Light emitting unit, display panel, and electronic device

Abstract

The application provides a light-emitting unit, a display panel and an electronic device. The light-emitting unit comprises a light-emitting chip, a color conversion layer and a pin; wherein the light-emitting chip is used for emitting light of a first color; the color conversion layer is located on one side of the light-emitting chip along a direction perpendicular to the thickness direction of the light-emitting unit, and is used for emitting light of another color under the excitation of the light emitted by the light-emitting chip. The light-emitting unit can emit light of another color different from the first color emitted by the light-emitting chip, and the thickness of the light-emitting unit is small.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a light-emitting unit, a display panel, and an electronic device. Background Technology

[0002] Micro LED (micron-sized light-emitting diode) display technology refers to a display technology that uses self-emissive LEDs on the micron scale as light-emitting units, assembling these units onto a driving substrate to form a high-density LED array. Due to its small size, high integration, and self-emissive nature, Micro LEDs offer significant advantages over LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) displays in terms of brightness, resolution, contrast ratio, energy consumption, lifespan, response speed, and thermal stability. However, existing light-emitting units are relatively thick. Summary of the Invention

[0003] This application provides a light-emitting unit, a display panel, and an electronic device, aiming to solve the problem of excessive thickness in the light-emitting unit.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is to provide a light-emitting unit, which includes a light-emitting chip, a color conversion layer, and pins; wherein, the light-emitting chip is used to emit light of a first color; the color conversion layer is located on one side of the light-emitting chip along a direction perpendicular to the thickness direction of the light-emitting unit, and is used to emit light of other colors under the excitation of the light emitted by the light-emitting chip.

[0005] In one embodiment of this application, the light-emitting chip has a top surface and a bottom surface opposite to each other along the thickness direction of the light-emitting unit, and a side surface located between the top surface and the bottom surface;

[0006] The light-emitting unit further includes: a reflective layer, which covers the top surface, bottom surface and side surface of the light-emitting chip along its circumferential direction, and defines the light-emitting side of the light-emitting chip; the color conversion layer is disposed on the light-emitting side of the light-emitting chip.

[0007] Preferably, along the thickness direction of the light-emitting unit, the thickness of the color conversion layer is not less than the thickness of the corresponding light-emitting chip.

[0008] In one embodiment of this application, the reflective layer includes:

[0009] The lower reflective layer, wherein the light-emitting chip and the color conversion layer are respectively disposed on one side surface of the lower reflective layer;

[0010] At least one upper reflective layer is disposed on the lower reflective layer, the reflective layer covers the top surface of the light-emitting chip and a portion of the side surface of the light-emitting chip along its circumferential direction, and defines the light-emitting side forming the light-emitting chip;

[0011] Preferably, the side surface of the color conversion layer facing the light-emitting chip is in contact with the light-emitting chip and the upper reflective layer.

[0012] In one embodiment of this application, the number of the light-emitting chip, the color conversion layer, and the upper reflective layer is one.

[0013] In one embodiment of this application, the number of light-emitting chips is at least two, and the emitted light from each light-emitting chip is of the same color;

[0014] The number of color conversion layers is at least one, and one color conversion layer corresponds to one light-emitting chip.

[0015] In one embodiment of this application, the light-emitting chip includes a first light-emitting chip, a second light-emitting chip, and a third light-emitting chip;

[0016] The color conversion layer includes a second color conversion layer and a third color conversion layer; the second color conversion layer and the third color conversion layer are located on one side of the second light-emitting chip and the third light-emitting chip, respectively, along a direction perpendicular to the thickness direction of the light-emitting unit; wherein, one of the first color, the second color and the third color is red, another is green, and the last is blue;

[0017] Preferably, the first color is blue.

