Quantitative analysis and modeling of acoustic conduction process at solid-solid interface in ultrasonic coagulation system

Abstract

The invention discloses a quantitative analysis and modeling method for the solid-solid interface acoustic conduction process of an ultrasonic coagulation system, which relates to the field of advanced material preparation. The invention provides critical ultrasonic excitation parameters, interface structure and constraint conditions to ensure the stability of contact acoustic transmission; constructs and optimizes a numerical calculation model based on the structural characteristics of the ultrasonic coagulation system, and expands the interface acoustic conduction data set; uses Fourier transform and wavelet transform to perform time-frequency analysis and quantitative characterization of solid-solid interface data, and realizes the extraction of time-frequency features on the excitation side and the response side and the marking of critical states; constructs a quantitative relationship model for the solid-solid interface acoustic conduction process, and improves the efficiency, stability and control accuracy of the solid-solid interface acoustic conduction; performs quantitative analysis, characterization and modeling of the solid-solid interface acoustic conduction process, and lays the foundation for real-time and precise control of acoustic conduction and high-energy ultrasonic fields, which is conducive to the realization of intelligent controllable melt / molten pool ultrasonic coagulation technology and the quantitative research and theoretical system establishment of ultrasonic coagulation mechanism.

Description

Technical Field

[0001] The present invention relates to the field of advanced material preparation, and in particular to a quantitative analysis and modeling method for a solid-solid interface acoustic conduction process in an ultrasonic coagulation system. Background Art

[0002] As the requirements for the performance, precision, cost and cycle of metal parts and special structural parts in important technical fields such as aerospace, national defense and military industry, biomedicine, bridges and ships, energy and transportation become increasingly higher, controllable metal melt / molten pool solidification, as the core process of key material forming and new material preparation methods such as precision smelting, efficient continuous casting, intelligent welding, additive manufacturing, has become a hot spot of research and attention, the focus of the integration of high-tech and advanced manufacturing, and a breakthrough point for the development of intelligent manufacturing.

[0003] Controllable metal melt / molten pool solidification refers to a scientific and technological method that regulates the liquid-solid phase change process to improve the microstructure and improve the comprehensive properties and performance of the material through abnormal environment, external field, modification, alloying, etc. Among them, power ultrasound, with unique nonlinear effects such as sound pressure, sound flow, cavitation, mechanical and thermal, acts on the molten state, semi-solid state and thermoplastic state of high-temperature liquid metal. By adjusting the melt properties and interface effects, changing the micro-area heat and mass transfer, promoting nucleation and phase equilibrium, releasing phase change stress and other micro-processes, it can produce degassing, impurity removal, shrinkage feeding, improved interface wettability, element segregation suppression, improved forming quality, grain refinement and equiaxed, homogenized organization, precipitation strengthening promotion, and performance anisotropy. Macroscopic synergistic effects and comprehensive benefits such as anisotropy suppression and condensation stress elimination have significant characteristics and comprehensive advantages of high energy, high efficiency, controllability and low cost in the quantitative research of solidification processes in the orientation, crystal growth, rapid solidification, deep supercooling and various new and extraordinary fields of high-quality structures with the goal of controlling shape, structure and properties, compared with space environment, strong electric pulse, ultra-gravity, electromagnetic field, high-pressure environment and other means. It also has broad application prospects and practical value in the research and development and application of new metal structural materials such as intermetallic compounds, amorphous / high-entropy alloys, high-temperature alloys, metal matrix composites, and advanced steel materials such as high-strength steel, bearing steel, tool steel, wear-resistant and corrosion-resistant steel.

[0004] However, in the existing ultrasonic solidification systems, the single vibration structure has an inefficient acoustic conduction process, there is no systematic quantitative analysis of the acoustic conduction process at the solid-solid interface, the acoustic conduction process cannot be quantitatively controlled in real time, and the beneficial effects of the ultrasonic solidification process have extremely poor repeatability, stability, controllability, and interpretability. These factors have severely restricted the quantitative research on the ultrasonic solidification mechanism and the establishment of a theoretical system, and hindered the large-scale application of controllable metal melt / molten pool ultrasonic solidification technology. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides a quantitative analysis and modeling method for the solid-solid interface acoustic conduction process of an ultrasonic coagulation system.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] A quantitative analysis and modeling method for the solid-solid interface acoustic conduction process of an ultrasonic coagulation system, comprising:

[0008] Determine the solid-solid interface bonding state and the excitation parameter range according to the vibration configuration of the ultrasonic coagulation system, the vibration unit of the ultrasonic coagulation system and the vibration type of the ultrasonic coagulation system; the solid-solid interface bonding state includes the solid-solid interface structure on the ultrasonic propagation path, the solid-solid interface bonding mode and the constraint conditions;

[0009] According to the solid-solid interface bonding state, using a vibration meter to measure the excitation side amplitude and the response side amplitude of different solid-solid interfaces within the excitation parameter range to obtain experimental data, and structuring the experimental data to obtain first structured data;

[0010] According to the solid-solid interface bonding state, based on the first structured data, the numerical value of the solid-solid interface dynamic acoustic conduction process is calculated to obtain extended data, and the extended data is structured to obtain second structured data;

[0011] Fourier transform and wavelet transform are used to perform time-frequency analysis and quantitative characterization of solid-solid interface data based on the second structured data to obtain time-frequency characteristic data of the solid-solid interface excitation side and time-frequency characteristic data of the solid-solid interface response side, and the time-frequency characteristic data of the solid-solid interface excitation side and the time-frequency characteristic data of the solid-solid interface response side are structured to obtain third structured data; the time-frequency characteristic data of the solid-solid interface excitation side and the time-frequency characteristic data of the solid-solid interface response side both include: amplitude, frequency and phase;

[0012] According to the solid-solid interface bonding state and based on the third structured data, a quantitative relationship model of the solid-solid interface acoustic conduction process is constructed.

[0013] Optionally, the solid-solid interface of the ultrasonic coagulation system includes: a connection interface, a contact interface, a swelling interface and a vibration isolation interface;

[0014] The solid-solid interface acoustic conduction process of the ultrasonic coagulation system refers to the dynamic response process of the solid-solid interface response side of the ultrasonic coagulation system to the time-frequency characteristics of the excitation side.

[0015] Optionally, the solid-solid interface bonding state and the excitation parameter range are determined according to the vibration configuration of the ultrasonic coagulation system, the vibration unit of the ultrasonic coagulation system and the vibration type of the ultrasonic coagulation system, specifically including:

[0016] Determine the vibration configuration of the ultrasonic coagulation system, the vibration unit of the ultrasonic coagulation system and the vibration type of the ultrasonic coagulation system in sequence, and clarify the range of excitation parameters; the range of excitation parameters includes frequency, amplitude and phase;

[0017] Analyzing the solid-solid interface structure on the acoustic propagation path according to the vibration type of the ultrasonic coagulation system to determine interface structure parameters, and determining different solid-solid interface structures based on the interface structure parameters; the interface structure parameters include material parameters, shape parameters, size parameters and surface state;

[0018] Determine the solid-solid interface bonding mode and constraint condition parameters according to four types of modes: connection, contact, expansion and vibration isolation;

[0019] According to the maximum restoring force of the longitudinal wave on the solid-solid interface, the critical amplitude-frequency characteristic curve of the solid-solid interface is determined and corrected according to the interface temperature as the constraint condition of the solid-solid interface excitation parameters.

