A method for preventing scraps from falling off the adsorption plate of a vacuum coating machine

Abstract

The present invention discloses a method for preventing chip dropping of an adsorption plate of a vacuum coating machine, comprising the following steps: step one, physically removing chips from the metal film surface of the adsorption plate or using equipment heating to melt the sharp chips of the thermal sprayed metal, so that the structure is firm and does not drop chips; step two, ultrasonically cleaning the metal film surface of the attachment plate, cleaning the metal dust and metal sharp chips on the metal film surface of the adsorption plate; step three, coating the surface of the adsorption plate after cleaning with a special resin material; step four, drying the resin; step five, using a tape of specific viscosity to stick the surface of the adsorption plate, and observing and photographing the dust stuck by the tape under a microscope, and using software to judge the number of contaminated particles and the relative total area of ​​the particles in the photographed picture; the present invention is a method for cleaning the surface of the adsorption plate, which successfully solves the problem of metal dust residue; the cleaning process effectively removes the residual metal dust pollution in the film micropores on the adsorption plate, improves the production yield of the vacuum coating equipment, and reduces the probability of target material nodules.

Description

Technical Field

[0001] The present invention relates to the technical field related to adsorption plate cleaning, and in particular to a method for preventing chips from falling off an adsorption plate of a vacuum coating machine. Background Art

[0002] There is a kind of enhanced adsorption plate for coating deposits in vacuum coating machine. Because the adsorption plate has a thin film layer with a thickness of 0.01-3.00 mm and micropores on the surface, it can adsorb the characteristics of coating deposits. The adsorption film layer with micropores on the adsorption plate belongs to porous metal film. The adsorption plate is sprayed with metal film and manufactured by thermal spraying technology.

[0003] The principle of thermal spraying is to spray metal materials, such as nickel wire, aluminum wire, copper wire, zinc wire, tin wire, bismuth wire, lead wire, indium wire or powder of the above materials, through high-temperature spraying of arc, flame, plasma, etc., to dissolve the metal and spray it onto the stainless steel tube or plate. During the manufacturing process of the adsorption plate, it can be found that the molten metal particles are sprayed onto the adsorption plate, and mist-like metal dust occurs. The metal dust in the production process floats and fills the micropores of the metal film, which will cause problems with the yield and target material when the vacuum coating machine is used. Due to the production process of the adsorption plate, metal dust particles are adsorbed on the surface to form an unstable structure. When the vacuum coating machine is used, the microparticles on the adsorption plate will gradually be plated into visible large particles until a certain weight or volume, and they will detach from the adsorption plate and splash into the vacuum furnace cavity, causing contamination of the target material or optical coating products. Therefore, in the traditional adsorption plate process, ultrasonic cleaning of the adsorption plate is applied. After cleaning, the adsorption plate product can still be found to have a particle contamination area of ​​about 2%. Therefore, a method that can effectively solve the problem of metal dust residue on the adsorption plate is needed to improve the cleanliness of the adsorption plate. Summary of the invention

[0004] The object of the present invention is to provide a method for preventing chips from falling off an adsorption plate of a vacuum coating machine, so as to overcome the deficiencies existing in the prior art.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A method for preventing chips from falling off an adsorption plate of a vacuum coating machine comprises the following steps:

[0007] Step 1: Physically remove the metal film surface of the adsorption plate to make the metal sharp chips formed by the metal fuse stacking on the surface of the adsorption plate fall off, or use the equipment heating method to melt the sharp chips of the thermal sprayed metal to make its structure firm and not fall off;

[0008] Step 2: Ultrasonic cleaning of the surface of the metal film of the adsorption plate to remove the metal dust and metal sharp chips on the surface of the metal film of the adsorption plate. The ultrasonic frequency can be selected to be 17, 20, 28, 40 KHz and other power for cleaning;

[0009] Step 3: coating the surface of the adsorption plate with resin material after cleaning;

[0010] Step 4: Drying the adsorption plate with resin after coating;

[0011] Step 5: Use a tape of specific viscosity to stick to the surface of the adsorption plate. Observe and take photos of the dust stuck to the tape under a microscope. Use software to determine the number of contaminated particles and the relative total area of ​​the particles.

