving the problems of wafer detachment and misalignment in existing technologies.

[0042] 7) The positioning method enables automatic batch positioning, breaking through the limitations of existing technologies and significantly improving production capacity.

[0043] In summary, the positioning mechanism and method of this invention have made significant improvements to the existing technology, realizing automated, high-precision, and highly stable wafer positioning, which is of great significance for the automated large-scale production of wafers. Attached Figure Description

[0044] Figure 1 A flowchart for wafer fixture extraction;

[0045] Figure 2 Flowchart for positioning the wafer fixture;

[0046] Figure 3 A flowchart for introducing guide plate bonding;

[0047] Figure 4 This is a schematic diagram of the fixture's structure;

[0048] Figure 5 This is a schematic diagram of the positioning mechanism of the present invention;

[0049] Figure 6 This is a schematic diagram of the structure after the guide plate and some fixtures are installed onto the wafer fixture base.

[0050] Figure 7 This is a schematic diagram of the positioning mechanism of the present invention in actual application in a film sorting machine;

[0051] Figure 8 This is a schematic diagram of the structure of some parts of the positioning mechanism after an explosion.

[0052] Figure 9 This is a schematic diagram of the power and transmission mechanism.

[0053] Figure 10 This is a schematic diagram of the positioning mechanism of the present invention in a film sorting machine;

[0054] Figure 11 for Figure 7 A magnified view of a portion of point A in the middle.

[0055] The diagram shows the following components: clamp 01, guide plate 02, wafer clamp base 03, clamp assembly 04, elastic roller 05, connecting rod 07, frame 10, worktable 20, isolation chamber 30, transfer mechanism 40, screening mechanism 50, guide plate 60, feeding and receiving tray mechanism 100, automatic lifting assembly 110, storage box 120, material handling mechanism 200, linear conveyor assembly 210, conveyor body 211, recess 212, towing component 213, power source 214, assembly station 300, reference platform 41, eccentric positioning wheel 42, power and transmission mechanism 43, spindle 421, eccentric wheel body 422, gear 423, guide cap 424, rack 431, positioning cylinder 432, elastic component 433, force-bearing part 61, lifting cylinder 62, positioning hole 63. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to all the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0057] Example 1

[0058] This technical solution proposes a positioning mechanism and method for a quartz wafer stacking machine. First, the basic structure and working principle of the quartz wafer stacking machine need to be introduced. Typically, a quartz wafer stacking machine includes a frame 10, a worktable 20, an isolation chamber 30 surrounding the worktable 20 to form an independent space, at least one set of symmetrical (X-axis) transfer mechanisms 40, a feeding / receiving tray mechanism 100 cooperating with the transfer mechanisms, a picking / discharging mechanism 200 cooperating with the feeding / receiving tray mechanism 100, a screening mechanism 50 cooperating with the picking / discharging mechanism 200, a lower CCD vision recognition mechanism (not shown in the figure), an upper CCD vision positioning mechanism (not shown in the figure), and a defective product recovery mechanism (not shown in the figure). The feeding / receiving tray mechanism 100 includes an automatic lifting assembly 110, a storage box 120, and a tray inspection unit (not shown in the figure).

[0059] It is known that during the stroke of the material handling mechanism 200, the side closer to the transfer mechanism 40 is the sheet arrangement station, and the side closer to the material receiving tray mechanism 100 is the pick-up and place station (picking up and placing up refer to taking out the empty fixture from the storage box 120 and putting the loaded fixture back into the storage box 120, respectively).

[0060] Working principle

[0061] 1. The material handling mechanism 200, through the lifting and lowering coordination of the automatic lifting component 110, takes out an empty fixture assembly 04 from the storage box of the material handling station and sends it to the sheet arrangement station.

[0062] 2. The transfer mechanism 40 picks up the wafers one by one from the screening mechanism 50 and places them into the empty fixture assembly 04.

[0063] 3. The visual recognition mechanism monitors the quality of the wafers picked up by the transfer mechanism 40 throughout the entire process, and puts unqualified products into the defective product recycling mechanism.

[0064] 4. After the empty jig assembly 04 has completed all wafer arrangement, the pick-and-place mechanism 200 puts the jig assembly 04 filled with wafers back into the storage box.

