Chip transfer device

Abstract

The present application relates to the technical field of automation equipment, and discloses a chip transfer device. The chip transfer device includes a frame and a material tube feeding mechanism, a chip sorting mechanism and a chip transfer mechanism arranged on the frame. The material tube feeding mechanism is used to transfer the material tube to the chip sorting mechanism; the chip sorting mechanism includes a fixing unit, a blowing unit and a transfer unit. The fixing unit is used to fix the material tube transferred by the material tube feeding mechanism. The blowing unit and the transfer unit are respectively arranged at the opposite ends of the fixing unit along the first horizontal direction. The blowing unit is used to be opposite to the end of the material tube and is used to blow the chip in the material tube to the transfer unit; the chip transfer mechanism is used to transfer the chip on the transfer unit to the tray. The chip transfer device provided in the present application can transfer the chips stored in the material tube to the tray, realizes the full process automation of chip loading, sorting and transfer, and solves the technical problem of low efficiency of manual operation in the prior art.

Description

Technical Field

[0001] The present application relates to the technical field of automation equipment, and in particular to a chip transfer device. Background Art

[0002] Chip manufacturing includes three major steps: chip design, chip manufacturing and packaging testing. Among them, chip packaging testing includes chip packaging, chip packaging and chip testing.

[0003] Common chip packaging forms include dual in-line package (DIP), ball grid array (BGA), chip scale package (CSP) and other types. Depending on the packaging form, the packaged chips are packaged in tubes and trays. For chips packaged in tubes, in order to achieve subsequent complex high and low temperature tests, they usually need to be converted into tray packaging. At present, the transfer of tube chips to trays is usually done manually, which is inefficient and cannot meet production needs. Summary of the invention

[0004] The purpose of the present application is to provide a chip transfer device to solve the technical problem of low efficiency of manual chip transfer in related technologies.

[0005] To solve the above-mentioned problems, the present application provides a chip transfer device, comprising a frame and a material tube feeding mechanism, a chip sorting mechanism and a chip transfer mechanism arranged on the frame; the material tube feeding mechanism is used to transfer the material tube to the chip sorting mechanism; the chip sorting mechanism comprises a fixing unit, a blowing unit and a transfer unit, the fixing unit is used to fix the material tube transferred by the material tube feeding mechanism, the blowing unit and the transfer unit are respectively arranged at opposite ends of the fixing unit along a first horizontal direction, the blowing unit is used to be opposite to the end of the material tube and to blow the chips in the material tube to the transfer unit; the chip transfer mechanism is used to transfer the chips on the transfer unit to a tray.

[0006] In one embodiment, the fixing unit includes at least one fixing platform, and the fixing platform includes a first fixing portion and a second fixing portion that are arranged opposite to each other, and the first fixing portion and the second fixing portion can move relatively to clamp or release the material tube together.

[0007] In one embodiment, the blowing unit comprises a blowing head, and the blowing head is arranged between the first fixing part and the second fixing part of one of the fixing platforms, and the fixing platform is also used to clamp the end of the material tube.

[0008] In one embodiment, the transfer unit includes a first driving member and a plurality of chip storage platforms, wherein the plurality of chip storage platforms are movably arranged on the frame and distributed along a second horizontal direction, and the first driving member is connected to the chip storage platform and is used to drive the chip storage platform to move along the second horizontal direction; the second horizontal direction intersects with the first horizontal direction.

[0009] In one embodiment, the transfer unit also includes a second driving member and a mounting plate, the mounting plate is movably arranged on the frame, the first driving member is connected to the mounting plate and is used to drive the mounting plate to move along the second horizontal direction; the chip storage table is rotatably arranged on the mounting plate, the second driving member is connected to the chip storage table and is used to drive the chip storage table to rotate.

[0010] In one embodiment, a mounting hole is provided on the mounting plate, and the chip storage platform includes a storage portion, a mounting portion and a gear connecting portion, the mounting portion is inserted into the mounting hole, one end of the mounting portion is connected to the storage portion, and the other end is connected to the gear connecting portion; the second driving member includes a linear driving member and a rack, the linear driving member is connected to the rack and is used to drive the rack to move along the second horizontal direction, and the rack is meshed with the gear connecting portion and is used to drive the gear connecting portion to rotate.

[0011] In one embodiment, the chip sorting mechanism further includes a conveying pipe, which is disposed between the fixed unit and the transfer unit and extends along the first horizontal direction, and is used to connect the material pipe at the fixed unit and the transfer unit.

[0012] In one embodiment, the chip transfer mechanism includes a first slide rail, a nozzle assembly and a third driving member. The first slide rail is mounted above the transfer unit, and the nozzle assembly is slidably set on the slide rail. The nozzle assembly includes a plurality of nozzles. The plurality of nozzles can be raised and lowered relative to the first slide rail and are used to take and place the chips. The third driving member is connected to the nozzle assembly and is used to drive the nozzle assembly to move along the first slide rail so that the plurality of nozzles can move between the transfer unit and the tray.

[0013] In one embodiment, the suction nozzle assembly includes a fixed plate and a fourth driving member, the fixed plate is slidably set on the first slide rail and connected to the third driving member, a plurality of suction nozzles are movably set on the fixed plate, and the fourth driving member is connected to at least one of the suction nozzles and is used to drive the suction nozzle to move to adjust the distance between adjacent suction nozzles.

