A semiconductor component package

Abstract

The present invention discloses a semiconductor component package, which specifically relates to the semiconductor field, including a chip plug-in board, a semiconductor chip is arranged on the top of the chip plug-in board, a package is fixedly installed on the outer wall of the semiconductor chip, a pressure plate is slidably connected to the outer wall of the package, a positioning rod is arranged on the outer wall of the chip plug-in board, a guide rod is inserted inside the positioning rod, the number of the guide rods is set to two, the outer walls of the two guide rods are both sleeved with a first spring, the first spring is fixedly installed on one side of the positioning rod, the outer wall of the positioning rod is hinged with a supporting connecting rod, and the outer wall of the supporting connecting rod is fixedly installed with a double-layer slider. The present invention sets a supporting connecting rod and a push plate, first presses the pressing plate, so that the pressing plate pushes the pushing plate to slide, and finally makes the positioning rod fit on the socket of the chip plug-in board, positions the pins of the semiconductor chip, and allows the pins to be inserted into the socket, so as to prevent the pins from being misaligned with the socket, resulting in pin damage.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more particularly to a semiconductor component package. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, semiconductors are very important. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential semiconductor material in various applications.

[0003] In the prior art, an integrated circuit chip using a DIP dual in-line package needs to be inserted into a chip socket with a DIP structure, and the two rows of pins of the chip using the DIP package need to be aligned one by one and inserted into the chip socket. When the DIP packaged chip is inserted or removed from the chip socket, special care needs to be taken to prevent damage to the chip pins. Therefore, how to design a semiconductor component package that can quickly align the chip pins with the chip socket for installation has become a problem that we currently need to solve. Summary of the invention

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a semiconductor component package, which is provided with a supporting link and a push plate. First, the pressure plate is pressed so that the pressure plate pushes the push plate to slide, and finally the positioning rod is fitted on the socket of the chip plug-in board, so as to position the pins of the semiconductor chip and allow the pins to be inserted into the socket of the chip plug-in board to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor component package, comprising a chip plug-in board, a semiconductor chip is arranged on the top of the chip plug-in board, a package body is fixedly installed on the outer wall of the semiconductor chip, a pressure plate is slidably connected to the outer wall of the package body, a positioning rod is arranged on the outer wall of the chip plug-in board, a guide rod is inserted into the interior of the positioning rod, the number of the guide rods is set to two, the outer walls of the two guide rods are sleeved with a first spring, the first spring is fixedly installed on one side of the positioning rod, the outer wall of the positioning rod is hinged with a support connecting rod, and the outer wall of the support connecting rod is fixedly installed with a double The double-layer slider has an insert rod inserted inside, the insert rod is inserted inside the supporting connecting rod, the outer wall of the pressure plate is fixedly connected with a push plate, the push plate is slidably connected to the inside of the packaging body, the push plate is fixedly connected to the first sleeve frame at one end away from the pressure plate, the first sleeve frame is slidably connected to the inside of the packaging body, the insert rod is slidably connected to the inside of the first sleeve frame, the outer wall of the double-layer slider is slidably connected with a slide groove, the slide groove is opened inside the packaging body, a first guide groove is opened inside the packaging body, the insert rod is slidably connected to the inside of the first guide groove, and a second guide groove is opened inside the packaging body.

[0006] In a preferred embodiment, a telescopic round rod is slidably connected to the interior of the second guide groove, the telescopic round rod is arranged on one side of the first sleeve frame, and the outer wall of the telescopic round rod is slidably connected to the second sleeve frame.

[0007] In a preferred embodiment, the second sleeve frame is slidably connected to the interior of the packaging body, one end of the second sleeve frame is fixedly connected to a telescopic square rod, and the telescopic square rod is fixedly connected to the top of the positioning rod.

[0008] In a preferred embodiment, an airbag is fixedly mounted on one side of the packaging body, the pressure plate is fixedly mounted on one side of the airbag, and a second spring is fixedly mounted inside the airbag.

