A cmp diamond dresser and a method of making the same

Abstract

The application discloses a CMP diamond dressing disc and a preparation method thereof, wherein the diamond dressing disc comprises a dressing disc base body, abrasive grains, a first plating layer, a second plating layer and a third plating layer, a blank area is arranged at the center of the upper surface of the dressing disc base body, a plurality of fan-shaped areas with the same center as the dressing disc base body are arranged on the outer circumferential side of the blank area, the plurality of fan-shaped areas are uniformly distributed at equal intervals along the circumferential direction of the dressing disc base body, the side edge of each fan-shaped area is serrated, a groove area is formed between every two fan-shaped areas, the plurality of groove areas are communicated with the blank area, and the abrasive grains are arranged on the fan-shaped areas. The surface energy is improved through high-temperature brazing, electroplating treatment and gas deposition treatment, the heat damage is low by controlling the high-temperature brazing temperature and time, the fixing mode is diversified, the abrasive grains are arranged in order, and the high-precision machining requirement is facilitated to improve the production efficiency and quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electroplated abrasive tools, in particular to a CMP diamond conditioning disc and a preparation method thereof. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafers are the basic materials, through processing can form various circuit element structures, eventually become a specific electrical function of integrated circuit products. With the development of integrated circuits, chip manufacturers have higher and higher quality requirements for substrate sheets, so it is very important to carry out chemical mechanical planarization polishing treatment on wafers.

[0003] Chemical mechanical planarization is a technology that combines chemical etching and mechanical force, which is a key link for smoothing processing of silicon wafers or other substrates in the processing process. In the chemical mechanical planarization (CMP) process, relative movement occurs between the polishing pad and the wafer, and the polishing liquid plays a chemical corrosion role, thereby removing the deposited layer material protruding on the wafer.

[0004] In order to meet the demand of wafer (wafer) processing production and maintain the stability of the quality, the conditioning disc is needed to be used to trim the polishing pad in the chemical mechanical polishing process. The main function of the conditioning disc is to remove the polishing by-products on the surface of the polishing pad, restore the rough surface of the polishing pad, improve its ability to hold slurry, and restore the ability of the polishing pad surface to hold and transport polishing liquid, which can effectively prolong the service life of the polishing pad, reduce the cost, and meet the demand of quality stability in wafer production.

[0005] However, the traditional diamond conditioning disc has some shortcomings:

[0006] 1. Low surface energy: the surface energy of diamond is low, which leads to weak adhesion with the substrate. During the trimming process, due to friction and impact, etc., the diamond is easy to fall off from the substrate;

[0007] 2. Thermal damage: during brazing, due to long-term high temperature, the diamond is easy to be damaged by heat, which changes the structure of the surface of the diamond and reduces its performance.

[0008] 3. Single fixing method: the traditional conditioning disc usually only uses a single method such as brazing or electroplating to fix the diamond. The single fixing method can easily lead to insufficient adhesion of the diamond, which makes it easy to fall off.

[0009] 4. Disorderly arrangement: the arrangement of diamonds on the traditional conditioning disc is disorderly, which can easily lead to uneven wear on the surface of the conditioning pad. This not only affects production efficiency and quality, but also accelerates the falling off and thermal damage of the diamond.

[0010] In view of the above defects, the application provides a CMP diamond dressing disc and a preparation method thereof. SUMMARY

[0011] Therefore, the application aims at the defects in the prior art, and mainly aims to provide a CMP diamond dressing disc and a preparation method thereof, which solve the technical problems that the surface energy of the traditional diamond dressing disc is low, the diamond dressing disc is easily damaged by heat during a long high-temperature brazing process, the diamond fixing mode is single, the arrangement is disordered, the production efficiency and quality are affected, and the diamond is easily dropped and damaged by heat.

[0012] To achieve the above-mentioned purpose, the application adopts the following technical solutions:

[0013] The CMP diamond dressing disc comprises:

[0014] A dressing disc base body, a blank area is arranged at the center of the upper surface of the dressing disc base body, a plurality of fan-shaped areas with the same center as the dressing disc base body are arranged on the outer circumferential side of the blank area, the plurality of fan-shaped areas are uniformly distributed at equal intervals along the circumferential direction of the dressing disc base body, one side of the fan-shaped area is sawtooth-shaped, a groove area is formed between every two fan-shaped areas, and the plurality of groove areas are in communication with the blank area;

[0015] Abrasive grains, the abrasive grains are arranged on the fan-shaped areas;

[0016] A first plating layer, the first plating layer partially embeds the abrasive grains and fixes the abrasive grains on the dressing disc base body, the height of the first plating layer embedding the abrasive grains is between 1 / 3 and 1 / 2 times the particle size of the abrasive grains;

[0017] A second plating layer, the second plating layer covers the first plating layer and partially embeds the abrasive grains, the height of the abrasive grains exposed from the second plating layer is between 1 / 4 and 1 / 3 times the particle size of the abrasive grains;

[0018] A third plating layer, the third plating layer covers the second plating layer, and the thickness of the third plating layer is between 4 and 6 microns.

[0019] As a preferred solution, the first plating layer is a brazing layer, the second plating layer is an electroplating layer, the thickness of the electroplating layer is between 65 and 107 microns, and the third plating layer is a ternary alloy covering layer.

[0020] As a preferred solution, the abrasive grains include but are not limited to octahedral diamond, the particle size of the abrasive grains is between 35 and 120 mesh, the diameter of the dressing disc base body is 108 mm, and the thickness of the dressing disc base body is 0.58 mm.

[0021] The application discloses a preparation method of a CMP diamond dressing disc.

