A chip anti-overflow plastic sealing device

Abstract

The invention discloses an anti-overflow plastic sealing device for chips, which relates to the technical field of chip packaging, and comprises a mounting frame, wherein a rotating disk is rotatably provided at the bottom of the mounting frame, and a plastic sealing structure is provided inside the rotating disk; by providing an overflow groove, an injection molding device performs over-injection molding in the plastic sealing groove so that the chip can be plastic-sealed, and the excess plastic enters the overflow groove; a cutter at the bottom of an upper mold cuts the plastic in the overflow groove after the injection molding is completed, so as to facilitate the subsequent taking of the complete plastic-sealed chip and the cleaning of the rubber in the overflow groove; by providing the mounting frame, a cylinder drives the mounting frame to move in a vertical direction, so as to adjust the distance between the mounting frame and the bottom rotating disk, so that the plastic sealing structure performs plastic sealing on the chip inside a protective cover, so as to prevent pollution caused by contact with the outside during the plastic sealing process; at the same time, the cylinder adjusts the distance between the mounting frame and the moving disk, and indirectly adjusts the moving distance of the connecting plate through a transmission block, so as to adjust the plastic sealing thickness of the chip.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, and in particular to an anti-overflow plastic sealing device for chips. Background Art

[0002] After the chip is produced, it needs to be packaged. However, when using current packaging equipment, the finished chips need to be placed manually on the packaging table, and then the hydraulic cylinder is started to drive the packaging plate for packaging. Therefore, the staff needs to wait for the chip packaging to be completed before putting the chip in again, which makes the chip packaging efficiency low.

[0003] In the prior art, there is a special plastic sealing device for chips, such as a plastic sealing device for independent chip packaging with announcement number CN219800785U, which includes a base plate with a support frame installed on the top of the base plate, and a protective structure for protecting workers is arranged between the base plate and the support frame.

[0004] This chip encapsulation device requires a rotating disk to rotate to perform continuous operations on the chip, but a fixed packaging structure is set in the rotating disk so that the rotating disk cannot rotate; at the same time, this encapsulation device needs to perform over-injection when the chip is fully encapsulated, and the over-injected glue is easy to overflow, making the chip's encapsulation package uneven. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the rotating disk of the background technology cannot rotate and excessive injection molding causes the complete plastic packaging of the chip to easily overflow the glue and cause uneven plastic packaging, and to propose an anti-overflow plastic packaging device for chips.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A chip overflow prevention plastic sealing device comprises a mounting frame, a rotating disk is rotatably provided at the bottom of the mounting frame, a plastic sealing structure is provided inside the rotating disk, and the plastic sealing structure comprises:

[0008] Four plastic sealing grooves are arranged on the top surface of the rotating disk, and overflow grooves are arranged on both sides of the plastic sealing grooves;

[0009] A movable groove is arranged at the bottom of each plastic sealing groove, a connecting plate is slidably connected in the movable groove, and the connecting plate is elastically connected to the bottom of the movable groove; slots are arranged on both sides of each plastic sealing groove, and the bottom of the slots is connected to the movable groove;

[0010] A transmission block is slidably connected in the slot, and the bottom of the transmission block is connected to the connecting plate;

[0011] A protective structure is arranged in the installation frame, and a cylinder of the protective structure is arranged on the top of the installation frame. A protective cover is arranged at the output end of the cylinder. The projection of the protective cover toward the rotating disk covers three plastic sealing grooves, and the plastic sealing groove located on the front of the installation frame is exposed. Setting grooves are opened on both sides of the protective cover, and an electric telescopic rod is arranged in each setting groove. An upper mold is arranged at the output end of the electric telescopic rod, and cutting knives are arranged on both sides of the bottom of the upper mold.

[0012] As a further solution of the present invention: a motor is arranged at the bottom center of the installation frame, the output end of the motor is arranged along the vertical direction, and the output end of the motor is connected to the bottom center of the rotating disk.

[0013] As a further solution of the present invention: the overflow grooves on both sides of the same plastic sealing groove are symmetrically arranged with respect to the central plane of the plastic sealing groove.

[0014] As a further solution of the present invention: a plurality of return springs are arranged at the bottom of the movable groove, and the top ends of the plurality of return springs are connected to the same connecting plate, and the connecting plate is arranged along the horizontal plane direction.

