A display panel and a manufacturing method thereof

Abstract

The present application provides a display panel and a manufacturing method thereof, the display panel comprising: a substrate; a plurality of sub-pixels, arranged on the substrate; a pixel defining layer, arranged on the substrate, the pixel defining layer being used to define the positions of the plurality of sub-pixels; an isolation structure, arranged on the pixel defining layer, the isolation structure being used to isolate the plurality of sub-pixels, the isolation structure comprising a first insulating layer, a conductive layer, and a second insulating layer stacked in sequence, the cathode layers of two adjacent sub-pixels being connected through the conductive layer; a first encapsulation layer, arranged on the sub-pixel and contacting the conductive layer; a cathode auxiliary layer, arranged on the second insulating layer, the cathode auxiliary layer extending from the side of the second insulating layer to the side contacting the conductive layer, so as to connect the cathode layer of the sub-pixel through the conductive layer. Through the above method, the cathode is turned on over the entire surface through the cathode auxiliary layer, the resistance and voltage drop are reduced, the optical crosstalk is avoided, the cathode signal driving force is enhanced, the uniformity is improved, and the picture quality is improved.

Description

Technical Field

[0001] The present application mainly relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof. Background Art

[0002] Compared with liquid crystal display panels (LCD), organic light emitting diode (OLED) display panels have many advantages such as full solid state, active luminescence, high brightness, high contrast, ultra-thin, low power consumption, no viewing angle limitation, wide operating temperature range, etc., and are receiving more and more attention. However, OLED display panels are expensive and the process is complicated, and practitioners are constantly looking for improvement solutions. In the preparation process of OLED devices, the deposition of luminescent materials is a relatively critical and expensive process. Traditional manufacturing often uses a vacuum evaporator and a fine metal mask (FMM) to deposit luminescent materials. Under this production mode, the disadvantages are very obvious: first, the vacuum evaporator is expensive and there are few suppliers, so domestic production is currently difficult to achieve; second, FMM is a consumable core component, and a set of masks can only be adapted to one model of display products, and it is currently impossible to mass produce in China and it is difficult to purchase high-end FMM; third, the actual utilization rate of expensive luminescent materials in this process is less than 20%, and it is difficult to recycle, resulting in a large amount of material waste. In this context, domestic OLED display panel factories are not only limited in materials and equipment by foreign monopoly manufacturers, but also find it difficult to achieve their profit targets. Therefore, it is urgent and important to find alternative solutions for the deposition of luminescent materials on substrates and to research the production of OLED display panels without FMM.

[0003] Graphical evaporation is an important technology currently introduced to FMM. It uses an array exposure and etching process to produce light-emitting material patterns, saves evaporation masks, can be applied to high PPI products, and is beneficial to improving product quality. Summary of the invention

[0004] The main purpose of the present application is to provide a display panel and a method for manufacturing the same to solve the problems of large resistance, large voltage drop, uneven screen display, optical crosstalk, etc. existing in the display panel formed by current graphic evaporation.

[0005] To solve the above problems, the present application provides a display panel, which includes: a substrate; a plurality of sub-pixels, which are arranged on the substrate; a pixel defining layer, which is arranged on the substrate, and the pixel defining layer is used to define the positions of the plurality of sub-pixels; an isolation structure, which is arranged on the pixel defining layer, and the isolation structure is used to isolate the plurality of sub-pixels, and the isolation structure includes a first insulating layer, a conductive layer, and a second insulating layer stacked in sequence, and the cathode layers of two adjacent sub-pixels are connected through the conductive layer; a first encapsulation layer, which is arranged on the sub-pixel and contacts the conductive layer; a cathode auxiliary layer, which is arranged on the second insulating layer, and the cathode auxiliary layer extends from the side of the second insulating layer to the side contacting the conductive layer, so as to connect the cathode layer of the sub-pixel through the conductive layer.

[0006] In one embodiment, the conductive layer and the cathode layer are sequentially connected to form a first conductive line, and the cathode auxiliary layer forms a second conductive line. The extension direction of the first conductive line and the extension direction of the second conductive line are perpendicular to each other.

[0007] In one embodiment, two ends of the first conductive line are configured to receive a common signal respectively, and two ends of the second conductive line are configured to receive a common signal respectively.

