A high-compression quartz photomask polishing adsorption pad and a preparation process thereof

Abstract

The application discloses a high-compression quartz photomask polishing adsorption pad and a preparation process thereof, and belongs to the technical field of polishing adsorption pads, and comprises a release film, a glue layer and an adsorption layer, wherein the release film is arranged on the glue layer, and the glue layer is arranged on the adsorption layer. The application solves the problem that the compression rate of the existing quartz photomask polishing adsorption pad is low, the polishing adsorption pad is easily damaged due to abrasion, and the service life of the polishing adsorption pad is reduced. In the application, air is drawn into the transverse adsorption buffer strip through the air hole interface, at this time, the air pressure in the transverse adsorption buffer strip, the longitudinal adsorption buffer strip and the positioning adsorption column is reduced, the adsorption property of the polishing adsorption pad is improved, the transverse adsorption buffer strip and the longitudinal adsorption buffer strip can buffer and compress the polishing adsorption pad, the compression rate of the polishing adsorption pad is improved, the polishing adsorption pad is prevented from being damaged due to abrasion, and the service life of the polishing adsorption pad is improved.

Description

Technical Field

[0001] The invention relates to the technical field of polishing adsorption pads, in particular to a quartz mask polishing adsorption pad with a high compression rate and a preparation process thereof. Background Art

[0002] Polishing is a process that uses mechanical, chemical, or electrochemical effects to reduce the surface roughness of a workpiece to obtain a bright, smooth surface. It is a finishing process that uses polishing tools and abrasive particles or other polishing media to modify the workpiece surface.

[0003] Polishing does not improve the dimensional or geometric accuracy of a workpiece. Instead, it aims to achieve a smooth surface or mirror finish, and is sometimes used to remove gloss. A polishing wheel is typically used as the polishing tool. The wheel is typically made of multiple layers of canvas, felt, or leather, clamped on both sides by metal discs, and its rim is coated with a polishing compound consisting of a uniform mixture of micro-powdered abrasive and grease. During polishing, the high-speed rotating polishing wheel presses against the workpiece, causing the abrasive to roll and slightly cut the surface, resulting in a shiny finished surface with a surface roughness of typically Ra 0.63-0.01 microns. Using a non-greasy matte polishing compound can deglaze the shiny surface to improve its appearance. Roller polishing is often used in the mass production of bearing steel balls.

[0004] During the polishing process of the existing quartz mask, the compression rate of the polishing adsorption pad is low, which causes the polishing adsorption pad to be easily worn and damaged, thereby reducing the service life of the polishing adsorption pad. Summary of the Invention

[0005] The purpose of the present invention is to provide a quartz mask polishing adsorption pad with a high compression rate and its preparation process, which can improve the compression rate of the polishing adsorption pad, avoid the polishing adsorption pad from being worn and damaged, and increase the service life of the polishing adsorption pad, thereby solving the problems raised in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A high-compression quartz mask polishing adsorption pad comprises a release film, an adhesive layer and an adsorption layer, wherein the release film is arranged on the adhesive layer, and the adhesive layer is arranged on the adsorption layer, wherein the thickness ratio of the release film, the adhesive layer and the adsorption layer is 1:1:4.

[0008] Preferably, the adsorption layer includes a supporting base pad and a polishing adsorption pad, the polishing adsorption pad is provided with evenly distributed adsorption pores, the polishing adsorption pad is arranged on the supporting base pad, and the supporting base pad is connected to the adhesive layer.

[0009] Preferably, the adsorption layer further comprises transverse adsorption buffer strips and longitudinal adsorption buffer strips, the transverse adsorption buffer strips are arranged side by side in the support base pad in the transverse direction, the longitudinal adsorption buffer strips are arranged side by side in the support base pad in the longitudinal direction, and the transverse adsorption buffer strips and the longitudinal adsorption buffer strips are connected.

[0010] Preferably, the adsorption layer further comprises a positioning adsorption column, the positioning adsorption column is arranged at the intersection of the transverse adsorption buffer strips and the longitudinal adsorption buffer strips, the positioning adsorption column is located in the adsorption air hole, and the end of the positioning adsorption column is provided with an adsorption port.

[0011] Preferably, the transverse adsorption buffer strips and the longitudinal adsorption buffer strips are connected with the positioning adsorption column.

[0012] Preferably, the transverse adsorption buffer strips are provided with air hole interfaces, and the air hole interfaces penetrate the support base pad.

