A heat transfer structure, a radiator and a server for strengthening and activating a porous capillary structure

Abstract

This application relates to the technical field of radiators, and particularly to a heat transfer structure, a radiator, and a server that strengthen and activate a porous capillary structure. Among them, the heat transfer structure that strengthens and activates the porous capillary structure includes: a heat conduction outer shell, which includes a first shell and a second shell. The first shell and the second shell enclose to form a vacuum phase change heat dissipation cavity, and the outer wall of the first shell can be in contact with a heat generating device; a first phase change heat conduction structure is arranged on the inner wall of the first shell, and a first phase change working fluid is therein; a second phase change heat conduction structure is arranged on the inner wall of the second shell; multiple groups of third phase change heat conduction structures are arranged in the inner wall of the first shell and can radially extend from the heat generating device to the edge of the first shell. Each group of the third phase change heat conduction structures has a second phase change heat conduction working fluid. The heat transfer structure of this application can activate more first phase change working fluids to absorb heat through the third phase change heat conduction structure in a vacuum environment, and has the effect of improving the heat dissipation capacity of the radiator.

Description

Technical Field

[0001] This application relates to the technical field of radiators, and in particular to a heat transfer structure, a radiator and a server that strengthen and activate a porous capillary structure. Background Art

[0002] At present, with the progress of modern technology, the level of production automation has also been continuously improved. In industrial production, with the progress of the manufacturing process, the heat generation power of electronic chips and electronic devices using electronic chips is getting higher and higher; at the same time, it is desired that the structures of electronic chips and electronic devices using electronic chips are as compact as possible to reduce the volume of electronic chips and electronic devices using electronic chips.

[0003] To meet the above needs, radiator structures such as HP heat pipes, VC vapor chambers, loop heat pipes LHP, and loop thermosyphon LTS have been developed and applied to electronic devices such as mobile terminals, computers, and servers, and can also be applied to information-based intelligent devices such as new energy vehicles to solve the heat dissipation problems of electronic chips and electronic devices with different heat generation efficiencies.

[0004] However, due to the limited internal space of electronic devices, the heat dissipation capacity of the above radiator structures is still difficult to meet the heat generation of electronic chips and electronic devices, and it is still necessary to further develop the heat dissipation capacity of radiator structures. Summary of the Invention

[0005] In order to improve the heat dissipation capacity of the radiator structure, this application provides a heat transfer structure, a radiator and a server that strengthen and activate a porous capillary structure.

[0006] A heat transfer structure that strengthens and activates a porous capillary structure provided by this application is used to help a heat-generating device conduct heat, and adopts the following technical solutions:

[0007] The heat transfer structure that strengthens and activates a porous capillary structure includes: a heat-conducting outer shell, including a first shell and a second shell, the first shell and the second shell enclose a vacuum phase-change heat dissipation cavity, and the outer wall of the first shell can be in contact with the heat-generating device; a first phase-change heat-conducting structure, arranged on the inner wall of the first shell, and the first phase-change heat-conducting structure has a first phase-change working medium; a second phase-change heat-conducting structure, arranged on the inner wall of the second shell; multiple groups of third phase-change heat-conducting structures, arranged in the inner wall of the first shell and capable of radially extending from the heat-generating device to the edge of the first shell, and each group of third phase-change heat-conducting structures has a second phase-change working medium.

[0008] By adopting the above technical solution, the third-phase change heat conduction structure extends from the heat generating device to the edge of the heat conduction housing, raising the temperature near the third-phase change heat conduction structure and activating the first-phase change working fluid in the first-phase change heat conduction structure within this range, enabling the first-phase change working fluid to undergo a phase change reaction and achieving a heat absorption effect.

[0009] Optionally, the first end of each group of the third-phase change heat conduction structures corresponds to the edge of the heat generating device, and the second end of each group of the third-phase change heat conduction structures extends towards the edge of the first housing.

[0010] By adopting the above technical solution, using the heat diffusion zone formed near the heat generating device, the third-phase change heat conduction structure absorbs heat from the heat diffusion zone and raises the overall temperature of the heat coverage zone formed by the coverage range of the third-phase change heat conduction structure.

