A method for preparing a microarray electrode

Abstract

This invention provides a method for fabricating a microarray electrode, including steps A) to G), as detailed below. In the prior art, the isolating sheet formed by a frame plate needs to be removed after resin casting and curing; additionally, a substrate needs to be attached, making the operation cumbersome. This invention replaces the isolating sheet formed by the frame plate with a resin plate isolating sheet, eliminating the need for centralized resin adhesive casting and a substrate, greatly simplifying the microarray electrode fabrication process. In the prior art, the frame isolating sheet is discarded after removal, and the precious metal wires on the frame and the back of the winding template cannot be reused, resulting in significant resource waste; furthermore, only 1-2 microarray electrode semi-finished products can be fabricated at a time, leading to low fabrication efficiency. In this invention, resin plate isolating sheets are attached to both sides of the winding template, and each semi-finished product can be cut into two semi-finished products, fully utilizing both the isolating sheet and the precious metal wires without waste, improving fabrication efficiency while saving resources.

Description

Technical Field

[0001] This invention relates to the field of electrodes, and in particular to a method for preparing a microarray electrode. Background Technology

[0002] Microelectrodes are electrodes with a diameter of less than 25 μm in at least one dimension (such as the radius of a disk or the width of a strip). Their steady-state current density is superior to that of conventional electrodes under forced convection. The polarization current on a microelectrode reduces the system's iR drop, making it suitable for high-resistivity systems. Microelectrodes, with their micrometer-scale or even smaller dimensions, offer advantages such as rapid response, high sensitivity, and high signal-to-noise ratio due to their extremely small working area. However, in practical applications, the current of a single microelectrode can sometimes fall below the detection limit of conventional electrochemical instruments, thus limiting their application. Microarray electrodes, on the other hand, consist of multiple microelectrodes arranged in a specific order, with a current equal to the sum of the currents of each individual microelectrode. They retain the characteristics of a single electrode while achieving a larger current intensity, allowing conventional electrochemical instruments to detect their signals. Therefore, microarray electrodes offer significant advantages and promising applications.

[0003] Existing technologies have disclosed various methods for fabricating microarray electrodes. For example, Chinese patent document ZL201210384966.0 discloses a method for fabricating glass-encapsulated ultramicroarray electrodes. ZL200710055628.1 also discloses a method for fabricating microdisk electrodes or microdisk array electrodes. However, these methods use manual arrangement of metal wires, which results in irregular arrangement and irregular interface structures in the fabricated microdisk array electrodes. Furthermore, manual arrangement of metal wires is time-consuming and inefficient, hindering the mass production of microarray electrodes.

[0004] Existing technology ZL 200910259577.3 also discloses a semi-automatic method for preparing micro-disk array electrode assemblies. The main process is as follows: First, a first layer of metal wire coil is wound on a winding template using a winding machine. Then, an isolation sheet surrounded by a frame sheet is placed on the first layer of metal wire coil, and a second layer of metal wire coil is wound on the isolation sheet. Then, a substrate is attached to the outside of the isolation sheet of the metal wire coil. Finally, resin adhesive is poured into the groove between the winding template, the isolation sheet, and the substrate. After curing, the metal wire coil is cut, and the winding template, the isolation sheet, and the substrate are removed to obtain the electrode assembly. However, micro-array electrodes generally use precious metal wires such as gold and platinum as electrode materials. The frame isolation sheet is discarded after removal, and the precious metal wires on the frame and the back of the winding template cannot be reused, resulting in a significant waste of resources. Moreover, this method of preparing micro-array electrodes is cumbersome. The isolation sheet surrounded by the frame sheet needs to be removed after the resin is poured and cured; in addition, the substrate needs to be attached, making the operation quite complicated. Moreover, only 1-2 microarray electrode semi-finished products can be prepared at a time, resulting in low preparation efficiency. Summary of the Invention

[0005] In view of this, the present invention provides a method for fabricating a microarray electrode. The fabrication method provided by the present invention is simple and efficient, eliminating the need for casting and substrate bonding; it also reduces the waste of insulating plates and precious metal wires; moreover, it can fabricate multiple microarray electrode assemblies at once, improving fabrication efficiency.

[0006] This invention provides a method for fabricating a microarray electrode, comprising the following steps:

[0007] A) Fix the winding template on the winding machine, set the operating parameters of the winding machine, and use the winding machine to wind the first layer of metal wire coil on the winding template along its long axis.