[0022] S1: design an upper sand mold, a plurality of screen holes are formed in the upper sand mold corresponding to the fan-shaped area, and a diameter of the screen hole is larger than a particle size of the abrasive grain;

[0023] S2: coat pressure-sensitive adhesive on an upper surface of the dressing disc substrate, and adhere and install the upper sand mold on the upper surface of the dressing disc substrate;

[0024] S3: use a stacking method to lay the abrasive grain on the screen hole;

[0025] S4: take a pressing plate matched with a specification of the dressing disc substrate, and compact the abrasive grain placed in the screen hole through the pressing plate, so that the abrasive grain is fully combined with the pressure-sensitive adhesive and adhered to the dressing disc substrate;

[0026] S5: remove the pressing plate, and perform a reverse buckling process on the dressing disc substrate together with the upper sand mold, and remove the excessive abrasive grain;

[0027] S6: select solder, lay the solder on the upper sand mold, use ultrasonic equipment to make the solder uniformly fill the gap between the screen hole and the abrasive grain, until the thickness of the solder accumulation is the same as the thickness of the upper sand mold, and the solder is shaped under the adhesion of the pressure-sensitive adhesive;

[0028] S7: remove the upper sand mold with the screen hole, place the dressing disc substrate to be processed in a vacuum high-temperature furnace to perform high-temperature brazing, so that the solder melts and fixes the abrasive grain on the dressing disc substrate to generate the brazing layer, and then natural cooling is performed;

[0029] S8: place the dressing disc substrate after the natural cooling in an electroplating solution to perform electroplating treatment, so as to generate an electroplating layer on the brazing layer, and the electroplating layer covers the surface of the abrasive grain at 67% to 88%;

[0030] S9: send the dressing disc substrate after the electroplating treatment to a tube furnace again, use a physical vapor deposition method to generate a third plating layer on the electroplating layer, and the third plating layer includes but is not limited to a ternary alloy covering layer.

[0031] As a preferred scheme, the thickness of the steel plate of the upper sand mold is 0.1 to 0.5 mm, and the diameter of the screen hole is 150 to 400 mu.

[0032] As a preferred scheme, the pressure-sensitive adhesive includes but is not limited to rubber type and resin type, and the thickness of the pressure-sensitive adhesive is 5 to 35 microns.

[0033] As a preferred solution, the solder includes but is not limited to silver, nickel, copper, the temperature of the high-temperature brazing is set to 1000-1800℃, and the time of the high-temperature brazing is controlled to 3min.

[0034] As a preferred solution, the current density of the electroplating treatment is controlled to 1-2A / dm 2 , the temperature of the electroplating treatment is controlled to 30-70℃, and the time of the electroplating treatment is between 6-10h.

[0035] As a preferred solution, the electroplating solution of the electroplating treatment includes but is not limited to nickel sulfate 250g / L, nickel chloride 30g / L, boric acid 40g / L, sodium dodecyl sulfate 0.1g / L, saccharin 1.5g / L, and 1,4-butynediol 0.5g / L.

[0036] As a preferred solution, the constituent elements of the third plating layer include but are not limited to palladium, nickel, chromium,

[0037] Compared with the prior art, the present application has obvious advantages and beneficial effects, specifically, from the above technical solution, it mainly has the following advantages:

[0038] 1. High surface energy: through high-temperature brazing, electroplating treatment and vapor deposition treatment, the abrasive particles are tightly connected with the truing disc substrate and are not easy to fall off, and the surface performance of the truing disc is improved, the corrosion resistance, oxidation resistance and wear resistance are enhanced, and the service life and stability of the truing disc are improved;

[0039] 2. Low thermal damage: during preparation, by controlling the temperature and time of high-temperature brazing, the risk of thermal damage to abrasive particles is reduced, and the performance and quality of abrasive particles are ensured;

[0040] 3. Diversified fixing mode: using resin type pressure sensitive adhesive and silver, nickel, copper and other solders, diversified fixing mode of abrasive particles can be realized, different application scenarios can be adapted to, and the adaptability and flexibility of the truing disc are improved;

[0041] 4. Ordered arrangement of abrasive particles: by designing the thickness of the steel plate of the sanding mold and the diameter of the screen hole, and cooperating with the setting of the fan-shaped area on the truing disc substrate, the ordered arrangement of abrasive particles on the surface of the truing disc can be ensured, the machining precision and surface flatness of the truing disc are improved, and high-precision machining requirements can be realized, and production efficiency and quality are improved.

[0042] In order to more clearly illustrate the structural features and effects of the present application, the present application will be described in detail below with reference to the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1Figure 1 is a schematic view of a sanding mold adhered to a dressing disc substrate according to an embodiment of the present application;

[0044] Figure 2 Figure 2 is a schematic view of the sanding mold adhered to the dressing disc substrate from another perspective according to an embodiment of the present application;

[0045] Figure 3 Figure 3 is a schematic view of the dressing disc substrate after filling abrasive particles and solder according to an embodiment of the present application;

[0046] Figure 4 Figure 4 is a schematic view of the dressing disc substrate after removing the sanding mold according to an embodiment of the present application;

[0047] Figure 5 Figure 5 is a schematic view of the dressing disc after high temperature brazing according to an embodiment of the present application;

[0048] Figure 6 Figure 6 is a schematic view of the dressing disc after electroplating according to an embodiment of the present application;

[0049] Figure 7 Figure 7 is a flow chart of a method for manufacturing a CMP diamond dressing disc according to an embodiment of the present application.

[0050] BRIEF DESCRIPTION OF THE DRAWINGS

[0051] 10, dressing disc substrate; 11, abrasive particle; 12, first plating layer; 13, second plating layer; 14, blank area; 15, fan-shaped area; 16, groove area;

[0052] 20, sanding mold; 21, sieve hole;

[0053] 30, pressure-sensitive adhesive;

[0054] 40, solder. DETAILED DESCRIPTION

[0055] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0056] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only.

[0057] An embodiment of the present application provides a CMP diamond dressing disc and a method for manufacturing the same. Please refer to Figure 1 ,Figure 2 and Figure 6 A CMP diamond dressing disc, comprising:

[0058] A dressing disc substrate 10, a blank area 14 is provided in the center of the upper surface of the dressing disc substrate 10, a plurality of fan-shaped areas 15 with the same center as the dressing disc substrate 10 are provided on the outer periphery of the blank area 14, the plurality of fan-shaped areas 15 are uniformly distributed at equal intervals along the circumferential direction of the dressing disc substrate 10, and one side of the fan-shaped area 15 is sawtooth-shaped, please refer to Figure 1 A groove area 16 is formed between every two fan-shaped areas 15, the plurality of groove areas 16 are communicated with the blank area 14, and the cross-sectional shape of the groove area 16 includes but is not limited to V-shaped, U-shaped, and circular arc-shaped;

[0059] Abrasive grains 11 laid on the fan-shaped area 15;

[0060] A first plating layer 12, the first plating layer 12 partially embeds the abrasive grains 11 and fixes the abrasive grains 11 on the dressing disc substrate 10, and the height of the first plating layer 12 embedding the abrasive grains 11 is between 1 / 3 and 1 / 2 times the particle size of the abrasive grains 11;

[0061] A second plating layer 13, the second plating layer 13 covers the first plating layer 12 and partially embeds the abrasive grains 11, and the height of the abrasive grains 11 exposed from the second plating layer 13 is between 1 / 4 and 1 / 3 times the particle size of the abrasive grains 11;

[0062] A third plating layer, the third plating layer covers the second plating layer 13, and the thickness of the third plating layer is between 4 and 6 μm, preferably, the thickness of the third plating layer is controlled to be 5 μm.

