A composite flexible conductive film and a preparation method and film preparation equipment thereof

Abstract

The present application relates to a kind of composite flexible conductive film and its preparation method, including polymer substrate layer and metal layer, select the polymer material containing coordination group to make polymer substrate layer, the metal layer is bonded with the polymer substrate layer by magnetron sputtering or evaporation, and with the way of forming coordination bond;The present application also relates to a kind of film preparation equipment, and alternatingly provided with plating area and non-plating area between its winding area and unwinding area, plating area includes plating vessel and first cooling roller, and non-plating area includes second cooling roller;The temperature difference between the last group of plating area and non-plating area is less than the temperature difference between the first group of plating area and non-plating area.The metal layer on the composite flexible conductive film of the present application is firmly combined with the polymer substrate layer, solves the problem that metal is easily dropped;The present application gradually reduces the temperature difference between plating area and non-plating area, so that the temperature difference that polymer material endures is smaller and smaller, guarantees the strength and elongation of polymer material.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of conductive film, in particular to a composite flexible conductive film and a preparation method and film preparation equipment thereof. BACKGROUND

[0002] The flexible conductive film is a composite structure conductive film, which comprises a high polymer base material layer in the middle and metal layers on both sides. The high polymer base material layer is used as a base layer and is made of high polymer material, which plays a supporting and fixing role in the conductive film. The metal layer is used as a functional layer and is made of conductive metal material, which is combined with the surface of the high polymer base material layer to make the film have good conductive performance.

[0003] The existing flexible conductive film has the problem of easy peeling of the metal layer. Through research, it is found that the interface adhesion between the film material (metal layer) and the base material (high polymer base material layer) is insufficient, which leads to delamination between the film material and the base material. The insufficient interface adhesion between the high polymer base material layer and the metal layer is mostly caused by the change of temperature during the production and preparation of the composite flexible conductive film, which causes the material to expand and contract with heat, resulting in stress. When the stress exceeds the adhesion of the metal layer and the high polymer base material layer, delamination occurs.

[0004] Therefore, how to improve the adhesion between the high polymer base material layer and the metal layer to cope with the inevitable temperature change during the preparation process and prevent the metal layer from peeling off has become a technical problem to be solved in the industry. SUMMARY

[0005] In order to overcome the problem that the metal layer of the existing composite flexible conductive film is easy to peel off from the high polymer base material layer, the present application provides a composite flexible conductive film and a preparation method and film preparation equipment thereof.

[0006] The technical scheme of the present application is as follows:

[0007] A composite flexible conductive film comprises a high polymer base material layer in the middle and metal layers on both sides. The material of the high polymer base material layer is a high polymer material containing a coordination group. The metal layer is bonded to the high polymer base material layer by magnetron sputtering or evaporation in a way of forming a coordination bond.

[0008] According to the application of the above scheme, the high polymer material is polyamide, polyterephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid fiber, polyoxymethylene, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose and its derivatives, starch and its derivatives, protein and its derivatives, polyvinyl alcohol and its cross-linked product, or polyethylene glycol and its cross-linked product, which contain pyridine coordination group, oxazole coordination group or pyrazole coordination group.

[0009] According to the application of the above scheme, the high polymer material is polyamide, polyterephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid fiber, polyoxymethylene, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose and its derivatives, starch and its derivatives, protein and its derivatives, polyvinyl alcohol and its cross-linked product, or polyethylene glycol and its cross-linked product, which contain pyridine coordination group, oxazole coordination group or pyrazole coordination group.

[0010] Further, the thermal conductivity of the high temperature resistant protective layer is greater than that of the first and second high polymer material layers.

[0011] Preferably, the metal layer is provided with a flame-retardant layer, and the flame-retardant layer comprises a flame retardant, a first adhesive and a first conductive agent.

[0012] Preferably, the metal layer is provided with a conductive layer, and the conductive layer comprises a second conductive agent and a second adhesive.

[0013] The application also provides a preparation method of the composite flexible conductive film, which is used for preparing the composite flexible conductive film of the above scheme.

[0014] According to the application of the above scheme, the high polymer material is polyamide, polyterephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid fiber, polyoxymethylene, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose and its derivatives, starch and its derivatives, protein and its derivatives, polyvinyl alcohol and its cross-linked product, or polyethylene glycol and its cross-linked product, which contain pyridine coordination group, oxazole coordination group or pyrazole coordination group.