[0013] Preferably, the transverse adsorption buffer strips, the longitudinal adsorption buffer strips and the positioning adsorption column comprise the following raw materials in mass fractions: 10-20 parts of polyurethane fibers and 8-22 parts of polyamide fibers.

[0014] Preferably, the transverse adsorption buffer strips, the longitudinal adsorption buffer strips and the positioning adsorption column are prepared by taking polyurethane fibers and polyamide fibers as raw materials, stirring, mixing, plasticizing and compacting through an extruder, extruding a pre-product with a certain shape from the head of the extruder, repeatedly extruding and stretching the pre-product through a calender, and processing the stretched product to form the transverse adsorption buffer strips, the longitudinal adsorption buffer strips and the positioning adsorption column meeting the size requirements.

[0015] According to another aspect of the present application, a preparation process of the high-compression quartz photomask polishing adsorption pad is provided, comprising the following steps:

[0016] S1, preparing an adsorption layer:

[0017] The transverse adsorption buffer strips and the longitudinal adsorption buffer strips are processed on the support base pad, and the transverse adsorption buffer strips and the longitudinal adsorption buffer strips are connected, the positioning adsorption column is processed on the transverse adsorption buffer strips and the longitudinal adsorption buffer strips, and the transverse adsorption buffer strips and the longitudinal adsorption buffer strips are connected with the positioning adsorption column, the polishing adsorption pad is processed on the support base pad, and the positioning adsorption column is located in the adsorption air hole, thereby forming the adsorption layer.

[0018] S2, preparing a polishing adsorption pad:

[0019] The adhesive layer is arranged on the adsorption layer, the release film is arranged on the adhesive layer, and the polishing adsorption pad is formed through lamination.

[0020] Compared with the prior art, the present application has the following advantages:

[0021] The present application can improve the adsorption of the polishing adsorption pad by reducing the air pressure in the lateral adsorption buffer strip, the longitudinal adsorption buffer strip and the positioning adsorption column, and the lateral adsorption buffer strip and the longitudinal adsorption buffer strip can buffer and compress the polishing adsorption pad, so as to improve the compression rate of the polishing adsorption pad, avoid damage caused by wear of the polishing adsorption pad, and prolong the service life of the polishing adsorption pad. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a forward schematic view of the high-compression quartz photomask polishing adsorption pad of the present application.

[0023] Figure 2 It is a forward schematic view of the adsorption layer of the present application.

[0024] Figure 3 It is a forward exploded view of the adsorption layer of the present application.

[0025] Figure 4 It is a schematic view of the positioning adsorption column provided on the support bottom pad of the present application.

[0026] In the figure: 1, release film; 2, adhesive layer; 3, adsorption layer; 31, support bottom pad; 32, polishing adsorption pad; 321, adsorption air hole; 33, lateral adsorption buffer strip; 34, longitudinal adsorption buffer strip; 35, positioning adsorption column; 4, air hole interface. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] To solve the problem that the compression rate of the polishing adsorption pad is low when the existing quartz photomask is polished, the polishing adsorption pad is easily worn and damaged, and the service life of the polishing adsorption pad is reduced, please refer to Figures 1-4 The present embodiment provides the following technical solutions:

[0029] Embodiment one

[0030] A high-compression quartz photomask polishing adsorption pad, comprising a release film 1, an adhesive layer 2 and an adsorption layer 3, the release film 1 is arranged on the adhesive layer 2, and the adhesive layer 2 is arranged on the adsorption layer 3, wherein the thickness ratio of the release film 1, the adhesive layer 2 and the adsorption layer 3 is 1:1:4.

[0031] In the embodiment, the adsorption layer 3 comprises a supporting bottom pad 31 and a polishing adsorption pad 32, the polishing adsorption pad 32 is provided with uniformly distributed adsorption pores 321, the polishing adsorption pad 32 is arranged on the supporting bottom pad 31, and the supporting bottom pad 31 is connected to the adhesive layer 2.

[0032] In the embodiment, the adsorption layer 3 further comprises transverse adsorption buffer strips 33 and longitudinal adsorption buffer strips 34, the transverse adsorption buffer strips 33 are arranged side by side in the supporting bottom pad 31 in the transverse direction, the longitudinal adsorption buffer strips 34 are arranged side by side in the supporting bottom pad 31 in the longitudinal direction, and the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34 are connected in communication.

