Chip curing packaging equipment

Abstract

The invention discloses a chip curing packaging device, which relates to the field of chip packaging technology, and comprises a base plate, a connecting plate is arranged on one side of the base plate, and a rotating structure is arranged on the surface of the connecting plate; an adjustment groove is arranged on the top surface of the base plate, and the adjusting groove is arranged with a packaging structure. By arranging the packaging structure, an air pump of the packaging structure faces an upper rotating disk and a lower rotating disk for installing the chip, and the air pump is started to drive the output end connecting rod of the cylinder to drive two pneumatic welding guns to move to cure and package the chip; after the packaging is completed, the air pump is started to adsorb the air, and the debris generated by the packaged chip is attracted by the air pump on one side and enters a collecting groove on one side for collection; by arranging the rotating structure, the collecting groove can facilitate the collection of dust and debris, and after completing one curing and packaging, the subsequent chip is packaged by rotation, and during the rotation, the cleaning brush cleans the surface of the rotating disk, and at the same time, the dust and debris can be swept into the collecting groove to complete the collection.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip curing packaging device. Background Art

[0002] The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chips and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. The contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits.

[0003] Existing chip packaging equipment, such as a chip curing packaging equipment with publication number CN115831828B, includes: a support base, a clamping mechanism, a chip, a three-axis moving mechanism and two pneumatic welding guns, the clamping mechanism includes a fixed plate, the fixed plate includes a clamping assembly and a driving assembly, the driving assembly includes a rotating fixed seat, and an annular groove is formed on the rotating fixed seat.

[0004] This packaging equipment will produce colloid debris after packaging and curing the chip, which needs to be cleaned during the packaging process to ensure the quality of the cured packaging. This packaging equipment cannot clean the impurities and debris on the surface, so they will enter the chip surface and perform the packaging operation together with the chip. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the packaging equipment of the above-mentioned background technology cannot clean the dust and debris generated during the packaging process, and to provide a chip curing packaging equipment.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A chip curing packaging device comprises a bottom plate, a connecting plate is arranged on one side of the bottom plate, a rotating structure is arranged on the surface of the connecting plate, a rotating gear of the rotating structure is rotatably connected to the connecting plate, an upper rotating disk and a lower rotating disk are arranged on the upper and lower surfaces of the connecting gear respectively, a plurality of fixed grooves and a collecting groove are arranged on the surface of the upper rotating disk and the lower rotating disk, and the collecting groove is arranged on one side of the fixed groove;

[0008] An adjustment groove is provided on the top surface of the bottom plate, and a packaging structure is provided in the adjustment groove, and a sliding frame of the packaging structure is slidably connected in the adjustment groove; vertical plates are provided on both sides of the sliding frame, and sliding grooves are provided on opposite surfaces of the vertical plates on both sides, and a first horizontal rod and a second horizontal rod are slidably provided in the sliding grooves on both sides, and the first horizontal rod and the second horizontal rod are respectively located above and below the rotating structure, and an upper pneumatic welding gun and a lower pneumatic welding gun are slidably provided on the surfaces of the first horizontal rod and the second horizontal rod respectively; an air pump is provided on the surface of the vertical plate on one side, and two cylinders are provided in the sliding groove close to the air pump, the air pump is connected to the cylinder, and the output end of the cylinder is connected to the first horizontal rod and the second horizontal rod; a cleaning brush is provided on the vertical plate away from the air pump, and the cleaning brush contacts the surface of the upper rotating disk.

[0009] As a further solution of the present invention: sliding blocks are provided at both ends of the first horizontal rod and the second horizontal rod, and the sliding blocks are slidably connected in the sliding groove; a connecting rod is provided at the output end of the cylinder, and the connecting rod is fixedly connected to the sliding block.

[0010] As a further solution of the present invention: the surfaces of the first horizontal rod and the second horizontal rod are both provided with adjustment grooves, the surfaces of the adjustment grooves are slidably provided with adjustment blocks, and the surfaces of the adjustment blocks are provided with upper and lower pneumatic welding guns.

[0011] As a further solution of the present invention: a screw rod is rotatably arranged in the adjustment groove, and a surface of the screw rod is threadedly connected to the sliding frame.