[0014] In one embodiment, it also includes a material pipe storage assembly, which includes a material pipe storage rack and a first lifting mechanism arranged on the frame, the material pipe storage rack is used to stack and store multiple material pipes, and the first lifting mechanism is used to lift the material pipes in the material pipe storage rack; the material pipe feeding mechanism includes a transfer rack, and the transfer rack is provided with a card slot for accommodating the material pipes. The transfer rack can be slidably arranged on the frame and can be moved to the bottom of the material pipe storage rack, and the transfer rack is used to transfer the material pipes in the material pipe storage rack to the fixed unit.

[0015] In one embodiment, a material pipe recovery box is further included. The material pipe recovery box and the material pipe storage rack are respectively arranged on opposite sides of the fixed unit, and the transfer rack is also used to push the material pipe at the fixed unit into the material pipe recovery box.

[0016] In one embodiment, it also includes a pallet feeding mechanism, which includes a pallet storage unit, a pallet recovery unit and a conveyor belt arranged on the frame, the pallet storage unit is used to store the pallet, the pallet recovery unit is used to recover the pallet, the conveyor belt is arranged between the pallet storage unit, the pallet recovery unit and the loading area on the frame, and the conveyor belt is used to transport the pallet between the pallet storage unit, the pallet recovery unit and the loading area on the frame.

[0017] In one embodiment, the pallet storage unit includes a pallet storage rack mounted above the conveyor belt and a second lifting mechanism, the second lifting mechanism being used to lift the pallets stacked in the pallet storage rack; the pallet recovery unit includes a pallet recovery rack mounted above the conveyor belt and a third lifting mechanism, the pallet recovery rack is arranged adjacent to the pallet storage rack, and the third lifting mechanism is used to lift the pallets stacked in the pallet recovery rack.

[0018] In one embodiment, the tray feeding mechanism also includes a second slide rail and a transfer plate, the second slide rail is arranged adjacent to the conveyor belt, the transfer plate can be slidably arranged on the second slide rail and is used to place the tray, and the conveyor belt is connected to the transfer plate and is used to drive the transfer plate to move along the second slide rail.

[0019] The chip transfer device provided in the present application includes a frame and a material tube feeding mechanism, a chip sorting mechanism and a chip transfer mechanism arranged on the frame. Among them, the material tube feeding mechanism is used to transfer the material tube to the chip sorting mechanism, so as to realize the automatic loading of the material tube and the chip; the chip sorting mechanism includes a fixing unit, a blowing unit and a transfer unit, the fixing unit is used to fix the material tube transferred by the material tube feeding mechanism, the blowing unit and the transfer unit are respectively arranged at the opposite ends of the fixing unit along the first horizontal direction, the blowing unit is used to be opposite to the end of the material tube and used to blow the chip in the material tube to the transfer unit, the fixing unit, the blowing unit and the transfer unit are used in combination to remove the chip from the material tube, so as to realize the automatic sorting of the chip; the chip transfer mechanism is used to transfer the chip on the transfer unit to the tray, so as to realize the automatic transfer of the chip. The above-mentioned chip transfer device realizes the full process automation of chip loading, sorting and transferring, and effectively improves the efficiency of chip transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of a chip transfer device provided in an embodiment of the present application;

[0022] Figure 2 for Figure 1 The schematic diagram of the structure of the chip transfer device without the protective cover is shown;

[0023] Figure 3 for Figure 2 The schematic diagram of the structure of the chip transfer device shown in another perspective;

[0024] Figure 4 for Figure 2 The schematic diagram of the structure of the chip transfer device shown in another viewing angle;

[0025] Figure 5 for Figure 4 A partial enlarged view of the transfer unit;

[0026] Figure 6 for Figure 4 Schematic diagram of the structure of the transfer unit.

[0027] Description of main component symbols:

[0028] 100. Chip transfer device; 200. Material tube; 300. Tray;

[0029] 1. Frame;

[0030] 2. Material pipe feeding mechanism; 21. Transfer rack;

[0031] 3. Chip sorting mechanism; 31. Air blowing unit; 32. Fixing unit; 321. First fixing part; 322. Second fixing part; 33. Transfer unit; 331. First driving member; 332. Chip storage table; 3321. Storage part; 3322. Mounting part; 3323. Gear connecting part; 3324. Storage slot; 333. Mounting plate; 334. Second driving member; 3341. Linear driving member; 3342. Rack; 34. Delivery pipe;

[0032] 4. Chip transfer mechanism; 41. First slide rail; 42. Suction nozzle assembly; 421. Suction nozzle; 422. Fixing plate; 423. Fourth driving member; 43. Third driving member;

[0033] 5. Material tube storage assembly; 51. Material tube storage rack;

[0034] 6. Material tube recycling box;

[0035] 7. Pallet feeding mechanism; 71. Pallet storage unit; 711. Pallet storage rack; 72. Pallet recovery unit; 721. Pallet recovery rack; 73. Conveyor belt; 74. Limiting block; 75. Second slide rail;

[0036] 81. Interactive module; 82. Protective cover. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0038] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly or indirectly disposed on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the patent. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0039] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0040] The present application provides a chip transfer device for transferring chips stored in a material tube to a tray.