[0012] To further explain, the coating method in step three includes dipping, rolling, brushing, spraying and showering.

[0013] To further illustrate, the coating resin material is epoxy acrylate, polyurethane acrylate, polyester acrylate, silicone resin, alkyd resin, phenolic resin, conductive polymer material, water-based paint or inorganic paint.

[0014] To further explain, the PVC tape used in step 5 is a tape with a width of 24 mm and a pull-out force of 200-300 gf.

[0015] To further explain, step 1 is to use a handheld chip remover with a rotation speed of 100-1000rpm and 300-2000 sandpaper for physical chip removal. After cleaning, use a brushing tool such as a silicone brush, a brush, etc. to brush epoxy resin with a viscosity of 2-10 seconds in a No. 4 viscosity cup onto the adsorption plate.

[0016] To further explain, in step 1, a handheld chip remover is used at a speed of 100-1000 rpm and emery cotton for physical chip removal. After cleaning, an epoxy resin solution with a viscosity of 2-10 seconds in a No. 4 viscosity cup is sprayed on the adsorption plate using a spray tool.

[0017] To further elaborate, in step 1, the physical chip removal materials include: sandpaper, steel wool, fiber cloth, steel brush, copper wire brush and wool brush, etc., and the cleaning is carried out by ultrasonic cleaning.

[0018] To further elaborate, step one uses a heating method of equipment to melt the sharp chips of the thermal sprayed metal to make its structure strong and not chip off. The heating method is such as a high-temperature furnace, an induction coil heating furnace, or a flame gun, and the temperature is heated to 10-600°C above the melting point of the sprayed material for 0.5-10 minutes.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention is a new adsorption plate surface cleaning method, which successfully solves the problem of metal dust residue. The cleaning process of the present invention effectively removes the residual metal dust pollution in the micropores of the film on the adsorption plate, improves the production yield of the vacuum coating equipment, and reduces the probability of target material nodules. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the adsorption plate in each step of the cleaning process of the present invention;

[0022] Figure 2 It is a schematic diagram of the process flow of the present invention;

[0023] Figure 3 This is the distribution image of metal dust on the adsorption plate surface under a microscope after ultrasonic cleaning;

[0024] Figure 4 This is a distribution image of metal dust on the surface of the adsorption plate under a microscope after cleaning in the present invention;

[0025] Figure 5 This is the characteristic image of the surface under the microscope after physical desquamation of the present invention (A indicates the position);

[0026] Figure 6 This is the characteristic image of the surface under the microscope after the sharp corner of the melt thermal spraying of the present invention

[0027] Figure 7 It is a structural schematic diagram of Example 1;

[0028] Figure 8 This is a schematic diagram of the structure of Example 2.

[0029] Notes on the attached drawings:

[0030] 1. Adsorption plate substrate; 2. Roughening; 3. Arc thermal spraying layer; 4. Physical chip removal and grinding layer; 5. Polymer coating; 6. Resin layer. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. When the number of an element is referred to as "plurality", it may be any number of two or more. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0034] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings:

[0035] Observe the original particles on the surface of the adsorption plate after thermal spraying, and the microstructure can be found from 3D scanning. The microstructure shows metal shavings and micropores. Judging from the dust collected on the adsorption plate after thermal spraying, it can be divided into two categories: one is metal shavings and the other is metal dust particles; both will clog the micropores of the adsorption plate and affect the adsorption performance of the adsorption plate.

[0036] 1. Causes of the metal tip of the adsorption plate: The microstructure on the metal film is due to the rapid cooling of the hot melt metal after it hits the adsorption plate. The tip metal is easily broken into small metal chips due to external force collision, which are larger particles with sharp filaments.