[0020] Optionally, according to the solid-solid interface bonding state, a vibration meter is used to measure the excitation side amplitude and the response side amplitude of different solid-solid interfaces within the excitation parameter range to obtain experimental data, and the experimental data is structured to obtain first structured data, specifically including:

[0021] Based on the ultrasonic coagulation system, two sets of laser vibrometers supporting external hardware synchronous triggering and an intelligent control host are used to build an automatic measurement system for solid-solid interface acoustic conduction data;

[0022] The vibration measuring points are determined according to the spatial position accessibility of the solid-solid interface, the vibration modes of the solid on the excitation side and the solid on the response side, the data of the vibration measuring points are obtained by using the automatic determination system of the solid-solid interface acoustic conduction data, and the vibration amplitude on the excitation side is obtained by solid vibration mode conversion; the vibration measuring points are the vibration measuring points of the solid on the excitation side and the solid on the response side;

[0023] According to the excitation parameter range and constraint conditions, a vibration measurement scheme is designed based on the principles of orthogonality and uniformity, and experimental points are determined within the excitation parameter range and constraint conditions;

[0024] Control the influence of irrelevant variables according to the vibration measurement scheme, compile the vibration measurement test program, and the vibration measurement test process;

[0025] According to the solid-solid interface structure and the solid-solid interface bonding mode, all the solid-solid interfaces of the ultrasonic coagulation system are traversed to obtain the experimental vibration measurement data, and all the experimental vibration measurement data are structured according to the solid-solid interface bonding mode ~ solid-solid interface structure ~ constraint conditions ~ excitation side amplitude ~ response side amplitude to obtain the first structured data.

[0026] Optionally, the vibration measurement experiment program includes: an equipment self-check program segment, an equipment parameter control program segment, an experimental vibration measurement program segment, a data recording program segment and an emergency handling program segment.

[0027] Optionally, according to the solid-solid interface bonding state, based on the first structured data, the numerical value of the solid-solid interface dynamic acoustic conduction process is calculated to obtain extended data, and the extended data is structured to obtain second structured data, specifically including:

[0028] According to the structural characteristics of the solid-solid interface of the ultrasonic coagulation system, a numerical calculation model of the dynamic acoustic conduction process of the solid-solid interface is constructed;

[0029] Optimizing the numerical calculation model according to the first structured data;

[0030] Determining a solid-solid interface structural parameter range; the solid-solid interface structural parameter range includes material parameters, shape parameters, size parameters and surface state;

[0031] Formulate a data expansion plan according to the solid-solid interface structure parameter range, and list all solid-solid interface parameter combinations;

[0032] Based on all solid-solid interface parameter combinations, the material constitutive structure and parameters used in the expansion of solid-solid interface acoustic conduction data and interface state data are obtained from the solid material database;

[0033] According to the data expansion scheme, respectively setting the optimized scanning parameters of the numerical calculation model;

[0034] Sequentially solving the optimized numerical calculation model based on the scanning parameters to obtain amplitude data of the response side under each scanning parameter;

[0035] The amplitude data is structured and arranged according to the solid-solid interface bonding mode, the solid-solid interface structure, the constraint condition, the excitation side amplitude, and the response side amplitude to obtain the second structured data.

[0036] Optionally, according to the structural characteristics of the solid-solid interface of the ultrasonic coagulation system, a numerical calculation model of the dynamic acoustic conduction process of the solid-solid interface is constructed, specifically including:

[0037] According to the solid-solid interface structure, constraint conditions and ultrasonic excitation parameters, compile the numerical calculation model control parameter table;

[0038] According to the shapes and sizes of the solid on the excitation side and the response side of the solid-solid interface, as well as the vibration position of the excitation source and the vibration measuring position of the vibration meter, the calculation domain of the solid-solid interface acoustic conduction model and the geometric model of the solid-solid interface are determined;

[0039] Meshing the geometric model of the solid-solid interface with tetrahedral or hexahedral meshes to obtain a solid mechanics module, and setting the material properties of the excitation side solid and the response side solid in the solid mechanics module;

[0040] According to the structural characteristics of the solid-solid interface of the ultrasonic coagulation system, the surface state and control equation of the solid on the excitation side of the solid-solid interface, the surface state and control equation of the solid on the response side and the boundary conditions are set to obtain the wave equation;

[0041] The excitation vibration source is set according to the excitation amplitude data measured by the solid-solid interface experiment, and the transient state of the wave equation is iteratively solved using the solid mechanics module until the calculation process converges and the solid amplitude data on the excitation side is stable and undistorted. The corresponding wave equation is used as the numerical calculation model.

[0042] Optionally, optimizing the numerical calculation model according to the first structured data specifically includes:

[0043] Based on the numerical calculation model, the error analysis of the simulated amplitude of the vibration point on the response side of the solid-solid interface acoustic conduction process and the experimental measured value is performed in the time domain and frequency domain to determine the error source;

[0044] Analyze the residuals of the calculation process of dynamic acoustic conduction at the solid-solid interface, determine the convergence of the iterative process of the numerical calculation model, and evaluate the source of the problem of the numerical calculation model;

[0045] Change the mesh type to optimize the mesh quality and adjust the time step;

[0046] Optimize the surface state and control equation of the solid on the excitation side of the solid-solid interface and the surface state and control equation of the solid on the response side, and adjust the parameters of the solid-solid interface so that the parameters of the solid-solid interface match the actual interface bonding state;

[0047] Optimizing the way boundary conditions are applied so that the boundary conditions match the actual sound conduction process;

[0048] Optimize and coordinate initial conditions;

[0049] Optimize material constitutive structure and adjust material parameters to match the actual metal material;

[0050] Change the solver type, iterative algorithm, and solver parameters;

[0051] Return to executing the step of performing error analysis in time domain and frequency domain on the simulated amplitude of the vibration point on the response side of the solid-solid interface acoustic conduction process and the experimental measured value based on the numerical calculation model to determine the source of the error, until the error between the simulated amplitude of the vibration point on the response side of the solid-solid interface acoustic conduction process and the experimental measured value is within a set range, thereby obtaining the optimized numerical calculation model.

[0052] Optionally, Fourier transform and wavelet transform are used to perform time-frequency analysis and quantitative characterization of solid-solid interface data based on the second structured data, specifically including:

[0053] Performing time domain analysis on the solid-solid interface acoustic conduction process data to obtain first curve data, and extracting the maximum value, minimum value, time average value, amplitude, peak-to-peak value, standard deviation and solid-solid contact duty cycle of the first curve data; the first curve data includes: an excitation side amplitude-time curve, a response side amplitude-time curve and an excitation side and response side amplitude phase difference-time curve;

[0054] Fourier transform is used to perform frequency domain analysis on the solid-solid interface acoustic conduction process data to obtain second curve data, and characteristic frequency, amplitude of characteristic frequency and initial phase of characteristic frequency of the second curve data are extracted; the second curve data includes an excitation side amplitude-frequency curve, a response side amplitude-frequency curve, an excitation side amplitude phase-frequency curve and a response side amplitude phase-frequency curve;

[0055] Short-time Fourier transform or wavelet transform is used to perform time-frequency analysis on the sound conduction process data of the solid-solid contact interface to obtain surface data, and extract the characteristic frequency of the surface data and the third curve data under the characteristic frequency; the third curve data includes: the amplitude-time curve of the excitation side and the amplitude-time curve of the response side; the surface data includes: the amplitude-frequency-time surface of the excitation side, the amplitude-phase-time surface of the excitation side, the amplitude-frequency-time surface of the response side, and the amplitude-phase-time surface of the response side.