[0008] The operating parameters include the number of spindle turns, the cable spool pitch, and the cable spool starting position.

[0009] B) Attach the two resin board isolation sheets coated with resin adhesive to the center position of the two sides of the winding template with the first layer of metal wire coil obtained in step A), so that the two sides of the winding template are covered with the first layer of isolation sheet.

[0010] in,

[0011] The resin plate separator coated with resin adhesive is obtained by the following method: coating one side of the resin plate separator with resin adhesive to obtain the resin plate separator coated with resin adhesive.

[0012] The resin plate separator can cover the first layer of metal wire coil in the length direction and is shorter than the first layer of metal wire coil in the width direction, so that the metal wire coil is exposed on both sides in the width direction.

[0013] C) Continue winding the second layer of metal wire coil on the winding template along its long axis; then, according to step B), attach two resin board isolation sheets coated with resin adhesive to the center position of the two sides of the winding template with the second layer of metal wire coil, so that the two sides of the winding template are covered with the second layer of isolation sheets respectively.

[0014] D) Repeat step C) until the nth layer of metal wire coil and the nth layer of insulating sheet are formed, to obtain an nth layer composite;

[0015] Where n≥2;

[0016] E) Remove the n-layer composite from the winding machine and vacuum dry it to cure the resin adhesive; then, cut the metal wires without resin adhesive at the top and bottom ends of the winding template to obtain two microarray electrode assemblies 1; then cut each microarray electrode assembly 1 along its long axis to divide it into two, resulting in a total of 4 microarray electrode assemblies 2.

[0017] F) Cut each microarray electrode assembly 2 multiple times along its width direction to obtain several microarray electrode assemblies 3;

[0018] G) Connect the metal wire end of the microarray electrode assembly 3 to the metal wire, fix it with conductive adhesive and cover it with heat shrink tubing, heat the heat shrink tubing to shrink it and tightly cover the connection between the metal wire and the metal wire, then put it into a silicone tube, and seal the end face of the silicone tube that is not connected to the metal wire, and then pour adhesive through the other end face of the silicone tube. After that, vacuum curing is performed to obtain the microarray electrode.

[0019] Preferably, in step A), the thickness of the winding template is 0.5 to 3.0 mm.

[0020] Preferably, the winding template is made of aluminum alloy plate, iron plate, stainless steel plate, plastic plate, glass plate or cardboard.

[0021] Preferably, the thickness of the resin plate separator is 0.1 to 1.0 mm.

[0022] Preferably, the resin plate separator is made of epoxy resin, polyurethane, or polyacrylic resin.

[0023] Preferably, the resin adhesive is an epoxy resin adhesive, a polyurethane adhesive, or a polyacrylic acid adhesive.

[0024] Preferably, in step E), the vacuum drying temperature is 20–60°C and the time is 0.5–5.0 h.

[0025] Preferably, in step G), the conductive adhesive is a silver conductive adhesive.

[0026] Preferably, in step G), the adhesive is an epoxy resin adhesive.

[0027] Preferably, in step G), the vacuum curing temperature is 20–60°C and the time is 1.0–12.0 h;

[0028] After vacuum curing, the end face is also polished.

[0029] This invention provides a method for fabricating a microarray electrode, including steps A) to G), as detailed above. In the prior art, the isolation sheet formed by the frame sheet needs to be removed after resin casting and curing; additionally, a substrate needs to be attached, making the operation cumbersome. This invention replaces the frame sheet with a resin plate isolation sheet, eliminating the need for centralized resin adhesive casting and a substrate, greatly simplifying the microarray electrode fabrication process. In the prior art, the frame isolation sheet is discarded after removal, and the precious metal wires on the frame and the back of the winding template cannot be reused, resulting in significant resource waste; furthermore, only 1-2 microarray electrode semi-finished products can be fabricated at a time, leading to low fabrication efficiency. In this invention, resin plate isolation sheets are attached to both sides of the winding template, and each semi-finished product can be cut into two, fully utilizing both the isolation sheet and the precious metal wires without waste, improving fabrication efficiency while saving resources. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of a winding template;

[0032] Figure 2 This is a schematic diagram of the winding template after winding the first layer of metal wire coil in step A);

[0033] Figure 3 A schematic diagram of the winding template after pasting the first layer of resin board separator in step B);

[0034] Figure 4 This is a schematic diagram of the winding template after winding the second layer of metal wire coil in step C);

[0035] Figure 5 This is a schematic diagram of the winding template after the second layer of resin board separator is pasted in step C);

[0036] Figure 6This is a schematic diagram of the winding template after winding the nth layer of metal wire coil and pasting the nth layer of resin board separator in step D);

[0037] Figure 7 This is a schematic diagram of the location where the metal wire is cut in step E).