[0012] As a further solution of the present invention: a first motor is arranged in the base plate, and an output end of the first motor is coaxially fixedly connected to the lead screw.

[0013] As a further solution of the present invention: limiting columns are arranged on both sides of the interior of the adjustment groove, and the limiting columns limit the sliding frame.

[0014] As a further solution of the present invention: the connecting plate is provided with a second motor, the output end of the second motor is vertically arranged upward, the output end of the second motor is coaxially connected with a driving gear, and the driving gear is connected to the transmission gear.

[0015] As a further solution of the present invention: a transmission gear is rotatably arranged in the connecting plate, the transmission gear is meshed and connected with the surface of the rotating gear, and the transmission gear is meshed and connected with the driving gear.

[0016] Beneficial effects of the present invention:

[0017] (1) A chip curing and packaging device of the present invention is provided with a packaging structure, wherein an air pump of the packaging structure faces an upper rotating disk and a lower rotating disk on which the chip is installed, and the air pump is started to drive the connecting rod at the output end of the cylinder to drive two pneumatic welding guns to move and cure the chip; after the packaging is completed, the air pump is started to absorb the air, and the debris generated by the packaged chip is attracted by the air pump on one side and enters a collection tank on one side for collection; the air absorbed by the air pump simultaneously enters the interior of the cylinders on both sides and drives the connecting rod to extend outward, and at the same time causes the horizontal rods on both sides to move outward, driving the two pneumatic welding guns away from the chip, so that the rotating structure can rotate to cure and package the subsequent chip;

[0018] (2) A chip curing and packaging device of the present invention has a rotating structure. The collection grooves on one side of the upper rotating disk and the lower rotating disk of the rotating structure can facilitate the collection of dust and debris. After completing one curing and packaging operation, the subsequent chips can be packaged by rotating 90 degrees. During the rotation, a cleaning brush arranged on the vertical plate on the other side cleans the surface of the rotating disk and can sweep the dust and debris into the collection groove for collection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Figure 1 It is a structural schematic diagram of a chip curing packaging device of the present invention;

[0021] Figure 2 The present invention Figure 1 A partial enlarged view of the middle A;

[0022] Figure 3 It is a front schematic diagram of a chip curing packaging device of the present invention;

[0023] Figure 4 It is a side schematic diagram of a chip curing packaging device of the present invention;

[0024] Figure 5 It is a schematic diagram of the internal structure of the connecting plate of the present invention.

[0025] In the figure: 1. bottom plate; 11. adjustment groove; 12. mounting plate; 13. connecting plate; 2. rotating structure; 21. upper rotating disk; 22. rotating gear; 23. lower rotating disk; 24. fixing groove; 25. collecting groove; 3. packaging structure; 31. sliding frame; 32. limiting column; 33. screw rod; 34. vertical plate; 35. sliding groove; 36. first horizontal rod; 37. upper pneumatic welding gun; 38. second horizontal rod; 39. lower pneumatic welding gun; 310. cylinder; 311. connecting rod; 312. sliding block; 313. air pump; 314. air hood; 315. cleaning brush; 316. adjusting groove; 317. adjusting block; 4. transmission gear; 5. driving gear; 6. first motor; 7. second motor. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Example 1

[0028] See also Figure 1-5 As shown, the present invention is a chip curing packaging device, comprising a base plate 1, an adjustment groove 11 is provided on the top surface of the base plate 1, and a mounting plate 12 is provided on one side of the base plate 1, and the mounting plate 12 is arranged along the vertical direction. A connecting plate 13 is provided on the top surface of the mounting plate 12, and the connecting plate 13 is arranged along the horizontal direction. A rotating structure 2 is provided on the side of the connecting plate 13 away from the mounting plate 12, and a rotating gear 22 of the rotating structure 2 is rotatably connected to the connecting plate 13. An upper rotating disk 21 is fixedly provided on the top of the rotating gear 22, and a lower rotating disk 23 is fixedly provided on the bottom surface of the rotating gear 22. Four fixing grooves 24 are provided on the exposed surfaces of the upper rotating disk 21 and the lower rotating disk 23. The fixing grooves 24 are arranged in a circumferential array at equal distances from the center of the upper rotating disk 21 and the lower rotating disk 23. A clamping component is provided inside the fixing groove 24. The chip to be packaged is placed in the fixing groove 24, and the internal supporting component will tightly clamp the chip to fix it. A collecting groove 25 is disposed on one side of the upper fixed groove 24 , and when viewed from the upper rotating disk 21 from top to bottom, the collecting groove 25 is disposed on one side of the fixed groove 24 in the clockwise direction.