[0009] In a preferred embodiment, the outer wall of the airbag is fixedly connected to an exhaust pipe, the exhaust pipe is fixedly installed on the outer wall of the packaging body, and the interior of the exhaust pipe is rotatably connected to a fan blade.

[0010] In a preferred embodiment, a synchronous belt is sleeved on the outer wall of the fan blade, and a plurality of pressing blocks are provided on the outer wall of the synchronous belt. The plurality of pressing blocks are fixedly installed inside the exhaust pipe.

[0011] In a preferred embodiment, a rotating rod is inserted into the interior of the synchronous belt, and the number of the rotating rods is set to be multiple. The multiple rotating rods are linearly and equidistantly arranged in sequence with respect to the inner wall of the synchronous belt. The rotating rod is rotatably connected to the interior of the exhaust pipe, and the bottom of the rotating rod is fixedly connected to an exhaust part, and the exhaust part is rotatably connected to the exhaust hole of the exhaust pipe.

[0012] In a preferred embodiment, a card slot is provided on the top of the packaging body, a stepped slide slot is provided on the top of the pressure plate, and a U-shaped plug plate is slidably connected inside the stepped slide slot.

[0013] Technical effects and advantages of the present invention:

[0014] 1. The present invention is provided with a supporting connecting rod and a push plate. First, the pressing plate is pressed, so that the pressing plate pushes the push plate to slide, and finally the positioning rod squeezes the first spring to contract, and then the package is placed on the top of the chip plug-in board, and the pressing of the pressing plate is released, so that the first spring is reset and extended to push the positioning rod to fit on the socket of the chip plug-in board, and then the package is pushed, so that the protruding block on the positioning rod also fits on the outer wall of the socket of the semiconductor chip, and then the pin positioning of the semiconductor chip is completed, so that the semiconductor chip can directly insert the pin into the socket of the chip plug-in board, and prevent the pin from being misaligned with the socket, resulting in damage to the pin;

[0015] 2. The present invention is provided with an air bag and an exhaust member. When the pressure plate is pressed, the pressure plate will squeeze the air bag to discharge the gas inside the air bag into the exhaust pipe. The gas will enter the exhaust pipe and blow the fan blades to rotate. The gas will be discharged from the exhaust pipe through the exhaust member to clean the dust on the chip plug-in board. The gas passing through the exhaust member will be constrained and deformed into a strip shape to increase the flow rate and flushing pressure of the gas. The rotation of the fan blade drives the rotating rod to rotate through the synchronous belt. The rotation of the rotating rod drives the exhaust member to rotate, causing the gas discharged by the exhaust member to rotate, thereby increasing the range that the exhaust member can blow to prevent the gas from being unable to blow to the socket of the chip plug-in board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 It is a schematic diagram of the rod insertion structure of the present invention.

[0018] Figure 3 It is a cross-sectional view of the packaging structure of the present invention.

[0019] Figure 4 For the present invention Figure 3 A-section structure enlarged view.

[0020] Figure 5 It is a cross-sectional view of the semiconductor chip structure of the present invention.

[0021] Figure 6 It is a cross-sectional view of the exhaust pipe structure of the present invention.

[0022] Figure 7 For the present invention Figure 6 Enlarged view of the structure of part B.

[0023] The accompanying drawings are marked as follows: 1. chip plug-in board; 2. semiconductor chip; 3. package body; 4. pressure plate; 5. positioning rod; 6. guide rod; 7. first spring; 8. supporting connecting rod; 9. double-layer slider; 10. plug-in rod; 11. push plate; 12. first set frame; 13. slide groove; 14. first guide groove; 15. second guide groove; 16. telescopic round rod; 17. second set frame; 18. telescopic square rod; 19. airbag; 20. second spring; 21. exhaust pipe; 22. fan blade; 23. synchronous belt; 24. pressure block; 25. rotating rod; 26. exhaust member; 27. slot; 28. stepped slide groove; 29. ​​U-shaped plug-in board. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Example 1