[0015] Step A: preparing a first high polymer material layer by taking high polymer material;

[0016] Step B: forming a high temperature resistant protective layer by coating high temperature resistant material on the first high polymer material layer;

[0017] Step C: preparing a second high polymer material layer by taking high polymer material and compounding it on the high temperature resistant protective layer.

[0018] According to the application of the above scheme, when the film plating is carried out for several times in a vacuum environment, the number of film plating vessels used in the last film plating is less than that used in the previous film plating.

[0019] The application also provides a film manufacturing device for the composite flexible conductive film, comprising a unwinding area and a winding area, and a plurality of plating areas and a plurality of non-plating areas are alternately arranged between the winding area and the unwinding area, the plating area comprises a plating vessel and a first cooling roller, and the non-plating area comprises a second cooling roller; each of the plating areas and the non-plating area behind it form a group, and the temperature difference between the plating area and the non-plating area of the latter group is less than that of the former group.

[0020] According to the application, the number of the plating vessels of the latter plating area is less than that of the former plating area, and the cooling temperatures of the first cooling rollers are the same.

[0021] According to the application, the plating vessel comprises a target material, an evaporation boat or a crucible.

[0022] According to the application, the non-plating area further comprises a second cooling roller, and the cooling temperatures of the second cooling rollers of the non-plating areas are the same.

[0023] According to the application, the temperature of the polymer substrate layer in the same group of the plating area and the non-plating area is the same.

[0024] According to the application, the film manufacturing device further comprises a turning roller, the polymer substrate layer is turned over by the turning roller, and the plating area at the rear end of the turning roller plates the other side of the polymer substrate layer.

[0025] According to the application, the beneficial effects are as follows:

[0026] The application realizes the firm combination of the metal layer and the polymer substrate layer by selecting the polymer material containing a coordination group, and adopting the magnetron sputtering or evaporation method to form the coordination bond between the metal material in the form of metal atom nanoparticles and the polymer material, thereby solving the problem that the metal on the flexible conductive film is easy to fall off.

[0027] Further, the application gradually reduces the temperature difference between the plating area and the non-plating area by gradually reducing the plating vessels of the plating areas in the film manufacturing process, so that the temperature difference experienced by the polymer material in the multiple plating processes is smaller and smaller, thereby reducing the influence of the temperature difference on the physical properties of the polymer material, and further ensuring the strength and elongation of the polymer material. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 FIG. 1 is a structural schematic diagram of the composite flexible conductive film of Example 1 in the application;

[0029] Figure 2 Structure diagram of the composite flexible conductive film of Example Three in the present application;

[0030] Figure 3 Structure diagram of the composite flexible conductive film of Example Five in the present application;

[0031] Figure 4 Structure diagram of the composite flexible conductive film of Example Six in the present application;

[0032] Figure 5 Flow chart of the method of the present application;

[0033] Figure 6 Structure diagram of the film manufacturing equipment of the present application.

[0034] In the drawings,

[0035] 1, polymer substrate layer; 101, first polymer material layer; 102, high-temperature resistant protective layer; 103, second polymer material layer; 2, metal layer; 3, flame-retardant layer; 4, conductive layer;

[0036] 5, unwinding area; 6, winding area; 7, plating area; 701, plating vessel; 702, first cooling roller; 8, non-plating area; 801, second cooling roller; 802, second passing roller; 9, turning roller;

[0037] 10, tension roller; 11, first passing roller. DETAILED DESCRIPTION

[0038] In order to better understand the purpose, technical solution and technical effect of the present application, the present application will be further explained in the following with reference to the drawings and examples. It should be noted that similar reference numerals and letters represent similar items in the following drawings, thus, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. Meanwhile, it is declared that the following described examples are only for explaining the present application, and not for limiting the present application.

[0039] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be a middle element, and when an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be a middle element.

[0040] The terms "first", "second" are only used for the purpose of convenient description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "several" is two or more, unless otherwise specifically limited. EXAMPLE

[0041] like Figure 1 As shown, a composite flexible conductive film includes a polymer substrate layer 1 located in the middle, which serves as a fixing and supporting element in the conductive film; metal layers 2 are provided on both sides of the polymer substrate layer 1. The polymer substrate layer 1 is made of a polymer material containing coordinating groups, which allows the metal layers 2 to firmly form a coordination structure with the polymer substrate layer 1, thus preventing them from detaching from the polymer substrate layer 1 and improving the bonding strength between the metal layers 2 and the polymer substrate layer 1.

