Wavelength conversion device and method of manufacturing the same

Abstract

A wavelength conversion device includes a main body, a weight element, and a colloid. The main body has a first surface, a second surface, a plurality of through holes, and a recess. The recess is located at a central axis of the wavelength conversion device and is recessed into the main body relative to the first surface, and the recess has a stop surface surrounding the central axis. The through holes are arranged in the recess and penetrate from the first surface to the second surface. The stop surface is adjacent to the first surface and the through holes and has a plurality of sections, which are partial inner walls of the through holes, respectively. The weight element is arranged in the recess and is supported by the stop surface and at least one of the sections. A projection of the through hole corresponding to at least one of the sections on the second surface in a direction parallel to the central axis at least partially overlaps a projection of the weight element on the second surface in the direction parallel to the central axis. The colloid at least partially covers the weight element. The wavelength conversion device and the manufacturing method thereof can stably arrange the weight element in the main body.

Description

Technical Field

[0001] This invention relates to an optical device and a method for manufacturing the same, and more particularly to a wavelength conversion device and a method for manufacturing the same. Background Technology

[0002] In recent years, projection devices primarily using solid-state light sources such as light-emitting diodes (LEDs) and laser diodes have gradually gained a foothold in the market. Since laser diodes have approximately 20% higher luminous efficiency than LEDs, to overcome the limitations of LED light sources, laser light sources have been developed to excite phosphors and generate the pure color light source required by projectors. Furthermore, laser projection devices use the laser beam provided by laser diodes to excite phosphors to emit light, serving as the projector's illumination source to meet the needs of projectors with various brightness levels. Therefore, projector architectures using laser light source devices as the light source system have replaced traditional high-pressure mercury lamps and become the mainstream light source for projectors.

[0003] In current laser projectors, a phosphor wheel is typically formed by coating a phosphor layer onto a highly reflective metal substrate. The phosphor layer on the metal substrate of the phosphor wheel is then excited by a laser beam emitted from a laser light source device to produce beams of different colors (such as green and yellow light). Alternatively, laser beams (such as blue light) can be allowed to pass directly through the phosphor wheel by creating cutouts in the metal substrate or by placing a light-transmitting plate on the metal substrate, thereby producing various colors of light.

[0004] To ensure smooth rotation of the phosphor wheel, a counterweight can be mounted on it. The counterweight can be fixed to the phosphor wheel by gluing, using a UV-curable adhesive, which has a short curing time and good production efficiency. However, when UV-curing the adhesive, structural factors such as the counterweight obstructing the light can reduce the UV light's penetration and / or irradiation range, leading to incomplete curing and making it difficult to securely fix the counterweight to the phosphor wheel.

[0005] The "Background Art" paragraph is only used to help understand the content of this invention. Therefore, the content disclosed in the "Background Art" paragraph may include some prior art that is not known to those skilled in the art. The content disclosed in the "Background Art" paragraph does not mean that the content or the problem to be solved by one or more embodiments of this invention was known or recognized by those skilled in the art before this application was filed. Summary of the Invention

[0006] The present invention provides a wavelength conversion device and a method for manufacturing the same, which enables a counterweight element to be stably mounted on the main body of the wavelength conversion device.

[0007] Other objects and advantages of the present invention can be further understood from the technical features disclosed herein.

[0008] To achieve one or more of the above-mentioned objectives, or other objectives, an embodiment of the present invention provides a wavelength conversion device. The wavelength conversion device is used to rotate about a central axis and includes a main body, at least one counterweight element, and at least one colloid.

[0009] The main body has a first surface, a second surface, a plurality of through holes, and a recess. The first surface is opposite to the second surface. The recesses are located on a central axis and recessed into the main body relative to the first surface, and the recesses have a stop surface surrounding the central axis. The through holes are spaced apart from each other in the recesses and extend from the first surface to the second surface in a direction parallel to the central axis. The stop surface is adjacent to the first surface and the through holes, and the stop surface has a plurality of segments, which are partial inner walls of the through holes. A counterweight element is disposed in the recess, the counterweight element rests against the stop surface and is positioned by at least one of the segments of the stop surface, and the orthographic projection of the through hole corresponding to at least one of these segments on the second surface in a direction parallel to the central axis at least partially overlaps with the orthographic projection of the counterweight element on the second surface in a direction parallel to the central axis. An adhesive at least partially covers the counterweight element to bond the counterweight element to the main body.