[0041] like Figure 1 and Figure 2 As shown, the chip transfer device 100 provided in the present application includes a frame 1 and a material pipe feeding mechanism 2, a chip sorting mechanism 3 and a chip transfer mechanism 4 arranged on the frame 1. The material pipe feeding mechanism 2 is used to transfer the material pipe 200 to the chip sorting mechanism 3. The chip sorting mechanism 3 includes a blowing unit 31, a fixing unit 32 and a transfer unit 33. The fixing unit 32 is used to fix the material pipe 200 transferred by the material pipe feeding mechanism 2. The blowing unit 31 and the transfer unit 33 are arranged along a first horizontal direction (such as Figure 2 The blowing unit 31 is used to be opposite to the end of the material tube 200 and is used to blow the chips in the material tube 200 to the transfer unit 33. The chip transfer mechanism 4 is used to transfer the chips on the transfer unit 33 to the tray 300.

[0042] The material tube feeding mechanism 2 is used to provide a material tube 200 to the chip sorting mechanism 3 , and a plurality of chips to be transferred are stored in the material tube 200 .

[0043] The chip sorting mechanism 3 is used to take out the chips stored in the material tube 200. Specifically, the fixing unit 32 fixes the material tube 200 between the blowing unit 31 and the transfer unit 33, so that the material tube 200 extends along the first horizontal direction, and one end of the material tube 200 faces the blowing unit 31, and the other end faces the transfer unit 33. The blowing unit 31 blows high-pressure gas into the material tube 200 to push the chips in the material tube 200 to the transfer unit 33. The blowing pressure of the blowing unit 31 can be adjusted according to parameters such as the number of chips in the material tube 200 and the length of the material tube 200.

[0044] The chip transfer device 100 provided in the present application includes a frame 1 and a material pipe feeding mechanism 2 , a chip sorting mechanism 3 and a chip transporting mechanism 4 arranged on the frame 1 . Among them, the material tube feeding mechanism 2 is used to transfer the material tube 200 to the chip sorting mechanism 3, so as to realize the automatic loading of the material tube 200 and the chip; the chip sorting mechanism 3 includes a blowing unit 31, a fixing unit 32 and a transfer unit 33, the fixing unit 32 is used to fix the material tube 200 transferred by the material tube feeding mechanism 2, the blowing unit 31 and the transfer unit 33 are respectively arranged at the opposite ends of the fixing unit 32 along the first horizontal direction, the blowing unit 31 is used to be opposite to the end of the material tube 200 and used to blow the chip in the material tube 200 to the transfer unit 33, the fixing unit 32, the blowing unit 31 and the transfer unit 33 are used in combination to take the chip out of the material tube 200, so as to realize the automatic sorting of the chip; the chip transfer mechanism 4 is used to transfer the chip on the transfer unit 33 to the tray 300, so as to realize the automatic transfer of the chip. The above chip transfer device 100 realizes the full process automation of chip loading, sorting and transfer, and effectively improves the efficiency of chip transfer.

[0045] It can be understood that sealing plugs are usually provided at both ends of the material tube 200 to prevent the chips from slipping out. Before transferring the material tube 200 to the chip sorting mechanism 3, the sealing plug on at least one side needs to be removed. Since the sealing plug is only used to prevent the chips from slipping out and does not have a sealing function, the remaining sealing plug and the chips can be blown out together by the blowing unit 31. At the chip sorting mechanism 3, the fixing unit 32 fixes the material tube 200 along the first horizontal direction, and can also eliminate the influence of gravity on chip sorting.

[0046] In the embodiments provided in this application, Figure 2 As shown, the fixing unit 32 includes at least one fixing platform, and the fixing platform includes a first fixing portion 321 and a second fixing portion 322 that are arranged opposite to each other. The first fixing portion 321 and the second fixing portion 322 can move relatively to clamp or release the material tube 200 together.

[0047] The first fixing portion 321 and the second fixing portion 322 may be arranged in different ways. Optionally, in one embodiment, the first fixing portion 321 and the second fixing portion 322 are arranged to move along the vertical direction, and the first fixing portion 321 and the second fixing portion 322 may move closer to each other to clamp the material tube 200, or may move away from each other to loosen the material tube 200.

[0048] The fixing unit 32 has a simple structure, can be used to fix the material pipe 200 , and can adjust the fixing position of the material pipe 200 .

[0049] It can be understood that in some embodiments, the first fixing portion 321 and the second fixing portion 322 can also be movably arranged in the horizontal direction, or the material tube 200 can also be fixed by structures such as clamps and mechanical arms. The specific design can be made according to actual conditions and is not limited here.

[0050] In the embodiments provided in the present application, the number and arrangement of the fixed stations are not unique.

[0051] Optionally, in one embodiment, the fixing unit 32 includes two fixing platforms, the two fixing platforms are arranged at intervals along the first horizontal direction, and the two fixing platforms are used to clamp two ends of the material tube 200 respectively.