[0038] Figure 8 This is a schematic diagram of the microarray electrode assembly 1 obtained after cutting the metal wire in step E).

[0039] Figure 9 This is a schematic diagram of cutting the microarray electrode assembly 1 into the microarray electrode assembly 2 in step E).

[0040] Figure 10 This is a schematic diagram of the microarray electrode assembly 2 obtained in step E); wherein, Figure 10 (a) is a front view of the microarray electrode assembly 2. Figure 10 (b) is a schematic diagram of the bottom of the microarray electrode assembly 2. Figure 10 (c) is a schematic diagram of the top of the microarray electrode assembly 2;

[0041] Figure 11 This is a schematic diagram of cutting the microarray electrode assembly 2 into the microarray electrode assembly 3 in step F); wherein, Figure 11 (a) is a schematic diagram of multiple cuts made to the microarray electrode assembly 2. Figure 11 (b) is a physical schematic diagram of the microarray electrode assembly 3 obtained after multiple cuts of the microarray electrode assembly 2;

[0042] Figure 12 This is a schematic diagram of the component obtained after inserting the silicone tube in step G);

[0043] Figure 13 This is a schematic diagram of the microarray electrode prepared in step G). Detailed Implementation

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0045] In this article, the technical features described in an open-ended manner include both closed technical solutions composed of the listed features and open technical solutions that include the listed features.

[0046] The term “and / or” as used herein includes any and all combinations of one or more of the related listed items.

[0047] In this document, numerical ranges are referred to as continuous unless otherwise specified, and include the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when a range refers to an integer, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are incorporated.

[0048] In this article, when referring to units for data ranges, if the unit is only followed by the right endpoint, it means that the units for the left and right endpoints are the same. For example, 0.5–3.0 mm means that the units for the left endpoint “0.5” and the right endpoint “3.0” are both mm.

[0049] This document only specifically discloses some numerical ranges. However, any lower limit can be combined with any upper limit to form an unspecified range; and any lower limit can be combined with other lower limits to form an unspecified range, just as any upper limit can be combined with any other upper limit to form an unspecified range. Furthermore, each individually disclosed point or single value can itself serve as a lower or upper limit and be combined with any other point or single value or with other lower or upper limits to form an unspecified range.

[0050] This invention provides a method for fabricating a microarray electrode, comprising the following steps:

[0051] A) Fix the winding template on the winding machine, set the operating parameters of the winding machine, and use the winding machine to wind the first layer of metal wire coil on the winding template along its long axis.

[0052] The operating parameters include the number of spindle turns, the cable spool pitch, and the cable spool starting position.

[0053] B) Attach the two resin board isolation sheets coated with resin adhesive to the center position of the two sides of the winding template with the first layer of metal wire coil obtained in step A), so that the two sides of the winding template are covered with the first layer of isolation sheet.

[0054] in,

[0055] The resin plate separator coated with resin adhesive is obtained by the following method: coating one side of the resin plate separator with resin adhesive to obtain the resin plate separator coated with resin adhesive.

[0056] The resin plate separator can cover the first layer of metal wire coil in the length direction and is shorter than the first layer of metal wire coil in the width direction, so that the metal wire coil is exposed on both sides in the width direction.

[0057] C) Continue winding the second layer of metal wire coil on the winding template along its long axis; then, according to step B), attach two resin board isolation sheets coated with resin adhesive to the center position of the two sides of the winding template with the second layer of metal wire coil, so that the two sides of the winding template are covered with the second layer of isolation sheets respectively.

[0058] D) Repeat step C) until the nth layer of metal wire coil and the nth layer of insulating sheet are formed, to obtain an nth layer composite;

[0059] Where n≥2;

[0060] E) Remove the n-layer composite from the winding machine and vacuum dry it to cure the resin adhesive; then, cut the metal wires without resin adhesive at the top and bottom ends of the winding template to obtain two microarray electrode assemblies 1; then cut each microarray electrode assembly 1 along its long axis to divide it into two, resulting in a total of 4 microarray electrode assemblies 2.