[0010] A method of manufacturing a wavelength conversion device includes the following steps: Providing a substrate having a central axis and opposing first and second surfaces. Forming a plurality of through holes and recesses in the substrate, wherein the recesses are located on the central axis and recessed into the substrate relative to the first surface, the recesses having a stop surface surrounding the central axis, the through holes being spaced apart from each other in the recesses and extending from the first surface to the second surface in a direction parallel to the central axis, the stop surface abutting the first surface and the through holes, and the stop surface having a plurality of segments, each segment being a partial inner wall of the through holes. Distributing at least one counterweight element in the recess such that the at least one counterweight element rests against the stop surface and is positioned by at least one of the segments of the stop surface, and the orthographic projection of the through hole corresponding to at least one of these segments on the second surface in a direction parallel to the central axis at least partially overlaps the orthographic projection of the at least one counterweight element on the second surface in a direction parallel to the central axis. Coating at least one colloid onto the at least one counterweight element. At least one colloid is photocured toward the first surface and photocured toward the second surface through a through-hole corresponding to at least one of these sections.

[0011] Based on the above, the embodiments of the present invention have at least one of the following advantages or effects. The main body of the wavelength conversion device is formed with a through hole and a recess, and the counterweight element is supported and positioned on the stop surface of the recess and overlaps the through hole. Therefore, when the colloid covering the counterweight element is photocured, UV light can irradiate the colloid not only towards the first surface but also through the through hole towards the second surface, thereby improving the efficiency and integrity of photocuring. Thus, the counterweight element can be securely fixed to the main body of the wavelength conversion device by the colloid.

[0012] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a projector according to an embodiment of the present invention.

[0014] Figure 2 yes Figure 1 A three-dimensional diagram of the wavelength conversion device.

[0015] Figure 3 yes Figure 2 A stereoscopic view of the wavelength conversion device from another perspective.

[0016] Figure 4 yes Figure 2 Front view of the wavelength conversion device.

[0017] Figure 5 yes Figure 4 A partial enlarged view of the wavelength conversion device.

[0018] Figure 6 yes Figure 5 A three-dimensional diagram of the wavelength conversion device.

[0019] Figure 7 yes Figure 6 A cross-sectional view of the wavelength conversion device along line II.

[0020] Figure 8 yes Figure 6 A magnified view of a portion of the substrate.

[0021] Figure 9 This is a partial perspective view of a wavelength conversion device according to another embodiment of the present invention.

[0022] Figure 10 yes Figure 9 A cross-sectional view of the wavelength conversion device along line II-II.

[0023] Figure 11 This is a partial front view of a wavelength conversion device according to another embodiment of the present invention.

[0024] Figure 12 yes Figure 11 A cross-sectional view of the wavelength conversion device along line III-III.

[0025] Figure 13 This is an exploded view of a wavelength conversion device according to another embodiment of the present invention.

[0026] Figure 14 This is a flowchart of a method for manufacturing a wavelength conversion device according to an embodiment of the present invention.

[0027] Figures 15A to 15H schematic drawing Figure 14 The specific steps of the manufacturing method.

[0028] Figures 16A to 16D , Figures 17A to 17C and Figures 18A to 18D The specific steps of a method for manufacturing a wavelength conversion device according to another embodiment of the present invention are illustrated schematically. Detailed Implementation

[0029] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present invention.

[0030] Figure 1 This is a schematic diagram of a projector according to an embodiment of the present invention. Please refer to it. Figure 1The projector 10 of this embodiment includes a light source 12, a wavelength conversion device 100, a light valve 14, and a projection lens 16. The light source 12 is, for example, a device including a laser light-emitting element and adapted to provide a laser beam L0. The wavelength conversion device 100 is, for example, a phosphor wheel and is configured with a wavelength conversion region and a non-wavelength conversion region, so that the wavelength conversion region and the non-wavelength conversion region alternately enter the transmission path of the laser beam L0 from the light source 12. When the wavelength conversion region is located on the transmission path of the laser beam L0, it can convert the wavelength of the laser beam L0 and generate a converted beam with different wavelengths. When the non-wavelength conversion region is located on the transmission path of the laser beam L0, the laser beam L0 can penetrate the non-wavelength conversion region or be reflected by the non-wavelength conversion region. At least one of the laser beam L0 and the converted beam leaving the wavelength conversion device 100 forms an illumination beam L1. The light valve 14 is adapted to convert the illumination beam L1 from the wavelength conversion device 100 into an image beam L2, and the projection lens 16 is adapted to project the image beam L2 out of the projector 10. In other embodiments, the wavelength conversion device 100 may be configured with only a wavelength conversion region and without a non-wavelength conversion region, the wavelength conversion region forming a complete ring around the central axis A of the substrate 1101.

