A water-permeable material and its preparation method and application
By using rice husk ash and high-functional phenolic epoxy resin in permeable materials, the problem of low permeability of existing permeable materials is solved, the high permeability and good bending strength of the material are achieved, and the application prospects are improved. .
Patent Information
- Application Number
- CN202410107350.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-25
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2044-01-25
AI Technical Summary
The existing permeable materials have low permeability, which affects their application in decoration, grouting molds and other fields.
When preparing water-permeable materials, rice husk ash is used as the key component, and its porous structure is used to significantly improve the water permeability. At the same time, the bending strength of the material is improved by cross-linking using high-functional phenolic epoxy resin.
The permeability and bending strength of permeable materials are significantly improved, allowing them to exhibit excellent performance in home decoration and industrial mold applications.
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Figure CN118027611B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of materials, and in particular relates to a water-permeable material and a preparation method and application thereof. Background Art
[0002] Permeable materials are often used as permeable paving materials and home-related materials due to their certain water permeability and air permeability. For example, they are used for ground decoration in residential areas, parking lots, etc. They can also be used in grouting molds, blister molds and other fields. Permeable materials in related technologies usually use resin as the base material, and the raw materials of permeable materials usually include resin, curing agent and inorganic filler. However, at present, the permeability of permeable materials in related technologies is relatively low, which affects the application of permeable materials to a certain extent. Summary of the invention
[0003] The present invention aims to solve at least one of the technical problems existing in the above-mentioned prior art. To this end, the present invention proposes the use of rice husk ash in the preparation of water-permeable materials. By using rice husk ash to prepare water-permeable materials, the obtained water-permeable materials have good water permeability.
[0004] The invention also provides a water-permeable material.
[0005] The invention also provides a method for preparing the water-permeable material.
[0006] The present invention also proposes application of the water-permeable material.
[0007] The first aspect of the present invention provides the use of rice husk ash in preparing water-permeable materials.
[0008] The unique porous structure of agricultural waste rice husk ash (the ash remaining after burning rice husks) can significantly improve the water permeability of the material by using rice husk ash to prepare permeable materials.
[0009] The second aspect of the present invention provides a water-permeable material, wherein raw materials for preparing the water-permeable material include: a resin material, a curing agent, rice husk ash and an inorganic filler.
[0010] The water-permeable material according to the embodiment of the present invention has at least the following beneficial effects:
[0011] The present invention utilizes the unique porous structure of agricultural waste rice husk ash, and significantly improves the water permeability of the material without reducing the bending strength of the water permeable material. For example, in some embodiments of the present invention, the water permeability of the water permeable material can reach more than 390mL / min; at the same time, epoxy resin (such as epoxy resin) is used as the matrix material, so that the obtained water permeable material has good mechanical properties. For example, in some embodiments of the present invention, the bending strength of the water permeable material can reach more than 12.4MPa. The water permeable material in the present invention is applied to household materials or to grouting molds and blister molds due to its excellent water permeability and mechanical properties, and has good application prospects.
[0012] In some embodiments of the present invention, the water permeable material is an epoxy resin water permeable material.
[0013] In some embodiments of the present invention, the epoxy resin water permeable material is a porous epoxy resin water permeable material.
[0014] In some embodiments of the present invention, in the water-permeable material, the mass fraction of the rice husk ash is 0.01%-35%, such as optionally 0.01%-20%.
[0015] In some embodiments of the present invention, in the raw materials for preparing the water-permeable material, the mass fraction of the rice husk ash is 0.01%-35%, such as optionally 0.01%-15%.
[0016] In some embodiments of the present invention, the mass ratio of the resin material, rice husk ash and inorganic filler is (50-600):(0.05-200):(0.05-600), such as (100-300):(0.1-100):(0.1-400).
[0017] In some embodiments of the present invention, the mass ratio of the resin material to the curing agent is (50-600):(10-400), such as (100-300):(50-200).
[0018] In some embodiments of the present invention, the rice husk ash is the ash remaining after burning rice husk.
[0019] In some embodiments of the present invention, the method for preparing rice husk ash comprises: burning rice husk in an air atmosphere at 200-1000° C. to obtain the rice husk ash. Optionally, the burning time is 0.5-20 hours. Specifically, the burning time may be 200-600° C. for 2 hours.
