A punching method for conductive fabric adhesive surface

Abstract

This invention relates to a conductive fabric processing method, specifically a punching method for the adhesive surface of the conductive fabric, comprising the following steps: S1: Attaching a first protective film, a positioning hole film, double-sided adhesive, and a first cover film, punching and removing waste in one pass; S2: Attaching the double-sided adhesive handle film and the second protective film to the first side of the double-sided adhesive, and attaching the second cover film to the second side of the double-sided adhesive, punching and removing waste in a second pass; S3: Attaching the conductive fabric and the third cover film to the second side of the double-sided adhesive, punching and removing waste in a third pass; S4: Attaching the double-sided adhesive and the complete conductive fabric handle film to the positioning hole film, attaching the release film to the conductive fabric, cutting open the conductive fabric handle film to expose the side, and removing waste; S5: Punching and removing waste in four and five passes; S6: Attaching the transparent release film to the conductive fabric handle film, removing the second protective film to obtain the conductive fabric. Compared with the prior art, this invention, by employing a conductive fabric adhesive surface punching technology, effectively improves the misalignment problem in the handle film attachment, thereby increasing the yield.

Description

Technical Field

[0001] This invention relates to a method for processing conductive cloth, specifically a method for punching the adhesive surface of conductive cloth. Background Technology

[0002] Conductive cloth tape is simply tape made of conductive cloth. Its key characteristic is the addition of adhesive properties to the conductive cloth base. For more information on its important properties, please refer to the entry for conductive cloth. Generally, the desired adhesive in the industry is conductive adhesive, which contains nickel, to achieve a magnetic shielding effect. However, some tapes do not require conductive adhesive and use only ordinary acrylic adhesive or hot melt adhesive, where good adhesion of the conductive cloth is sufficient. Conductive cloth tape is suitable for various electronic and electrical products such as computers, mobile phones, wires, and cables, primarily for shielding or isolating electromagnetic waves or radio wave interference during high-frequency transmission.

[0003] The existing die-cutting method for the conductive fabric adhesive surface is as follows: 1. Center the non-release side of the release film (positioning hole) onto the adhesive surface of the transparent protective film; 2. Center the adhesive side of the double-sided adhesive onto the release side of the release film (positioning hole); 3. Remove the original paper and center the release side of the cover film one onto the adhesive surface; 4. Dig, remove the waste material within the marking lines, and simultaneously remove all the cover film one on the surface; 5. Center the release side of the release film (double-sided adhesive handle film) onto the adhesive surface; 6. Center the adhesive side of the silicone protective film onto the non-release side of the release film (double-sided adhesive handle film); 7. Reverse the removal of the transparent protective film and the release film within the trimming lines; 8. Center the release side of the cover film two onto the adhesive surface; 9. Dig, remove the outer frame waste, and use sealing tape to remove the cover film two on the surface; 10. Remove the non-adhesive side of the conductive fabric... 11. Remove the conductive cloth backing paper and center the release liner of the cover film onto the adhesive surface; 12. Punch and remove waste material from the marked area, and remove all remaining cover film; 13. Place one side of the release liner of the two standard conductive cloth handle films in the middle of the bonding mark line, and the other side on both sides of the adhesive surface (the roller must be covered with release film during bonding, and the release film should face outwards); 14. Center the release liner of the white release film on the middle glue leakage area; 15. Punch and deepen the crease, but do not cut through the conductive cloth, leaving a shallow mark on the handle film; 16. Punch and remove waste material from the outer frame outline; 17. Use sealing tape to remove the white release film waste material on the middle adhesive; 18. Place the release liner of the transparent release film onto the adhesive surface; 19. Reverse the silicone protective film.

[0004] This method has certain drawbacks: First, because the conductive fabric handle film is applied manually, it is necessary to ensure that the slitting is neat and the winding is also neat; however, this requirement cannot be met in reality. The drawback is that because the material has S-curves of varying sizes, it will lead to misalignment during application.

[0005] Second: Marking lines (marking lines) are made in the waste area of ​​the conductive cloth. The marking lines are not easy to see on the adhesive surface of the conductive cloth, which means that the speed must be slow when applying it. Otherwise, the material will not be applied straight and will be misaligned.