[0031] Figure 2 yes Figure 1 A three-dimensional diagram of the wavelength conversion device. Figure 3 yes Figure 2 A perspective view of the wavelength conversion device from another angle. Please refer to... Figure 2 and Figure 3 The wavelength conversion device 100 of this embodiment includes a main body 110 and a driving unit 120. The main body 110 has a first surface 110a, a second surface 110b, a plurality of through holes 110c, and a recess 110d. The main body 110 includes a substrate 1101 and a wavelength conversion region and a non-wavelength conversion region (not labeled) disposed on the substrate 1101. The wavelength conversion region and the non-wavelength conversion region together form a complete ring and surround the central axis A of the substrate 1101. The wavelength conversion region includes at least one wavelength conversion layer (shown as a plurality of wavelength conversion layers 1102, 1103, 1104), and the non-wavelength conversion region includes a reflective layer 1105 or an opening (not shown). In this embodiment, the non-wavelength conversion region is a reflective layer 1105 disposed on the substrate 1101, or glass is disposed in the opening of the substrate 1101, and the reflective layer 1105 is disposed on the glass. In this embodiment, the substrate 1101 may be made of aluminum or other suitable materials, and the first surface 110a and the second surface 110b are two opposite surfaces of the substrate 1101. Figure 1 , Figure 2As shown, the first surface 110a of the substrate 1101 is, for example, the surface facing the light source 10. Wavelength conversion layers 1102, 1103, 1104 and reflective layer 1105 are disposed on the first surface 110a of the substrate 1101. The driving unit 120 is, for example, a motor and is disposed on the second surface 110b of the main body 110. It is used to drive the substrate 1101 to rotate about the central axis A, so that the wavelength conversion layers 1102, 1103, 1104 and reflective layer 1105 are sequentially moved around the central axis A. Figure 1 Along the transmission path of the laser beam L0 shown, wavelength conversion layers 1102, 1103, and 1104 can convert the wavelength of the laser beam L0, and reflective layer 1105 can reflect the laser beam L0. In other embodiments, the non-wavelength conversion area is, for example, an opening in the substrate 1101, or a transparent glass can be disposed in the opening. When the substrate 1101 of the wavelength conversion device 100 rotates about the central axis A, the laser beam L0 will penetrate the non-wavelength conversion area (the opening or the transparent glass disposed in the opening).

[0032] Figure 4 yes Figure 2 Front view of the wavelength conversion device. Figure 5 yes Figure 4 A partial enlarged view of the wavelength conversion device. Figure 6 yes Figure 5 A three-dimensional diagram of the wavelength conversion device. Please refer to... Figure 2 and Figures 4 to 6 The wavelength conversion device 100 of this embodiment further includes at least one counterweight element 130 (shown as one) and at least one colloid 140 (shown as one). The at least one counterweight element 130 may be made of copper or stainless steel, or may be made of other high-density materials. The substrate 1101 has a plurality of through holes 110c and recesses 110d. The recesses 110d are located on the central axis A and are recessed into the substrate 1101 of the body 110 relative to the first surface 110a. Wavelength conversion layers 1102, 1103, 1104 and reflective layer 1105 surround the recesses 110d, and the recesses 110d have a stop surface BS surrounding the central axis A. The through holes 110c are spaced apart from each other in the recesses 110d and extend from the first surface 110a to the second surface 110b (marked as...) of the substrate 1101 in a direction parallel to the central axis A. Figure 3 ).

[0033] The stop surface BS is adjacent to the first surface 110a and the through hole 110c and is inclined or perpendicular to the first surface 110a. The stop surface BS has a plurality of segments S4, which are partial inner walls of the through holes 110c. The counterweight element 130 is disposed in the recess 110d and rests against the stop surface BS and is positioned by at least one of the segments S4 of the stop surface BS. In this embodiment, the counterweight element 130 is positioned in a segment S4 of the stop surface BS (i.e., a partial inner wall of a through hole 110c). The orthographic projection of the through hole 110c corresponding to this segment S4 on the second surface 110b in the direction parallel to the central axis A at least partially overlaps with the orthographic projection of the counterweight element 130 on the second surface 110b in the direction parallel to the central axis A. The colloid 140 is, for example, a photocurable adhesive, which at least partially covers the counterweight element 130 to bond the counterweight element 130 to the body 110. In other embodiments, colloid 140 may be a thermosetting adhesive, a room-temperature curing adhesive, or other types of adhesive.

[0034] As described above, the main body 110 of the wavelength conversion device 100 is formed with a through hole 110c and a recess 110d. The counterweight element 130 rests against and is positioned on the stop surface BS of the recess 110d and overlaps the through hole 110c. Therefore, when the colloid 140 covering the counterweight element 130 is photocured, the UV light can irradiate the colloid 140 not only towards the first surface 110a of the substrate 1101, but also through the through hole 110c towards the second surface 110b, thereby improving the efficiency and integrity of the photocuring of the colloid 140. Thus, the counterweight element 130 can be securely fixed to the main body 110 of the wavelength conversion device 100 by the colloid 140.

