An embedded stable chip capacitor packaging device

Abstract

The present invention discloses an embedded stable chip capacitor packaging device, which relates to the technical field of packaging devices, including a supporting base, a grabbing and mounting assembly for mounting a packaging plastic sheet for the chip capacitor is arranged on the top of the supporting base, a glue assembly for attaching glue to the packaging plastic sheet is arranged on the top of the supporting base, a positioning mechanism for positioning and clamping a circuit board is arranged on the top of the supporting base, and a dust removal assembly for removing dust is arranged on one side of the grabbing and mounting assembly. In the present invention, through the use of the dust removal assembly, a moving column pushes the extrusion block to move downward, a spring tube contracts, and air inside the spring tube is ejected from a nozzle at the bottom of the air outlet pipe through an air outlet pipe, and is sprayed toward the circuit board to blow away dust particles, thereby achieving the effect of removing dust particles remaining on the top of the chip capacitor, and avoiding the situation in which dust particles are encapsulated on the chip capacitor together with the packaging plastic sheet, resulting in hollows between the packaging plastic sheet and the chip capacitor, affecting the use of the chip capacitor.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging devices, and in particular to an embedded stable chip capacitor packaging device. Background Art

[0002] A chip capacitor packaging device is a device used to package and fix chip capacitors. It is usually composed of a clamp, a fixture, etc. The design and structure of the chip capacitor packaging device can be adjusted and optimized according to different application requirements. It can be used in electronic equipment, communication equipment, automotive electronics, medical equipment and other fields to provide stable and reliable capacitor packaging solutions. It is widely used in the electronics industry to provide stable and reliable capacitor packaging solutions for various devices and systems. The chip capacitor is packaged using suitable packaging materials, such as epoxy resin, silicone, etc. The packaging material has insulating and protective properties, which can prevent the capacitor from being affected by the external environment. A packaging plastic sheet is installed on the top of the chip capacitor to protect the capacitor and ensure its stable and reliable connection. Packaging can provide protection for the chip capacitor to prevent it from being affected by external environmental factors such as mechanical vibration, shock, temperature changes and humidity. Packaging can provide an additional insulation layer and shell to protect the circuits and components inside the capacitor.

[0003] In the process of pasting the encapsulation plastic sheet on the top of the chip capacitor, the positioning and clamping of the circuit board must be completed manually. However, since the capacitor components on the circuit board are small and require high positioning accuracy, manual positioning is prone to deviations, and the encapsulation plastic sheet will not be accurately pasted on the top of the capacitor element, which will affect the tightness and stability of the package, and may cause gaps or uneven contact between the plastic sheet and the capacitor element during the packaging process, thereby affecting the quality and performance of the package.

[0004] During the chip capacitor packaging process, if some dust particles remain on the top, these particles will be encapsulated on the chip capacitor together with the packaging plastic sheet, which will cause hollows to form between the packaging plastic sheet and the chip capacitor, destroying the sealing property and affecting its performance, thereby affecting the use of the chip capacitor. During the working process of the capacitor, the capacitor may drift in capacitance due to loose internal structure, thereby affecting the normal operation of the electronic equipment, causing the chip capacitor to have an unstable structure and possibly damage the capacitor. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the present invention provides an embedded stable chip capacitor packaging device, which solves the problems raised in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions: an embedded stable chip capacitor packaging device, used for packaging chip capacitors, the embedded stable chip capacitor packaging device includes a support base, a grabbing and mounting component for mounting a packaging plastic sheet for the chip capacitor is arranged on the top of the support base, an adhesive component for attaching glue to the packaging plastic sheet is arranged on the top of the support base, a positioning mechanism for positioning and clamping a circuit board is arranged on the top of the support base, and a dust removal component for removing dust is arranged on one side of the grabbing and mounting component;

[0009] The positioning mechanism includes a positioning component arranged on the top of the support base for assisting in positioning the chip capacitor, and a fixing component arranged on the bottom of the positioning component for clamping and fixing the circuit board.