[0065] One of the main improvements of this technical solution is the introduction of a guide plate 60 at the film arrangement station, which directly replaces the original guide plate 02, thereby saving the time cost of manually installing and disassembling the guide plate and the cost of manufacturing the guide plate.

[0066] Another major improvement of this technical solution is the addition of an assembly station 300 between the pick-and-place station and the wafer stacking station, which directly replaces the manual work previously required for tasks such as guide plate stripping, mask plate installation, and top cover plate 1 installation. The assembly station 300 is located in this position because it not only provides operating space, but more importantly, the fixture 01 is still positioned above the transfer body 211, and negative pressure is provided below the transfer body 211 to maintain the stability of the wafer.

[0067] The material handling mechanism 200 includes a linear conveying assembly 210, which comprises a power source 214 mounted on the worktable 20 and a conveying body 211 fixed to the output shaft of the power source 214. The conveying body 211 can be made of any material, has a hollow internal structure, and is rectangular in shape. One or two recesses 212 are formed on the upper surface of the conveying body 211. Each recess 212 has multiple holes or channels connecting to the internal cavity, and an interface is provided at one end to connect to an air source to create negative pressure in the cavity. The recesses 212 are used to load the fixtures 01. Two recesses 212 are provided to simultaneously accommodate two fixtures, increasing the continuous working time of the sheet arrangement and reducing the operation interval.

[0068] To replace manual assembly, this technical solution includes a drag-hanging component 213 inside the conveying body 211 for extracting the clamp 01 from the storage box 120. The drag-hanging component 213 is protruding from the edge of the feeding tray in the recess 212, preferably in two parallel sets. During operation, the drag-hanging component 213 works in conjunction with the automatic lifting assembly 110 and the storage box 120 to extract the clamp: first, the height of the storage box 120 is adjusted using the automatic lifting assembly 110; then, the power source 214 is activated to feed it into the conveying body 211; finally, the drag-hanging component 213 grips the outer edge of the clamp 01 through a reverse motion. If necessary, an electromagnetic adsorption extraction mechanism can also be used, or a multi-axis robotic arm can be installed on the top side of the conveying body to achieve clamp gripping. These mechanisms can reduce the structural complexity of the conveying body itself.

[0069] In this embodiment, to simplify the extraction operation of the clamp 01 and eliminate the need for lifting and lowering coordination using the automatic lifting assembly 110, an improved solution is provided:

[0070] The towing component 213 is designed to flip over on one side to be parallel to or lower than the upper plane of the conveying body 211 when it comes into contact with the object. Thus, when retrieving the clamp 01, simply adjusting the height of the upper plane of the conveying body 211 to be the same as or slightly lower than the bottom surface of the clamp 01 allows the towing component 213 to flip over and pass over the bottom surface of the clamp 01. After completely passing over it, it utilizes a spring or self-realigning mechanism to directly retrieve the clamp 01 without the need for the automatic lifting assembly 110. This flip-over design of the towing component 213 is common in the prior art and readily conceived by those skilled in the art.

[0071] In addition to the above-mentioned improved solution for the towing component 213, other auxiliary mechanisms can also be considered to simplify the extraction of the clamp 01:

[0072] 1. An adsorption device is installed on the side of the conveyor body 211 to extract the clamp 01 by using negative pressure adsorption.

[0073] 2. A multi-axis robotic arm is installed on the top surface of the conveyor body 211, and the gripper 01 is extracted by the robotic arm.

[0074] 3. Use electromagnets or other devices to attract the metal parts of clamp 01, thereby enabling clamp 01 to grip.

[0075] 4. A clamping device is installed on the storage box 120, and the ejector clamp 01 is clamped and received by the conveying body 211.

[0076] The above-mentioned mechanisms can reduce the reliance on the automatic lifting component 110, realize unattended automated operation, and help improve production efficiency.

[0077] To improve the stability of the retrieval clamp 01 by the towing component 213, it is necessary to consider constraining the clamp's degrees of freedom within the storage container 120. If the clamp has too much freedom within the storage container 120, contact between the towing component 213 and the clamp will cause the clamp to shift, which is detrimental to stable retrieval. Therefore, a pair of rotatable elastic rollers 05 with damping rotation can be installed on both sides of the storage container 120 where the clamp is placed. Once the clamp is pushed into a certain depth, it will be clamped by the elastic rollers 05 on both sides, requiring a relatively large pushing force to move through the storage container 120. In this way, the clamp will not move when the towing component 213 contacts the clamp, thereby improving retrieval stability. Here, the working surface of the elastic rollers 05 is preferably made of elastic rubber.