[0061] F) Cut each microarray electrode assembly 2 multiple times along its width direction to obtain several microarray electrode assemblies 3;

[0062] G) Connect the metal wire end of the microarray electrode assembly 3 to the metal wire, fix it with conductive adhesive and cover it with heat shrink tubing, heat the heat shrink tubing to shrink it and tightly cover the connection between the metal wire and the metal wire, then put it into a silicone tube, and seal the end face of the silicone tube that is not connected to the metal wire, and then pour adhesive through the other end face of the silicone tube. After that, vacuum curing is performed to obtain the microarray electrode.

[0063] Regarding step A) :

[0064] A) Fix the winding template on the winding machine, set the operating parameters of the winding machine, and use the winding machine to wind the first layer of metal wire coil on the winding template along its long axis.

[0065] According to the present invention, the winding template is first fixed on the winding machine. The winding template is as follows: Figure 1 As shown, this is a long strip / rectangular template. In this invention, the thickness of the winding template is preferably 0.5–3.0 mm, specifically 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, or 3.0 mm. In this invention, the winding template can be made of aluminum alloy plate, iron plate, stainless steel plate, plastic plate, glass plate, or cardboard, etc.

[0066] In this invention, the winding template is fixed on the winding machine, and the metal wire is installed in each hole of the winding machine to prepare for the winding operation.

[0067] According to this invention, after all installation is completed, the operating parameters of the winding machine are set, and the winding machine is used to wind the first layer of metal wire coils along the long axis of the winding template. In this invention, the operating parameters include the number of spindle turns, the thread pitch of the spool, and the starting position of the spool. The number of spindle turns (Tn) is preferably 5 to 100 turns, and in some embodiments of this invention, it is 30 turns. The thread pitch (P) of the spool is preferably 0.03 to 2.0 mm, and in some embodiments of this invention, it is 0.4 mm. The starting position of the spool (O) is 0. The number of spindle turns represents the number of turns of metal wire wound on the winding template, and the thread pitch represents the spacing between two adjacent metal wires in the same layer of metal wire coils. This invention sets the operating parameters of the winding machine and uses the winding machine, the winding template, and the resin plate separator to wind metal wire coils arranged in an array, achieving the purpose of mechanically arranging precious metal wires.

[0068] In this invention, a first layer of metal wire coil is wound along the long axis (or length direction) of the winding template. The structure of the resulting winding template for winding the first layer of metal wire coil is as follows: Figure 2 As shown, 1 is the winding template, and 2 is the first layer of metal wire coil. It can be seen that multiple turns of metal wire are wound on the winding template, and the metal wires are evenly spaced.

[0069] In this invention, the metal wire used in the metal wire coil is preferably gold, platinum, or silver. The diameter of the metal wire is preferably 5–50 μm, and in some embodiments of this invention, it is 25 μm.

[0070] Regarding step B) :

[0071] B) Attach the two resin board isolation sheets coated with resin adhesive to the center position of both sides of the winding template with the first layer of metal wire coil obtained in step A), so that the first layer of isolation sheet covers both sides of the winding template.

[0072] In this invention, the resin-coated spacer sheet is prepared by the following method: coating one side of the resin-coated spacer sheet with a resin adhesive to obtain the resin-coated spacer sheet. The resin-coated spacer sheet can be made of polymer materials such as epoxy resin, polyurethane, or polyacrylic acid resin. The thickness of the resin-coated spacer sheet is preferably 0.1–1.0 mm, specifically 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1.0 mm. The resin adhesive is preferably epoxy resin adhesive, polyurethane adhesive, or polyacrylic acid adhesive. Each resin plate separator has two surfaces (or two sides) – a front and a back (or front and back sides). In this invention, when applying the resin adhesive, the resin adhesive is applied to one side (or one side surface) of the resin plate separator, thereby obtaining a resin plate separator coated with resin adhesive (i.e., a separator coated with resin adhesive on one side).