[0011] Optionally, the first housing includes a bottom plate and a cover plate. The third-phase change heat conduction structure includes a microscale liquid phase change channel structure and a gas phase change channel structure. The microscale liquid phase change channel structure is arranged on the bottom plate, and the liquefied second-phase change working fluid can flow in the microscale liquid phase change channel structure. The gas phase change channel structure is arranged on the cover plate, and the vaporized second-phase change working fluid can flow in the gas phase change channel structure. The cover plate is covered on the bottom plate so that the gas phase change channel structure corresponds to the microscale liquid phase change channel structure to form multiple microscale vacuum phase change heat transfer cavities.

[0012] By adopting the above technical solution, the liquid second-phase change working fluid absorbs a large amount of latent heat and vaporizes in the microscale liquid phase change channel structure, reducing the temperature of the heat generating device. The gaseous second-phase change working fluid can release heat to the first-phase change working fluid in the first-phase change heat conduction structure in the gas phase change channel structure, activating the first-phase change working fluid to absorb heat and vaporize, enabling the first-phase change working fluid to complete a heat cycle in the vacuum phase change heat dissipation cavity. At the same time, the second-phase change working fluid can also release heat and liquefy in the gas phase change channel structure to complete the heat cycle.

[0013] Optionally, the thickness of the third-phase change heat conduction structure is between 0.1 mm and 0.5 mm, and the microscale liquid phase change channel structure is formed on the bottom plate by means of etching or electrochemical corrosion.

[0014] By adopting the above technical solution, the microscale liquid phase change channel structure can be formed in a relatively thin heat transfer structure.

[0015] Optionally, the cross-section of the microscale liquid phase change channel structure is rectangular, trapezoidal or an incomplete circle.

[0016] Optionally, the thickness of the third-phase change heat conduction structure is between 0.5 mm and 1 mm, and the microscale liquid phase change channel structure is formed on the bottom plate by sintering a porous structure.

[0017] By adopting the above technical solution, the microscale liquid phase change channel structure can be formed in a relatively thick heat transfer structure.

[0018] Optionally, the porous structure can be one of copper ropes, copper meshes or copper powders.

[0019] Optionally, the heat transfer structure with enhanced activated porous capillary structure further includes a plurality of support columns, which are arranged at intervals in the heat dissipation cavity. Both ends of each support column are in contact with the first housing and the second housing respectively. The heat transfer structure with enhanced activated porous capillary structure further includes a fourth phase change heat conduction structure, which is arranged on the circumferential side wall of the support column and is connected to the first phase change heat conduction structure and the second phase change heat conduction structure respectively.

[0020] By adopting the above technical solution, it can effectively avoid the collapse or expansion of the heat conduction outer shell, affecting its heat dissipation effect; at the same time, the support column can also play a role in guiding the flow, prompting the droplets formed by the exothermic liquefaction of water vapor in the second phase change heat conduction structure to slide along the support column into the first phase change heat conduction structure, which is beneficial to forming a heat dissipation cycle. The fourth phase change heat conduction structure can connect the first phase change heat conduction structure and the second phase change heat conduction structure to form a complete and connected capillary channel, prompting the liquid to flow in the capillary channel under capillary action to achieve circulation.

[0021] A radiator provided by the present application includes a heat transfer structure with an enhanced activated porous capillary structure including all or part of the above technical features.

[0022] By adopting the above technical solution, it can play an effect of enhancing and activating the phase change heat conduction structure in the radiator and improve the heat dissipation capacity.

[0023] A server provided by the present application includes a radiator including all or part of the above technical features.

[0024] By adopting the above technical solution, the server has a stronger heat dissipation capacity.

[0025] In summary, the present application includes at least one of the following beneficial technical effects:

[0026] 1. It has a larger phase change heat dissipation area, which is beneficial to improving the heat dissipation effect;

[0027] 2. It has higher structural strength and is not easily deformed during practical use, which is beneficial to extending the service life;

[0028] 3. It has a smaller thermal resistance and smoother liquid circulation, which is beneficial to improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a three-dimensional structural schematic diagram of Embodiment 1 of the heat transfer structure with an enhanced activated porous capillary structure of the present application;

[0030] Figure 2 is Figure 1 Internal schematic diagram of the heat transfer structure with enhanced activated porous capillary structure;

