A copper needle chip separation device and method

Abstract

This invention provides a copper needle chip separation device, comprising: a separation pipe; a first vortex separator, disposed at one end of the separation pipe, including a first inlet and a first outlet, the first inlet and the first outlet respectively connected to the separation pipe; and a second vortex separator, disposed at the other end of the separation pipe, including a second inlet, a second outlet, a flow-dividing vane, and at least one guide plate, the second inlet and the second outlet respectively connected to a separation channel, the flow-dividing vane connected to the periphery of the second outlet and extending obliquely outward from the second outlet along the material flow direction, and the guide plate arranged around the flow-dividing vane, which is a non-closed ring element. This invention requires minimal manual intervention, giving it significant advantages over conventional chip separation methods, such as high efficiency and good separation effect. Simultaneously, it avoids the problem of damage to the component surface, making it a novel copper needle chip separation device and method with broad application prospects.

Description

Technical Field

[0001] This invention belongs to the field of ultra-precision lathe turning technology, specifically referring to a copper needle chip separation device and method. Background Technology

[0002] Ultra-precision machine tools are widely used in the machining of millimeter-level copper pins in the semiconductor industry. During the chip cutting process, due to the small size of the copper pins, it is difficult to remove the workpiece directly after machining on a traditional lathe. Usually, the millimeter-level copper pins are cut off by the chip cutting tool and removed simultaneously with the chips. Then, the separation of the copper pins and chips is done manually under an optical microscope. This separation method is very inefficient and requires a lot of manpower and resources.

[0003] The industry is currently developing equipment capable of separating micro-components from chips. For example, document CN109015092A describes a device for separating ferrous components from chips. This device uses a lead screw nut and an electromagnetic tray to separate the components from the chips. Although it can improve the separation efficiency, in actual use, there is mutual collision between the components, chips, and the separation device, which can cause damage or even complete destruction of the component surface. This greatly reduces the component production yield. In addition, the separation process of this type of equipment is closely related to the size, density, and other parameters of the components and chips. For different components to be separated, this type of equipment is difficult to maintain a stable separation effect. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the problem of difficulty in separating copper needles from chips in the prior art, and to provide a copper needle chip separation device and method.

[0005] To solve the above-mentioned technical problems, the present invention provides a copper needle chip separation device, comprising: a separation pipe; a first vortex separator, the first vortex separator being disposed at one end of the separation pipe, comprising a first inlet and a first outlet, the first inlet and the first outlet being respectively connected to the separation pipe; and a second vortex separator, the second vortex separator being disposed at the other end of the separation pipe, comprising a second inlet, a second outlet, a flow-dividing vane, and at least one guide plate, the second inlet and the second outlet being respectively connected to the separation channel, the flow-dividing vane being connected to the periphery of the second outlet and extending obliquely outward from the second outlet along the material outflow direction, and the guide plate being disposed around the flow-dividing vane and being a non-closed annular element.

[0006] In one embodiment of the present invention, the angle between the flow divider and the material outflow direction is 20° to 80°.

[0007] In one embodiment of the present invention, the guide plate is a 3 / 4 ring, and the height of the guide plate is 0~3mm.

[0008] In one embodiment of the present invention, the first spin separator further includes a first housing, the first housing being connected to the separation channel, and the first outlet and the first inlet being respectively disposed on opposite sides of the first housing.

[0009] In one embodiment of the present invention, the first rotary separator further includes a collection tray, which is disposed inside the first housing, and the first outlet is disposed above the collection tray.

[0010] In one embodiment of the present invention, the first rotary separator further includes a chip conveying component and a chip collector, the collecting tray is provided with a chip outlet, the chip conveying component abuts against the chip outlet, and the chip collector is disposed at the discharge end of the chip conveying component.

[0011] In one embodiment of the present invention, the second vortex separator further includes a second housing, the second housing being connected to the separation channel, the second outlet and the second inlet being respectively disposed on opposite sides of the second housing, and the guide plate and the splitter vane being connected inside the second housing and disposed near the second outlet.

[0012] In one embodiment of the present invention, the second vortex separator further includes a copper needle collector, which is disposed at the discharge end of the second outlet.