[0042] In this embodiment, the metal layer 2 is copper or aluminum, and the polymer substrate layer 1 is a polyamide containing pyridine coordination groups. The pyridine coordination structure can provide nitrogen and oxygen atoms with coordination sites and spatial positions, so that copper or aluminum atoms can form atomic or ionic forces with nitrogen and oxygen atoms that are stronger than van der Waals forces. This makes the copper or aluminum layer bond more tightly to the polymer substrate layer 1, preventing the copper or aluminum layer from falling off the polymer substrate layer 1.

[0043] In this invention, the metal layer 2 is processed by magnetron sputtering or vapor deposition. Under magnetron sputtering or vapor deposition conditions, the material of the metal layer 2 can be deposited on the polymer material in the form of nano-atoms, forming coordinate bonds with the polymer material containing coordinating groups, thereby achieving a strong bonding effect.

[0044] In other alternative embodiments, the polymeric material may also be a polyterephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid, polydiphenylene dimethyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate, poly(p-phenylene terephthalate), polypropylene, polyoxymethylene, epoxy resin, phenolic resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose and its derivatives, starch and its derivatives, protein and its derivatives, polyvinyl alcohol and its crosslinks, or polyethylene glycol and its crosslinks, which contain pyridine coordinating groups.

[0045] In other alternative embodiments, the polymeric material may also be polyamide, polyterephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid, polydiphenylene dimethylformamide, acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate, poly(p-phenylene terephthalate), polypropylene, polyoxymethylene, epoxy resin, phenolic resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose and its derivatives, starch and its derivatives, protein and its derivatives, polyvinyl alcohol and its crosslinks, or polyethylene glycol and its crosslinks.

[0046] In other alternative embodiments, the high molecular material can also be a polyamide, a polyterephthalate, a polyimide, a polyethylene, a polypropylene, a polystyrene, a polyvinyl chloride, an aramid, a polyoxymethylene, an acrylonitrile-butadiene-styrene copolymer, a polybutylene terephthalate, a polyphenylene terephthalamide, a polyacetal, a polyoxymethylene, an epoxy resin, a phenolic resin, a polytetrafluoroethylene, a polyvinylidene fluoride, a silicone rubber, a polycarbonate, a cellulose and its derivatives, a starch and its derivatives, a protein and its derivatives, a polyvinyl alcohol and its cross-linked product, or a polyethylene glycol and its cross-linked product, which contains a pyrazole coordination group. Embodiment

[0047] As shown in Figure 5 , the present embodiment provides a preparation method for preparing the composite flexible conductive film described in Embodiment One. The method is as follows: a high molecular material containing a coordination group is selected to form a high molecular substrate layer 1, and then a metal material is magnetron sputtered or evaporated in a vacuum environment. The metal material is changed into metal nano-atoms under high energy and deposited on the high molecular material. At this time, the coordination group in the high molecular material and the metal nano-atoms are coordinated and combined, forming atomic force higher than van der Waals force, and thus the metal layer 2 is firmly attached to the high molecular substrate layer 1.

[0048] It can be seen that the method of the present embodiment needs to pay attention to two points. The first is that the high molecular material should contain a coordination group. The second is that the metal material is in the form of magnetron sputtering or evaporation, so that the metal material forms a coordination bond with the high molecular material in the form of atoms.

[0049] Based on the above method, when the film is plated several times in a vacuum environment, the number of plating vessels 701 used in the last plating is less than the number of plating vessels 701 used in the previous plating. Embodiment

[0050] As shown in Figure 2As shown, a composite flexible conductive film, same as embodiment one, its structure also includes a polymer substrate layer 1 and two metal layers 2 on both sides, the difference is that the polymer material layer is a composite structure, specifically, the polymer substrate layer 1 includes a first polymer material layer 101, a high-temperature resistant protective layer 102 and a second polymer material layer 103, and the high-temperature resistant protective layer 102 is arranged between the first polymer material layer 101 and the second polymer material layer 103. The polymer substrate layer 1 of this structure can further reduce the burning of the polymer material to form holes in the process of magnetron sputtering or evaporation. For example, when magnetron sputtering, high-temperature particles can burn through the first polymer material layer 101 or the second polymer material layer 103, but when the high-temperature particles reach the high-temperature resistant protective layer 102, since the high-temperature resistant protective layer 102 can resist high temperature, the high-temperature particles cannot burn through this layer, thus preventing the high-temperature particles from further burning through the other side of the polymer material layer, thereby preventing the high-temperature particles from burning through the entire polymer substrate layer 1. As above, the materials of the first polymer material layer 101 and the second polymer material layer 103 are both selected to contain coordination groups that can coordinate with metal atoms.