[0056] Optionally, according to the solid-solid interface bonding state and based on the third structured data, a quantitative relationship model of the solid-solid interface acoustic conduction process is constructed, specifically including:

[0057] Preprocessing the acoustic conduction data in the third structured data;

[0058] Constructing a neural network; the neural network includes a plurality of sub-network results for predicting and inverting the solid-solid interface acoustic conduction process; each of the sub-network structures is composed of an input layer, an output layer and a hidden layer;

[0059] Set the training parameters of the neural network;

[0060] Based on the set training parameters, a CPU+GPU heterogeneous multi-core parallel computing platform is used to predict and invert the solid-solid interface acoustic conduction process to train the neural network and obtain a trained neural network;

[0061] The trained neural network is used as a quantitative relationship model of the solid-solid interface acoustic conduction process.

[0062] According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0063] (1) The present invention uses a vibrometer and numerical calculation method to achieve quantitative analysis and characterization of solid-solid connection, contact, expansion and vibration isolation interfaces under different interface structures, excitation parameters and constraint conditions of the ultrasonic coagulation system;

[0064] (2) For the solid-solid contact interface in the ultrasonic conduction process, the present invention provides the critical ultrasonic excitation parameters, interface structure and constraint conditions when the amplitude, frequency and energy state of the response side change, thereby ensuring the stability of contact sound transmission;

[0065] (3) Based on the structural characteristics of the solid-solid connection, contact, expansion and vibration isolation interface of the ultrasonic coagulation system, the present invention constructs and optimizes the numerical calculation model of the solid-solid interface dynamic acoustic conduction process and expands the interface acoustic conduction data set;

[0066] (4) The present invention uses Fourier transform and wavelet transform to perform time-frequency analysis and quantitative characterization of solid-solid interface data, which can realize time-frequency feature extraction and critical state marking on the excitation side and response side;

[0067] (5) The present invention constructs a quantitative relationship model of the solid-solid interface acoustic conduction process by means of mathematical modeling + deep learning, which can improve the efficiency, stability and control accuracy of solid-solid interface acoustic conduction;

[0068] (6) The present invention can lay a foundation for real-time and precise control of acoustic conduction and high-energy ultrasonic fields by quantitatively analyzing, characterizing and modeling the acoustic conduction process at the solid-solid interface of the ultrasonic solidification system, which is beneficial to the realization of intelligent controllable melt / molten pool ultrasonic solidification technology and the quantitative research and theoretical system establishment of the ultrasonic solidification mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0070] Figure 1 A flow chart of the quantitative analysis and modeling method of the solid-solid interface acoustic conduction process of the ultrasonic coagulation system provided by the present invention;

[0071] Figure 2 A schematic diagram of a typical solid-solid connection interface of the ultrasonic coagulation system provided by the present invention;

[0072] Figure 3 A schematic diagram of a typical solid-solid contact interface of the ultrasonic coagulation system provided by the present invention;

[0073] Figure 4 A schematic diagram of a typical solid-solid expansion interface of the ultrasonic coagulation system provided by the present invention;

[0074] Figure 5 A schematic diagram of a typical solid-solid vibration isolation interface of the ultrasonic coagulation system provided by the present invention;

[0075] Figure 6 Schematic diagram of synchronous laser vibration measurement of a typical solid-solid interface of the ultrasonic coagulation system provided by the present invention.

[0076] Marking Description:

[0077] 1-transducer, 2-solid-solid connection interface, 3-bolt, 4-amplifier, 5-solid-solid point-to-surface contact interface, 6-mold wall, 7-expansion sleeve, 8-solid-solid expansion interface, 9-mold moving wall, 10-solid-solid vibration isolation interface, 11-asbestos, 12-fixed seat, 13-mold, 14-melt, 15-elevator, 16-fixed seat, 17-cylinder. DETAILED DESCRIPTION

[0078] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0079] The purpose of the present invention is to provide a quantitative analysis and modeling method for the solid-solid interface acoustic conduction process of an ultrasonic coagulation system, which can solve the problems existing in the existing ultrasonic coagulation system, such as the inefficiency of the single acoustic conduction process of the vibration structure, the lack of systematic quantitative analysis of the solid-solid interface acoustic conduction process, the inability to quantitatively control the acoustic conduction process in real time, and the extremely poor repeatability, stability, controllability and interpretability of the beneficial effects of the ultrasonic coagulation process. It can then promote the quantitative research on the ultrasonic coagulation mechanism and the establishment of a theoretical system, as well as the large-scale application of controllable metal melt / molten pool ultrasonic solidification technology.

[0080] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0081] like Figure 1 As shown, the method for quantitative analysis and modeling of the solid-solid interface acoustic conduction process of the ultrasonic coagulation system provided by the present invention includes:

[0082] Step 100: Determine the solid-solid interface bonding state and parameters. Specifically, the solid-solid interface bonding state and the excitation parameter range are determined according to the vibration configuration of the ultrasonic coagulation system, the vibration unit of the ultrasonic coagulation system, and the vibration type of the ultrasonic coagulation system. The solid-solid interface bonding state includes the solid-solid interface structure on the ultrasonic propagation path, the solid-solid interface bonding mode, and the constraint conditions.

[0083] In the present invention, the solid-solid interface of the ultrasonic coagulation system refers to the basic components of the ultrasonic coagulation system, such as the transducer, amplitude transformer, cylinder, slide, water-cooled block, push rod, cover plate, fixed seat, mold, etc., which are connected, contacted, expanded, and isolated by vibration, and are constrained by rigidity, elasticity, flexibility, constant displacement, constant force, etc., and are a stable sound transmission structure composed of specific materials, shapes, sizes, and surface properties.

[0084] Solid-solid interfaces include connection interfaces, contact interfaces, expansion interfaces and vibration isolation interfaces. Among them, connection interfaces include transducer end face-horn, horn-ultrasonic tool, transducer flange-fixed seat, transducer flange-slide, transducer flange-cylinder, push rod-cylinder, cover plate protrusion-cover plate, etc. Contact interfaces include horn end face-mold outer wall, push rod end face-mold outer wall, cover plate protrusion and mold outer wall, mold moving wall-mold static wall, mold inner wall-first solidification phase shell, etc. Expansion interfaces include horn-ultrasonic tool, ultrasonic tool-mold, horn-mold, etc. Vibration isolation interfaces include mold moving wall-mold static wall, horn-mold, etc.

[0085] Furthermore, the solid-solid interface acoustic conduction process of the ultrasonic coagulation system in the present invention refers to the dynamic response process of the solid-solid interface response side of the ultrasonic coagulation system to the time-frequency characteristics such as amplitude, frequency, and phase of the excitation side, which is determined by the solid-solid interface structure, bonding method, constraints and specific parameters, and can be described by a quantitative relationship model of the solid-solid interface acoustic conduction process.

[0086] Furthermore, the solid-solid interface bonding state includes the solid-solid interface structure, bonding mode and constraint conditions. Among them, the solid-solid interface structure is composed of the excitation side solid, the response side solid and the solid-solid interface, which is determined by the solid materials, shapes, sizes and surface properties on both sides. The solid-solid interface bonding modes include connection, contact, expansion, vibration isolation and their composite forms or superposition states. The composite forms include connection contact, contact vibration isolation and expansion vibration isolation. Contact is the most effective decoupling method between the components of the ultrasonic vibration unit. The dynamic contact problem of the solid-solid interface in the ultrasonic conduction process is the most typical and complex. The longitudinal wave restoring force of the connection mode is provided by the bolt preload of the bolt connection and the interface bonding force of metallurgical or mechanical bonding. The reliable connection condition is that the bolt preload or the interface bonding force is not less than the peak tensile stress of the longitudinal wave at the interface, which includes bolt connection, metallurgical or mechanical bonding and other connection forms. The longitudinal wave restoring force of the contact mode is provided by the contact preload of the cylinder constant pressure mode and the elastic force caused by the material deformation of the slide constant displacement mode. The dynamic contact condition is that the contact preload or the material elastic force is less than the peak tensile stress of the longitudinal wave at the interface and is not always zero. The condition for the contact to be transformed into a connection is that the contact preload or the material elastic force is not less than the peak tensile stress of the longitudinal wave at the interface. The condition for the contact to be transformed into vibration isolation is that the contact preload or the material elastic force is always zero, which includes point-to-surface contact, point-to-line contact, surface-to-surface contact and other structural forms. The longitudinal wave restoring force of the expansion mode is provided by the axial friction force caused by radial expansion. The reliable expansion condition is that the axial friction force is not less than the peak tensile stress of the longitudinal wave at the interface. The vibration isolation mode does not provide longitudinal wave restoring force and cannot transmit longitudinal waves. It is a flexible constraint. The solid-solid interface constraint conditions include rigidity, elasticity, flexibility, constant displacement, constant force and their composite forms.