[0018] In one embodiment of this application, the upper reflective layer includes a first upper reflective layer and a second upper reflective layer; the first upper reflective layer covers the top surface of the second light-emitting chip and a portion of the side surface of the second light-emitting chip along its circumferential direction, and defines the light-emitting side of the second light-emitting chip; the second color conversion layer is disposed on the side where the light-emitting side of the second light-emitting chip is located;

[0019] The second upper reflective layer covers the top surface of the third light-emitting chip and a portion of the side surface of the third light-emitting chip along its circumferential direction, and defines the light-emitting side of the third light-emitting chip; the third color conversion layer is disposed on the side where the light-emitting side of the third light-emitting chip is located;

[0020] Preferably, the light-emitting unit further includes a scattering layer, which is disposed on the side of the first light-emitting chip away from the lower reflective layer and located on the light-emitting side of the first light-emitting chip;

[0021] Preferably, along the thickness direction of the light-emitting unit, the straight-line distance between the side surface of the scattering layer facing away from the lower reflective layer and the lower reflective layer is the first distance, the straight-line distance between the side surface of the second color conversion layer facing away from the lower reflective layer and the lower reflective layer is the second distance, and the straight-line distance between the side surface of the third color conversion layer facing away from the lower reflective layer and the lower reflective layer is the third distance, wherein the first distance is equal to the second distance, and / or the first distance is equal to the third distance;

[0022] Preferably, the upper reflective layer further includes a third upper reflective layer, which covers all sides of the first light-emitting chip along its circumferential direction.

[0023] In one embodiment of this application, it further includes:

[0024] A light-shielding layer is disposed on the lower reflective layer and covers the side surface of the upper reflective layer away from the light-emitting chip and the sidewall of the color conversion layer, while exposing at least a portion of the surface of the color conversion layer away from the lower reflective layer.

[0025] An encapsulation layer that at least covers the surface of the light-shielding layer facing away from the light-emitting chip and the surface of the color conversion layer facing away from the lower reflective layer;

[0026] Preferably, the light-emitting unit further includes pins, which are disposed on the side surface of the lower reflective layer opposite to the light-emitting chip, for electrical connection with the driving substrate; wherein the encapsulation layer exposes the pins.

[0027] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a display panel, the display panel including: a driving substrate and a plurality of light-emitting units, the driving substrate being used to provide driving signals; the plurality of light-emitting units being disposed on the driving substrate and electrically connected to the driving substrate; the light-emitting units being the light-emitting units involved above.

[0028] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide an electronic device that includes the display panel mentioned above.

[0029] The beneficial effects of the embodiments of this application, which differ from the prior art, are as follows: The light-emitting unit provided in the embodiments of this application includes a light-emitting chip and a color conversion layer; the light-emitting chip is used to emit light of a first color. Along a direction perpendicular to the thickness direction of the light-emitting unit, the color conversion layer is located on one side of the light-emitting chip and is used to emit light of other colors under the excitation of the light emitted by the light-emitting chip; thereby enabling the light-emitting unit to emit light of other colors different from the first color, so as to achieve full-color display after multiple light-emitting units are disposed on the driving substrate; and compared with the scheme of disposing the color conversion layer along the thickness direction of the light-emitting unit on one side of the light-emitting chip, the overall thickness of the light-emitting unit can be reduced. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a light-emitting unit provided in an embodiment of this application;

[0031] Figure 2 A schematic diagram of the light-emitting structure provided in another embodiment of this application;

[0032] Figure 3 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0033] Figure 4 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0034] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures

[0036] 100 - Display panel; 10a / 10b - Light-emitting unit; 1 - Light-emitting chip; 1a - First light-emitting chip; 1b - Second light-emitting chip; 1c - Third light-emitting chip; 2 - Color conversion layer; 2a - Second color conversion layer; 2b - Third color conversion layer; 3 - Pin; 4 - Reflective layer; 41 - Lower reflective layer; 42 - Upper reflective layer; 5 - Light-shielding layer; 6 - Encapsulation layer; 7 - Diffusing layer; 20 - Driving substrate. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0038] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0039] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0041] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a light-emitting unit provided in an embodiment of this application. In this embodiment, a light-emitting unit 10a is provided, which includes a light-emitting chip 1, a color conversion layer 2, and pins 3. Pins 3 are electrically connected to the light-emitting chip 1 and are used for electrical connection to the driving substrate 20. Pins 3 include a positive pin and a negative pin, which are electrically connected to the positive and negative terminals of the light-emitting chip 1 respectively through two leads.

