Electronic device

Abstract

An embodiment of the present application provides an electronic device, including a device body and a fan. The device body includes a main body member and a bottom case connected to each other. The device body forms a heat dissipation space, and the bottom case is provided with at least one air inlet hole communicating with the heat dissipation space; the fan includes a cover plate and an impeller. The cover plate is connected to the device body, and the cover plate and the bottom case jointly enclose to form a wind guiding channel. The air inlet hole forms an air inlet of the wind guiding channel, and the air outlet of the wind guiding channel faces the heat dissipation space. The impeller is rotatably connected to the cover plate and is located in the wind guiding channel. In the fan of this electronic device, the bottom case is used instead of the bottom plate to jointly form the wind guiding channel with the cover plate. At this time, the fan does not need to be provided with a bottom plate, and there is no need to provide connection structures such as snap protrusions on the cover plate. There is also no need to set a vibration gap between the fan and the bottom case. In this way, the thickness of this electronic device is reduced by at least the thickness of the bottom plate and the thickness of the vibration gap, thereby realizing the thinning of the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and particularly to an electronic device. Background Art

[0002] With the rapid improvement of the chip processing speed in electronic devices such as laptop computers, the heat dissipation structure has become a key design point in electronic devices. An electronic device includes a device body and a fan. The device body includes a connected main body member and a bottom case. The main body member and the bottom case jointly enclose a heat dissipation space. The bottom case is provided with air inlets communicating with the heat dissipation space. The fan is connected to the main body member and can generate an air flow blowing from the air inlets to the heat dissipation space. Currently, a general fan includes a cover plate, a bottom plate, and an impeller. The cover plate and the bottom plate are joined and jointly enclose a wind guiding channel. The wind guiding channel has an air inlet and an air outlet. The impeller is rotatably connected to the cover plate and is disposed in the wind guiding channel. Among them, the fan is connected to a bracket, and the bottom plate is spaced from the bottom case. Its air inlet faces the air inlets on the bottom case, and the air outlet faces the heat dissipation space. Currently, the thickness of the device body is limited by the thickness of the fan and the thickness of the gap between the fan and the bottom case, and it is difficult to meet the increasing demand of current users for thinner and lighter electronic devices. Summary of the Invention

[0003] This application provides an electronic device, which solves the problem that the thickness of the current electronic device meets the increasing demand of current users for thinner and lighter electronic devices.

[0004] To achieve the above object, this application adopts the following technical solutions:

[0005] An embodiment of this application provides an electronic device, including a device body and a fan. The device body includes a connected main body member and a bottom case. The device body forms a heat dissipation space. The bottom case is provided with at least one air inlet communicating with the heat dissipation space. The fan includes a cover plate and an impeller. The cover plate is connected to the device body. The cover plate and the bottom case jointly enclose a wind guiding channel. The air inlet forms the air inlet of the wind guiding channel. The air outlet of the wind guiding channel faces the heat dissipation space. The impeller is rotatably connected to the cover plate and is located in the wind guiding channel.

[0006] In the electronic device, the bottom case of the fan is used instead of the bottom plate to jointly form the wind guiding channel with the cover plate. At this time, the fan does not need to be provided with a bottom plate, and the cover plate does not need to be provided with connection structures such as snap protrusions. There is no need to set a vibration gap between the fan and the bottom case. In this way, compared with the current electronic device, the thickness of the electronic device provided by the embodiment of this application is reduced by at least the thickness of the bottom plate and the thickness of the vibration gap, thus realizing the thinning of the electronic device. At the same time, the setting of this fan shortens the distance between the impeller and the cold air outside the bottom case, improves the air suction efficiency, and avoids the hot air in the heat dissipation space from being cyclically sucked into the wind guiding channel through the vibration gap, affecting the heat dissipation effect.

[0007] As an implementation manner, the main body member includes an upper shell, a bracket and a main board. The upper shell is connected to the bottom shell and they jointly enclose a containing cavity. The bracket and the main board are both located in the containing cavity. The bracket is connected to the upper shell, and a heat dissipation space is formed between the bracket and the bottom shell. The main board is connected to a side of the bracket facing away from the upper shell, and the air outlet faces the main board to prevent heat in the heat dissipation space from accumulating at the main board.

[0008] As an implementation manner, the cover plate includes an upper cover portion and side portions connected to the upper cover portion. The side portions extend along the edge of the upper cover portion, and a notch is formed between two extending ends of the side portions. The notch faces the heat dissipation space, and the impeller is rotatably connected to the upper cover portion. The impeller forms a negative pressure by rotating to suck external air into the air guiding channel through the air inlet hole, and the side portions can guide the airflow sucked into the air guiding channel by the impeller to flow toward the air outlet.

