A chip packaging structure with double-sided heat dissipation

Abstract

The present invention discloses a chip packaging structure with double-sided heat dissipation, which belongs to the field of chip heat dissipation technology. The structure comprises a substrate and a packaging material. A receiving hole is reserved on the packaging material. A heat conductive adhesive layer is formed in the receiving hole and on the surface of the substrate. The heat conductive adhesive layer contacts with a surface of the chip. A heat sink is arranged at the opening of the receiving hole. The inner surface of the heat sink is pressed against the surface of the chip. After the chip is accommodated in the receiving hole, a heat dissipation gap is formed between the inner wall of the receiving hole and the side of the chip. The present invention realizes effective heat dissipation of the chip away from a surface of the substrate through the provided heat sink, thereby ensuring the heat dissipation effect of the chip. The heat conductive adhesive layer transfers the heat of the other surface of the chip to the ambient space through the substrate, thereby enabling both surfaces of the chip to dissipate heat, i.e., realizing double-sided heat dissipation, thereby improving the heat dissipation efficiency.

Description

Technical Field

[0001] The invention relates to a chip packaging structure with double-sided heat dissipation, belonging to the technical field of chip heat dissipation. Background Art

[0002] With the rapid development of electronic technology, the performance and stability of chips as the core components of electronic devices directly determine the operation effect of the entire system. However, with the improvement of chip integration and enhanced functions, its heat dissipation problem has become increasingly prominent.

[0003] Traditional chip packaging adopts a single-sided heat dissipation packaging method. The heat dissipation capacity is limited by the area of ​​single-sided heat dissipation, which restricts the development of power chips to higher power density. Therefore, a double-sided heat dissipation chip packaging structure is proposed. Summary of the invention

[0004] The object of the present invention is to provide a chip packaging structure with double-sided heat dissipation to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned object, the present invention adopts the following technical solution: a chip packaging structure with double-sided heat dissipation, comprising a substrate and a packaging material, wherein the packaging material is fixedly arranged on the substrate, and a receiving hole for receiving the chip is reserved on the packaging material, the receiving hole is arranged to be through-through from top to bottom, and an opening of the receiving hole is against the substrate;

[0006] A thermal conductive adhesive is coated on the surface of the substrate inside the receiving hole and dried and solidified to form a thermal conductive adhesive layer 1, and the thermal conductive adhesive layer 1 contacts the surface of the chip 1 placed in the receiving hole to form a heat dissipation area. The heat generated by the chip can be effectively transferred to the substrate through the thermal conductive adhesive layer 1, thereby achieving heat dissipation;

[0007] A heat sink is arranged at an opening of the receiving hole and away from the substrate, and the inner surface of the heat sink is pressed against the surface of the chip to form another heat dissipation area;

[0008] The receiving hole is larger than the chip. When the chip is received in the receiving hole, a heat dissipation gap is formed between the inner wall of the receiving hole and the side of the chip.

[0009] Preferably, a plurality of bumps for pressing against the sides of the chip to fix the chip are evenly arranged on the inner walls around the receiving hole. As shown in the figure, the bumps are arranged vertically to ensure the stability of the position of the chip in the receiving hole. The heat dissipation gap is formed between adjacent bumps. The chip is placed inside the receiving hole, and the sides of the chip are pressed against and fixed by the bumps. The heat dissipation efficiency is improved by the bumps and the heat dissipation gap, thereby ensuring the stable operation of the chip.

[0010] Preferably, the interior of the heat dissipation gap is filled and cured with a second thermal conductive adhesive layer, and the upper portion of the second thermal conductive adhesive layer extends to the surface of the chip and bonds and fixes the heat sink. When the second thermal conductive adhesive layer is not cured, the heat sink is installed on the chip to ensure close contact between the heat sink and the chip.

[0011] Preferably, a conductive plate is provided between the substrate and the packaging material. The conductive plate is made of a plate pressed and formed with the material of the packaging material as the main board. Copper foil that can be electrically connected to the chip pins is laminated on one or both sides of the main board. A graphic circuit is pre-made on the copper foil, and the graphic circuit is used to transmit electrical signals. The side of the conductive plate extends to the inside of the accommodating hole, and the pins of the chip are electrically connected to the conductive plate.

[0012] Preferably, a pin connection hole is formed on the side of the conductive plate extending into the accommodating hole, and a through groove corresponding to the pin connection hole and having a larger hole diameter than the pin connection hole is formed on the side wall of the first thermal conductive adhesive layer.

