Silicon ring grinding and polishing equipment

Abstract

The present invention relates to the technical field of polishing equipment, and in particular to a silicon ring grinding and polishing equipment, comprising: a turntable, which is used to support a silicon ring and can rotate around a first axis, wherein the first axis is the central axis of the turntable; a pressure head, which can move relative to the turntable along the first axis direction to press the silicon ring on the turntable, and when the silicon ring is pressed, the turntable and the pressure head respectively cover the two ends of the inner ring of the silicon ring so that the inner ring of the silicon ring is enclosed to form a closed guide cavity; the pressure head includes a pressing surface for fitting the end face of the silicon ring; a flow channel, which is provided on the pressure head for the circulation of polishing liquid, and the flow channel is at least partially open to the pressing surface to form a cooling section; a rotating shaft, which is passed through the pressure head along the first axis, and the pressure head can rotate relative to the rotating shaft around the first axis; the rotating shaft is hollow inside to form a liquid inlet channel; through the design of the flow channel, in combination with the pressure head and the turntable, the polishing liquid can cool the inner ring and the top wall of the silicon ring.

Description

Technical Field

[0001] The invention relates to the technical field of polishing equipment, and in particular to a silicon ring grinding and polishing equipment. Background Art

[0002] Ring-shaped silicon parts (such as silicon rings) generally involve grinding and polishing (i.e. grinding and polishing) processes during production and processing. Depending on the processing requirements, the grinding and polishing parts of the silicon rings are also different. For example, in some silicon rings, the outer wall needs to be ground and polished.

[0003] In the related art, the outer wall of the silicon ring is generally ground and polished by rotating the silicon ring itself and making a rotating polishing head contact the outer wall of the rotating silicon ring to achieve grinding and polishing. Generally speaking, during the grinding and polishing process, polishing liquid needs to be sprayed on the outer wall of the silicon ring. The polishing liquid has two main functions. First, some abrasive particles (such as diamond particles) in the polishing liquid are used to improve the grinding and polishing effect. Second, the polishing liquid can also cool the silicon ring and the polishing head during the grinding and polishing process. However, at present, the polishing liquid is generally sprayed directly on the outer wall of the silicon ring through a nozzle. For some larger silicon rings, the contact area between the polishing liquid and the silicon ring is small, so the cooling effect on the silicon ring is relatively general, and there is still room for improvement. Summary of the invention

[0004] In order to solve at least one of the technical problems mentioned in the background technology, the object of the present invention is to provide a silicon ring grinding and polishing device.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A silicon ring grinding and polishing device, comprising:

[0007] A turntable, used for supporting the silicon ring and capable of rotating around a first axis, wherein the first axis is a central axis of the turntable;

[0008] The pressure head can move relative to the turntable along the first axis direction to press the silicon ring on the turntable. When the silicon ring is pressed, the turntable and the pressure head respectively cover the two ends of the inner ring of the silicon ring so that the inner ring of the silicon ring is enclosed to form a closed guide cavity; the pressure head includes a pressing surface for fitting the end face of the silicon ring;

[0009] A flow channel is provided on the pressure head for the polishing liquid to flow, one end of which is connected to the flow guide cavity, and the other end is connected to the nozzle facing the outer peripheral wall of the silicon ring; and the flow channel is at least partially open to the pressing surface to form a cooling section;

[0010] A rotating shaft is provided on the pressure head along the first axis, and the pressure head can rotate around the first axis relative to the rotating shaft; the rotating shaft is hollow inside to form a liquid inlet channel, one end of the liquid inlet channel is connected to the guide cavity, and the other end is connected to the system for supplying polishing liquid;

[0011] A driving mechanism, used for driving the pressure head to move along the first axis;

[0012] The grinding and polishing mechanism comprises at least one polishing head arranged on the side of the turntable for grinding and polishing the outer peripheral wall of the silicon ring.

[0013] Preferably, the flow channel includes a first flow channel, a second flow channel and an open groove; the open groove is opened on the pressing surface to constitute the cooling section; one end of the open groove is connected to one end of the first flow channel, and the other end is connected to one end of the second flow channel; the other end of the first flow channel is connected to the nozzle, and the other end of the second flow channel is connected to the guide cavity.