[0009] As an implementation manner, the cover plate further includes ears connected to the side portions, and the ears are fixedly connected to the device main body. The setting of the ears realizes the connection between the fan and the device main body and does not occupy the space in the thickness direction of the fan.

[0010] As an implementation manner, there are multiple ears, and the multiple ears are arranged around the upper cover portion to improve the connection stability between the cover plate and the device main body.

[0011] As an implementation manner, the cover plate is connected to the bottom shell to improve the connection tightness between the fan and the bottom shell and the sealing performance of the air guiding channel. During installation, the fan can be first installed on the bottom shell, and then the bottom shell is connected to the main body member.

[0012] As an implementation manner, a connecting column protrudes from a side of the bottom shell facing the bracket, and the cover plate is connected to the connecting column. The setting of the connecting column can avoid reducing the structural strength of the bottom shell by opening a connecting structure on the bottom shell.

[0013] As an implementation manner, the cover plate and the bottom shell are in clearance fit to facilitate the quick installation of the fan and the bottom shell.

[0014] As an implementation manner, the electronic device further includes an elastic buffer member, and the cover plate and the bottom shell jointly clamp the buffer member. The setting of the buffer member can absorb the vibration of the fan, thereby reducing the vibration feeling of the bottom shell.

[0015] As an implementation manner, the buffer member extends along the edge of the cover plate and is hermetically connected between the cover plate and the bottom case. In this way, the air guide channel is sealed through the buffer member, avoiding air leakage of the air guide channel due to the installation gap between the cover plate and the bottom case.

[0016] As an implementation manner, the bottom case has an air inlet area, and a plurality of air inlet holes are provided. All of the plurality of air inlet holes are located in the air inlet area, the air inlet area faces the impeller, and the cover plate covers the air inlet area. In this way, the electronic device replaces the air inlet on the current fan bottom plate with a plurality of air inlet holes, improving the air flow velocity and thus the heat dissipation efficiency.

[0017] As an implementation manner, the electronic device further includes a display main body. The display main body includes a display end housing rotatably connected to the device main body and a display screen connected to the display end housing. The display screen is used for displaying images. The main body member further includes a keyboard connected to the bracket. The upper case is provided with positioning holes, and the keys of the keyboard pass through the positioning holes, allowing users to input instructions by operating the keyboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a perspective three-dimensional structure diagram of the electronic device provided by the embodiment of the present application from one perspective;

[0019] Figure 2 is a perspective three-dimensional structure diagram of the electronic device provided by the embodiment of the present application from another perspective;

[0020] Figure 3 is Figure 1 a cross-sectional view taken along line A-A in

[0021] Figure 4 is Figure 1 an exploded view of the electronic device in

[0022] Figure 5 is a partial structure diagram of the electronic device when a current fan is provided, where the bottom case is not shown;

[0023] Figure 6 is Figure 5 a partial cross-sectional view taken along line B-B of the electronic device in

[0024] Figure 7 is an exploded view of the electronic device provided by the embodiment of the present application;

[0025] Figure 8 is Figure 1 a partial cross-sectional view taken along line C-C in

[0026] Figure 9Assembly diagram of the bottom case, fan and buffer of the electronic device provided by the embodiment of the present application;

[0027] Figure 10 Three-dimensional structure diagram of the fan of the electronic device provided by the embodiment of the present application.

[0028] Explanation of reference numerals:

[0029] 10. Device main body; 11. Main body component; 111. Upper case; 1110. Positioning hole; 112. Bracket; 1121. Avoidance hole; 113. Main board; 114. Keyboard; 1141. Key; 12. Bottom case; 121. Connecting column; 122. Convex column; 120. Air inlet area; 1201. Air inlet hole; 101. Heat dissipation space; 20. Fan; 21. Cover plate; 211. Upper cover part; 2111. Positioning column; 212. Side part; 2121. Spiral section; 2122. Opening section; 213. Ear part; 2131. Connecting hole; 22. Impeller; 221. Rotating shaft; 222. Blade assembly; 2221. Rotating blade; 223. Limiting plate; 201. Air guiding channel; 202. Air outlet; 30. Display main body; 40. Buffer;

[0030] 20'. Fan; 21'. Cover plate; 211'. Upper cover part; 212'. Side part; 213'. Ear part; 214'. Snap projection; 2131'. Connecting hole; 22'. Bottom plate; 2201'. Clamping hole; 23'. Impeller; 201'. Air guiding channel; 202'. Air inlet; 203'. Air outlet; 1122'. Connecting column; 102'. Vibration gap. Detailed implementation manners

[0031] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application and should not be construed as limiting the present application.

[0032] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present application.