[0063] The first plating layer 12 is a brazing layer, the second plating layer 13 is an electroplating layer, the thickness of the electroplating layer is between 65 and 107 μm, the second plating layer 13 covers and shields more than 70% of the surface of the abrasive grains 11, ensures that the diamond is not easy to fall off, the third plating layer is a ternary alloy covering layer, the third plating layer can resist acid and alkali corrosion, prevents the first plating layer 12 and the second plating layer 13 from being damaged, and causes the abrasive grains 11 to fall off; the abrasive grains 11 include but are not limited to octahedral diamond, the particle size of the abrasive grains 11 is between 35 and 120 mesh, that is, the diameter of the abrasive grains 11 ranges from 10 to 100 μm, the particle size of the abrasive grains 11 is preferably 60 to 100 mesh, and more preferably 80 mesh, the diameter of the dressing disc substrate 10 is 108 mm, and the thickness is 0.58 mm.

[0064] A preparation method of a CMP diamond dressing disc, please refer to Figure 7 , comprising the following steps:

[0065] S1: design the sanding mold 20, the sanding mold 20 is provided with a plurality of sieve holes 21 corresponding to the fan-shaped area 15, the aperture of the sieve hole 21 is larger than the particle size of the abrasive particles 11, the sanding mold 20 is used to control the distribution of the abrasive particles 11, the sieve hole 21 is the aperture of the sanding mold 20 for controlling the abrasive particles 11 to pass, please see Figure 1 .

[0066] Here, by carefully designing the sanding mold 20 and opening a plurality of sieve holes 21, it is ensured that the distribution and size of the abrasive particles 11 meet the preset requirements, and the presence of the sieve hole 21 enables the abrasive particles 11 to be laid on the dressing disc base body 10 according to the preset distribution state.

[0067] S2: coat the pressure-sensitive adhesive 30 on the upper surface of the dressing disc base body 10, and adhere and install the sanding mold 20 on the upper surface of the dressing disc base body 10, please see Figure 2 .

[0068] It should be noted that the pressure-sensitive adhesive 30 is a kind of adhesive with pressure-sensitive adhesion, which can adhere the abrasive particles 11 and fix them on the dressing disc base body 10, and can improve the stability and reliability of the overall preparation process.

[0069] S3: use the stacking method to stack and lay the abrasive particles 11 one by one on the sieve hole 21, and ensure that there are abrasive particles 11 on each sieve hole 21, please see Figure 3 .

[0070] Here, the use of the stacking method can accurately control the position and quantity of the abrasive particles 11, and provides a good foundation for the shape and performance of the subsequent dressing disc.

[0071] S4: take the pressing plate matching the specification of the dressing disc base body 10, and compact the abrasive particles 11 placed in the sieve hole 21 through the pressing plate, so that the abrasive particles 11 are fully combined with the pressure-sensitive adhesive 30 and adhered to the dressing disc base body 10.

[0072] Here, the use of the pressing plate to compact the abrasive particles 11 can ensure that all the abrasive particles 11 have the same height and are uniformly distributed on the dressing disc base body 10, which provides protection for the overall performance of the dressing disc.

[0073] S5: remove the pressing plate, and perform the reverse processing of the dressing disc base body 10 together with the sanding mold 20, that is, flip it over, and remove the excess abrasive particles 11, which lays a good foundation for subsequent processing;

[0074] S6: select the solder 40, lay the solder 40 on the sanding mold 20, use the ultrasonic equipment to make the solder 40 uniformly fill the gap between the sieve hole 21 and the abrasive particles 11, until the thickness of the solder 40 accumulation is the same as the thickness of the sanding mold 20, and is shaped under the adhesion of the pressure-sensitive adhesive 30, please see Figure 3 .

[0075] It is necessary to note that the appropriate solder 40 is selected and laid on the upper sand mold 20, and the solder 40 fills the gap between the sieve hole 21 and the abrasive grain 11 by the action of the generating device, which can further strengthen the connection between the abrasive grain 11 and the pressure-sensitive adhesive 30 and the dressing disc substrate 10, and make good processing preparation for subsequent high-temperature brazing.

[0076] S7: Remove the upper sand mold 20 with the sieve hole 21, please refer to Figure 4 , place the dressing disc substrate 10 to be processed in a vacuum high-temperature furnace for high-temperature brazing, melt the solder 40 to fix the abrasive grain 11 on the dressing disc substrate 10 to form a brazing layer, and then perform natural cooling treatment, please refer to Figure 5 .

[0077] Here, the pressure-sensitive adhesive 30 has been decomposed and gasified due to high temperature, leaving only the brazing layer to fix the abrasive grain 11 on the surface of the dressing disc substrate 10, further enhancing the connection between the abrasive grain 11 and the dressing disc substrate 10, and the natural cooling treatment can gradually cool and stabilize the dressing disc substrate 10, providing a reliable substrate foundation for subsequent processing.

[0078] S8: Place the dressing disc substrate 10 after natural cooling treatment in an electroplating solution for electroplating treatment to form an electroplated layer on the brazing layer, the electroplated layer covering the surface of the abrasive grain 11 between 67% and 88%, making the abrasive grain 11 and the dressing disc substrate 10 more stable and less likely to fall off, improving the service life and stability of the dressing disc, please refer to Figure 6 ;

[0079] S9: Send the dressing disc substrate 10 after electroplating treatment to a tube furnace, use physical vapor deposition to cover a third plating layer on the electroplated layer, the third plating layer including but not limited to a ternary alloy covering layer, which can resist acid and alkali corrosion and prevent the plating layer from being damaged to cause the abrasive grain 11 to fall off.