[0033] It should be noted that the polishing adsorption pad can be buffered and compressed by the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34, the compression rate of the polishing adsorption pad can be improved, the polishing adsorption pad can be prevented from being damaged due to abrasion, and the service life of the polishing adsorption pad can be improved.

[0034] In the embodiment, the adsorption layer 3 further comprises positioning adsorption columns 35, the positioning adsorption columns 35 are arranged at the intersection of the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34, the positioning adsorption columns 35 are located in the adsorption pores 321, and the end portions of the positioning adsorption columns 35 are provided with adsorption ports.

[0035] In the embodiment, the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34 are connected in communication with the positioning adsorption columns 35.

[0036] It should be noted that when the quartz photomask is subjected to polishing treatment, air is drawn into the transverse adsorption buffer strips 33 through the air hole interface 4, at this time, the air pressure in the transverse adsorption buffer strips 33, the longitudinal adsorption buffer strips 34 and the positioning adsorption columns 35 is reduced, the adsorption property of the polishing adsorption pad can be improved, the polishing adsorption pad can be buffered and compressed by the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34, the compression rate of the polishing adsorption pad can be improved, the polishing adsorption pad can be prevented from being damaged due to abrasion, and the service life of the polishing adsorption pad can be improved.

[0037] In the embodiment, the transverse adsorption buffer strips 33 are provided with air hole interfaces 4, and the air hole interfaces 4 penetrate the supporting bottom pad 31.

[0038] It should be noted that air is drawn into the transverse adsorption buffer strips 33 through the air hole interface 4, at this time, the air pressure in the transverse adsorption buffer strips 33, the longitudinal adsorption buffer strips 34 and the positioning adsorption columns 35 is reduced, and the adsorption property of the polishing adsorption pad can be improved.

[0039] In the embodiment, the transverse adsorption buffer strips 33, the longitudinal adsorption buffer strips 34 and the positioning adsorption columns 35 each comprise raw materials in the following mass fractions: 10 parts of polyurethane fiber and 8 parts of polyamide fiber.

[0040] In the embodiment, the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 are all made of polyurethane fiber and polyamide fiber as raw materials, and after stirring, mixing, plasticizing and compacting by an extruder, a pre-product with a certain shape is extruded from the head of the extruder, and the pre-product is repeatedly extruded and stretched by a calender, and the stretched product is processed to form the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 meeting the size requirements.

[0041] It should be noted that the use of polyurethane fiber and polyamide fiber to prepare the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 can improve the high elastic recovery rate of the polishing adsorption pad, improve the compression rate of the polishing adsorption pad, avoid damage caused by polishing adsorption pad wear, and improve the service life of the polishing adsorption pad.

[0042] In order to better show the preparation process of the quartz photomask polishing adsorption pad, the embodiment also provides a preparation process of a high-compression-rate quartz photomask polishing adsorption pad, which comprises the following steps:

[0043] S1, preparing an adsorption layer 3:

[0044] The transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 are processed on the support bottom pad 31, and the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 are connected, the positioning adsorption column 35 is processed on the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34, and the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 are both connected with the positioning adsorption column 35, the polishing adsorption pad 32 is processed on the support bottom pad 31, and the positioning adsorption column 35 is located in the adsorption air hole 321, at this time, the adsorption layer 3 is formed;

[0045] S2, preparing a polishing adsorption pad:

[0046] The adhesive layer 2 is provided on the adsorption layer 3, and the release film 1 is provided on the adhesive layer 2, and after laminating, the polishing adsorption pad is formed.

[0047] Embodiment two

[0048] A high-compression-rate quartz photomask polishing adsorption pad comprises a release film 1, an adhesive layer 2 and an adsorption layer 3, the release film 1 is provided on the adhesive layer 2, and the adhesive layer 2 is provided on the adsorption layer 3, wherein the thickness ratio of the release film 1, the adhesive layer 2 and the adsorption layer 3 is 1:1:4.

[0049] In the embodiment, the adsorption layer 3 comprises a support bottom pad 31 and a polishing adsorption pad 32, the polishing adsorption pad 32 is provided with uniformly distributed adsorption air holes 321, the polishing adsorption pad 32 is arranged on the support bottom pad 31, and the support bottom pad 31 is connected to the adhesive layer 2.