[0014] Preferably, one end of the flow channel connected to the guide cavity constitutes the liquid inlet end, and the other end of the flow channel constitutes the liquid outlet end; a groove is opened in the middle of the pressing surface; the liquid inlet end is arranged in the groove; a filter element covering the groove is provided on the pressing surface; and the filter element extends from the end of the rotating shaft close to the turntable.

[0015] Preferably, at least one scraper is fixed to the portion of the rotating shaft extending out of the filter element, and the scraper is in contact with the side wall of the filter element close to the turntable.

[0016] Preferably, a convex portion extends upward from the side wall of the pressure head away from the pressing surface, and a socket with an open upper end is provided in the convex portion. A fixed sleeve is fixed on the outer peripheral wall of the rotating shaft, and the fixed sleeve is rotatably inserted into the socket, and a lower end of the fixed sleeve and a lower end of the socket are spaced apart to form a confluence chamber; one end of the flow channel away from the guide chamber is connected to the confluence chamber; a third flow channel is provided in the fixed sleeve, one end of the third flow channel is connected to the confluence chamber, and the other end is connected to the nozzle.

[0017] Preferably, a reinforcing rib is provided between the side wall of the pressure head away from the pressing surface and the convex portion, and the flow channel is at least partially located in the reinforcing rib.

[0018] Preferably, a positioning ring for positioning the silicon ring is provided in the middle of the turntable.

[0019] Preferably, one or more ribs are provided in the middle of the positioning ring.

[0020] Preferably, the driving mechanism is a screw linear module, and the rotating shaft is fixed to a slide seat of the screw linear module.

[0021] Preferably, the equipment also includes a machine table, and the turntable is rotatably arranged on the machine table; the polishing mechanism also includes a cylinder, a motor and a slider, and the slider is slidably arranged on the machine table, and the motor is installed on the slider to drive the polishing head to rotate; the cylinder is used to drive the slider to slide so that the polishing head is close to or away from the outer wall of the silicon ring.

[0022] Compared with the prior art, the advantages of adopting this solution are:

[0023] In the present scheme, a flow channel is provided in the pressure head, and the flow channel part is opened to the pressing surface of the pressure head to form a cooling section; in addition, the inner ring of the silicon ring is formed into a guide cavity by using the pressure head and the turntable to press the silicon ring, so that when the polishing liquid is sprayed during grinding and polishing, the direction of the polishing liquid is to enter the guide cavity through the liquid inlet channel in the rotating shaft, and then flow from the guide cavity to the flow channel, and finally flow from the flow channel to the nozzle, and finally sprayed from the nozzle to the outer peripheral wall of the silicon ring; it can be seen that during the flow process, the polishing liquid will first contact the inner ring peripheral wall of the silicon ring in the guide cavity, thereby playing a certain cooling effect on the inner peripheral wall of the silicon ring, and then because the flow channel part (cooling section) is open to the pressing surface, the cooling liquid in the cooling section of the flow channel can directly contact the top wall of the silicon ring, thereby playing a cooling effect on the top wall of the silicon ring.

[0024] In summary, it can be seen that in this solution, through the design of the flow channel, the pressure head and the turntable, the polishing liquid can cool the inner ring and the top wall of the silicon ring. Moreover, such a design ensures that the polishing liquid is finally sprayed from the nozzle to the outer wall of the silicon ring, which will not cause excessive waste of polishing liquid.

[0025] In addition, in this solution, the rotating shaft and the pressure head are rotated in coordination, so that the pressure head can rotate synchronously with the turntable and the silicon ring, ensuring that the silicon ring can be rotated and polished normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure of the silicon ring of the present invention in a compressed state;

[0028] Figure 3 is a cross-sectional view of the silicon ring of the present invention in a compressed state;

[0029] Figure 4 for Figure 3 A partial enlarged schematic diagram of

[0030] Figure 5 This is the exploded view of the pressure head;

[0031] Figure 6 The cross-sectional view of the pressure head. DETAILED DESCRIPTION

[0032] The technical solutions of the embodiments of the present invention are explained and described below in conjunction with the drawings of the embodiments of the present invention, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the protection scope of the present invention.

[0033] In the following description, terms such as "inside", "outside", "up", "down", "left", "right", etc. that indicate directions or positional relationships are only used to facilitate the description of the embodiments and simplify the description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operate in a specific direction. Therefore, they should not be understood as limitations on the present invention.