[0052] In the embodiment provided in the present application, the blowing unit 31 includes a blowing head, which is arranged between a first fixing portion 321 and a second fixing portion 322 of a fixing platform, and the fixing platform is also used to clamp the end of the material tube 200 .

[0053] The blowing head is connected to one end of the material pipe 200 and is used to blow high-pressure gas into the material pipe 200 to blow the chips in the material pipe 200 to the transfer unit 33 .

[0054] Using a fixed platform to simultaneously press the blowing head and the end of the material tube 200 is beneficial to improving the alignment between the blowing head and the end of the material tube 200 and creating a sealed environment, so that the blowing head can smoothly blow out the chips in the material tube 200.

[0055] In the embodiment provided in the present application, elastic members may be further provided on the clamping surfaces of the first fixing portion 321 and the second fixing portion 322 to improve the air tightness between the blowing head and the end of the material pipe 200 .

[0056] In the embodiments provided in this application, Figure 4 and Figure 5 As shown, the transfer unit 33 includes a first driving member 331 and a plurality of chip storage platforms 332. The plurality of chip storage platforms 332 are movably disposed on the rack 1 and along the second horizontal direction (eg Figure 4 The first driving member 331 is connected to the chip storage platform 332 and is used to drive the chip storage platform 332 to move along the second horizontal direction. The second horizontal direction intersects with the first horizontal direction.

[0057] The chip storage platform 332 is used to receive the chip removed from the material tube 200, and one chip is stored in one chip storage platform 332. The first driving member 331 drives the chip storage platform 332 to move, so that different chip storage platforms 332 can be aligned with the material tube 200 in sequence.

[0058] In one embodiment, the first horizontal direction is perpendicular to the second horizontal direction.

[0059] By setting up a chip storage table 332, the chips at the transfer unit 33 can be arranged regularly, thereby reducing the difficulty of the chip transfer mechanism 4 to pick up the chips; and by setting up a first driving member 331 and using the first driving member 331 to drive the chip storage table 332 to move, continuous chip sorting can be achieved, thereby improving the chip transfer efficiency.

[0060] In the embodiments provided in this application, Figure 5 and Figure 6 As shown, the transfer unit 33 also includes a second driving member 334 and a mounting plate 333, the mounting plate 333 is movably arranged on the frame 1, and the first driving member 331 is connected to the mounting plate 333 and is used to drive the mounting plate 333 to move along the second horizontal direction. The chip storage platform 332 is rotatably arranged on the mounting plate 333, and the second driving member 334 is connected to the chip storage platform 332 and is used to drive the chip storage platform 332 to rotate.

[0061] The first driving member 331 includes, but is not limited to, a linear slide mechanism, a lead screw transmission mechanism, and a belt driving mechanism. Optionally, in one embodiment, the first driving member 331 includes a belt and a driving motor, the belt is extended along the second horizontal direction and connected to the mounting plate 333, and the driving motor drives the belt to perform a rotary motion and drives the mounting plate 333 to reciprocate along the second horizontal direction.

[0062] The second driving member 334 drives the chip storage platform 332 and the chip disposed on the chip storage platform 332 to rotate synchronously, so as to achieve chip angle adjustment, for example, rotating the chip 90°, 180°, 270° on the horizontal plane, so that the chip can be transferred to the tray 300 for storage at different angles.

[0063] In the embodiments provided in this application, Figure 5 and Figure 6 As shown, a mounting hole is provided on the mounting plate 333, and the chip storage platform 332 includes a storage portion 3321, a mounting portion 3322 and a gear connecting portion 3323. The mounting portion 3322 is inserted into the mounting hole, and one end of the mounting portion 3322 is connected to the storage portion 3321, and the other end is connected to the gear connecting portion 3323. The second driving member 334 includes a linear driving member 3341 and a rack 3342. The linear driving member 3341 is connected to the rack 3342 and is used to drive the rack 3342 to move along the second horizontal direction. The rack 3342 is meshed with the gear connecting portion 3323 and is used to drive the gear connecting portion 3323 to rotate.

[0064] The storage portion 3321 is provided with a receiving groove 3324 for storing chips. The receiving groove 3324 has an opening. The opening of the receiving groove 3324 is used to face the material tube 200 to receive the chips removed from the material tube 200 .

[0065] The mounting portion 3322 is a cylindrical structure, and the outer wall of the mounting portion 3322 and the inner wall of the mounting hole are provided with matching thread structures, and the mounting portion 3322 is threadedly connected with the mounting hole. The mounting portion 3322 can rotate in the mounting hole in a clockwise direction or a counterclockwise direction.

[0066] The storage portion 3321 , the mounting portion 3322 and the gear connecting portion 3323 are integrally arranged, and the rack 3342 is meshed with the gear connecting portions 3323 of the plurality of chip storage platforms 332 , and can drive the plurality of chip storage platforms 332 to rotate synchronously.

[0067] In the embodiments provided in this application, Figure 2 and Figure 5 As shown, the chip classification mechanism 3 further includes a conveying pipe 34 , which is disposed between the fixing unit 32 and the transfer unit 33 and extends along a first horizontal direction. The conveying pipe 34 is used to connect the material pipe 200 at the fixing unit 32 with the transfer unit 33 .

