A multi-layer circuit board with high efficiency in heat dissipation

Abstract

The present invention discloses a multi-layer circuit board with high efficiency in heat dissipation, and relates to the technical field of multi-layer circuit boards. The present invention comprises a multi-layer circuit board, two support frames and two mounting plates, and also comprises a heat dissipation device, wherein the heat dissipation device is arranged on the outer wall of the multi-layer circuit board, the dehumidification device is arranged on the back of the heat dissipation device, the heat conduction device is arranged on the right side of the dehumidification device, and the buffer device is arranged on the opposite sides of the two support frames, wherein the heat dissipation device also comprises a round heat conduction frame, four heat conduction feet, four hollow heat conduction tubes, a heat conduction ring, a fan device, and a plurality of ceramic heat sinks, and the round heat conduction frame is fixedly mounted on the outer wall of the multi-layer circuit board. The fan device of the present invention discharges heat evenly, preventing damage to the electronic components of the multi-layer circuit board caused by excessive local heat, thereby avoiding the problem of local high temperature damage caused by uneven heat dissipation of the multi-layer circuit board.

Description

Technical Field

[0001] The invention relates to the technical field of multi-layer circuit boards, in particular to a multi-layer circuit board with high-efficiency heat dissipation. Background Art

[0002] A multilayer circuit board is a circuit board structure with multiple levels and internal interconnections. It is usually composed of multiple copper foil layers, insulating material layers and silk screen layers. The number of layers can range from two to dozens. Different layers are connected through electrical holes, which can improve the wiring density and signal transmission speed of the circuit board, thereby achieving higher circuit functions and performance. Multilayer circuit boards are widely used in high-speed digital circuits, microprocessors and communication equipment.

[0003] The invention with patent announcement number CN212305751U discloses a multi-layer circuit board with high efficiency in heat dissipation, including a lower layer board, a first prepreg is provided at the upper end of the lower layer board, a first ceramic heat conducting plate, a core layer board, and a second ceramic heat conducting plate are provided at the upper end of the first prepreg, a clearance groove is provided at the upper middle side of the core layer board, a heat dissipation device is fixed in the clearance groove, a first circuit layer is provided at the upper end of the core layer board, a chip is welded on the first circuit layer, and the chip is located directly below the heat dissipation device. The multi-layer circuit board of this patent welds the chip at the upper end of the core layer board and opens a clearance groove for accommodating the heat dissipation device, which can reduce the overall volume of the circuit board.

[0004] However, the current multi-layer circuit boards with efficient heat dissipation have the following problems: when the multi-layer circuit boards with efficient heat dissipation are dissipating heat, heat will accumulate in a local area of ​​the multi-layer circuit board, which may easily cause local high-temperature damage, thereby leading to the problem of uneven heat dissipation of the multi-layer circuit board. Therefore, we propose a multi-layer circuit board with efficient heat dissipation. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides a multi-layer circuit board with efficient heat dissipation, which solves the problem raised in the above background technology that heat will accumulate in a local area of ​​the multi-layer circuit board, easily causing local high-temperature damage, thereby leading to uneven heat dissipation and local damage of the multi-layer circuit board.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a multi-layer circuit board with high efficiency in heat dissipation, comprising a multi-layer circuit board, two support frames and two mounting plates, wherein the two support frames are embedded on the left and right sides of the multi-layer circuit board, the two mounting plates are respectively fixed to one end of the two support frames away from the multi-layer circuit board, and the surfaces of the two mounting plates are provided with circular holes, and further comprising a heat dissipation device, a dehumidification device, a heat conduction device and a buffer device, wherein the heat dissipation device is arranged on the outer wall of the multi-layer circuit board, the dehumidification device is arranged on the rear side of the heat dissipation device, the heat conduction device is arranged on the dehumidification device and is located on the right side of the dehumidification device, and the buffer device is arranged between the two support frames, wherein the heat dissipation device further comprises a round-shaped heat conduction frame, four A heat-conducting foot, four hollow heat-conducting tubes, a heat-conducting ring, a fan device, and a plurality of ceramic heat sinks. The circular heat-conducting frame is fixedly mounted on the outer wall of the multi-layer circuit board. The four heat-conducting feet are respectively fixed at the four corners of the circular heat-conducting frame. The four hollow heat-conducting tubes are respectively fixed on the front faces of the four heat-conducting feet. The heat-conducting ring is fixed at one end of the four hollow heat-conducting tubes that are respectively away from the four heat-conducting feet. The fan device is fixedly mounted in the middle of the inner wall of the heat-conducting ring. The plurality of ceramic heat sinks are respectively fixed on one side of the heat-conducting ring close to the circular heat-conducting frame. The fan device discharges the heat evenly to prevent the damage of the electronic components of the multi-layer circuit board caused by excessive local heat, thereby avoiding the problem of local high-temperature damage caused by uneven heat dissipation of the multi-layer circuit board.