[0073] In this invention, two resin-coated insulating sheets, as described above, are prepared and then adhered to the center of both sides of the winding template with the first layer of metal wire coils obtained in step A), thereby covering both sides of the winding template with the first layer of insulating sheets. In this invention, the side coated with resin adhesive is always adhered to the winding template. The winding template has two surfaces (or two sides): a front and a back (or front and back sides). In this invention, the two resin-coated insulating sheets are adhered to these two surfaces, specifically at the center of both surfaces. This centering position means that the resin-coated insulating sheets are located at the center of both the length and width directions of the winding template. In this invention, the resin-coated insulating sheets cover the first layer of metal wire coils in the length direction and are shorter than the first layer of metal wire coils in the width direction, exposing the metal wire coils on both sides in the width direction. The structure after adhering the resin-coated insulating sheets is as follows: Figure 3 As shown, 1 is the winding template, 2 is the first layer of metal wire coil, and 3 is the first layer of insulating sheet. It can be seen that the resin insulating sheet is positioned in the center of the winding template, and it completely covers the metal wire coil in the length direction, while being shorter than the metal wire on both sides in the width direction (i.e., the resin insulating sheet is recessed at both ends compared to the metal wire in the width direction), thus exposing the metal wire coil on both sides in the width direction. This invention is not limited to the above distribution method; for example, the resin insulating sheet can also be positioned in the center of the winding template in the length direction, with the metal wire coil exposed on both sides in the width direction.

[0074] In this invention, after the above-mentioned pasting operation, the first layer of isolation sheet is respectively covered on both sides of the winding template. Figure 3 The diagram is a plan view, showing only the front (the side facing the viewer) where the resin board separator is attached. In reality, a resin board separator is also attached to the back; that is, both sides of the winding template are covered with a layer of separator, referred to as the first layer separator. Preferably, the two first layer separators are symmetrically distributed along the winding template.

[0075] Regarding step C) :

[0076] C) Continue winding the second layer of metal wire coil on the winding template along its long axis; then, according to step B), attach two resin plate separators coated with resin adhesive to the center positions of the two sides of the winding template with the second layer of metal wire coil, so that the two sides of the winding template are covered with the second layer of separator.

[0077] According to the present invention, after step B), the winding machine is started to continue winding the second layer of metal wire coil on the winding template along its long axis. The specific operation is the same as in step A), and will not be repeated here. The above-mentioned continued winding of the second layer of metal wire coil can be done in either the forward or reverse direction. The wound product is as follows: Figure 4 As shown, 1 is the winding template, 3 is the first layer of insulating sheet, and 4 is the second layer of metal wire coil.

[0078] According to the present invention, after the second layer of metal wire coil is wound, two resin plate separators coated with resin adhesive are respectively pasted to the center positions of the two side surfaces of the winding template on which the second layer of metal wire coil is wound, in step B), so that the two side surfaces of the winding template are respectively covered with the second layer of separators. The selection range of resin adhesive and resin plate separators, the coating method of the resin adhesive on the resin plate separators, and the pasting position of the separators on the winding template are all consistent with the previous technical solution and will not be repeated here; more preferably, they are completely consistent with the specific selections in step B).

[0079] In this invention, after step C), a second layer of insulating sheets is applied to both sides of the winding template, such as... Figure 5 As shown, 1 is the winding template, 5 is the first and second layer of insulating sheet, and 6 is the first and second layer of metal wire coil.

[0080] Regarding step D) :

[0081] D) Repeat step C) until the nth layer of metal wire coil and the nth layer of insulating sheet are formed, resulting in an nth layer composite.

[0082] According to the present invention, after step C), the operation of step C) is repeated, that is, the metal wire coil and the resin board insulating sheet are wound sequentially until the nth layer of metal wire coil and the nth layer of insulating sheet are formed, resulting in an n-layer composite. The n-layer composite refers to a composite structure in which n layers of metal wire coil and n layers of insulating sheet are adhered to both sides of the winding template; that is, each side surface has an n-layer composite structure consisting of n layers of metal wire coil and n layers of insulating sheet, and there are two n-layer composite structures on both sides. The resulting composite is as follows: Figure 6 As shown, 1 is the winding template, 7 is the first to nth layer of insulating sheet, and 8 is the first to nth layer of metal wire coil.

[0083] In this invention, n≥2, specifically 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16.

[0084] Regarding step E) :

[0085] E) Remove the n-layer composite from the winding machine and vacuum dry it to cure the resin adhesive; then, cut the metal wires without resin adhesive at the top and bottom ends of the winding template to obtain two microarray electrode assemblies 1; then cut each microarray electrode assembly 1 along its long axis to divide it into two, resulting in a total of 4 microarray electrode assemblies 2.

[0086] According to the present invention, the n-layer composite obtained in step D) is first removed from the winding machine and subjected to vacuum drying to cure the resin binder (i.e., to cure the resin binder coated on the resin board separator). The vacuum drying temperature is preferably 20–60°C, specifically 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, or 60°C. The vacuum drying time is preferably 0.5–5.0 h, specifically 0.5 h, 1.0 h, 1.5 h, 2.0 h, 2.5 h, 3.0 h, 3.5 h, 4.0 h, 4.5 h, or 5.0 h.