[0080] It is necessary to note that the third plating layer can limit the protection of the electroplated layer and the abrasive grain 11 from the external environment, and through this treatment method, the stability of the abrasive grain 11 and the long-term use performance of the dressing disc can be ensured.

[0081] The steel plate thickness of the upper sand mold 20 is between 0.1 and 0.5 mm, preferably between 0.1 and 0.3 mm, and more preferably 0.15 mm. The appropriate thickness can ensure the strength and durability of the mold, while avoiding the influence of the thickness of the steel plate on the distribution of the abrasive particles 11 in the sieve hole 21. The diameter of the sieve hole 21 is between 150 and 400 μm, and preferably 200 μm. Both too large or too small sieve holes can affect the distribution and fixation of the abrasive particles 11. The pressure-sensitive adhesive 30 includes but is not limited to rubber type and resin type. The pressure-sensitive adhesive 30 is preferably resin type. Both banana type and resin type have good adhesion and stability, while the resin type pressure-sensitive adhesive 30 has better high-temperature resistance and corrosion resistance. The thickness of the pressure-sensitive adhesive 30 is between 5 and 35 microns, and preferably 20 μm. A too thick adhesive layer can affect the fixation of the abrasive particles 11 and the flatness of the dressing disc, while a too thin adhesive layer cannot provide sufficient adhesion. The solder 40 includes but is not limited to silver, nickel, and copper. The solder 40 is preferably nickel, which has good high-temperature resistance and corrosion resistance. When nickel is used as the solder 40, it can bring excellent high-temperature oxidation resistance, corrosion resistance, and high-strength performance. The high-temperature brazing temperature is set to 1000-1800°C, preferably 1100-1500°C, and more preferably 1200°C. The appropriate temperature can ensure good bonding between the solder 40 and the abrasive particles 11 and the substrate. The high-temperature brazing time is controlled to be 3 min to avoid heat damage to the abrasive particles 11 due to long-term high-temperature action, thereby reducing their performance, or insufficient bonding between the solder 40 and the substrate due to too short a time.

[0082] Further, the current density of the electroplating treatment is controlled to be between 1 and 2 A / dm 2 , preferably 1.5 A / dm 2 . The appropriate current density can improve the deposition speed and quality of the electroplated layer. The temperature of the electroplating treatment is controlled to be between 30 and 70°C, preferably between 45 and 55°C, and more preferably 48°C. The appropriate temperature can improve the adhesion and stability of the electroplated layer. The electroplating treatment time is between 6 and 10 h to avoid a too thick electroplated layer with pinholes due to too long a time, or insufficient deposition of the electroplated layer due to too short a time. The electroplating solution of the electroplating treatment includes but is not limited to nickel sulfate 250 g / L, nickel chloride 30 g / L, boric acid 40 g / L, sodium dodecyl sulfate 0.1 g / L, saccharin 1.5 g / L, and 1,4-butynediol 0.5 g / L to provide good electroplating effect and stability. The constituent elements of the third plating layer include but are not limited to palladium, nickel, and chromium. Preferably, the third plating layer is a nickel-chromium-palladium ternary alloy coating. Palladium is chemically inert and can resist the corrosion of hydrofluoric acid, phosphoric acid, perchloric acid, hydrochloric acid, and sulfuric acid vapor. Compared with a thin film of nickel-chromium alloy, the addition of palladium can further improve the surface of the dressing disc substrate 10 to be resistant to acid and alkali corrosion.

[0083] Example 1:

[0084] S1: design the sanding mold 20, the sanding mold 20 is provided with a plurality of sieve holes 21 corresponding to the fan-shaped area 15, the aperture of the sieve hole 21 is slightly larger than the particle size of the abrasive particles 11;

[0085] S2: coat the pressure-sensitive adhesive 30 on the upper surface of the dressing disc base body 10, the thickness of the pressure-sensitive adhesive 30 is 15 μm, and the sanding mold 20 is adhered and installed on the upper surface of the dressing disc base body 10;

[0086] S3: use the stacking method to lay the abrasive particles 11 on the sieve holes 21, and ensure that each sieve hole 21 has abrasive particles 11;

[0087] S4: take the pressing plate matched with the specification of the dressing disc base body 10, and compact the abrasive particles 11 placed in the sieve holes 21 through the pressing plate, so that the abrasive particles 11 are fully combined with the pressure-sensitive adhesive 30 and adhered to the dressing disc base body 10;

[0088] S5: remove the pressing plate, and perform the reverse buckling treatment on the dressing disc base body 10 together with the sanding mold 20, and remove the excess abrasive particles 11;

[0089] S6: select the solder 40, lay the solder 40 on the sanding mold 20, use the ultrasonic equipment to make the solder 40 uniformly fill the gap between the sieve holes 21 and the abrasive particles 11, until the thickness of the solder 40 accumulation is the same as the thickness of the sanding mold 20, and the solder 40 is shaped under the adhesion of the pressure-sensitive adhesive 30;

[0090] S7: remove the sanding mold 20 with the sieve holes 21, place the dressing disc base body 10 to be processed in the vacuum high-temperature furnace for high-temperature brazing, the temperature of the high-temperature brazing is set to 1200℃, and the time length is controlled to 3 min, so that the solder 40 melts to fix the abrasive particles 11 on the dressing disc base body 10 to generate a brazing layer, and then natural cooling treatment is performed, wherein the pressure-sensitive adhesive 30 has been removed due to high temperature, and only the brazing layer is left to fix the abrasive particles 11 on the surface of the base body;

[0091] S8: place the dressing disc base body 10 after the natural cooling treatment in the electroplating liquid for electroplating treatment, the current density is 1.5 A / dm 2 , the temperature is 48℃, and the electroplating time is 8 h, so as to generate an electroplating layer on the brazing layer, and the electroplating layer covers more than 70% of the surface of the abrasive particles 11;

[0092] S9: send the dressing disc base body 10 after the electroplating treatment to the tube furnace again, use the physical vapor deposition method (PVD) to generate a third plating layer on the electroplating layer, the third plating layer is a ternary alloy covering layer, the thickness is controlled to 5 μm, can resist acid and alkali corrosion, and prevent the damage of the plating layer from causing the abrasive particles 11 to fall off.