[0042] The light-emitting chip 1 has a top surface and a bottom surface facing away from each other, as well as a side surface located between the top and bottom surfaces. The light-emitting chip 1 emits light of a first color. The first color can be red, green, or blue. The light-emitting chip 1 can be a miniature light-emitting diode, for example, a Mini-LED chip or a Micro-LED chip. The size of the Mini-LED chip and the Micro-LED chip can reach the sub-millimeter or micrometer scale, with the Mini-LED chip being larger than the Micro-LED chip. When applied to different scenarios with varying pixel-level requirements, either a Mini-LED chip or a Micro-LED chip can be used depending on the specific application.

[0043] Along a direction X perpendicular to the thickness direction Y of the light-emitting unit 10a, i.e., along the lateral direction X of the light-emitting unit 10a, the color conversion layer 2 is located on one side of the light-emitting chip 1, and is used to emit light of other colors when excited by the light emitted from the light-emitting chip 1. In this way, the light-emitting unit 10a can emit light of other colors that are different from the first color, so that after multiple light-emitting units 10a are provided on the driving substrate 20, the display panel 100 can achieve full-color display; and compared with the solution of placing the color conversion layer 2 along the thickness direction Y of the light-emitting unit 10a on one side of the light-emitting chip 1, the overall thickness of the light-emitting unit 10a can be reduced.

[0044] The color conversion layer 2 may include quantum dot materials or fluorescent conversion materials; the fluorescent conversion material may be a red / green conversion material. Taking blue as the first color as an example, the color conversion layer 2 may be a red conversion layer to make the light-emitting unit 10a emit red light; or, the color conversion layer 2 may be a green conversion layer to make the light-emitting unit 10a emit green light.

[0045] Furthermore, the color conversion layer 2 may also include colloids, scattering particles, etc. After light is incident on the scattering particles, it can be randomly reflected and scattered in various directions, thereby ensuring that the emitted light pattern of the light-emitting chip 1 is more consistent after passing through the color conversion layer 2.

[0046] In one embodiment of this application, combined with Figure 1 The number of light-emitting chip 1 and color conversion layer 2 is one each.

[0047] In this embodiment, the light-emitting unit 10a further includes a reflective layer 4, which covers the top surface, bottom surface, and side surface of the light-emitting chip 1 along its circumferential direction, and defines the light-emitting side of the light-emitting chip 1; the light emitted from the light-emitting chip 1 is emitted through this light-emitting side. The color conversion layer 2 is disposed on the light-emitting side of the light-emitting chip 1.

[0048] It can be understood that the reflective layer 4 covers the light-emitting chip 1 and forms an optical microcavity with an opening. The light-emitting chip 1 is located inside the optical microcavity and emits light only through the opening on one side of the optical microcavity. In this way, the light extraction and color purity can be effectively improved. Moreover, the sidewall of the optical microcavity can prevent light leakage from the light-emitting chip 1 and avoid optical crosstalk between the individual light-emitting chips 1, which greatly improves the photon utilization rate.

[0049] In one specific embodiment, along the thickness direction Y of the light-emitting unit 10a, the thickness of the color conversion layer 2 is not less than the thickness of the corresponding light-emitting chip 1; thus, the situation where light of the first color is emitted at the corresponding position can be avoided. Preferably, along the thickness direction Y of the light-emitting unit 10a, the thickness of the color conversion layer 2 is slightly higher than the thickness of the corresponding light-emitting chip 1; thus, the situation where light of the first color is emitted at the corresponding position can be avoided, and the influence of the color conversion layer 2 on the overall thickness of the light-emitting unit 10a can be reduced.

[0050] In one specific embodiment, the reflective layer 4 includes a lower reflective layer 41 and an upper reflective layer 42. The light-emitting chip 1 and the color conversion layer 2 are respectively disposed on one side surface of the lower reflective layer 41. Pins 3 are disposed on the side surface of the lower reflective layer 41 opposite to the light-emitting chip 1. The upper reflective layer 42 is disposed on the lower reflective layer 41 and covers the top surface of the light-emitting chip 1 and the portion of the side surface of the light-emitting chip 1 along its circumferential direction, defining the light-emitting side of the light-emitting chip 1.