[0006] Third: During the production process, it is necessary to make frequent adjustments to prevent material deviation. This will result in time wasted on adjustments, and even if the adjustments are not made well the first time, it will also waste materials.

[0007] Fourth: Because the conductive cloth must be reinforced with pressure lines, the purpose of which is to prevent the conductive cloth from bursting open. However, the pressure lines can only leave marks, not penetrate the conductive cloth. This is because when the blue film is applied, some parts will be misaligned, and pressing will cause the conductive cloth to be cut through.

[0008] The defect rate of existing technology is as follows: 10% of defects are due to improper material stripping and not being aligned; 10% are due to debugging; and 10% are due to not paying attention to the marking lines. 30% of defects are caused by the conductive cloth being cut through, and debugging wastes about one hour. Therefore, it is evident that the existing punching method has a high defect rate. Summary of the Invention

[0009] The purpose of this invention is to provide a die-cutting method for the adhesive surface of conductive cloth in order to solve at least one of the above problems, thereby achieving a low defect rate in the production die-cutting of conductive cloth.

[0010] The objective of this invention is achieved through the following technical solution:

[0011] A method for punching conductive adhesive fabric surfaces includes the following steps:

[0012] S1: Sequentially attach the first protective film, positioning hole film, double-sided tape and first cover film, then perform a punching cut and remove waste material;

[0013] S2: The double-sided adhesive handle film and the second protective film are sequentially attached to the first side of the double-sided adhesive after the first punching in step S1, and the second cover film is attached to the second side of the double-sided adhesive. Then, a second punching is performed and the waste material is removed.

[0014] S3: The conductive cloth and the third cover film are sequentially attached to the second side of the double-sided tape after the second punching in step S2, and then the third punching is performed to remove the waste material.

[0015] S4: Apply double-sided tape to the positioning hole film at intervals, apply release film to the conductive cloth after three punchings in step S3, apply the complete conductive cloth handle film to the double-sided tape, cut open the conductive cloth handle film to expose the side of the conductive cloth handle film, and then remove the waste material.

[0016] S5: The semi-finished product obtained in step S4 is punched four times and five times in sequence, and then the waste is removed;

[0017] S6: Apply the transparent release film to the conductive fabric handle film after five punchings in step S5, and then remove the second protective film to obtain the conductive fabric.

[0018] Preferably, step S1 includes the following steps:

[0019] S11: Attach the non-release surface of the positioning hole membrane to the adhesive surface of the first protective film;

[0020] S12: Attach the first side of the double-sided adhesive to the release surface of the positioning hole film and remove the original paper from the double-sided adhesive;

[0021] S13: Attach the release surface of the first cover film to the second side of the double-sided adhesive;

[0022] S14: A punching operation is performed from the first cover film side, followed by the removal of the waste material from the first cover film and the marking line.

[0023] Preferably, step S2 includes the following steps:

[0024] S21: Attach the release surface of the double-sided adhesive handle film to the second side of the double-sided adhesive after it has been punched once in step S1;

[0025] S22: Attach the adhesive side of the second protective film to the non-release surface of the double-sided adhesive handle film;

[0026] S23: After removing the first protective film and the release film within the trimming line, attach the release surface of the second cover film to the first side of the double-sided adhesive.

[0027] S24: Secondary punching is performed from the second cover film side, followed by removal of the second cover film and outer frame waste.

[0028] Preferably, the second cover film is removed by adhesive tape.

[0029] Preferably, step S3 includes the following steps:

[0030] S31: Attach the conductive cloth to the first side of the double-sided adhesive after the second punching in step S2, and remove the original paper from the double-sided adhesive.

[0031] S32: Attach the release surface of the third cover film to the adhesive surface of the conductive cloth;

[0032] S33: The third cover film is punched three times, and then the waste from the third cover film and the marking area is discharged.

[0033] Preferably, step S4 includes the following steps:

[0034] S41: Two double-sided adhesive strips are attached to the positioning hole membrane at intervals, and the release film is attached to the adhesive surface of the conductive cloth after three punchings in step S3.