[0008] In one embodiment, the display panel also includes: a first common signal source, connected to the first ends of multiple first wires; a second common signal source, connected to the second ends of multiple first wires; a third common signal source, connected to the first ends of multiple second wires; and a fourth common signal source, connected to the second ends of multiple second wires; wherein the first common signal source, the second common signal source, the third common signal source and the fourth common signal source are configured to provide a common signal.

[0009] In one embodiment, the sub-pixel includes an anode layer, an organic light-emitting layer and a cathode layer stacked in sequence, the organic light-emitting layer overlaps the pixel defining layer and contacts the first insulating layer, and the upper surface of the organic light-emitting layer is not higher than the first insulating layer.

[0010] In one embodiment, the display panel further includes a second encapsulation layer disposed on the cathode auxiliary layer and the first encapsulation layer.

[0011] To solve the above problems, the present application also provides a method for manufacturing a display panel, which includes: providing a substrate; forming a plurality of sub-pixels, a pixel defining layer and an isolation column on the substrate, the pixel defining layer is used to define the positions of the plurality of sub-pixels, the isolation column is arranged on the pixel defining layer, the isolation structure is used to isolate the plurality of sub-pixels, the isolation column includes a first insulating layer, a conductive layer and a second insulating layer stacked in sequence, and the cathode layers of two adjacent sub-pixels are connected through the conductive layer; forming a first encapsulation layer on the sub-pixels, the first encapsulation layer is in contact with the conductive layer; forming a cathode auxiliary layer on the second insulating layer and the first encapsulation layer, the cathode auxiliary layer extending from the side of the second insulating layer to the side contacting the conductive layer, so as to connect the cathode layer of the sub-pixel through the conductive layer.

[0012] In one embodiment, a plurality of sub-pixels, a pixel defining layer and an isolation column are formed on a substrate, including: forming an anode layer on the substrate; forming a pixel defining layer on the substrate; forming an isolation column on the pixel defining layer; and sequentially forming an organic light-emitting layer and a cathode layer on the anode layer, wherein the anode layer, the organic light-emitting layer and the cathode layer form sub-pixels.

[0013] In one embodiment, the method for manufacturing a display panel further includes: forming a second encapsulation layer on the cathode auxiliary layer and the first encapsulation layer.

[0014] In order to solve the above problems, the present application also provides a display device, which includes any display panel as described above or a display panel manufactured by any of the above manufacturing methods.

[0015] Through the above method, the light-emitting layers of adjacent sub-pixels are isolated by constructing an isolation structure, thereby avoiding optical crosstalk between adjacent sub-pixels, and by constructing a cathode auxiliary layer, the cathode auxiliary layer, the conductive layer and the cathode layer of the adjacent sub-pixel are connected to each other, thereby achieving connection and conduction between them, so that a mesh cathode structure is formed on the entire surface, the resistance of the cathode is reduced, and the driving force of the cathode signal is enhanced by the cathode auxiliary layer, reducing the cathode load and improving the uniformity of the signal, thereby reducing the voltage drop therein and improving the quality of the picture display. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0017] Figure 1 is a schematic structural diagram of an embodiment of a display panel provided by the present application;

[0018] Figure 2 is a schematic diagram of mesh connection of an embodiment of a display panel provided by the present application;

[0019] Figure 3 It is a schematic diagram of the steps of an embodiment of a method for manufacturing a display panel provided by the present application;

[0020] Figure 4a to Figure 4g It is a schematic diagram of the steps and structure of an embodiment of a method for manufacturing a display panel provided by the present application;

[0021] Figure 5 yes Figure 3 Schematic diagram of the sub-step flow chart of step S20;

[0022] Figure 6 It is a structural schematic diagram of an embodiment of a display device provided in the present application.

[0023] Figure numerals: 100, display panel; 10, substrate; 20, sub-pixel; 201, anode layer; 202, organic light-emitting layer; 203, cathode layer; 30, pixel defining layer; 40, isolation structure; 401, first insulating layer; 402, conductive layer; 403, second insulating layer; 50, first encapsulation layer; 60, cathode auxiliary layer; 70, second encapsulation layer; 80, first wire; 801, first common signal source; 802, second common signal source; 90, second wire; 901, third common signal source; 902, fourth common signal source; 200, display device. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It will be appreciated that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some but not all structures related to the present application are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present application.