[0051] In this embodiment, the thermal conductivity of the high-temperature resistant protective layer 102 is greater than that of the first polymer material layer 101 and the second polymer material layer 103 on both sides. In this way, when the metal layer 2 is formed on the first polymer material layer 101 or the second polymer material layer 103, that is, when the metal layer 2 is formed in the plating film area 7, the heat can be transferred to the cooling roller in time, and at the same time, the cooling temperature of the cooling roller can also be quickly transferred to the first polymer material layer 101 or the second polymer material layer 103 being plated, thereby achieving the purpose of preventing the polymer material from being burned through; at the same time, it can further assist the polymer conductive film to cool down. Embodiment

[0052] This embodiment provides a preparation method for preparing the composite flexible conductive film described in embodiment three, which adds a preparation step of the polymer substrate layer 1 based on the method of embodiment two, including:

[0053] Step A, taking a polymer material to prepare a first polymer material layer 101;

[0054] The polymer material includes a polymer material containing a pyridine coordination group, an oxazole coordination group or a pyrazole coordination group, etc.

[0055] Step B, coating a high-temperature resistant material on the first polymer material layer 101 to form a high-temperature resistant protective layer 102;

[0056] By performing step B, the first polymer material layer 101 and the high-temperature resistant protective layer 102 are combined into a double-layer film composite structure.

[0057] Step C, take the polymer material, and compound the second polymer material layer 103 on the high-temperature-resistant protective layer 102.

[0058] Similarly, the polymer material of the second polymer material layer 103 is also a polymer material with a coordination structure. By performing Step C, the high-molecular substrate layer 1 is a film substrate with a sandwich structure, which includes the first polymer material layer 101, the high-temperature-resistant protective layer 102, and the second polymer material layer 103 in sequence. Embodiment

[0059] As shown in Figure 3 , a composite flexible conductive film, same as embodiment one, its structure also includes a high-molecular substrate layer 1 and two metal layers 2 on both sides, the difference is that the metal layer 2 is provided with a flame-retardant layer 3, the flame-retardant layer 3 includes a flame retardant, a first adhesive, and a first conductive agent. The flame retardant can prevent the conductive film from burning, the first adhesive can bond the flame retardant and the first conductive agent on the metal layer 2, and the first conductive agent can make the flame-retardant layer 3 conductive, reducing the interface resistance between the metal layer 2 and the flame-retardant layer 3.

[0060] Among them, the first adhesive is one of acrylic adhesive, polyurethane adhesive, epoxy adhesive, phenolic adhesive, silicone adhesive, rubber-based water-based adhesive, ethylene acetate adhesive, polyvinyl alcohol adhesive, and polyvinylidene fluoride; the first conductive agent is one of conductive carbon black, graphene, carbon nanotube, carbon fiber, and conductive carbon fiber composite material. Embodiment

[0061] As shown in Figure 4 , a composite flexible conductive film, same as embodiment one, its structure also includes a high-molecular substrate layer 1 and two metal layers 2 on both sides, the difference is that the metal layer 2 is provided with a conductive layer 4, the conductive layer 4 includes a second conductive agent and a second adhesive. The second adhesive is used to bond the conductive agent on the metal layer 2; the second conductive agent is used to reduce the interface resistance between the metal layer 2 and the high-molecular substrate layer 1.