[0031] Figure 3 is Figure 1 Schematic diagram of the third phase change heat transfer structure of the heat transfer structure with enhanced activated porous capillary structure;

[0032] Figure 4 is Figure 3 Cross-sectional schematic diagram of the heat transfer structure with enhanced activated porous capillary structure;

[0033] Figure 5 is Figure 4 Local enlarged structure schematic diagram at location A of the heat transfer structure with enhanced activated porous capillary structure;

[0034] Figure 6 is Figure 5 Cross-sectional structure schematic diagram of the micro-scale vacuum phase change heat transfer cavity of the heat transfer structure with enhanced activated porous capillary structure;

[0035] Figure 7 is Figure 6 Cross-sectional structure schematic diagram of an alternative scheme of the micro-scale vacuum phase change heat transfer cavity;

[0036] Figure 8 is Figure 6 Cross-sectional structure schematic diagram of another alternative scheme of the micro-scale vacuum phase change heat transfer cavity;

[0037] Figure 9 is Figure 6 Cross-sectional structure schematic diagram of the third alternative scheme of the micro-scale vacuum phase change heat transfer cavity;

[0038] Figure 10 Schematic diagram of the temperature difference change of the heat transfer structure with enhanced activated porous capillary structure in this application;

[0039] Figure 11 Schematic diagram of the third phase change heat transfer structure of Example 2 of the heat transfer structure with enhanced activated porous capillary structure in this application; and

[0040] Figure 12 is Figure 11 Cross-sectional schematic diagram of the heat transfer structure with enhanced activated porous capillary structure.

[0041] Explanation of reference numerals:

[0042] 10. Heat-conducting housing; 11. First housing; 111. Bottom plate; 112. Cover plate; 12. Second housing; 21. First phase-change heat-conducting structure; 22. Second phase-change heat-conducting structure; 23. Third phase-change heat-conducting structure; 231. Microscale liquid phase-change channel structure; 232. Gas phase-change channel structure; 233. Sealing; 24. Fourth phase-change heat-conducting structure; 30. Support column; 41. Vacuum phase-change heat dissipation cavity; 42. Microscale vacuum phase-change heat transfer cavity; 70. Heat coverage area; 80. Heat diffusion area; 90. Heat-generating device. Detailed implementation mode

[0043] The following is a further detailed description of the present application.

[0044] Example 1:

[0045] The heat transfer structure with a strengthened and activated porous capillary structure in this embodiment can be used to help the heat-generating device 90 conduct heat, such as server chips, mobile terminal chips, or computer chips, etc. Specifically, refer to Figures 1 to 4 . The heat transfer structure with a strengthened and activated porous capillary structure in this embodiment includes a heat-conducting housing 10, a first phase-change heat-conducting structure 21, a second phase-change heat-conducting structure 22, and a third phase-change heat-conducting structure 23. Among them, as Figure 1 shown, the heat-conducting housing 10 includes a first housing 11 and a second housing 12, and the first housing 11 and the second housing 12 enclose to form a vacuum phase-change heat dissipation cavity 41. Refer to Figure 1 and Figure 4 . In this embodiment, the first housing 11 can be in the shape of a semi-enclosed box, and the second housing 12 can be a flat plate that can cover the open end of the first housing 11. The first housing 11 and the second housing 12 can be welded together to form a vacuum phase-change heat dissipation cavity 41. A first phase-change heat-conducting structure 21 is provided on the inner wall of the first housing 11, and a second phase-change heat-conducting structure 22 is provided on the inner wall of the second housing 12. Both the first phase-change heat-conducting structure 21 and the second phase-change heat-conducting structure 22 have a porous structure, and the fluid can flow through the porous structure in the first phase-change heat-conducting structure 21 and the second phase-change heat-conducting structure 22, and undergo a phase change when heated to the outer surface of the porous structure.

[0046] As a preference, the materials of the first housing 11 and the second housing 12 can be metal housings mainly composed of copper, aluminum, stainless steel, or titanium, etc., or other materials beneficial to heat dissipation can also be selected.