[0051] The upper reflective layer 42 and the lower reflective layer 41 can be made of the same material. The upper reflective layer 42 and / or the lower reflective layer 41 may include, but are not limited to, metal or DBR (distributed Bragg reflector) reflective structures.

[0052] In this specific embodiment, the side surface of the color conversion layer 2 facing the light-emitting chip 1 is in contact with the light-emitting chip 1 and the upper reflective layer 42. This reduces the risk of light leakage and decreases the size of the light-emitting unit 10a in the lateral direction X, which is perpendicular to its thickness direction Y, thus facilitating the miniaturization of the product.

[0053] In this embodiment, the light-emitting unit 10a further includes a light-shielding layer 5 and an encapsulation layer 6. The light-shielding layer 5 is disposed on the lower reflective layer 41 and covers the side surface of the upper reflective layer 42 facing away from the light-emitting chip 1 and the sidewall of the color conversion layer 2, while exposing at least a portion of the surface of the color conversion layer 2 facing away from the lower reflective layer 41. This avoids crosstalk between the emitted light of adjacent light-emitting chips 1, ensuring that the emitted light of the light-emitting chip 1 can only be emitted within the area defined by the light-shielding layer 5 around it; and it also prevents the light-shielding layer 5 from blocking the emission of other colors of light from the light-emitting chip 1. The light-shielding layer 5 comprises a black colloid.

[0054] The encapsulation layer 6 covers at least the surface of the light-shielding layer 5 facing away from the light-emitting chip 1 and the surface of the color conversion layer 2 facing away from the lower reflective layer 41, thus protecting the light-shielding layer 5 and the color conversion layer 2. In one specific embodiment, the encapsulation layer 6 covers all surfaces of the light-shielding layer 5 facing away from the light-emitting chip 1, all sides of the lower reflective layer 41, and the surface of the lower reflective layer 41 facing away from the light-emitting chip 1 and its sides. The pin 3 is exposed through the encapsulation layer 6. That is, the encapsulation layer 6 covers all other components of the light-emitting unit 10a except for the pin 3.

[0055] The encapsulation layer 6 may comprise an organic or inorganic layer, and may consist of a single layer or multiple layers. The material of the encapsulation layer 6 may be a transparent adhesive, such as epoxy resin.

[0056] In another embodiment of this application, see Figure 2 , Figure 2 This is a schematic diagram of a light-emitting structure provided in another embodiment of this application; another light-emitting unit 10b is provided, which differs from the light-emitting unit 10a provided in the above embodiment in that: the number of light-emitting chips 1 is at least two, each light-emitting chip 1 is arranged at intervals, and the emitted light of each light-emitting chip 1 is of the same color. The number of color conversion layers 2 is at least one, and one color conversion layer 2 corresponds to one light-emitting chip 1.

[0057] In this embodiment, the number of light-emitting chips 1 can be three, namely a first light-emitting chip 1a, a second light-emitting chip 1b, and a third light-emitting chip 1c. The number of color conversion layers 2 can be two, namely a second color conversion layer 2a and a third color conversion layer 2b. Along the transverse direction X, which is perpendicular to the thickness direction Y of the light-emitting unit 10b, the second color conversion layer 2a is located on one side of the second light-emitting chip 1b; the third color conversion layer 2b is located on one side of the third light-emitting chip 1c. One of the first, second, and third colors is red, another is green, and the last is blue. The three light-emitting chips 1 can be arranged at equal intervals, and the second color conversion layer 2a and the third color conversion layer 2b are located on the same side of the corresponding light-emitting chip 1 to achieve uniform light emission.

[0058] Thus, the three light-emitting chips 1 of the light-emitting unit 10b can emit red light, green light and blue light respectively in conjunction with the color conversion layers 2 of two colors. Therefore, one light-emitting unit 10b can be used as a pixel unit, and the three light-emitting chips 1 can be used to control the brightness of the three primary colors, thereby achieving full-color display by adjusting the brightness ratio of the three primary colors.