[0026] Refer to the instruction manual Figure 1-4 A semiconductor component package according to an embodiment of the present invention includes a chip plug-in board 1, which is composed of a substrate body and a socket. Figure 1 A semiconductor chip 2 is arranged on the top of the chip plug board 1. The semiconductor chip 2 is composed of a semiconductor chip body and pins. A package body 3 is fixedly mounted on the outer wall of the semiconductor chip 2. A pressure plate 4 is slidably connected to the outer wall of the package body 3. For details, see Figure 2 The outer wall of the chip plug board 1 is provided with a positioning rod 5. Through the setting of the outer wall stopper of the positioning rod 5, the auxiliary positioning rod 5 is fitted to the outer wall of the socket of the chip plug board 1. A guide rod 6 is inserted into the interior of the positioning rod 5. The number of guide rods 6 is set to two. The outer walls of the two guide rods 6 are sleeved with a first spring 7, and the first spring 7 is fixedly installed on one side of the positioning rod 5. The outer wall of the positioning rod 5 is hinged with a supporting connecting rod 8. The outer wall of the supporting connecting rod 8 is fixedly installed with a double-layer slider 9. The double-layer slider 9 is provided with one layer of a square slider and the other layer of a round slider, so that the square slider of the double-layer slider 9 can be rotated without sliding to the end of the slide groove 13. The supporting connecting rod 8 will be limited by the square slider of the double-layer slider 9 and cannot be rotated. The double-layer slider 9 is inserted with an insertion rod 10, and the insertion rod 10 is inserted into the interior of the supporting connecting rod 8. See details. Figure 3The outer wall of the pressing plate 4 is fixedly connected to a push plate 11, which is slidably connected to the inside of the packaging body 3. The end of the pushing plate 11 away from the pressing plate 4 is fixedly connected to a first sleeve frame 12, which is slidably connected to the inside of the packaging body 3. The insertion rod 10 is slidably connected to the inside of the first sleeve frame 12. Figure 4 The outer wall of the double-layer slider 9 is slidably connected with a slide groove 13, the slide groove 13 is opened inside the packaging body 3, the interior of the packaging body 3 is provided with a first guide groove 14, the insertion rod 10 is slidably connected inside the first guide groove 14, and the interior of the packaging body 3 is provided with a second guide groove 15.

[0027] It should be noted that when the semiconductor chip 2 needs to be inserted into the slot of the chip plug-in board 1, the pressing plate 4 can be pressed to move a certain distance, so that the pressing plate 4 pushes the push plate 11 to slide along the inner wall of the package body 3, and then the push plate 11 drives the insertion rod 10 to slide along the inside of the first guide groove 14 by pushing the first set frame 12, and the insertion rod 10 pulls the double-layer slider 9 to move, and the double-layer slider 9 will drive the supporting connecting rod 8 to move and slide along the inside of the slide groove 13, and the supporting connecting rod 8 moves and pulls the positioning rod 5 to move in the direction of the push plate 11, so that the positioning rod 5 moves along the outer wall of the guide rod 6 and squeezes the first spring 7 to contract, and then the package body 3 is roughly aligned and placed on the top of the chip plug-in board 1, and the pressure of the pressing plate 4 is released. The first spring 7 on the outer wall of the guide rod 6 is reset and extended to push the positioning rod 5 to reset, so that the positioning rod 5 is stuck on the two rows of sockets corresponding to the pins of the semiconductor chip 2, and then the package body 3 is pushed to move, so that the package body 3 drives the positioning rod 5 to move through the supporting connecting rod 8 and the telescopic square rod 18, so that the protruding card block on the positioning rod 5 is also attached to the outer wall of the socket of the semiconductor chip 2, and then the positioning rod 5 completes the positioning of the pins of the semiconductor chip 2, so that the semiconductor chip 2 can be directly inserted into the socket of the chip plug board 1, so as to achieve the effect of quickly connecting the pins with the socket, and the user does not need to align the pins of the semiconductor chip 2 with the socket of the chip plug board 1 one by one, so as to prevent the pins from being misaligned with the socket, resulting in damage to the pins;