[0010] Furthermore, the grabbing and mounting assembly includes a motor fixedly connected to the top of the supporting base, the output shaft of the motor is fixedly connected to a reciprocating rod, the end of the reciprocating rod away from the motor is rotatably connected to a moving rod, the end of the moving rod away from the reciprocating rod is rotatably connected to a lifting plate, the top of the supporting base is fixedly connected to a track plate, the track plate is slidably connected to the lifting plate, a track groove is provided inside the track plate, a lifting groove is provided inside the lifting plate, the lifting groove is arranged in an inverted V shape, a moving column is slidably connected inside the lifting groove, the end of the moving column away from the lifting plate is fixedly connected to a transfer rod, and the moving column is slidably connected to the inside of the track groove.

[0011] Furthermore, a right clamping plate is rotatably connected to one side of the transfer rod, a right clamping roller is rotatably connected to the bottom of the right clamping plate, a clamping spring is slidably connected inside the transfer rod, the clamping spring is fixedly connected to the right clamping plate, a left clamping plate is rotatably connected to the right side of the transfer rod, a left clamping roller is rotatably connected to the bottom of the left clamping plate, and the left clamping plate is fixedly connected to the clamping spring.

[0012] Furthermore, the adhesive component includes a support column fixedly connected to the top of the support base, a packaging sheet groove is opened on the top of the support column, a glue box is fixedly connected inside the support column, glue cotton is fixedly connected inside the support column, the glue cotton is connected to the glue box, and a clamping groove is opened on the top of the support column.

[0013] Furthermore, the positioning assembly includes a storage table fixedly connected to the top of the support base, the top of the storage table is fixedly connected to a support frame, the top of the support frame is rotatably connected to a positioning rod, the end of the positioning rod away from the support frame is fixedly connected to a laser locator, the top of the support frame is fixedly connected to a horizontal frame, the top of the storage table is fixedly connected to a fixed block, the fixed block is internally threaded with a worm, the right end of the worm is rotatably connected to a positioning plate, and the end of the worm away from the positioning plate is fixedly connected to a rotating handle.

[0014] Furthermore, the fixing assembly includes a rotating column rotatably connected to the bottom of the storage table, the bottom of the rotating column is fixedly connected to a rotating gear, the bottom of the lifting plate is fixedly connected to a connecting plate, the bottom of the connecting plate is fixedly connected to a rack, the rack is meshed with the rotating gear, the outer side of the rotating column is fixedly connected to a rotating block, the end of the rotating block away from the rotating column is rotatably connected to a stretching rod, and the end of the stretching rod away from the rotating block is rotatably connected to the connecting block.

[0015] Furthermore, both ends of the connecting block are rotatably connected to pulling rods, the bottom of the storage table is fixedly connected to a rotating shaft, the outer side of the rotating shaft is rotatably connected to two clamping rods, the clamping rods are rotatably connected to the pulling rods, the ends of the two clamping rods away from the rotating shaft are fixedly connected to the clamping shaft, and the outer sides of the clamping shafts are fixedly connected to shock-absorbing rollers.

[0016] Furthermore, the dust removal assembly includes a support ring fixedly connected to the track plate near the storage table side, the top of the support ring is fixedly connected to a fixed cylinder, the top of the support ring is fixedly connected to a spring tube, the spring tube is located inside the fixed cylinder, the top of the spring tube is fixedly connected to an extrusion block, the bottom of the spring tube is fixedly connected to an air outlet pipe, the air outlet pipe is fixedly connected to the fixed cylinder, the bottom of the spring tube is fixedly connected to a rotating shaft, the outer side of the rotating shaft is rotatably connected to an air intake piece, the bottom of the support ring is fixedly connected to a blocking piece, and the bottom of the air outlet pipe is fixedly connected to a nozzle.

[0017] (III) Beneficial effects

[0018] The present invention provides an embedded stable chip capacitor packaging device, which has the following beneficial effects:

[0019] 1. The present invention uses a positioning mechanism. The user rotates the positioning rod by hand. The user rotates the rotating handle. The positioning plate is close to the left side of the circuit board, and the other two positioning plates are respectively close to the front and the rear of the circuit board, so that the circuit board is fixed by the positioning plate. At the same time, the chip capacitor to be packaged on the circuit board is located just below the laser, thereby achieving the effect of positioning the chip capacitor of the circuit board, avoiding the situation where the packaging plastic sheet cannot be accurately pasted on the top of the capacitor element due to deviations caused by naked eye observation, which affects the tightness and stability of the packaging. When the same chip capacitor of the same circuit board of the same batch is packaged subsequently, there is no need to repeat the positioning. The packaged circuit board is removed, and the unpackaged circuit board is placed between the positioning plates in the same direction as the packaged circuit board, so that the three sides of the unpackaged circuit board are close to the positioning plates to complete the positioning.