[0050] In the embodiment, the adsorption layer 3 further comprises transverse adsorption buffer strips 33 and longitudinal adsorption buffer strips 34, the transverse adsorption buffer strips 33 are arranged in parallel in the support base pad 31 in the transverse direction, the longitudinal adsorption buffer strips 34 are arranged in parallel in the support base pad 31 in the longitudinal direction, and the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34 are connected.

[0051] It should be noted that the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34 can buffer and compress the polishing adsorption pad, can improve the compression rate of the polishing adsorption pad, avoid damage due to wear of the polishing adsorption pad, and can improve the service life of the polishing adsorption pad.

[0052] In the embodiment, the adsorption layer 3 further comprises positioning adsorption columns 35, the positioning adsorption columns 35 are arranged at the intersection connection positions of the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34, the positioning adsorption columns 35 are located in the adsorption air holes 321, and the end portions of the positioning adsorption columns 35 are provided with adsorption ports.

[0053] In the embodiment, the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34 are connected with the positioning adsorption columns 35.

[0054] It should be noted that when the quartz photomask is subjected to polishing treatment, air is drawn into the transverse adsorption buffer strips 33 through the air hole interface 4, at this time, the air pressure in the transverse adsorption buffer strips 33, the longitudinal adsorption buffer strips 34 and the positioning adsorption columns 35 is reduced, the adsorption property of the polishing adsorption pad is improved, the transverse adsorption buffer strips 33 and the longitudinal adsorption buffer strips 34 can buffer and compress the polishing adsorption pad, the compression rate of the polishing adsorption pad is improved, wear and damage of the polishing adsorption pad are avoided, and the service life of the polishing adsorption pad is improved.

[0055] In the embodiment, the transverse adsorption buffer strips 33 are provided with air hole interfaces 4, and the air hole interfaces 4 penetrate the support base pad 31.

[0056] It should be noted that air is drawn into the transverse adsorption buffer strips 33 through the air hole interface 4, at this time, the air pressure in the transverse adsorption buffer strips 33, the longitudinal adsorption buffer strips 34 and the positioning adsorption columns 35 is reduced, and the adsorption property of the polishing adsorption pad is improved.

[0057] In the embodiment, the transverse adsorption buffer strips 33, the longitudinal adsorption buffer strips 34 and the positioning adsorption columns 35 each comprise raw materials in the following mass fractions: 10 parts of polyurethane fiber and 22 parts of polyamide fiber.

[0058] In the embodiment, the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 are all made of polyurethane fiber and polyamide fiber as raw materials, and after stirring, mixing, plasticizing and compacting by an extruder, a pre-product with a certain shape is extruded from the head of the extruder, and the pre-product is repeatedly extruded and stretched by a calender, and the stretched product is processed to form the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 meeting the size requirements.

[0059] It should be noted that the use of polyurethane fiber and polyamide fiber to prepare the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 can improve the high elastic recovery rate of the polishing adsorption pad, improve the compression rate of the polishing adsorption pad, avoid damage due to wear of the polishing adsorption pad, and improve the service life of the polishing adsorption pad.

[0060] The polishing adsorption pad is prepared by the same preparation process as in Example 1, and the difference between Example 2 and Example 1 is that the mass fraction of polyamide fiber in Example 2 is increased.

[0061] Example Three

[0062] A high-compression quartz photomask polishing adsorption pad, comprising a release film 1, an adhesive layer 2 and an adsorption layer 3, the release film 1 is arranged on the adhesive layer 2, and the adhesive layer 2 is arranged on the adsorption layer 3, wherein the thickness ratio of the release film 1, the adhesive layer 2 and the adsorption layer 3 is 1:1:4.

[0063] In the embodiment, the adsorption layer 3 includes a support bottom pad 31 and a polishing adsorption pad 32, the polishing adsorption pad 32 is provided with uniformly distributed adsorption pores 321, the polishing adsorption pad 32 is arranged on the support bottom pad 31, and the support bottom pad 31 is connected to the adhesive layer 2.

[0064] In the embodiment, the adsorption layer 3 further includes a transverse adsorption buffer strip 33 and a longitudinal adsorption buffer strip 34, the transverse adsorption buffer strip 33 is arranged side by side in the transverse direction in the support bottom pad 31, the longitudinal adsorption buffer strip 34 is arranged side by side in the longitudinal direction in the support bottom pad 31, and the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 are connected.

[0065] It should be noted that the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 can buffer and compress the polishing adsorption pad, improve the compression rate of the polishing adsorption pad, avoid damage due to wear of the polishing adsorption pad, and improve the service life of the polishing adsorption pad.