[0035] Furthermore, in this embodiment, the counterweight element 130 is located radially between the stop surface BS and the central axis A on the substrate 1101. Therefore, when the substrate 1101 rotates about the central axis A, the centrifugal force generated by the counterweight element 130 is directed from the central axis A towards the stop surface BS. This allows the stop surface BS to act as a stop for the counterweight element 130, preventing the centrifugal force from causing the counterweight element 130 to separate from the substrate 1101.

[0036] Figure 7 yes Figure 6 A cross-sectional view of the wavelength conversion device along line II. Figure 8 yes Figure 6 A magnified view of a portion of the substrate. Please refer to... Figures 6 to 8In this embodiment, the first surface 110a includes a first stepped surface S1 and a second stepped surface S2. The first stepped surface S1 is, for example, the bottom surface of the recess 110d. The stop surface BS connects the first stepped surface S1 and the second stepped surface S2, thus forming a stepped structure between the first surface 110a and the stop surface BS. Furthermore, the stop surface BS in this embodiment includes a plurality of staggered first arc surfaces S3 and a plurality of second arc surfaces. These second arc surfaces are the aforementioned plurality of segments S4 of the stop surface BS, i.e., the partial inner walls (inner walls facing the central axis A) of the through holes 110c. The radius of curvature of each of these second arc surfaces (segments S4) is smaller than the radius of curvature of each of these first arc surfaces S3. The counterweight element 130 is disposed on the first stepped surface S1 and rests against at least one of these second arc surfaces (segments S4). Specifically, in this embodiment, the counterweight element 130 is conical. The diameter of the conical counterweight element 130 in the radial direction of the substrate gradually increases from the second surface 110b to the first surface 110a, and can be... Figure 7 As shown, the conical counterweight element 130 extends partially into the through hole 110c and is positioned in the through hole 110c, and abuts against the second arc surface (section S4) of the through hole 110c.

[0037] In this embodiment, the number of through holes 110c exceeds the number of counterweights 130. Therefore, counterweights 130 and colloids 140 are not disposed at some of the through holes 110c. That is, the counterweights 130 and colloids 140 only cover a portion of these through holes 110c, leaving the remaining through holes 110c uncovered. Consequently, the airflow generated when the substrate 1101 rotates can flow through the uncovered through holes 110c, thereby improving the heat dissipation efficiency of the substrate 1101. Furthermore, the substrate 1101 may also have multiple heat dissipation structures 110e to increase the heat dissipation area and generate turbulence, thereby further improving the heat dissipation efficiency of the substrate 1101. In this embodiment, the heat dissipation structures 110e are spaced apart from each other and surround the central axis A of the substrate 1101, and are located radially between the wavelength conversion layers 1102, 1103, 1104 and the through holes 110c. These heat dissipation structures 110e are, for example, structures that protrude or recede relative to the first surface 110a of the substrate 1101. By means of the above-described heat dissipation design of this embodiment, for example, the heat dissipation efficiency can be improved by about 10%, the temperature of the wavelength conversion device 100 can be reduced by about 10 to 20 degrees Celsius, and the wavelength conversion efficiency can be improved by about 5 to 8%.

[0038] Figure 9 This is a partial perspective view of a wavelength conversion device according to another embodiment of the present invention. Figure 10 yes Figure 9 A cross-sectional view of the wavelength conversion device along line II-II. Figure 9 and Figure 10The main difference between the illustrated embodiment and the foregoing embodiment is that, Figure 9 and Figure 10 The counterweight element 130A shown is spherical, not like... Figure 6 and Figure 7 The conical and spherical counterweight element 130A shown partially extends into and is positioned in the through hole 110c, and abuts against the second arc surface (section S4) of the through hole 110c.

[0039] Figure 11 This is a partial front view of a wavelength conversion device according to another embodiment of the present invention. Figure 12 yes Figure 11 A cross-sectional view of the wavelength conversion device along line III-III. Figure 11 and Figure 12 The main difference between the illustrated embodiment and the foregoing embodiment is that, Figure 11 and Figure 12 The counterweight element 130B shown is plate-shaped, not like... Figure 6 and Figure 7 The conical or Figure 9 and Figure 10 The spherical, sheet-like counterweight element 130B includes a side surface LS with two edges E at both ends. The sheet-like counterweight element 130B rests against two second arc surfaces (segments S4) with its two edges E on its side surface LS, and also rests against the junction of two first arc surfaces S3 and adjacent second arc surfaces (segments S4) with its side surface LS.