[0059] In some specific embodiments, the first light-emitting chip 1a is used to emit blue light. In this case, the color conversion layer 2 includes a green conversion layer and a red conversion layer. Along the transverse direction X, perpendicular to the thickness direction Y of the light-emitting unit 10b, the green conversion layer is located on one side of the second light-emitting chip 1b, and the second light-emitting chip 1b excites the green conversion layer to emit green light. The red conversion layer is located on one side of the third light-emitting chip 1c. The third light-emitting chip 1c excites the red conversion layer to emit red light. The first light-emitting chip 1a directly emits blue light, thus emitting the three primary colors of light respectively in one light-emitting unit 10b.

[0060] In this embodiment, the reflective layer 4 includes a lower reflective layer 41 and a plurality of upper reflective layers 42 disposed on the lower reflective layer 41; the plurality of upper reflective layers 42 include a first upper reflective layer, a second upper reflective layer, and a third upper reflective layer. The first upper reflective layer covers the top surface of the second light-emitting chip 1b and a portion of the side surface of the second light-emitting chip 1b along its circumferential direction, and defines the light-emitting side of the second light-emitting chip 1b. The second color conversion layer 2a is disposed on the side where the light-emitting side of the second light-emitting chip 1b is located. The second upper reflective layer covers the top surface of the third light-emitting chip 1c and a portion of the side surface of the third light-emitting chip 1c along its circumferential direction, and defines the light-emitting side of the third light-emitting chip 1c. The third color conversion layer 2b is disposed on the side where the light-emitting side of the third light-emitting chip 1c is located. The third upper reflective layer covers all side surfaces of the first light-emitting chip 1a along its circumferential direction.

[0061] Specifically, the surface of the second color conversion layer 2a facing the second light-emitting chip 1b is in contact with the second light-emitting chip 1b and the first upper reflective layer. And / or, the surface of the third color conversion layer 2b facing the third light-emitting chip 1c is in contact with the third light-emitting chip 1c and the second upper reflective layer. In this way, the risk of light leakage can be reduced, and the size of the light-emitting unit 10b in the lateral direction X perpendicular to its thickness direction Y can be reduced, which is conducive to the miniaturization of the product.

[0062] In this embodiment, please refer to Figure 2 The light-emitting unit 10b also includes a scattering layer 7, which is disposed on the side of the first light-emitting chip 1a away from the lower reflective layer 41 and located on the light-emitting side of the first light-emitting chip 1a. In this way, the light emitted from the first light-emitting chip 1a can be randomly reflected and scattered in various directions after incident on the scattering layer 7, thereby ensuring that the emitted light pattern of the first light-emitting chip 1a after passing through the scattering layer 7 is more consistent.

[0063] In this design, along the thickness direction Y of the light-emitting unit 10b, the straight-line distance between the surface of the scattering layer 7 facing away from the lower reflective layer 41 and the lower reflective layer 41 is the first distance; the straight-line distance between the surface of the second color conversion layer 2a facing away from the lower reflective layer 41 and the lower reflective layer 41 is the second distance; and the straight-line distance between the surface of the third color conversion layer 2b facing away from the lower reflective layer 41 and the lower reflective layer 41 is the third distance. The first distance is equal to the second distance, and / or the first distance is equal to the third distance. This ensures the overall flatness of the light-emitting unit 10b and minimizes its overall thickness. Of course, the first distance, the second distance, and / or the third distance may not be equal.

[0064] In this embodiment, combined with Figure 2 The light-shielding layer 5 covers the surface of each upper reflective layer 42 facing away from the light-emitting chip 1, the sidewall of the color conversion layer 2, and all other surfaces of the light-emitting chip 1 except for its light-emitting side, where the color conversion layer 2 is not provided. For example, taking a light-emitting chip 1 including a first light-emitting chip 1a, a second light-emitting chip 1b, and a third light-emitting chip 1c as an example; the light-shielding layer 5 covers the surface of the second color conversion layer 2a facing away from the second light-emitting chip 1b, the circumferential sidewall of the second color conversion layer 2a, the surface of the third color conversion layer 2b facing away from the third light-emitting chip 1c, the circumferential sidewall of the third color conversion layer 2b, and all other surfaces of the first light-emitting chip 1a except for its light-emitting side.

[0065] Specifically, the light-shielding layer 5 can further fill all the gaps between two adjacent light-emitting chips 1 to facilitate processing and the normal progress of subsequent processes.