[0087] Among them, the solid-solid interface dynamic contact problem in the ultrasonic conduction process refers to the dynamic contact problem of solid and solid rough interface elastoplastic materials under external heating and / or force loads in the ultrasonic vibration system. This problem consists of three parts. The first part is the deformation of the object under the external load at the contact surface, which is controlled by continuous medium mechanics and depends on the geometric shape and material constitutive properties of the object. The second part is the relative motion of the contacting objects, which is controlled by multi-body dynamics. The third part is the interface contact process, which is controlled by friction contact mechanics and depends on the compression and adhesion in the normal direction of the contact surface, as well as the friction and micro-slip in the tangential direction. Its complexity will cause the ultrasonic vibration system to be detuned due to the mismatch of frequency, impedance, power and other factors between the excitation side and the response side of the solid-solid contact interface, which will lead to the instability of the interface sound conduction process and the complete change of frequency, amplitude and phase, and be in an inefficient chaotic sound conduction state. The condition for judging the instability of the solid-solid contact interface sound conduction state is that the ultrasonic vibration system is in a low-frequency (fs / 100) and high-energy (P0 / 5) energy dissipation state for a long time (100T).

[0088] Based on the above description, in actual application, the implementation process of step 100 includes:

[0089] 1) According to the ultrasonic solidification system of metal melt, determine its vibration configuration, vibration unit and vibration type in turn, and clarify the range of excitation parameters such as frequency F0, amplitude A0, phase Theta0, etc.

[0090] 2) According to the type of ultrasonic vibration, analyze the solid-solid interface structure on the sound propagation path and determine the interface structure parameters such as material, shape, size, and surface state. Among them, material parameters refer to the constitutive equations and parameters such as linear elasticity, elastoplasticity, hyperelasticity, viscoelasticity, and nonlinear elasticity that describe the thermodynamic behavior of high-performance alloys, ceramics, and metal-based homogeneous, composite, and gradient materials. Surface states include mirror, smooth, rough, textured, etc., which are distinguished by roughness level.

[0091] 3) Determine the interface bonding mode and constraint parameters according to the four categories of connection, contact, expansion and vibration isolation. Among them, for the connection interface, the constraint conditions are bolt preload or interface bonding force, interface temperature. For the contact interface, the constraint conditions are contact preload and interface temperature. For the expansion interface, the constraint conditions are axial friction and interface temperature.

[0092] 4) Determine the critical amplitude-frequency characteristic curve for reliable operation of the solid-solid interface based on the maximum restoring force of the longitudinal wave at the solid-solid interface, and make corrections based on the interface temperature as constraints on the solid-solid interface excitation parameters.

[0093] 5. All solid-solid interfaces in the ultrasonic coagulation system are classified according to the interface bonding mode and subdivided according to the interface structure. All parameters are structured according to the excitation parameter range ~ interface structure ~ constraint conditions.

[0094] Step 101: Experimental determination of solid-solid interface acoustic conduction data. Specifically, according to the solid-solid interface bonding state, a vibration meter is used to measure the excitation side amplitude and the response side amplitude of different solid-solid interfaces within the excitation parameter range to obtain experimental data, and the experimental data is structured to obtain first structured data. That is, according to the solid-solid interface bonding modes such as connection, contact, expansion, and vibration isolation, a vibration meter is used within the excitation parameter range to measure the amplitude of the excitation side and the response side for different interface structures, and the experimental data is structured.

[0095] In actual application, the implementation process of step 101 is:

[0096] 1) Based on the ultrasonic solidification system of metal melt, two sets of laser vibrometers supporting external hardware synchronous triggering and intelligent control host are used to build a software and hardware system for automatic measurement of solid-solid interface acoustic conduction data. Among them, the vibration meter has an amplitude measurement range greater than A0_max, an accuracy better than 0.01μm, a sampling rate greater than F0_max*20, ​​is resistant to ambient light interference, and can perform stable amplitude measurement of high-temperature objects.

[0097] 2) According to the spatial position accessibility of the solid-solid interface, the vibration modes of the solid on the excitation side and the solid on the response side, the vibration measurement points of the solid on the excitation side and the response side are determined, and the amplitude of the excitation side can be obtained by solid vibration mode conversion.

[0098] 3) According to the solid-solid interface excitation parameter range and constraints, the vibration measurement scheme is designed based on the principles of orthogonality and uniformity, and the experimental points are determined within the full parameter range and constraints.

[0099] 4) According to the vibration measurement plan, strictly control the influence of irrelevant variables, compile the vibration measurement test program, and accurately execute the vibration measurement test process. The process of compiling the vibration measurement test program is as follows:

[0100] (1) Prepare the equipment self-test program segment. Check the communication and control status between the control host and the ultrasonic power supply, laser vibrometer, and thermal constraint controller to determine whether the communication and control status are normal. If not, report an error and exit. If normal, proceed to the next step.

[0101] (2) Prepare equipment control program segments. Prepare equipment parameter control programs according to equipment control protocols and timing.

[0102] (3) Prepare the experimental vibration measurement program segment. According to the experimental plan, prepare the experimental parameter scanning loop to traverse all experimental control parameters.

[0103] (4) Prepare data recording program segments. According to the experimental plan, prepare the experimental parameters and amplitude measurement data archiving program.

[0104] (5) Prepare emergency procedures. According to possible emergencies during the experiment, prepare emergency procedures such as equipment emergency stop, experiment suspension, experiment resumption, and experiment termination to ensure the safety of personnel and equipment and the reliability of experimental data.

[0105] (6) Perform offline and online debugging of the experimental vibration measurement program to ensure that the program is accurate.

[0106] 5) Traverse all solid-solid interfaces of ultrasonic coagulation systems according to the interface bonding mode and interface structure, and structure all experimental vibration measurement data according to interface bonding mode ~ solid-solid interface structure ~ constraint conditions ~ excitation side amplitude ~ response side amplitude.

[0107] Step 102: numerical calculation of the interface dynamic acoustic conduction process. Specifically, according to the solid-solid interface bonding state, the numerical value of the solid-solid interface dynamic acoustic conduction process is calculated based on the first structured data to obtain extended data, and the extended data is structured to obtain the second structured data. That is, according to different solid-solid interface bonding modes and interface structures, based on the experimental data of the solid-solid interface acoustic conduction process, a numerical calculation model of the interface dynamic acoustic conduction process is constructed and optimized, the solid-solid interface acoustic conduction data set is expanded, and the extended data is structured.

[0108] In actual application, the implementation process of step 102 includes:

[0109] 1) According to the structural characteristics of the ultrasonic coagulation system's solid-solid connection, contact, expansion, and vibration isolation interface, a numerical calculation model of its dynamic acoustic conduction process is constructed. The numerical calculation model includes geometric structure, finite element mesh, material parameters, control equations, initial conditions, boundary conditions, solver parameters, etc. The construction process is as follows:

[0110] (1) According to the solid-solid interface structure, constraint conditions and ultrasonic excitation parameters in the process of dynamic acoustic conduction at the solid-solid interface, a control parameter table of the numerical calculation model is compiled to provide a data basis for subsequent numerical calculations.