[0013] To solve the above-mentioned technical problems, the present invention also provides a method for separating copper needle chips, which is implemented using the above-mentioned copper needle chip separation device, and specifically includes the following steps: S1, simultaneously injecting separation liquid into the first inlet and the second inlet, so that the liquid flow velocity at the first inlet and the second inlet is between 0.10 and 1.05 m / s, and the flow velocity at the second inlet is less than the flow velocity at the first inlet, thereby creating a swirling environment with both internal and external swirling flow inside the separation channel; S2, placing the copper needles and chips in the swirling environment for swirling separation; S3, collecting the chips from the first outlet and collecting the copper needles from the second outlet, thus completing the separation process of copper needles and chips.

[0014] In one embodiment of the present invention, the mass ratio of the separation liquid to the material to be separated is 5-20%.

[0015] The technical solution of the present invention has the following advantages compared with the prior art:

[0016] The copper needle chip separation device and method of the present invention, through the structural arrangement of the first vortex separator, the second vortex separator, and the separation pipe, provides conditions for the formation of vortices of different intensities inside, thereby enabling the chips and copper needles to be separated autonomously through the vortex. On the one hand, this method does not require much manual intervention, making it significantly more efficient and effective than conventional chip separation methods. On the other hand, by using liquid vortex separation, it avoids the problem of collisions between components, chips, and the separation device during processing, which can easily occur in conventional separation equipment, leading to damage or even complete destruction of the component surface. It is a novel copper needle chip separation device and method with broad application prospects. Attached Figure Description

[0017] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0018] Figure 1 This is a three-dimensional schematic diagram of the copper needle chip separation device in a preferred embodiment of the present invention;

[0019] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the second spin divider in the middle;

[0020] Figure 3 yes Figure 2 Schematic diagram of the cross section at point AA.

[0021] Explanation of reference numerals in the accompanying drawings: 100, First vortex separator; 110, First inlet; 120, First outlet; 130, Collection tray; 131, Chip outlet; 140, Chip conveyor; 150, Chip collector; 160, First housing; 200, Separation pipe; 300, Second vortex separator; 310, Second inlet; 320, Second outlet; 330, Copper needle collector; 340, Second housing; 341, Guide plate; 342, Diverter vane. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention. Example

[0023] This embodiment provides a copper needle chip separation device, which includes: a separation pipe 200; a first vortex separator 100, which is disposed at one end of the separation pipe 200 and includes a first inlet 110 and a first outlet 120, which are respectively connected to the separation pipe 200; and a second vortex separator 300, which is disposed at the other end of the separation pipe 200 and includes a second inlet 310, a second outlet 320, a flow divider 342, and at least one guide plate 341. The second inlet 310 and the second outlet 320 are respectively connected to the separation pipe 200. The flow divider 342 is connected to the periphery of the second outlet 320 and extends outward from the second outlet 320 at an angle along the material outflow direction. The guide plate 341 is disposed around the flow divider 342 and is a non-closed ring element.

[0024] The copper needle chip separation device of the present invention, through the structural arrangement of the first vortex separator 100, the second vortex separator 300 and the separation pipe 200, provides conditions for the formation of vortices of different intensities inside, so that the chips and copper needles can be separated autonomously by the vortex. On the one hand, this method does not require much manual intervention, which makes it significantly more efficient and effective than conventional chip separation methods. On the other hand, by using liquid vortex separation, it avoids the problem that conventional separation equipment is prone to collision between components, chips and separation device during processing, which can lead to damage or even complete destruction of the component surface. It is a new type of copper needle chip separation device with broad application prospects.

[0025] by Figure 1 The copper needle and chip separation device shown is for reference. In this embodiment, the first vortex separator 100, the separation pipe 200, and the second vortex separator 300 are arranged sequentially from top to bottom. Both copper needles and chips enter the device through the first vortex separator 100 for vortex separation. Afterward, the chips can be discharged from the first outlet 120, and the copper needles can be discharged from the second outlet 320, thereby achieving the separation of copper needles and chips. In this embodiment, the first vortex separator 100 and the second vortex separator 300 are respectively connected to external circulation pumps to achieve the separation process of materials with different masses or surface areas by controlling the flow rate and velocity of the separation liquid. Furthermore, they can also be connected to external controllers to set parameters for the circulation pumps or to install valve switches at the first and second inlets and outlets, thereby further improving the flexibility and controllability of the device.

