A solder paste printing device for small batch products

Abstract

The application discloses a solder paste printing device suitable for small-batch products, which comprises a polyester film fixing module, a transmission module and an adjusting module; the polyester film fixing module comprises a polyester film with a printing pattern; the transmission module is used for fixing and position adjusting of a to-be-printed substrate; the to-be-printed substrate is arranged between the polyester film fixing module and the transmission module; and the adjusting module is used for height adjusting of the to-be-printed substrate. The solder paste printing of different thickness requirements can be realized by changing polyester films with different thicknesses, and the height and position of the substrate can be adjusted. The device can be suitable for small-batch and multi-variety products, and high-precision solder paste printing is realized.

Description

Technical Field

[0001] This invention relates to a solder paste printing apparatus suitable for small-batch products, belonging to the field of surface mount technology in electronic packaging. Background Technology

[0002] Solder paste printing is a crucial step in surface mount technology (SMT). The quality of solder paste printing directly affects the soldering quality of components. The smoothness and thickness of the solder paste are key factors influencing the printing process. For pilot-scale, small-batch manufacturing products, due to the small quantity and frequent pad design changes, common solder paste printing methods include: 1) Manual application of solder paste using pneumatic needles. This method results in poor printing quality and slow speed, failing to meet the technical requirements of pilot-scale experiments; 2) Printing solder paste using custom stencils. This method offers high quality, but due to the high cost of stencil production and long lead times, it is not very practical for pilot-scale products with frequent pad changes and infrequent solder paste printing. Summary of the Invention

[0003] The purpose of this invention is to provide a solder paste printing device suitable for small-batch products. It uses a polyester film as a printing screen instead of a stencil. The design pattern of the solder pads is laser-printed onto the polyester film using a general laser drilling device. Then, the polyester film is installed on the device through preset holes to achieve high-precision printing.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] This invention provides a solder paste printing device suitable for small-batch products, comprising: a polyester film fixing module, a transmission module, and an adjustment module;

[0006] The polyester film fixing module includes an upper printing mold, a lower printing mold, and a polyester film, wherein the polyester film is assembled between the upper printing mold and the lower printing mold; the polyester film has a printed pattern.

[0007] The transmission module is used to fix and adjust the position of the printed circuit board.

[0008] The substrate to be printed is placed between the polyester film fixing module and the transmission module;

[0009] The adjustment module is rotatably connected to the transmission module, and the adjustment module passes through the transmission module to contact the substrate to be printed. The adjustment module is used to adjust the height of the substrate to be printed.

[0010] Furthermore, the bottom of the upper printing mold has a threaded hole that matches the lower printing mold, and the upper printing mold is fixedly connected to the lower printing mold by countersunk bolts;

[0011] The polyester film has positioning holes, and the polyester film is assembled with positioning pins on the printing mold through the positioning holes.

[0012] Furthermore, the transmission module includes an adjustable upper top block, an adjustable lower top block, an upper sliding rod, a lower sliding rod, a base plate mold support, and a gear shaft;

[0013] The substrate mold has a hollow center, and the gear of the gear shaft passes through the center of the substrate mold; the substrate to be printed is placed on the top of the gear.

[0014] The upper sliding rod and the lower sliding rod are placed on the upper surface of the substrate mold and are assembled with the gear of the gear shaft to form a gear transmission structure; the adjustable upper top block is installed on the outer end of the upper sliding rod and the adjustable lower top block is installed on the outer end of the lower sliding rod; the substrate to be printed is placed between the adjustable upper top block and the adjustable lower top block.

[0015] Furthermore, there are two upper sliding rods and two lower sliding rods, both of which mesh with the gears of the gear shaft;

[0016] The two upper sliding rods and the two lower sliding rods are parallel to each other and are perpendicular to each other on the substrate mold plane. The upper sliding rods and the lower sliding rods are moved left and right by gears to achieve coarse adjustment of the substrate position.

[0017] Furthermore, the substrate mold has perpendicular sliding grooves, and the upper sliding rod and the lower sliding rod are placed in the sliding grooves of the substrate mold and are assembled with the gear of the gear shaft.

[0018] Furthermore, the adjustable upper and lower blocks are provided with countersunk grooves, and the adjustable upper and lower blocks are installed at the countersunk grooves into the screw holes of the upper and lower sliding rods by bolts.

[0019] Furthermore, the printing lower mold is provided with positioning holes. During printing, the printing lower mold is assembled with the positioning pins on the substrate mold through the positioning holes.