[0040] Figure 13 This is an exploded view of a wavelength conversion device according to another embodiment of the present invention. Figure 13 The main difference between the illustrated embodiment and the foregoing embodiment is that, Figure 13 The main body 110' shown includes a base plate 1101' and a counterweight plate 1106. The first surface 110a and the second surface 110b of the main body 110' are two opposing surfaces of the counterweight plate 1106, as shown below. Figure 1 , Figure 13As shown, the first surface 110a of the counterweight plate 1106 is, for example, the surface facing the light source 10. The counterweight plate 1106 is disposed on the substrate 1101' and located on the central axis A. The wavelength conversion layers 1102-1104 and the reflective layer 1105 are disposed on the substrate 1101' and located on the same side of the substrate 1101' as the counterweight plate 1106 and surround the counterweight plate 1106. The counterweight plate 1106 is fixed to the substrate 1101' by means of adhesive 150, or by other suitable means, for example, and the present invention does not limit this. The through hole 110c and the recess 110d of the body 110' are formed on the counterweight plate 1106, and their arrangement and function are the same as or similar to those in the foregoing embodiments, and will not be described again here. Furthermore, the substrate 1101' of this embodiment has a plurality of openings H, which are spaced apart from each other and surround the central axis A. Through-holes 110c correspond one-to-one with these openings H, and the orthographic projections of these through-holes 110c on the second surface 110b in a direction parallel to the central axis A at least partially overlap with the orthographic projections of these openings H on the second surface 110b in the same direction. Therefore, the airflow generated when the substrate 1101 rotates can flow through the openings H and through the corresponding unshielded through-holes 110c, thereby improving the heat dissipation efficiency of the substrate 1101'.

[0041] The following describes a method for manufacturing a wavelength conversion device according to an embodiment of the present invention.

[0042] Figure 14 This is a flowchart of a method for manufacturing a wavelength conversion device according to an embodiment of the present invention. Figures 15A to 15H schematic drawing Figure 14 Please refer to the specific steps of the manufacturing method. Figure 14 and Figures 15A to 15H First, such as Figure 15A The substrate BM is provided (step S601), having a central axis A and opposing first surface 110a and second surface 110b. Next, as shown... Figures 15B to 15D As shown, a plurality of through holes 110c and recesses 110d are formed in the substrate BM (step S602), wherein the recesses 110d are located on the central axis A and are recessed into the substrate BM relative to the first surface 110a. Furthermore, as in the aforementioned embodiments... Figures 6 to 8 As shown, the recess 110d formed in step S602 has a stop surface BS around the central axis A. The through holes 110c are spaced apart from each other in the recess 110d and extend from the first surface 110a of the substrate BM to the second surface 110b in a direction parallel to the central axis A. The stop surface BS is adjacent to the first surface 110a and the through holes 110c, and the stop surface BS has a plurality of segments S4, which are local inner walls of the through holes 110c.

[0043] In detail, in step S602 above, first as Figure 15B As shown, the substrate BM is stamped along the direction from the second surface 110b toward the first surface 110a to form a boss structure P1 on the substrate BM. Then, as... Figure 15C These through holes 110c are formed in the boss structure P1 along a direction parallel to the central axis A, as shown. Figure 15D The boss structure P1 is stamped along the direction from the first surface 110a to the second surface 110b, forming a recess 110d in the central region of the boss structure P1 and an annular protrusion P2 around the periphery of the boss structure P1. The side surface of the recess 110d forms a stop surface BS, the bottom surface of the recess 110d is a first step surface S1, the top surface of the annular protrusion P2 is a second step surface S2, and the stop surface BS connects the first step surface S1 and the second step surface S2. The through holes 110c are located at the junction of the first step surface S1 and the stop surface BS. The first surface 110a and the stop surface BS form a stepped structure. The stop surface BS and the first surface 110a are, for example, perpendicular to each other, or the stop surface BS is relatively inclined to the first surface 110a; this invention is not limited to this. Furthermore, as in the foregoing embodiments... Figures 6 to 8 As shown, the stop surface BS formed in step S602 includes a plurality of staggered first arc surfaces S3 and a plurality of second arc surfaces (segments S4), wherein the radius of curvature of each of the second arc surfaces (segments S4) is smaller than the radius of curvature of each of the first arc surfaces S3. Thus, the substrate BM constitutes the substrate of the wavelength conversion device 100 of the aforementioned embodiment (e.g., Figure 2 The substrate 1101 shown. Furthermore, after completing step S602, as... Figure 15E The wavelength conversion layer shown is... Figure 15E A wavelength conversion layer (labeled as wavelength conversion layer 1102) is disposed on substrate 1101 such that the wavelength conversion layer surrounds at least a portion of the outer side of recess 110d.