[0034] See also Figure 1-6 As shown, this embodiment provides a silicon ring grinding and polishing equipment, which is mainly used for grinding and polishing (i.e., grinding and polishing) the outer peripheral wall of the silicon ring M. It can be understood that the outer peripheral wall of the silicon ring M claimed in this embodiment refers to the outer peripheral wall of the silicon ring M, and correspondingly, the annular wall of the silicon ring M is the inner peripheral wall of the silicon ring M.

[0035] The equipment mainly includes a machine table 1, a turntable 2, a pressure head 3, a flow channel, a rotating shaft 5, a driving mechanism, a grinding and polishing mechanism, etc. The following is a detailed description of each component.

[0036] The turntable 2 is rotatably arranged on the machine 1, mainly used to support the silicon ring M, and the rotation axis of the turntable 2 is its own central axis, which is recorded as the first axis here; it can be understood that according to different processing directions, the first axis can be vertical, horizontal, or even inclined. For example, in this embodiment, the first axis is specifically shown as being vertical, and the following is specifically expanded based on this situation. A motor 20 is fixedly arranged on the machine 1, and the motor 20 is connected to the turntable 2 to drive the turntable 2 to rotate.

[0037] The pressing head 3 is disposed above the turntable 2 and can move relative to the turntable 2 along the first axis direction to press the silicon ring M onto the turntable 2. In the pressed state, the silicon ring M Figure 2-Figure 4 In the state shown, the turntable 2 and the pressure head 3 respectively cover the two ends of the inner ring of the silicon ring M (i.e., the upper and lower ends of the inner ring of the silicon ring M). Under the cover of the turntable 2 and the pressure head 3, the inner ring of the silicon ring M is surrounded by the two to form a closed guide cavity M1.

[0038] For the convenience of explanation, the end surface of the pressing head 3 that is in contact with the silicon ring M is recorded as the pressing surface. For example, in this embodiment, the area where the lower end surface of the pressing head 3 is in contact with the silicon ring M is the pressing surface.

[0039] A flow channel is provided on the pressure head 3 for the circulation of the polishing liquid, one end of which is connected with the guide cavity M1, and the other end is connected with a nozzle (not shown in the figure) facing the outer peripheral wall of the silicon ring M. Specifically, the nozzle can be connected through a hose, and the nozzle can be fixed on the machine 1 through a bracket, and its spraying direction is toward the outer peripheral wall of the silicon ring M, preferably toward the position where the outer peripheral wall of the silicon ring M contacts the polishing head 71.

[0040] It is worth noting that, in this embodiment, the flow channel is at least partially open to the pressing surface to form a cooling section, that is, the lower side of the cooling section is an open structure, and the upper surface of the silicon ring M fits the opening of the cooling section to cover the opening.

[0041] The rotating shaft 5 is disposed on the pressure head 3 along the first axis, and the pressure head 3 can rotate around the first axis relative to the rotating shaft 5, so as to ensure that during the polishing process, the pressure head 3 can rotate coaxially and synchronously with the turntable 2 after the silicon ring M is pressed.

[0042] like Figure 4 As shown, the interior of the rotating shaft 5 is hollow to form a liquid inlet channel 51. One end of the liquid inlet channel 51 is connected to the guide cavity M1 as an output end, and the other end is connected to the system for supplying polishing liquid as an input end. The system for supplying polishing liquid here can be a pump that draws the polishing liquid in the polishing liquid tank to the input end of the liquid inlet channel to realize liquid supply.

[0043] A driving mechanism, used for driving the pressure head 3 to move along the first axis;

[0044] The grinding and polishing mechanism includes at least one polishing head 71 disposed on the side of the turntable 2 for grinding and polishing the outer peripheral wall of the silicon ring M.

[0045] A flow channel is provided in the pressure head 3, and the flow channel is partially opened on the pressing surface of the pressure head 3 to form a cooling section; in addition, the pressure head 3 and the turntable 2 are used to press the silicon ring M so that the inner ring of the silicon ring M forms a guide cavity M1. In this way, when the polishing liquid is sprayed during grinding and polishing, the direction of the polishing liquid is to enter the guide cavity M1 through the liquid inlet channel 51 in the rotating shaft 5, and then flow from the guide cavity M1 to the flow channel, and finally flow from the flow channel to the nozzle, and finally spray from the nozzle to the outer peripheral wall of the silicon ring M.