[0047] Refer to Figure 1 and Figure 2, the first housing 11 of this embodiment can be in contact with and fit to the heating device 90, and absorb the heat generated when the heating device 90 operates, forming an evaporation end; the second housing 12 faces away from the heating device 90, forming a condensation end for heat dissipation. Specifically, in the solution of this embodiment, the first phase change heat conduction structure 21 and the second phase change heat conduction structure 22 are porous capillary structures formed by sintering copper powder, and the porous capillary structure contains a first phase change working fluid, such as deionized water. Refer to Figure 4 and Figure 5 , when the cavity is in a vacuum, the liquid deionized water absorbs the heat generated by the heating device 90 in the porous capillary structure of the first phase change heat conduction structure 21, and can undergo liquid-vapor phase change to vaporize into water vapor. The water vapor flows in the direction indicated by the arrow towards the second housing 12 in the vacuum phase change heat dissipation cavity 41 due to the action of a small pressure difference, and enters the porous capillary structure of the second phase change heat conduction structure 22. The gaseous working fluid dissipates heat to the outside through the second housing 12 in the porous capillary structure of the second phase change heat conduction structure 22, and under a certain vacuum condition, undergoes vapor-liquid phase change again to liquefy into water droplets. The liquid working fluid flows back into the first phase change heat conduction structure 21 to form a cycle.

[0048] In other embodiments not shown in the figure, structures such as copper ropes and copper meshes can be used to replace the sintered copper powder to form a porous capillary structure on the inner walls of the first housing 11 and the second housing 12 to achieve a similar effect.

[0049] It should be noted that the first phase change working fluid should be selected as a solid-liquid combination that is not likely to react with the material of the heat conduction housing 10, such as copper and deionized water, to reduce the loss of the heat conduction housing 10 and the liquid working fluid during the heat dissipation process.

[0050] Refer to Figure 3 , multiple groups of third phase change heat conduction structures 23 are arranged inside the first housing 11 of this embodiment, and can radiate and extend from the heating device 90 to the edge of the first housing 11. Each group of third phase change heat conduction structures 23 contains a second phase change working fluid.

[0051] Adopting the above technical solution, the third phase change heat conduction structure 23 radiates and extends from the heating device 90 to the edge of the heat conduction housing 10, raising the temperature near the third phase change heat conduction structure 23 and activating the first phase change working fluid in the first phase change heat conduction structure 21 within the corresponding range, enabling the first phase change working fluid to absorb heat and undergo gas-liquid phase change to achieve the heat absorption effect.

[0052] Theoretically, the heat of the heating device 90 can diffuse along the first housing 11 from the heating device 90 to the edge of the heat conduction housing 10, activating the first phase change working fluid in the first phase change heat conduction structure 21 within the diffusion range to absorb heat and undergo a phase change (i.e., the area far from the heating device 90), thereby completing the heat dissipation cycle described above. However, in practical applications, the thermal resistance of the first housing 11 is relatively large, and the heat diffusion area 80 of the heating device 90 on the first housing 11 is only the range near the heating device 90. There is a gap between the actual heat dissipation effect of the first phase change working fluid in the first phase change heat conduction structure 21 and the theoretical effect, which limits the overall heat dissipation efficiency of the radiator.

[0053] The heat conduction power of the first housing 11 itself, the heat transfer temperature difference ΔT, and its distance Δl can be expressed by the following relationship That is

[0054] That is, when the fixed heat transfer power Q and the transmission cross-sectional area A are given, different k values result in, and thus

[0055]

[0056] That is, the heat transfer temperature difference ΔT is proportional to the transmission distance Δl but inversely proportional to k. Generally speaking, for the same material, the farther the distance Δl, the greater the temperature difference ΔT. For a vapor-liquid two-phase isothermal product, taking a heating device using a conventional metal plate as the evaporation end for a specific phase change medium as an example, when the temperature difference ΔT is large enough, the temperature in the corresponding area is relatively low, and it is impossible to effectively activate the phase change medium in the porous capillary structure at that place to overheat, resulting in its inability to achieve the theoretical phase change heat absorption effect.