[0020] 2. The present invention uses a dust removal component. The movable column pushes the extrusion block to move downward, the spring tube contracts, and the air inside the spring tube is ejected from the nozzle at the bottom of the air outlet pipe through the air outlet pipe, and sprayed toward the circuit board to blow away the dust particles, thereby achieving the effect of removing the dust particles remaining on the top of the chip capacitor, and avoiding the situation where the dust particles will be encapsulated on the chip capacitor together with the encapsulation plastic sheet, resulting in hollows between the encapsulation plastic sheet and the chip capacitor, affecting the use of the chip capacitor.

[0021] 3. The present invention uses a grabbing and mounting assembly, and the motor drives the reciprocating rod to rotate, and the left clamping plate and the right clamping plate squeeze the clamping spring to shrink the clamping spring. At the same time, the reverse elastic force of the clamping spring causes the left clamping roller and the right clamping roller to clamp the packaging plastic sheet, thereby achieving the effect of clamping the packaging plastic sheet. The device automatically clamps the packaging plastic sheet instead of manual picking, thereby preventing the packaging plastic sheet from adhering to more dust.

[0022] The reciprocating rod pulls the moving rod to move to the left, and the clamping shaft drives the shock-absorbing roller to rotate. The shock-absorbing roller and the other three identical shock-absorbing rollers clamp the circuit board above the storage table, achieving the effect of fixing the circuit board, ensuring that during subsequent packaging, the jitter during machine operation will not cause the circuit board position to deviate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a schematic cross-sectional view of part of the structure of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the grabbing and installing assembly of the present invention;

[0026] Figure 4 It is a schematic diagram of the structure of the clamping spring of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of the adhesive assembly of the present invention;

[0028] Figure 6 It is a schematic diagram of the positioning mechanism structure of the present invention;

[0029] Figure 7 This is a schematic diagram of the structure of the positioning component of the present invention;

[0030] Figure 8 It is a schematic diagram of the structure of the fixing assembly of the present invention;

[0031] Fig. 9 This is a schematic diagram of the structure of the dust removal component of the present invention;

[0032] Fig.10 It is a schematic diagram of the structure of the air intake plate of the present invention.

[0033] The numbers in the figure represent:

[0034] 1. Support base;

[0035] 2. Grab and install assembly; 21. Motor; 22. Reciprocating rod; 23. Moving rod; 24. Track plate; 25. Track slot; 26. Lifting plate; 27. Lifting slot; 28. Moving column; 29. ​​Transfer rod; 210. Right clamping plate; 211. Clamping spring; 212. Right clamping roller; 213. Left clamping plate; 214. Left clamping roller;

[0036] 3. Adhesive assembly; 31. Support column; 32. Glue box; 33. Packaging sheet slot; 34. Glue cotton; 35. Clamping slot;

[0037] Positioning mechanism: 41, positioning assembly; 411, storage table; 412, support frame; 413, positioning rod; 414, laser locator; 415, horizontal frame; 416, fixing block; 417, worm; 418, positioning plate; 419, rotating handle; 42, fixing assembly; 421, rotating column; 422, rotating gear; 423, connecting plate; 424, rack; 425, rotating block; 426, stretching rod; 427, connecting block; 428, pulling rod; 429, rotating shaft; 4210, clamping rod; 4211, clamping shaft; 4212, shock-absorbing roller;

[0038] 5. Dust removal assembly; 51. Support ring; 52. Fixed cylinder; 53. Spring tube; 54. Extrusion block; 55. Air outlet pipe; 56. Rotating shaft; 57. Air inlet piece; 58. Blocking piece. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] refer to Figures 1 to 10 An embedded stable chip capacitor packaging device according to a preferred embodiment of the present invention will be described in detail below. An embedded stable chip capacitor packaging device is used to package chip capacitors.

[0041] An embedded stable chip capacitor packaging device comprises a support base 1, a grabbing and mounting component 2 for mounting a packaging plastic sheet for a chip capacitor is arranged on the top of the support base 1, an adhesive component 3 for attaching glue to the packaging plastic sheet is arranged on the top of the support base 1, a positioning mechanism for positioning and clamping a circuit board is arranged on the top of the support base 1, and a dust removal component 5 for removing dust is arranged on one side of the grabbing and mounting component 2;

[0042] The positioning mechanism includes a positioning component 41 disposed on the top of the support base 1 for assisting in positioning the chip capacitor, and a fixing component 42 disposed on the bottom of the positioning component 41 for clamping and fixing the circuit board.