[0028] It should be noted that when the chip plug-in board 1 needs to be separated from the semiconductor chip 2, the pressing plate 4 can be fully pressed, so that the pressing plate 4 pushes the first set frame 12 through the push plate 11 to drive the insertion rod 10 to slide along the inside of the first guide groove 14, and then the insertion rod 10 pulls the double-layer slider 9 to move, and the movement of the double-layer slider 9 will drive the supporting connecting rod 8 to move along the inside of the slide groove 13. At the same time, the movement of the supporting connecting rod 8 pulls the telescopic square rod 18 to move through the positioning rod 5, and the movement of the telescopic square rod 18 drives the second set frame 17 to squeeze the telescopic round rod 16 When the first frame 12 drives the insertion rod 10 to move to the corner of the first guide groove 14, the double-layer slider 9 drives the supporting connecting rod 8 to slide to the end of the slide groove 13, so that the square slider of the double-layer slider 9 can no longer prevent the supporting connecting rod 8 from rotating. At the same time, the telescopic round rod 16 also slides to the corner of the second guide groove 15, and then as the pressure plate 4 pushes the first frame 12 to continue to move through the push plate 11, the first frame 12 starts to drive the insertion rod 10 to move along the second guide groove 15. The push plate 11 moves along the remaining straight groove inside the first guide groove 14, so that the insertion rod 10 no longer drives the double-layer slider 9 to move, and the push plate 11 pushes the telescopic round rod 16 to move in the process of moving along the straight groove of the first guide groove 14, so that the telescopic round rod 16 moves along the inclined groove of the second guide groove 15, and then the telescopic round rod 16 is squeezed by the inclined groove of the second guide groove 15 and continues to shrink, and the contraction of the telescopic round rod 16 pulls the second set frame 17 to move, and the movement of the second set frame 17 drives the telescopic square rod 18 to move, and the movement of the telescopic square rod 18 drives the positioning rod 5 to squeeze the supporting connecting rod 8, so that the supporting connecting rod 8 that stops being limited by the upper type slider of the double-layer slider 9 is rotated under pressure, and the rotation of the supporting connecting rod 8 applies pressure to the chip plug board 1 and the package body 3, so that the package body 3 is squeezed and lifted, and then the package body 3 drives the pins of the semiconductor chip 2 to be pulled out from the socket of the chip plug board 1, so as to achieve the effect of vertically separating the chip plug board 1 from the semiconductor chip 2, and prevent the user from being unable to vertically pull out the semiconductor chip 2, resulting in bending and damage of the semiconductor chip 2;

[0029] It should be noted that when the telescopic square rod 18 drives the positioning rod 5 to squeeze the supporting link 8 and makes the supporting link 8 rotate to fit with the top of the chip plug-in board 1, the pressing plate 4 can be stopped, and then the U-shaped plug-in board 29 is pulled to slide along the stepped slide groove 28, so that the U-shaped plug-in board 29 can be inserted into the groove of the card slot 27, and then the U-shaped plug-in board 29 limits the pressing plate 4 through the card slot 27 to prevent the pressing plate 4 from resetting, so that the supporting link 8 is always in contact with the top of the chip plug-in board 1, so that after the package body 3 is hit, the force borne by the package body 3 can be partially shared by the supporting link 8 and transmitted to the chip plug-in board 1, preventing the force borne by the package body 3 from being directly transmitted to the socket of the chip plug-in board 1 through the pins of the semiconductor chip 2, causing the socket of the chip plug-in board 1 and the pins of the semiconductor chip 2 to be deformed and damaged, so as to achieve the effect of improving the stability of the installation of the chip plug-in board 1 and the semiconductor chip 2.