[0035] S42: Remove the original paper from the double-sided tape and attach the non-release side of the conductive fabric handle film to the double-sided tape;

[0036] S43: Cut the conductive fabric handle film and remove the conductive fabric handle film waste.

[0037] Preferably, the four punching operations in step S5 are performed by punching the conductive fabric handle film side until an imprint is left on the conductive fabric handle film without cutting through the conductive fabric.

[0038] Preferably, the five punching operations in step S5 are performed on the conductive fabric handle film side, followed by the removal of outer frame outline waste and release film waste.

[0039] Preferably, the release film waste is removed by adhesive tape.

[0040] Preferably, the first protective film is a transparent protective film; the second protective film is a silicone protective film; the release film is a PET release film; and the bonding is a center-aligned bonding.

[0041] After the waste material from the three-punch cutting process is removed, the original cover film is replaced with a 0.05mm PET release film. 10mm double-sided adhesive is applied to both sides of the bottom film, the original paper of the double-sided adhesive is removed, and the release side of the conductive fabric handle film is attached to the double-sided adhesive on both sides. After the three punches, a cutting tool is added to trim the edge of the conductive fabric handle film. After punching, the PET release film is pulled out.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. By adopting this conductive cloth adhesive surface punching technology, the conductive cloth handle film is changed to a single sheet of material, which changes the misalignment defect of the handle film bonding, thereby improving the product production yield and reducing the defect rate caused by bonding in the original technology; at the same time, by changing the misalignment defect of the handle film bonding, the defect of the conductive cloth being cut through due to misalignment is reduced, further reducing the defect to 0%.

[0044] 2. Due to the adoption of this conductive fabric adhesive surface punching technology, the manual method has been changed (using a whole sheet of conductive fabric handle film and using 0.05MM PET release film instead of cover film), thereby reducing costs. Attached Figure Description

[0045] Figure 1 This is a schematic diagram of a single punching operation according to the present invention;

[0046] Figure 2 This is a schematic diagram of the secondary punching process of the present invention;

[0047] Figure 3This is a schematic diagram of the three-stage punching process of the present invention;

[0048] Figure 4 This is a schematic diagram of the four punching processes of the present invention;

[0049] Figure 5 This is a schematic diagram of the five-stage punching process of the present invention;

[0050] Figure 6 This is a schematic diagram of the structure of the present invention after the conductive fabric handle film is bonded together;

[0051] Figure 7 This is a schematic diagram of cutting the conductive fabric handle film according to the present invention;

[0052] Figure 8 This is a schematic diagram of the product obtained in Example 1. Detailed Implementation

[0053] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0054] Example 1

[0055] A punching method for conductive fabric adhesive surface, such as... Figure 1-7 As shown, the specific steps include the following:

[0056] 1. Place the non-release side of the positioning hole film (i.e., the blue release film (positioning film) in the figure) onto the adhesive side of the transparent protective film in the center;

[0057] 2. Center the adhesive side of the double-sided tape onto the release surface of the positioning hole film;

[0058] 3. Tear off the original paper and attach the release surface of the first cover film (i.e., cover film (a) in the figure) to the adhesive surface in the center;

[0059] 4. See the schematic diagram for a single punching operation ( Figure 1 Punching is performed according to the punching shape shown in the figure and the order of ①-②. The first punching is from the first cover film to the transparent protective film, that is, punching to the position hole film. The second punching is from the first cover film to the position hole film, that is, punching to the double-sided tape. The waste material inside the marking line is discharged, and at the same time, the first cover film on the surface is completely removed.

[0060] 5. Place the release side of the release film (double-sided adhesive handle film, i.e., the blue release film in the picture) onto the adhesive side of the double-sided adhesive.