[0029] The encapsulation structure 3 is arranged in the adjustment groove 11 of the bottom plate 1, and the sliding frame 31 of the encapsulation structure 3 is slidably connected in the adjustment groove 11. A screw rod 33 is rotatably arranged in the adjustment groove 11, and the screw rod 33 is threadedly connected to the sliding frame 31. Vertical plates 34 are arranged on both sides of the top of the sliding frame 31, and the vertical plates 34 are arranged along the vertical direction. Sliding grooves 35 are arranged on the opposite sides of the vertical plates 34 on both sides. The first horizontal rod 36 and the second horizontal rod 38 are arranged inside the sliding grooves 35 on both sides, and sliding blocks 312 are fixedly arranged at both ends of the first horizontal rod 36 and the second horizontal rod 38, and the sliding blocks 312 are slidably limited in the sliding grooves 35. Two cylinders 310 are arranged inside the sliding groove 35 near the collecting tank 25, and the two cylinders 310 are located on the same vertical straight line. The output ends of the two cylinders 310 are arranged upward and downward respectively, and the connecting rods 311 arranged at the output ends of the two cylinders 310 are fixedly connected to the sliding blocks 312. An air pump 313 is arranged on the surface of the vertical plate 34 on which the air cylinder 310 is arranged. One end of the air pump 313 is connected to the air cylinders 310 on both sides. An air hood 314 is arranged on the side of the air pump 313 close to the rotating structure 2. A cleaning brush 315 is fixedly arranged on the vertical plate 34 away from the air pump 313, and the bottom surface of the cleaning brush 315 contacts the surface of the upper rotating disk 21. Adjustment grooves 316 are arranged on the surfaces of the first horizontal rod 36 and the second horizontal rod 38, and adjustment blocks 317 are slidably arranged on the adjustment grooves 316. An upper pneumatic welding gun 37 and a lower pneumatic welding gun 39 are arranged on the adjustment blocks 317 of the first horizontal rod 36 and the second horizontal rod 38, respectively, and the output ends of the pneumatic welding guns on both sides are arranged toward the direction of the rotating structure 2.

[0030] Among them, a first motor 6 is arranged on the top of the mounting plate 12, and the output end of the first motor 6 is arranged upward in the vertical direction. The output end of the first motor 6 is coaxially connected with a driving gear 5, and a transmission gear 4 is rotatably arranged in the connecting plate 13. The transmission gear 4 is meshed and connected with the driving gear 5, and the surface of the transmission gear 4 is meshed and connected with the rotating gear 22.

[0031] When using this chip curing and packaging equipment, the chip to be cured and packaged is set in the fixing groove 24, and the clamping assembly in the fixing groove 24 clamps and fixes the chip. Then start the second motor 7, and the output end of the second motor 7 drives the screw rod 33 to rotate, so that the sliding frame 31 slides under the action of the screw rod 33 and the limit of the limit column 32. Thereby driving the vertical rods on both sides to move to the designated working area of ​​the rotating structure 2. The upper pneumatic welding gun 37 and the lower pneumatic welding gun 39 are used to cure and package the chip. After the packaging is completed, the air pump 313 is started, and the output end of the air pump 313 absorbs the external air through the air cover 314, so that the air generates negative pressure, and the dust and debris near the chip move and fall into the collection tank 25 for collection. The air pump 313 is connected to the cylinder 310. The air of the air pump 313 enters the cylinder 310 so that the output end of the cylinder 310 drives the connecting rod 311 and the sliding block 312 to move, so that the upper horizontal rod and the lower water rod move to both sides, and the upper pneumatic welding gun 37 and the lower pneumatic welding gun 39 are adjusted away from the working area. Then the first motor 6 is started, and the output end of the first motor 6 drives the driving gear 5 to rotate, and indirectly drives the transmission gear 4 and the rotating gear 22 to rotate, so that the rotating gear 22 rotates ninety degrees. The rotation of the rotating gear 22 drives the upper rotating disk 21 and the lower rotating disk 23 to rotate ninety degrees, so that the subsequent chip to be packaged rotates to the position of the upper pneumatic welding gun 37 and the lower pneumatic welding gun 39. During the rotation process, the cleaning brush 315 cleans the surface of the upper rotating disk 21. When the upper rotating disk 21 rotates so that the cleaning brush 315 is located on the collecting groove 25, the dust on the cleaning brush 315 will fall into the collecting groove 25 for collection. Then the air pump 313 is started to make the air hood 314 of the air pump 313 blow out air, so that the output end of the cylinder 310 drives the first horizontal rod 36 and the second horizontal rod 38 to approach the direction of the rotating structure 2, so that the two pneumatic welding guns can contact the chip surface for packaging.