[0013] Preferably, the radiator includes a cover plate, the outer surface of the cover plate is provided with a plurality of fins arranged in a criss-cross pattern, the fins and the cover plate are an integrally formed structure, and air-cooling gaps are formed between the fins. The main function of the fins is to increase the surface area of ​​the radiator, thereby increasing the heat dissipation efficiency. By increasing the surface area, the radiator can better exchange heat with the surrounding air and quickly dissipate heat.

[0014] Preferably, the inner surface of the cover plate is evenly distributed with a number of protrusions and press blocks pressed onto the chip, with gaps between adjacent press blocks, forming a mesh of uniform heat channels on the inner surface of the cover plate. The uniform heat channels contribute to uniform distribution and rapid transfer of heat. When the chip generates heat, the heat can not only be directly transferred to the fins through the press blocks, but can also be diffused on the core surface through these uniform heat channels, reducing the phenomenon of heat concentration.

[0015] Preferably, the heat sink completely covers the opening of the receiving hole, effectively protecting the chip from direct influences of the external environment, such as the intrusion of dust, moisture or other contaminants, and the outer surface of the heat sink is flush with the opening of the receiving hole. The outer surface of the heat sink is flush with the opening of the receiving hole, which can ensure that the heat exchange between the heat sink and the external environment is smoother. The absence of additional protrusions can reduce the resistance to air flow and improve the heat dissipation efficiency.

[0016] Compared with existing technologies:

[0017] 1. The present invention realizes effective heat dissipation of the chip away from one surface of the substrate by setting a heat sink, thereby ensuring the heat dissipation effect of the chip, and transfers the heat of the other surface of the chip to the ambient space through the substrate through the thermal conductive adhesive layer, so that both surfaces of the chip can dissipate heat, that is, double-sided heat dissipation is achieved, thereby improving the heat dissipation efficiency.

[0018] 2. The present invention helps to improve the heat dissipation efficiency by adding heat dissipation gaps. The heat dissipation gaps allow heat to be transferred and differentiated between the two surfaces of the chip. Especially when one side does not dissipate heat well, the heat can be dispersed to the other side through these heat dissipation gaps, thereby ensuring the stable operation of the chip.

[0019] 3. The present invention facilitates uniform distribution and rapid transfer of heat through heat channels. When the chip generates heat, the heat can not only be directly transferred to the fins through the pressing block, but also diffused on the chip surface through these heat channels, reducing the phenomenon of heat concentration, so that the radiator can more effectively absorb and disperse the heat generated by the chip, which helps to reduce the risk of local overheating of the chip and improve the overall heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the present invention.

[0021] Figure 2 It is a schematic diagram of the structure after a thermal conductive adhesive layer is coated in the accommodation hole of the present invention.

[0022] Figure 3 It is a schematic diagram of the structure after a chip is placed in the receiving hole of the present invention.

[0023] Figure 4 It is a schematic diagram of the structure after the second thermal conductive adhesive layer is filled in the receiving hole of the present invention.

[0024] Figure 5 It is a schematic diagram of the structure of the packaging material, bump and chip of the present invention.

[0025] Figure 6 It is a top view of the packaging material, bumps and chip of the present invention.

[0026] Figure 7 It is an exploded view of the substrate, packaging material and conductive plate of the present invention.

[0027] Figure 8 It is a schematic structural diagram of a substrate, packaging material, conductive plate and thermal conductive adhesive layer of the present invention.

[0028] Fig. 9 It is a schematic diagram of the structure of the cover plate and the fins of the present invention.

[0029] Fig.10 It is a schematic diagram of the structure of the cover plate and the pressing block of the present invention.

[0030] In the figure: 1, substrate, 2, packaging material, 201, receiving hole, 202, bump, 3, conductive plate, 301, pin connection hole, 4, thermal conductive adhesive layer 1, 401, through groove, 5, heat sink, 501, cover plate, 502, fin, 503, pressing block, 6, chip, 7, thermal conductive adhesive layer 2. DETAILED DESCRIPTION

[0031] The present invention is described below with specific embodiments, but they are not intended to be limiting of the invention.