[0043] The grabbing and mounting assembly 2 includes a motor 21 fixedly connected to the top of the support base 1. The motor 21 is connected to an external power supply to control the rotation of its output shaft. The output shaft of the motor 21 is fixedly connected to a reciprocating rod 22. The reciprocating rod 22 is made of stainless steel, has a hard texture and is wear-resistant. The end of the reciprocating rod 22 away from the motor 21 is rotatably connected to a moving rod 23. The moving rod 23 is made of stainless steel, has a hard texture and is wear-resistant. The end of the moving rod 23 away from the reciprocating rod 22 is rotatably connected to a lifting plate 26. A track plate 24 is fixedly connected to the top of the support base 1. The track plate 24 is slidably connected to the lifting plate 26. A track groove 25 is provided inside the track plate 24. A lifting groove 27 is provided inside the lifting plate 26. The lifting groove 27 is set in an inverted V shape. A moving column 28 is slidably connected inside the lifting groove 27. The end of the moving column 28 away from the lifting plate 26 is fixedly connected to a transfer rod 29, and the moving column 28 is slidably connected to the inside of the track groove 25.

[0044] A right clamping plate 210 is rotatably connected to one side of the transfer rod 29, and a right clamping roller 212 is rotatably connected to the bottom of the right clamping plate 210. The right clamping roller 212 is made of rubber, which is soft and has great friction. A clamping spring 211 is slidably connected inside the transfer rod 29. The clamping spring 211 is made of phosphor bronze, which is hard and not easily corroded. The clamping spring 211 is fixedly connected to the right clamping plate 210. A left clamping plate 213 is rotatably connected to the right side of the transfer rod 29, and a left clamping roller 214 is rotatably connected to the bottom of the left clamping plate 213. The left clamping roller 214 is made of rubber, which is soft and has great friction. The left clamping plate 213 is fixedly connected to the clamping spring 211.

[0045] The adhesive component 3 includes a support column 31 fixedly connected to the top of the support base 1, a packaging sheet groove 33 is opened on the top of the support column 31, a glue box 32 is fixedly connected inside the support column 31, a glue cotton 34 is fixedly connected inside the support column 31, the glue cotton 34 is made of sponge material, the glue cotton 34 is connected to the glue box 32, and a clamping groove 35 is opened on the top of the support column 31.

[0046] The positioning assembly 41 includes a storage table 411 fixedly connected to the top of the support base 1, a support frame 412 is fixedly connected to the top of the storage table 411, a positioning rod 413 is rotatably connected to the top of the support frame 412, and a laser locator 414 is fixedly connected to the end of the positioning rod 413 away from the support frame 412, and the laser locator 414 is used to locate the chip capacitor, a horizontal frame 415 is fixedly connected to the top of the support frame 412, a fixed block 416 is fixedly connected to the top of the storage table 411, and a worm 417 is internally threadedly connected to the fixed block 416. The worm 417 is made of alloy steel with a hard texture and wear resistance. The right end of the worm 417 is rotatably connected to a positioning plate 418, and the positioning plate 418 is provided with four three sides for fixing the circuit board on the top of the storage table 411, and a rotating handle 419 is fixedly connected to the end of the worm 417 away from the positioning plate 418.

[0047] The fixing assembly 42 includes a rotating column 421 rotatably connected to the bottom of the storage table 411, a rotating gear 422 is fixedly connected to the bottom of the rotating column 421, and the rotating gear 422 is made of alloy steel, which is hard and wear-resistant. A connecting plate 423 is fixedly connected to the bottom of the lifting plate 26, and a rack 424 is fixedly connected to the bottom of the connecting plate 423. The rack 424 is made of alloy steel, which is hard and wear-resistant. The rack 424 is meshed with the rotating gear 422, and a rotating block 425 is fixedly connected to the outer side of the rotating column 421, and the end of the rotating block 425 away from the rotating column 421 is rotatably connected to a stretching rod 426, and the end of the stretching rod 426 away from the rotating block 425 is rotatably connected to a connecting block 427.