[0061] 6. Center the adhesive side of the silicone protective film (i.e., the blue silicone film in the picture) onto the non-release side of the release film (double-sided adhesive handle film);

[0062] 7. Reverse-discharge transparent protective film and release film within the trimming line;

[0063] 8. Place the release surface of the second cover film (i.e., cover film (II) in the figure) onto the adhesive surface in the center;

[0064] 9. Secondary punching is shown in the schematic diagram. Figure 2 Punch according to the punching shape in the figure, punching from the second cover film to the silicone protective film (that is, punching to the point where the double-sided adhesive handle film breaks), remove the outer frame waste, and use sealing tape to remove the second cover film on the surface;

[0065] 10. Place the non-adhesive side (cloth side) of the conductive cloth onto the adhesive side in the center;

[0066] 11. Tear off the conductive cloth base paper and attach the release surface of the third cover film (i.e., cover film (three) in the figure) to the adhesive surface in the center;

[0067] 12. The three-stage punching process is shown in the diagram. Figure 3 Punch according to the punching shape in the figure, punching from the third cover film to the silicone protective film (that is, punching to the break of the double-sided adhesive handle film), remove the waste in the marked area, and at the same time remove all the remaining third cover film;

[0068] 13. Attach two strips of double-sided tape to the positioning hole film. Attach the PET release film (i.e., conductive fabric handle film / conductive fabric release film) to the adhesive side of the conductive fabric. Peel off the original double-sided tape and attach the release film to the top of the double-sided tape. Figure 6 As shown;

[0069] 14. Cut the conductive fabric handle film (i.e., the conductive fabric release film in the picture) open. Figure 7 Cut the handle film at intervals and trim the edges), and remove the conductive cloth handle film waste in the middle position;

[0070] 15. See the diagram for the four punching operations ( Figure 4 Punch according to the punching shape in the diagram, punching only the conductive cloth handle film until a shallow mark is left. Press the lines deep, but do not cut through the conductive cloth. A shallow mark can be left on the handle film.

[0071] 16. See the diagram for the five punching operations ( Figure 5 According to the punching shape in the figure, punch from the conductive cloth handle film to the silicone protective film, that is, punch to the double-sided adhesive handle film (and remove the waste material of the outer frame outline);

[0072] 17. Use sealing tape to remove the white release film waste on the intermediate adhesive;

[0073] 18. Place the release surface of the transparent release film (i.e., the transparent release film (carrier film) in the figure) onto the adhesive surface;

[0074] 19. Reverse silicone protective film.

[0075] 20. (The following is a possible interpretation / statement): Figure 8The conductive cloth tape product shown.

[0076] Compared to existing technologies, this embodiment changes the conductive fabric handle film to a single sheet of material; under normal circumstances, die-cut products with a 0.05mm PET release film attached to the conductive fabric adhesive side meet product requirements and standards.

[0077] The main difference between this embodiment and existing technologies lies in steps 13 and 14. Specifically, after removing the waste material from the three-punch cutting process, the original cover film is replaced with a 0.05mm PET release film. Double-sided adhesive is applied to both sides of the bottom film with a 10mm gap. The original paper of the double-sided adhesive is removed, and the release surface of the conductive fabric handle film is attached to the double-sided adhesive on both sides (e.g., ...). Figure 6 After the third stroke, add a cutting tool step to trim the edges of the handle film. Figure 7 After punching, the PET release film is pulled out. The weight of the release film in this step is low. If it is too heavy, the release film will not be able to be pulled out. Therefore, a 0.05 mm PET release film is selected.

[0078] Production was carried out using the punching method of this embodiment, and routine performance tests were conducted (the tests were conducted using standard or conventional methods in the art). The results are shown in Table 1.

[0079] Table 1 Physical properties of punched products from Example 1

[0080] Glue / Conductive acrylic adhesive Total thickness Mm 0.12±0.01 Peeling force KG / 25mm 0.9-1.1 Vertical conduction resistance Ω <0.05 Electromagnetic shielding / 100kHz-3GHz Initial adhesion 1 / 32-1 inch 16 (within 100mm) Holding power Hr >24 Applicable temperature ℃ -20-80 Inventory conditions ℃ RH 20 / 65 Inventory shelf life Month 6

[0081] Therefore, it can be seen that the punching method of this embodiment (invention) can improve the product yield while the obtained product can maintain the same or even better performance as commercially available products.

[0082] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.