[0020] In some embodiments of the present invention, the resin material includes at least one of epoxy resin or acrylic resin.
[0021] In some embodiments of the present invention, the epoxy resin comprises bisphenol A epoxy resin and multifunctional novolac epoxy resin, wherein the functionality of the multifunctional novolac epoxy resin is greater than 2.
[0022] In the related art, difunctional epoxy resin is usually used to form a linear cross-linked structure with a low cross-linking density. In the present invention, a high-functionality phenolic epoxy resin (functionality>2) is used for modification to form a network cross-linking, so that the cross-linking density of the resin curing is improved, and the strength of the epoxy resin water-permeable material is further improved, such as improving the bending strength and glass transition temperature of the epoxy resin water-permeable material, so that the mechanical properties and heat resistance of the material are improved, and due to the network cross-linking of the high-functionality phenolic epoxy resin, the water permeability of the epoxy resin water-permeable material is better.
[0023] In some embodiments of the present invention, the functionality of the multifunctional phenolic epoxy resin is 2.5-4, such as 2.5-3.6.
[0024] In some embodiments of the present invention, the epoxy equivalent of the multifunctional phenolic epoxy resin is 120-350, such as 170-210.
[0025] In some embodiments of the present invention, the mass ratio of the bisphenol A epoxy resin to the multifunctional novolac epoxy resin is (10-350):(10-350), such as (50-200):(50-200).
[0026] In some embodiments of the present invention, the epoxy equivalent of the bisphenol A epoxy resin is 120-400, such as 170-250.
[0027] In some embodiments of the present invention, the functionality of the bisphenol A epoxy resin is 2.
[0028] In some embodiments of the present invention, the curing agent is a polyamide curing agent.
[0029] In some embodiments of the present invention, the polyamide curing agent may include a polyamide obtained by reacting dimer acid, oleic acid and a fatty amine. Optionally, the molecular weight of the polyamide is not limited. Optionally, the fatty amine may be selected from tetraethylenepentamine and the like.
[0030] In some embodiments of the present invention, the polyamide curing agent may be a polyamide resin formed by condensation of dimerized vegetable oil fatty acid and fatty amine.
[0031] In some embodiments of the present invention, the inorganic filler includes at least one of silicon dioxide, aluminum oxide, titanium dioxide, quartz, talc or calcium carbonate.
[0032] In some embodiments of the present invention, the particle size of the inorganic filler is 0.01-200 μm, such as 1-50 μm.
[0033] In some embodiments of the present invention, the preparation raw materials further include glass microspheres.
[0034] In some embodiments of the present invention, the particle size of the glass microspheres is 2-300 μm, such as 10-150 μm.
[0035] In some embodiments of the present invention, the mass ratio of the resin material to the glass microspheres is (50-600):(0.05-600), such as (100-300):(0.1-400).
[0036] In some embodiments of the present invention, the preparation raw materials further include a coupling agent and a dispersant.
[0037] In some embodiments of the present invention, the coupling agent may be an organosilicon coupling agent having an amino group or an epoxy group.
[0038] In some embodiments of the present invention, the coupling agent includes at least one of 3-(trimethoxysilyl)-1-propylamine, 3-glycidyloxypropyltrimethoxysilane, 3-(2,3-epoxypropoxy)propyltrimethoxysilane (KH560), N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane (KH792) or a polymer coupling agent.
[0039] In some embodiments of the present invention, the polymer coupling agent includes C-8001, such as C-8001 from BYK Chemical.
[0040] In some embodiments of the present invention, the dispersant includes but is not limited to styrene maleic acid copolymer, unsaturated polyacid polymer, etc., for example, BYK-199, etc.
[0041] In some embodiments of the present invention, the mass ratio of the resin material to the coupling agent and the dispersant is (50-600):(0.05-50):(0.05-50), such as (100-300):(0.1-10):(0.1-10).
[0042] In some embodiments of the present invention, the preparation raw materials further include solvent I.
[0043] In some embodiments of the present invention, the solvent I includes at least one of water or an alcohol. Optionally, the alcohol includes at least one of ethylene glycol or diethylene glycol.