[0066] Of course, in other embodiments, the light-emitting unit 10b may also include six, nine or more light-emitting chips 1; the specific number and arrangement of the color conversion layer 2, the upper reflective layer 42 and the light-shielding layer 5 in the light-emitting unit 10b provided in these embodiments are similar to the above-mentioned light-emitting unit 10b including three light-emitting chips 1, and the above-mentioned three light-emitting chips 1 can be arranged in a group and formed sequentially.

[0067] The light-emitting unit 10b provided in this embodiment uses light-emitting chips 1 as sub-pixels. If the light-emitting unit 10b is applied to the display panel 100 and full-color display is required, then three types of light-emitting chips 1 capable of emitting three primary colors of light need to be simultaneously provided. In the above embodiment of this application, the emitted light color of each light-emitting chip 1 is the same. Thus, for the same light-emitting unit 10b, each light-emitting chip 1 can be manufactured using the same process and the same materials. At the same time, a color conversion layer 2 is provided on one side of at least one light-emitting chip 1 along the transverse direction X, which is perpendicular to the thickness direction Y of the light-emitting unit 10a. This allows the light-emitting unit 10b to emit at least two different colors of light, thereby achieving full-color display without increasing the overall thickness of the light-emitting unit 10b.

[0068] In one embodiment, see Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of the structure of a display panel 100 provided in one embodiment of this application; Figure 4 This is a schematic diagram of the structure of a display panel 100 according to another embodiment of this application; a display panel 100 is provided, which can be a rigid screen or a flexible screen, for displaying images during operation. The display panel 100 includes: a driving substrate 20 and a plurality of light-emitting units. The plurality of light-emitting units are disposed on the driving substrate 20 and electrically connected to the driving substrate 20. The plurality of light-emitting units can be spaced apart or in contact with each other to reduce the size. The driving substrate 20 includes a driving circuit for providing driving signals to control the brightness of the plurality of light-emitting units to realize image display.

[0069] Among them, such as Figure 3 The light-emitting unit can be Figure 1 The corresponding embodiment provides a light-emitting unit 10a. The light-emitting unit 10a is... Figure 1 When the light-emitting unit 10a provided in the corresponding embodiment is used, the color conversion layer 2 corresponding to the multiple light-emitting units 10a on the driving substrate 20 has different colors. That is, the color of the light emitted by the color conversion layer 2 of some light-emitting units 10a under the excitation of the light emitted by the corresponding light-emitting chip 1 is different from the color of the light emitted by the color conversion layer 2 of other light-emitting units 10a under the excitation of the light emitted by the corresponding light-emitting chip 1. Specifically, three light-emitting units 10a can be grouped together, and the colors of the light emitted by the three light-emitting units 10a in each group are all different, so as to achieve full-color display.

[0070] Or, such as Figure 4 As shown, the light-emitting unit can also be Figure 2 The corresponding embodiment provides a light-emitting unit 10b. The specific structure and function of the light-emitting units 10a / 10b can be found in the above description. Of course, in other embodiments, among the multiple light-emitting units on the display panel 100, some light-emitting units are...Figure 1 The corresponding embodiment provides a light-emitting unit 10a, and the remaining light-emitting units are... Figure 2 The corresponding embodiment provides a light-emitting unit 10b.

[0071] The display panel 100 may include one or more driving substrates 20, which provide driving signals together by splicing. To avoid optical problems caused by splicing the driving substrates 20, the splicing gap between adjacent driving substrates 20 is kept as small as possible, or even seamless splicing is achieved.

[0072] The driving substrate 20 has the same shape as the overall shape of the display panel 100, and can typically be rectangular or square. When the display panel 100 is an irregularly shaped display device, the shape of the driving substrate 20 can be adapted to other shapes, which are not limited here. The driving substrate 20 includes, but is not limited to, a circuit board or an array substrate. The circuit board can be a printed circuit board (PCB), and when applied to flexible displays, a flexible printed circuit board (FPC) can be used, which is not limited here.