[0033] For the convenience of clearly describing the technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish identical or similar items with basically the same functions and roles. For example, the first limiting portion and the second limiting portion are only used to distinguish different limiting portions, and do not limit their sequence. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and the terms such as "first" and "second" do not necessarily limit being different.

[0034] It should be noted that in the present application, words such as "in one of the embodiments" or "for example" are used to give examples, illustrations or explanations. Any embodiment or design solution described as "in one of the embodiments" or "for example" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "in one of the embodiments" or "for example" is intended to present relevant concepts in a specific manner.

[0035] In the present application, unless otherwise clearly specified and limited, terms such as "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0036] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments.

[0037] With the rapid improvement of the chip processing speed in electronic devices, heat dissipation structures such as fans have become a key design point in electronic devices.

[0038] The embodiments of the present application provide an electronic device. The above-mentioned electronic device can be a mobile terminal such as a tablet computer, a tablet computer accessory, a television, a wearable device, a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc. Or, it can also be a professional shooting device such as a digital camera, a single-lens reflex camera / mirrorless camera, an action camera, a gimbal camera, a drone, etc. The embodiments of the present application do not impose special restrictions on the specific form of the electronic device, as long as the electronic device uses a fan as the heat dissipation structure.

[0039] Please refer to Figure 1 and Figure 2 , the electronic device provided by the embodiment of the present application includes a device main body 10.

[0040] The device main body 10 includes a connected main body member 11 and a bottom case 12. The bottom case 12 can be detachably connected to the main body member 11 after the main body member 11 is assembled. Please combine Figure 3 , the main body member 11 can generate heat. The device main body 10 is formed with a heat dissipation space 101. The main body member 11 can dissipate heat into the heat dissipation space 101. Among them, the heat dissipation space 101 can be formed by the main body member 11, or can be jointly enclosed by the main body member 11 and the bottom case 12. The bottom case 12 is provided with at least one air inlet hole 1201, and the air inlet hole 1201 is communicated with the heat dissipation space 101.

[0041] Optionally, an air inlet area 120 is provided on the bottom case 12. There are multiple air inlet holes 1201, and all of them are located in the air inlet area 120. The setting of the multiple air inlet holes 1201 can block external impurities from entering the heat dissipation space 101 while ventilating.

[0042] In some embodiments, please refer to Figure 3 and Figure 4 , the main body member 11 includes an upper case 111, a bracket 112 and a control component. The bottom case 12 is connected to the upper case 111 and jointly encloses a receiving cavity. The upper case 111 and the bottom case 12 provide protection for some components of the electronic device. Among them, the bottom case 12 can be detachably connected to the upper case 111, and the detachable connection methods include but are not limited to snap connection, screw connection, etc. The thickness direction of the device main body 10 is the direction from the upper case 111 to the bottom case 12. Both the bracket 112 and the control component are located in the receiving cavity. The bracket 112 is connected to the upper case 111. The bracket 112 can provide an installation foundation for various internal parts of the electronic device. The control component is connected to the bracket 112. A functional structural member electrically connected to the control component can also be connected to the bracket 112. The control component can control the functional structural member to realize its function. The control component can include one or several heat-generating devices such as a main board 113, a battery module, a wireless communication module, a camera module, an audio playback module, a chip, an electronic component, etc. The main body member 11 dissipates heat through the control component. The arrangement positions and installation methods of these control components are not specifically limited in this application. Those skilled in the art should understand that the electronic device can include one or several of the above-listed control components. Of course, it can also include components not limited to those listed in this article above, and can also include other components. The materials of the upper case 111, the bottom case 12 and the bracket 112 are not limited herein. In specific practice, those skilled in the art can select according to actual needs; for example, it can be a metal material, a plastic material, a ceramic material or a glass material, etc.

[0043] Taking the electronic device as a laptop computer as an example, the upper shell 111 can be equivalent to the C shell of the laptop computer, and the bottom shell 12 can be equivalent to the D shell of the laptop computer. The motherboard 113 is a typical heat-generating electronic device. In the following embodiments, the control component is described as the motherboard 113. The main body component 11 also includes a keyboard 114, which is the above-mentioned functional structural component. The keyboard 114 is connected to the bracket 112 and is electrically connected to the control component. The upper shell 111 avoids the keys 1141 of the keyboard 114. Specifically, a positioning hole 1110 is opened on the main body component 11, and the keys 1141 of the keyboard 114 are inserted into the positioning hole 1110 for user operation. The user can input instructions through the keyboard 114 to enable the motherboard 113 to execute the corresponding program.