[0026] See Figure 1As shown, in this embodiment, the first vortex separator 100 further includes a first housing 160, which is connected to the separation pipe 200. The first outlet 120 and the first inlet 110 are respectively disposed on opposite sides of the first housing 160. The first housing 160 is preferably a funnel-shaped element with a larger upper opening and a smaller lower opening. Its upper end is connected to the outside, and its lower end is connected to the separation pipe 200. The first housing 160 is used to connect the first outlet 120 and the first inlet 110, and the first inlet 110 and the first outlet 120 are interconnected. In this embodiment, the first inlet 110 is disposed on the side wall of the first housing 160, and the first outlet 120 is disposed at the top of the first housing 160. In this embodiment, the first vortex separator 100 further includes a collection tray 130, which is disposed above the first housing 160. It is preferably an upward-opening box, and its cross-section matches the cross-sectional shape, area, and other parameters of the first housing 160. The collection tray 130 has a certain height and volume. The first outlet 120 extends from the top of the first housing 160 into the collection tray 130, and the bottom of the collection tray 130 is sealed at the junction with the first outlet 120. This structure allows the material discharged from the first outlet 120 to be placed inside the collection tray 130, which is convenient for recycling.

[0027] See Figure 1As shown, the first rotary separator 100 also includes a chip conveyor 140 and a chip collector 150. The collection tray 130 is provided with a chip outlet 131. The chip conveyor 140 abuts against the chip outlet 131, and the chip collector 150 is disposed at the discharge end of the chip conveyor 140. In this embodiment, the collection tray 130 includes a bottom surface and a side wall with a certain height surrounding the bottom surface. The chip outlet 131 is disposed on the side wall to receive and transfer the material inside the collection tray 130. The chip conveyor 140 is correspondingly disposed below the chip outlet 131. It is used to receive the material discharged from the chip outlet 131 and transfer it to the chip collector 150. Correspondingly, the chip collector 150 is disposed at the bottom of the chip conveyor 140. It is used to receive the material discharged by the chip conveyor 140. The operator can disassemble and recycle the chip collector 150 to recycle the chips separated inside. Specifically, in this embodiment, the chip conveying component 140 includes a driving mechanism, a driving wheel, a driven wheel, and a conveyor belt sleeved on the outside of the driving wheel and the driven wheel. The conveyor belts are connected end to end to form a closed transport loop. The driving mechanism drives the driving wheel to rotate, and the driving wheel drives the belt on it for transmission. The driven wheel is used to maintain the transport surface of the chip conveying mechanism horizontally, thereby ensuring the stability of the transmission process. In other embodiments, the chip conveying component 140 can be configured as an inclined guide groove, a horizontally moving conveyor plate, or other structures that can achieve the purpose of guiding and transporting materials. The present invention does not limit the specific configuration of the transmission components. In this embodiment, the chip collector 150 is preferably a collection box with an open top. The receiving opening on its upper surface corresponds to the discharge end of the chip conveying component 140. It can be fixedly connected to the chip collector 150 or detachably connected to the bottom of the chip collector 150 for easy overall disassembly and recycling. Similarly, the present invention does not limit the specific structure and connection method of the chip collector 150.

[0028] See Figure 1 As shown, in this embodiment, the separation pipe 200 is set as a cylindrical pipe extending in the vertical direction, preferably made of acrylic material. This shape can ensure that internal and external swirling flows are formed inside, thereby realizing a complete separation process.