[0111] (2) According to the shape and size of the solid on the excitation side and the response side of the solid-solid interface, as well as the vibration position of the excitation source and the vibration measurement position of the vibration meter, the calculation domain and geometric model of the solid-solid interface acoustic conduction model are determined. The geometric model is a digital image file obtained by 3D modeling.

[0112] (3) The solid-solid interface geometric model is meshed with tetrahedral or hexahedral meshes to obtain a solid mechanics module, and the material properties of the excitation side solid and the response side solid are set.

[0113] (4) According to the structural characteristics of the solid-solid connection, contact, expansion, and vibration isolation interface of the ultrasonic coagulation system, the surface states and control equations of the solid on the excitation side and the solid on the response side of the solid-solid interface, as well as boundary conditions such as thermal and mechanical constraints, are set to obtain the wave equation.

[0114] (5) The excitation source is set according to the excitation amplitude data measured in the solid-solid interface experiment, and the solid mechanics module is used to perform the transient solution of the wave equation.

[0115] (6) When the wave equation calculation process converges and the solid amplitude data on the excitation side is stable and undistorted, the wave equation obtained by the last iteration is used as the numerical calculation model to complete the construction of the numerical calculation model of the dynamic acoustic conduction process at the solid-solid interface.

[0116] 2) According to the experimental data of solid-solid connection, contact, expansion and vibration isolation interface acoustic conduction process, the numerical calculation model is optimized to accurately reflect the physical process. The optimization process of the numerical calculation model is as follows:

[0117] (1) Based on the numerical calculation model of the dynamic acoustic conduction process of the solid-solid interface, the time domain and frequency domain error analysis of the simulated amplitude of the vibration point on the response side of the solid-solid interface acoustic conduction process and its experimental measured value were carried out to determine the error source.

[0118] (2) Analyze the residuals of the calculation process of dynamic acoustic conduction at the solid-solid interface, determine the convergence of the iterative process of the numerical calculation model, and evaluate the source of the model problem.

[0119] (3) Change the grid type, optimize the grid quality, adjust the time step, and improve the spatial and temporal discretization accuracy of the numerical calculation model to balance the calculation accuracy and efficiency.

[0120] (4) Optimize the solid-solid interface control equation and adjust its parameters to match the actual interface bonding state.

[0121] (5) Optimize the way boundary conditions are applied to match the actual sound conduction process.

[0122] (6) Optimize and coordinately adjust initial conditions to avoid parameter conflicts in the initial process of the numerical calculation model.

[0123] (7) Optimize the material constitutive structure and adjust the material parameters to match the actual metal material.

[0124] (8) Change the solver type, iterative algorithm and its parameters to improve solution efficiency and accuracy.

[0125] (9) Based on step (1) and step (2), step (1) to step (8) are repeated by the control variable method to optimize and adjust the numerical calculation model of the solid-solid interface dynamic sound conduction process until the error between the simulated amplitude of the response side vibration point and its experimental measured value in the solid-solid interface sound conduction process is within an acceptable range, thereby obtaining an accurate numerical calculation model of the solid-solid interface dynamic sound conduction process. The acceptable range is a range set based on actual needs.

[0126] 3) According to actual needs, determine the parameter ranges of solid-solid interface structure, ultrasonic excitation, and constraint conditions. Interface structure parameters include material, shape, size, and surface state. Constraint conditions include thermal and mechanical constraints.

[0127] 4) According to the range of solid-solid interface parameters, a data expansion plan is formulated based on the principles of uniformity and orthogonality, and all solid-solid interface parameter combinations are listed.

[0128] 5) Through the public solid material database, all material constitutive and parameter and interface state data required for the expansion of solid-solid interface acoustic conduction data are obtained.

[0129] 6) According to the solid-solid interface acoustic conduction data expansion plan, parameter scanning and setting are performed on the numerical calculation models of the dynamic acoustic conduction processes of the solid-solid connection, contact, expansion and vibration isolation interfaces.

[0130] 7) Using a high-performance workstation, the numerical calculation model of the dynamic acoustic conduction process of solid-solid connection, contact, expansion, and vibration isolation interface is solved in turn according to the parameters set by the scan, and the response side amplitude data under the corresponding parameters is obtained.

[0131] 8) Structuralize the extended data according to interface bonding mode, solid-solid interface structure, constraint conditions, excitation side amplitude, and response side amplitude.

[0132] Step 103: Time-frequency analysis and quantitative characterization of interface data. Specifically, Fourier transform and wavelet transform are used to perform time-frequency analysis and quantitative characterization of solid-solid interface data based on the second structured data, and the time-frequency characteristic data of the solid-solid interface excitation side and the time-frequency characteristic data of the solid-solid interface response side are obtained, and the time-frequency characteristic data of the solid-solid interface excitation side and the time-frequency characteristic data of the solid-solid interface response side are structured to obtain the third structured data. That is, based on the structured data of the solid-solid interface acoustic conduction process, Fourier transform and wavelet transform are used to perform time domain, frequency domain, time-frequency analysis and quantitative characterization, and the amplitude, frequency, phase and other time-frequency characteristic data of the solid-solid interface excitation side and the response side are obtained and structured.

[0133] In actual application, the implementation process of step 103 includes:

[0134] 1) Perform time domain analysis on the data of solid-solid connection, contact, expansion and vibration isolation interface acoustic conduction process, obtain curve data such as excitation side amplitude-time, response side amplitude-time, excitation side and response side amplitude phase difference-time (i.e., first curve data), and extract the maximum value, minimum value, time average value, amplitude, peak-to-peak value, standard deviation and solid-solid contact duty cycle. Among them, the solid-solid contact duty cycle is the percentage of solid-solid interface contact time to the total time.

[0135] 2) Use Fourier transform to perform frequency domain analysis on the data of solid-solid connection, contact, expansion and vibration isolation interface acoustic conduction process, obtain curve data such as excitation side amplitude-frequency, response side amplitude-frequency, excitation side amplitude phase-frequency, response side amplitude phase-frequency (i.e., second surface data), and extract characteristic frequencies, their amplitudes and initial phases.

[0136] 3) Use short-time Fourier transform or wavelet transform to perform time-frequency analysis on all the sound conduction process data of the solid-solid contact interface, and obtain surface data such as amplitude-frequency-time on the excitation side, amplitude-phase-time on the excitation side, amplitude-frequency-time on the response side, and amplitude-phase-time on the response side, and extract the characteristic frequency and the curve data such as amplitude-time on the excitation side and amplitude-time on the response side under the characteristic frequency (i.e., the third curve data) to obtain the time-frequency characteristic data of the excitation side and the response side.

[0137] Among them, for the acoustic conduction process of the solid-solid connection interface, the characteristics of the time domain and frequency domain analysis results are: the amplitude waveform on the response side is complete and unbroken, the frequency is single and the same as the excitation side, and the phase difference between the response side and the excitation side is stable. Otherwise, the state of the solid-solid connection interface is destroyed, and the critical ultrasonic excitation parameters, interface structure and constraint conditions for the destruction of the solid-solid connection interface state are marked. The typical reasons are: insufficient preload on the bolt connection interface, defects or damage on the metallurgical or mechanical connection interface, resulting in separation of the connection interface.