[0044] In some embodiments of the present invention, the mass ratio of the resin material to the solvent I is (50-600):(50-500), such as (100-300):(50-300).
[0045] In some embodiments of the present invention, the water permeability of the water permeable material is above 180 mL / min, such as 180-500 mL / min.
[0046] The third aspect of the present invention provides a method for preparing a water-permeable material, comprising the following steps: mixing and curing raw materials including a resin material, a curing agent, rice husk ash and an inorganic filler to obtain the water-permeable material.
[0047] In some embodiments of the present invention, the water permeable material is an epoxy resin water permeable material.
[0048] In some embodiments of the present invention, the preparation method comprises the following steps: mixing epoxy resin, curing agent, glass beads, rice husk ash, coupling agent, dispersant, inorganic filler and solvent I, and curing to obtain epoxy resin water-permeable material.
[0049] In some embodiments of the present invention, the preparation method comprises the following steps:
[0050] S1, mixing a mixture containing bisphenol A epoxy resin and multifunctional phenolic epoxy resin with a curing agent to prepare a mixed material II;
[0051] The remaining raw materials are mixed to prepare a mixed material I;
[0052] S2, mixing the mixed material I and the mixed material II, and curing them to obtain the epoxy resin water-permeable material.
[0053] In some embodiments of the present invention, before mixing the mixed material I and the mixed material II, the mixed material I is maintained in a stirring state; and / or the mixed material II is maintained in a stirring state;
[0054] In some embodiments of the present invention, the step of preparing the mixed material I in step S1 specifically includes the following operations:
[0055] After feeding, the mixture is preheated to 26-32°C, dispersed for 1-10 minutes, vacuumed to <-0.09Mpa, and maintained in vacuum for 10-60 minutes to obtain mixed material I; preferably, the preheating temperature is 28-30°C. Preferably, the dispersion speed is 500-2000rpm.
[0056] Through the above implementation, preheating to 26-32°C not only makes the rice husk ash, inorganic filler (such as silica powder), and glass microbeads dispersed more evenly in the solvent I, but also can maintain the temperature stable after adding epoxy resin and curing agent in the subsequent steps, and it is not easy to make the resin cure too fast and gel prematurely, and it is not easy to make the filler sink and stratify, so that the prepared epoxy resin permeable material has a good pore size distribution and better permeability. Dispersing for 1-10 minutes can make the rice husk ash, inorganic filler, and glass microbeads dispersed more evenly in water, and the dispersion effect is good. The purpose of vacuuming is to expel the air in the mixed material I, and it is not easy to have bubbles during the resin curing process to affect the porosity of the obtained porous resin. Vacuuming to <-0.09MPa can make bubbles easier to remove and exhaust faster, improve production efficiency, and improve the performance of epoxy resin permeable materials.
[0057] In some embodiments of the present invention, the step of preparing the mixed material I in step S1 specifically includes the following operations:
[0058] Preheat the material temperature to 28-30°C, disperse at a high speed of 1200-1800rpm for 4-6min, evacuate to less than -0.095MPa, maintain the vacuum state for 15-30min to obtain mixed material I, vent and maintain stirring.
[0059] In some embodiments of the present invention, the step of preparing the mixed material II in step S1 specifically includes the following operations:
[0060] Mix bisphenol A epoxy resin and polyfunctional phenolic epoxy resin, add curing agent, and stir and disperse at 26-32°C and vacuum degree <-0.085Mpa to obtain mixed material II. Preferably, stir and disperse at 28-30°C.
[0061] Through the above implementation, stirring and dispersing are performed at 26-32°C, so that the resin is not easy to solidify too fast or too slow. The purpose of dispersion is to make the added mixed material I and the resin form Winsor III multiphase microemulsion and emulsify more fully. The purpose of vacuum degree <-0.085MPa is to discharge the bubbles in the mixture, so that the pore distribution and porosity are not easily affected during solidification, which can make it easier to remove bubbles and exhaust faster, improve production efficiency, and make it difficult for the resin to gel in advance before being poured into the mold.