[0078] In addition to the elastic roller 05, the following mechanisms can also be considered to constrain the clamp and improve extraction stability:

[0079] 1. A hydraulic cylinder is installed inside the storage box 120 to clamp and fix the fixture.

[0080] 2. Use a vacuum suction cup to fix the clamp.

[0081] 3. An electromagnet is installed inside the storage box 120 to fix the clamp using electromagnetic adsorption.

[0082] 4. A mechanical slot is provided inside the storage box 120 to cooperate with the corresponding part of the clamp to achieve mechanical locking.

[0083] 5. A mechanical lifting device is installed on the bottom surface of the storage box 120 to lift the bottom surface of the clamp and reduce the degree of freedom.

[0084] The above-mentioned mechanisms can effectively constrain the degrees of freedom of the fixture, prevent minor displacements during the extraction of the dragged parts, and ensure the stability of the extraction.

[0085] To achieve a seamless fit between the guide plate 60 and the fixture 01, the position of the fixture 01 must first be precisely positioned. Specifically, reference platforms 41 with internal cavities are set on both sides of the conveyor body 211, and an eccentric positioning wheel 42 connected to a gear 423 is rotatably mounted on the platform. The eccentric positioning wheel 42 consists of a spindle 421, an eccentric wheel body 422 fixedly mounted on the spindle and located above it, a gear 423 located below it, and a guide cap 424 located above the eccentric wheel body 422. The rotation of the eccentric positioning wheel 42 is achieved by the following mechanism: the positioning cylinder 432 pushes the rack 431 to move, the rack 431 meshes with the gear 423 of the positioning wheel, driving the eccentric positioning wheel 42 to rotate, thereby changing the relative position of the fixture 01. At the same time, the elastic component 433 causes the rack to return to its original position when the positioning cylinder 432 loses force.

[0086] Then, a force-bearing part 61, a lifting cylinder 62, and a positioning hole 63 should be provided for the guide plate 60.

[0087] After the eccentric positioning wheel 42 returns to its initial state with a gap from the fixture 01, the lifting cylinder 62 drives the guide plate 60 to move downwards, achieving contact with the surface of the fixture 01. To avoid excessive interference to the fixture 01 when directly detaching upwards, the guide plate 60 is hinged to the reference platform 41 via the connecting rod 07, possessing a certain degree of freedom (to ensure this degree of freedom, the clearances in each direction of the hinged fit can be appropriately enlarged). During the descent and contact process, the positioning hole 63 on the guide plate 60 engages with the guide cap 424 of the eccentric positioning wheel 42, achieving accurate alignment between the guide plate 60 and the fixture 01. Finally, the lifting cylinder 62 drives the guide plate 60 to move up and down, and the engagement of the positioning hole 63 and the eccentric positioning wheel 42 achieves precise and seamless contact between the guide plate 60 and the fixture 01.

[0088] In addition to the mechanisms mentioned above, the following mechanisms can also be considered for fixture positioning and guide plate engagement:

[0089] 1. Set up an electromagnet to attract and position the fixture, and then use a cylinder to drive the guide plate to press down and adhere.

[0090] 2. A vacuum suction cup is set below the guide plate to adsorb the positioning fixture, and then the guide plate is pressed down and bonded by a cylinder.

[0091] 3. Set a linear motor on the reference platform to drive the guide plate to move horizontally, adjust the relative position with the fixture, and achieve fit.

[0092] 4. A horizontal cylinder is installed on one side of the guide plate to directly push the guide plate to move horizontally, adjust the relative position with the fixture, and achieve fit.

[0093] To facilitate better understanding, the following list summarizes the main components and their functions:

[0094] Component Name Main functions and effects Introducing guide plate 60 It directly replaces the original guide plate 02, eliminating the need for manual disassembly and reassembly, thus reducing labor intensity. Assembly station 300 Automatically completes tasks such as guide plate removal and mask plate installation. Transmission Entity 211 The interior has cavities and grooves for loading clamps. Trailer component 213 Extraction clamps in collaboration with lifting units Flip-up towable parts Simplified fixture extraction, no lifting unit required. Elastic roller 05 Constraining the degrees of freedom of the fixture improves extraction stability. 42 Eccentric positioning wheel Adjust the relative position of the fixture to achieve positioning. Positioning cylinder 432 Drive positioning wheel to rotate Elastic component 433 When the positioning cylinder loses force, the positioning system is reset. Lifting cylinder 62 Control the up and down movement of the guide plate Positioning hole 63 In conjunction with the positioning wheels, the guide plate is accurately positioned.