[0138] For the acoustic conduction process of the solid-solid contact interface, the characteristics of the time domain, frequency domain and time-frequency analysis results are: there is no significant asynchronous distortion between the amplitude waveform on the response side and the excitation side, the fundamental frequency of the amplitude on the response side is the main frequency and there is no mutation, the fundamental frequency energy is greater than the sum of the low-frequency and high-frequency energies, and the contact duty cycle increases with the excitation amplitude, otherwise the state of the solid-solid contact interface is destroyed, marking the destruction of the solid-solid connection interface state and the critical ultrasonic excitation parameters, interface structure and constraint conditions of the state changes such as the amplitude of the response side from single frequency to multi-frequency, the amplitude of the excitation side from single frequency to multi-frequency, the main frequency of the response side is separated from the fundamental frequency, and the low-frequency energy of the response side is higher than the high-frequency energy. The typical causes of destruction are: contact interface bonding, dislocation, detachment, material peeling, and severe plastic deformation of the surface.

[0139] For the acoustic conduction process of the solid-solid expansion interface, the characteristics of the time domain and frequency domain analysis results are: the amplitude waveform on the response side is complete and unbroken, the frequency is single and the same as the excitation side, and the phase difference between the response side and the excitation side is stable. Otherwise, the state of the solid-solid expansion interface is destroyed, marking the critical ultrasonic excitation parameters, interface structure and constraint conditions for the destruction of the solid-solid expansion interface state. The typical reasons are: insufficient axial friction at the expansion interface, defects or damage in the expansion structure, resulting in slippage at the expansion interface.

[0140] For the acoustic conduction process of the solid-solid vibration isolation interface, the characteristics of the time domain and frequency domain analysis results are: there is no amplitude on the response side, otherwise the state of the solid-solid vibration isolation interface is destroyed, marking the critical ultrasonic excitation parameters, interface structure and constraints of the solid-solid vibration isolation interface state destruction. The typical reason is: the interface thermal and mechanical constraints exceed the allowable values, resulting in vibration transmission of the vibration isolation material.

[0141] 4) The amplitude, frequency, phase and other time-frequency characteristics and state critical data of the excitation side and response side of the solid-solid interface are structured and organized according to the interface bonding mode ~ solid-solid interface structure ~ interface constraint conditions ~ excitation side time-frequency characteristics ~ response side time-frequency characteristics.

[0142] Step 104: Quantitative modeling of the solid-solid interface acoustic conduction process. Specifically, according to the solid-solid interface bonding state, based on the third structured data, a quantitative relationship model of the solid-solid interface acoustic conduction process is constructed. That is, according to the solid-solid interface bonding mode, interface structure and constraint conditions of the metal melt ultrasonic solidification system, based on the time-frequency characteristic data of the excitation side and the response side of the interface acoustic conduction process, a quantitative relationship model of the solid-solid interface acoustic conduction process is constructed in a mathematical modeling + deep learning manner.

[0143] Among them, by conducting full parameter space quantitative analysis on the prediction and inversion model of the solid-solid connection, contact, expansion and vibration isolation interface sound conduction process (i.e., the quantitative relationship model of the solid-solid interface sound conduction process), the solid-solid interface sound conduction scheme can be optimized, and the optimal sound transmission structure, constraint conditions and ultrasonic excitation parameters of the solid-solid interface of the ultrasonic coagulation system can be determined to improve the efficiency and stability of ultrasonic conduction. Based on the prediction and inversion model of the solid-solid connection, contact, expansion and vibration isolation interface sound conduction process, a quantitative control model can be constructed to realize real-time regulation of the solid-solid interface sound conduction process, improve the control accuracy and efficiency of the ultrasonic conduction process, and facilitate the quantitative research on the ultrasonic coagulation mechanism and the large-scale application of power ultrasound in the research, development, preparation and production of new materials.

[0144] In actual application, the implementation process of step 104 includes:

[0145] 1) Preprocessing of acoustic conduction data: Specifically, mathematical methods are used to establish connections between simple relationships between data to reduce data dimensions, and then all structured data are normalized.

[0146] 2) Neural network structure design. The deep neural network structure of the solid-solid interface acoustic conduction process includes eight sub-networks such as prediction and inversion of solid-solid connection, contact, expansion and vibration isolation interface acoustic conduction process. The sub-network structure consists of an input layer, an output layer and a hidden layer. Among them, the input of the prediction network input layer is the solid-solid interface structure, interface constraints and time-frequency characteristics of the excitation side, and the output of the output layer is the time-frequency characteristics of the response side. The input of the inversion network input layer is the time-frequency characteristics of the response side, and the output of the output layer is the solid-solid interface structure, interface constraints and time-frequency characteristics of the excitation side. The hidden layer can be a fully connected layer, a convolutional layer, a pooling layer, a local connection layer, a recurrent layer, an embedding layer, a fusion layer, a noise layer, a residual layer, an LSTM layer, etc. and any combination thereof to balance the training calculation and model performance.

[0147] 3) Setting of neural network training parameters. Neural network training parameters include the selection of loss function, evaluation function, optimizer, activation function, callback function, initializer, regularizer, etc. and the setting of related parameters. The specific parameters to be set depend on the characteristics of the acoustic conduction data and the network structure.

[0148] 4) Neural network training and optimization. Specifically, a CPU+GPU heterogeneous multi-core parallel high-performance computing platform is used to train the prediction and inversion model (i.e., neural network) of the solid-solid connection, contact, expansion and vibration isolation interface acoustic conduction process. The neural network structure and parameters are optimized based on the analysis of the training results to take into account the model training overhead, computing efficiency and accuracy.

[0149] 5) Verify the performance of the trained neural network. The absolute error and relative error of the neural network prediction and inversion data are analyzed with the experimental measured data. At the same time, linear regression analysis is performed on the measured data and the prediction or inversion data to comprehensively evaluate its effectiveness, reliability and the practicality and applicability of the inversion rules.

[0150] Based on the above description, the present invention has the following advantages over the prior art:

[0151] 1. The present invention adopts synchronous laser vibration measurement and numerical calculation methods to realize the quantitative analysis and characterization of solid-solid connection, contact, expansion and vibration isolation interfaces under different interface structures, excitation parameters and constraint conditions of ultrasonic coagulation system.

[0152] 2. With regard to the solid-solid contact interface during the ultrasonic conduction process, the present invention provides the critical ultrasonic excitation parameters, interface structure and constraint conditions when the amplitude, frequency and energy state of the response side change, thereby ensuring the stability of contact sound transmission.

[0153] 3. According to the structural characteristics of the solid-solid connection, contact, expansion and vibration isolation interface of the ultrasonic coagulation system, the present invention constructs and optimizes the numerical calculation model of the dynamic sound conduction process of the solid-solid interface and expands the interface sound conduction data set.

[0154] 4. The present invention performs time domain, frequency domain and time-frequency analysis on the amplitude data of the solid-solid interface acoustic conduction process based on Fourier and wavelet transforms, thereby realizing the extraction of time-frequency features on the excitation side and the response side and the marking of the critical state.

[0155] 5. The present invention constructs a prediction and inversion model for the solid-solid connection, contact, expansion and vibration isolation interface sound conduction process by means of mathematical modeling + deep learning, thereby improving the solid-solid interface sound conduction efficiency, stability and control accuracy.

[0156] 6. The quantitative analysis, characterization and modeling of the solid-solid interface acoustic conduction process of the metal melt ultrasonic solidification system provided by the present invention can lay the foundation for real-time and precise control of acoustic conduction and high-energy ultrasonic fields, which is conducive to the realization of intelligent controllable melt / molten pool ultrasonic solidification technology and the quantitative research and theoretical system establishment of ultrasonic solidification mechanism.

[0157] Based on specific embodiments, the implementation effect of the quantitative analysis and modeling method of the solid-solid interface acoustic conduction process of the ultrasonic coagulation system provided by the present invention is described below.