[0032] Example 1

[0033] like Figure 1-Figure 10 As shown, in this embodiment, a double-sided heat dissipation chip packaging structure is provided, including a substrate 1 and a packaging material 2, the packaging material 2 is fixed on the substrate 1, and a receiving hole 201 for receiving the chip 6 is reserved on the packaging material 2, the receiving hole 201 is through-set from top to bottom, and an opening of the receiving hole 201 is against the substrate 1;

[0034] The inside of the receiving hole 201 and the surface of the substrate 1 are coated with thermal conductive adhesive and dried and solidified to form a thermal conductive adhesive layer 4, and the thermal conductive adhesive layer 4 is in contact with the surface of the chip 6 placed in the receiving hole 201 to form a heat dissipation area. In this way, the heat generated by the chip 6 can be effectively transferred to the substrate 1 through the thermal conductive adhesive layer 4, thereby achieving heat dissipation;

[0035] A heat sink 5 is disposed at the opening of the accommodating hole 201 and away from the substrate 1. The inner surface of the heat sink 5 is pressed against the surface of the chip 6 to form another heat dissipation area.

[0036] The receiving hole 201 is larger than the chip 6. When the chip 6 is received in the receiving hole 201, a heat dissipation gap is formed between the inner wall of the receiving hole 201 and the side of the chip 6.

[0037] The packaging process of chip 6 is as follows:

[0038] Step 1: fix the packaging material 2 on the substrate 1 so that one opening of the receiving hole 201 abuts against the substrate 1 to form a single opening of the receiving hole 201;

[0039] Step 2: Coat a thermal conductive adhesive layer 4 (such as 4) inside the receiving hole 201 and on the surface of the substrate 1 and dry and solidify it. Figure 2 shown);

[0040] Step 3: Place the chip 6 inside the receiving hole 201, and a surface of the chip 6 is attached to the thermal conductive adhesive layer 4 (such as Figure 3 shown);

[0041] Step 4: Fix the heat sink 5 on the chip 6 so that the heat sink 5 is fixedly covered at the opening position of the receiving hole 201 away from the substrate 1 (such as Figure 1 shown);

[0042] This double-sided heat dissipation chip 6 packaging structure realizes double-sided heat dissipation of the chip 6 through the thermal conductive adhesive layer 1 4 and the heat sink 5;

[0043] By setting the heat sink 5, the chip 6 is effectively dissipated away from the surface of the substrate 1, thereby ensuring the heat dissipation effect of the chip 6; and the heat from the other surface of the chip 6 is transferred to the ambient space through the substrate 1 by the thermal conductive adhesive layer 4, so that both surfaces of the chip 6 can dissipate heat, that is, double-sided heat dissipation is achieved, thereby improving the heat dissipation efficiency;

[0044] The heat dissipation efficiency is improved through the heat dissipation gap, thus ensuring the stable operation of the chip;

[0045] The principle of improving heat dissipation efficiency by heat dissipation gaps is as follows: heat dissipation gaps help improve heat dissipation efficiency. These heat dissipation gaps allow heat to be transferred and differentiated between the two surfaces of the chip 6. Especially when one side does not dissipate heat well, the heat can be dispersed to the other side through these heat dissipation gaps, thereby ensuring the stable operation of the chip 6.

[0046] like Figure 6 , Figure 8 As shown, in order to improve the stability of the chip 6 contained in the containing hole 201, a plurality of bumps 202 for pressing against the side of the chip 6 to fix the chip 6 are evenly arranged on the inner wall around the containing hole 201, as shown in FIG. Figure 8 As shown, the bumps 202 are arranged vertically to ensure that the position of the chip 6 in the receiving hole 201 is stable. The heat dissipation gap is formed between adjacent bumps 202. The chip 6 is placed inside the receiving hole 201. The side of the chip 6 is tightly fixed by the bumps 202. The heat dissipation efficiency is improved by the bumps 202 and the heat dissipation gap, thereby ensuring the stable operation of the chip.

[0047] like Figure 1 , Figure 4 As shown, the heat dissipation gap is filled and cured with a second heat conductive adhesive layer 7, and the upper portion of the second heat conductive adhesive layer 7 extends to the surface of the chip 6 and adheres and fixes the heat sink 5. When the second heat conductive adhesive layer 7 is not cured (such as Figure 4 As shown), the heat sink 5 is mounted on the chip 6 to ensure close contact between the heat sink 5 and the chip 6;

[0048] The second thermal conductive adhesive layer 7 is filled in the heat dissipation gap, and acts as a bridge to connect the chip 6 and the packaging material more closely. This connection not only improves the overall mechanical stability, but also optimizes the heat transfer path.