[0007] Preferably, a plurality of resistors are welded on the front side of the multi-layer circuit board, a plurality of semiconductor chips are welded on the front side of the multi-layer circuit board, the semiconductor chips of the multi-layer circuit board are used to control the opening and closing of the fan device through wires, a plurality of wire interfaces are welded on the front side of the multi-layer circuit board, the circular heat-conducting frame is made of non-conductive heat-resistant material, and a heat-conducting gap is arranged between the plurality of ceramic heat sinks.

[0008] Preferably, the dehumidification device includes two strip boxes, two motors, two rollers, a U-shaped plate, a dehumidification box, and a silica gel dehumidification block. The two strip boxes are respectively fixed on the top and bottom surfaces of the circular heat-conducting frame, the two strip boxes are respectively provided with slide grooves on the back sides, and the two strip boxes are respectively provided with slide rails on the back sides. The two motors are respectively slidably installed inside the two strip boxes, the two rollers are respectively fixed on the back sides of the two motor shafts, and the two rollers are respectively slidably installed in the slide rails of the two strip boxes. The U-shaped plate is fixed on the back sides of the two motors, the dehumidification box is fixed in the middle of the front side of the U-shaped plate, and the front side of the dehumidification box is provided with an air inlet. The silica gel dehumidification block is fixedly installed on the inner wall of the dehumidification box. The silica gel dehumidification block absorbs moisture in the gas more effectively to prevent the electronic components on the multi-layer circuit board from being corroded by the gas containing moisture, thereby avoiding the problem of electronic components of the multi-layer circuit board being damaged by moisture.

[0009] Preferably, the two motors are respectively fixed with sliding pads facing each other, the semiconductor chip of the multilayer circuit board is used to control the opening and closing of the motor through wires, the outer walls of the two rollers are respectively fixed with rubber membranes, and the air inlet of the dehumidification box is fixedly installed with a filter.

[0010] Preferably, the heat conducting device includes an L-shaped plate, a fan plate, two rubber strips and a shock absorbing assembly, the L-shaped plate is fixed in the middle of the back side of the U-shaped plate, the fan plate is rotatably installed on the front side of the L-shaped plate, a torsion spring is arranged between the fan plate and the L-shaped plate, the two rubber strips are respectively fixed on the left and right sides of the fan plate, and the shock absorbing devices are respectively arranged on the top and bottom surfaces of the L-shaped plate, and the airflow blows the back of the multi-layer circuit board to prevent heat from accumulating on the back of the multi-layer circuit board, thereby avoiding the problem of excessive heat damage to the back of the multi-layer circuit board.

[0011] Preferably, the shock absorbing assembly includes two strips and two U-shaped connecting plates, the two strips are respectively hinged on the top and bottom surfaces of the U-shaped plate, the two U-shaped connecting plates are respectively hinged on the top and bottom surfaces of the support frame, the two strips are rotatably installed at one end away from the U-shaped plate inside the U-shaped connecting plate, and a torsion spring is arranged between the two strips and the two U-shaped connecting plates. The strips and the U-shaped connecting plates buffer the dehumidification box, reducing the vibration caused by the movement of the dehumidification box during the dehumidification process, thereby avoiding the problem of vibration damage to electronic components caused by dehumidification of the multi-layer circuit board.