[0044] The electronic device further includes a display body 30, which includes a display end housing and a display screen. The display end housing is rotatably connected to the device body 10, specifically, the display end housing is rotatably connected to the upper shell 111, and the display screen is connected to the display end housing and electrically connected to the main board 113. The display screen is used to display images. The display body 30 has a covering position covering the device body 10, and the display body 30 can reach the covering position or leave the covering position by rotating relative to the device body 10. When the display body 30 is in the covering position, the display screen faces the keyboard 114 to protect the display screen and the keyboard 114.

[0045] In this example, see Figure 3 and Figure 4 The electronic device also includes a fan 20, which is connected to the main component 11 and is arranged in the heat dissipation space 101. When the fan 20 is in operation, it can generate an airflow that blows from the air inlet 1201 to the heat dissipation space 101, and the airflow can take away the heat in the heat dissipation space 101.

[0046] Correspondingly, the device body 10 may also have at least one air outlet connected to the heat dissipation space 101. When the fan 20 is in operation, air can enter the air inlet 1201 from the outside, flow through the heat dissipation space 101, and then be discharged from the air outlet. In this way, the hot air in the heat dissipation space 101 can be brought out of the device body 10, thereby achieving heat dissipation of the device body 10.

[0047] Optionally, the motherboard 113 is connected to the side of the bracket 112 facing away from the upper shell 111, and a heat dissipation space 101 is formed between the bracket 112 and the bottom plate. The motherboard 113 is at least partially exposed to the heat dissipation space 101, and the heat of the motherboard 113 can be dissipated to the heat dissipation space 101. In order to avoid heat accumulation when the motherboard 113 is working, the fan 20 can guide the airflow to blow toward the motherboard 113 to dissipate heat from the motherboard 113.

[0048] See also Figure 5 andFigure 6 , the current fan 20' generally includes a cover plate 21', a bottom plate 22' and an impeller 23'. The cover plate 21' is connected to the bottom plate 22' and they jointly enclose a wind guiding channel 201'. The wind guiding channel 201' has an air inlet 202' and an air outlet 203'. The impeller 23' is rotatably connected to the cover plate 21' and is disposed in the wind guiding channel. The impeller 23' rotates relative to the cover plate 21' during operation. The wind guiding channel 201' is used to guide the flow direction of the air flow so that the air flow blows from the air inlet 202' to the air outlet 203'. Among them, the thickness direction of the fan 20' is the extending direction of the rotation axis of the impeller 23'. To achieve the thinning of the fan 20', the air inlet 202' is opened on the bottom plate 22', the cover plate 21' and the bottom plate 22' jointly enclose the air outlet 203'. The opening direction of the air inlet 202' is the same as the extending direction of the rotation axis of the impeller 23', and the opening direction of the air outlet 203' is perpendicular to the opening direction of the air inlet 202'. Among them, the air inlet 202' faces the air intake hole 1201, and the air outlet 203' faces the main board 113.

[0049] Specifically, the cover plate 21' includes an upper cover portion 211', a side portion 212' and an ear portion 213'. The side portion 212' is connected to the upper cover portion 211', the side portion 212' extends along the edge of the upper cover portion 211' and bends towards one side of the upper cover portion 211'. A notch is formed between the two extending ends of the side portion 212', and the notch faces the heat dissipation space 101. The ear portion 213' is connected to the outside of the side portion 212'. The cover plate 21' is connected to the connecting column 1122' protruding on the bracket through the ear portion 213'. Among them, a connecting structure for connecting to the bottom plate 22' is provided on the side portion 212'. The connecting structure can be a snap protrusion 214' protruding from the edge of the side portion 212' away from the upper cover portion 211' and extending in the direction away from the upper cover portion 211'. Correspondingly, the bottom plate 22' can be provided with a snap hole 2201'. The snap protrusion 214' passes through the snap hole 2201' and is snap-fitted with the bottom plate 22' through the snap hole 2201'. The cover plate 21' and the bottom plate 22' form the air outlet 203' of the wind guiding channel 201' at the notch of the side portion 212'. The upper cover portion 211' and the bottom plate 22' respectively form the upper and lower cavity walls of the air outlet 203', and the two extending ends of the side portion 212' form the left and right cavity walls of the air outlet 203'. The impeller 23' is rotatably connected to the upper cover portion 211'. The rotation axis of the impeller 23' is perpendicular to the upper cover portion 211', and the impeller 23' is directly opposite to the air inlet 202'. Among them, the thickness of the impeller 23' is less than the distance between the upper cover portion 211' and the bottom plate 22', so that the impeller 23' is accommodated in the wind guiding channel 201' to enable the air flow to converge at the air inlet 202' and improve the flow rate of the air flow in the wind guiding channel 201'.