[0087] According to the present invention, after the above-mentioned curing operation is completed, the metal wires without resin adhesive at both ends of the winding template are cut to obtain two microarray electrode assemblies 1. The metal wires without resin adhesive at both ends refer to the metal wires exposed in the width direction of the resin plate separator mentioned above, such as... Figure 7 As shown, the arrows indicate the locations where the metal wires are cut, meaning the upper and lower metal wires of the winding template are cut. This separates the two n-layer composite structures adhered to the two side surfaces of the winding template from the template, thus obtaining two microarray electrode assemblies 1, as shown. Figure 8 As shown.

[0088] According to the present invention, after obtaining two microarray electrode components 1, each microarray electrode component 1 is cut in half along its long axis, resulting in a total of four microarray electrode components 2. The cutting can be performed using a hacksaw. The process of cutting the microarray electrode components 1 into microarray electrode components 2 is as follows: Figure 9 As shown; where the red dashed line represents the cutting line along the long axis of the microarray electrode assembly 1. The actual microarray electrode assembly 2 is shown below. Figure 10 As shown, where, Figure 10 (a) is a front view of the microarray electrode assembly 2. Figure 10 (b) is a schematic diagram of the bottom of the microarray electrode assembly 2. Figure 10 (c) is a schematic diagram of the top of the microarray electrode assembly 2.

[0089] Regarding step F) :

[0090] F) Cut each microarray electrode assembly 2 multiple times along its width direction to obtain several microarray electrode assemblies 3.

[0091] According to the present invention, after obtaining the microarray electrode assembly 2 in step E), it is cut multiple times along the width direction to obtain a plurality of microarray electrode assemblies 3. Preferably, the number of cuts is ≥2. The cutting is preferably equal-spaced cutting, that is, each electrode assembly 2 is cut into a plurality of microarray electrode assemblies 3 of the same width at equal intervals along the width direction. The above operation process is as follows: Figure 11 As shown, where, Figure 11 (a) is a schematic diagram of multiple cuts made to the microarray electrode assembly 2. Figure 11 (b) is a physical schematic diagram of the microarray electrode assembly 3 obtained after multiple cuts of the microarray electrode assembly 2.

[0092] In this invention, the above-mentioned cutting operation is performed on each microarray electrode assembly 2 obtained in step E), so that each microarray electrode assembly 2 is cut into several microarray electrode assemblies 3.

[0093] Regarding step G) :

[0094] G) Connect the metal wire end of the microarray electrode assembly 3 to the metal wire, fix it with conductive adhesive and cover it with heat shrink tubing, heat the heat shrink tubing to shrink it and tightly cover the connection between the metal wire and the metal wire, then put it into a silicone tube, and seal the end face of the silicone tube that is not connected to the metal wire, and then pour adhesive through the other end face of the silicone tube. After that, vacuum curing is performed to obtain the microarray electrode.

[0095] According to the present invention, the metal wire end of the microarray electrode assembly 3 is connected to a metal wire. The metal wire includes a wire and a rubber sheath wrapped around the wire, with the wire exposed at both ends of the rubber sheath. When connecting the metal wire end of the microarray electrode assembly 3 to the metal wire, the metal wire end of the microarray electrode assembly 3 is connected to the exposed wire at one end of the metal wire.

[0096] According to the present invention, after the above connection, it is fixed with conductive adhesive and covered with heat shrink tubing. Specifically, conductive adhesive is applied to the connection between the metal wire and the wire, and heat shrink tubing is wrapped around it. The heat shrink tubing is then heated to shrink it and tightly cover the connection between the metal wire and the metal wire to reinforce the connection. The conductive adhesive is preferably silver conductive adhesive.