[0062] In some embodiments of the present invention, the step of preparing the mixed material II in step S1 specifically includes the following operations:
[0063] Bisphenol A epoxy resin and polyfunctional phenolic epoxy resin are put into dispersion kettle II for stirring, and curing agent is added. The mixture is dispersed at 28-30° C., vacuum degree <-0.085 MPa, and a speed of 1000-2000 rpm to obtain mixed material II.
[0064] The high-speed dispersion speed is 1000-2000rpm, which not only makes the mixed material I and the resin fully emulsified to form Winsor III multiphase microemulsion, but also prevents the system temperature from being too high due to the dispersion speed being too high, resulting in the resin curing too quickly.
[0065] In some embodiments of the present invention, in step S2, mixed material II is added to mixed material I under stirring, and vacuum is drawn <-0.085MPa while dispersing for 1-10 minutes, and high-speed dispersion is turned off to obtain a mixed slurry, which is cured to obtain the epoxy resin permeable material.
[0066] In some embodiments of the present invention, in step S2, the mixed material I is added within 3-10 minutes.
[0067] In some embodiments of the present invention, in step S2, the curing treatment includes first curing at 20-30°C for 10-60h, then curing at 50-65°C for 0.5-4h, and then curing at 70-90°C for 0.5-4h.
[0068] In some embodiments of the present invention, in step S2, the curing treatment includes first curing at 20-30°C for 10-60h, then curing at 50-65°C for 0.5-4h, and then curing at 70-90°C for 0.5-4h, and then placing at 20-30°C for 10-60h.
[0069] The fourth aspect of the present invention proposes the use of the above-mentioned permeable material in the preparation of molds, the preparation of permeable paving materials or the preparation of home furnishing materials.
[0070] In some embodiments of the present invention, the mold includes but is not limited to a slip casting mold, a blister mold, etc., specifically a ceramic slip casting mold or a blister mold, etc. BRIEF DESCRIPTION OF THE DRAWINGS
[0071] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0072] Figure 1 This is a microscopic test result diagram of rice husk ash in Example 1 of the present invention;
[0073] Figure 2 This is a schematic diagram of the process flow of preparing the epoxy resin water-permeable material in Example 1 of the present invention;
[0074] Figure 3 This is a microscopic test result diagram of the epoxy resin water-permeable material in Example 1 of the present invention;
[0075] Figure 4 This is a microscopic test result diagram of the epoxy resin water-permeable material in Example 2 of the present invention;
[0076] Figure 5 This is a microscopic test result diagram of the epoxy resin water-permeable material in Comparative Example 1;
[0077] Figure 6 This is a microscopic test result diagram of the epoxy resin water-permeable material in Comparative Example 2;
[0078] Figure 7 This is a microscopic test result diagram of the raw material silicon dioxide powder of the example. DETAILED DESCRIPTION
[0079] The following will be combined with the embodiments to clearly and completely describe the concept of the present invention and the technical effects produced, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.
[0080] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0081] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0082] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0083] If not otherwise specified, the temperature in the specific implementation mode is room temperature, that is, in the range of 20-30° C., and will not have a significant impact on the test results.
[0084] The experimental methods in the following examples without specifying specific conditions are generally carried out according to conventional conditions in the art or conditions recommended by the manufacturers; the raw materials and reagents used, unless otherwise specified, are all raw materials and reagents that can be obtained from commercial channels such as conventional markets.