[0030] Example 2

[0031] Reference Manual Attached Figure 4-7 The second guide groove 15 is slidably connected to a telescopic round rod 16, which is arranged on one side of the first frame 12. The outer wall of the telescopic round rod 16 is slidably connected to a second frame 17, which is slidably connected to the inside of the packaging body 3. One end of the second frame 17 is fixedly connected to a telescopic square rod 18. Figure 5 , the telescopic square rod 18 is fixedly connected to the top of the positioning rod 5, see Figure 6 An airbag 19 is fixedly mounted on one side of the package body 3, a pressure plate 4 is fixedly mounted on one side of the airbag 19, a second spring 20 is fixedly mounted inside the airbag 19, an exhaust pipe 21 is fixedly connected to the outer wall of the airbag 19, and the exhaust pipe 21 is fixedly mounted on the outer wall of the package body 3, see Figure 7 The exhaust pipe 21 is rotatably connected to a fan blade 22, and a synchronous belt 23 is sleeved on the outer wall of the fan blade 22. A plurality of pressing blocks 24 are arranged on the outer wall of the synchronous belt 23. Through the arrangement of the pressing blocks 24, the pressing blocks can press the synchronous belt 23 on the outer wall of the rotating rod 25 to prevent the synchronous belt 23 from jumping when driving the rotating rod 25 to rotate. The plurality of pressing blocks 24 are fixedly installed inside the exhaust pipe 21, and a rotating rod 25 is inserted inside the synchronous belt 23. The number of the rotating rods 25 is set to be multiple, and the plurality of rotating rods 25 are linearly and equidistantly arranged with respect to the inner wall of the synchronous belt 23. The rotating rod 25 is rotatably connected to the inside of the exhaust pipe 21, and an exhaust member 26 is fixedly connected to the bottom of the rotating rod 25. Through the exhaust member 2 The setting of the internal through hole 6 expands the blowing range of the gas passing through the exhaust member 26, and the flow speed of the gas and the flushing pressure on the dust will increase. The exhaust member 26 is rotatably connected to the exhaust hole of the exhaust pipe 21. A card slot 27 is provided on the top of the package body 3. Through the setting of the card slot 27, not only can the U-shaped plug 29 be inserted, but also the heat dissipation efficiency of the package body 3 can be improved. A stepped slide groove 28 is provided on the top of the pressing plate 4. Through the setting of the stepped slide groove 28, after the U-shaped plug 29 slides to a certain position, the support at the bottom of the U-shaped plug 29 disappears, so that the U-shaped plug 29 can be pressed down and inserted into the card slot 27. The U-shaped plug 29 is slidably connected inside the stepped slide groove 28.