[0068] Optionally, in one embodiment, the fixing unit 32 includes two fixing platforms, one fixing platform clamps the blowing unit 31 , and the other fixing platform is connected to the conveying pipe 34 .

[0069] By providing the conveying pipe 34 and spacing the transfer unit 33 from the fixing unit 32 , the risk of interference between the structures during the material pipe 200 transportation, chip granulation and material transfer process can be reduced.

[0070] In the embodiments provided in this application, Figure 3 and Figure 4 As shown, the chip transfer mechanism 4 includes a first slide rail 41, a nozzle assembly 42 and a third driving member 43. The first slide rail 41 is mounted above the transfer unit 33, and the nozzle assembly 42 is slidably arranged on the slide rail. The nozzle assembly 42 includes a plurality of nozzles 421, and the plurality of nozzles 421 can be raised and lowered relative to the first slide rail 41 and are used to take and place chips. The third driving member 43 is connected to the nozzle assembly 42 and is used to drive the nozzle assembly 42 to move along the first slide rail 41, so that the plurality of nozzles 421 move between the transfer unit 33 and the tray 300.

[0071] In some embodiments, the first slide rail 41 extends along the second horizontal direction.

[0072] The frame 1 includes a tray 300 loading area (such as Figure 4 The first slide rail 41 is disposed between the transfer unit 33 and the loading area. The nozzle assembly 42 moves along the first slide rail 41 to transfer the chips at the transfer unit 33 to the empty tray 300 in the loading area.

[0073] On the one hand, the suction nozzle assembly 42 uses the suction force generated by negative pressure to absorb the chip, which is not easy to scratch the chip or damage the chip pins during the picking and placing process, and the chip is not easy to fall off during the transportation process, and the reliability is high; on the other hand, the above-mentioned chip transportation mechanism 4 can realize point-to-point high-speed picking and placing operations of the chip, and the operation efficiency is high.

[0074] In the embodiments provided in this application, Figure 4 As shown, the suction nozzle assembly 42 includes a fixed plate 422 and a fourth driving member 423. The fixed plate 422 is slidably set on the first slide rail 41 and connected to the third driving member 43. A plurality of suction nozzles 421 are movably set on the fixed plate 422. The fourth driving member 423 is connected to at least one suction nozzle 421 and is used to drive the suction nozzle 421 to move to adjust the distance between adjacent suction nozzles 421.

[0075] like Figure 2 and Figure 4 As shown, the plurality of suction nozzles 421 are distributed along the second horizontal direction, and the fourth driving member 423 is used to drive the plurality of suction nozzles 421 to move along the second horizontal direction.

[0076] The nozzle assembly 42 is provided with a number of nozzles 421 that are not unique. Optionally, in one embodiment, the transfer unit 33 includes four chip storage tables 332, and the nozzle assembly 42 includes four nozzles 421, and the nozzle assembly 42 can suck all the chips stored in the transfer unit 33 at one time.

[0077] A linear slide rail is arranged on the fixed plate 422 , and a plurality of suction nozzles 421 are slidably arranged on the linear slide rail through a slider. The third driving member 43 includes but is not limited to a driving motor, and the third driving member 43 can drive the plurality of suction nozzles 421 to move on the linear slide rail.

[0078] The spacing between the multiple suction nozzles 421 is adjustable, and can be compatible with trays 300 of different spacing sizes, and can be compatible with transfer units 33 of different sizes, so that the chips can be transferred according to the design requirements.

[0079] In the embodiment provided in the present application, a spring buffer is also provided on the suction nozzle 421 to reduce the damage to the chip caused by high-speed movement.

[0080] In the embodiments provided in this application, Figure 1 and Figure 2 As shown, a protective cover 82 is also provided on the rack 1, and the protective cover 82 is provided on the transfer unit 33 and the loading area to provide further protection for the chips.

[0081] In the embodiment provided in the present application, the chip transfer device 100 further includes a lens module (not shown). The lens module is arranged on the frame 1 and aligned with the transfer unit 33, and is used to locate the chip storage table 332 and the suction nozzle assembly 42, thereby improving the accuracy of the suction nozzle assembly 42 in sucking the chip.

[0082] In the embodiments provided in this application, Figure 2 and Figure 4 As shown, the chip transfer device 100 also includes a material tube storage assembly 5, which includes a material tube storage rack 51 and a first lifting mechanism (not shown) arranged on the frame 1. The material tube storage rack 51 is used to stack and store multiple material tubes 200, and the first lifting mechanism is used to lift the material tubes 200 in the material tube storage rack 51. The material tube feeding mechanism 2 includes a transfer rack 21, on which a card slot for accommodating the material tube 200 is arranged. The transfer rack 21 is slidably arranged on the frame 1 and located at the bottom of the material tube storage rack 51. The transfer rack 21 is used to transfer the material tube 200 in the material tube storage rack 51 to the fixed unit 32. The material tube feeding mechanism 2 also includes a slide rail for installing the transfer rack 21 and a driving motor for driving the transfer rack 21 to slide.

[0083] The material pipes 200 in the material pipe storage rack 51 are stacked and stored in a vertical direction, and the first lifting mechanism is against the material pipe 200 at the bottom and can lift the material pipe 200 to a certain height.