[0048] Both ends of the connecting block 427 are rotatably connected to a pulling rod 428, the bottom of the storage table 411 is fixedly connected to a rotating shaft 429, the outer side of the rotating shaft 429 is rotatably connected to two clamping rods 4210, the clamping rod 4210 is rotatably connected to the pulling rod 428, the two clamping rods 4210 are fixedly connected to the clamping shaft 4211 at one end away from the rotating shaft 429, the outer side of the clamping shaft 4211 is fixedly connected to a shock-absorbing roller 4212, and four shock-absorbing rollers 4212 are arranged on the outer side of the storage table 411.

[0049] The dust removal component 5 includes a support ring 51 fixedly connected to the side of the track plate 24 close to the storage table 411, the top of the support ring 51 is fixedly connected to a fixed cylinder 52, the top of the support ring 51 is fixedly connected to a spring tube 53, the spring tube 53 is made of rubber, the inner wall of the spring tube 53 is embedded with a spring, the spring tube 53 is located inside the fixed cylinder 52, the top of the spring tube 53 is fixedly connected to an extrusion block 54, the bottom of the spring tube 53 is fixedly connected to an air outlet pipe 55, the air outlet pipe 55 is fixedly connected to the fixed cylinder 52, the bottom of the spring tube 53 is fixedly connected to a rotating shaft 56, the outer side of the rotating shaft 56 is rotatably connected to an air intake piece 57, the air intake piece 57 is made of lightweight plastic material, is light in texture and easy to deflect, the bottom of the support ring 51 is fixedly connected to a blocking piece 58, and the bottom of the air outlet pipe 55 is fixedly connected to a nozzle.

[0050] The following is the entire working process and working principle of the above embodiment: the user puts multiple packaging plastic sheets into the packaging sheet groove 33 in sequence, the first packaging plastic sheet slides down along the inclined surface of the packaging sheet groove 33, and the first packaging plastic sheet slides to the top of the glue cotton 34. Since the clamping groove 35 is connected with the glue cotton 34, the glue cotton 34 absorbs the adhesive inside the clamping groove 35, and the bottom of the packaging plastic sheet contacts the glue cotton 34 and is contaminated with the adhesive. The drying and bonding time of the adhesive is longer, and the bottom of the packaging plastic sheet is contaminated with the adhesive and will not stick to the glue cotton 34.

[0051] The user places the circuit board to be packaged on the top of the storage table 411, and the user rotates the positioning rod 413 clockwise by hand, and the positioning rod 413 drives the laser locator 414 fixedly connected thereto to rotate clockwise to the top of the circuit board, and the horizontal frame 415 blocks the positioning rod 413 from continuing to rotate, and the horizontal frame 415 supports the positioning rod 413 to keep the positioning rod 413 horizontal, and the user turns on the laser locator 414 to make the laser locator 414 emit a laser to illuminate the circuit board, and the user rotates the rotating handle 419 by hand, and the rotating handle 419 drives the worm 417 fixedly connected thereto to rotate, and because the worm 417 is threadedly connected to the fixed block 416, the worm 417 approaches the circuit board, and the worm 417 drives the positioning plate 418 rotatably connected thereto to approach the circuit board, so that the positioning plate 418 is close to the left side of the circuit board, and the rotation of the rotating handle 419 is stopped, and the user rotates the other two rotating handles 419 on the top of the storage table 411 by hand. , so that the other two positioning plates 418 are respectively pressed against the front and rear of the circuit board, so that the circuit board is fixed by the positioning plates 418, and at the same time, the chip capacitor to be packaged on the circuit board is located just below the laser, so as to achieve the effect of positioning the chip capacitor of the circuit board, and avoid the situation that deviations are easy to occur only by naked eye observation, resulting in the inability to accurately stick the packaging plastic sheet on the top of the capacitor element, affecting the tightness and stability of the packaging. The user turns off the laser locator 414, and the user rotates the positioning rod 413 counterclockwise by hand to reset the positioning rod 413. The positioning rod 413 drives the laser locator 414 to reset counterclockwise, avoiding the laser locator 414 affecting the packaging. When the same chip capacitor of the same circuit board of the same batch is packaged subsequently, there is no need to repeat the positioning. The packaged circuit board is removed, and the unpackaged circuit board is placed between the positioning plates 418 in the same direction as the packaged circuit board, so that the three sides of the unpackaged circuit board are close to the positioning plates 418 to complete the positioning.