[0062] Among them, the second adhesive is one of acrylic adhesive, polyurethane adhesive, epoxy adhesive, phenolic adhesive, silicone adhesive, rubber-based water-based adhesive, ethylene acetate adhesive, polyvinyl alcohol adhesive, and polyvinylidene fluoride; the second conductive agent is one of conductive carbon black, graphene, carbon nanotube, carbon fiber, and conductive carbon fiber composite material. Embodiment

[0063] As shown in Figure 6As shown, the embodiment provides a film preparation equipment for preparing the composite flexible conductive film of the above embodiment, which has a vacuum coating cavity, and a unwinding area 5 and a winding area 6 are arranged in the cavity, and a plurality of coating areas 7 and a plurality of non-coating areas 8 are alternately arranged between the winding area 6 and the unwinding area 5, that is, arranged in the following alternating manner: coating area 7, non-coating area 8, coating area 7, non-coating area 8, … The conventional coating method does not have a non-coating area, and continuously and once coats the polymer substrate layer on one side, and the evaporator continuously emits high heat to the polymer substrate layer, which is easy to burn the polymer material. The present application alternately inserts the non-coating area (without a coating vessel) into the coating area to disperse the coating and avoid the risk of holes.

[0064] The coating area 7 includes a coating vessel 701 and a first cooling roller 702. The coating vessel 701 can be a target material or an evaporation boat or a crucible, which is used for magnetron sputtering coating or evaporation coating of the polymer substrate layer 1. The first cooling roller 702 is used to cool the polymer substrate layer 1 in the coating area 7 to prevent the polymer substrate layer 1 from being burned due to high temperature. The non-coating area 8 includes a second passing roller 802, which assists the movement of the film. The non-coating area 8 does not have a coating vessel 701, and the temperature of this area is lower than that of the coating area.

[0065] Since the coating vessel 701 generates energy to form metal nanoparticles during work, the energy is relatively large, and the temperature generated is also very high. Therefore, the temperature of the coating area 7 is higher than that of the non-coating area 8. The polymer material is subjected to high temperature in the coating area 7 and low temperature in the non-coating area 8. After the film passes through the plurality of alternating coating areas 7 and non-coating areas 8, the polymer material will experience multiple cold and hot alternations. The high temperature of the coating area 7 of the existing equipment is consistent, and the low temperature of the non-coating area 8 is consistent, which causes the polymer material to continuously experience a large temperature difference during the entire coating process, resulting in a large decrease in the strength and elongation of the polymer material.

[0066] Based on this, the film preparation equipment of the embodiment defines each coating area 7 and the non-coating area 8 located behind it as a group, and the temperature difference between the coating area 7 and the non-coating area 8 of the next group is less than the temperature difference between the coating area 7 and the non-coating area 8 of the previous group. For example, the temperature difference T1 of the first coating area and the first non-coating area 8, and the temperature difference T2 of the second coating area and the second non-coating area 8, have the relationship: T2 < T1.

[0067] In order to achieve the effect that the temperature difference gradually decreases, the temperature of the coating area is gradually reduced, specifically, the number of the coating vessels 701 in the subsequent coating area is less than that of the previous coating area, and the cooling temperature of the first cooling roller 702 of the coating area is not changed, so that the temperature of the coating area gradually decreases from the front end to the rear end, and finally the temperature difference between the coating area and the non-coating area 8 gradually decreases. For example, the number of the evaporation boats in the first coating area is 50, the number of the evaporation boats in the second coating area is 45, and so on, and the number of the evaporation boats in the third coating area is 40. The cooling temperature of the first cooling roller 702 of the coating area is not changed. In this way, the temperature difference experienced by the polymer material gradually decreases, thereby reducing the influence of the temperature difference on the polymer material and ensuring the strength and elongation of the polymer material.

[0068] In the embodiment, although the non-coating area does not have coating vessels, the non-coating area still has heat radiation from the coating area and still has a relatively high temperature. Therefore, the non-coating area 8 also includes a second cooling roller 801, and the cooling temperatures of the second cooling rollers 801 of the non-coating areas 8 are the same. The second cooling roller 801 can further cool the film in the non-coating area 8.

[0069] The first temperature detection device can be arranged on the same side of the first cooling roller 702 of the coating area 7 to monitor the temperature V1 of the polymer substrate layer 1 in the coating area 7, and the second temperature detection device can be arranged on the same side of the second cooling roller 801 of the non-coating area 8 to monitor the temperature V2 of the polymer substrate layer 1 in the non-coating area 8. The flow and temperature of the cooling liquid in the first cooling roller 702 and the second cooling roller 801 are adjusted by the controller to make temperature V2 = temperature V1, that is, the temperature of the polymer material in the same group of the coating area 7 and the non-coating area 8 is consistent. It can be seen that although the ambient temperature of the coating area 7 and the ambient temperature of the non-coating area 8 have a large temperature difference, the temperature difference of the polymer material changes little by adjusting the temperature of the two cooling rollers.