[0025] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0026] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0027] In the currently existing graphic evaporation technology, the evaporated cathode structure is connected to the conductive part of the isolation structure therein, which results in a larger resistance of the cathode structure after the connection, resulting in increased power consumption and a larger voltage drop (IRdrop), thereby causing effects such as uneven display and optical crosstalk, which in turn affects the display effect of the picture.

[0028] Among them, IR drop refers to a phenomenon in which the voltage on the power supply and ground network in the integrated circuit drops and increases. IRdrop is mainly divided into static IR drop and dynamic IR drop. Among them, the static IR drop phenomenon is mainly caused by the voltage division of the metal connection of the power supply network, which is caused by the resistance division of the metal connection itself; dynamic IR drop is the voltage drop caused by the current fluctuation when the power supply switches the circuit.

[0029] With the development of semiconductor technology, the metal interconnects are getting narrower and narrower, resulting in increasing resistance values ​​and decreasing power supply voltages, which results in an increasingly obvious impact of IR-Drop. The present application provides a display panel that can effectively reduce the resistance of the cathode and enhance the driving force of the cathode signal, thereby reducing the impact of IR-Drop and further improving the display effect of the picture.

[0030] See also Figure 1 As shown, Figure 1 It is a schematic diagram of the structure of an embodiment of a display panel provided in the present application; wherein the display panel 100 includes: a substrate 10, a sub-pixel 20, a pixel defining layer 30, an isolation structure 40, a first encapsulation layer 50 and a cathode auxiliary layer 60. Specifically, the structure is provided with a plurality of sub-pixels 20 arranged on a substrate 10; a pixel defining layer 30 is arranged on the substrate 10, and the pixel defining layer 30 is used to define the positions of the plurality of sub-pixels 20; an isolation structure 40 is arranged on the pixel defining layer 30, and the isolation structure 40 is used to isolate the plurality of sub-pixels 20, wherein the isolation structure 40 includes a first insulating layer 401, a conductive layer 402 and a second insulating layer 403 stacked in sequence, and the cathode layer 203 of two adjacent sub-pixels 20 is connected through the conductive layer 402; a first encapsulation layer 50 is arranged on the sub-pixel 20 and contacts the conductive layer 402; a cathode auxiliary layer 60 is arranged on the second insulating layer 403, and the cathode auxiliary layer 60 extends from the side of the second insulating layer 403 to the side contacting the conductive layer 402, so as to connect the cathode layer 203 of the sub-pixel 20 through the conductive layer 402.

[0031] Among them, the cathode layer 203, the cathode auxiliary layer 60 and the conductive layer 402 are interconnected to form a mesh structure, and this mesh structure can effectively reduce the load; specifically, the mesh structure is composed of multiple nodes and multiple connection points, and the peripheral VSS signal can be input through the cathode auxiliary layer 60 and the cathode layer 203 respectively, which can effectively enhance the driving force of the cathode signal VSS, and the formed mesh structure has certain flexibility, reliability and anti-destruction. The mesh structure has higher transmission efficiency and flexibility than the structure formed by grouping, and has multiple paths to avoid affecting the overall signal transmission due to the failure of a single path, thereby improving reliability and having strong anti-destruction.

[0032] See also Figure 2 As shown, Figure 2 It is a schematic diagram of mesh connection of an embodiment of a display panel provided in the present application.

[0033] Optionally, in one embodiment, the conductive layer 402 and the cathode layer 203 are sequentially connected to form a first wire 80 , and the cathode auxiliary layer 60 forms a second wire 90 , and the extension direction of the first wire 80 and the extension direction of the second wire 90 are perpendicular to each other.

[0034] Optionally, in one embodiment, two ends of the first conductive line 80 are configured to receive a common signal respectively, and two ends of the second conductive line 90 are configured to receive a common signal respectively.