[0052] The output shaft of the motor 21 rotates clockwise, driving the reciprocating rod 22 fixedly connected thereto to rotate clockwise. The reciprocating rod 22 pushes the moving rod 23 connected thereto to move rightward. The moving rod 23 pushes the lifting plate 26 connected thereto to move rightward. The lifting plate 26 pushes the moving column 28 to slide rightward in the track groove 25. When the moving column 28 moves to the rightmost end of the track groove 25, the lifting plate 26 presses the moving column 28 downward, causing the moving column 28 to move downward on the left side of the lifting groove 27. At the same time, the moving column 28 moves downward on the right end of the track groove 25. When the moving column 28 moves to the bottom of the track groove 25, the reciprocating rod 22 rotates from an inclined state to a horizontal state. The transfer rod 29 approaches the encapsulating plastic sheet at the top of the glue cotton 34. The transfer rod 29 drives the left clamping plate connected thereto to slide rightward. The roller 214 and the right clamping roller 212 move downward to contact the packaging plastic sheet. The packaging plastic sheet squeezes the left clamping roller 214 to make the left clamping roller 214 rotate clockwise with the connection between the left clamping plate 213 and the transfer rod 29 as the rotation center axis. The packaging plastic sheet squeezes the right clamping roller 212 to make the right clamping roller 212 rotate counterclockwise with the connection between the right clamping plate 210 and the transfer rod 29 as the rotation center axis. The left clamping plate 213 and the right clamping plate 210 squeeze the clamping spring 211 to make the clamping spring 211 contract. At the same time, the reverse elastic force of the clamping spring 211 makes the left clamping roller 214 and the right clamping roller 212 clamp the packaging plastic sheet, thereby achieving the effect of clamping the packaging plastic sheet. The device automatically clamps the packaging plastic sheet instead of manual picking, thereby preventing the packaging plastic sheet from adhering to more dust.

[0053] The reciprocating rod 22 continues to rotate clockwise, and the reciprocating rod 22 rotates from a horizontal state to an inclined state. The reciprocating rod 22 pulls the moving rod 23 to move leftward, and the moving rod 23 pulls the lifting plate 26 to move leftward. The lifting plate 26 drives the connecting plate 423 to move leftward, and the connecting plate 423 drives the rack 424 to move leftward. The rack 424 contacts and meshes with the rotating gear 422, so that the rotating gear 422 rotates clockwise, and the rotating gear 422 drives the rotating column 421 to rotate clockwise, and the rotating column 421 drives the rotating block 425 to rotate clockwise and pull the stretching rod 426 connected to it for rotation. The stretching rod 426 pulls the connecting block 427 connected to it for rotation to move in the direction of the rotating gear 422, and the connecting block 427 pulls the pulling rod 426 connected to it for rotation. The rod 428 moves in the direction of the rotating gear 422, and the pulling rod 428 pulls the clamping rod 4210 rotatably connected thereto to move in the direction of the rotating gear 422. Since the clamping rod 4210 is rotatably connected to the rotating shaft 429, the clamping rod 4210 rotates clockwise with the rotating shaft 429 as the rotation center axis, and the clamping rod 4210 drives the clamping shaft 4211 fixedly connected thereto to rotate clockwise, and the clamping shaft 4211 drives the shock-absorbing roller 4212 fixedly connected thereto to rotate clockwise. The shock-absorbing roller 4212 and the other three identical shock-absorbing rollers 4212 clamp the circuit board above the storage table 411, thereby achieving the effect of fixing the circuit board, thereby ensuring that during subsequent packaging, the jitter during machine operation can be avoided to prevent the circuit board position from deviating.