[0046] It can be seen that during the flow process, the polishing liquid will first contact the inner circumferential wall of the silicon ring M in the guide cavity M1, thereby cooling the inner circumferential wall of the silicon ring M to a certain extent. Then, since the flow channel part (cooling section) is open to the clamping surface, the coolant in the cooling section of the flow channel can directly contact the top wall of the silicon ring M, thereby cooling the top wall of the silicon ring M.

[0047] In summary, it can be seen that in this solution, through the design of the flow channel, in conjunction with the pressure head 3 and the turntable 2, the polishing liquid can cool the inner ring and the top wall of the silicon ring M. Moreover, such a design ensures that the polishing liquid is ultimately sprayed from the nozzle to the outer peripheral wall of the silicon ring M, without causing excessive waste of the polishing liquid.

[0048] In addition, in this solution, the rotating shaft 5 and the pressing head 3 are rotatably matched, so that the pressing head 3 can rotate synchronously with the turntable 2 and the silicon ring M, ensuring that the silicon ring M can be normally rotated and polished.

[0049] It is understandable that the flow channel may be one or more than one. For example, in this embodiment, the flow channels are designed to be multiple and distributed on the pressure head 3 in a circular array.

[0050] The specific structure of the flow channel is as follows: Figure 6 As shown, the flow channel includes a first flow channel 41, a second flow channel 42 and an open groove 43; the open groove 43 is opened on the pressing surface to form the cooling section, and the open groove 43 extends along the radial direction of the pressing surface.

[0051] One end of the opening groove 43 is connected to one end of the first flow channel 41 , and the other end is connected to one end of the second flow channel 42 ; the other end of the first flow channel 41 is connected to the nozzle, and the other end of the second flow channel 42 is connected to the guide cavity M1 .

[0052] In this way, the direction of the polishing liquid is: liquid inlet channel 51 - flow guide cavity M1 - second flow channel 42 - opening groove 43 - first flow channel 41 - nozzle.

[0053] In addition, since there may be some larger particles in the polishing liquid, such as crystals, if it flows directly into the flow channel, it is easy to cause the flow channel to be blocked. Therefore, in this embodiment:

[0054] One end of the flow channel connected to the flow guide cavity M1 constitutes a liquid inlet end, and the other end of the flow channel constitutes a liquid outlet end; Figure 4 and Figure 6 As shown, a groove 33 is opened in the middle of the pressing surface; the liquid inlet end is arranged in the groove 33, that is, the end of the second flow channel 42 away from the opening groove 43 is located on the top wall of the groove 33.

[0055] A filter element 34 covering the notch of the groove 33 is provided on the pressing surface, and the filter element 34 can be a filter plate with filter holes or a filter mesh; the filter element 34 extends downward from the end of the rotating shaft 5 close to the turntable 2, and the rotating shaft 5 is rotatably connected to the filter element 34, so that the polishing liquid will flow out from the lower end of the liquid inlet channel 51 and enter the lower side of the filter element 34, and then pass upward through the filter element 34 into the filter element 34 and enter the groove 33, and finally enter the second flow channel 42 from the groove 33; in this process, some larger particles in the polishing liquid are intercepted by the filter element 34, so that they cannot enter the groove 33, thereby avoiding the problem of flow channel blockage.

[0056] Due to long-term use, the lower side of the filter element 34 is prone to accumulate blockages. Therefore, in this embodiment, at least one scraper 52 is fixed on the portion of the rotating shaft 5 extending outside the filter element 34. It is preferably a flexible scraper 52 made of rubber or silicone material. The scraper 52 and the rotating shaft 5 remain relatively stationary. The scraper 52 conflicts with the side wall of the filter element 34 close to the turntable 2. In this way, when working, the filter element 34 rotates with the pressure head 3, and the scraper 52 remains stationary with the rotating shaft 5. In this way, the scraper 52 is equivalent to rotating relative to the filter element 34, thereby scraping the lower wall of the filter element 34 to clean the lower wall of the filter element 34. Such a design allows the power of the scraper to rotate relative to the filter element to share the power of the turntable motor, without the need to design additional power components to drive the scraper and the filter element to rotate relative to each other.