[0029] See Figures 1 to 3As shown, the second vortex separator 300 is disposed at the bottom end of the separation pipe 200. It also includes a second housing 340, which is connected to the separation pipe 200. The second outlet 320 and the second inlet 310 are respectively disposed on opposite sides of the second housing 340. The guide plate 341 and the flow-dividing vane 342 are both connected inside the second housing 340 and disposed near the second outlet 320. In this embodiment, the second vortex separator 300 is used to receive and recover the separated copper needles. The second housing 340 has the same structure as the first housing 160, but its installation method is opposite to that of the first housing 160. Thus, the first housing 160 and the second housing 340 are symmetrically arranged with the midpoint of the separation pipe 200 as the center, that is, the second housing 340 is inverted relative to the first housing 160. Furthermore, in this embodiment, the second inlet 310 is disposed on the side wall of the second housing 340, and the second outlet 320 is disposed on the lower bottom surface of the second housing 340 and located at the center of its lower bottom surface. In this embodiment, the second outlet 320 is preferably an outlet pipe that penetrates the lower bottom surface of the second housing 340, and the part of it located inside the second housing 340 is higher than the lower bottom surface of the second housing 340. One end of the diverter wing plate 342 is connected to the top of the second outlet 320 located inside the second housing 340, and the other end is connected to the lower bottom surface inside the second housing 340. Thus, the diverter wing plate 342 and the second outlet 320 together form a volcano-shaped component. That is, the functional surface of the diverter wing plate 342 in this embodiment is an inwardly concave quarter-circular arc surface. Furthermore, in this embodiment, the diversion wing plate 342 is non-planar, and its inclination angle with the material discharge direction gradually decreases from the second outlet 320 toward the lower bottom surface of the second housing 340. Specifically, the angle between the diversion wing plate 342 and the material discharge direction gradually changes between 20° and 80°. In actual use, the separation of copper needles and chips of different sizes can be achieved by adjusting the above angle, thereby improving the applicability of this copper needle and chip separation device. Furthermore, under the above conditions, this copper needle and chip separation device can achieve the separation process of copper needles and chips with diameters from 10μm to 300μm.

[0030] See Figure 2 and Figure 3As shown, this embodiment includes two guide plates 341, both of which are arranged around the flow divider 342. Specifically, the two guide plates 341 are preferably concentric annular elements with different diameters. Each guide plate 341 is a 3 / 4 ring with the same opening orientation. Further, in this embodiment, the height of the guide plates 341 is 0~3mm, preferably 1.5mm. Within the above height range, the guide plates 341 can cooperate with the flow divider 342 to obtain the maximum separation sharpness and achieve the optimal separation effect. Specifically, in this embodiment, the structural arrangement of the flow divider 342 and the guide plates 341 can generate a weak secondary vortex at the second outlet 320, thereby effectively controlling the turbulence intensity during discharge, making the internal material distribution more uniform and stable, and thus avoiding collision damage between the copper needles and the equipment wall under excessive vortex action.

[0031] In this embodiment, the second vortex separator 300 further includes a copper needle collector 330, which is disposed at the discharge end of the second outlet 320. In this embodiment, the copper needle collector 330 is preferably a recycling box connected to the bottom of the separation pipe 200, which is detachably connected to the bottom of the second vortex separator 300. Similarly, the present invention does not limit the specific structure and connection method of the copper needle collector. Example

[0032] This embodiment provides a method for separating copper needle chips, which is implemented using the copper needle chip separation device in Embodiment 1, and specifically includes the following steps:

[0033] S1. Separation liquid is simultaneously injected into the first inlet 110 and the second inlet 310, so that the liquid flow velocity at the first inlet 110 and the second inlet 310 is between 0.10 and 1.05 m / s, and the flow velocity at the second inlet 310 is less than that at the first inlet 110. This creates a swirling environment with both internal and external swirling flow inside the separation pipe 200. In this embodiment, the flow velocity at the first inlet 110 is 1.05 m / s, and the flow velocity at the second inlet 310 is 0.50 m / s. The separation liquid is an oil with a fluid concentration of 10%. In other embodiments, the mass ratio of the separation liquid to the material to be separated is 5-20%. The separation liquid is preferably an oil. This enables the separation and processing of copper needles with a diameter of 550 μm to 15 μm.