[0044] After completing the fabrication of substrate 1101 and the configuration of the wavelength conversion layer, as follows: Figure 15F The counterweight element 130 is positioned in the recess 110d (step S603), so that the counterweight element 130 rests against the second arc surface (segment S4) of the stop surface BS and is positioned by the second arc surface (segment S4) of the stop surface BS. The projection of the through hole 110c corresponding to segment S4 onto the second surface 110b in a direction parallel to the central axis A at least partially overlaps with the projection of the counterweight element 130 onto the second surface 110b in a direction parallel to the central axis A. Next, as... Figure 15G The image shows the application of a colloid 140, for example a light-curing colloid, to the counterweight element 130 (step S604). Figure 15HThe colloid 140 is photocured by UV light L3 from a UV light source (unlabeled) toward the first surface 110a, while UV light L3 from another UV light source (unlabeled) passes through the through holes 110c corresponding to section S4 and photocures the colloid 140 toward the second surface 110b (step S605). In steps S603 to S605, the number of through holes 110c is greater than the number of counterweights 130. Therefore, counterweights 130 and colloid 140 are not placed at many of the through holes 110c. That is, the counterweights 130 and colloid 140 only cover a portion of the through holes 110c; the remaining through holes 110c are not covered by the counterweights 130 and colloid 140. In other embodiments, in step S605, UV light L3 directed toward the first surface 110a and UV light L3 directed toward the second surface 110b can be photocured simultaneously or at different times by the colloid 140.

[0045] The following describes another method for manufacturing the wavelength conversion device according to an embodiment of the present invention.

[0046] Figures 16A to 16D , Figures 17A to 17C and Figures 18A to 18D The specific steps of a method for manufacturing a wavelength conversion device according to another embodiment of the present invention are illustrated schematically. First, as... Figure 16A A substrate BM' is provided, having a central axis A and opposing first surfaces 110a and second surfaces 110b. Next, as shown... Figure 16B As shown, the substrate BM' is stamped along the direction from the second surface 110b toward the first surface 110a to form a boss structure P1' on the substrate BM'. Then, as... Figure 16C As shown, multiple through holes 110c are formed in the boss structure P1' along a direction parallel to the central axis A. For example... Figure 16D The boss structure P1' shown is stamped along the direction from the first surface 110a to the second surface 110b, so that a recess 110d is formed in the central region of the boss structure P1' and an annular protrusion P2' is formed around the periphery of the boss structure P1'. The specific structure of the recess 110d and the through hole 110c formed here is the same as or similar to that of... Figure 14 The process formed in step S602 will not be described again here. Thus, the substrate BM' constitutes the counterweight plate 1106 of the wavelength conversion device of the aforementioned embodiment.

[0047] On the other hand, such as Figure 17A The substrate 1101' is shown, and as shown... Figure 17B As shown, multiple openings H are formed on substrate 1101'. Next, as... Figure 17C As shown, a wavelength conversion layer (labeled wavelength conversion layer 1102) is disposed on substrate 1101'. Then, as... Figure 18A As shown Figure 16DThe counterweight plate 1106 is disposed on the substrate 1101', with the counterweight plate 1106 positioned on the central axis A, and the wavelength conversion layer (designated as wavelength conversion layer 1102) surrounding at least a portion of the outside of the recess 110d. Furthermore, the through holes 110c are arranged in a one-to-one correspondence with the openings H, and the orthographic projections of the through holes 110c onto the second surface 110b in the direction parallel to the central axis A at least partially overlap with the orthographic projections of the openings H onto the second surface 110b in the same direction.

[0048] like Figure 18B The counterweight element 130 is positioned in the recess 110d, such that it rests against and is positioned by the second arc surface (segment S4) of the stop surface BS. The projection of the through hole 110c corresponding to segment S4 onto the second surface 110b in a direction parallel to the central axis A at least partially overlaps with the projection of the counterweight element 130 onto the second surface 110b in the same direction. Next, as shown... Figure 18C The image shows a colloid 140, for example a light-curing colloid, covering a counterweight element 130. For example... Figure 18D The colloid 140 is photocured by UV light L3 from a UV light source (unlabeled) toward the first surface 110a, while UV light L3 from another UV light source (unlabeled) passes through the through hole 110c corresponding to section S4 to photocur the colloid 140 toward the second surface 110b.

[0049] In summary, the embodiments of the present invention have at least one of the following advantages or effects. The main body of the wavelength conversion device is formed with a through-hole and a recess, and the counterweight element rests against and is positioned on the stop surface of the recess and overlaps the through-hole. Therefore, when the colloid covering the counterweight element is photocured, UV light can irradiate the colloid not only towards the first surface but also simultaneously towards the second surface through the through-hole, thereby improving the efficiency and integrity of photocuring. Thus, the counterweight element can be securely fixed to the main body of the wavelength conversion device by the colloid. Furthermore, the centrifugal force generated on the counterweight element when the substrate rotates is directed from the central axis towards the stop surface, thereby preventing the centrifugal force from separating the counterweight element from the substrate by the stop surface's stop on the counterweight element. Additionally, the airflow generated when the substrate rotates can flow through the unshielded through-hole, thereby improving the substrate's heat dissipation efficiency.