[0035] Optionally, in one embodiment, the display panel 100 also includes: a first common signal source 801, connected to the first ends of multiple first wires 80; a second common signal source 802, connected to the second ends of multiple first wires 80; a third common signal source 901, connected to the first ends of multiple second wires 90; a fourth common signal source 902, connected to the second ends of multiple second wires 90; wherein the first common signal source 801, the second common signal source 802, the third common signal source 901 and the fourth common signal source 902 are configured to provide a common signal; by adding a cathode auxiliary layer 60, the input drive of the VSS signal is performed through four common signal sources on the original basis, which effectively enhances the driving force of the cathode signal VSS, thereby improving the uniformity of the VSS signal.

[0036] Optionally, in one embodiment, the sub-pixel 20 includes an anode layer 201, an organic light-emitting layer 202 and a cathode layer 203 which are stacked in sequence, the organic light-emitting layer overlaps the pixel defining layer and contacts the first insulating layer, and the upper surface of the organic light-emitting layer is not higher than the first insulating layer.

[0037] Among them, the anode material of the anode layer 201 is mainly used as the anode of the device, and its work function is required to be as high as possible to improve the hole injection efficiency. The selection of anode materials includes but is not limited to chromium, titanium, gold, silver, copper, aluminum, ITO, their combination or other suitable conductive materials.

[0038] Among them, the organic light-emitting materials in the organic light-emitting layer 202 are generally divided into two categories: high molecular polymers, small molecule organic substances and complex light-emitting materials; high molecular polymers are usually conductive conjugated polymers or semiconductor conjugated polymers, which can be formed into films by spin coating, are simple to make and low in cost, but their purity is not easy to improve, and they are inferior to small molecule organic compounds in terms of durability, brightness and color. Organic small molecule light-emitting materials are mainly organic dyes, which have the advantages of strong chemical modification, wide selection range, easy purification, high quantum efficiency, and can produce various color emission peaks such as red, green, blue, and yellow, but most of them have concentration quenching problems in the solid state. Complex light-emitting materials are between organic and inorganic substances, with both high fluorescence quantum efficiency of organic substances and high stability of inorganic substances, and are regarded as a type of light-emitting material with great application prospects.

[0039] The organic light-emitting layer 202 is used to emit red light, blue light or green light when the display panel is powered on; the organic light-emitting layer 202 may include but is not limited to one or more of HIL (Hole Injection Layer), HTL (Hole Transfer Layer), EML (Emitting Layer) and ETL (Electron Transfer Layer).

[0040] The cathode material of the cathode layer 203 is mainly used as the cathode of the device. The lower the metal work function of the cathode material, the easier it is to inject electrons, the higher the luminous efficiency, the less Joule heat generated during operation, and the longer the device life. The selection of the cathode layer 203 material includes but is not limited to chromium, titanium, gold, silver, copper, aluminum, ITO, a combination thereof or other suitable conductive materials; the cathode layer 203 material and the anode layer 201 material can be the same material or different materials, which are set according to actual needs.

[0041] Optionally, in one embodiment, the display panel further includes a second encapsulation layer 70 disposed on the cathode auxiliary layer 60 and the first encapsulation layer 50 .

[0042] Among them, traditional OLED packaging technology is to encapsulate electrodes and various organic functional layers on a rigid substrate. Generally, a cover is added to the device with a desiccant, and then the substrate and the cover are combined with sealants such as epoxy resin; thin film packaging is the current mainstream packaging technology. Thin film packaging materials are mainly divided into inorganic packaging materials, organic packaging materials and inorganic-organic composite packaging materials. Among them, inorganic-organic composite packaging materials have the advantages of good water and oxygen barrier properties of inorganic packaging materials and good film-forming properties of organic packaging materials, and are the mainstream choice for OLED packaging materials.

[0043] The key core material of OLED devices is the ultra-thin organic electroluminescent layer, which is extremely sensitive to water, oxygen, and heat, which is also the reason for its poor stability. Oxygen will quench triplet excitons, directly leading to a significant decrease in the luminescence quantum efficiency. It will also oxidize the organic materials of the hole transport layer and the light-emitting layer, causing the unsaturated double bonds to be opened, and the device's luminescence efficiency and electron hole transport capacity to decrease. Water vapor easily causes the organic semiconductor in the light-emitting layer to undergo hydrolysis reactions. The metals used in the electrodes are very active, and are easily oxidized and easily react with the infiltrated water vapor to be hydrolyzed. Due to the particularity of their substrate materials, flexible devices have a worse water and oxygen barrier capability than rigid materials, and have higher requirements for packaging. Strict packaging of OLED devices is a necessary condition for extending device life and improving device stability, and is the only way to achieve mass production of OLED devices.