[0070] In the embodiment, the film forming device also includes a turning roller 9, the polymer substrate layer 1 is turned over by the turning roller 9, and the coating area 7 located at the rear end of the turning roller 9 coats the other side of the polymer substrate layer 1. For example, before turning, the coating area 7 coats the A side of the polymer substrate layer 1, and after turning, the coating area 7 coats the B side of the polymer substrate layer 1. The film forming device also has a tension roller 10 for flattening the film and a plurality of first passing rollers 11 for assisting the stable movement of the film.

[0071] The technical features of the above embodiments can be combined in any manner. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0072] The above embodiments only express several implementation manners of the present application, which are described in a more specific and detailed manner, but cannot be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A composite flexible conductive film comprising a polymer substrate layer in the middle and metal layers on both sides, characterized in that, The material of the polymer substrate layer is a polymer material containing a coordination group, and the metal layer is bonded to the polymer substrate layer by magnetron sputtering or evaporation in a manner of forming a coordination bond; The polymer substrate layer comprises a first polymer material layer, a high-temperature-resistant protective layer, and a second polymer material layer, and the high-temperature-resistant protective layer is arranged between the first polymer material layer and the second polymer material layer; The thermal conductivity of the high-temperature-resistant protective layer is greater than that of the first polymer material layer and the second polymer material layer on both sides. The preparation method of the composite flexible conductive film comprises the following steps: selecting a polymer material containing a coordination group to prepare a polymer substrate layer; in a vacuum environment, using magnetron sputtering or evaporation, a metal material is combined with the coordination group of the polymer material in the form of metal nanometer atoms, and then a metal layer is deposited on the surface of the polymer substrate layer. The preparation steps of the polymer substrate layer comprise: Step A: preparing a first polymer material layer from a polymer material containing a coordination group; Step B: coating a high-temperature-resistant material on the first polymer material layer to form a high-temperature-resistant protective layer; Step C: taking a polymer material and compounding a second polymer material layer on the high-temperature-resistant protective layer; The plating process has a plurality of plating areas and non-plating areas arranged alternately, and when a plurality of plating is carried out in a vacuum environment, the number of plating vessels used in the last plating is less than the number of plating vessels used in the previous plating, so that the temperature difference between the last group of plating areas and non-plating areas is less than the temperature difference between the previous group of plating areas and non-plating areas.

2. The composite flexible conductive film of claim 1, wherein The polymer material is polyamide, polyterephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid, polyoxymethylene, acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate, poly-p-phenyleneterephthalamide, polypropylene, polyoxymethylene, epoxy resin, phenolic resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose and its derivatives, starch and its derivatives, protein and its derivatives, polyvinyl alcohol and its cross-linked product, or polyethylene glycol and its cross-linked product, which contain pyridine coordination groups, oxazole coordination groups or pyrazole coordination groups.

3. The composite flexible conductive film of claim 1, wherein The metal layer is provided with a flame-retardant layer, and the flame-retardant layer comprises a flame retardant, a first binder and a first conductive agent.

4. The composite flexible conductive film of claim 1, wherein The metal layer is provided with a conductive layer, and the conductive layer comprises a second conductive agent and a second binder.

5. An apparatus for manufacturing a composite flexible conductive film according to any one of claims 1 to 4, comprising an unwinding section and a winding section, wherein A plurality of plating areas and a plurality of non-plating areas are arranged alternately between the winding area and the unwinding area, the plating area comprises a plating vessel and a first cooling roller, and the non-plating area comprises a second cooling roller; each plating area and the non-plating area located after it form a group, and the temperature difference between the last group of plating areas and non-plating areas is less than the temperature difference between the previous group of plating areas and non-plating areas.

6. The film production apparatus according to claim 5, wherein The number of plating vessels in the last plating area is less than the number of plating vessels in the previous plating area; and the cooling temperatures of the plurality of first cooling rollers are the same.

7. The film production apparatus according to claim 5, wherein The temperature of the polymer substrate layer in the same group of plating areas and non-plating areas is the same.

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