[0057] Specifically referring to Figures 3 to 6 , the first housing 11 of this embodiment includes a bottom plate 111 and a cover plate 112, and the third phase change heat conduction structure 23 includes a microscale liquid phase change channel structure 231 and a gas phase change channel structure 232. The microscale liquid phase change channel structure 231 is arranged on the bottom plate 111, and the gas phase change channel structure 232 is arranged on the cover plate 112. When the cover plate 112 is covered on the bottom plate 111, the microscale liquid phase change channel structure 231 and the gas phase change channel structure 232 are opposite to form a plurality of microscale vacuum phase change heat transfer cavities 42. The first end of the microscale vacuum phase change heat transfer cavity 42 is close to the heating device 90, and the second end is close to the edge of the first housing 11, so that the microscale vacuum phase change heat transfer cavity 42 can radiate and cover part of the first housing 11. As Figure 3As shown, a plurality of micro-scale vacuum phase change heat transfer cavities 42 are arranged circumferentially around the heating device 90 and radiate and extend from the heating device 90 to the edge of the first housing 11. A sealing cap 233 is provided at the second end of the micro-scale vacuum phase change heat transfer cavity 42 for evacuating the air inside the micro-scale vacuum phase change heat transfer cavity 42 to form a vacuum environment and injecting a second phase change working fluid into the micro-scale vacuum phase change heat transfer cavity 42. The second phase change working fluid can be deionized water, which is the same as the first phase change working fluid, or other working fluids different from the first phase change working fluid can be selected according to the situation.

[0058] In the technical solution of this embodiment, the thickness of the bottom plate 111 is preferably controlled within 0.1 - 1 mm, the thickness of the cover plate 112 is preferably controlled within 0.1 - 1 mm, and the thickness of the micro-scale vacuum phase change heat transfer cavity 42 is preferably controlled within 0.1 - 1 mm. These three parts of the structure can be welded, hot-pressed or glued to make the enclosed cavity structure achieve absolute sealing (the sealing level should at least reach a He leakage rate lower than 2*10^-8 pa.m3 / s).

[0059] For the specific working process, refer to Figure 5 , the micro-scale vacuum phase change heat transfer cavity 42 absorbs heat from the heating device 90. The heat causes the second phase change working fluid inside the micro-scale vacuum phase change heat transfer cavity 42 to absorb heat through phase change and generate steam. The steam transfers horizontally towards the sealing cap 233 end along the direction indicated by the arrow, increasing the temperature of the first housing 11 near the micro-scale vacuum phase change heat transfer cavity 42. At the same time, the heat transfers vertically upwards through the cover plate 112 and is transferred to the first phase change working fluid in the upper first phase change heat conduction structure 21. In a vacuum situation, the first phase change working fluid will undergo phase change over a larger area, promoting it to absorb more heat in the heat dissipation cycle.

[0060] For the above-mentioned micro-scale vacuum phase change heat transfer cavity 42, its internal structure varies according to different thickness dimensions. For example, Figure 6 as shown, the thickness dimension of the micro-scale vacuum phase change heat transfer cavity 42 in this embodiment is in the range of 0.1 - 0.5 mm. Micro-scale liquid phase change channel structures 231 can be formed on the bottom plate 111 by processes such as etching or electrochemical etching, and gas phase change channel structures 232 can be formed on the cover plate 112.

[0061] The gas phase change channel structures 232 on the cover plate 112 can be formed by means such as cutting, etching, electrochemical etching, or can be composed of two thin plates combined. For example, through holes are punched on the first thin plate, which is then covered on the bottom plate so that the through holes correspond to the micro-scale liquid phase change channel structures 231, and then the second thin plate is covered to seal and form the micro-scale vacuum phase change heat transfer cavity 42.

[0062] Optionally, the cross-section of the microscale liquid phase change channel structure 231 can be a rectangle as shown in Figure 6 , a trapezoid as shown in Figure 7 , or an incomplete circle as shown in Figure 8 . It can also be other suitable shapes. It should be noted that the "incomplete circle" here can be that the circular cross-section is divided into two parts along the chord, and the major arc part is retained to form the microscale liquid phase change channel structure 231.

[0063] Referring to Figure 9 , in other embodiments, such as when the thickness dimension is in the range of 0.5 - 1 mm, the microscale liquid phase change channel structure 231 can be formed by a porous structure. For example, copper powder, copper wire, copper mesh, etc. are sintered on the bottom plate 111 to form a porous structure with capillary channels, then the cover plate 112 is covered and a certain amount of liquid working medium is encapsulated, and finally the inside of the heat pipe is evacuated (such as the internal vacuum pressure reaches 0.01 - 2 Pa) and sealed to form a microscale vacuum phase change heat transfer cavity 42. In this way, when the heat generating device 90 works and releases heat, one end of the microscale vacuum phase change heat transfer cavity 42 close to the heat generating device 90 can be heated to self-start the heat cycle, enabling it to quickly perform phase change endotherm inside and transfer heat to the other end, sharing a part of the heat dissipation of the heat generating device 90.