[0084] The transfer rack 21 can move to the bottom of the material tube 200 in the material tube storage rack 51, and the card slot on the transfer rack 21 can store one material tube 200. The transfer rack 21 moves toward the fixing unit 32, and can take the material tube 200 stored in the card slot out of the material tube storage rack 51. The bottom end of the material tube storage rack 51 is also provided with an opening for the material tube 200 to pass through. It can be understood that when the transfer rack 21 transfers the material tube 200 at the bottom out, the material tube 200 in the material tube storage rack 51 falls as a whole and is lifted by the first lifting mechanism.

[0085] The number of material tubes 200 that can be stored in the material tube storage rack 51 is related to the height of the material tube storage rack 51. Optionally, in one embodiment, in order to ensure chip transfer efficiency, at least 30 material tubes 200 are arranged in the material tube storage rack 51.

[0086] In the embodiment provided in the present application, the chip transfer device 100 also includes a material tube recovery box 6, and the material tube recovery box 6 and the material tube storage rack 51 are respectively arranged on opposite sides of the fixed unit 32, and the transfer rack 21 is also used to push the material tube 200 at the fixed unit 32 into the material tube recovery box 6.

[0087] After the transfer rack 21 transfers the material tube 200 to the fixing unit 32, the two ends of the material tube 200 are clamped by the fixing table. The fixing table moves upward in the vertical direction, and the material tube 200 can be lifted to a certain height and separated from the transfer rack 21; after the transfer rack 21 retreats a certain distance, the fixing table moves downward in the vertical direction, and the material tube 200 can be aligned with the blowing unit 31 and the conveying pipe 34. After all the chips in the material tube 200 are removed, the first fixing part 321 and the second fixing part 322 of the fixing table are separated, and the locking of the material tube 200 is released, and then the transfer rack 21 moves toward the material tube recovery box 6, and the material tube 200 can be pushed into the material tube recovery box 6.

[0088] By adopting the above design, the automatic loading and recycling of the material tube 200 can be realized, thereby further improving the automation level of the chip transfer device 100.

[0089] It can be understood that in some embodiments, a robotic arm can be used to grab the material tube 200 to complete the loading, fixing and recycling of the material tube 200. The specific design can be based on actual conditions and is not limited here.

[0090] In the embodiments provided in this application, Figure 2 , Figure 3 and Figure 4 As shown, the chip transfer device 100 also includes a tray feeding mechanism 7, which includes a tray storage unit 71, a tray recovery unit 72 and a conveyor belt 73 arranged on the frame 1, the tray storage unit 71 is used to store the tray 300, the tray recovery unit 72 is used to recover the tray 300, and the conveyor belt 73 is arranged between the tray storage unit 71, the tray recovery unit 72 and the loading area on the frame 1, and the conveyor belt 73 is used to transport the tray 300 between the tray storage unit 71, the tray recovery unit 72 and the loading area on the frame 1.

[0091] The tray storage unit 71 is used to stack and store empty trays 300 , and the tray recovery unit 72 is used to recover the trays 300 on which chips are placed.

[0092] By adopting the above design, the tray 300 can be automatically loaded and recycled, thereby further improving the automation level of the chip transfer device 100.

[0093] In the embodiment provided in the present application, the pallet storage unit 71 includes a pallet storage rack 711 and a second lifting mechanism (not shown) mounted above the conveyor belt 73, and the second lifting mechanism is used to lift the pallets 300 stacked in the pallet storage rack 711. The pallet recovery unit 72 includes a pallet recovery rack 721 and a third lifting mechanism (not shown) mounted above the conveyor belt 73, and the pallet recovery rack 721 is arranged adjacent to the pallet storage rack 711, and the third lifting mechanism is used to lift the pallets 300 stacked in the pallet recovery rack 721.

[0094] Limiting blocks 74 are further provided at corresponding positions of the tray storage rack 711 and the tray recovery rack 721 . The limiting blocks 74 can abut against the bottom of the tray 300 to support the tray 300 .

[0095] Specifically, the second lifting mechanism and the third lifting mechanism are used to lift the pallet 300, and the limit block 74 is used to pop out and support the pallet 300 after the pallet 300 is lifted to a certain height, so that the pallet 300 is away from the surface of the frame 1, so that the conveyor belt 73 can transfer the pallet 300 under the pallet storage rack 711 and the pallet recovery rack 721.

[0096] With the above design, the pallet storage rack 711, the pallet recovery rack 721 and the conveyor belt 73 are reasonably arranged, which is conducive to improving the transfer efficiency of the pallet 300.

[0097] In the embodiment provided in the present application, the tray feeding mechanism 7 also includes a second slide rail 75 and a transfer plate (not shown in the figure). The second slide rail 75 is arranged adjacent to the conveyor belt 73. The transfer plate can be slidably arranged on the second slide rail 75 and is used to place the tray 300. The conveyor belt 73 is connected to the transfer plate and is used to drive the transfer plate to move along the second slide rail 75.