[0012] Preferably, the buffer device includes four pads, two arc-shaped spring sheets and a protection component, two of the pads are respectively fixed on the left and right sides of the circular heat-conducting frame, and the other two pads are respectively fixed on the inner walls of the support frame, and the two arc-shaped spring sheets are respectively fixed between the two pads. The protection component is arranged on the front side of the four pads, and the arc-shaped spring sheets on the pads buffer the circular heat-conducting frame to prevent the multi-layer circuit board on the circular heat-conducting frame from shaking during transportation and causing damage to the electronic components, thereby avoiding the problem of the multi-layer circuit board being easily damaged during transportation.

[0013] Preferably, the protection component includes four support plates, a grid plate and two baffles, two of the support plates are respectively fixed on the top surfaces of the four pads, and the other two of the support plates are respectively fixed on the bottom surfaces of the four pads, the grid plate is fixedly installed on the front surfaces of the four support plates, and the two baffles are respectively fixed on the top and bottom surfaces of the grid plates, and the two baffles are respectively arranged on the front surfaces of two circular heat-conducting frames. The grid plates and the baffles prevent foreign objects from entering or knocking against the multi-layer circuit board, thereby preventing foreign objects from damaging the multi-layer circuit board, thereby avoiding the problem of the multi-layer circuit board being accidentally damaged by foreign objects.

[0014] The present invention provides a multi-layer circuit board with high efficiency in heat dissipation. It has the following beneficial effects:

[0015] (1) The present invention arranges a heat dissipation device so that the circular heat-conducting frame, the heat-conducting feet, the hollow heat-conducting pipe, the heat-conducting ring and the fan device cooperate with the ceramic heat sink. The ceramic heat sink absorbs the heat in the middle of the multi-layer circuit board, and the ceramic heat sink transfers the heat to the heat-conducting ring. The hollow heat-conducting pipe transfers the heat at the edge of the multi-layer circuit board to the heat-conducting ring. The fan device discharges the heat evenly, preventing the damage of the electronic components of the multi-layer circuit board caused by excessive local heat, thereby avoiding the problem of local high-temperature damage caused by uneven heat dissipation of the multi-layer circuit board.

[0016] (2) The present invention arranges a dehumidification device so that the strip box, motor, roller, U-shaped plate and dehumidification box cooperate with the silica gel dehumidification block. The silica gel dehumidification block increases the contact area with the gas during the left and right reciprocating movement, allowing the silica gel dehumidification block to absorb moisture in the gas more quickly, thereby preventing the electronic components on the multi-layer circuit board from being corroded by the gas containing moisture, thereby avoiding the problem of damage to the electronic components of the multi-layer circuit board due to moisture.

[0017] (3) The present invention arranges a heat-conducting device so that the L-shaped plate, the fan plate, the rubber strip and the strip plate cooperate with the U-shaped connecting plate. The fan plate fans back and forth in the L-shaped plate. The rubber strip on the fan plate prevents damage due to bumps. The fan plate fans the airflow, and the airflow blows the back of the multi-layer circuit board to prevent heat from accumulating on the back of the multi-layer circuit board, thereby avoiding the problem of damage to the back of the multi-layer circuit board due to excessive heat. In addition, the strip plate and the U-shaped connecting plate buffer the dehumidification box, reducing the vibration caused by the movement of the dehumidification box during the dehumidification process, thereby avoiding the problem of damage to electronic components caused by vibration caused by dehumidification of the multi-layer circuit board.

[0018] (4) The present invention arranges a buffer device so that the cushion strip, arc-shaped spring sheet, support plate and mesh plate cooperate with the baffle plate. The arc-shaped spring sheet on the cushion strip buffers the circular heat-conducting frame to prevent the multi-layer circuit board on the circular heat-conducting frame from shaking during transportation and causing damage to electronic components, thereby avoiding the problem of the multi-layer circuit board being easily damaged during transportation. In addition, the mesh plate and the baffle plate prevent foreign objects from entering or hitting the multi-layer circuit board, preventing foreign objects from damaging the multi-layer circuit board, thereby avoiding the problem of the multi-layer circuit board being accidentally damaged by foreign objects. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the present invention as a whole;

[0020] Figure 2 It is a schematic diagram of the left side section of the present invention as a whole;