[0032] Example 2

[0033] A method for using a chip curing packaging device comprises the following steps:

[0034] Step 1: The chip to be cured and packaged is placed in the fixing groove 24, and the clamping assembly in the fixing groove 24 clamps and fixes the chip. Then the second motor 7 is started, and the output end of the second motor 7 drives the screw rod 33 to rotate, so that the sliding frame 31 slides under the action of the screw rod 33 and the limit of the limit column 32. Thereby, the vertical rods on both sides are driven to move to the designated working area of ​​the rotating structure 2, so that the upper pneumatic welding gun 37 and the lower pneumatic welding gun 39 cure and package the chip.

[0035] Step 2: After the packaging is completed, the air pump 313 is started. The output end of the air pump 313 absorbs the external air through the air cover 314, so that the air generates negative pressure and the dust and debris near the chip move and fall into the collection tank 25 for collection.

[0036] Step 3: The air pump 313 is connected to the cylinder 310, and the air of the air pump 313 enters the cylinder 310 so that the output end of the cylinder 310 drives the connecting rod 311 and the sliding block 312 to move, thereby moving the upper horizontal rod and the lower water rod to both sides, and adjusting the upper pneumatic welding gun 37 and the lower pneumatic welding gun 39 away from the working area.

[0037] Step 4: Start the first motor 6. The output end of the first motor 6 drives the driving gear 5 to rotate, and indirectly drives the transmission gear 4 and the rotating gear 22 to rotate, so that the rotating gear 22 rotates 90 degrees. The rotation of the rotating gear 22 drives the upper rotating disk 21 and the lower rotating disk 23 to rotate 90 degrees, so that the subsequent chip to be packaged rotates to the position of the upper pneumatic welding gun 37 and the lower pneumatic welding gun 39.

[0038] Step 5: During the rotation process, the cleaning brush 315 cleans the surface of the upper rotating disk 21. When the upper rotating disk 21 rotates so that the cleaning brush 315 is located on the collecting groove 25, the dust on the cleaning brush 315 will fall into the collecting groove 25 for collection. Then the air pump 313 is started to make the air hood 314 of the air pump 313 blow out air, so that the output end of the cylinder 310 drives the first horizontal rod 36 and the second horizontal rod 38 to approach the direction of the rotating structure 2, so that the two pneumatic welding guns can contact the chip surface for packaging.

[0039] Working principle of the present invention: A chip curing packaging device of the present invention is provided with a packaging structure 3, and the air pump 313 of the packaging structure 3 faces the upper rotating disk 21 and the lower rotating disk 23 for installing the chip. The air pump 313 is started to drive the output end connecting rod 311 of the cylinder 310 to drive two pneumatic welding guns to move to cure and package the chip; after the packaging is completed, the air pump 313 is started to absorb the air, and the debris generated by the packaged chip is attracted by the air pump 313 on one side and enters the collection tank 25 on one side for collection; the air absorbed by the air pump 313 will enter the interior of the cylinders 310 on both sides at the same time. The connecting rod 311 is driven to extend outward, and the horizontal rods on both sides are moved outward, driving the two pneumatic welding guns away from the chip, so that the rotating structure 2 can be rotated to solidify and package the subsequent chips; by setting the rotating structure 2, the collection grooves 25 set on one side of the upper rotating disk 21 and the lower rotating disk 23 of the rotating structure 2 can facilitate the collection of dust and debris. After completing a solidification package, the subsequent chips are packaged by rotating ninety degrees. During the rotation, the cleaning brush 315 set on the vertical plate 34 on the other side cleans the surface of the rotating disk, and can sweep the dust and debris into the collecting groove 25 for collection.