[0037] 2. Causes of metal dust on the adsorption plate: During the thermal spraying process, metal particles cool down from molten liquid to solid state prematurely. When they collide with the adsorption plate, they cannot stick to the surface. The metal dust generated by rebounding is small and powdery. The metal dust is blocked in the micropores of the adsorption plate, so it will affect the adsorption performance of the adsorption plate.

[0038] The existing ultrasonic wave has limited efficiency in removing dust in micropores, and the adsorption effect of the adsorption plate is not well improved after cleaning. Therefore, a new cleaning method is needed to better remove the embedded dust in the adsorption plate.

[0039] like Figure 1-2 As shown, in this embodiment, a method for preventing chips from falling off an adsorption plate of a vacuum coating machine is provided, comprising the following steps:

[0040] Step 1: Physically remove the metal film surface of the adsorption plate to make the metal tip formed by the metal fuse stack on the surface of the adsorption plate fall off; or use a high-temperature furnace, an induction coil heating furnace, a flame gun, or other heating methods to melt the sharp chips of the thermal sprayed metal to make its structure firm and not fall off.

[0041] Step 2: Ultrasonic cleaning of the surface of the metal film of the adsorption plate to remove the metal dust and metal sharp chips on the surface of the metal film of the adsorption plate. The ultrasonic frequency can be selected at 17, 20, 28, 40 K Hz and other power for cleaning;

[0042] Step three, coating the resin material on the surface of the adsorption plate after cleaning; in this step, the coating methods include dipping, rolling, brushing, spraying and shower coating; the resin material can be effectively coated on the adsorption plate.

[0043] Specific coating resin materials include the following:

[0044] 1. Polyurethane system, acrylic system, epoxy resin system.

[0045] 2. Photocurable resins mainly include epoxy acrylate, polyurethane acrylate, polyester acrylate series, silicone resin, alkyd resin and phenolic resin.

[0046] 3. Conductive polymer materials mainly include polypyrrole, polyparaphenylene, polyphenylene sulfide, polyaniline, etc.

[0047] 4. Water-based coatings mainly include polyvinyl alcohol and its various modified products, water-soluble alkyd resins, water-soluble epoxy resins and inorganic polymer water-based resins.

[0048] 5. Inorganic coatings: silicic acid system, such as sodium silicate and potassium silicate.

[0049] Step 4: Drying the adsorption plate with resin after coating;

[0050] Step 5: Use PVC tape with a pull-out force of 200-300 gf (preferably 250 gf) to stick to the surface of the adsorption board. Observe and take photos of the dust stuck to the tape under a microscope. Use software to determine the number of contaminated particles and the relative total area of ​​the particles.

[0051] This technology describes two types of metal particles (metals), which can be cleaned by the present invention to reduce the contamination area to less than 0.5%: (1) The cleaning method discloses that after the physical descaling treatment of the adsorption plate, the micropores are deeply cleaned and a thin film coating is applied to protect the microstructure.

[0052] To further elaborate, physical chip removal materials include: sandpaper, steel wool, fiber cloth, steel brush, copper wire brush and wool brush, etc., and cleaning uses ultrasonic cleaning.

[0053] like Figure 3 The figure shows the dust distribution image observed by microscope after ultrasonic cleaning only. It can be seen that most of the metal dust particles are not completely removed. The number of particles is 615 and the contaminated area is 1.485%. Figure 4 The dust distribution image observed under a microscope after cleaning by the present invention shows that there are 5 particles and the contamination area is controlled at 0.367%, which is basically close to a state without metal dust particles. Figure 5As shown, you can see the image of the polished surface under the microscope after cleaning. Figure 5 A in each location in the figure is the surface of the adsorption plate after grinding to remove the brittle metal tip. Figure 6 Heating the metal melts the surface of the thermally sprayed metal chips.

[0054] In summary, the following two embodiments are provided: Embodiment 1:

[0055] Step 1: Physically remove chips from the metal film surface of the adsorption plate to make the metal sharp chips formed by the metal fuse stacking on the surface of the adsorption plate fall off; first use a handheld mechanical physical chip remover with a speed of 100-1000rpm and 300-2000 sandpaper for physical chip removal. First, use sandpaper with high roughness and perform rough grinding at a low speed to remove physical chips, and then gradually use sandpaper with lower roughness for high-speed grinding to remove physical chips.