[0085] Rice husk ash is the ash remaining after burning rice husks. The microscopic test results are shown in the figure below. Figure 1 As shown in FIG. 1 (surface morphology magnified 100,000 times by a scanning electron microscope), the incineration conditions are: calcination at 200°C for 2h, 400°C for 2h, or 600°C for 2h in an air atmosphere; the rice husk can also be incinerated at other temperatures;
[0086] Bisphenol A epoxy resin: E-44, Baling Petrochemical, obtained by the reaction of bisphenol A and epichlorohydrin; epoxy equivalent weight is 170-250, functionality is 2;
[0087] Multifunctional phenolic epoxy resin: NPPN 638S Nan Ya, obtained by reacting linear phenolic resin and epichlorohydrin; epoxy equivalent weight is 170-210, functionality is 2.5-3.6;
[0088] Polyamide curing agent (containing polyamide and water): dimer acid (CAS No. 61788-89-4), oleic acid (CAS No. 112-80-1) and tetraethylene pentamine (CAS No. 112-57-2) are reacted at a weight ratio of 1:2:2 at 230° C. under nitrogen protection for 3-4 hours to obtain polyamide, which is then cooled to below 100° C. and diluted with water to obtain a polyamide curing agent with a solid content of 50%; wherein the weight ratio of dimer acid, oleic acid and tetraethylene pentamine is (1-2):(1-2):2;
[0089] Glass beads: particle size is 10-150μm;
[0090] Silica powder: particle size is 1-50μm;
[0091] Coupling agent: C-8001, BYK Chemical; KH560 or KH792 can also be used;
[0092] Dispersant: BYK-199, BYK Chemical; other styrene maleic acid copolymers, unsaturated polyacid polymers, etc. can also be used;
[0093] Example 1
[0094] This embodiment discloses an epoxy resin water-permeable material, and the preparation process thereof specifically includes:
[0095] (I) The ingredients are prepared according to the following proportions, calculated by weight:
[0096] Component 1: bisphenol A epoxy resin: 50 parts; polyfunctional phenolic epoxy resin: 50 parts;
[0097] Component 2: polyamide curing agent: 100 parts;
[0098] Component 3: rice husk ash: 50 parts; glass microspheres: 200 parts; silicon dioxide powder: 100 parts; coupling agent: 3 parts; dispersant: 3 parts; water: 150 parts;
[0099] (II) According to the proportion, water, coupling agent and dispersant in component 3 are first added into dispersion kettle 1 for stirring, and then rice husk ash, silica powder and glass beads are added, and a constant temperature water bath is turned on to preheat the material temperature to 28-30°C, and at this temperature: high-speed dispersion is performed at 1500rpm for 5 minutes, vacuum is drawn <-0.095MPa, the vacuum state is maintained for 15-30 minutes, and then emptied and the stirring state is maintained;
[0100] (III) According to the proportion, component 1 is put into high-speed dispersion kettle 2 and stirred evenly, then component 2 is added, stirring is started, and a constant temperature water bath is opened to maintain the material temperature of the dispersion kettle at 28-30°C during the entire stirring process. At this temperature: high-speed dispersion is started at 1500rpm, and the mixed material of component 3 obtained in the step is slowly drawn into dispersion kettle 2 at a uniform flow rate within 5 minutes, and then vacuum is drawn <-0.085MPa while high-speed dispersion is performed for 3 minutes, and the high-speed dispersion is closed and emptied to obtain a mixed slurry; the material is discharged into a mold for casting; wherein the curing conditions in the casting are: curing at room temperature for 24 hours, then curing at 60°C for 2 hours, and then curing at 80°C for 2 hours, and then placed at room temperature for 24 hours to obtain an epoxy resin permeable material.
[0101] Example 2
[0102] This embodiment discloses an epoxy resin water-permeable material, which is different from Embodiment 1 in that, in this embodiment, component 1 is, by mass, 100 parts of bisphenol A epoxy resin and 0 parts of polyfunctional phenolic epoxy resin; the rest is the same as Embodiment 1.
[0103] Comparative Example 1
[0104] This comparative example discloses an epoxy resin water-permeable material, which is different from Example 1 in that, in this comparative example, component 1 is, by mass, 100 parts of bisphenol A epoxy resin and 0 parts of polyfunctional phenolic epoxy resin; component 2 does not contain rice husk ash, and the rest is the same as Example 1.
[0105] Comparative Example 2
[0106] This comparative example discloses an epoxy resin water-permeable material, which is different from Example 1 in that component 2 of this comparative example does not contain rice husk ash, and the rest is the same as Example 1.
[0107] Comparative Example 3
[0108] This comparative example discloses an epoxy resin water-permeable material, which is different from comparative example 1 in that in this comparative example, the preheating temperature in step (II) is 23-25°C, and the stirring temperature in step (III) is 23-25°C, which is different from 28-30°C in comparative example 1.
[0109] Comparative Example 4
[0110] This comparative example discloses an epoxy resin water-permeable material, which is different from comparative example 1 in that in this comparative example, the vacuuming operation in steps (II) to (III) is eliminated.