[0050] To reduce the impact of the vibration generated during the operation of the fan 20' on the device main body 10, the fan 20' is generally connected to the bracket 112. At this time, the cover plate 21' is connected to the bracket 112 and is away from the bottom case 12, the bottom plate 22' is close to the bottom case 12, and the bottom plate 22' is spaced from the bottom case 12, so that a vibration gap 102' is reserved between the fan 20' and the bottom case 12. The air inlet 202' faces the air inlet hole 1201 on the bottom case 12, and the air outlet 203' faces the heat dissipation space 101. In this way, the bracket 112 can buffer the vibration of the fan 20', and the setting of the vibration gap 102' can prevent the fan 20' from hitting the bottom case 12 during vibration. When the fan 20' is in the operating state, the external air flow sequentially passes through the air inlet hole 1201, the vibration gap 102', the air inlet 202', the air guiding channel 201', and the air outlet 203', and then blows to the heat dissipation space 101, thereby taking away the heat in the heat dissipation space 101. To thin the device main body 10, an avoidance hole 1121 can be opened on the bracket 112, and the fan 20' is installed on the bracket 112 and passes through the avoidance hole 1121 to shorten the total thickness of the main body member 11 and the fan 20'. However, the thickness of the current device main body is still limited by the thickness of the fan 20' and the thickness of the vibration gap 102', and it is difficult to meet the increasing demand of current users for the thin and light of electronic devices.

[0051] To solve this problem, please refer to Figures 7 to 9 , the fan 20 in the electronic device provided in this application includes a cover plate 21 and an impeller 22. The cover plate 21 is connected to the device main body 10. The cover plate 21 and the bottom case 12 jointly enclose to form an air guiding channel 201, that is, the bottom case 12 forms a part of the wall surface of the air guiding channel 201. The air guiding channel 201 has an air inlet and an air outlet 202. The air inlet hole 1201 on the bottom case 12 forms the air inlet of the air guiding channel 201, and the air outlet 202 of the air guiding channel 201 faces the heat dissipation space 101. The impeller 22 is rotatably connected to the cover plate 21 and is located in the air guiding channel 201. When the impeller 22 is in the operating state, the air flow in the air guiding channel 201 can be blown from the air inlet hole 1201 to the air outlet 202. At this time, the external air flow sequentially passes through the air inlet hole 1201, the air guiding channel 201, and the air outlet 202, and then blows to the heat dissipation space 101, thereby taking away the heat in the heat dissipation space 101.

[0052] The fan 20 in this electronic device uses the bottom case 12 to replace the bottom plate 22' (such as Figure 6 ) to jointly form the air guiding channel 201 with the cover plate 21. At this time, the fan 20 does not need to be provided with a bottom plate, and the cover plate 21 does not need to be provided with connection structures such as snap protrusions 214' (such as Figure 6 ), and there is no need to set a vibration gap 102' (such as Figure 6), so that compared with the current electronic device, the thickness of the electronic device provided by the embodiment of the present application is reduced by at least the thickness of the bottom plate 22' (such as Figure 6 ) and the thickness of the vibration gap 102' (such as Figure 6 ), thereby realizing the thinning of the electronic device. At the same time, the setting of the fan 20 shortens the distance between the impeller 22 and the cold air outside the bottom case 12, improves the air intake efficiency, and avoids the hot air in the heat dissipation space 101 from being cyclically sucked into the air guide channel 201 through the vibration gap, affecting the heat dissipation effect.

[0053] Specifically, please refer to Figure 8 and Figure 9 . The cover plate 21 includes an upper cover portion 211 and a side portion 212 connected to the upper cover portion 211. The side portion 212 extends along the edge of the upper cover portion 211 and is bent toward one side of the upper cover portion 211. In the illustrated embodiment, the upper cover portion 211 is flat, and the side portion 212 is perpendicularly bent relative to the upper cover portion 211. A notch is formed between the two extending ends of the side portion 212, and the notch faces the heat dissipation space 101. The cover plate 21 and the bottom case 12 form an air outlet 202 at the notch of the side portion 212. Among them, the edge of the side portion 212 away from the upper cover portion 211 is flat, and there is no need to provide a buckle protrusion. The side portion 212 can be in clearance fit with the bottom case 12.

[0054] Optionally, the cover plate 21 covers the air intake area 120. At this time, the side portion 212 is disposed around the outside of the air intake area 120 so that all the intake holes 1201 communicate with the air guide channel 201. In this way, the electronic device replaces the air inlet on the bottom plate of the current fan 20 with a plurality of intake holes 1201, improves the flow rate of the air flow, and thus improves the heat dissipation efficiency. Among them, the size of the air intake area 120 can be the same as the size of the air inlet on the bottom plate of the current fan 20.