[0056] Step 2: Ultrasonic cleaning of the metal film surface of the adsorption plate, the cleaning frequency is 20KHz, the cleaning time is about 5-15 minutes according to the shape of the adsorption plate, which can remove most of the metal dust and metal sharp chips (such as Figure 3 shown);

[0057] Step 3: Apply resin material on the surface of the adsorption plate after cleaning; the resin material can be effectively applied on the adsorption plate. After cleaning, use a silicone brush or a hair brush to apply epoxy resin with a viscosity of 2-10 seconds in a No. 4 viscosity cup on the adsorption plate. (Preferably, the viscosity is 6 seconds) Water-based epoxy resin is applied on the adsorption plate. This is the polymer coating 5 mentioned below. Resin composition: solid content 5-30%.

[0058] Step 4: Dry the adsorption plate with resin after coating.

[0059] Step 5: Use PVC tape with a pull-out force of 200-300 gf (preferably 250 gf) to stick to the surface of the adsorption board. Observe and take photos of the dust stuck to the tape under a microscope. Use software to determine the number of contaminated particles and the relative total area of ​​the particles.

[0060] like Figure 7As shown, the structure of the adsorption plate produced includes sandblasting roughening 2 on the surface of the adsorption plate substrate 1, and the parameters of roughening 2 are: air pressure: 0.1-3Kgf / cm², sandblasting particles: 10-80 mesh corundum sand, roughness Ra5-15μm; the adsorption plate is made of 304 stainless steel, and then an arc thermal spraying layer 3 is made on the surface of roughening 2, with an aluminum wire diameter of 2.0mm, wire feeding speed: 10mm / sec, compressed air: 0.13-0.15 Kgf / cm2, current 300-350A, film thickness 0.2-0.5mm, roughness Ra: 35-4 μm, Rz: 200- 300 μm, surface area ratio: >4.0. Then, physical chip removal and grinding are performed on the surface of the arc thermal spraying layer 3 to produce a physical chip removal and grinding layer 4, and finally a polymer coating 5 is made on the surface of the physical chip removal and grinding layer 4.

[0061] Embodiment 2:

[0062] Step 1: Heat the metal film surface of the adsorption plate to melt the sharp chips of the thermal sprayed metal to make its structure strong and not chip off. The heating method uses a flame gun to bake. The flame gun speed is 1-3 cm / second, and it is baked back and forth to heat to 10-600℃ above the sprayed material. The total heating time is accumulated for 0.5-2 minutes.

[0063] Step 2: Ultrasonic cleaning of the metal film surface of the adsorption plate, the cleaning frequency is 20KHz, the cleaning time is about 5-15 minutes according to the shape of the adsorption plate, which can remove most of the metal dust and metal shavings on the metal film surface of the adsorption plate ( Figure 3 );

[0064] Step 3: Apply resin material on the surface of the adsorption plate after cleaning; the resin material can be effectively applied on the adsorption plate. After cleaning, use a spraying tool such as a spray gun with a nozzle of 2.0 aperture to spray acrylic paint with a viscosity of 2-10 seconds in a No. 4 viscosity cup on the adsorption plate. (The preferred viscosity is 4 seconds) The oily acrylic ester on the adsorption plate is the polymer coating 5 mentioned below. Resin composition: solid content 5-30%, resin hydroxyl ratio of 1-5%.

[0065] Step 4: Bake the adsorption plate after coating.

[0066] Step 5: Use PVC tape with a pull-out force of 200-300 gf (preferably 250 gf) to stick to the surface of the adsorption board. Observe and take photos of the dust stuck to the tape under a microscope. Use software to determine the number of contaminated particles and the relative total area of ​​the particles.