[0093] Example 2:

[0094] S1: design the sanding mold 20, the sanding mold 20 is provided with a plurality of sieve holes 21 corresponding to the fan-shaped area 15, the aperture of the sieve hole 21 is slightly larger than the particle size of the abrasive particles 11;

[0095] S2: coat the pressure-sensitive adhesive 30 on the upper surface of the dressing disc base body 10, the thickness of the pressure-sensitive adhesive 30 is 20 μm, and the sanding mold 20 is adhered and installed on the upper surface of the dressing disc base body 10;

[0096] S3: use the stacking method to lay the abrasive particles 11 on the sieve holes 21, and ensure that each sieve hole 21 has the abrasive particles 11;

[0097] S4: take the pressing plate matched with the specification of the dressing disc base body 10, and compact the abrasive particles 11 placed in the sieve holes 21 through the pressing plate, so that the abrasive particles 11 are fully combined with the pressure-sensitive adhesive 30 and adhered to the dressing disc base body 10;

[0098] S5: remove the pressing plate, and perform the reverse buckling treatment on the dressing disc base body 10 together with the sanding mold 20, and remove the excessive abrasive particles 11;

[0099] S6: select the solder 40, lay the solder 40 on the sanding mold 20, use the ultrasonic equipment to make the solder 40 uniformly fill the gap between the sieve holes 21 and the abrasive particles 11, until the thickness of the solder 40 accumulation is the same as the thickness of the sanding mold 20, and the solder 40 is shaped under the adhesion of the pressure-sensitive adhesive 30;

[0100] S7: remove the sanding mold 20 with the sieve holes 21, place the dressing disc base body 10 to be processed in the vacuum high-temperature furnace for high-temperature brazing, the temperature of the high-temperature brazing is set to 1200℃, and the time length is controlled to 3 min, so that the solder 40 melts to fix the abrasive particles 11 on the dressing disc base body 10 to generate a brazing layer, and then natural cooling treatment is performed, wherein the pressure-sensitive adhesive 30 has been removed due to high temperature, and only the brazing layer is left to fix the abrasive particles 11 on the surface of the base body;

[0101] S8: place the dressing disc base body 10 after the natural cooling treatment in the electroplating liquid for electroplating treatment, the current density is 1.5 A / dm 2 , the temperature is 48℃, and the electroplating time is 8 h, so as to generate an electroplating layer on the brazing layer, and the electroplating layer covers more than 70% of the surface of the abrasive particles 11;

[0102] S9: send the dressing disc base body 10 after the electroplating treatment to the tube furnace again, use the physical vapor deposition method (PVD) to generate a third plating layer on the electroplating layer, the third plating layer is a ternary alloy covering layer, the thickness is controlled to 5 μm, can resist acid and alkali corrosion, and prevent the damage of the plating layer from causing the abrasive particles 11 to fall off.

[0103] Example 3:

[0104] S1: design the sanding mold 20, the sanding mold 20 is provided with a plurality of sieve holes 21 corresponding to the fan-shaped area 15, the aperture of the sieve hole 21 is slightly larger than the particle size of the abrasive particles 11;

[0105] S2: coat the pressure-sensitive adhesive 30 on the upper surface of the dressing disc base body 10, the thickness of the pressure-sensitive adhesive 30 is 25 μm, and the sanding mold 20 is adhered and installed on the upper surface of the dressing disc base body 10;

[0106] S3: use the stacking method to lay the abrasive particles 11 on the sieve holes 21, and ensure that each sieve hole 21 has abrasive particles 11;

[0107] S4: take the pressing plate matched with the specification of the dressing disc base body 10, and compact the abrasive particles 11 placed in the sieve holes 21 through the pressing plate, so that the abrasive particles 11 are fully combined with the pressure-sensitive adhesive 30 and adhered to the dressing disc base body 10;

[0108] S5: remove the pressing plate, and perform the reverse buckling treatment on the dressing disc base body 10 together with the sanding mold 20, and remove the excess abrasive particles 11;

[0109] S6: select the solder 40, lay the solder 40 on the sanding mold 20, use the ultrasonic equipment to make the solder 40 uniformly fill the gap between the sieve holes 21 and the abrasive particles 11, until the thickness of the solder 40 accumulation is the same as the thickness of the sanding mold 20, and the solder 40 is shaped under the adhesion of the pressure-sensitive adhesive 30;

[0110] S7: remove the sanding mold 20 with the sieve holes 21, place the dressing disc base body 10 to be processed in the vacuum high-temperature furnace for high-temperature brazing, the temperature of the high-temperature brazing is set to 1200℃, and the time length is controlled to 3 min, so that the solder 40 melts to fix the abrasive particles 11 on the dressing disc base body 10 to generate a brazing layer, and then natural cooling treatment is performed, wherein the pressure-sensitive adhesive 30 has been removed due to high temperature, and only the brazing layer is left to fix the abrasive particles 11 on the surface of the base body;

[0111] S8: place the dressing disc base body 10 after the natural cooling treatment in the electroplating liquid for electroplating treatment, the current density is 1.5 A / dm 2 , the temperature is 48℃, and the electroplating time is 8 h, so as to generate an electroplating layer on the brazing layer, and the electroplating layer covers more than 70% of the surface of the abrasive particles 11;

[0112] S9: send the dressing disc base body 10 after the electroplating treatment to the tube furnace again, use the physical vapor deposition method (PVD) to generate a third plating layer on the electroplating layer, the third plating layer is a ternary alloy covering layer, the thickness is controlled to 5 μm, can resist acid and alkali corrosion, and prevent the damage of the plating layer from causing the abrasive particles 11 to fall off.