[0098] Optionally, in one embodiment, second slide rails 75 are respectively arranged on opposite sides of the conveyor belt 73, and the second slide rails 75 are arranged parallel to the conveyor belt 73 and extend along the first horizontal direction. The second slide rails 75 are respectively connected to the two sides of the transfer plate, and the conveyor belt 73 is connected to the middle.

[0099] By using the second slide rail 75 and the transfer plate, the tray 300 can be smoothly transferred between the tray storage rack 711, the tray recovery rack 721 and the loading area of ​​the rack 1, reducing the wind direction of the tray 300 leaving the conveyor belt 73, which is beneficial to the subsequent chip transfer.

[0100] It can be understood that in some embodiments, a robotic arm transfer pallet 300 can also be used, and the specific design can be made according to actual conditions and is not limited here.

[0101] In the embodiment provided in the present application, the chip transfer device 100 further includes an interactive module 81 disposed on the frame 1, and the interactive module 81 includes but is not limited to a display screen, a voice unit, a keyboard and mouse assembly, an operation button, etc. The interactive module 81 is used to implement various parameter settings, status display, alarm processing, process monitoring, and other functions.

[0102] The embodiment of the present application also provides an automatic control system, which includes a system controller module, which is communicated with the material tube feeding mechanism 2, the chip sorting mechanism 3, and the chip transfer mechanism 4, and is used to control each module or mechanism to collaboratively complete the loading and recycling of the material tube 200, the chip sorting and transfer, and the loading and recycling of the tray 300.

[0103] The automatic control system also includes a data processing module for recording the operation data and production data of the chip dispensing device. The operation data includes the operation status of the device and the operation status of the operator, including but not limited to the device operation time and parameter adjustment time; the production data includes but not limited to the device transfer products, production efficiency and other data. The operation data and production data are stored in categories to facilitate subsequent management and query.

[0104] The automatic control system provided in the present application also interacts with an independent equipment automation programming (Equipment Automation Programming, EAP) system to achieve data exchange and functional linkage. The EAP system includes a material ID recognition module, a production scheduling ID recognition module, a data verification module and an equipment control module. For example, the material list and the production scheduling list are designed with a unique corresponding QR code ID. The material ID recognition module can recognize the QR code on the material list and parse the corresponding ID information. The production scheduling ID recognition module can recognize the QR code on the production scheduling list and parse the corresponding ID information. The data verification module is used to verify the ID information parsed by the material ID recognition module and the production scheduling ID recognition module. When the verification results are consistent, a running signal is sent through the equipment controller to start the chip transfer device 100. When the verification results are inconsistent, a lock signal is sent through the equipment controller to prohibit the chip transfer device 100 from being opened.

[0105] The whole working process of the chip transfer device 100 provided in this application includes:

[0106] S100. Provide a bill of materials and a production schedule, use the EAP system to input the QR code information on the bill of materials and the production schedule, and perform data verification on the information on the bill of materials and the production schedule to determine whether the materials can be put into production normally.

[0107] S200. After passing the inspection, the operator stacks the material tubes 200 storing the chips on the material tube storage rack 51. Multiple material tubes 200 can be stacked at one time, for example, 1 material tube 200 can be stored. The operator also stacks the empty pallets 300 on the pallet storage rack 711. Multiple empty pallets 300 can be stacked at one time, for example, 2 pallets 300 can be stored.

[0108] S300, after the materials are placed, the chip sorting device is controlled to start, and the feeding and recycling of the material tube 200, the chip sorting and transportation, and the feeding and recycling of the tray 300 are automatically completed.

[0109] Specifically, one material tube 200 stored in the material tube storage rack 51 is separated and transported to the fixed unit 32 of the chip sorting mechanism 3 by using the transfer rack; at the same time, a tray 300 stored in the tray storage rack 711 is separated and transported to the tray 300 loading area by using the conveyor belt 73, waiting for the chip to be picked up and placed; then, the blowing unit 31 is used to blow the chips in the material tube 200 at the fixed unit 32 into the conveying tube 34, so that the chips are neatly arranged one by one in the conveying tube 34; then, under the action of the blowing unit 31, the chips in the conveying tube 34 are blown one by one to the chip storage table 332. During the chip sorting process, the chip storage table 332 and the chips can be rotated at various angles by setting parameters; then, the nozzle assembly 42 is used to transfer the chips on the chip storage table 332 to the tray 300 in the tray 300 loading area, so as to realize a chip transfer operation.

[0110] After all the chips in the current material tube 200 are blown to the conveying tube 34 and the chip storage table 332, the empty material tube 200 needs to be recovered to the material tube recovery box 6 by using the transfer rack 21, and the material tube 200 loading and recovery process is repeated to ensure that there are sufficient chips to be sorted and transported at the chip sorting mechanism 3. Similarly, after the current tray 300 is full, the full tray 300 needs to be transported to the tray recovery rack 721 by using the conveyor belt 73, and the tray 300 loading and recovery process is repeated to ensure that the tray 300 can receive chips and realize uninterrupted chip transportation.

[0111] The system controller module effectively combines the above processes. Under the comprehensive coordination of the system controller module, each module and mechanism can complete its own actions in sequence until the chip transfer is completed. After the task is completed, the data processing module stores the operation data and completes data interaction with various auxiliary systems.