[0044] In order to solve the above problems, the present application also provides a method for manufacturing a display panel, which specifically includes the following steps:

[0045] See also Figure 3 and Figure 4a to Figure 4g As shown, Figure 3 It is a schematic diagram of the steps of an embodiment of a method for manufacturing a display panel provided by the present application; Figure 4a to Figure 4g It is a schematic diagram of the steps of an embodiment of a method for manufacturing a display panel provided in the present application.

[0046] Step S10: providing a substrate.

[0047] Among them, Figure 4a The substrate 10 plays a role in supporting the entire panel in the display panel. The material of the packaging substrate may include a hard packaging substrate and a flexible packaging substrate. The material selection includes but is not limited to BT material, ABF material, MIS material, PI (polyimide) and PE (polyester) resin materials or their combinations.

[0048] Optionally, in one embodiment, it can be a glass substrate; in another embodiment, it can also be a flexible substrate, wherein the material of the flexible substrate is polyimide (PI). The substrate generally has to meet several conditions: good transparency; certain adhesion with the film material; and certain temperature resistance.

[0049] Step S20: forming a plurality of sub-pixels, a pixel defining layer and an isolation column on a substrate, wherein the pixel defining layer is used to define the positions of the plurality of sub-pixels, the isolation column is disposed on the pixel defining layer, the isolation structure is used to isolate the plurality of sub-pixels, the isolation column comprises a first insulating layer, a conductive layer and a second insulating layer stacked in sequence, and the cathode layers of two adjacent sub-pixels are connected via a conductive layer.

[0050] See also Figure 5 , Figure 5yes Figure 3 The sub-steps of step S20 are shown in FIG. 1 . The sub-steps specifically include the following steps:

[0051] Step S201: forming an anode layer on a substrate.

[0052] The anode material is generally formed on the substrate by deposition, which may be formed by methods including but not limited to physical vapor deposition, chemical vapor deposition, molecular beam epitaxy, spin coating or spraying, and electroplating.

[0053] Optionally, in one embodiment, the anode is patterned by wet etching or dry etching to obtain mutually spaced anode layers 201, such as Figure 4b As shown, dry etching includes laser etching or plasma etching; wet etching includes chemical etching.

[0054] Step S202: forming a pixel defining layer on a substrate.

[0055] Among them, the pixel defining layer 30, as a component in the OLED display panel 100, can be arranged to cooperate with the overall display, such as improving pixel display effect, simplifying manufacturing process, reducing panel thickness, improving device yield, etc.

[0056] Specifically, Figure 4b As shown, a pixel defining layer 30 is formed between the anode layers 201 spaced apart from each other, and the pixel defining layer 30 contacts the side surfaces of the anode layers 201 and extends to the upper surface of the anode layers.

[0057] The material of the pixel defining layer 30 may be an organic material, an organic material with an inorganic coating disposed thereon, or an inorganic material. The organic material of the pixel defining layer 30 includes, but is not limited to, polyimide. The inorganic material of the pixel defining layer 30 includes, but is not limited to, silicon oxide (SiO2), silicon nitride (Si3N4), silicon oxynitride (Si2N2O), magnesium fluoride (MgF2), or a combination thereof.

[0058] Step S203: forming isolation columns on the pixel defining layer.

[0059] like Figure 4c The isolation structure 40 formed by the isolation columns is used to separate adjacent different sub-pixels 20 to form a sub-pixel array to prevent optical crosstalk between adjacent sub-pixels 20, achieve high resolution and colorization of the display panel, and better solve the problems of low resolution of the cathode template of the display panel and low yield of the display panel.

[0060] The material of the isolation structure 40 may be one of a non-conductive organic material and a non-conductive inorganic material. The non-conductive inorganic material includes, but is not limited to, an inorganic silicon-containing material. For example, the silicon-containing material includes silicon oxide or nitride or a combination thereof. The non-conductive organic material includes a negative photosensitive organic material. For example, the negative photosensitive organic material includes, but is not limited to, a negative photoresist.