[0049] In addition, the upper part of the thermal conductive adhesive layer 2 7 extends to the surface of the chip 6 and is bonded and fixed to the heat sink 5, ensuring close contact between the heat sink 5 and the chip 6, reducing thermal resistance, and further improving the heat dissipation effect. At the same time, bonding and fixing also enhances the stability of the entire heat dissipation structure and prevents loosening or falling off due to vibration or external impact.

[0050] The heat sink 5 completely covers the opening of the receiving hole 201, which can effectively protect the chip from direct influences of the external environment, such as the invasion of dust, moisture or other pollutants, and the outer surface of the heat sink 5 is flush with the opening of the receiving hole 201. The outer surface of the heat sink is flush with the opening of the receiving hole, which can ensure that the heat exchange between the heat sink and the external environment is smoother. The absence of additional protrusions can reduce the resistance to air flow and improve the heat dissipation efficiency.

[0051] Example 2

[0052] like Figure 6-Figure 8 As shown, on the basis of Example 1, in order to enable the chip 6 to be electrically connected to external electrical components, a conductive plate 3 is arranged between the substrate 1 and the packaging material 2. The conductive plate 3 uses a plate pressed and formed with the material of the packaging material 2 as a main board, and a copper foil that can be electrically connected to the chip pins is laminated on one side or both sides of the main board. A graphic circuit is pre-made on the copper foil, and the graphic circuit is used to transmit electrical signals. The side of the conductive plate 3 extends to the inside of the accommodating hole 201, and the pins of the chip 6 are electrically connected to the conductive plate 3.

[0053] like Figure 7 , Figure 8 As shown, in order to enable the chip 6 to be electrically connected to the external electrical components, the conductive plate 3 extends to the side of the accommodation hole 201 to open a pin connection hole 301, and the side wall of the thermal conductive adhesive layer 1 4 is opened with a through groove 401 corresponding to the pin connection hole 301 and having a larger hole diameter than the pin connection hole 301;

[0054] The pin connection hole 301 can be opened by laser drilling;

[0055] The opening process is:

[0056] In Example 1, the first step of the packaging process of the chip 6 is to open a pin connection hole 301 at a corresponding position of the conductive plate 3 by using a laser drilling device before the packaging material 2 is fixed on the substrate 1, and then the pin connection hole 301 is cleaned and drilled, and then the pin connection hole 301 is electroplated with copper by using an electroplating copper process, so that it can be used as an electrical signal connection terminal on the conductive plate 3 to achieve the conduction of the electrical signal. After the pin connection hole 301 is opened and processed, when the packaging material 2 is fixed on the substrate 1, the conductive plate 3 is fixed between the packaging material 2 and the substrate 1 to complete the installation of the substrate 1, the packaging material 2 and the conductive plate 3;

[0057] In Example 1, after the second step of the packaging process of the chip 6 is to dry and solidify the thermal conductive adhesive layer 4, the thermal conductive adhesive layer 4 covers the side of the conductive plate 3 extending into the receiving hole 201, and then a through groove 401 corresponding to the pin connection hole 301 is opened on the thermal conductive adhesive layer 4 by using a laser drilling device. After the chip 6 is placed in the receiving hole 201, the pins of the chip 6 penetrate the through groove 401 and are inserted into the pin connection hole 301, thereby realizing the electrical signal connection between the chip 6 and the conductive plate 3;

[0058] In addition, the through groove 401 can also be provided by inserting an external pin into the pin connection hole 301 during the coating of the thermal conductive adhesive, and then pulling out the external pin after the thermal conductive adhesive layer 4 is cured, so that the pin insertion position forms a hole corresponding to the pin connection hole 301.

[0059] The through slot 401 and the conductive plate 3 are opened in the heat dissipation gap. Thus, after the chip 6 is installed in the accommodation hole 201 and the pin of the chip 6 passes through the through slot 401 and is inserted into the pin connection hole 301, solder can be added from the heat dissipation gap to the connection between the pin of the chip 6 and the pin connection hole 301 to increase the stability of the connection between the pin of the chip 6 and the pin connection hole 301.

[0060] Example 3

[0061] like Figure 1 , Fig. 9 as well as Fig.10 As shown, on the basis of Example 1, in order to improve the heat dissipation efficiency of the chip 6, the heat sink 5 includes a cover plate 501, and the outer surface of the cover plate 501 is provided with a plurality of fins 502 arranged in a criss-cross pattern. The fins 502 and the cover plate 501 are an integrally formed structure, and air-cooling gaps are formed between the fins 502. The main function of the fins 502 is to increase the surface area of ​​the heat sink, thereby increasing the heat dissipation efficiency. By increasing the surface area, the heat sink 5 can better exchange heat with the surrounding air and quickly dissipate the heat;

[0062] In addition, air-cooling gaps are formed between the fins 502. These gaps allow air to flow freely between the fins to form an air-cooling effect. When an external fan or other heat dissipation device is working, air will flow through these gaps to take away the heat on the fins, further improving the heat dissipation effect.