[0020] Furthermore, the adjustment module includes a hollow rotating ring, a base, and a bolt pin;

[0021] The hollow rotating ring is fixed inside the base, and the hollow rotating ring is installed and fixed to the gear shaft, so that there is a gap between the gear shaft and the base;

[0022] The bolt pin passes through the hollow rotating ring and is rotatably connected to the inside of the gear on the gear shaft. A top block is fitted on the top of the bolt pin for placing the substrate to be printed.

[0023] Furthermore, the hollow rotating ring includes an inner rotating ring and an outer rotating ring. The outer rotating ring of the hollow rotating ring is fixed in the base by bolts, and the inner rotating ring of the hollow rotating ring is assembled with the gear shaft by bolts.

[0024] Furthermore, the gear shaft has a threaded hole inside the gear, and the bolt pin passes through the hollow swivel and is rotatably connected to the gear shaft through the threaded hole.

[0025] The beneficial effects of this invention are as follows:

[0026] (1) The solder paste printing device provided by the present invention can realize the printing of substrates with product size of 3mm×3mm-140mm×140mm and height of 0-10mm. By changing the polyester film of different thicknesses, the solder paste printing of different thicknesses can be achieved, and the height and position of the substrate can be adjusted.

[0027] (2) In this invention, the pattern is engraved on a polyester film, and then the solder paste is printed onto the pads of the substrate using the pattern on the polyester film. Polyester film has higher precision than manual solder paste application and is faster than stencil fabrication. Stencil fabrication requires a frame before a solder paste printing machine can be used, which is troublesome each time. This invention achieves solder paste printing with different thicknesses by changing the thickness of the polyester film, which is suitable for small batches / multiple varieties of products and achieves high-precision solder paste printing. The device is economical, with low printing film cost and simple operation. Attached Figure Description

[0028] Figure 1 A schematic diagram of the overall structure of a solder paste printing device suitable for small-batch products is provided in one embodiment of the present invention;

[0029] Figure 2 for Figure 1 An exploded view of the solder paste printing apparatus is shown below;

[0030] Figure 3 for Figure 1 The exploded view of the polyester film fixing module installation in the solder paste printing device shown;

[0031] Figure 4 for Figure 1 The diagram shows the overall assembly of the transmission module in the solder paste printing device.

[0032] Figure 5 for Figure 1 A schematic diagram of the assembly of the upper and lower sliding rods and the gear shaft in the solder paste printing device shown;

[0033] Figure 6 for Figure 1 The diagram shows an adjustable top block in the solder paste printing device.

[0034] Figure 7 for Figure 1 The diagram shows an adjustable lower block in the solder paste printing device.

[0035] Figure 8 for Figure 1 The exploded view of the gear shaft and base assembly in the solder paste printing device shown;

[0036] Figure 9 for Figure 1 The diagram shows a hollow rotating ring in the solder paste printing device.

[0037] Figure 10 for Figure 1 The diagram shows the assembly of bolt pins in the solder paste printing device. Detailed Implementation

[0038] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present invention, and should not be construed as limiting the present invention.

[0039] In the description of this invention, it should be noted that the terms "upper", "lower", "front", "rear", "end", "bottom", "side", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation. Therefore, they should not be construed as limiting this invention.

[0040] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a direct connection, or a connection through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms in this invention according to the specific circumstances.

[0041] Secondly, the term "an embodiment" or "embodiment" as used in this invention refers to a specific feature, structure, or characteristic that can be included in at least one implementation of this invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0042] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0043] Example 1, referring to Figure 1 and Figure 2This is the first embodiment of the present invention, which provides a solder paste printing device suitable for small-batch products, including: a squeegee 1, an upper printing mold 2, a polyester film 3, a lower printing mold 4, a circuit board 5, an adjustable upper ejector block 6, an adjustable lower ejector block 7, a board support mold 8, a gear shaft 9, a hollow rotating ring 10, a base 11, a bolt ejector pin 12, an ejector block 13, an upper sliding rod 14, and a lower sliding rod 15.

[0044] Specifically, the bottom of the upper printing mold 2 has a positioning pin hole for the lower printing mold 4, which is fixedly connected to the lower printing mold 4 by countersunk bolts; the polyester film 3 is assembled between the upper printing mold 2 and the lower printing mold 4.

[0045] See Figure 4 The substrate mold 8 has a hollow center, and the gear portion of the gear shaft 9 passes through the center of the substrate mold 8.