[0061] Step S204: forming an organic light-emitting layer and a cathode layer in sequence on the anode layer, and the anode layer, the organic light-emitting layer and the cathode layer form a sub-pixel.

[0062] like Figure 4d Each pixel in the display panel 100 is composed of three primary colors: red, blue and green (RGB). Each color of each pixel is called a sub-pixel 20. Each sub-pixel 20 includes: an anode layer 201, a cathode layer 203 and an organic light-emitting layer 202, and emits light of different colors through different organic light-emitting layers 202; and different arrangements of the sub-pixels 20 also have different effects on the display effect of the display panel 100.

[0063] Step S30: forming a first encapsulation layer on the sub-pixel, wherein the first encapsulation layer is in contact with the conductive layer.

[0064] like Figure 4e In one embodiment, the function of the first encapsulation layer 50 is to individually encapsulate and isolate different sub-pixels 20 to protect their structure and prevent crosstalk, and to isolate the cathode layer 203 from the cathode auxiliary layer 60 to avoid direct contact and conduction between the cathode layer 203 and the cathode auxiliary layer 60, so as to increase the area of ​​the overall cathode, thereby reducing the cathode resistance and forming a mesh structure through interconnection with the conductive layer to enhance the input of the VSS signal.

[0065] Optionally, in one embodiment, the packaging method used includes but is not limited to chemical vapor deposition (CVD), atomic layer deposition technology (ALD) and mixed barrier layer.

[0066] Currently, packaging technologies include metal lid packaging, glass substrate packaging, thin film packaging, etc.

[0067] Step S40: forming a cathode auxiliary layer on the second insulating layer and the first encapsulation layer, wherein the cathode auxiliary layer extends from a side surface of the second insulating layer to a side surface contacting the conductive layer, so as to connect the cathode layer of the sub-pixel through the conductive layer.

[0068] Optionally, in one embodiment, if Figure 4fThe cathode auxiliary layer 60 covers the upper surface and two side surfaces of the second insulating layer 403, and extends to the side surface of the contact conductive layer 402, and is in contact with and connected to the first encapsulation layer 50; the cathode auxiliary layer 60 is connected to the conductive layer 402 in the isolation structure 40 between adjacent sub-pixels 20, and the cathode layer 203 in the adjacent sub-pixels 20 is also connected to the conductive layer 402 in the isolation structure 40, thereby realizing the connection and conduction of the cathodes between the sub-pixels 20 in the display panel 100 as a whole, thereby increasing the connection area of ​​the cathode, reducing the resistance of the overall cathode, and reducing the voltage drop (IR drop) phenomenon therein; and the isolation structure 40 therein can effectively separate the adjacent sub-pixels 20 to avoid optical crosstalk and the like, and the mutual connection between the cathode auxiliary layer 60, the conductive layer 402 and the cathode layer 203 also constitutes a mesh structure, which can enhance the driving force of its cathode signal VSS, reduce the load and have certain flexibility and reliability.

[0069] Optionally, in one embodiment, the method for manufacturing the display panel 100 further includes: forming a second encapsulation layer 70 on the cathode auxiliary layer 60 and the first encapsulation layer 50 .

[0070] like Figure 4g The second encapsulation layer 70 encapsulates and protects the display panel 100 as a whole, isolating it from the external environment to prevent impurities, oxygen, moisture and other substances in the air from contaminating and corroding the display panel 100, and to prevent problems such as damage by external forces. Encapsulation technology includes two categories: online encapsulation and offline encapsulation. Online encapsulation is to directly plate an inorganic and organic alternating barrier layer on the surface of the metal electrode of the OLED device; while offline encapsulation technology is to use encapsulation glue / film to bond a layer of high-barrier film on the surface of the metal electrode of the OLED device, which is generally easier to prepare than the online process. The advantage of offline encapsulation technology is that the performance of the encapsulation glue / film and the high-barrier film can be optimized separately, but during the encapsulation process, the OLED device may be exposed to water, oxygen or dust, which may damage the flexible device and is not conducive to achieving the goal of high efficiency and long life.

[0071] The material of the second encapsulation layer 70 and the material of the first encapsulation layer 50 may be the same material or different materials, and the material is set according to specific practical needs.