[0055] Please refer to Figure 8 . The impeller 22 faces the air intake area 120, and the rotation axis of the impeller 22 is parallel to the central axis of the intake holes 1201 in the air intake area 120, so that the air flow generated by the impeller 22 enters the air guide channel 201 from the intake holes 1201.

[0056] Please combine Figure 10, the impeller 22 includes a rotating shaft 221 and a blade assembly 222. The blade assembly 222 includes a plurality of rotating blades 2221 connected to the rotating shaft. The plurality of rotating blades 2221 are arranged at equal intervals along the circumferential direction of the rotating shaft 221 and all extend in a direction away from the rotating shaft 221. The extending ends of the respective rotating blades 2221 are bent toward the same side. The rotating shaft 221 is rotatably connected to the upper cover portion 211 and is electrically connected to the main board 113 through a wire 23. When the fan 20 is in an operating state, the main board 113 controls the rotation of the rotating shaft 221, and the plurality of rotating blades 2221 rotate with the rotating shaft 221, so that a negative pressure is generated near the rotating shaft 221, and the air flow can enter the air guiding channel 201 from the air inlet and is centrifugally blown to the circumferential side of the rotating blades 2221. The side portion 212 can guide the air flow blown to the circumferential side to flow toward the air outlet 202. Among them, the side portion 212 includes an adjacent spiral section 2121 and an opening section 2122, and the spiral section 2121 can extend in a spiral shape with respect to the rotating shaft 221. The distal end of the spiral section 2121 away from the rotating shaft 221 forms one side wall of the air outlet 202 of the air guiding channel 201, and the opening section 2122 is connected to the proximal end of the spiral section 2121 close to the rotating shaft 221 and forms the other side wall of the air outlet 202 of the air guiding channel 201. In order to expand the blowing range, the air outlet 202 formed by the opening section 2122 and the distal end of the spiral section 2121 is in a flared shape.

[0057] Optionally, the impeller 22 further includes a limiting plate 223. The limiting plate 223 is disposed around the rotating shaft 221 and is connected to the extending ends of the plurality of rotating blades 2221 to position the rotating blades 2221. Among them, the limiting plate 223 is connected to the side of the blade assembly 222 close to the upper cover portion 211 to prevent blocking the air flow from entering the air guiding channel 201.

[0058] It should be noted that to ensure the smooth rotation of the impeller 22, both the blade assembly 222 and the limiting plate 223 are spaced apart from the upper cover portion 211.

[0059] In some embodiments, please refer to Figure 9 and Figure 10 , the cover plate 21 further includes an ear portion 213. The ear portion 213 protrudes from the side of the side portion 212 facing away from the air guiding channel 201, and the ear portion 213 is fixedly connected to the device main body 10. The fan 20 is fixedly connected to the device main body 10 through the ear portion 213, which can avoid increasing the thickness of the fan 20.

[0060] Optionally, there are a plurality of ear portions 213. The plurality of ear portions 213 are disposed around the upper cover portion 211. In this way, the cover plate 21 is stably fixed circumferentially through the plurality of ear portions 213.

[0061] In some embodiments, please refer to Figure 8 and Figure 9, the cover plate 21 is connected to the bottom case 12. The connection method between the cover plate 21 and the bottom case 12 can be bonding, screw connection, snap connection, etc. In this embodiment, when assembling the electronic device, the fan 20 can be first connected to the bottom case 12, and then the bottom case 12 can be installed on the assembled main body member 11.

[0062] As one of the implementation manners, a connecting column 121 protrudes from the side of the bottom case 12 facing the bracket 112. The number of the connecting columns 121 is the same as the number of the ear portions 213, and each ear portion 213 is fixedly connected to a connecting column 121. The ear portion 213 is fixedly connected to the connecting column 121 to realize the fixed connection between the cover plate 21 and the bottom case 12. In this implementation manner, the connecting column 121 can be integrally formed with the bottom case 12.

[0063] Wherein, the ear portion 213 can be connected to the extending end of the connecting column 121 far from the bottom case 12, so that the connecting column 121 can absorb part of the vibration of the fan 20 through its slight elastic deformation, thereby reducing the vibration feeling on the bottom case 12. At the same time, there is no need to open a connecting structure on the bottom case 12, ensuring the flatness and structural strength of the bottom case 12.

[0064] Optionally, a connecting groove can be provided on the connecting column 121, and a connecting hole 2131 is opened on the ear portion 213. The opening direction of the connecting hole 2131 is the same as the opening direction of the connecting hole 2131, and the connecting hole 2131 is directly opposite to the connecting groove. The electronic device further includes a locking member. The locking member passes through the connecting hole 2131 and is connected to the connecting groove in a matching manner to jointly clamp the ear portion 213 with the connecting column 121, thereby realizing the locking of the ear portion 213 and the connecting column 121. The locking member can be a screw, and the screw is threadedly connected to the groove wall of the connecting groove or can also be threadedly connected to the hole wall of the connecting hole 2131.