[0097] According to the present invention, after the above treatment, it is placed in a silicone tube. The resulting component is as follows: Figure 12 As shown, 1 is the microarray electrode assembly 3, 2 is the metal wire, 3 is the heat shrink tubing, and 4 is the silicone tube. Then, the end face of the silicone tube not connected to the metal wire (i.e.,...) Figure 12 The lower end face of the silicone tube is sealed, and then the other end face of the silicone tube (i.e., the other end face opposite to the sealed end face, specifically) is used to seal the tube. Figure 12 An adhesive is poured onto the upper surface of the electrode, followed by vacuum curing to obtain a microarray electrode. The adhesive is preferably an epoxy resin adhesive. The vacuum curing temperature is preferably 20–60°C, specifically 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, or 60°C. The vacuum curing time is preferably 1.0–12.0 h, specifically 1.0 h, 2.0 h, 3.0 h, 4.0 h, 5.0 h, 6.0 h, 7.0 h, 8.0 h, 9.0 h, 10.0 h, 11.0 h, or 12.0 h. Through the above vacuum curing, the adhesive is cured and air bubbles in the adhesive are removed.

[0098] In this invention, after the above-described curing process, it is preferable to further polish the end face of the resulting component. The end face refers to the end face without the metal wire connected (i.e., the end face). Figure 12 (The lower end face of the electrode). After the above treatment, a microarray electrode is obtained. Figure 13 As shown, from left to right, the first sample is a silicone tube, the second sample is the sample before the adhesive is poured after the silicone tube is put on, and the last 5 samples are the final microarray electrode samples.

[0099] This invention provides a method for fabricating a microarray electrode, including steps A) to G), as detailed above. In the prior art, the isolation sheet formed by the frame sheet needs to be removed after resin casting and curing; additionally, a substrate needs to be attached, making the operation cumbersome. This invention replaces the frame sheet with a resin plate isolation sheet, eliminating the need for centralized resin adhesive casting and a substrate, greatly simplifying the microarray electrode fabrication process. In the prior art, the frame isolation sheet is discarded after removal, and the precious metal wires on the frame and the back of the winding template cannot be reused, resulting in significant resource waste; furthermore, only 1-2 microarray electrode semi-finished products can be fabricated at a time, leading to low fabrication efficiency. In this invention, resin plate isolation sheets are attached to both sides of the winding template, and each semi-finished product can be cut into two, fully utilizing both the isolation sheet and the precious metal wires without waste, improving fabrication efficiency while saving resources.

[0100] To further understand the present invention, preferred embodiments of the present invention are described below in conjunction with examples. However, it should be understood that these descriptions are only for further illustrating the features and advantages of the present invention, and not for limiting the scope of the claims of the present invention.

[0101] Example 1

[0102] A) Fix the stainless steel winding template on the winding machine, set the operating parameters of the winding machine, and use the winding machine to wind the first layer of metal wire coil (the diameter of the metal wire is 25μm) on the winding template along its long axis.

[0103] The operating parameters for the winding machine are as follows:

[0104] Number of spindle turns (Tn): 30 turns; ribbon cable spool pitch (P): 0.4 mm; ribbon cable spool starting position (O): 0 mm.

[0105] B) Attach two resin board separators coated with resin adhesive (the resin board material is epoxy resin and the resin board thickness is 0.3mm) to the center position of both sides of the winding template with the first layer of metal wire coil obtained in step A), so that the first layer of separators covers both sides of the winding template.

[0106] C) Continue winding the second layer of metal wire coil (forward or reverse) along its long axis on the winding template; then, according to step B), attach two resin board isolation sheets coated with resin adhesive (the resin board material and thickness are the same as in step B) to the center position of both sides of the winding template with the second layer of metal wire coil, so that the second layer of isolation sheets are covered on both sides of the winding template.

[0107] D) Repeat step C) until the 6th layer of metal wire coil and the 6th layer of insulating sheet are formed, resulting in a 6-layer composite.

[0108] E) Remove the 6-layer composite from the winding machine and place it in a 25°C vacuum oven for 5.0 hours to allow the resin adhesive to cure and remove air bubbles from the resin adhesive. Then, cut the metal wires without resin adhesive at the top and bottom ends of the winding template and remove the 6-layer composite from both sides of the winding template to obtain two 30×6 arrayed microarray electrode components 1. Then, cut each microarray electrode component 1 along its long axis to divide it into two, resulting in a total of 4 microarray electrode components 2.

[0109] F) Each microarray electrode assembly 2 is cut four times at equal intervals along its width direction to obtain five microarray electrode assemblies 3. A total of 20 microarray electrode assemblies 3 are obtained from four microarray electrode assemblies 2.