[0113] Example 4:

[0114] S1: design the sanding mold 20, the sanding mold 20 is provided with a plurality of sieve holes 21 corresponding to the fan-shaped area 15, the aperture of the sieve hole 21 is slightly larger than the particle size of the abrasive particles 11;

[0115] S2: coat the pressure-sensitive adhesive 30 on the upper surface of the dressing disc base body 10, the thickness of the pressure-sensitive adhesive 30 is 20 μm, and the sanding mold 20 is adhered and installed on the upper surface of the dressing disc base body 10;

[0116] S3: use the stacking method to lay the abrasive particles 11 on the sieve holes 21, and ensure that each sieve hole 21 has abrasive particles 11;

[0117] S4: take the pressing plate matched with the specification of the dressing disc base body 10, and compact the abrasive particles 11 placed in the sieve holes 21 through the pressing plate, so that the abrasive particles 11 are fully combined with the pressure-sensitive adhesive 30 and adhered to the dressing disc base body 10;

[0118] S5: remove the pressing plate, and perform the reverse buckling treatment on the dressing disc base body 10 together with the sanding mold 20, and remove the excess abrasive particles 11;

[0119] S6: select the solder 40, lay the solder 40 on the sanding mold 20, use the ultrasonic equipment to make the solder 40 uniformly fill the gap between the sieve holes 21 and the abrasive particles 11, until the thickness of the solder 40 accumulation is the same as the thickness of the sanding mold 20, and the solder 40 is shaped under the adhesion of the pressure-sensitive adhesive 30;

[0120] S7: remove the sanding mold 20 with the sieve holes 21, place the dressing disc base body 10 to be processed in the vacuum high-temperature furnace for high-temperature brazing, the temperature of the high-temperature brazing is set to 1100℃, and the time length is controlled to 3 min, so that the solder 40 melts to fix the abrasive particles 11 on the dressing disc base body 10 to generate a brazing layer, and then natural cooling treatment is performed, wherein the pressure-sensitive adhesive 30 has been removed due to high temperature, and only the brazing layer is left to fix the abrasive particles 11 on the surface of the base body;

[0121] S8: place the dressing disc base body 10 after the natural cooling treatment in the electroplating liquid for electroplating treatment, the current density is 1.5 A / dm 2 , the temperature is 48℃, and the electroplating time is 8 h, so as to generate an electroplating layer on the brazing layer, and the electroplating layer covers more than 70% of the surface of the abrasive particles 11;

[0122] S9: send the dressing disc base body 10 after the electroplating treatment to the tube furnace again, use the physical vapor deposition method (PVD) to generate a third plating layer on the electroplating layer, the third plating layer is a ternary alloy covering layer, the thickness is controlled to 5 μm, can resist acid and alkali corrosion, and prevent the damage of the plating layer from causing the abrasive particles 11 to fall off.

[0123] Example 5:

[0124] S1: design the sanding mold 20, the sanding mold 20 is provided with a plurality of sieve holes 21 corresponding to the fan-shaped area 15, the aperture of the sieve hole 21 is slightly larger than the particle size of the abrasive particles 11;

[0125] S2: coat the pressure-sensitive adhesive 30 on the upper surface of the dressing disc base body 10, the thickness of the pressure-sensitive adhesive 30 is 20 μm, and the sanding mold 20 is adhered and installed on the upper surface of the dressing disc base body 10;

[0126] S3: use the stacking method to lay the abrasive particles 11 on the sieve holes 21, and ensure that each sieve hole 21 has the abrasive particles 11;

[0127] S4: take the pressing plate matched with the specification of the dressing disc base body 10, and compact the abrasive particles 11 placed in the sieve holes 21 through the pressing plate, so that the abrasive particles 11 are fully combined with the pressure-sensitive adhesive 30 and adhered to the dressing disc base body 10;

[0128] S5: remove the pressing plate, and perform the reverse buckling treatment on the dressing disc base body 10 together with the sanding mold 20, and remove the excessive abrasive particles 11;

[0129] S6: select the solder 40, lay the solder 40 on the sanding mold 20, use the ultrasonic equipment to make the solder 40 uniformly fill the gap between the sieve holes 21 and the abrasive particles 11, until the thickness of the solder 40 accumulation is the same as the thickness of the sanding mold 20, and the solder 40 is shaped under the adhesion of the pressure-sensitive adhesive 30;

[0130] S7: remove the sanding mold 20 with the sieve holes 21, place the dressing disc base body 10 to be processed in the vacuum high-temperature furnace for high-temperature brazing, the temperature of the high-temperature brazing is set to 1300 ℃, and the time length is controlled to 3 min, so that the solder 40 melts to fix the abrasive particles 11 on the dressing disc base body 10 to generate a brazing layer, and then natural cooling treatment is performed, wherein the pressure-sensitive adhesive 30 has been removed due to high temperature, and only the brazing layer is left to fix the abrasive particles 11 on the surface of the base body;

[0131] S8: place the dressing disc base body 10 after the natural cooling treatment in the electroplating liquid for electroplating treatment, the current density is 1.5 A / dm 2 , the temperature is 48 ℃, and the electroplating time is 8 h, so as to generate an electroplated layer on the brazing layer, and the electroplated layer covers more than 70% of the surface of the abrasive particles 11;

[0132] S9: send the dressing disc base body 10 after the electroplating treatment to the tube furnace again, use the physical vapor deposition method (PVD) to generate a third plating layer on the electroplated layer, the third plating layer is a ternary alloy covering layer, the thickness is controlled to 5 μm, can resist acid and alkali corrosion, and prevents the damage of the plating layer from causing the abrasive particles 11 to fall off.

[0133] Example 6:

[0134] S1: design the sanding mold 20, the sanding mold 20 is provided with a plurality of sieve holes 21 corresponding to the fan-shaped area 15, the aperture of the sieve hole 21 is slightly larger than the particle size of the abrasive particles 11;

[0135] S2: coat the pressure-sensitive adhesive 30 on the upper surface of the dressing disc base body 10, the thickness of the pressure-sensitive adhesive 30 is 20 μm, and the sanding mold 20 is adhered and installed on the upper surface of the dressing disc base body 10;

[0136] S3: use the stacking method to lay the abrasive particles 11 on the sieve holes 21, and ensure that each sieve hole 21 has the abrasive particles 11;

[0137] S4: take the pressing plate matched with the specification of the dressing disc base body 10, and compact the abrasive particles 11 placed in the sieve holes 21 through the pressing plate, so that the abrasive particles 11 are fully combined with the pressure-sensitive adhesive 30 and adhered to the dressing disc base body 10;

[0138] S5: remove the pressing plate, and perform the reverse buckling treatment on the dressing disc base body 10 together with the sanding mold 20, and remove the excessive abrasive particles 11;