[0095] Through the rational arrangement and coordinated movement of these components, the automatic extraction, precise positioning, and seamless fit with the guide plate of the fixture are achieved. The entire automation process reduces labor intensity and improves production efficiency.

[0096] See attached document Figure 1-3 The overall working steps of a quartz wafer stacking machine:

[0097] 1. Wafer extraction fixture:

[0098] (1) The storage box 120 adjusts the position of the wafer clamp via the automatic lifting assembly 110;

[0099] (2) The main body of the conveyor enters the storage box horizontally;

[0100] (3) A wafer gripper for dragging components;

[0101] (4) The main body with the wafer clamp is horizontally ejected from the storage box;

[0102] 2. Positioning wafer fixture:

[0103] (1) Start the positioning cylinder to push the rack to move;

[0104] (2) The rack drives the positioning wheel to rotate;

[0105] (3) The positioning wheel changes the relative position of the wafer clamp;

[0106] (4) Align the wafer fixture with the guide plate;

[0107] 3. Introducing guide plate bonding:

[0108] (1) Start the lifting cylinder to drive the guide plate to descend;

[0109] (2) Utilize the degree of freedom provided by the hinged connection between the guide plate and the reference platform;

[0110] (3) The guide plate is introduced to cooperate with the positioning wheel to achieve alignment;

[0111] (4) Introduce the guide plate and attach it to the wafer fixture;

[0112] 4. Film scheduling and production:

[0113] (1) The transfer mechanism loads the wafer into the wafer fixture;

[0114] (2) Visual inspection agencies check chip quality;

[0115] (3) The corresponding mechanisms at the assembly station complete the post-processing of the wafer fixture;

[0116] (4) The pick-and-place mechanism puts the wafer jig back after the wafer arrangement is completed.

[0117] Example 2

[0118] Based on Embodiment 1, this embodiment proposes an improved scheme to further enhance positioning accuracy and stability. Specifically, a pneumatic interface can be opened on the side of the conveying body 211, which is connected to a compressed air source through a pipe. After the wafer locator 300 is aligned with the wafer fixture 01, the air source is activated, and a high-pressure airflow is introduced into the conveying body 211 through the interface.

[0119] After the high-pressure airflow enters the internal cavity of the transfer body 211, the airflow will be ejected from the through hole on the bottom surface of the cavity, forming a stable air buoyancy effect. At this time, the wafer jig 01 will be suspended by the airflow and lose contact with the bottom surface of the transfer body 211.

[0120] In the air-floating state, the position of the wafer jig 01 no longer depends on mechanical contact, but is entirely supported by airflow, which can effectively reduce positioning errors. Even if the transport body 211 or the external environment experiences slight vibrations, it will not affect the air-floating wafer jig 01.

[0121] After air flotation is completed, the eccentric positioning wheel 42 is started to rotate precisely to adjust the relative position of the wafer clamp 01. At this time, the wafer clamp 01 does not need to overcome mechanical friction. The positioning wheel 42 only needs to provide a small force to drive the wafer clamp 01 to rotate, thereby achieving high-precision positioning.

[0122] The air-bearing support also facilitates the subsequent bonding between the guide plate 60 and the wafer jig 01. When the two come into contact, the wafer jig 01 can move and rotate freely, thereby ensuring a completely gapless bonding with the guide plate 60 in a resistance-free state.

[0123] This embodiment effectively solves the positioning error problem of mechanical connection by applying air flotation, and achieves higher precision and more stable wafer positioning. It also improves the reliability of positioning wheel rotation and guide plate bonding.