[0054] When the moving rod 23 pulls the lifting plate 26 to move to the left, the lifting plate 26 squeezes the moving column 28 upward, so that the moving column 28 moves upward on the left side of the lifting groove 27, and the moving column 28 moves upward at the right end of the track groove 25. When the moving column 28 moves to the top of the track groove 25, the moving column 28 reaches the top of the lifting groove 27, and the lifting plate 26 pulls the moving column 28 to continue to slide to the left in the track groove 25. When the moving column 28 moves to the leftmost end of the track groove 25, the lifting plate 26 squeezes the moving column 28 downward, so that the moving column 28 moves downward on the right side of the lifting groove 27, and the moving column 28 moves downward at the left end of the track groove 25. The moving column 28 pushes the transfer rod 29 to move downward, and the transfer rod 29 drives the packaging plastic sheet to move downward. The packaging plastic sheet corresponds to the chip capacitor on the circuit board. Since the bottom of the packaging plastic sheet is adhered with an adhesive, the packaging plastic sheet and the chip capacitor are tightly adhered to achieve the effect of accurately installing the packaging plastic sheet, avoiding the situation where the packaging plastic sheet and the chip capacitor are manually installed. Deviation;

[0055] The reciprocating rod 22 continues to rotate clockwise. When the moving rod 23 pushes the lifting plate 26 to move rightward, the lifting plate 26 presses the moving column 28 upward, so that the moving column 28 moves upward on the right side of the lifting slot 27. The moving column 28 drives the transfer rod 29 to move upward. Since the packaging plastic sheet and the chip capacitor are tightly attached together, and the left clamping roller 214 is rotatably connected to the left clamping plate 213, and the right clamping roller 212 is rotatably connected to the right clamping plate 210, the left clamping roller 214 and the right clamping roller 212 are rotatably connected. The friction between the wheel 212 and the packaging plastic sheet is relatively small, and the transfer rod 29 moves upward to drive the left clamping roller 214 and the right clamping roller 212 to move upward. The left clamping roller 214 and the right clamping roller 212 are separated from the packaging plastic sheet. At the same time, the moving column 28 moves upward at the left end of the track groove 25. When the moving column 28 moves to the top of the track groove 25, the moving column 28 reaches the top of the lifting groove 27, and the lifting plate 26 pushes the moving column 28 to slide to the left in the track groove 25 to complete the reset.

[0056] When the moving column 28 moves downward on the right side of the lifting slot 27, the moving column 28 pushes the squeezing block 54 to move downward, and the squeezing block 54 squeezes the spring tube 53 fixedly connected thereto to contract, and the gas inside the spring tube 53 squeezes the air inlet sheet 57 downward to deflect downward, but the blocking sheet 58 blocks the air inlet sheet 57 from deflecting downward, so the air inside the spring tube 53 is ejected from the nozzle at the bottom of the air outlet pipe 55 through the air outlet pipe 55, and sprayed toward the circuit board to blow away the dust particles, thereby achieving the effect of removing the dust particles remaining on the top of the chip capacitor, and avoiding the situation that the dust particles will be encapsulated together with the encapsulating plastic sheet on the chip capacitor, resulting in hollow drums between the encapsulating plastic sheet and the chip capacitor, which affects the use of the chip capacitor;

[0057] When the movable column 28 moves upward on the right side of the lifting slot 27, due to the spring embedded in the inner wall of the spring tube 53, the spring tube 53 loses the squeezing of the movable column 28, the spring tube 53 automatically stretches, the air intake piece 57 deflects toward the inside of the spring tube 53, and the air is replenished inside the spring tube 53 to prepare for the next dust removal.

[0058] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An embedded stable chip capacitor packaging device, used for packaging chip capacitors, the embedded stable chip capacitor packaging device comprising a supporting base (1), characterized in that: The top of the support base (1) is provided with a grabbing and mounting component (2) for mounting a packaging plastic sheet on a chip capacitor, the top of the support base (1) is provided with an adhesive component (3) for attaching glue to the packaging plastic sheet, the top of the support base (1) is provided with a positioning mechanism for positioning and clamping a circuit board, and one side of the grabbing and mounting component (2) is provided with a dust removal component (5) for removing dust; The positioning mechanism comprises a positioning component (41) arranged on the top of the support base (1) for assisting in positioning the chip capacitor, and a fixing component (42) arranged on the bottom of the positioning component (41) for clamping and fixing the circuit board; The grabbing and mounting assembly (2) comprises a motor (21) fixedly connected to the top of the support base (1), the output shaft of the motor (21) is fixedly connected to a reciprocating rod (22), the end of the reciprocating rod (22) away from the motor (21) is rotatably connected to a moving rod (23), the end of the moving rod (23) away from the reciprocating rod (22) is rotatably connected to a lifting plate (26), the top of the support base (1) is fixedly connected to a track plate (24), the track plate (24) is slidably connected to the lifting plate (26), a track groove (25) is provided inside the track plate (24), a lifting groove (27) is provided inside the lifting plate (26), the lifting groove (27) is configured to be in an inverted V shape, a moving column (28) is slidably connected inside the lifting groove (27), the end of the moving column (28) away from the lifting plate (26) is fixedly connected to a transfer rod (29), and the moving column (28) is slidably connected inside the track groove (25); The dust removal component (5) comprises a support ring (51) fixedly connected to a side of the track plate (24) close to the storage table (411); a fixed tube (52) is fixedly connected to the top of the support ring (51); a spring tube (53) is fixedly connected to the top of the support ring (51); the spring tube (53) is located inside the fixed tube (52); a squeezing block (54) is fixedly connected to the top of the spring tube (53); an air outlet pipe (55) is fixedly connected to the bottom of the spring tube (53); the air outlet pipe (55) is fixedly connected to the fixed tube (52); a rotating shaft (56) is fixedly connected to the bottom of the spring tube (53); an air inlet sheet (57) is rotatably connected to the outer side of the rotating shaft (56); a blocking sheet (58) is fixedly connected to the bottom of the support ring (51); and a nozzle is fixedly connected to the bottom of the air outlet pipe (55).