[0139] S6: select the solder 40, lay the solder 40 on the sanding mold 20, use the ultrasonic equipment to make the solder 40 uniformly fill the gap between the sieve holes 21 and the abrasive particles 11, until the thickness of the solder 40 accumulation is the same as the thickness of the sanding mold 20, and the solder 40 is shaped under the adhesion of the pressure-sensitive adhesive 30;

[0140] S7: remove the sanding mold 20 with the sieve holes 21, place the dressing disc base body 10 to be processed in the vacuum high-temperature furnace for high-temperature brazing, the temperature of the high-temperature brazing is set to 1200℃, and the time length is controlled to 3 min, so that the solder 40 melts to fix the abrasive particles 11 on the dressing disc base body 10 to generate a brazing layer, and then natural cooling treatment is performed, wherein the pressure-sensitive adhesive 30 has been removed due to high temperature, and only the brazing layer is left to fix the abrasive particles 11 on the surface of the base body;

[0141] S8: place the dressing disc base body 10 after the natural cooling treatment in the electroplating liquid for electroplating treatment, the current density is 1.5 A / dm 2 , the temperature is 48℃, and the electroplating time is 6 h, so as to generate an electroplating layer on the brazing layer, and the electroplating layer covers more than 70% of the surface of the abrasive particles 11;

[0142] S9: send the dressing disc base body 10 after the electroplating treatment to the tube furnace again, use the physical vapor deposition method (PVD) to generate a third plating layer on the electroplating layer, the third plating layer is a ternary alloy covering layer, the thickness is controlled to 5 μm, can resist acid and alkali corrosion, and prevent the damage of the plating layer from causing the abrasive particles 11 to fall off.

[0143] Example 7:

[0144] S1: design the sanding mold 20, the sanding mold 20 is provided with a plurality of sieve holes 21 corresponding to the fan-shaped area 15, the aperture of the sieve hole 21 is slightly larger than the particle size of the abrasive particles 11;

[0145] S2: coat the pressure-sensitive adhesive 30 on the upper surface of the dressing disc base body 10, the thickness of the pressure-sensitive adhesive 30 is 20 μm, and the sanding mold 20 is adhered and installed on the upper surface of the dressing disc base body 10;

[0146] S3: use the stacking method to lay the abrasive particles 11 on the sieve holes 21, and ensure that each sieve hole 21 has abrasive particles 11;

[0147] S4: take the pressing plate matched with the specification of the dressing disc base body 10, and compact the abrasive particles 11 placed in the sieve holes 21 through the pressing plate, so that the abrasive particles 11 are fully combined with the pressure-sensitive adhesive 30 and adhered to the dressing disc base body 10;

[0148] S5: remove the pressing plate, and perform the reverse buckling treatment on the dressing disc base body 10 together with the sanding mold 20, and remove the excess abrasive particles 11;

[0149] S6: select the solder 40, lay the solder 40 on the sanding mold 20, use the ultrasonic equipment to make the solder 40 uniformly fill the gap between the sieve holes 21 and the abrasive particles 11, until the thickness of the solder 40 accumulation is the same as the thickness of the sanding mold 20, and the solder 40 is shaped under the adhesion of the pressure-sensitive adhesive 30;

[0150] S7: remove the sanding mold 20 with the sieve holes 21, place the dressing disc base body 10 to be processed in the vacuum high-temperature furnace for high-temperature brazing, the temperature of the high-temperature brazing is set to 1200℃, and the time length is controlled to 3 min, so that the solder 40 melts to fix the abrasive particles 11 on the dressing disc base body 10 to generate a brazing layer, and then natural cooling treatment is performed, wherein the pressure-sensitive adhesive 30 has been removed due to high temperature, and only the brazing layer is left to fix the abrasive particles 11 on the surface of the base body;

[0151] S8: place the dressing disc base body 10 after the natural cooling treatment in the electroplating liquid for electroplating treatment, the current density is 1.5 A / dm 2 , the temperature is 48℃, and the electroplating time is 10 h, so as to generate an electroplated layer on the brazing layer, and the electroplated layer covers more than 70% of the surface of the abrasive particles 11;

[0152] S9: send the dressing disc base body 10 after the electroplating treatment to the tube furnace again, use the physical vapor deposition method (PVD) to generate a third plating layer on the electroplated layer, the third plating layer is a ternary alloy covering layer, the thickness is controlled to 5 μm, can resist acid and alkali corrosion, and prevent the damage of the plating layer from causing the abrasive particles 11 to fall off.

[0153] In Example 1, the 15 μm thick pressure sensitive adhesive 30 can be completely removed during brazing, but after the reverse buckling, the retention of the abrasive grains 11 on the dressing disc substrate 10 is reduced, because the adhesive layer is too thin, resulting in insufficient adhesion, and the abrasive grains 11 are prone to fall off; in Example 3, the 25 μm pressure sensitive adhesive 30 can well adhere to the abrasive grains 11, so that the abrasive grains 11 are not prone to fall off, but during high-temperature brazing, the pressure sensitive adhesive 30 is not completely removed due to the too thick adhesive layer, and there is a certain residue on the dressing disc substrate 10; while in Example 2, the 20 μm pressure sensitive adhesive 30 can well adhere to the abrasive grains 11, so that the abrasive grains 11 are not prone to fall off, and can be completely removed by high temperature during high-temperature brazing without residue. For detailed comparison, please refer to the following table:

[0154]

[0155] Therefore, when the pressure sensitive adhesive 30 is spin-coated, the thickness of the pressure sensitive adhesive 30 should be controlled at 20 microns.

[0156] In Example 4, the temperature of the high-temperature furnace is set at 1100℃, and the abrasive grains 11 have no thermal damage phenomenon, but the pressure sensitive adhesive 30 has residue on the substrate; in Example 5, the temperature of the high-temperature furnace is set at 1300℃, and the pressure sensitive adhesive 30 is completely removed, but the diamond surface appears cracks and thermal damage occurs; in Example 2, the temperature in the vacuum high-temperature furnace should be controlled at 1200℃, and the abrasive grains 11 have no thermal damage phenomenon, and the pressure sensitive adhesive 30 is completely removed. For details, please refer to the following table:

[0157]

[0158] Therefore, during brazing, the temperature in the vacuum high-temperature furnace should be controlled at 1200℃.