[0124] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A positioning mechanism for a quartz wafer stacking machine, characterized in that... This includes: the main conveyor (211) that enters and exits the film arrangement station; The transfer body (211) has at least one recess (212) for placing the wafer jig (01), the recess is hollow and has multiple holes that connect to the internal cavity; An inlet guide plate (60) is disposed above the conveying body. The inlet guide plate can move up and down above the recess via a lifting mechanism to fit against the wafer jig. Two reference platforms (41) with internal cavities are set at the wafer stacking station. When the conveying body arrives at the wafer stacking station, the two reference platforms (41) are respectively located on one side of the conveying body. An eccentric positioning wheel (42) connected to a gear (423) is rotatably set above the reference platform. The rotation of the eccentric positioning wheel changes the relative position of the wafer jig to adjust the alignment relationship between the wafer jig and the guide plate.

2. The positioning mechanism of the quartz wafer stacking machine according to claim 1, characterized in that... The eccentric positioning wheel (42) rotates through the following mechanism: A gear (423) is provided in the eccentric positioning wheel (42), and a positioning cylinder (432) and a rack (431) are provided. The positioning cylinder (432) pushes the rack (431) to move. The rack (431) meshes with the gear (423) and drives the eccentric positioning wheel (42) to rotate.

3. The positioning mechanism of the quartz wafer stacking machine according to claim 1, characterized in that... The guide plate (60) is hinged to the reference platform via a connecting rod (07). The guide plate (60) is provided with a positioning hole (63), and the eccentric positioning wheel (42) is provided with a guide cap (424). The positioning hole (63) cooperates with the guide cap (424) to realize the alignment of the guide plate (60) and the wafer fixture.

4. The positioning mechanism of the quartz wafer stacking machine according to claim 1, characterized in that... The lifting mechanism is a lifting cylinder (62). The lifting cylinder drives the guide plate (60) to move up and down. By using the cooperation between the guide plate (60) and the eccentric positioning wheel (42), the guide plate and the wafer fixture are put into contact.

5. The positioning mechanism of the quartz wafer stacking machine according to any one of claims 1-4, characterized in that... It also includes a sensor disposed on one side of the transfer body (211) for detecting whether the wafer jig has entered a predetermined position.

6. A positioning method using the positioning mechanism according to any one of claims 1-4, characterized in that, This positioning method is used in conjunction with a storage cassette (120) for placing a wafer jig (01) and includes the following steps: A. Extraction steps: Start the power source (214) to drive the transfer body (211) into the storage box (120) of the wafer jig (01), and the transfer body drags and extracts the wafer jig from the storage box; B. Positioning Step: Start the rotation mechanism of the eccentric positioning wheel (42) to drive the eccentric positioning wheel to rotate and change the relative position of the wafer clamp on the transfer body; C. Bonding Step: Start the lifting mechanism to drive the guide plate (60) to descend. The guide plate cooperates with the eccentric positioning wheel to achieve alignment and bonding with the wafer fixture.

7. The positioning method according to claim 6, characterized in that... The extraction steps specifically include: The position of the wafer clamp is adjusted using the transfer mechanism of the storage cassette (120) of the wafer clamp; The transfer body (211) enters horizontally into the storage box (120) and is gripped by the outer edge of the wafer clamp; Drive the transfer body (211) to exit the storage box (120) horizontally, and complete the extraction of the wafer fixture.

8. The positioning method according to claim 7, characterized in that... Before the extraction step, the device further includes a constraint mechanism in the storage box (120) to constrain the position of the wafer jig and prevent the wafer jig from moving during the extraction process.

9. The positioning method according to any one of claims 6-8, characterized in that... The positioning steps specifically include: The eccentric positioning wheel (42) is driven to rotate at a predetermined angle by the rotation mechanism of the eccentric positioning wheel (42); The guide cap (424) of the eccentric positioning wheel (42) cooperates with the positioning hole (63) of the guide plate (60) to achieve precise positioning of the wafer fixture.

10. The positioning method according to claim 9, characterized in that... The bonding step specifically includes: The guide plate (60) is hinged to the reference platform (41), giving the guide plate (60) a certain degree of freedom; The positioning hole (63) of the guide plate (60) cooperates with the guide cap (424) of the eccentric positioning wheel (42) to achieve initial alignment; The guide plate (60) continues to descend and come into contact with the surface of the wafer fixture.

11. The positioning method according to claim 9, characterized in that... Also includes: The wafer is loaded into the wafer jig using a transfer mechanism; The quality of the wafers was inspected using a visual inspection system. The post-processing of the wafer fixture is completed using an assembly mechanism.

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