[0066] In the embodiment, the adsorption layer 3 further includes a positioning adsorption column 35, the positioning adsorption column 35 is arranged at the intersection of the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34, the positioning adsorption column 35 is located in the adsorption pore 321, and the end of the positioning adsorption column 35 is provided with an adsorption port.

[0067] In the embodiment, the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 are communicated with the positioning adsorption column 35.

[0068] It should be noted that when polishing the quartz photomask, the air is drawn into the transverse adsorption buffer strip 33 through the air hole interface 4, at this time, the air pressure in the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 is reduced, which can improve the adsorption of the polishing adsorption pad, and the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 can buffer and compress the polishing adsorption pad, which can improve the compression rate of the polishing adsorption pad, avoid damage caused by wear of the polishing adsorption pad, and improve the service life of the polishing adsorption pad.

[0069] In the embodiment, the air hole interface 4 is arranged on the transverse adsorption buffer strip 33 and penetrates the support bottom pad 31.

[0070] It should be noted that when polishing the quartz photomask, the air is drawn into the transverse adsorption buffer strip 33 through the air hole interface 4, at this time, the air pressure in the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 is reduced, which can improve the adsorption of the polishing adsorption pad, and the transverse adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 can buffer and compress the polishing adsorption pad, which can improve the compression rate of the polishing adsorption pad, avoid damage caused by wear of the polishing adsorption pad, and improve the service life of the polishing adsorption pad.

[0071] In the embodiment, the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 each include the following raw materials: 20 parts of polyurethane fiber and 8 parts of polyamide fiber.

[0072] In the embodiment, the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 are prepared by using polyurethane fiber and polyamide fiber as raw materials, stirring, mixing, plasticizing and compacting by an extruder, extruding a pre-product with a certain shape from the head of the extruder, repeatedly extruding and extending the pre-product by a calender, and processing the extended product to form the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 meeting the size requirements.

[0073] It should be noted that the use of polyurethane fiber and polyamide fiber to prepare the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 can improve the high elastic recovery rate of the polishing adsorption pad, improve the compression rate of the polishing adsorption pad, avoid damage caused by wear of the polishing adsorption pad, and improve the service life of the polishing adsorption pad.

[0074] The polishing adsorption pad is prepared by using the same preparation process as in Example 1, and the difference between Example 3 and Example 1 is that the mass fraction of polyurethane fiber in Example 3 is increased.

[0075] Comparative Example

[0076] A high-compression quartz photomask polishing adsorption pad, comprising a release film 1, an adhesive layer 2 and an adsorption layer 3, the release film 1 is arranged on the adhesive layer 2, and the adhesive layer 2 is arranged on the adsorption layer 3, wherein the thickness ratio of the release film 1, the adhesive layer 2 and the adsorption layer 3 is 1:1:4.

[0077] In the embodiment, the adsorption layer 3 comprises a supporting bottom pad 31 and a polishing adsorption pad 32, the polishing adsorption pad 32 is provided with uniformly distributed adsorption pores 321, the polishing adsorption pad 32 is arranged on the supporting bottom pad 31, and the supporting bottom pad 31 is connected to the adhesive layer 2.

[0078] Compared with the first embodiment, the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 structure are cancelled in the comparative example, the polishing adsorption pad is prepared by using the same preparation process as the first embodiment, and the preparation steps of the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 are cancelled correspondingly.

[0079] The polishing adsorption pads prepared in the first to third embodiments and the comparative example are subjected to performance tests, and the performance test results of the polishing adsorption pads are shown in Table 1.

[0080] Table 1: Performance test results of the polishing adsorption pad

[0081]

[0082] As shown in the above table, the polishing adsorption pads prepared in the first to third embodiments all have good compression rate and wear resistance.

[0083] Among them, the compression rate and wear resistance of the second embodiment compared with the first embodiment are improved, which shows that increasing the mass fraction of polyamide fiber can improve the compression rate and wear resistance of the polishing adsorption pad;

[0084] Among them, the compression rate and wear resistance of the third embodiment compared with the first embodiment are improved, which shows that increasing the mass fraction of polyurethane fiber can improve the compression rate and wear resistance of the polishing adsorption pad;

[0085] Among them, the compression rate and wear resistance of the comparative example compared with the first embodiment are reduced, because the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 are not increased in the comparative example, which leads to the reduction of the compression rate and wear resistance of the polishing adsorption pad, which shows that the transverse adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 can improve the compression rate and wear resistance of the polishing adsorption pad.