[0015] As a further solution of the present invention: the top of the transmission block is in a triangular shape, and the inclined surface of the top of the transmission block is arranged toward a side away from the plastic sealing groove.

[0016] As a further solution of the present invention: the grooves on both sides are arranged along the vertical direction.

[0017] As a further solution of the present invention: four plastic sealing grooves are arranged in a circular array with equal distances about the center of the rotating disk.

[0018] As a further solution of the present invention: the output shaft of the motor rotates at an angle of ninety degrees each time.

[0019] As a further solution of the present invention: the position of the cutter is adapted to the position of the overflow chute below.

[0020] As a further solution of the present invention: the upper mold is connected to an external injection molding device.

[0021] Beneficial effects of the present invention:

[0022] (1) The present invention provides an anti-overflow plastic sealing device for chips. The cylinder drives the mounting frame to move in the vertical direction, thereby adjusting the distance between the mounting frame and the bottom rotating disk, so that the plastic sealing structure seals the chip inside the protective cover to prevent contact with the outside and contamination during the plastic sealing process; at the same time, the cylinder adjusts the distance between the mounting frame and the moving disk, and indirectly adjusts the moving distance of the connecting plate through the transmission block, thereby adjusting the plastic sealing thickness of the chip;

[0023] (2) The chip anti-overflow plastic sealing device of the present invention is provided with an overflow groove, and the injection molding equipment performs over-injection molding in the plastic sealing groove so that the chip can be plastic-sealed, and the excess plastic enters the overflow groove; the cutter at the bottom of the upper mold cuts the plastic in the overflow groove after the injection molding is completed, so as to facilitate the subsequent removal of the complete plastic-sealed chip and the cleaning of the plastic in the overflow groove;

[0024] (3) The chip anti-overflow plastic sealing device of the present invention is provided with a transmission block. When the motor drives the rotating disk to rotate, the transmission block contacts the bottom of the protective cover, thereby driving the connecting plate and the chip to move to the bottom of the plastic sealing groove. The chip plastic sealing is completed by the upper mold. When the chip in the plastic sealing groove is exposed from the protective cover, the connecting plate is driven by the force of the restoring spring at the bottom to pop out the plastic sealed chip, which is convenient for direct removal. The glue in the overflow groove is still accumulated inside after cutting. After taking the chip, it is convenient to clean the glue in the overflow groove, which is convenient for the subsequent placement of new chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention will be further described below in conjunction with the accompanying drawings.

[0026] Figure 1 It is a structural schematic diagram of an anti-overflow plastic sealing device for chips according to the present invention;

[0027] Figure 2 It is a front schematic diagram of an anti-overflow plastic sealing device for chips according to the present invention;

[0028] Figure 3 It is a side cross-sectional view of an anti-overflow plastic sealing device for chips according to the present invention;

[0029] Figure 4 The present invention Figure 3 A partial enlarged view of the middle A;

[0030] Figure 5 It is a structural schematic diagram of the rotating disk and the plastic sealing structure of the present invention.

[0031] In the figure: 1. Installation frame; 2. Protection structure; 21. Cylinder; 22. Protection cover; 23. Setting groove; 3. Rotating disk; 4. Motor; 5. Plastic sealing structure; 51. Plastic sealing groove; 52. Overflow groove; 53. Moving groove; 54. Connecting plate; 55. Reset spring; 56. Transmission block; 6. Electric telescopic rod; 7. Upper mold; 8. Cutter. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example 1

[0034] See also Figure 1-5 As shown, the present invention is an anti-overflow plastic sealing device for chips, including a mounting frame 1, the front and rear surfaces of the mounting frame 1 are provided with slots, a motor 4 is provided at the bottom of the mounting frame 1, the motor 4 is located at the center of the bottom of the mounting frame 1, the output end of the motor 4 is vertically arranged upward, and a rotating disk 3 is fixedly arranged at the output end of the motor 4. A protective structure 2 is provided above the rotating disk 3, and a cylinder 21 of the protective structure 2 is fixedly arranged at the top of the mounting frame 1, the cylinder 21 is located at the top center of the mounting frame 1, and the output end of the cylinder 21 is arranged along the vertical direction. A protective cover 22 is fixedly connected to the output end of the cylinder 21, and the shape of the protective cover 22 is adapted to the slot in the mounting frame 1.