[0021] Figure 3 is a schematic diagram of the front side of the heat dissipation device of the present invention;

[0022] Figure 4 It is a schematic diagram of a left side cross-section of the heat dissipation device of the present invention;

[0023] Figure 5 is a schematic diagram of a front cross-sectional view of a dehumidification device of the present invention;

[0024] Figure 6 is a schematic diagram of the back side of the dehumidification device of the present invention;

[0025] Figure 7 is a schematic diagram of a cross-sectional back side view of the heat conducting device of the present invention;

[0026] Figure 8 It is a schematic diagram of a cross-sectional view of the bottom surface of the buffer device of the present invention.

[0027] In the figure: 1. multilayer circuit board; 2. support frame; 3. mounting plate; 4. heat dissipation device; 5. dehumidification device; 6. heat conduction device; 7. buffer device; 41. round heat conduction frame; 42. heat conduction foot; 43. hollow heat conduction pipe; 44. heat conduction ring; 45. fan device; 46. ceramic heat sink; 51. strip box; 52. motor; 53. roller; 54. U-shaped plate; 55. dehumidification box; 56. silica gel dehumidification block; 61. L-shaped plate; 62. fan plate; 63. rubber strip; 64. strip plate; 65. U-shaped connecting plate; 71. gasket; 72. arc-shaped spring piece; 73. support plate; 74. grid plate; 75. baffle. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Example 1

[0029] See also Figure 1-6The present invention provides a technical solution: a multi-layer circuit board with high efficiency in heat dissipation, comprising a multi-layer circuit board 1, two support frames 2 and two mounting plates 3, wherein the two support frames 2 are embedded on the left and right sides of the multi-layer circuit board 1, and the two mounting plates 3 are respectively fixed on one end of the two support frames 2 away from the multi-layer circuit board 1, and the surfaces of the two mounting plates 3 are provided with round holes, and also comprising a heat dissipation device 4 and a dehumidification device 5, wherein the heat dissipation device 4 is arranged on the outer wall of the multi-layer circuit board 1, and the heat dissipation device 4 also comprises a round-shaped heat-conducting frame 41, four heat-conducting feet 42, four hollow heat-conducting pipes 43, a heat-conducting ring 44, a fan device 45, and a plurality of ceramic heat sinks 46, the round-shaped heat-conducting frame 41 is fixedly mounted on the outer wall of the multi-layer circuit board 1, the four heat-conducting feet 42 are respectively fixed at the four corners of the round-shaped heat-conducting frame 41, the four hollow heat-conducting pipes 43 are respectively fixed on the front of the four heat-conducting feet 42, the heat-conducting ring 44 is fixed on one end of the four hollow heat-conducting pipes 43 away from the four heat-conducting feet 42, and the fan device 45 is provided on the outer wall of the multi-layer circuit board 1. The fan device 45 is fixedly installed in the middle of the inner wall of the heat-conducting ring 44, and a plurality of ceramic heat sinks 46 are respectively fixed on one side of the heat-conducting ring 44 close to the circular heat-conducting frame 41. A plurality of resistors are welded on the front of the multi-layer circuit board 1, and a plurality of semiconductor chips are welded on the front of the multi-layer circuit board 1. The semiconductor chips of the multi-layer circuit board 1 are used to control the opening and closing of the fan device 45 through wires. A plurality of wire interfaces are welded on the front of the multi-layer circuit board 1. The circular heat-conducting frame 41 is a non-conductive and heat-resistant material. A heat-conducting gap is arranged between the plurality of ceramic heat sinks 46. The ceramic heat sink 46 absorbs the heat in the middle of the multi-layer circuit board 1, and the ceramic heat sink 46 transfers the heat to the heat-conducting ring 44. The hollow heat-conducting pipe 43 transfers the heat at the edge of the multi-layer circuit board 1 to the heat-conducting ring 44. The fan device 45 discharges the heat evenly to prevent the damage of the electronic components of the multi-layer circuit board 1 caused by excessive local heat, thereby avoiding the problem of local high-temperature damage caused by uneven heat dissipation of the multi-layer circuit board 1.