[0050] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All simple equivalent variations and modifications made according to the claims and description of the invention are still within the scope of this invention. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the invention. In addition, the abstract and title are merely for assisting in patent document searches and are not intended to limit the scope of the invention. Moreover, the terms "first," "second," etc., used in this specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not intended to limit the upper or lower limit of the number of elements.

[0051] Explanation of reference numerals in the attached figures

[0052] 10: Projector

[0053] 12: Light source

[0054] 14: Light valve

[0055] 16: Projection lens

[0056] 100: Wavelength conversion device

[0057] 110, 110': Main body

[0058] 110a: First surface

[0059] 110b: Second surface

[0060] 110c: Through hole

[0061] 110d: concave part

[0062] 110e: Heat dissipation structure

[0063] 1101, 1101': substrate

[0064] 1102, 1103, 1104: Wavelength conversion layer

[0065] 1105: Reflective layer

[0066] 1106: Counterweight plate

[0067] 120: Drive Unit

[0068] 130, 130A, 130B: Counterweight components

[0069] 140: Colloid

[0070] 150: Adhesive

[0071] A: Central axis

[0072] BM, BM': Substrate

[0073] BS: Stop surface

[0074] E: Edge

[0075] H: Opening

[0076] L0: Laser beam

[0077] L1: illumination beam

[0078] L2: Image Beam

[0079] L3: UV light

[0080] LS: Side view

[0081] P1, P1': Boss structure

[0082] P2, P2': Annular protrusions

[0083] S1: First segment difference plane

[0084] S2: Second segment difference surface

[0085] S3: First arc surface

[0086] S4: Section

Claims

1. A wavelength conversion device for rotating about a central axis, characterized in that, include: The main body, at least one counterweight element, and at least one colloid; in The main body has a first surface, a second surface, a plurality of through holes and a recess, the first surface being opposite to the second surface, the recess being located on the central axis and recessed into the main body relative to the first surface, the recess having a stop surface surrounding the central axis, the plurality of through holes being spaced apart from each other in the recess and penetrating from the first surface to the second surface in a direction parallel to the central axis, the stop surface being adjacent to the first surface and the plurality of through holes, and the stop surface having a plurality of segments, the plurality of segments being partial inner walls of the plurality of through holes; The at least one counterweight element is disposed in the recess, wherein the at least one counterweight element rests against the stop surface and is positioned by at least one of the plurality of segments of the stop surface, and the orthographic projection of the through hole corresponding to at least one of the plurality of segments on the second surface in the direction parallel to the central axis at least partially overlaps with the orthographic projection of the at least one counterweight element on the second surface in the direction parallel to the central axis. as well as The at least one colloid at least partially covers the at least one counterweight element and glues the at least one counterweight element to the body.

2. The wavelength conversion device according to claim 1, characterized in that, The main body includes a substrate and at least one wavelength conversion layer disposed on the substrate and surrounding the recess, the substrate being configured to rotate about the central axis to move the at least one wavelength conversion layer about the central axis.

3. The wavelength conversion device according to claim 2, characterized in that, The at least one counterweight element is located radially on the substrate between the stop surface and the central axis.

4. The wavelength conversion device according to claim 2, characterized in that, The first surface, the second surface, the plurality of through holes, and the recess are formed on the substrate.

5. The wavelength conversion device according to claim 2, characterized in that, The main body further includes a counterweight plate disposed on the substrate and located on the central axis. The first surface, the second surface, the plurality of through holes and the recess are formed on the counterweight plate. The substrate has a plurality of openings. The plurality of through holes correspond one-to-one with the plurality of openings. The orthographic projection of the plurality of through holes on the second surface in the direction parallel to the central axis at least partially overlaps with the orthographic projection of the plurality of openings on the second surface in the direction parallel to the central axis.

6. The wavelength conversion device according to claim 1, characterized in that, The first surface includes a first stepped surface and a second stepped surface, and the stop surface is connected between the first stepped surface and the second stepped surface to form a stepped structure between the first surface and the stop surface. The at least one counterweight element is disposed on the first stepped surface.

7. The wavelength conversion device according to claim 1, characterized in that, The stop surface includes a plurality of first arc surfaces and a plurality of second arc surfaces arranged in an alternating manner. The plurality of second arc surfaces are the plurality of sections of the stop surface. The at least one counterweight element rests on the junction of at least one of the plurality of first arc surfaces and an adjacent second arc surface or rests on at least one of the plurality of second arc surfaces.