[0110] G) Connect the metal wire end of the microarray electrode assembly 3 to the metal wire, fix it with silver conductive adhesive and wrap it with heat shrink tubing. Heat the heat shrink tubing to shrink it and tightly wrap the connection between the metal wire and the metal wire. Then place it in a silicone tube and seal the end face of the silicone tube that is not connected to the metal wire. Then pour epoxy resin adhesive through the other end face of the silicone tube. After that, vacuum cure at 25°C for 12.0h, and then polish the end face to obtain microarray electrodes (spacing 0.4mm and 0.3mm respectively). The 20 microarray electrode assemblies 3 obtained in step F) are all processed according to step G), and finally a total of 20 microarray electrodes are obtained.

[0111] This document uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of these embodiments are merely to aid in understanding the method and core ideas of the present invention, including the best mode, and to enable any person skilled in the art to practice the present invention, including manufacturing and using any device or system, and implementing any combined method. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims. The scope of protection of this patent is defined by the claims and may include other embodiments that can be conceived by those skilled in the art. If these other embodiments have structural elements similar to those expressed in the claims, or if they include equivalent structural elements that are not substantially different from those expressed in the claims, then these other embodiments should also be included within the scope of the claims.

Claims

1. A method for fabricating a microarray electrode, characterized in that, Includes the following steps: A) Fix the winding template on the winding machine, set the operating parameters of the winding machine, and use the winding machine to wind the first layer of metal wire coil on the winding template along its long axis. The operating parameters include the number of spindle turns, the cable spool pitch, and the cable spool starting position. B) Attach the two resin board isolation sheets coated with resin adhesive to the center position of the two sides of the winding template with the first layer of metal wire coil obtained in step A), so that the two sides of the winding template are covered with the first layer of resin board isolation sheets respectively. in, The resin plate separator coated with resin adhesive is obtained by the following method: coating one side of the resin plate separator with resin adhesive to obtain the resin plate separator coated with resin adhesive. The resin plate separator can cover the metal wire coil in the length direction and is shorter than the metal wire coil in the width direction, so that the metal wire coil is exposed on both sides in the width direction. C) Continue winding the second layer of metal wire coil on the winding template along its long axis; then, according to step B), attach two resin board isolation sheets coated with resin adhesive to the center position of the two sides of the winding template on which the second layer of metal wire coil is wound, so that the two sides of the winding template are covered with the second layer of resin board isolation sheets respectively. D) Repeat step C) until the nth layer of metal wire coil and the nth layer of resin plate separator are formed to obtain an n-layer composite; Where n≥2; E) Remove the n-layer composite from the winding machine and vacuum dry it to cure the resin adhesive; then, cut the exposed metal wires at the top and bottom ends of the winding template that extend beyond the resin plate separator in the width direction to obtain two microarray electrode assemblies 1; then cut each microarray electrode assembly 1 along its long axis to divide it into two, resulting in a total of 4 microarray electrode assemblies 2. F) Cut each microarray electrode assembly 2 multiple times along its width direction to obtain several microarray electrode assemblies 3; G) Connect the metal wire end of the microarray electrode assembly 3 to the metal wire, fix it with conductive adhesive and cover it with heat shrink tubing, heat the heat shrink tubing to shrink it and tightly cover the connection between the metal wire and the metal wire, then put it into a silicone tube, and seal the end face of the silicone tube that is not connected to the metal wire, then pour adhesive from the other end face of the silicone tube, and then vacuum cure to obtain the microarray electrode.

2. The preparation method according to claim 1, characterized in that, In step A), the thickness of the winding template is 0.5~3.0 mm.

3. The preparation method according to claim 1, characterized in that, The winding template is made of aluminum alloy plate, iron plate, stainless steel plate, plastic plate, glass plate or cardboard.

4. The preparation method according to claim 1, characterized in that, The thickness of the resin plate separator is 0.1~1.0mm.

5. The preparation method according to claim 1, characterized in that, The resin plate separator is made of epoxy resin, polyurethane, or polyacrylic resin.

6. The preparation method according to claim 1, characterized in that, The resin adhesive is an epoxy resin adhesive, a polyurethane adhesive, or a polyacrylic acid adhesive.

7. The preparation method according to claim 1, characterized in that, In step E), the vacuum drying temperature is 20~60℃ and the time is 0.5~5.0 h.

8. The preparation method according to claim 1, characterized in that, In step G), the conductive adhesive is a silver conductive adhesive.

9. The preparation method according to claim 1, characterized in that, In step G), the adhesive is an epoxy resin adhesive.

10. The preparation method according to claim 1, characterized in that, In step G), the vacuum curing temperature is 20~60℃ and the time is 1.0~12.0 h; After vacuum curing, the end face is also polished.

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