[0159] In Example 6, the plating time is controlled at 6h, and after the plating is completed, the plating layer has a thickness of 65 μm, and the abrasive grains 11 are wrapped by 67% of the volume, and the grain dropping occurs during the marathon test, because the plating layer is not high enough, and the control of the abrasive grains 11 is not enough, resulting in the diamond falling off during the test; in Example 7, the plating time is controlled at 10h, and after the plating is completed, the plating layer has a thickness of 107 μm, and the diamond is wrapped by 88% of the volume, and the control is good, and there is no diamond falling off during the marathon test, but the exposed volume of the abrasive grains 11 is small, resulting in the performance of the dressing disc being reduced, and the efficiency being reduced; in Example 2, the plating time is controlled at 8h, and after the plating is completed, the plating layer has a thickness of 83 μm, and the diamond is wrapped by 70% of the volume, and the control is good, and there is no diamond falling off during the marathon test, and the exposed volume of the abrasive grains 11 is appropriate, and the performance of the dressing disc meets the use requirements. For details, please refer to the following table:

[0160]

[0161] Therefore, during plating, the plating time is controlled at 8h, which is the best.

[0162] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the principle of the present application shall be included in the protection scope of the present application.

Claims

1. A CMP diamond conditioning disk, characterized by, It comprises: A dressing disc base (10), the center of the upper surface of the dressing disc base (10) is provided with a blank area (14), the outer periphery of the blank area (14) is provided with a plurality of sector areas (15) with the same center as the dressing disc base (10), the plurality of sector areas (15) are uniformly distributed along the circumferential direction of the dressing disc base (10), one side of the sector area (15) is jagged, and a groove area (16) is formed between every two sector areas (15), and the plurality of groove areas (16) are communicated with the blank area (14); Abrasive grains (11) laid on the sector area (15); A first plating layer (12) partially embedding the abrasive grains (11) and fixing the abrasive grains (11) on the dressing disc base (10), the height of the first plating layer (12) embedding the abrasive grains (11) is between 1 / 3 and 1 / 2 times the particle size of the abrasive grains (11); A second plating layer (13) covering the first plating layer (12) and partially embedding the abrasive grains (11), the height of the abrasive grains (11) exposed from the second plating layer (13) is between 1 / 4 and 1 / 3 times the particle size of the abrasive grains (11); A third plating layer covering the second plating layer (13), the thickness of the third plating layer is between 4 and 6 microns.

2. The CMP diamond conditioning disk of claim 1, wherein: The first plating layer (12) is a brazing layer, the second plating layer (13) is an electroplating layer, the thickness of the electroplating layer is between 65 and 107 microns, and the third plating layer is a ternary alloy covering layer.

3. The CMP diamond conditioning disk of claim 1, wherein: The abrasive grains (11) comprise octahedral diamond, the particle size of the abrasive grains (11) is between 35 and 120 mesh, the diameter of the dressing disc base (10) is 108 mm, and the thickness is 0.58 mm.

4. A method of manufacturing a CMP diamond dresser, based on the CMP diamond dresser according to claim 2, characterized in that, It comprises the following steps: S1: design an upper sand mold (20), the upper sand mold (20) is provided with a plurality of screen holes (21) corresponding to the sector area (15), and the particle size of the screen hole (21) is larger than the particle size of the abrasive grains (11); S2: coat a pressure-sensitive adhesive (30) on the upper surface of the dressing disc base (10), and adhere and install the upper sand mold (20) on the upper surface of the dressing disc base (10); S3: use the stacking method to lay the abrasive grains (11) on the screen hole (21); S4: take a pressing plate matched with the specification of the dressing disc base (10), and compact the abrasive grains (11) placed in the screen hole (21) through the pressing plate, so that the abrasive grains (11) are fully combined with the pressure-sensitive adhesive (30) and adhered to the dressing disc base (10); S5: remove the pressing plate, and perform a reverse clamping process on the dressing disc base (10) together with the upper sand mold (20) to remove the excess abrasive grains (11). S6: Selecting a solder (40), laying the solder (40) on the upper sand mold (20), using ultrasonic equipment to make the solder (40) uniformly fill the gap between the screen holes (21) and the abrasive particles (11), until the thickness of the solder (40) accumulation is the same as the thickness of the upper sand mold (20), and is shaped under the adhesion of the pressure-sensitive adhesive (30); S7: Remove the upper sand mold (20) with the screen holes (21), place the modified disc substrate (10) to be processed in a vacuum high-temperature furnace for high-temperature brazing, melt the solder (40) to fix the abrasive particles (11) on the modified disc substrate (10) to form the brazing layer, and then perform natural cooling treatment; S8: Place the modified disc substrate (10) after natural cooling treatment in an electroplating solution for electroplating treatment to form a layer of electroplated layer on the brazing layer, the electroplated layer covering the surface of the abrasive particles (11) between 67% and 88%; S9: After the electroplating treatment, the modified disc substrate (10) is sent to a tubular furnace, and a third plating layer is formed on the electroplated layer using physical vapor deposition, the third plating layer including a ternary alloy covering layer.

5. The method of claim 4, wherein the method further comprises: The thickness of the steel plate of the upper sand mold (20) is between 0.1 and 0.5 mm, and the diameter of the screen hole (21) is between 150 and 400 μm. ​ 6. The method of claim 4, wherein the method further comprises: The pressure-sensitive adhesive (30) includes rubber type and resin type, and the thickness of the pressure-sensitive adhesive (30) is between 5 and 35 microns.

7. The method of claim 4, wherein the method further comprises: The solder (40) includes silver, nickel, and copper, the temperature of the high-temperature brazing is set to 1000-1800°C, and the time of the high-temperature brazing is controlled to be 3 minutes. ​ 8. The method of claim 4, wherein the method further comprises: The current density of the electroplating treatment is controlled to be between 1 and 2 A / dm², the temperature of the electroplating treatment is controlled to be between 30 and 70°C, and the time of the electroplating treatment is between 6 and 10 hours.

9. The method of claim 4, wherein the method further comprises: The electroplating solution for electroplating treatment includes nickel sulfate 250 g / L, nickel chloride 30 g / L, boric acid 40 g / L, sodium dodecyl sulfate 0.1 g / L, saccharin 1.5 g / L, 1,4-butynediol 0.5 g / L. ​ 10. The method of claim 4, wherein the method further comprises: The constituent elements of the third plating layer include palladium, nickel, and chromium. ​

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