[0035] A plastic sealing structure 5 is arranged inside the rotating disk 3. Four plastic sealing grooves 51 of the plastic sealing structure 5 are arranged on the top surface of the rotating disk 3. The four plastic sealing grooves 51 are arranged in a circular array with equal distances about the axial center of the rotating disk 3. Overflow grooves 52 with shallower depth are arranged on both sides of the top surface of each plastic sealing groove 51. The overflow grooves 52 on both sides of the same plastic sealing groove 51 are symmetrically arranged about the central plane of the plastic sealing groove 51. A moving groove 53 is arranged at the bottom of the plastic sealing groove 51. A plurality of return springs 55 are arranged at the bottom of the moving groove 53. The tops of the plurality of return springs 55 are connected to the same connecting plate 54. The connecting plate 54 is arranged along the horizontal plane direction. The connecting plate 54 is slidably connected in the moving groove 53. Grooves are arranged on the top surfaces of the rotating disk 3 on both sides of the plastic sealing groove 51. The grooves are arranged along the vertical direction. The bottom of the grooves extends downward to communicate with the moving grooves 53. Transmission blocks 56 are arranged on both sides of the top surface of the connecting plate 54. The top of the transmission block 56 extends from the groove to the outside of the rotating disk 3. The top of the transmission block 56 is in the shape of a triangle, and the inclined surface of the triangle is set in the direction away from the plastic sealing groove 51. The projection of the protective cover 22 in the direction of the rotating disk 3 covers the three plastic sealing grooves 51, and the plastic sealing groove 51 on the front can be exposed. Vertical setting grooves 23 are set on both sides of the protective cover 22, and the positions of the grooves are adapted to the positions of the plastic sealing grooves 51 on both sides of the rotating disk 3. Two electric telescopic rods 6 are set on the top of the mounting frame 1. The electric telescopic rods 6 are set in the vertical direction. The positions of the electric telescopic rods 6 are adapted to the positions of the setting grooves 23 of the protective cover 22, and the bottom ends of the electric telescopic rods 6 extend into the setting grooves 23. An upper mold 7 is set at the output end of the electric telescopic rod 6. The upper mold 7 is connected to the external injection molding equipment, and cutters 8 are set on both sides of the bottom of the upper mold 7.

[0036] When using this chip overflow prevention plastic sealing device, turn on the switch of the cylinder 21 to make it work, the output end of the cylinder 21 drives the protective cover 22 to move in the vertical direction, and the cylinder 21 is controlled to drive the protective cover 22 close to the rotating disk 3 below, so that a specified distance is left between the bottom of the protective cover 22 and the rotating disk 3. At this time, the plastic sealing groove 51 of the rotating disk 3 located on the front can be exposed, and the staff will place the chip with plastic sealing in the plastic sealing groove 51. Then start the motor 4, and the output end of the motor 4 drives the rotating disk 3 to rotate in a ninety-degree direction. During the rotation of the rotating disk 3, the inclined surface of the triangle on the top surface of the transmission block 56 will contact the bottom surface of the protective cover 22, and the rotation of the rotating disk 3 causes the transmission block 56 to shrink toward the inside of the slot, thereby driving the bottom connecting plate 54 to move downward. The chip on the top surface of the connecting plate 54 penetrates into the plastic sealing groove 51. After the rotating disk 3 rotates ninety degrees, the molding groove 51 for setting the chip is located directly below the setting grooves 23 on both sides, and the transmission block 56 contacts the bottom of the protective cover 22, so that the chip is located inside the molding groove 51. At this time, the electric telescopic rod 6 in the setting groove 23 is started, and the electric telescopic rod 6 drives the upper mold 7 to move downward, so that the bottom of the upper mold 7 contacts the top surface of the molding groove 51. Then the external injection molding equipment enters the molding groove 51 through the upper mold 7 to complete the injection molding of the chip. In order to fully mold the chip, the injection molding equipment needs to complete a slight over-injection, and the excess plastic overflows into the overflow groove 52. After the injection molding is completed, the electric telescopic rod 6 drives the upper mold 7 to move downward, and drives the cutter 8 at the bottom of the lower mold to cut the plastic in the overflow groove 52, and then the electric telescopic rod 6 drives the upper mold 7 to move upward, so that the cutter 8 is separated from the plastic below. After the plastic sealing operation of a single chip is completed, the rotating disk 3 continues to place the chip in the exposed plastic sealing groove 51, so that the motor 4 continues to drive the rotating disk 3 to rotate 90 degrees to repeat the above operation, thereby completing the continuous plastic sealing of several chips. Until the plastic-sealed chip rotates to the front of the plastic sealing device, at this time, the top of the transmission block 56 is not supported by the bottom of the protective cover 22, and the connecting plate 54 moves upward under the force of the reset springs 55 at the bottom, and the plastic-sealed chip on the top of the connecting plate 54 will pop out for easy removal; the plastic in the overflow groove 52 will accumulate inside the overflow groove 52 due to the cutting of the cutter 8. After taking the plastic-sealed chip, it is convenient to directly clean the plastic in the overflow groove 52, so as to facilitate the subsequent placement of new chips.