[0046] A sliding groove perpendicular to each other is opened on the substrate mold 8. The upper sliding rod 14 and the lower sliding rod 15 are placed in the sliding groove of the substrate mold 8 and are assembled with the gear of the gear shaft 9.

[0047] It should be noted that there are two upper sliding rods 14 and two lower sliding rods 15, all of which mesh with the gears of the gear shaft 9; the two upper sliding rods and the two lower sliding rods are distributed in parallel, and the upper sliding rods 14 and the lower sliding rods 15 are distributed perpendicularly on the plane of the substrate mold 8. The gears drive the upper sliding rods 14 and the lower sliding rods 15 to move left and right, thereby achieving coarse adjustment of the substrate position.

[0048] See Figure 6 and Figure 7 Both the adjustable upper block 6 and the adjustable lower block 7 are equipped with countersunk grooves. M3 bolts are used to install the adjustable upper block 6 and the adjustable lower block 7 into the screw holes on the sliding rod at the countersunk grooves. Figure 5 The top block is shown at the threaded hole.

[0049] During operation, the circuit board 5 is placed between the adjustable upper block 6 and the adjustable lower block 7, and is held in place by the adjustable upper block 6 and the adjustable lower block 7. The position can be adjusted by loosening the bolts and sliding the adjustable upper block 6 and the adjustable lower block 7.

[0050] See Figure 8 and 9 The hollow rotating ring 10 includes an inner rotating ring and an outer rotating ring. The outer rotating ring of the hollow rotating ring 10 is fixed inside the base 11 by bolts. The inner rotating ring of the hollow rotating ring 10 is assembled with the gear shaft 9 by bolts, and there is a gap between the gear shaft 9 and the base 11 to ensure that the gear shaft rotates normally.

[0051] See Figure 10The gear shaft 9 has a threaded hole for a bolt pin 12 inside the gear. The bolt pin 12 passes through the base 11 and is assembled with the threaded hole inside the gear shaft 9. The top block 13 is fixed together with the top of the bolt pin 12. The circuit board 5 is placed on the top block 13.

[0052] The threaded hole depth is 3mm, and the height of the circuit board 5 can be adjusted by rotating the bolt pin 12.

[0053] Example 2: This example provides a solder paste printing method based on the solder paste printing apparatus of the above examples, as follows:

[0054] The first step is to assemble the polyester film fixing module.

[0055] The polyester film 3 with the printed pattern is assembled with the lower printing mold 4 through the positioning holes and the positioning pins. The upper printing mold 2 is positioned and assembled with the lower printing mold 4 through the reserved holes, and then a fixed connection is formed by M3 bolts. Figure 3 As shown.

[0056] The second step is to assemble the transmission module.

[0057] 1) Pass the gear portion of the gear shaft 9 through the center of the substrate mold 8, and assemble the upper sliding rod 14 and the lower sliding rod 15 onto the gear to form a gear transmission mechanism. The inner ends of the upper sliding rod 14 and the lower sliding rod 15 are engaged with the substrate mold 8 using pins. The assembly is as follows: Figure 5 As shown;

[0058] The adjustable upper top block 6 and adjustable lower top block 7 are assembled to the outer end of the upper sliding rod 14 at the countersunk groove, and the threaded connection is achieved by clamping the top blocks. Figure 5 Similarly, at the position shown, the adjustable lower top block 7 is assembled to the outer end of the lower sliding rod 15;

[0059] 2) Assemble the inner rotating ring of the hollow rotating ring 10 with bolts to the gear shaft 9, then place the hollow rotating ring 10 into the base 11 and connect it to the base 11 with the outer ring bolts, as shown. Figure 8 As shown, the outer ring assembly bolt holes are as follows: Figure 9 As shown.

[0060] 3) Pass the bolt pin 12 through the center hole of the base 11 and make it movable to the threaded hole on the gear shaft 9. Then, make the top block 13 fixedly connected to the bolt pin 12 through the thread.

[0061] The third step is to assemble the substrate.

[0062] Place the substrate to be printed in a position such as Figure 2At the position shown, adjust the gear shaft 9, and move it left and right through the upper sliding rod 14 and the lower sliding rod 15 to achieve initial clamping of the substrate to be printed; for substrates of different lengths and widths, the adjustable upper top block 6 and the adjustable lower top block 7 slide in the countersunk groove to achieve clamping of the left and right distances; rotate the bolt pin 12 to adjust the up and down position of the substrate to be printed to achieve the printing height of the substrate.