[0158] Example 1

[0159] In this embodiment, a typical solid-solid connection interface of the ultrasonic coagulation system is as follows: Figure 2 As shown, the transducer 1 and the amplitude transformer 4 are connected together by bolts 3 to form a solid-solid connection interface 2. When the bolt preload is not less than the peak tensile stress of the longitudinal wave at the solid-solid connection interface, the sound conduction process is stable and reliable. When the bolt preload is less than the peak tensile stress of the longitudinal wave at the solid-solid connection interface and is not always zero, the solid-solid connection interface evolves into a dynamic surface-to-surface contact interface, and there is a waveform missing in the interface separation state. When the bolt preload is always zero, the solid-solid connection interface evolves into a vibration isolation interface, and the longitudinal wave cannot be transmitted.

[0160] Example 2

[0161] Typical solid-solid contact interfaces in ultrasonic coagulation systems are as follows: Figure 3 As shown, the horn 4 and the mold wall 6 are in contact with each other through the preload force to form a solid-solid contact interface 5. When the contact preload force is less than the peak tensile stress of the longitudinal wave at the interface and is not always zero, the law of dynamic contact sound conduction process is followed. When the contact preload force is not less than the peak tensile stress of the longitudinal wave at the interface, the solid-solid contact interface evolves into a point-to-surface connection interface. When the contact preload force is always zero, the solid-solid contact interface evolves into a vibration isolation interface, and the longitudinal wave cannot be transmitted.

[0162] Example 3

[0163] Typical solid-solid expansion interface of ultrasonic coagulation system Figure 4 As shown, the transducer 1 and the amplitude transformer 4 are combined together by the expansion sleeve 7 to form a solid-solid expansion interface 8. When the axial friction force is not less than the peak tensile stress of the longitudinal wave at the interface, the sound conduction process is stable and reliable. When the axial friction force is less than the peak tensile stress of the longitudinal wave at the interface and is not constantly zero, there is a waveform missing in the interface slip state at the solid-solid expansion interface. When the axial friction force is constantly zero, the solid-solid expansion interface evolves into a vibration isolation interface, and the longitudinal wave cannot be transmitted.

[0164] Example 4

[0165] Typical solid-solid vibration isolation interfaces in ultrasonic coagulation systems are as follows: Figure 5 As shown, the mold moving wall surface 9 and the asbestos 11 are combined together to form a solid-solid vibration isolation interface 10, and longitudinal waves cannot be transmitted.

[0166] Example 5

[0167] Typical solid-solid interface synchronous laser vibration measurement in ultrasonic coagulation system Figure 6As shown, the vibration unit includes a fixed seat 12, a transducer 1, a horn 4, a mold 13, a push rod 15 and a cylinder 17. The basic structure is a fixed seat 12 + transducer 1 + horn 4 ~ mold 13 ~ push rod 15 + cylinder 17 + fixed seat 12. The ultrasonic propagation path involves the sound conduction process of the transducer-horn solid connection interface, the horn-mold solid point-surface contact interface, the push rod-mold solid point-surface contact interface, the push rod-cylinder solid-solid connection interface, and the sound radiation process of the mold-melt solid-liquid adhesion interface. For the dynamic sound conduction process of the horn-mold solid point-surface contact interface, two synchronous laser vibrometers are used for synchronous vibration measurement. The arrangements of the vibration measurement points 17 on the excitation side and the response side are as shown in the figure. Figure 6 The casting mold 13 is used to contain the melt 14 .

[0168] In addition, the quantitative analysis and modeling method of the solid-solid interface acoustic conduction process of the ultrasonic coagulation system provided above is in the form of a computer program, which is implemented through a software functional unit and sold or used as an independent product, and can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory, random access memory, disk or optical disk, and other media that can store program codes.

[0169] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0170] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A quantitative analysis and modeling method for the solid-solid interface acoustic conduction process of an ultrasonic coagulation system, characterized in that: include: Determine the solid-solid interface bonding state and the excitation parameter range according to the vibration configuration of the ultrasonic coagulation system, the vibration unit of the ultrasonic coagulation system and the vibration type of the ultrasonic coagulation system; the solid-solid interface bonding state includes the solid-solid interface structure on the ultrasonic propagation path, the solid-solid interface bonding mode and the constraint conditions; According to the solid-solid interface bonding state, using a vibration meter to measure the excitation side amplitude and the response side amplitude of different solid-solid interfaces within the excitation parameter range to obtain experimental data, and structuring the experimental data to obtain first structured data; According to the solid-solid interface bonding state, based on the first structured data, the numerical value of the solid-solid interface dynamic acoustic conduction process is calculated to obtain extended data, and the extended data is structured to obtain second structured data; Fourier transform and wavelet transform are used to perform time-frequency analysis and quantitative characterization of solid-solid interface data based on the second structured data to obtain time-frequency characteristic data of the solid-solid interface excitation side and time-frequency characteristic data of the solid-solid interface response side, and the time-frequency characteristic data of the solid-solid interface excitation side and the time-frequency characteristic data of the solid-solid interface response side are structured to obtain third structured data; the time-frequency characteristic data of the solid-solid interface excitation side and the time-frequency characteristic data of the solid-solid interface response side both include: amplitude, frequency and phase; According to the solid-solid interface bonding state and based on the third structured data, a quantitative relationship model of the solid-solid interface acoustic conduction process is constructed; Among them, according to the solid-solid interface bonding state, the numerical value of the solid-solid interface dynamic acoustic conduction process is calculated based on the first structured data to obtain extended data, and the extended data is structured to obtain the second structured data, specifically including: According to the structural characteristics of the solid-solid interface of the ultrasonic coagulation system, a numerical calculation model of the dynamic acoustic conduction process of the solid-solid interface is constructed; Optimizing the numerical calculation model according to the first structured data; Determining a solid-solid interface structural parameter range; the solid-solid interface structural parameter range includes material parameters, shape parameters, size parameters and surface state; Formulate a data expansion plan according to the solid-solid interface structure parameter range, and list all solid-solid interface parameter combinations; Based on all solid-solid interface parameter combinations, the material constitutive structure and parameters used in the expansion of solid-solid interface acoustic conduction data and interface state data are obtained from the solid material database; According to the data expansion scheme, respectively setting the optimized scanning parameters of the numerical calculation model; Sequentially solving the optimized numerical calculation model based on the scanning parameters to obtain amplitude data of the response side under each scanning parameter; Structuring the amplitude data according to the solid-solid interface bonding mode, the solid-solid interface structure, the constraint condition, the excitation side amplitude, and the response side amplitude to obtain the second structured data; According to the structural characteristics of the solid-solid interface of the ultrasonic coagulation system, a numerical calculation model of the dynamic acoustic conduction process of the solid-solid interface is constructed, including: According to the solid-solid interface structure, constraint conditions and ultrasonic excitation parameters, compile the numerical calculation model control parameter table; According to the shapes and sizes of the solid on the excitation side and the response side of the solid-solid interface, as well as the vibration position of the excitation source and the vibration measuring position of the vibration meter, the calculation domain of the solid-solid interface acoustic conduction model and the geometric model of the solid-solid interface are determined; Meshing the geometric model of the solid-solid interface with tetrahedral or hexahedral meshes to obtain a solid mechanics module, and setting the material properties of the excitation side solid and the response side solid in the solid mechanics module; According to the structural characteristics of the solid-solid interface of the ultrasonic coagulation system, the surface state and control equation of the solid on the excitation side of the solid-solid interface, the surface state and control equation of the solid on the response side and the boundary conditions are set to obtain the wave equation; The excitation vibration source is set according to the excitation amplitude data measured by the solid-solid interface experiment, and the transient state of the wave equation is iteratively solved using the solid mechanics module until the calculation process converges and the solid amplitude data on the excitation side is stable and undistorted. The corresponding wave equation is used as the numerical calculation model.