[0030] The dehumidification device 5 is arranged at the rear side of the heat dissipation device 4, and the dehumidification device 5 includes two strip boxes 51, two motors 52, two rollers 53, a U-shaped plate 54, a dehumidification box 55, and a silica gel dehumidification block 56. The two strip boxes 51 are respectively fixed on the top and bottom surfaces of the circular heat conduction frame 41, and the two strip boxes 51 are respectively provided with slide grooves on the back side, and the two strip boxes 51 are respectively provided with slide rails on the back side. The two motors 52 are respectively slidably installed inside the two strip boxes 51, and the two rollers 53 are respectively fixed on the back side of the rotating shafts of the two motors 52. The two rollers 53 are respectively slidably installed in the slide rails of the two strip boxes 51, and the U-shaped plate 54 is fixed on the back side of the two motors 52, and the dehumidification box 55 is fixed on the U-shaped In the middle of the front of the plate 54, an air inlet is opened on the front of the dehumidification box 55, a silica gel dehumidification block 56 is fixedly installed on the inner wall of the dehumidification box 55, two motors 52 are respectively fixed with sliding pads on the opposite sides, the semiconductor chip of the multi-layer circuit board 1 is used to control the opening and closing of the motor 52 through wires, and rubber membranes are respectively fixed on the outer walls of the two rollers 53. A filter is fixedly installed on the air inlet of the dehumidification box 55. The silica gel dehumidification block 56 increases the contact area with the gas during the reciprocating movement to the left and right, so that the silica gel dehumidification block 56 can absorb moisture in the gas more quickly to prevent the electronic components on the multi-layer circuit board 1 from being corroded by the gas containing moisture, thereby avoiding the problem of damage to the electronic components of the multi-layer circuit board 1 due to moisture.

[0031] The staff puts the multi-layer circuit board 1 into the housing and connects it to the housing through the mounting plate 3 on the support frame 2. During daily use, the round-shaped heat-conducting frame 41 on the multi-layer circuit board 1 absorbs the heat from the edge of the multi-layer circuit board 1. The heat is transferred to the heat-conducting foot 42, the heat-conducting foot 42 transfers the heat to the hollow heat-conducting pipe 43, the hollow heat-conducting pipe 43 transfers the heat to the heat-conducting ring 44, and the heat in the middle of the multi-layer circuit board 1 is dissipated to the ceramic heat sink 46. At the same time, the semiconductor chip on the multi-layer circuit board 1 is used to start the fan device 45 on the heat-conducting ring 44 through the wire, and the fan device 45 starts to rotate the fan blades, and the rotation of the fan blades draws the airflow in and discharges the airflow outward, so that the ceramic heat sink 46 absorbs the heat in the middle of the multi-layer circuit board 1, and the ceramic heat sink 46 transfers the heat to the heat-conducting ring 44, the hollow heat-conducting pipe 43 transfers the heat from the edge of the multi-layer circuit board 1 to the heat-conducting ring 44, and the fan device 45 discharges the heat evenly to prevent local excessive heat from causing damage to the electronic components of the multi-layer circuit board 1, thereby avoiding the problem of local high temperature damage caused by uneven heat dissipation of the multi-layer circuit board 1.

[0032] When the multilayer circuit board 1 is in a humid environment, the semiconductor chip on the multilayer circuit board 1 is used to start the motor 52 in the strip box 51 through the wire, the motor 52 shaft rotates back and forth, the motor 52 drives the roller 53 to rotate back and forth, the roller 53 slides back and forth in the slide rail of the strip box 51, the roller 53 drives the motor 52 to slide back and forth in the strip box 51, the motor 52 drives the U-shaped plate 54 to move back and forth, the U-shaped plate 54 drives the dehumidification box 55 to move back and forth, the dehumidification box 55 drives the silica gel dehumidification block 56 to move back and forth, so that the silica gel dehumidification block 56 increases the contact area with the gas during the reciprocating movement, so that the silica gel dehumidification block 56 absorbs moisture in the gas more quickly, and prevents the electronic components on the multilayer circuit board 1 from being corroded by the gas containing moisture, thereby avoiding the problem of damage to the electronic components of the multilayer circuit board 1 due to moisture. Example 2