[0064] Figure 10 shows the relationship between the distance and temperature drop of the heat transfer structure with the enhanced activated porous capillary structure and the traditional metal plate in this embodiment. The upper diagonal line is the metal plate, and the lower curve is this embodiment. The third phase change heat conduction structure 23 of this embodiment effectively improves the effective thermal conductivity of the first housing 11. Based on the formula mentioned above, combined with Figure 10 , at the same position (i.e., the same Δl), the temperature drop (i.e., ΔT) amplitude of this embodiment is much smaller than that of the traditional metal plate, so that a relatively high temperature can be maintained near the third phase change heat conduction structure 23 to activate the first phase change working medium in the upper first phase change heat conduction structure 21, enabling it to absorb sufficient heat to undergo a vapor-liquid phase change reaction under a certain vacuum, realizing phase change endotherm and continuously circulating under the action of capillary pumping force. Multiple third phase change heat conduction structures 23 extend radially, and their action ranges are connected and overlapped with each other to form a heat coverage area 70, increasing the effective range where the first phase change heat conduction structure 21 can achieve phase change heat dissipation, which is beneficial to improving the heat dissipation effect of this embodiment.

[0065] The above structure is simple and easy to implement. As shown in Figure 3 , this embodiment is equivalent to expanding the working area of the actual first phase change working medium from the projected area of the heat generating device 90 to the distal end of the third phase change heat conduction structure 23, that is, the range of the heat coverage area 70, which is beneficial to improving the heat dissipation effect of this embodiment.

[0066] As a preference, as shown in Figures 3 to 5As shown, the first end of the micro-scale vacuum phase change heat transfer cavity 42 in this embodiment corresponds to the edge of the heating device 90, and the second end of the micro-scale vacuum phase change heat transfer cavity 42 extends towards the edges of the first housing 11 and the second housing 12. For the position on the bottom plate 111 that is in direct contact with the heating device 90, the heat is relatively concentrated, the heat transfer distance is short, and the heat can directly pass through the bottom plate 111 and be transferred to the upper first phase change heat conduction structure 21. The above structure utilizes the heat diffusion region 80 near the heating device 90. When the temperature of the working heating device 90 rises to a certain level and the third phase change heat conduction structure 23 absorbs heat from the heat diffusion region 80, since the inside of the micro-scale vacuum phase change heat transfer cavity 42 is a vacuum environment, it can absorb heat and start automatically, quickly perform phase change heat transfer inside the tube body 231, and raise the overall temperature of the heat coverage area 70.

[0067] On the one hand, the third phase change heat conduction structure 23 shares a part of the heat dissipation of the heating device 90. On the other hand, it can ensure that the temperature difference ΔT1 at the head and tail of the micro-scale vacuum phase change heat transfer cavity 42 is ≤ 5 °C, that is, the third phase change heat conduction structure 23 can extend a part of the heat of the heating device 90 to the area far from the heating device 90 through the micro-scale vacuum phase change heat transfer cavity 42, and expand to form a heat coverage area 70 that nearly covers the entire bottom plate 111, thereby taking away a large amount of heat, so as to reduce the conduction of a large amount of heat only relying on the heat conduction of the material of the first housing 11 itself and increasing the heat transfer temperature difference.

[0068] Reference Figures 2 to 5 , the heat transfer structure with an enhanced activated porous capillary structure in this embodiment further includes a plurality of support columns 30. The plurality of support columns 30 are arranged at intervals in the vacuum phase change heat dissipation cavity 41, and both ends of each support column 30 are in contact with the first housing 11 and the second housing 12 respectively. The support columns 30 play a role in connecting and supporting the first housing 11 and the second housing 12, preventing the heat conduction outer shell 10 from collapsing or expanding and affecting its heat dissipation effect. At the same time, the support columns 30 can also play a guiding role, promoting the droplets formed by the exothermic liquefaction of water vapor in the second phase change heat conduction structure 22 to slide along the support columns 30 and fall into the first phase change heat conduction structure 21, which is conducive to forming a heat dissipation cycle.