[0065] Wherein, the opening direction of the connecting groove can be the same as the extending direction of the rotation axis of the impeller 22 to facilitate the installation of the locking member. Of course, the opening direction of the connecting groove may not be the same as the extending direction of the rotation axis of the rotation, and the ear portion 213 and the connecting column 121 can also be detachably connected by means such as bonding and snap connection, which is not limited herein.

[0066] In other embodiments, the cover plate 21 can also be connected to the main body member 11. For example, the cover plate 21 is connected to the bracket 112 to facilitate the bracket 112 to absorb the vibration of the fan 20 and reduce the vibration feeling on the bottom case 12. At this time, a connecting column 121 can protrude from the bracket 112, and the ear portion 213 and the connecting column 121 are fixedly connected by a locking member, which is not limited herein. It should be noted that among the multiple ear portions 213, some can be connected to the bottom case 12 and the other part can be connected to the bracket 112, which is not limited herein.

[0067] To facilitate the positioning of the fan 20 and the bottom case 12, please refer to Figure 8 andFigure 10 , a plurality of positioning posts 2111 can be protruded on one side of the upper cover part 211 facing the impeller 22. Correspondingly, positioning grooves adapted to be inserted and connected with the positioning posts 2111 can be arranged on the bottom shell 12, and the number of the positioning grooves is equal to that of the positioning posts 2111. During installation, the fan 20 can be first buckled on the bottom shell 12, and the positioning posts 2111 are inserted into the positioning grooves. At this time, the connection holes 2131 on the ear parts 213 are aligned with the connection grooves on the connection posts 121, and the locking piece can directly pass through the connection holes 2131 and be connected with the connection grooves in a matching manner. Among them, the positioning posts 2111 can have inclined cut surfaces to facilitate the insertion and connection with the positioning grooves.

[0068] To avoid affecting the structural strength of the bottom shell 12, a convex post 122 can be protruded on one side of the bottom shell 12 facing the bracket 112, and the positioning groove can be opened on the convex post 122.

[0069] In some embodiments, please refer to Figure 7 and Figure 8 , an avoidance hole 1121 is opened on the bracket 112, and the cover plate 21 passes through the avoidance hole 1121. When the electronic device is assembled, the fan 20 can be first installed on the bottom shell 12, and then the bottom shell 12 is connected to the assembled main body member 11. The avoidance hole 1121 not only further reduces the thickness of the device main body 10, but also can accommodate the design tolerance to avoid collision between the fan 20 and the bracket 112.

[0070] In some embodiments, please refer to Figure 7 and Figure 8 , the electronic device further includes a buffer member 40. The buffer member 40 has elasticity, and the cover plate 21 and the bottom shell 12 jointly clamp the buffer member 40. The arrangement of the buffer member 40 can absorb the vibration of the fan 20, thereby reducing the vibration feeling of the bottom shell 12.

[0071] As one implementation manner, the buffer member 40 extends along the edge of the cover plate 21 and is hermetically connected between the cover plate 21 and the bottom shell 12. In this way, the air guiding channel 201 is sealed through the buffer member 40, avoiding air leakage of the air guiding channel 201 due to the installation gap between the cover plate 21 and the bottom shell 12.

[0072] Optionally, the buffer member 40 extends along the extension path of the side part 212 and covers the side part 212 to improve the connection stability between the cover plate 21 and the bottom shell 12 and the airtightness of the air guiding channel 201.

[0073] In other embodiments, the buffer member 40 can also be a non-solid structure such as a spring, and a plurality of buffer members 40 can also be arranged at intervals along the edge of the side part 212, which is not limited here.

[0074] It should be noted that in this embodiment, the thickness of the side portion 212 is smaller than the thickness of the current side portion 212, and the sum of the thickness of the side portion 212 and the thickness of the buffer member 40 can be substantially the same as the thickness of the current side portion 212, that is, the thickness of the air guiding channel 201 remains unchanged after the buffer member 40 is provided, so as to prevent the buffer member 40 from occupying the thickness of the device main body 10.

[0075] Optionally, the buffer member 40 can be a rubber strip, foam, etc. When the side portion 212 and the bottom case 12 clamp the buffer member 40, the buffer member 40 can be compressed to strengthen the sealing of the air guiding channel 201 and improve the connection stability of the buffer member 40 between the cover plate 21 and the bottom case 12. The rubber strip can also be bonded between the side portion 212 and the bottom case 12.