[0057] In this embodiment, the specific connection structure between the rotating shaft 5 and the pressure head 3 is:

[0058] The side wall of the pressure head 3 away from the pressing surface has a convex portion 31 extending upward. Figure 4 and Figure 6 As shown, the convex portion 31 has a socket with an open upper end, and the socket has a circular structure; a fixed sleeve 6 is fixed on the outer peripheral wall of the rotating shaft 5, and the fixed sleeve 6 is rotatably inserted into the socket. Specifically, a bearing 61 and a seal 62 are arranged in sequence along the axial direction of the rotating shaft 5 between the outer peripheral wall of the rotating sleeve and the inner peripheral wall of the socket. The bearing 61 mainly realizes the rotational connection between the rotating shaft 5 and the socket, and the seal 62 mainly plays a sealing role, which can be a mechanical seal, a packing seal or a lip seal, etc., which is not specifically limited here.

[0059] like Figure 4 The lower end of the fixing sleeve 6 and the lower end of the socket are spaced apart to form a confluence cavity 30; the end of the flow channel away from the guide cavity M1 is connected to the confluence cavity 30, that is, the end of the first flow channel 41 away from the opening groove 43 is connected to the confluence cavity.

[0060] The fixing sleeve 6 is provided with a third flow channel 60 , one end of the third flow channel 60 is communicated with the confluence chamber 30 , and the other end thereof leads out to a pipeline 53 and is communicated with the nozzle.

[0061] In this way, the flow direction of the polishing liquid in the flow channel is: second flow channel 42 - opening groove 43 - first flow channel 41 - confluence cavity 30 - third flow channel 60 - pipeline 53 - nozzle.

[0062] like Figure 1 As shown, a plurality of reinforcing ribs 32 distributed in an annular array are provided between the side wall of the pressing head 3 away from the pressing surface and the protrusion 31 , and the flow channel is at least partially located in the reinforcing rib 32 . Specifically, the first flow channel 41 is located in the reinforcing rib 32 .

[0063] With such arrangement, the reinforcing rib 32 can play a role in reinforcing the strength of the pressure head 3 and can also serve as a carrier for opening the flow channel, so that the structure is more compact.

[0064] In order to position the silicon ring M so that it can be coaxial with the rotating shaft 5, a positioning ring 21 for positioning the silicon ring M is provided in the middle of the turntable 2. The positioning ring 21 is coaxially arranged with the turntable 2, and the outer diameter of the positioning ring 21 is substantially equal to the inner diameter of the silicon ring M.

[0065] In addition, in this embodiment, one or more ribs 22 are provided in the middle of the positioning ring 21. The ribs 22 can play a role in strengthening the positioning ring 21, and when the polishing liquid is discharged from the lower end of the liquid inlet channel 51, the ribs 22 rotate with the turntable 2, so that the rotating ribs 22 can stir and disperse the polishing liquid discharged from the liquid inlet channel 51, so as to reduce some agglomerated particles in the polishing liquid.

[0066] In this embodiment, the driving mechanism is a screw linear module. It can be understood that the screw linear module is the most commonly used linear driving component currently available, and generally mainly includes a slide rail 81, a slide seat 82, a screw, and a motor. The slide seat 82 slides linearly on the slide rail 81 under the drive of the screw. In this way, as long as the rotating shaft 5 is fixed to the slide seat 82, for example, in this embodiment, the fixed sleeve 6 on the rotating shaft 5 is fixed to the slide seat 82, the slide seat 82 can drive the rotating shaft 5 to move up and down, and then drive the pressure head 3 to move up and down, so as to achieve the tightening or loosening of the silicon ring M.

[0067] like Figure 3As shown, the polishing mechanism also includes a cylinder 74, a motor 72 and a slider 73. The slider 73 is slidably arranged on the machine table 1. The motor 72 is installed on the slider 73 to drive the polishing head 71 to rotate. In this embodiment, the polishing head 71 is a polishing wheel structure; the cylinder 74 is used to drive the slider 73 to slide so that the polishing head 71 is close to or away from the outer peripheral wall of the silicon ring M. After the silicon ring M is clamped, the slide seat is driven by the cylinder to slide close to the silicon ring M until the polishing head 71 touches the outer peripheral wall of the silicon ring M, and then the polishing action can be started.