[0112] In summary, the chip transfer device 100 provided in the present application has the following beneficial effects:

[0113] 1. The chip transfer device 100 can realize the full process automation of chip loading, material sorting and material transfer, effectively improving the efficiency of chip transfer. At the same time, it can also reduce labor costs by replacing manual operations with automated equipment.

[0114] 2. The chip transfer device 100 can realize automation and information control, and the operation data and production data are stored in real time. The data is safe and traceable, which further improves the safety of the operation.

[0115] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A chip transfer device, characterized in that: It includes a frame and a material pipe feeding mechanism, a chip sorting mechanism and a chip transporting mechanism arranged on the frame; The material tube feeding mechanism is used to transfer the material tube to the chip sorting mechanism; The chip sorting mechanism includes a fixing unit, a blowing unit and a transfer unit, the fixing unit is used to fix the material tube transferred by the material tube feeding mechanism, the blowing unit and the transfer unit are respectively arranged at opposite ends of the fixing unit along the first horizontal direction, the blowing unit is used to be opposite to the end of the material tube and to blow the chips in the material tube to the transfer unit, the transfer unit includes a mounting plate, a first driving member, a second driving member and a plurality of chip storage tables, the mounting plate is movably arranged on the frame, the first driving member is connected to the mounting plate and is used to drive the mounting plate to move along the second horizontal direction, the chip storage table is rotatably arranged on the mounting plate, the second driving member is connected to the chip storage table and is used to drive the chip storage table to rotate, the chip storage table is provided with a storage slot for storing chips, and the second horizontal direction intersects with the first horizontal direction; The chip transfer mechanism is used to transfer the chip on the transfer unit to a tray.

2. The chip transfer device according to claim 1, characterized in that: The fixing unit includes at least one fixing platform, which includes a first fixing portion and a second fixing portion that are arranged opposite to each other, and the first fixing portion and the second fixing portion can move relatively to jointly clamp or loosen the material pipe; the blowing unit includes a blowing head, which is arranged between the first fixing portion and the second fixing portion of one of the fixing platforms, and the fixing platform is also used to clamp the end of the material pipe.

3. The chip transfer device according to claim 1, characterized in that: A mounting hole is provided on the mounting plate, and the chip storage platform includes a storage portion, a mounting portion and a gear connecting portion. The storage portion is provided with the storage groove, and the mounting portion is passed through the mounting hole. One end of the mounting portion is connected to the storage portion, and the other end is connected to the gear connecting portion; the second driving member includes a linear driving member and a rack, the linear driving member is connected to the rack and is used to drive the rack to move along the second horizontal direction, and the rack is meshed with the gear connecting portion and is used to drive the gear connecting portion to rotate.

4. The chip transfer device according to claim 1, characterized in that: The chip transfer mechanism includes a first slide rail, a nozzle assembly and a third driving member. The first slide rail is mounted above the transfer unit. The nozzle assembly is slidably disposed on the slide rail. The nozzle assembly includes a plurality of nozzles. The plurality of nozzles can be raised and lowered relative to the first slide rail and are used to take and place the chips. The third driving member is connected to the nozzle assembly and is used to drive the nozzle assembly to move along the first slide rail so that the plurality of nozzles can move between the transfer unit and the tray.

5. The chip transfer device according to claim 4, characterized in that: The suction nozzle assembly includes a fixed plate and a fourth driving member, the fixed plate is slidably set on the first slide rail and connected to the third driving member, a plurality of suction nozzles are movably set on the fixed plate, and the fourth driving member is connected to at least one of the suction nozzles and is used to drive the suction nozzle to move so as to adjust the distance between adjacent suction nozzles.

6. The chip transfer device according to claim 1, characterized in that: It also includes a material pipe storage component, which includes a material pipe storage rack and a first lifting mechanism arranged on the frame, the material pipe storage rack is used to stack and store multiple material pipes, and the first lifting mechanism is used to lift the material pipes in the material pipe storage rack; the material pipe feeding mechanism includes a transfer rack, and the transfer rack is provided with a card slot for accommodating the material pipes. The transfer rack can be slidably arranged on the frame and can be moved to the bottom of the material pipe storage rack, and the transfer rack is used to transfer the material pipes in the material pipe storage rack to the fixed unit.

7. The chip transfer device according to any one of claims 1 to 6, characterized in that: It also includes a pallet feeding mechanism, which includes a pallet storage unit, a pallet recovery unit and a conveyor belt arranged on the frame, the pallet storage unit is used to store the pallet, the pallet recovery unit is used to recover the pallet, the conveyor belt is arranged between the pallet storage unit, the pallet recovery unit and the loading area on the frame, and the conveyor belt is used to transport the pallet between the pallet storage unit, the pallet recovery unit and the loading area on the frame.

8. The chip transfer device according to claim 7, characterized in that: The pallet storage unit includes a pallet storage rack mounted above the conveyor belt and a second lifting mechanism, the second lifting mechanism being used to lift the pallets stacked in the pallet storage rack; the pallet recovery unit includes a pallet recovery rack mounted above the conveyor belt and a third lifting mechanism, the pallet recovery rack being arranged adjacent to the pallet storage rack, the third lifting mechanism being used to lift the pallets stacked in the pallet recovery rack.

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