[0032] It should be noted that when the pressing plate 4 is pressed, the pressing plate 4 will squeeze the airbag 19, so that the gas inside the airbag 19 is discharged into the exhaust pipe 21 and squeezes the second spring 20 to contract. When the gas enters the exhaust pipe 21, it first blows the fan blade 22 to rotate before entering the cavity inside the exhaust pipe 21. The gas entering the cavity inside the exhaust pipe 21 will be discharged through the exhaust member 26, and the gas will be constrained and deformed into a strip shape after passing through the exhaust member 26 to increase the flow rate of the gas and the flushing pressure of the gas, so as to achieve a better effect of cleaning the dust on the chip plug-in board 1 and prevent the flushing pressure of the gas from being insufficient, thereby preventing the dust from being discharged. As a result, the dust accumulated inside the socket of the chip plug board 1 cannot be blown out, affecting the contact effect between the socket of the chip plug board 1 and the pins of the semiconductor chip 2. The rotation of the fan blade 22 drives the synchronous belt 23 to rotate, and the rotation of the synchronous belt 23 drives the rotating rod 25 to rotate. The rotation of the rotating rod 25 drives the exhaust member 26 to rotate, so that the gas discharged by the exhaust member 26 can rotate, thereby increasing the range that the exhaust member 26 can blow, and preventing the gas from failing to blow onto the socket of the chip plug board 1. It should be noted that when the pressing plate 4 stops being pressed, the second spring 20 will reset and extend, driving the airbag 19 to be refilled with gas and pushing the pressing plate 4 to reset.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor component package, comprising a chip interposer, characterized in that: A semiconductor chip is arranged on the top of the chip plug-in board, a packaging body is fixedly installed on the outer wall of the semiconductor chip, a pressure plate is slidably connected to the outer wall of the packaging body, a positioning rod is arranged on the outer wall of the chip plug-in board, a guide rod is inserted into the interior of the positioning rod, the number of the guide rods is set to two, the outer walls of the two guide rods are both sleeved with a first spring, the first spring is fixedly installed on one side of the positioning rod, the outer wall of the positioning rod is hinged with a supporting connecting rod, a double-layer slider is fixedly installed on the outer wall of the supporting connecting rod, an insert rod is inserted into the interior of the double-layer slider, and the insert rod is inserted into the interior of the supporting connecting rod.

2. The semiconductor device package according to claim 1, characterized in that: The outer wall of the pressure plate is fixedly connected to a push plate, and the push plate is slidably connected to the inside of the packaging body. The end of the push plate away from the pressure plate is fixedly connected to a first sleeve frame, and the first sleeve frame is slidably connected to the inside of the packaging body. The insertion rod is slidably connected to the inside of the first sleeve frame. The outer wall of the double-layer slider is slidably connected to a slide groove, and the slide groove is opened in the interior of the packaging body. A first guide groove is opened in the interior of the packaging body. The insertion rod is slidably connected to the inside of the first guide groove, and a second guide groove is opened in the interior of the packaging body.

3. The semiconductor device package according to claim 2, characterized in that: A telescopic round rod is slidably connected inside the second guide groove. The telescopic round rod is arranged on one side of the first sleeve frame. The outer wall of the telescopic round rod is slidably connected to the second sleeve frame.

4. The semiconductor device package according to claim 3, characterized in that: The second sleeve frame is slidably connected to the interior of the packaging body, one end of the second sleeve frame is fixedly connected to a telescopic square rod, and the telescopic square rod is fixedly connected to the top of the positioning rod.

5. The semiconductor device package according to claim 1, characterized in that: An airbag is fixedly mounted on one side of the packaging body, the pressure plate is fixedly mounted on one side of the airbag, and a second spring is fixedly mounted inside the airbag.

6. The semiconductor device package according to claim 5, characterized in that: The outer wall of the airbag is fixedly connected with an exhaust pipe, the exhaust pipe is fixedly installed on the outer wall of the packaging body, and the interior of the exhaust pipe is rotatably connected with a fan blade.

7. The semiconductor device package according to claim 6, characterized in that: The outer wall of the fan blade is sleeved with a synchronous belt, and the outer wall of the synchronous belt is provided with a plurality of pressing blocks, and the plurality of pressing blocks are fixedly installed inside the exhaust pipe.

8. The semiconductor device package according to claim 7, characterized in that: A rotating rod is inserted into the interior of the synchronous belt, and the number of the rotating rods is set to be multiple. The multiple rotating rods are linearly and equidistantly arranged in sequence with respect to the inner wall of the synchronous belt. The rotating rod is rotatably connected to the interior of the exhaust pipe, and an exhaust component is fixedly connected to the bottom of the rotating rod, and the exhaust component is rotatably connected to the exhaust hole of the exhaust pipe.

9. The semiconductor device package according to claim 1, characterized in that: A card slot is provided on the top of the packaging body, a stepped slide slot is provided on the top of the pressing plate, and a U-shaped plug plate is slidably connected inside the stepped slide slot.

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