[0086] Therefore, when polishing the quartz photomask, the air is drawn into the lateral adsorption buffer strip 33 through the air hole interface 4, at this time, the air pressure in the lateral adsorption buffer strip 33, the longitudinal adsorption buffer strip 34 and the positioning adsorption column 35 is reduced, the adsorption of the polishing adsorption pad can be improved, the lateral adsorption buffer strip 33 and the longitudinal adsorption buffer strip 34 can buffer and compress the polishing adsorption pad, the compression rate of the polishing adsorption pad can be improved, the polishing adsorption pad can be prevented from being damaged due to abrasion, and the service life of the polishing adsorption pad can be improved.

[0087] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0088] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, alternatives and variations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-compression quartz mask polishing adsorption pad, comprising a release film (1), an adhesive layer (2) and an adsorption layer (3), characterized in that: The release film (1) is arranged on the adhesive layer (2), and the adhesive layer (2) is arranged on the adsorption layer (3), wherein the thickness ratio of the release film (1), the adhesive layer (2) and the adsorption layer (3) is 1:1:4; The adsorption layer (3) comprises a supporting base pad (31) and a polishing adsorption pad (32), wherein the polishing adsorption pad (32) is provided with evenly distributed adsorption pores (321), and the polishing adsorption pad (32) is provided on the supporting base pad (31), and the supporting base pad (31) is connected to the adhesive layer (2); The adsorption layer (3) further comprises a transverse adsorption buffer strip (33) and a longitudinal adsorption buffer strip (34), wherein the transverse adsorption buffer strip (33) is arranged side by side transversely in the support base pad (31), and the longitudinal adsorption buffer strip (34) is arranged side by side longitudinally in the support base pad (31), and the transverse adsorption buffer strip (33) and the longitudinal adsorption buffer strip (34) are connected; The adsorption layer (3) further comprises a positioning adsorption column (35), the positioning adsorption column (35) being arranged at the cross connection of the transverse adsorption buffer strip (33) and the longitudinal adsorption buffer strip (34), the positioning adsorption column (35) being located in the adsorption pore (321), the end of the positioning adsorption column (35) being provided with an adsorption port, the transverse adsorption buffer strip (33) and the longitudinal adsorption buffer strip (34) both being connected to the positioning adsorption column (35), the transverse adsorption buffer strip (33) being provided with an air hole interface (4), the air hole interface (4) penetrating the supporting base pad (31).

2. The high-compression quartz mask polishing adsorption pad according to claim 1, characterized in that: The transverse adsorption buffer strip (33), the longitudinal adsorption buffer strip (34), and the positioning adsorption column (35) all comprise the following raw materials in parts by mass: 10-20 parts of polyurethane fiber and 8-22 parts of polyamide fiber.

3. The high-compression quartz mask polishing adsorption pad according to claim 2, characterized in that: The transverse adsorption buffer strips (33), longitudinal adsorption buffer strips (34) and positioning adsorption columns (35) are all made of polyurethane fibers and polyamide fibers. After being stirred, mixed, plasticized and compacted by an extruder, a pre-product of a certain shape is extruded from the head of the extruder. The pre-product is repeatedly extruded and extended by a calender, and the extended product is processed to form transverse adsorption buffer strips (33), longitudinal adsorption buffer strips (34) and positioning adsorption columns (35) that meet size requirements.

4. A process for preparing a high-compression quartz mask polishing adsorption pad according to claim 3, characterized in that: The steps include: S1. Preparation of adsorption layer (3): Processing a transverse adsorption buffer strip (33) and a longitudinal adsorption buffer strip (34) on the support base pad (31), and making the transverse adsorption buffer strip (33) and the longitudinal adsorption buffer strip (34) connected, processing a positioning adsorption column (35) on the transverse adsorption buffer strip (33) and the longitudinal adsorption buffer strip (34), and making the transverse adsorption buffer strip (33) and the longitudinal adsorption buffer strip (34) both connected to the positioning adsorption column (35), processing a polishing adsorption pad (32) on the support base pad (31), and making the positioning adsorption column (35) located in the adsorption pore (321), thereby forming an adsorption layer (3); S2. Preparation of polishing adsorption pad: An adhesive layer (2) is provided on the adsorption layer (3), and a release film (1) is provided on the adhesive layer (2), and the polishing adsorption pad is formed by lamination.

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