[0037] Example 2

[0038] The present invention provides a method for using a chip overflow prevention plastic sealing device, comprising the following steps:

[0039] Step 1: Turn on the switch of the cylinder 21 to make it work. The output end of the cylinder 21 drives the protective cover 22 to move in the vertical direction. The cylinder 21 is controlled to drive the protective cover 22 to approach the rotating disk 3 below, so that a specified distance is left between the bottom of the protective cover 22 and the rotating disk 3. At this time, the plastic sealing groove 51 on the front of the rotating disk 3 can be exposed, and the staff places the plastic-sealed chip in the plastic sealing groove 51;

[0040] Step 2: Start the motor 4, and the output end of the motor 4 drives the rotating disk 3 to rotate 90 degrees. During the rotation of the rotating disk 3, the triangular inclined surface of the top surface of the transmission block 56 will contact the bottom surface of the protective cover 22. The rotation of the rotating disk 3 causes the transmission block 56 to shrink toward the inside of the slot, thereby driving the bottom connecting plate 54 to move downward. The chip on the top surface of the connecting plate 54 penetrates into the plastic sealing groove 51;

[0041] Step 3: After the rotating disk 3 rotates 90 degrees, the molding groove 51 for setting the chip is located directly below the setting grooves 23 on both sides, and the transmission block 56 contacts the bottom of the protective cover 22, so that the chip is located inside the molding groove 51. At this time, the electric telescopic rod 6 in the setting groove 23 is started, and the electric telescopic rod 6 drives the upper mold 7 to move downward, so that the bottom of the upper mold 7 contacts the top surface of the molding groove 51. Then the external injection molding equipment enters the molding groove 51 through the upper mold 7 to complete the injection molding of the chip. In order to fully mold the chip, the injection molding equipment needs to complete a slight over-injection, and the excess plastic overflows into the overflow groove 52;

[0042] Step 4: After the injection molding is completed, the electric telescopic rod 6 drives the upper mold 7 to move downward, driving the cutter 8 at the bottom of the lower mold to cut the plastic in the overflow groove 52, and then the electric telescopic rod 6 drives the upper mold 7 to move upward to separate the cutter 8 from the plastic below. The plastic sealing operation of a single chip is completed, and at this time, the rotating disk 3 continues to place the chip in the exposed plastic sealing groove 51, so that the motor 4 continues to drive the rotating disk 3 to rotate 90 degrees to repeat the above operation, thereby completing the continuous plastic sealing of several chips;

[0043] Step 5: until the chip that has been plastic-sealed is rotated to the front of the plastic-sealing device, at this time, the top of the transmission block 56 is not supported by the bottom of the protective cover 22, and the connecting plate 54 is moved upward by the force of several return springs 55 at the bottom, and the chip that has been plastic-sealed on the top of the connecting plate 54 will pop out for easy removal; the plastic in the overflow groove 52 will accumulate inside the overflow groove 52 due to the cutting of the cutter 8. After taking the plastic-sealed chip, it is convenient to directly clean the plastic in the overflow groove 52, which is convenient for the subsequent placement of new chips.