[0033] See also Figure 1-8 Based on Example 1, this embodiment further includes a heat conducting device 6 and a buffer device 7, wherein the heat conducting device 6 is arranged on the dehumidification device 5 and is located on the right side of the dehumidification device 5, the heat conducting device 6 includes an L-shaped plate 61, a fan plate 62, two rubber strips 63 and a shock absorbing assembly, the L-shaped plate 61 is fixed in the middle of the back side of the U-shaped plate 54, the fan plate 62 is rotatably installed on the front side of the L-shaped plate 61, a torsion spring is arranged between the fan plate 62 and the L-shaped plate 61, the two rubber strips 63 are respectively fixed on the left and right sides of the fan plate 62, the fan plate 62 reciprocates in the L-shaped plate 61, the rubber strips 63 on the fan plate 62 prevent damage from bumps, the fan plate 62 fans the airflow, and the airflow blows the back of the multi-layer circuit board 1 to prevent heat from accumulating on the back of the multi-layer circuit board 1, thereby avoiding the problem of excessive heat damage on the back of the multi-layer circuit board 1.

[0034] The shock absorbing devices are respectively arranged on the top and bottom surfaces of the L-shaped plate 61. The shock absorbing assembly includes two strips 64 and two U-shaped connecting plates 65. The two strips 64 are respectively hinged on the top and bottom surfaces of the U-shaped plate 54. The two U-shaped connecting plates 65 are respectively hinged on the top and bottom surfaces of the support frame 2. The ends of the two strips 64 away from the U-shaped plate 54 are respectively rotatably installed inside the U-shaped connecting plates 65. Torsion springs are arranged between the two strips 64 and the two U-shaped connecting plates 65. The strips 64 and the U-shaped connecting plates 65 buffer the dehumidification box 55 to reduce the vibration caused by the movement of the dehumidification box 55 during the dehumidification process, thereby avoiding the problem of vibration damaging electronic components caused by dehumidification of the multi-layer circuit board 1.

[0035] The buffer device 7 is arranged between the two support frames 2, and the buffer device 7 includes four pads 71, two arc-shaped spring pieces 72 and a protection component. The two pads 71 ​​are respectively fixed on the left and right sides of the circular heat-conducting frame 41, and the other two pads 71 ​​are respectively fixed on the inner walls of the support frame 2. The two arc-shaped spring pieces 72 are respectively fixed between the two pads 71. The arc-shaped spring pieces 72 on the pads 71 ​​buffer the circular heat-conducting frame 41 to prevent the multi-layer circuit board 1 on the circular heat-conducting frame 41 from shaking during transportation and causing damage to electronic components, thereby avoiding the problem of the multi-layer circuit board 1 being easily damaged due to shaking during transportation.

[0036] The protection component is arranged on the front of the four pads 71, and the protection component includes four support plates 73, a grid plate 74 and two baffles 75. The two support plates 73 are respectively fixed on the top surfaces of the four pads 71, and the other two support plates 73 are respectively fixed on the bottom surfaces of the four pads 71. The grid plate 74 is fixedly installed on the front of the four support plates 73. The two baffles 75 are respectively fixed on the top and bottom surfaces of the grid plate 74. The two baffles 75 are respectively arranged on the front of two circular heat conducting frames 41. The grid plate 74 and the baffle 75 prevent foreign objects from entering or knocking against the multi-layer circuit board 1, preventing foreign objects from damaging the multi-layer circuit board 1, thereby avoiding the problem of the multi-layer circuit board 1 being accidentally damaged by foreign objects.

[0037] While the motor 52 drives the U-shaped plate 54 to move back and forth left and right, the U-shaped plate 54 drives the L-shaped plate 61 to move back and forth left and right, and the L-shaped plate 61 drives the fan plate 62 to move back and forth left and right, so that the fan plate 62 rotates in the L-shaped plate 61. The fan plate 62 is restricted by the torsion spring, and the fan plate 62 reciprocates in the L-shaped plate 61. The rubber strip 63 on the fan plate 62 prevents damage from bumps. The fan plate 62 fans the airflow, and the airflow blows the back of the multi-layer circuit board 1 to prevent heat from accumulating on the back of the multi-layer circuit board 1, thereby avoiding the problem of excessive heat damage on the back of the multi-layer circuit board 1.