2. The embedded stable chip capacitor packaging device according to claim 1, characterized in that: One side of the transfer rod (29) is rotatably connected to a right clamping plate (210), and the bottom of the right clamping plate (210) is rotatably connected to a right clamping roller (212). The transfer rod (29) is slidably connected to a clamping spring (211), and the clamping spring (211) is fixedly connected to the right clamping plate (210). The right side of the transfer rod (29) is rotatably connected to a left clamping plate (213), and the bottom of the left clamping plate (213) is rotatably connected to a left clamping roller (214), and the left clamping plate (213) is fixedly connected to the clamping spring (211).

3. The embedded stable chip capacitor packaging device according to claim 1, characterized in that: The adhesive component (3) comprises a support column (31) fixedly connected to the top of the support base (1), a packaging sheet groove (33) is provided on the top of the support column (31), a glue box (32) is fixedly connected inside the support column (31), glue cotton (34) is fixedly connected inside the support column (31), the glue cotton (34) is communicated with the glue box (32), and a clamping groove (35) is provided on the top of the support column (31).

4. The embedded stable chip capacitor packaging device according to claim 1, characterized in that: The positioning assembly (41) comprises a storage table (411) fixedly connected to the top of the support base (1); the top of the storage table (411) is fixedly connected to a support frame (412); the top of the support frame (412) is rotatably connected to a positioning rod (413); one end of the positioning rod (413) away from the support frame (412) is fixedly connected to a laser locator (414); the top of the support frame (412) is fixedly connected to a horizontal frame (415); the top of the storage table (411) is fixedly connected to a fixing block (416); the fixing block (416) is internally threadedly connected to a worm (417); the right end of the worm (417) is rotatably connected to a positioning plate (418); and one end of the worm (417) away from the positioning plate (418) is fixedly connected to a rotating handle (419).

5. The embedded stable chip capacitor packaging device according to claim 1, characterized in that: The fixing assembly (42) comprises a rotating column (421) rotatably connected to the bottom of the storage platform (411); a rotating gear (422) is fixedly connected to the bottom of the rotating column (421); a connecting plate (423) is fixedly connected to the bottom of the lifting plate (26); a rack (424) is fixedly connected to the bottom of the connecting plate (423); the rack (424) is meshed with the rotating gear (422); a rotating block (425) is fixedly connected to the outside of the rotating column (421); an end of the rotating block (425) away from the rotating column (421) is rotatably connected to a stretching rod (426); and an end of the stretching rod (426) away from the rotating block (425) is rotatably connected to a connecting block (427).

6. The embedded stable chip capacitor packaging device according to claim 5, characterized in that: Both ends of the connection block (427) are rotatably connected to a pulling rod (428); the bottom of the storage platform (411) is fixedly connected to a rotating shaft (429); two clamping rods (4210) are rotatably connected to the outer side of the rotating shaft (429); the clamping rods (4210) are rotatably connected to the pulling rod (428); one end of the two clamping rods (4210) away from the rotating shaft (429) is fixedly connected to the clamping shaft (4211); and the outer side of the clamping shaft (4211) is fixedly connected to a shock-absorbing roller (4212).

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