2. The method for quantitative analysis and modeling of solid-solid interface acoustic conduction process in ultrasonic coagulation system according to claim 1, characterized in that: The solid-solid interface of the ultrasonic coagulation system includes: connection interface, contact interface, expansion interface and vibration isolation interface; The solid-solid interface acoustic conduction process of the ultrasonic coagulation system refers to the dynamic response process of the solid-solid interface response side of the ultrasonic coagulation system to the time-frequency characteristics of the excitation side.

3. The method for quantitative analysis and modeling of solid-solid interface acoustic conduction process in ultrasonic coagulation system according to claim 1, characterized in that: The solid-solid interface bonding state and the excitation parameter range are determined according to the vibration configuration of the ultrasonic coagulation system, the vibration unit of the ultrasonic coagulation system and the vibration type of the ultrasonic coagulation system, specifically including: Determine the vibration configuration of the ultrasonic coagulation system, the vibration unit of the ultrasonic coagulation system and the vibration type of the ultrasonic coagulation system in sequence, and clarify the range of excitation parameters; the range of excitation parameters includes frequency, amplitude and phase; Analyzing the solid-solid interface structure on the acoustic propagation path according to the vibration type of the ultrasonic coagulation system to determine interface structure parameters, and determining different solid-solid interface structures based on the interface structure parameters; the interface structure parameters include material parameters, shape parameters, size parameters and surface state; Determine the solid-solid interface bonding mode and constraint condition parameters according to four types of modes: connection, contact, expansion and vibration isolation; According to the maximum restoring force of the longitudinal wave on the solid-solid interface, the critical amplitude-frequency characteristic curve of the solid-solid interface is determined and corrected according to the interface temperature as the constraint condition of the solid-solid interface excitation parameters.

4. The method for quantitative analysis and modeling of solid-solid interface acoustic conduction process in ultrasonic coagulation system according to claim 1, characterized in that: According to the solid-solid interface bonding state, a vibration meter is used to measure the excitation side amplitude and the response side amplitude of different solid-solid interfaces within the excitation parameter range to obtain experimental data, and the experimental data is structured to obtain first structured data, specifically including: Based on the ultrasonic coagulation system, two sets of laser vibrometers supporting external hardware synchronous triggering and an intelligent control host are used to build an automatic measurement system for solid-solid interface acoustic conduction data; The vibration measuring points are determined according to the spatial position accessibility of the solid-solid interface, the vibration modes of the solid on the excitation side and the solid on the response side, the data of the vibration measuring points are obtained by using the automatic determination system of the solid-solid interface acoustic conduction data, and the vibration amplitude on the excitation side is obtained by solid vibration mode conversion; the vibration measuring points are the vibration measuring points of the solid on the excitation side and the solid on the response side; According to the excitation parameter range and constraint conditions, a vibration measurement scheme is designed based on the principles of orthogonality and uniformity, and experimental points are determined within the excitation parameter range and constraint conditions; Control the influence of irrelevant variables according to the vibration measurement scheme, compile the vibration measurement test program, and the vibration measurement test process; According to the solid-solid interface structure and the solid-solid interface bonding mode, all solid-solid interfaces of the ultrasonic coagulation system are traversed to obtain experimental vibration measurement data, and all experimental vibration measurement data are structured according to the solid-solid interface bonding mode, solid-solid interface structure, constraint conditions, excitation side amplitude, and response side amplitude to obtain the first structured data.

5. The method for quantitative analysis and modeling of solid-solid interface acoustic conduction process in ultrasonic coagulation system according to claim 4, characterized in that: The vibration test program includes: equipment self-check program segment, equipment parameter control program segment, experimental vibration test program segment, data recording program segment and emergency handling program segment.

6. The method for quantitative analysis and modeling of solid-solid interface acoustic conduction process in ultrasonic coagulation system according to claim 1, characterized in that: Optimizing the numerical calculation model according to the first structured data specifically includes: Based on the numerical calculation model, the error analysis of the simulated amplitude of the vibration point on the response side of the solid-solid interface acoustic conduction process and the experimental measured value is performed in the time domain and frequency domain to determine the error source; Analyze the residuals of the calculation process of dynamic acoustic conduction at the solid-solid interface, determine the convergence of the iterative process of the numerical calculation model, and evaluate the source of the problem of the numerical calculation model; Change the mesh type to optimize the mesh quality and adjust the time step; Optimize the surface state and control equation of the solid on the excitation side of the solid-solid interface and the surface state and control equation of the solid on the response side, and adjust the parameters of the solid-solid interface so that the parameters of the solid-solid interface match the actual interface bonding state; Optimizing the way boundary conditions are applied so that the boundary conditions match the actual sound conduction process; Optimize and coordinate initial conditions; Optimize material constitutive structure and adjust material parameters to match the actual metal material; Change the solver type, iterative algorithm, and solver parameters; Return to executing the step of performing error analysis in time domain and frequency domain on the simulated amplitude of the vibration point on the response side of the solid-solid interface acoustic conduction process and the experimental measured value based on the numerical calculation model to determine the source of the error, until the error between the simulated amplitude of the vibration point on the response side of the solid-solid interface acoustic conduction process and the experimental measured value is within a set range, thereby obtaining the optimized numerical calculation model.

7. The method for quantitative analysis and modeling of solid-solid interface acoustic conduction process in ultrasonic coagulation system according to claim 1, characterized in that: Fourier transform and wavelet transform are used to perform time-frequency analysis and quantitative characterization of solid-solid interface data based on the second structured data, specifically including: Performing time domain analysis on the solid-solid interface acoustic conduction process data to obtain first curve data, and extracting the maximum value, minimum value, time average value, amplitude, peak-to-peak value, standard deviation and solid-solid contact duty cycle of the first curve data; the first curve data includes: an excitation side amplitude-time curve, a response side amplitude-time curve and an excitation side and response side amplitude phase difference-time curve; Fourier transform is used to perform frequency domain analysis on the solid-solid interface acoustic conduction process data to obtain second curve data, and characteristic frequency, amplitude of characteristic frequency and initial phase of characteristic frequency of the second curve data are extracted; the second curve data includes an excitation side amplitude-frequency curve, a response side amplitude-frequency curve, an excitation side amplitude phase-frequency curve and a response side amplitude phase-frequency curve; Short-time Fourier transform or wavelet transform is used to perform time-frequency analysis on the sound conduction process data of the solid-solid contact interface to obtain surface data, and extract the characteristic frequency of the surface data and the third curve data under the characteristic frequency; the third curve data includes: the amplitude-time curve on the excitation side and the amplitude-time curve on the response side; the surface data includes: the amplitude-frequency-time surface on the excitation side, the amplitude-phase-time surface on the excitation side, the amplitude-frequency-time surface on the response side, and the amplitude-phase-time surface on the response side.

8. The method for quantitative analysis and modeling of solid-solid interface acoustic conduction process in ultrasonic coagulation system according to claim 7, characterized in that: According to the solid-solid interface bonding state and based on the third structured data, a quantitative relationship model of the solid-solid interface acoustic conduction process is constructed, which specifically includes: Preprocessing the acoustic conduction data in the third structured data; Constructing a neural network; the neural network includes a plurality of sub-network structures for predicting and inverting the solid-solid interface acoustic conduction process; each of the sub-network structures is composed of an input layer, an output layer and a hidden layer; Set the training parameters of the neural network; Based on the set training parameters, a CPU+GPU heterogeneous multi-core parallel computing platform is used to predict and invert the solid-solid interface acoustic conduction process to train the neural network and obtain a trained neural network; The trained neural network is used as a quantitative relationship model of the solid-solid interface acoustic conduction process.

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