[0111] Comparative Example 5
[0112] This comparative example discloses an epoxy resin water-permeable material, which is different from comparative example 1 in that in this comparative example, the preheating temperature in step (II) is 35° C. (stirring temperature), and the stirring temperature in step (III) is 35° C., which is different from 28-30° C. in comparative example 1. The high temperature of 35° C. during the stirring process causes the material to gel during high-speed dispersion, affecting the performance of the epoxy resin water-permeable material.
[0113] Comparative Example 6
[0114] This comparative example discloses an epoxy resin water-permeable material, which is different from comparative example 1 in that in this comparative example, the preheating temperature in step (II) is 20°C (stirring temperature), and the stirring temperature in step (III) is 20°C, which is different from 28-30°C in comparative example 1. The low temperature of 20°C during the stirring process causes the filler in the material to sink and delaminate, and the flexural strength and water permeability are greatly reduced.
[0115] Test example
[0116] This test example tests the performance of the epoxy resin water-permeable materials obtained in the examples and comparative examples, specifically including:
[0117] 1) The microscopic test results of the epoxy resin water-permeable materials obtained in Example 1-2 and Comparative Example 1-2 are as follows: Figure 2-6 shown.
[0118] 2) Bending strength test: The mixed slurry obtained in step (III) of each embodiment and comparative example was cast into a 12cm*2cm*2cm strip mold and cured at room temperature for 24 hours, then cured at 60℃ / 2h and 80℃ / 2h, and then placed at room temperature for 24 hours for a bending strength test. The test conditions were: indenter radius 5mm, span 100mm, and pressing speed 2mm / min.
[0119] 3) Water permeability test: The mixed slurry obtained in step (III) of each embodiment and comparative example was placed in a circular mold with a diameter of 28 mm and a thickness of 15 mm for curing at room temperature for 24 hours, then cured at 60°C / 2 hours and 80°C / 2 hours, and then placed at room temperature for 24 hours before testing. The test sample was placed in a constant temperature and constant pressure water flow test system, the pressure difference was set to 0.4 MPa, the temperature was set to 25°C, and the water permeability was tested using pure water filtered by reverse osmosis.
[0120] The measured results are shown in Table 1 below:
[0121] Table 1
[0122] Experimental example Bending strength MPa Water permeability mL / min Example 1 12.4 393 Example 2 11.46 223 Comparative Example 1 8.99 113 Comparative Example 2 11.01 175 Comparative Example 3 7.11 72.5 Comparative Example 4 6.34 131
[0123] Compared with Example 1, after adding multifunctional phenolic epoxy resin in Example 2, the flexural strength of the epoxy resin permeable material is increased by 22.5%, and after adding rice husk ash in Example 2, the flexural strength of the material is increased by 27.5%. In Example 1, multifunctional phenolic epoxy resin and rice husk ash are added at the same time, and the flexural strength of the material is increased by 37.9%.
[0124] Compared with comparative example 1, after adding multifunctional phenolic epoxy resin to comparative example 2, the water permeability of epoxy resin water permeable material increased by 54.8%, and after adding rice husk ash to embodiment 2, the water permeability of the material increased by 97.3%, while in embodiment 1, multifunctional phenolic epoxy resin and rice husk ash were added at the same time, and the water permeability of the material increased by 247.7%. Among them, compared with comparative example 1, after adding rice husk ash to embodiment 2, the effect of rice husk ash on the bending strength of the material is better than that of multifunctional phenolic resin, the porous structure of rice husk ash forms a firm connection with the resin, and the movement of the resin molecular chain is restricted to a certain extent, therefore, the bending strength of the water permeable material of embodiment 2 is improved.
[0125] If there is no special explanation, the actual meaning of "about" in the present invention is that the error is allowed within the range of ±2%, for example, about 100 is actually 100±2%×100. The "normal temperature" or "room temperature" in the present invention, unless otherwise specified, is about 20-30°C.
[0126] Unless otherwise specified, “between” in the present invention includes the number itself, for example, “between 2-3” includes the endpoint values 2 and 3.
[0127] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.