[0044] Working principle of the present invention: An anti-overflow plastic sealing device for chips of the present invention is provided with an installation frame 1, and a cylinder 21 drives the installation frame 1 to move in the vertical direction, thereby adjusting the distance between the installation frame 1 and the bottom rotating disk 3, so that the plastic sealing structure 5 performs plastic sealing on the chip inside the protective cover 22, thereby preventing the chip from contacting the outside and causing pollution during the plastic sealing process; at the same time, the cylinder 21 adjusts the distance between the installation frame 1 and the moving disk, and indirectly adjusts the moving distance of the connecting plate 54 through the transmission block 56, thereby adjusting the plastic sealing thickness of the chip; by providing an overflow groove 52, the injection molding equipment performs excessive injection molding in the plastic sealing groove 51 so that the chip can be plastic sealed, and the excess plastic enters the overflow groove 52; the cutter at the bottom of the upper mold 7 8 After the injection molding is completed, the plastic in the overflow groove 52 is cut to facilitate the subsequent removal of the complete plastic-encapsulated chip and the cleaning of the rubber in the overflow groove 52; by setting a transmission block 56, when the motor 4 drives the rotating disk 3 to rotate, the transmission block 56 contacts the bottom of the protective cover 22, thereby driving the connecting plate 54 and the chip to move to the bottom of the plastic-encapsulation groove 51, and the chip plastic-encapsulation is completed by the upper mold 7. When the chip in the plastic-encapsulation groove 51 is exposed from the protective cover 22, the connecting plate 54 is driven by the restoring spring force at the bottom to drive the plastic-encapsulated chip to pop out, which is convenient for direct removal. The rubber in the overflow groove 52 is still accumulated inside after cutting. After taking the chip, it is convenient to clean the rubber in the overflow groove 52, which is convenient for the subsequent placement of new chips.

[0045] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A chip anti-overflow plastic sealing device, comprising a mounting frame (1), characterized in that: A rotating disk (3) is rotatably provided at the bottom of the installation frame (1), and a plastic sealing structure (5) is provided inside the rotating disk (3). The plastic sealing structure (5) comprises: Four plastic sealing grooves (51) are arranged on the top surface of the rotating disk (3), and overflow grooves (52) are arranged on both sides of the plastic sealing grooves (51); A movable groove (53) is arranged at the bottom of each plastic sealing groove (51), a connecting plate (54) is slidably connected in the movable groove (53), and the connecting plate (54) is elastically connected to the bottom of the movable groove (53); grooves are arranged on both sides of each plastic sealing groove (51), and the bottom of the groove is connected to the movable groove (53); A transmission block (56) is slidably connected in the slot, and the bottom of the transmission block (56) is connected to the connecting plate (54); A protective structure (2) is arranged in the installation frame (1); a cylinder (21) of the protective structure (2) is arranged at the top of the installation frame (1); a protective cover (22) is arranged at the output end of the cylinder (21); a projection of the protective cover (22) in the direction of the rotating disk (3) covers three plastic sealing grooves (51); and the plastic sealing groove (51) located on the front of the installation frame (1) is exposed; setting grooves (23) are provided on both sides of the protective cover (22); an electric telescopic rod (6) is arranged in each setting groove (23); an upper mold (7) is arranged at the output end of the electric telescopic rod (6); and cutters (8) are arranged on both sides of the bottom of the upper mold (7).

2. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: A motor (4) is arranged at the bottom center of the installation frame (1), and the output end of the motor (4) is arranged along the vertical direction. The output end of the motor (4) is connected to the bottom center of the rotating disk (3).

3. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: The overflow grooves (52) on both sides of the same plastic sealing groove (51) are symmetrically arranged with respect to the central plane of the plastic sealing groove (51).

4. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: A plurality of return springs (55) are arranged at the bottom of the movable groove (53), and the top ends of the plurality of return springs (55) are connected to the same connecting plate (54), and the connecting plate (54) is arranged along the horizontal plane direction.

5. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: The top of the transmission block (56) is in a triangular shape, and the inclined surface of the top of the transmission block (56) is arranged toward a side away from the plastic sealing groove (51).

6. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: The grooves (23) on both sides are arranged along the vertical direction.

7. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: The four plastic sealing grooves (51) are arranged in a circular array at equal distances from the center of the rotating disk (3).

8. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: The output shaft of the motor (4) rotates at an angle of ninety degrees each time.

9. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: The position of the cutter (8) is adapted to the position of the overflow chute (52) below.

10. The chip overflow prevention plastic sealing device according to claim 1, characterized in that: The upper mold (7) is connected to an external injection molding device.

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