[0072] To solve the above problems, the present application also provides a display device, see Figure 6 , Figure 6 1 is a schematic diagram of a display device according to an embodiment of the present application. The display device 200 includes any display panel 100 described in the above embodiments or a display panel 100 manufactured by the above manufacturing method, so that the display panel 100 provides a stable picture output for the display device 200.

[0073] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include: substrate; A plurality of sub-pixels are disposed on the substrate; A pixel defining layer, disposed on the substrate, and used to define positions of a plurality of sub-pixels; an isolation structure, disposed on the pixel defining layer, the isolation structure being used to isolate a plurality of the sub-pixels, the isolation structure comprising a first insulating layer, a conductive layer, and a second insulating layer stacked in sequence, and cathode layers of two adjacent sub-pixels being connected via the conductive layer; A first encapsulation layer, disposed on the sub-pixel and contacting the conductive layer; a cathode auxiliary layer, disposed on the second insulating layer, the cathode auxiliary layer extending from a side surface of the second insulating layer to a side surface contacting the conductive layer, so as to be connected to the cathode layer of the sub-pixel through the conductive layer; Among them, the conductive layer and the cathode layer are connected in sequence to form a first conductive wire, the cathode auxiliary layer forms a second conductive wire, the extension direction of the first conductive wire and the extension direction of the second conductive wire are perpendicular to each other; the two ends of the first conductive wire are configured to receive a common signal respectively, and the two ends of the second conductive wire are configured to receive the common signal respectively.

2. The display panel according to claim 1, characterized in that: The display panel further includes: A first common signal source connected to the first ends of the plurality of first conducting wires; A second common signal source connected to the second ends of the plurality of first conducting wires; A third common signal source connected to the first ends of the plurality of second conductive lines; a fourth common signal source connected to the second ends of the plurality of second conductive lines; The first common signal source, the second common signal source, the third common signal source and the fourth common signal source are configured to provide the common signal.

3. The display panel according to claim 1, characterized in that: The sub-pixel includes an anode layer, an organic light-emitting layer and the cathode layer which are stacked in sequence. The organic light-emitting layer overlaps the pixel defining layer and contacts the first insulating layer. The upper surface of the organic light-emitting layer is not higher than the first insulating layer.

4. The display panel according to claim 1, characterized in that: The display panel further includes a second encapsulation layer disposed on the cathode auxiliary layer and the first encapsulation layer.

5. A method for manufacturing a display panel, characterized in that: The production method comprises: providing a substrate; A plurality of sub-pixels, a pixel defining layer and an isolation structure are formed on the substrate, wherein the pixel defining layer is used to define the positions of the plurality of sub-pixels, the isolation structure is disposed on the pixel defining layer, the isolation structure is used to isolate the plurality of sub-pixels, the isolation structure comprises a first insulating layer, a conductive layer and a second insulating layer which are sequentially stacked, and cathode layers of two adjacent sub-pixels are connected via the conductive layer; forming a first encapsulation layer on the sub-pixel, wherein the first encapsulation layer is in contact with the conductive layer; A cathode auxiliary layer is formed on the second insulating layer and the first encapsulation layer, wherein the cathode auxiliary layer extends from a side surface of the second insulating layer to a side surface contacting the conductive layer, so as to connect the cathode layer of the sub-pixel through the conductive layer.

6. The method for manufacturing a display panel according to claim 5, characterized in that: The method of forming a plurality of sub-pixels, a pixel defining layer and an isolation structure on the substrate comprises: forming an anode layer on the substrate; forming a pixel defining layer on the substrate; forming an isolation structure on the pixel defining layer; An organic light-emitting layer and a cathode layer are sequentially formed on the anode layer, and the anode layer, the organic light-emitting layer and the cathode layer form the sub-pixel.

7. The manufacturing method according to claim 6, characterized in that: The method for manufacturing the display panel further includes: A second encapsulation layer is formed on the cathode auxiliary layer and the first encapsulation layer.

8. A display device, characterized in that: The display device includes the display panel as described in any one of claims 1 to 4, or includes a display panel manufactured by the method for manufacturing a display panel as described in any one of claims 5 to 7.

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