[0034] S2. The copper needles and chips are placed in a vortex separator environment for vortex separation. This structure makes the vortex generated by the second vortex separator 300 smaller than that of the first vortex separator 100. As a result, an inner vortex and an outer vortex surrounding the inner vortex are generated simultaneously in the separation pipe 200. Due to the different flow velocities of the inner and outer vortices, an unequal pressure difference is generated inside the separation pipe 200, which in turn forms a buoyancy difference liquid surface in the vertical direction. When the copper needles and chips fall to this liquid surface, the chips, due to their larger specific surface area, experience a relatively greater buoyancy. When the buoyancy they receive is greater than their own weight, the chips will move towards the first vortex separator 100 and be discharged from the first outlet 120 under the action of the first vortex separator 100. At the same time, due to the smaller specific surface area of ​​the copper needles, the buoyancy they receive is less than their own weight. As a result, under the action of centrifugal rotation, they fall along the inner wall of the separation pipe 200 into the second vortex separator 300 and are discharged through the second outlet 320, thereby realizing the overall separation process.

[0035] S3. Collect the chips from the first outlet 120 and collect the copper needles from the second outlet 320, thus completing the separation process of the copper needles and chips. Specifically, in this embodiment, after the chips are discharged through the first outlet 120, they are conveyed to the chip collector 150 by the chip conveyor 140, and the copper needles are conveyed to the copper needle collector 330 through the second outlet 320. At the same time, the first outlet 120 and the second outlet 320 can also be connected to the first inlet 110 or the second inlet 310, thereby realizing the recycling of the separation liquid.

[0036] In summary, the copper needle chip separation device and method of the present invention, through the structural arrangement of the first vortex separator 100, the second vortex separator 300, and the separation pipe 200, provides conditions for the formation of vortices of different intensities within them, thereby enabling the chips and copper needles to be autonomously separated through the vortex. On the one hand, this method does not require much manual intervention, making it significantly more efficient and effective than conventional chip separation methods. On the other hand, by using liquid vortex separation, it avoids the problem of collisions between components, chips, and the separation device during processing, which can easily occur in conventional separation equipment, leading to damage or even complete destruction of the component surface. It is a novel copper needle chip separation device and method with broad application prospects.

[0037] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A copper needle chip separation device, characterized in that: include: Separate pipes; A first vortex separator is disposed at one end of the separation pipe. It includes a first inlet, a first outlet, a first housing, a collection tray, a chip conveying component, and a chip collector. The first inlet and the first outlet are respectively connected to the separation pipe. The first housing is connected to the separation pipe. The first outlet and the first inlet are respectively disposed on opposite sides of the first housing. The collection tray is disposed inside the first housing. The first outlet is disposed above the collection tray. The collection tray has a chip outlet. The chip conveying component abuts against the chip outlet. The chip collector is disposed at the discharge end of the chip conveying component. The second vortex separator is located at the other end of the separation pipe. It includes a second inlet, a second outlet, a flow-dividing vane, at least one guide plate, a second housing, and a copper needle collector. The second inlet and the second outlet are respectively connected to the separation pipe. The flow-dividing vane is connected to the periphery of the second outlet and extends outward from the second outlet at an angle along the material outflow direction. The guide plate is arranged around the flow-dividing vane and is a non-closed ring element. The second housing is connected to the separation pipe. The second outlet and the second inlet are respectively located on opposite sides of the second housing. The guide plate and the flow-dividing vane are both connected inside the second housing and located near the second outlet. The copper needle collector is located at the discharge end of the second outlet.

2. The copper needle chip separation device according to claim 1, characterized in that: The angle between the flow divider and the material outflow direction is 20°~80°.

3. The copper needle chip separation device according to claim 1, characterized in that: The guide plate is a 3 / 4 circular ring, and the height of the guide plate is 0~3mm.

4. A method for separating copper needle chips, characterized in that: The copper needle chip separation device according to any one of claims 1 to 3 is used to implement the process, specifically including the following steps: S1. Simultaneously inject separation liquid into the first inlet and the second inlet, so that the liquid flow velocity at the first inlet and the second inlet is between 0.10 and 1.05 m / s, and the flow velocity at the second inlet is less than the flow velocity at the first inlet, thereby creating a swirling environment with both internal and external swirling flow inside the separation pipe; S2. Place the copper needle and chips in the spinning environment for spinning operation; S3. Collect the chips from the first outlet and collect the copper needles from the second outlet, thus completing the separation process of the copper needles and chips.

5. The copper needle chip separation method according to claim 4, characterized in that: The mass ratio of the separation liquid to the material to be separated is 5-20%.

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