[0076] Optionally, the buffer member 40 can also be an adhesive layer. The adhesive layer can be formed by a structural adhesive, such as a back glue, or can also be formed by a liquid glue, such as glue. The glue has elasticity after curing. During installation, glue can be first applied to the side portion 212, and then the cover plate 21 and the bottom case 12 are joined. At this time, the glue bonds the side portion 212 and the bottom case 12 and has a certain thickness. After the glue cures, it forms the buffer member 40. The buffer member 40 can not only buffer the fan 20 but also realize the fixed connection between the fan 20 and the bottom case 12.

[0077] It should be noted that the fan 20 and the bottom case 12 can be pre-fixed through the adhesive layer first, and then the connection between the ear portion 213 and the connection post 121 is realized through the locking member, so that the cover plate 21 and the bottom case 12 are closely attached. Of course, the fan 20 can also be fixedly connected only through the adhesive layer without connecting the ear portion 213 and the bottom case 12.

[0078] In other embodiments, the buffer member 40 can also be provided between the upper cover portion 211 and the bottom case 12, or between the ear portion 213 and the bottom case 12 (or the connection post 121), and there is no limitation here.

[0079] In some embodiments, the cover plate 21 and the bottom case 12 are in clearance fit to reduce air leakage in the air guiding channel 201 and at the same time achieve rapid installation of the fan 20 and the bottom case 12. It can be understood that for the fan 20 with relatively slight vibration in the operating state, the cover plate 21 can be directly in sealing abutment with the bottom case 12 to improve the sealing performance of the air guiding channel 201. For an ordinary fan 20, a tiny gap may also be provided between the cover plate 21 and the bottom case 12. This gap can be used to accommodate tolerances and reserve a certain vibration space for the fan 20. The distance between the impeller 22 and the bottom case 12 can be equal to the distance between the impeller 22 and the bottom plate in the current fan 20, or slightly greater than the distance between the current impeller 22 and the bottom plate. It should be noted that this embodiment is applied to electronic devices with good fit in the area of the bottom case 12 opposite to the cover plate 21 (such as good flatness at the joint of the two) or with low requirements for the overall sealing of the machine. At this time, since no buffer member needs to be provided, materials can be saved and costs can be reduced.

[0080] Finally, it should be noted that the above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: The device body comprises a main body component and a bottom shell connected to each other, wherein the device body forms a heat dissipation space, the bottom shell is provided with at least one air inlet hole connected to the heat dissipation space, and a connecting column is protruded from a side of the bottom shell facing the main body component; the main body component comprises an upper shell, a bracket and a main board, the upper shell is connected to the bottom shell, and together they are formed to form a receiving cavity, the bracket and the main board are both located in the receiving cavity, the bracket is connected to the upper shell, the heat dissipation space is formed between the bracket and the bottom shell, the main board is connected to a side of the bracket facing away from the upper shell, and the air outlet faces the main board; The fan comprises a cover plate and an impeller, the cover plate being connected to the device body, the cover plate and the bottom shell being jointly arranged to form an air guide channel, the air inlet hole forming an air inlet of the air guide channel, and the air outlet of the air guide channel facing the heat dissipation space, the impeller being rotatably connected to the cover plate and being located in the air guide channel, the cover plate being connected to the bottom shell, wherein the cover plate comprises an upper cover portion, a side portion connected to the upper cover portion and an ear portion connected to the side portion, the upper cover portion being in the shape of a flat plate, the side portion extending along the edge of the upper cover portion, a notch being formed between two extending ends of the side portion, the notch facing the heat dissipation space, and the air flow in the air guide channel being blown toward the notch from the air inlet, the impeller being rotatably connected to the upper cover portion, the ear portion protruding from a side of the side portion facing away from the air guide channel, the ear portion being fixedly connected to the device body, and the ear being provided with a plurality of, A plurality of ears are arranged around the upper cover, and the ears are connected to the extending end of the connecting column away from the bottom shell; the electronic device also includes an elastic buffer, the cover plate and the bottom shell jointly clamp the buffer, the buffer is extended along the edge of the cover plate and is sealed between the cover plate and the bottom shell, the bottom shell has an air inlet area, a plurality of air inlet holes are opened, and the plurality of air inlet holes are all located in the air inlet area, the air inlet area is directly opposite to the impeller, the cover plate is covered in the air inlet area, the bracket is opened with an avoidance hole, and the cover plate is penetrated through the avoidance hole; the electronic device also includes a display body, the display body includes a display end shell rotatably connected to the device body and a display screen connected to the display end shell, the main body component also includes a keyboard connected to the bracket, the upper shell is opened with a positioning hole, and the keys of the keyboard are penetrated through the positioning hole.

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