[0040] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A chip curing packaging device, characterized in that: The invention comprises a bottom plate (1), a connecting plate (13) is arranged on one side of the bottom plate (1), a rotating structure (2) is arranged on the surface of the connecting plate (13), a rotating gear (22) of the rotating structure (2) is rotatably connected to the connecting plate (13), an upper rotating disk (21) and a lower rotating disk (23) are arranged on the upper and lower surfaces of the connecting gear respectively, a plurality of fixing grooves (24) and a collecting groove (25) are arranged on the surfaces of the upper rotating disk (21) and the lower rotating disk (23), and the collecting groove (25) is arranged on one side of the fixing groove (24); The top surface of the bottom plate (1) is provided with an adjustment groove (11), and the adjustment groove (11) is provided with a packaging structure (3), and a sliding frame (31) of the packaging structure (3) is slidably connected in the adjustment groove (11); vertical plates (34) are provided on both sides of the sliding frame (31), and sliding grooves (35) are provided on opposite surfaces of the vertical plates (34) on both sides, and a first horizontal rod (36) and a second horizontal rod (38) are slidably provided in the sliding grooves (35) on both sides, and the first horizontal rod (36) and the second horizontal rod (38) are respectively located above and below the rotating structure (2), and the first horizontal rod (36) and An upper pneumatic welding gun (37) and a lower pneumatic welding gun (39) are slidably disposed on the surface of the second horizontal rod (38); an air pump (313) is disposed on the surface of a vertical plate (34) on one side; two air cylinders (310) are disposed in a sliding groove (35) near the air pump (313); the air pump (313) is connected to the air cylinder (310); and the output end of the air cylinder (310) is connected to the first horizontal rod (36) and the second horizontal rod (38); a cleaning brush (315) is disposed on the vertical plate (34) away from the air pump (313); the cleaning brush (315) contacts the surface of the upper rotating disk (21); The air pump (313) absorbs air, and debris generated by the packaged chips is attracted by the air pump (313) on one side and enters the collection tank (25) on one side for collection; the air absorbed by the air pump (313) simultaneously enters the inside of the cylinders (310) on both sides, driving the first horizontal rod (36) and the second horizontal rod (38) to move outward.

2. The chip curing packaging equipment according to claim 1, characterized in that: Sliding blocks (312) are provided at both ends of the first horizontal rod (36) and the second horizontal rod (38), and the sliding blocks (312) are slidably connected in the sliding groove (35); a connecting rod (311) is provided at the output end of the cylinder (310), and the connecting rod (311) is fixedly connected to the sliding block (312).

3. The chip curing packaging equipment according to claim 1, characterized in that: The surfaces of the first horizontal rod (36) and the second horizontal rod (38) are both provided with adjustment grooves (316), the surfaces of the adjustment grooves (316) are slidably provided with adjustment blocks (317), and the surfaces of the adjustment blocks (317) are provided with upper pneumatic welding guns (37) and lower pneumatic welding guns (39).

4. The chip curing packaging equipment according to claim 1, characterized in that: A screw rod (33) is rotatably arranged in the adjustment groove (11), and a surface of the screw rod (33) is threadedly connected to the sliding frame (31).

5. The chip curing packaging equipment according to claim 4, characterized in that: A first motor (6) is arranged in the base plate (1), and an output end of the first motor (6) is coaxially fixedly connected to the lead screw (33).

6. The chip curing packaging equipment according to claim 5, characterized in that: Limiting posts (32) are arranged on both sides of the adjustment groove (11), and the limiting posts (32) limit the sliding frame (31).

7. The chip curing packaging equipment according to claim 1, characterized in that: The connecting plate (13) is provided with a second motor (7), the output end of the second motor (7) is arranged vertically upward, the output end of the second motor (7) is coaxially connected to a driving gear (5), and the driving gear (5) is connected to the transmission gear (4).

8. The chip curing packaging equipment according to claim 7, characterized in that: A transmission gear (4) is rotatably arranged in the connecting plate (13), the transmission gear (4) is meshingly connected with the surface of the rotating gear (22), and the transmission gear (4) is meshingly connected with the driving gear (5).

Images