[0063] like Fig. 9 , Fig.10As shown, in order to further improve the heat dissipation efficiency of the chip 6, the inner surface of the cover plate 501 is evenly distributed with a number of protrusions and pressing blocks 503 pressed on the chip 6, and there are gaps between adjacent pressing blocks 503. A mesh-like uniform heat channel is formed on the inner surface of the cover plate 501. The uniform heat channel helps to evenly distribute and quickly transfer heat. When the chip 6 generates heat, the heat can not only be directly transferred to the fins 502 through the pressing blocks 503, but also diffused on the surface of the chip 6 through these uniform heat channels, thereby reducing the phenomenon of heat concentration.

[0064] The presence of the mesh-like heat-dissipating channel enables the heat sink 5 to more effectively absorb and disperse the heat generated by the chip 6 , which helps to reduce the risk of local overheating of the chip 6 and improve the overall heat dissipation efficiency.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate rather than limit the technical solutions of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the present invention can still be modified or replaced by equivalents. Any modification or partial replacement that does not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A chip packaging structure with double-sided heat dissipation, comprising a substrate (1) and a packaging material (2), wherein the packaging material (2) is fixed on the substrate (1), and a receiving hole (201) for receiving a chip (6) is reserved on the packaging material (2), characterized in that: The accommodating hole (201) is arranged to penetrate vertically, and an opening of the accommodating hole (201) abuts against the base plate (1); A thermally conductive adhesive is coated on the surface of the substrate (1) and dried and solidified inside the receiving hole (201) to form a thermally conductive adhesive layer (4), and the thermally conductive adhesive layer (4) is in contact with a surface of a chip (6) placed in the receiving hole (201) to form a heat dissipation area; A heat sink (5) is provided at an opening position of the accommodation hole (201) away from the substrate (1), and the inner surface of the heat sink (5) is pressed against the surface of the chip (6) to form another heat dissipation area; The receiving hole (201) is larger than the chip (6), and when the chip (6) is received in the receiving hole (201), a heat dissipation gap is formed between the inner wall of the receiving hole (201) and the side of the chip (6); A plurality of protrusions (202) for pressing against the side of the chip (6) to fix the chip (6) are evenly arranged on the inner walls around the accommodating hole (201), and heat dissipation gaps are formed between adjacent protrusions (202); The interior of the heat dissipation gap is filled and cured with a second heat conductive adhesive layer (7), and the upper portion of the second heat conductive adhesive layer (7) extends to the surface of the chip (6) and is bonded and fixed to the heat sink (5).

2. The chip packaging structure with double-sided heat dissipation according to claim 1, characterized in that: A conductive plate (3) is provided between the substrate (1) and the packaging material (2), the side edge of the conductive plate (3) extends to the interior of the accommodating hole (201), and the pins of the chip (6) are electrically connected to the conductive plate (3).

3. The chip packaging structure with double-sided heat dissipation according to claim 2, characterized in that: The conductive plate (3) is provided with a pin connection hole (301) on the side extending into the accommodating hole (201), and the side wall of the thermal conductive adhesive layer (4) is provided with a through groove (401) corresponding to the pin connection hole (301) and having a larger hole diameter than the pin connection hole (301).

4. The chip packaging structure with double-sided heat dissipation according to claim 1, characterized in that: The heat sink (5) comprises a cover plate (501), the outer surface of the cover plate (501) is provided with a plurality of fins (502) arranged in a crisscross pattern, the fins (502) and the cover plate (501) are an integrally formed structure, and air-cooling gaps are formed between the fins (502).

5. The chip packaging structure with double-sided heat dissipation according to claim 4, characterized in that: The inner surface of the cover plate (501) is evenly distributed with a number of protrusions and pressing blocks (503) pressed onto the chip (6), with gaps between adjacent pressing blocks (503) forming a mesh-like uniform heat channel on the inner surface of the cover plate (501).

6. The chip packaging structure with double-sided heat dissipation according to claim 1, characterized in that: The heat sink (5) completely covers the opening of the accommodation hole (201), and the outer surface of the heat sink (5) is flush with the opening of the accommodation hole (201).

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