[0038] While the U-shaped plate 54 drives the L-shaped plate 61 to move back and forth left and right, the strip plate 64 on the L-shaped plate 61 is restricted by the U-shaped connecting plate 65, and the strip plate 64 reciprocates up and down in the L-shaped plate 61. The strip plate 64 drives the U-shaped connecting plate 65 to reciprocate up and down outside the strip plate 64, and the U-shaped connecting plate 65 reciprocates up and down in the support frame 2. Under the action of the torsion spring force on the strip plate 64, the strip plate 64 and the U-shaped connecting plate 65 buffer the dehumidification box 55, reducing the vibration caused by the movement of the dehumidification box 55 during the dehumidification process, thereby avoiding the problem of vibration damage to electronic components caused by dehumidification of the multi-layer circuit board 1.

[0039] During daily transportation, under the elastic force of the arc-shaped spring piece 72 on the pad strip 71, the arc-shaped spring piece 72 on the pad strip 71 buffers the circular heat-conducting frame 41 to prevent the multi-layer circuit board 1 on the circular heat-conducting frame 41 from shaking during transportation and causing damage to electronic components, thereby avoiding the problem of the multi-layer circuit board 1 being easily damaged by shaking during transportation.

[0040] During daily use, the mesh plate 74 on the support plate 73 prevents foreign objects from hitting the multi-layer circuit board 1, and the baffle 75 on the mesh plate 74 prevents foreign objects from entering the multi-layer circuit board 1, so that the mesh plate 74 and the baffle 75 effectively prevent foreign objects from damaging the multi-layer circuit board 1, thereby avoiding the problem of the multi-layer circuit board 1 being accidentally damaged by foreign objects.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A multi-layer circuit board with high heat dissipation efficiency, comprising a multi-layer circuit board (1), two support frames (2) and two mounting plates (3), wherein the two support frames (2) are embedded on the left and right sides of the multi-layer circuit board (1), and the two mounting plates (3) are respectively fixed on one end of the two support frames (2) away from the multi-layer circuit board (1), and the surfaces of the two mounting plates (3) are provided with circular holes, characterized in that: It also comprises a heat sink (4), a dehumidification device (5), a heat conduction device (6) and a buffer device (7), wherein the heat sink (4) is arranged on the outer wall of the multi-layer circuit board (1), the dehumidification device (5) is arranged on the rear side of the heat sink (4), the heat conduction device (6) is arranged on the dehumidification device (5) and is located on the right side of the dehumidification device (5), and the buffer device (7) is arranged between two support frames (2) and is used to buffer the multi-layer circuit board (1) to prevent the multi-layer circuit board (1) from shaking during the transportation process and causing damage to electronic components; The heat dissipation device (4) further comprises a circular heat-conducting frame (41), four heat-conducting feet (42), four hollow heat-conducting tubes (43), a heat-conducting ring (44), a fan device (45), and a plurality of ceramic heat sinks (46); the circular heat-conducting frame (41) is fixedly mounted on the outer wall of the multilayer circuit board (1); the four heat-conducting feet (42) are respectively fixed at four corners of the circular heat-conducting frame (41); the four hollow heat-conducting tubes (43) are respectively fixed at the front of the four heat-conducting feet (42); the heat-conducting ring (44) is fixed at one end of the four hollow heat-conducting tubes (43) respectively away from the four heat-conducting feet (42); the fan device (45) is fixedly mounted in the middle of the inner wall of the heat-conducting ring (44); and the plurality of ceramic heat sinks (46) are respectively fixed at one side of the heat-conducting ring (44) close to the circular heat-conducting frame (41).

2. The multi-layer circuit board with high heat dissipation efficiency according to claim 1, characterized in that: A plurality of resistors are welded on the front side of the multilayer circuit board (1), a plurality of semiconductor chips are welded on the front side of the multilayer circuit board (1), the semiconductor chips of the multilayer circuit board (1) are used to control the opening and closing of a fan device (45) through electric wires, a plurality of electric wire interfaces are welded on the front side of the multilayer circuit board (1), the circular heat conducting frame (41) is made of a non-conductive heat-resistant material, and a heat conducting gap is provided between the plurality of ceramic heat sinks (46).