[0067] like Figure 8As shown, in this embodiment, the structure of the adsorption plate produced includes sandblasting roughening 2 on the surface of the adsorption plate substrate 1, and the roughening 2 parameters are: air pressure: 0.1-3Kgf / cm², sandblasting particles: 10-80 mesh corundum sand, roughness Ra5-15μm; the adsorption plate is made of 304 stainless steel. Then a layer of water-soluble resin 6 is coated on the surface of the roughening 2, and the polyvinyl alcohol coating used in this embodiment is used. Then an arc thermal spraying layer 3 is made, with an aluminum wire diameter of 2.0mm, a wire feeding speed of 10mm / sec, a compressed air of 0.13-0.15 Kgf / cm2, a current of 300-350A, a film thickness of 0.2-0.5mm, a roughness Ra: 35-4 μm, Rz: 200-300 μm, and a surface area ratio of >4.0. Then the surface of the arc thermal spraying layer 3 is heated and melted 4, and finally a polymer coating 5 is made on the surface of the blunt angle layer 4 formed after the metal melts.

[0068] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered as within the scope of this specification. For ordinary technicians in this field, they can make several modifications and improvements without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A method for preventing chips from falling off the adsorption plate of a vacuum coating machine, characterized in that: The following steps are involved: Step 1: There is an arc film layer on the surface of the adsorption plate, and the film layer has micropores. Physically remove the metal film surface of the adsorption plate to make the metal sharp chips formed by the stacking of metal fuses on the surface of the adsorption plate fall off, or use equipment heating to melt the sharp chips of the thermal sprayed metal to make its structure firm and not fall off; Step 2: Ultrasonic cleaning of the surface of the metal film of the adsorption plate to remove metal dust and metal sharp chips on the surface of the metal film of the adsorption plate; Step 3: coating the surface of the adsorption plate with resin material after cleaning; Step 4: drying the resin; Step 5: Use tape to stick the dust stuck to the adsorption board. Observe and take photos with a microscope. Use software to determine the number of polluted particles and the relative total area of ​​particles.

2. A method for preventing the adsorption plate of a vacuum coating machine from dropping chips as claimed in claim 1, characterized in that: The coating methods in step three include dipping, rolling, brushing, spraying and showering.

3. A method for preventing the adsorption plate of a vacuum coating machine from dropping chips as claimed in claim 1, characterized in that: The resin material applied in step three is epoxy acrylate, epoxy resin, polyurethane acrylate, polyester acrylate, silicone resin, alkyd resin, or phenolic resin.

4. A method for preventing the adsorption plate of a vacuum coating machine from dropping chips as claimed in claim 1, characterized in that: The tape used in step 5 is a PVC tape with a pulling speed of 300 mm / min, a sample width of 24 mm, and a pulling force of 200-300 gf.

5. A method for preventing the adsorption plate of a vacuum coating machine from dropping chips as claimed in claim 1, characterized in that: First, use a handheld chip remover with a speed of 100-1000rpm and 300-2000 sandpaper for physical chip removal. After cleaning, use a brush to apply an epoxy resin solution with a viscosity of 2-10 seconds in a No. 4 viscosity cup on the adsorption plate.

6. A method for preventing the adsorption plate of a vacuum coating machine from dropping chips as claimed in claim 1, characterized in that: First, use a handheld chip remover with a speed of 100-1000rpm and emery cotton for physical chip removal. After cleaning, use a spray tool to spray an epoxy resin solution with a viscosity of 2-10 seconds in a No. 4 viscosity cup onto the adsorption plate.

7. A method for preventing the adsorption plate of a vacuum coating machine from dropping chips as claimed in claim 1, characterized in that: In step 1, the physical chip removal materials include: sandpaper, steel wool and fiber cloth; in step 2, ultrasonic cleaning machine is used for cleaning.

8. A method for preventing the adsorption plate of a vacuum coating machine from dropping chips as claimed in claim 1, characterized in that: Use equipment heating to melt the sharp chips of thermal sprayed metal to make its structure strong and not fall off. The heating method is such as induction coil heating furnace, flame gun fire baking, heating to 10-600℃ above the melting point of the sprayed material, and the heating time is 0.5-10 minutes.

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