[0068] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. A silicon ring grinding and polishing device, characterized in that: include: A turntable, used for supporting the silicon ring and capable of rotating around a first axis, wherein the first axis is a central axis of the turntable; The pressure head can move relative to the turntable along the first axis direction to press the silicon ring on the turntable. When the silicon ring is pressed, the turntable and the pressure head respectively cover the two ends of the inner ring of the silicon ring so that the inner ring of the silicon ring is enclosed to form a closed guide cavity; the pressure head includes a pressing surface for fitting the end face of the silicon ring; A flow channel is provided on the pressure head for the polishing liquid to flow, one end of which is connected to the flow guide cavity, and the other end is connected to the nozzle facing the outer peripheral wall of the silicon ring; and the flow channel is at least partially open to the pressing surface to form a cooling section; A rotating shaft is provided on the pressure head along the first axis, and the pressure head can rotate around the first axis relative to the rotating shaft; the rotating shaft is hollow inside to form a liquid inlet channel, one end of the liquid inlet channel is connected to the guide cavity, and the other end is connected to the system for supplying polishing liquid; A driving mechanism, used for driving the pressure head to move along the first axis; The grinding and polishing mechanism comprises at least one polishing head arranged on the side of the turntable for grinding and polishing the outer peripheral wall of the silicon ring; One end of the flow channel connected to the guide cavity constitutes a liquid inlet end, and the other end of the flow channel constitutes a liquid outlet end; a groove is opened in the middle of the pressing surface; the liquid inlet end is arranged in the groove; a filter element covering the groove is provided on the pressing surface; the filter element extends from the end of the rotating shaft close to the turntable.

2. A silicon ring grinding and polishing device according to claim 1, characterized in that: The flow channel includes a first flow channel, a second flow channel and an open groove; the open groove is opened on the pressing surface to constitute the cooling section; one end of the open groove is connected to one end of the first flow channel, and the other end is connected to one end of the second flow channel; the other end of the first flow channel is connected to the nozzle, and the other end of the second flow channel is connected to the guide cavity.

3. A silicon ring grinding and polishing device according to claim 1, characterized in that: At least one scraper is fixed on the portion of the rotating shaft extending out of the filter element, and the scraper is in conflict with the side wall of the filter element close to the turntable.

4. A silicon ring grinding and polishing device according to claim 1, characterized in that: A convex portion extends upward from the side wall of the pressure head away from the pressing surface, and a socket with an open upper end is provided in the convex portion. A fixing sleeve is fixed on the outer peripheral wall of the rotating shaft, and the fixing sleeve is rotatably inserted into the socket, and a confluence cavity is formed between the lower end of the fixing sleeve and the lower end of the socket; one end of the flow channel away from the guide cavity is connected to the confluence cavity; a third flow channel is provided in the fixing sleeve, and one end of the third flow channel is connected to the confluence cavity, and the other end is connected to the nozzle.

5. A silicon ring grinding and polishing device according to claim 4, characterized in that: A reinforcing rib is provided between the side wall of the pressure head away from the pressing surface and the convex portion, and the flow channel is at least partially located in the reinforcing rib.

6. The silicon ring grinding and polishing equipment according to claim 1, characterized in that: A positioning ring for positioning the silicon ring is arranged in the middle of the turntable.

7. A silicon ring grinding and polishing device according to claim 6, characterized in that: One or more convex ribs are arranged in the middle of the positioning ring.

8. The silicon ring grinding and polishing equipment according to claim 1, characterized in that: The driving mechanism is a screw linear module, and the rotating shaft is fixed to the slide seat of the screw linear module.

9. The silicon ring grinding and polishing equipment according to claim 1, characterized in that: The equipment also includes a machine platform, and the turntable is rotatably arranged on the machine platform; the polishing mechanism also includes a cylinder, a motor and a slider, and the slider is slidably arranged on the machine platform, and the motor is installed on the slider to drive the polishing head to rotate; the cylinder is used to drive the slider to slide so that the polishing head is close to or away from the outer peripheral wall of the silicon ring.

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