[0073] In some embodiments, see Figure 5 , Figure 5 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application. An electronic device is provided, which may be a desktop computer, laptop computer, personal digital assistant (PDA), mobile phone, television, etc. The electronic device includes a display panel 100 for displaying images during operation. The display panel 100 is the display panel 100 involved in any of the above embodiments. The specific structure and function of the display panel 100 can be found in the relevant descriptions of the display panel 100 provided in the above embodiments, and will not be repeated here.

[0074] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A light-emitting unit, characterized in that, include: A light-emitting chip, used to emit light of the first color; A color conversion layer, perpendicular to the thickness direction of the light-emitting unit, is located on one side of the light-emitting chip and is used to emit light of other colors when excited by the emitted light of the light-emitting chip; the light-emitting chip has a top surface and a bottom surface opposite to each other along the thickness direction of the light-emitting unit, and a side surface located between the top surface and the bottom surface. A reflective layer covers the top surface, bottom surface, and side surface of the light-emitting chip along its circumferential direction, and defines the light-emitting side of the light-emitting chip. The color conversion layer is disposed on the light-emitting side of the light-emitting chip.

2. The light-emitting unit according to claim 1, characterized in that, Along the thickness direction of the light-emitting unit, the thickness of the color conversion layer is not less than the thickness of the corresponding light-emitting chip.

3. The light-emitting unit according to claim 1, characterized in that, The reflective layer includes: The lower reflective layer, wherein the light-emitting chip and the color conversion layer are respectively disposed on one side surface of the lower reflective layer; At least one upper reflective layer is disposed on the lower reflective layer, the reflective layer covers the top surface of the light-emitting chip and a portion of the side surface of the light-emitting chip along its circumferential direction, and defines the light-emitting side of the light-emitting chip.

4. The light-emitting unit according to claim 3, characterized in that, The number of the light-emitting chip, the color conversion layer, and the upper reflective layer is one.

5. The light-emitting unit according to claim 3, characterized in that, The number of light-emitting chips is at least two, and the emitted light from each light-emitting chip is the same color; The number of color conversion layers is at least one, and one color conversion layer corresponds to one light-emitting chip.

6. The light-emitting unit according to claim 5, characterized in that, The light-emitting chip includes a first light-emitting chip, a second light-emitting chip, and a third light-emitting chip; The color conversion layer includes a second color conversion layer and a third color conversion layer; the second color conversion layer and the third color conversion layer are located on one side of the second light-emitting chip and the third light-emitting chip, respectively, along a direction perpendicular to the thickness direction of the light-emitting unit; wherein, one of the first color, the second color and the third color is red, another is green, and the last is blue.

7. The light-emitting unit according to claim 6, characterized in that, The upper reflective layer includes a first upper reflective layer and a second upper reflective layer; the first upper reflective layer covers the top surface of the second light-emitting chip and the portion of the side surface of the second light-emitting chip along its circumferential direction, and defines the light-emitting side of the second light-emitting chip; the second color conversion layer is disposed on the side where the light-emitting side of the second light-emitting chip is located. The second upper reflective layer covers the top surface of the third light-emitting chip and a portion of the side surface of the third light-emitting chip along its circumferential direction, and defines the light-emitting side of the third light-emitting chip; the third color conversion layer is disposed on the side where the light-emitting side of the third light-emitting chip is located.

8. The light-emitting unit according to claim 7, characterized in that, The light-emitting unit further includes a scattering layer, which is disposed on the side of the first light-emitting chip away from the lower reflective layer and located on the light-emitting side of the first light-emitting chip.

9. The light-emitting unit according to claim 3, characterized in that, Also includes: A light-shielding layer is disposed on the lower reflective layer and covers the side surface of the upper reflective layer away from the light-emitting chip and the sidewall of the color conversion layer, while exposing at least a portion of the surface of the color conversion layer away from the lower reflective layer. The encapsulation layer covers at least the surface of the light-shielding layer facing away from the light-emitting chip and the surface of the color conversion layer facing away from the lower reflective layer.

10. A display panel, characterized in that, include: A driving substrate, used to provide driving signals; Multiple light-emitting units are disposed on the driving substrate and electrically connected to the driving substrate; The light-emitting unit is the light-emitting unit as described in any one of claims 1-9.

11. An electronic device, characterized in that, include: The display panel as described in claim 10.

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