[0069] As a preference, reference Figure 2 , the plurality of support columns 30 in this embodiment are arranged at intervals in a triangular array. In other embodiments not shown in the figure, the support columns can also be arranged in a rectangular or other array forms.

[0070] Reference Figures 2 to 5 , the heat transfer structure with an enhanced activated porous capillary structure in this embodiment further includes a fourth phase change heat conduction structure 24. The fourth phase change heat conduction structure 24 is arranged on the circumferential side wall of the support column 30 and is respectively connected to the first phase change heat conduction structure 21 and the second phase change heat conduction structure 22.

[0071] Reference Figure 5 , in a vacuum environment, the liquid working medium absorbs heat and vaporizes in the first phase change heat conduction structure 21, and flows towards the second housing 12 along the direction indicated by the arrow in the vacuum phase change heat dissipation cavity 41; then it enters the second phase change heat conduction structure 22 and dissipates heat to the second housing 12; the heat is dissipated through the second housing 12. After the gaseous working medium in the second phase change heat conduction structure 22 releases heat and liquefies and aggregates to form droplets, a capillary pumping force can be formed under the capillary action of the fourth phase change heat conduction structure 24, and it flows back to the heat covering area 70 of the first phase change heat conduction structure 21 along the direction indicated by the arrow in the fourth phase change heat conduction structure 24; the liquid working medium absorbs heat and vaporizes again to form a cycle.

[0072] Compared with the structure of the light wall support column, this solution can use the capillary action of the porous structure of the fourth phase change heat conduction structure 24 to drive the liquid water to flow back into the first phase change heat conduction structure 21, so that the length of the support column 30 can be appropriately increased. This solution avoids the defect of the light wall support column structure that in order to achieve the liquid water reflux, it is necessary to shorten the length of the support column to make the distance between the upper and lower housings too close, resulting in an increase in thermal resistance and affecting the overall heat dissipation effect.

[0073] Optionally, the first phase change heat conduction structure 21, the second phase change heat conduction structure 22, the third phase change heat conduction structure 23, and the fourth phase change heat conduction structure 24 in this embodiment all have a porous structure, and the pore sizes of the first phase change heat conduction structure 21, the second phase change heat conduction structure 22, the third phase change heat conduction structure 23, and the fourth phase change heat conduction structure 24 can be different to promote the circulation of the liquid working medium.

[0074] The heat transfer structure with an enhanced activated porous capillary structure in this embodiment can be applied to a VC heat pipe structure, and can also be applied to heat dissipation structures that utilize vapor-liquid two-phase changes such as loop heat pipes and loop thermosyphons. For example: heat dissipation fins and diversion pipes can also be provided on the heat conduction housing 10 of this embodiment. Specifically, the heat dissipation fins can be provided on the surface of the diversion pipe, and both ends of the diversion pipe are provided on the heat conduction housing and are connected to the vacuum phase change heat dissipation cavity 41 to form a fluid circuit. A liquid reservoir can also be provided on the heat conduction housing 10 of this embodiment. Specifically, the liquid reservoir can be provided on the first housing 11 and / or the second housing 12 and is connected to the vacuum phase change heat dissipation cavity 41. One end of the diversion pipe is connected to the liquid reservoir, and the other end is connected to the vacuum phase change heat dissipation cavity 41 to form a fluid circuit.

[0075] Embodiment Two:

[0076] Compared with Embodiment One, the heat transfer structure with an enhanced activated porous capillary structure in Embodiment Two adjusts the arrangement mode of each third phase change heat conduction structure 23. Specifically, refer to Figure 7 and Figure 8, the lengths of the third phase change heat conduction structures 23 of the second embodiment are the same and are radially arranged around the center of the heating device 90, making the third phase change heat conduction structures 23 circular, and the proximal ends of the third phase change heat conduction structures 23 are placed within the range of the heating device 90.

[0077] The strengthening and activation effect of the structure of the second embodiment is slightly worse than that of the first embodiment, but it can also achieve the effect of expanding the heat coverage area 70.

[0078] The present application also provides a heat sink. The heat sink according to this embodiment includes a heat transfer structure with a strengthened and activated porous capillary structure having all or part of the above technical features.