[0063] It should be noted that different printing thicknesses are not only related to the thickness of the polyester film, but also to the printing distance between the substrate and the printing film, so the printing height of the substrate needs to be adjusted.

[0064] The fourth step involves attaching the polyester film fixing module assembled in the first step to the positioning pin on the substrate mold 8 through the positioning hole of the printing lower mold 4, forming a pin engagement. The pin positions are as follows: Figure 4 As shown, this assembly is a free assembly in the Z direction, which facilitates the replacement of the substrate. The assembled assembly is as follows: Figure 1 As shown.

[0065] The fifth step is to spread the solder paste on one side of the polyester film and use a squeegee 1 to print the solder paste onto the substrate through the pattern on the polyester film.

[0066] Step 6: Pull the polyester film fixing module from step 1 upwards, replace the substrate, and repeat steps 4 and 5 above.

[0067] Step 7: Disassemble and clean.

[0068] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A solder paste printing device suitable for small-batch products, characterized in that, include: Polyester film fixing module, transmission module, and adjustment module; The polyester film fixing module includes an upper printing mold, a lower printing mold, and a polyester film, wherein the polyester film is assembled between the upper printing mold and the lower printing mold; the polyester film has a printed pattern. The transmission module is used to fix and adjust the position of the substrate to be printed. The transmission module includes an adjustable upper block, an adjustable lower block, an upper sliding rod, a lower sliding rod, a substrate support mold, and a gear shaft. The substrate support mold has a hollow center, and the gear of the gear shaft passes through the center of the substrate support mold. The substrate to be printed is placed on the top of the gear. The upper and lower sliding rods are placed on the upper surface of the substrate support mold and are assembled with the gear of the gear shaft to form a gear transmission structure. There are two upper and two lower sliding rods, each meshing with the gear of the gear shaft. The two upper and two lower sliding rods are parallel and perpendicular to each other on the substrate support mold plane. The gears drive the upper and lower sliding rods to move left and right, achieving coarse adjustment of the substrate position. The adjustable upper block is installed on the outer end of the upper sliding rod, and the adjustable lower block is installed on the outer end of the lower sliding rod. The substrate to be printed is placed between the adjustable upper and lower blocks. The substrate to be printed is placed between the polyester film fixing module and the transmission module; The adjustment module is rotatably connected to the transmission module, and the adjustment module passes through the transmission module to contact the substrate to be printed. The adjustment module is used to adjust the height of the substrate to be printed. The adjustment module includes a hollow rotating ring, a base, and a bolt pin; the hollow rotating ring is fixed inside the base and is also fixed to the gear shaft, so that there is a gap between the gear shaft and the base; the bolt pin passes through the hollow rotating ring and is rotatably connected to the inside of the gear on the gear shaft, and a top block is fitted on the top of the bolt pin for placing the substrate to be printed.

2. The solder paste printing device suitable for small-batch products according to claim 1, characterized in that, The upper printing mold has a threaded hole at its bottom that matches the lower printing mold, and the upper printing mold is fixedly connected to the lower printing mold by countersunk bolts; The polyester film has positioning holes, and the polyester film is assembled with positioning pins on the printing mold through the positioning holes.

3. The solder paste printing device suitable for small-batch products according to claim 1, characterized in that, The substrate mold has perpendicular sliding grooves, and the upper sliding rod and the lower sliding rod are placed in the sliding grooves of the substrate mold and are assembled with the gear of the gear shaft.

4. The solder paste printing device suitable for small-batch products according to claim 1, characterized in that, The adjustable upper and lower blocks are provided with countersunk grooves, and the adjustable upper and lower blocks are installed into the screw holes of the upper and lower sliding rods at the countersunk grooves by bolts.

5. The solder paste printing device suitable for small-batch products according to claim 1, characterized in that, The printing lower mold is provided with positioning holes. During printing, the printing lower mold is assembled with the positioning pins on the substrate mold through the positioning holes.

6. The solder paste printing device suitable for small-batch products according to claim 1, characterized in that, The hollow rotating ring includes an inner rotating ring and an outer rotating ring. The outer rotating ring of the hollow rotating ring is fixed in the base by bolts, and the inner rotating ring of the hollow rotating ring is assembled with the gear shaft by bolts.

7. A solder paste printing device suitable for small-batch products according to claim 6, characterized in that, The gear shaft has a threaded hole inside the gear, and the bolt pin passes through the hollow swivel and is rotatably connected to the gear shaft through the threaded hole.

Images