3. The multi-layer circuit board with high heat dissipation efficiency according to claim 1, characterized in that: The dehumidification device (5) comprises two strip boxes (51), two motors (52), two rollers (53), a U-shaped plate (54), a dehumidification box (55), and a silica gel dehumidification block (56); the two strip boxes (51) are respectively fixed on the top surface and the bottom surface of the circular heat conducting frame (41); the two strip boxes (51) are respectively provided with a slide groove on the back side; the two strip boxes (51) are respectively provided with a slide rail on the back side; the two motors (52) are respectively slidably mounted on the two strip boxes. Inside the box (51), the two rollers (53) are respectively fixed on the back sides of the rotating shafts of the two motors (52), and the two rollers (53) are respectively slidably mounted in the slide rails of the two strip boxes (51). The U-shaped plate (54) is fixed on the back sides of the two motors (52). The dehumidification box (55) is fixed in the middle of the front side of the U-shaped plate (54). An air inlet is provided on the front side of the dehumidification box (55). The silica gel dehumidification block (56) is fixedly mounted on the inner wall of the dehumidification box (55).

4. The multi-layer circuit board with high heat dissipation efficiency according to claim 3, characterized in that: Sliding pads are fixed to the two motors (52) facing each other, the semiconductor chip of the multilayer circuit board (1) is used to control the opening and closing of the motor (52) through electric wires, rubber membranes are fixed to the outer walls of the two rollers (53), and a filter is fixedly installed at the air inlet of the dehumidification box (55).

5. The multi-layer circuit board with high heat dissipation efficiency according to claim 3, characterized in that: The heat conduction device (6) comprises an L-shaped plate (61), a fan plate (62), two rubber strips (63) and a shock absorbing assembly, wherein the L-shaped plate (61) is fixed in the middle of the back side of the U-shaped plate (54), the fan plate (62) is rotatably mounted on the front side of the L-shaped plate (61), a torsion spring is arranged between the fan plate (62) and the L-shaped plate (61), the two rubber strips (63) are respectively fixed on the left side and the right side of the fan plate (62), and the shock absorbing devices are respectively arranged on the top surface and the bottom surface of the L-shaped plate (61).

6. The multi-layer circuit board with high heat dissipation efficiency according to claim 5, characterized in that: The shock absorbing assembly comprises two strips (64) and two U-shaped connecting plates (65); the two strips (64) are respectively hinged to the top surface and the bottom surface of the U-shaped plate (54); the two U-shaped connecting plates (65) are respectively hinged to the top surface and the bottom surface of the support frame (2); one end of the two strips (64) away from the U-shaped plate (54) is rotatably mounted inside the U-shaped connecting plates (65); and a torsion spring is provided between the two strips (64) and the two U-shaped connecting plates (65).

7. The multi-layer circuit board with high heat dissipation efficiency according to claim 1, characterized in that: The buffer device (7) comprises four pads (71), two arc-shaped spring sheets (72) and a protection component, wherein two of the pads (71) are respectively fixed to the left and right sides of the round-shaped heat-conducting frame (41), and another two of the pads (71) are respectively fixed to the inner wall of the support frame (2), and the two arc-shaped spring sheets (72) are respectively fixed between the two pads (71), and the protection component is arranged on the front of the four pads (71).

8. The multi-layer circuit board with high heat dissipation efficiency according to claim 7, characterized in that: The protection assembly comprises four support plates (73), a grid plate (74) and two baffles (75); two of the support plates (73) are respectively fixed on the top surfaces of four pad strips (71); the other two of the support plates (73) are respectively fixed on the bottom surfaces of the four pad strips (71); the grid plate (74) is fixedly mounted on the front surfaces of the four support plates (73); the two baffles (75) are respectively fixed on the top and bottom surfaces of the grid plate (74); and the two baffles (75) are respectively arranged on the front surfaces of two round-shaped heat conducting frames (41).

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