[0079] The heat sink of this embodiment can play the role of strengthening and activating the phase change heat conduction structure in the heat sink and improving the heat dissipation capacity.

[0080] The present application also provides a server. The server according to this embodiment includes a heat sink having all or part of the above technical features.

[0081] The server of this embodiment has the characteristic of stronger heat dissipation capacity.

[0082] The above are all the preferred embodiments of the present application. The protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A heat transfer structure for enhancing and activating a porous capillary structure, which is used to help a heat-generating device dissipate heat. Characterized in that, The heat transfer structure for enhancing and activating a porous capillary structure includes: A heat-conducting outer shell (10), including a first shell (11) and a second shell (12), the first shell (11) and the second shell (12) enclose a vacuum phase-change heat dissipation cavity (41), and the outer wall of the first shell (11) can be in contact with the heat-generating device; A first phase-change heat-conducting structure (21), arranged on the inner wall of the first shell (11), and a first phase-change working fluid is provided in the first phase-change heat-conducting structure (21); A second phase-change heat-conducting structure (22), arranged on the inner wall of the second shell (12); Multiple groups of third phase-change heat-conducting structures (23), arranged in the inner wall of the first shell (11) and capable of radially extending from the heat-generating device to the edge of the first shell (11), and a second phase-change working fluid is provided in each group of the third phase-change heat-conducting structures (23); The first end of each group of the third phase-change heat-conducting structures (23) corresponds to the edge of the heat-generating device, and the second end of each group of the third phase-change heat-conducting structures (23) extends towards the edge of the first shell (11); The first shell (11) includes a bottom plate (111) and a cover plate (112), the third phase-change heat-conducting structure (23) includes a microscale liquid phase-change channel structure (231) and a gas phase-change channel structure (232), the microscale liquid phase-change channel structure (231) is arranged on the bottom plate (111), and the liquefied second phase-change working fluid can flow in the microscale liquid phase-change channel structure (231), the gas phase-change channel structure (232) is arranged on the cover plate (112), and the vaporized second phase-change working fluid can flow in the gas phase-change channel structure (232). The cover plate (112) is covered on the bottom plate (111) so that the gas phase-change channel structure (232) corresponds to the microscale liquid phase-change channel structure (231) to form a plurality of microscale vacuum phase-change heat transfer cavities (42).

2. A heat transfer structure for enhancing and activating a porous capillary structure according to claim 1, Characterized in that, The thickness of the third phase-change heat-conducting structure (23) is between 0.1 mm and 0.5 mm, and the microscale liquid phase-change channel structure (231) is formed on the bottom plate (111) by means of etching or electrochemical corrosion.

3. A heat transfer structure for enhancing and activating a porous capillary structure according to claim 2, Characterized in that, The cross-section of the microscale liquid phase-change channel structure (231) is rectangular, trapezoidal or an incomplete circle.

4. A heat transfer structure for enhancing and activating a porous capillary structure according to claim 1, Characterized in that, The thickness of the third phase-change heat-conducting structure (23) is between 0.5 mm and 1 mm, and the microscale liquid phase-change channel structure (231) is formed on the bottom plate (111) by sintering a porous structure.

5. A heat transfer structure with an enhanced and activated porous capillary structure according to claim 4, wherein, the porous structure is one of copper ropes, copper meshes or copper powders.

6. A heat transfer structure with an enhanced and activated porous capillary structure according to claim 1, wherein, the heat transfer structure with the enhanced and activated porous capillary structure further includes a plurality of support columns (30), the plurality of support columns (30) are arranged at intervals in the vacuum phase change heat dissipation cavity (41), two ends of each support column (30) are respectively in contact with the first housing (11) and the second housing (12), the heat transfer structure with the enhanced and activated porous capillary structure further includes a fourth phase change heat conduction structure (24), the fourth phase change heat conduction structure (24) is arranged on the circumferential side wall of the support column (30) and is respectively connected with the first phase change heat conduction structure (21) and the second phase change heat conduction structure (22).

7. A radiator, wherein, it includes the heat transfer structure with the enhanced and activated porous capillary structure according to any one of claims 1 to 6.

8. A server, wherein, it includes the radiator according to claim 7.

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