Claims

1. A conductive cloth-adhesive surface die-cutting method, characterized by, Includes the following steps: S1: The first protective film, the positioning hole film, the double-sided tape and the first cover film are attached in sequence, and then a punching is performed to remove the waste material; wherein, the punching is performed from the first cover film to the transparent protective film, that is, punching until the positioning hole film breaks; S2: The double-sided adhesive handle film and the second protective film are sequentially attached to the first side of the double-sided adhesive after the first punching in step S1. The second cover film is attached to the second side of the double-sided adhesive. Then, a second punching is performed and the waste is removed. The second punching is performed from the first cover film to the positioning hole film, that is, punching until the double-sided adhesive breaks. S3: The conductive cloth and the third cover film are sequentially attached to the second side of the double-sided adhesive after the second punching in step S2, and then the third punching is performed and the waste is removed; wherein, the third punching is performed from the third cover film to the silicone protective film, that is, punching until the double-sided adhesive handle film breaks. S4: Apply double-sided tape to the positioning hole film at intervals, apply release film to the conductive cloth after three punchings in step S3, apply the complete conductive cloth handle film to the double-sided tape, cut open the conductive cloth handle film to expose the side of the conductive cloth handle film, and then remove the waste material. S5: The semi-finished product obtained in step S4 is subjected to four punching and five punching in sequence, and then the waste is removed; among them, the four punching only punches the conductive cloth handle film until a shallow mark is left, and the five punching punches from the conductive cloth handle film to the silicone protective film, that is, punching until the double-sided adhesive handle film breaks. S6: Apply the transparent release film to the conductive fabric handle film after five punchings in step S5, and then remove the second protective film to obtain the conductive fabric.

2. The punching method for the conductive adhesive surface according to claim 1, characterized in that, Step S1 includes the following steps: S11: Attach the non-release surface of the positioning hole membrane to the adhesive surface of the first protective film; S12: Attach the first side of the double-sided adhesive to the release surface of the positioning hole film and remove the original paper from the double-sided adhesive; S13: Attach the release surface of the first cover film to the second side of the double-sided adhesive; S14: A punching operation is performed from the first cover film side, followed by the removal of the waste material from the first cover film and the marking line.

3. The punching method for the conductive adhesive surface according to claim 1, characterized in that, Step S2 includes the following steps: S21: Attach the release surface of the double-sided adhesive handle film to the second side of the double-sided adhesive after it has been punched once in step S1; S22: Attach the adhesive side of the second protective film to the non-release surface of the double-sided adhesive handle film; S23: After removing the first protective film and the release film within the trimming line, attach the release surface of the second cover film to the first side of the double-sided adhesive. S24: Secondary punching is performed from the second cover film side, followed by removal of the second cover film and outer frame waste.

4. The punching method for the conductive adhesive surface according to claim 3, characterized in that, The second cover film was removed by sticking it off with adhesive tape.

5. The punching method for the conductive adhesive surface according to claim 1, characterized in that, Step S3 includes the following steps: S31: Attach the conductive cloth to the first side of the double-sided adhesive after the second punching in step S2, and remove the original paper from the double-sided adhesive. S32: Attach the release surface of the third cover film to the adhesive surface of the conductive cloth; S33: The third cover film is punched three times, and then the waste from the third cover film and the marking area is discharged.

6. The punching method for the conductive adhesive surface according to claim 1, characterized in that, Step S4 includes the following steps: S41: Two double-sided adhesive strips are attached to the positioning hole membrane at intervals, and the release film is attached to the adhesive surface of the conductive cloth after three punchings in step S3. S42: Remove the original paper from the double-sided tape and attach the non-release side of the conductive fabric handle film to the double-sided tape; S43: Cut the conductive fabric handle film and remove the conductive fabric handle film waste.

7. The punching method for the conductive adhesive surface according to claim 1, characterized in that, In step S5, the four punching operations are performed from the side of the conductive cloth handle film to leave marks on the conductive cloth handle film without cutting through the conductive cloth.

8. The punching method for the conductive adhesive surface according to claim 1, characterized in that, The five punching operations in step S5 are performed on the conductive fabric handle film side, followed by the removal of outer frame outline waste and release film waste.

9. The punching method for the conductive adhesive surface according to claim 8, characterized in that, Release film waste is removed by adhesive tape.

10. The punching method for the conductive adhesive surface according to claim 1, characterized in that, The first protective film is a transparent protective film; the second protective film is a silicone protective film; the release film is a PET release film; and the bonding is a center-aligned bonding.

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