Claims
1. A water-permeable material, characterized in that: The raw materials for preparing the water permeable material include: resin material, curing agent, rice husk ash, glass beads and inorganic filler; the resin material includes epoxy resin, the epoxy resin includes bisphenol A epoxy resin and multifunctional phenolic epoxy resin, wherein the functionality of the multifunctional phenolic epoxy resin is greater than 2; the curing agent is a polyamide curing agent; the inorganic filler includes at least one of silicon dioxide, aluminum oxide, titanium dioxide, quartz, talcum powder or calcium carbonate; The mass ratio of the resin material, rice husk ash and inorganic filler is (50-600):(0.05-200):(0.05-600), and the mass ratio of the resin material to the glass microbeads is (50-600):(0.05-600); In the water-permeable material, the mass fraction of the rice husk ash is 0.01%-35%; The particle size of the inorganic filler is 0.01-200 μm; the particle size of the glass microbeads is 2-300 μm.
2. The water-permeable material according to claim 1, characterized in that: The mass ratio of the resin material, rice husk ash and inorganic filler is (100-300):(0.1-100):(0.1-400).
3. The water-permeable material according to claim 1, characterized in that: The method for preparing the rice husk ash comprises: burning rice husks at 200-1000° C. in an air atmosphere to obtain the rice husk ash.
4. The water-permeable material according to claim 1, characterized in that: The functionality of the multifunctional phenolic epoxy resin is 2.5-4.
5. The water-permeable material according to claim 1, characterized in that: The epoxy equivalent of the multifunctional phenolic epoxy resin is 120-350.
6. The water-permeable material according to claim 1, characterized in that: The epoxy equivalent of the bisphenol A epoxy resin is 120-400.
7. The water-permeable material according to claim 1, characterized in that: The mass ratio of the bisphenol A epoxy resin to the multifunctional novolac epoxy resin is (10-350):(10-350).
8. The water-permeable material according to claim 1, characterized in that: The mass ratio of the resin material to the curing agent is (50-600):(10-400).
9. The water-permeable material according to claim 1, characterized in that: The preparation raw materials also include a coupling agent and a dispersant.
10. The water-permeable material according to claim 9, characterized in that: The coupling agent includes at least one of 3-(trimethoxysilyl)-1-propylamine, 3-glycidyloxypropyltrimethoxysilane, 3-(2,3-epoxypropyloxy)propyltrimethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane or a polymer coupling agent.
11. The water-permeable material according to claim 10, characterized in that: The polymer coupling agent includes C-8001.
12. The water-permeable material according to claim 9, characterized in that: The mass ratio of the resin material to the coupling agent and the dispersant is (50-600):(0.05-50):(0.05-50).
13. A method for preparing the water-permeable material according to claim 1, characterized in that: The preparation method comprises the following steps: S1, mixing a mixture containing bisphenol A epoxy resin and multifunctional phenolic epoxy resin with a curing agent to prepare a mixed material II; The remaining raw materials are mixed to prepare a mixed material I; S2, mixing the mixed material I and the mixed material II, and curing them to obtain the epoxy resin water-permeable material.
14. The method for preparing a water-permeable material according to claim 13, characterized in that: In step S2, the curing treatment includes curing at 20-30°C for 10-60h, curing at 50-65°C for 0.5-4h, and curing at 70-90°C for 0.5-4h.
15. The method for preparing a water-permeable material according to claim 13, characterized in that: The preparation step of the mixed material I in step S1 specifically includes the following operations: After adding the materials, they are preheated to 26-32°C, dispersed for 1-10 minutes, evacuated to <-0.09MPa, and maintained in the vacuum state for 10-60 minutes to obtain mixed material I.
16. The method for preparing a water-permeable material according to claim 13, characterized in that: The preparation step of the mixed material II in step S1 specifically includes the following operations: Bisphenol A epoxy resin and polyfunctional phenolic epoxy resin are mixed, a curing agent is added, and the mixture is stirred and dispersed at 26-32° C. and a vacuum degree of less than -0.085 MPa to obtain a mixed material II.
17. Use of the water-permeable material according to any one of claims 1 to 12 or the water-permeable material prepared by the preparation method according to any one of claims 13 to 16 in preparing molds, preparing water-permeable paving materials or preparing household materials.
Citation Information
Patent Citations
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