8. The wavelength conversion device according to claim 7, characterized in that, The radius of curvature of each of the plurality of second arc surfaces is smaller than the radius of curvature of each of the plurality of first arc surfaces.

9. The wavelength conversion device according to claim 1, characterized in that, The at least one counterweight element is plate-shaped, spherical, or conical.

10. The wavelength conversion device according to claim 1, characterized in that, The at least one counterweight and the at least one colloid only cover a portion of the plurality of through holes, and the at least one colloid is a light-curing adhesive.

11. A method for manufacturing a wavelength conversion device, characterized in that, include: A substrate is provided, wherein the substrate has a central axis and opposing first and second surfaces; A plurality of through holes and recesses are formed in the substrate, wherein the recesses are located on the central axis and recessed into the substrate relative to the first surface, the recesses have a stop surface around the central axis, the plurality of through holes are spaced apart from each other in the recesses and penetrate from the first surface to the second surface in a direction parallel to the central axis, the stop surface is adjacent to the first surface and the plurality of through holes, and the stop surface has a plurality of segments, the plurality of segments being partial inner walls of the plurality of through holes; At least one counterweight element is disposed in the recess such that the at least one counterweight element rests against the stop surface and is positioned by at least one of the plurality of segments of the stop surface, and the orthographic projection of the through hole corresponding to at least one of the plurality of segments onto the second surface in the direction parallel to the central axis at least partially overlaps with the orthographic projection of the at least one counterweight element onto the second surface in the direction parallel to the central axis. At least one colloid is coated onto the at least one counterweight element; as well as The at least one colloid is photocured toward the first surface and photocured toward the second surface through the through-hole corresponding to at least one of the plurality of segments.

12. The method for manufacturing the wavelength conversion device according to claim 11, characterized in that, The step of forming the plurality of through holes and the recesses on the substrate includes: The substrate is stamped along the second surface toward the first surface to form a boss structure on the substrate; The plurality of through holes are formed in the boss structure along the direction parallel to the central axis; and The boss structure is stamped along the direction from the first surface to the second surface to form a recess in the central region of the boss structure and an annular protrusion around the periphery of the boss structure. The side of the recess forms the stop surface, the bottom surface of the recess is a first step surface, the top surface of the annular protrusion is a second step surface, the stop surface connects the first step surface and the second step surface, and the plurality of through holes are located at the junction of the first step surface and the stop surface.

13. The method for manufacturing the wavelength conversion device according to claim 11, characterized in that, The substrate constitutes the substrate of the wavelength conversion device, and the manufacturing method includes: At least one wavelength conversion layer is disposed on the substrate, wherein the at least one wavelength conversion layer surrounds the recess.

14. The method for manufacturing the wavelength conversion device according to claim 11, characterized in that, The substrate constitutes a counterweight plate of the wavelength conversion device, and the manufacturing method includes: Provide substrate; At least one wavelength conversion layer is disposed on the substrate, wherein the at least one wavelength conversion layer surrounds the recess; and The counterweight plate is disposed on the base plate, wherein the counterweight plate is located on the central axis.

15. The method for manufacturing the wavelength conversion device according to claim 14, characterized in that, include: A plurality of openings are formed on the substrate, and the plurality of through holes are arranged in a one-to-one correspondence with the plurality of openings. The orthographic projection of the plurality of through holes on the second surface in the direction parallel to the central axis at least partially overlaps with the orthographic projection of the plurality of openings on the second surface in the same direction parallel to the central axis.

16. The method for manufacturing the wavelength conversion device according to claim 11, characterized in that, include: The first surface and the stop surface form a stepped structure.

17. The method for manufacturing the wavelength conversion device according to claim 11, characterized in that, include: The stop surface is formed to include a plurality of first arc surfaces and a plurality of second arc surfaces arranged in an alternating manner, wherein the plurality of second arc surfaces are the plurality of segments of the stop surface; as well as The at least one counterweight element rests on the junction of at least one of the plurality of first arc surfaces and an adjacent second arc surface, or rests on at least one of the plurality of second arc surfaces.

18. The method for manufacturing the wavelength conversion device according to claim 17, characterized in that, include: The radius of curvature of each of the plurality of second arc surfaces is formed to be smaller than the radius of curvature of each of the plurality of first arc surfaces.

19. The method for manufacturing the wavelength conversion device according to claim 11, characterized in that, include: The at least one counterweight and the at least one colloid are configured to only cover a portion of the plurality of through holes, and the colloid is a photocurable colloid.

20. The method for manufacturing the wavelength conversion device according to claim 11, characterized in that, The stop surface is perpendicular to the first surface, or the stop surface is inclined relative to the first surface.

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