Heat dissipation structure of phased array antenna, phased array antenna and satellite platform

Abstract

The present invention relates to the field of aerospace thermal control technology, and in particular to a heat dissipation structure of a phased array antenna, a phased array antenna and a satellite platform, wherein the heat dissipation structure of the phased array antenna includes a pre-buried heat pipe network, a support mechanism and an external heat pipe, the pre-buried heat pipe network includes a first heat pipe and a second heat pipe buried in a satellite cabin board, the projection of the first heat pipe on the satellite cabin board and the projection of the second heat pipe on the satellite cabin board are arranged crosswise; the support frame includes an array frame and a component frame for installing an antenna module, the component frame is arranged on the array frame, and the array frame and the component frame are respectively connected to the satellite cabin board; the condensation section of the external heat pipe is externally attached to the outer surface of the satellite cabin board, and the evaporation section of the external heat pipe is connected to the component frame. The heat dissipation structure of the phased array antenna of the present invention dissipates heat to the antenna module installed on the supporting mechanism through the external heat pipe and the pre-buried heat pipe network, shortens the heat transfer path, reduces the heat transfer thermal resistance, and significantly improves the heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the field of aerospace thermal control technology, and in particular to a heat dissipation structure of a phased array antenna, a phased array antenna, and a satellite platform. Background Art

[0002] Spaceborne phased array antennas are a crucial component of satellite payloads and significantly impact the performance of the entire satellite communications system. The core module of a spaceborne phased array antenna is the T / R (T / Ransmitter and Receiver) assembly. When the phased array antenna is operating, the majority of heat is generated by the T / R assembly. Device temperature and temperature consistency between components directly determine antenna performance. Properly designed heat dissipation pathways and controlled chip temperature are essential for ensuring antenna performance. However, existing spaceborne phased array antennas suffer from poor heat dissipation capabilities, long heat dissipation pathways, and high thermal resistance, failing to meet device heat dissipation requirements, thus impacting antenna performance. Summary of the Invention

[0003] The purpose of the present invention is to provide a heat dissipation structure for a phased array antenna, optimize the heat dissipation path, improve the heat dissipation efficiency, and reduce the temperature difference between the antenna module and the satellite cabin panel.

[0004] To achieve the above objectives, the following technical solutions are provided:

[0005] A heat dissipation structure for a phased array antenna is used to dissipate heat for a phased array antenna of a satellite platform. The satellite platform includes a satellite cabin panel, including:

[0006] a pre-buried heat pipe network, comprising a first heat pipe and a second heat pipe buried in the satellite cabin panel, wherein a projection of the first heat pipe on the satellite cabin panel and a projection of the second heat pipe on the satellite cabin panel are arranged crosswise;

[0007] A supporting mechanism, the supporting mechanism comprising an array surface frame and an assembly frame for mounting an antenna module, the assembly frame being arranged on the array surface frame, and the array surface frame and the assembly frame being respectively connected to the satellite cabin panel;

[0008] An external heat pipe is attached, wherein a condensing section of the external heat pipe is attached to the outer surface of the satellite cabin panel, and an evaporating section of the external heat pipe is connected to the component frame.

[0009] Furthermore, it also includes a thermal control coating, which is arranged on the surface of the satellite cabin panel.

[0010] Furthermore, a plurality of the first heat pipes and a plurality of the second heat pipes are respectively provided, the plurality of the first heat pipes are arranged at intervals along the axial direction of the second heat pipe, and the plurality of the second heat pipes are arranged at intervals along the axial direction of the first heat pipe.

[0011] Furthermore, the component frame includes a support plate and a connecting flange arranged on the support plate, the support plate is located in the array frame, and the connecting flange is located outside the array frame, one side surface of which is connected to the satellite cabin panel, and the other side surface is connected to both the array frame and the external heat pipe.

[0012] Furthermore, the array frame includes a frame body and a connecting frame arranged on the outer surface of the frame body, the connecting frame is connected to the satellite cabin plate, the support plate is located in the frame body, and the connecting flange is connected to the connecting frame.

[0013] Furthermore, a plurality of first mounting grooves are provided on the support plate, and the plurality of first mounting grooves are distributed on the support plate at intervals.

[0014] Furthermore, the connecting frame includes a connecting part arranged on the outer surface of the frame body and a fixing part connected to the connecting part, the connecting part is provided with a groove, a part of the connecting flange is accommodated in the groove and connected to the connecting part, and the other part extends out of the groove and is connected to the external heat pipe, and the fixing part is connected to both the frame body and the satellite cabin panel.

[0015] Furthermore, the connecting frame further includes a reinforcing portion provided on an outer side surface of the frame body, and the reinforcing portion is connected to the bottom of the connecting member.

[0016] Furthermore, two connecting frames are provided, and the two connecting frames are respectively provided on both sides of the frame body.

[0017] Furthermore, the frame body is provided with an accommodating cavity and a second mounting groove connected to the accommodating cavity, the support plate is accommodated in the accommodating cavity, and the connecting flange extends out of the accommodating cavity.

[0018] Furthermore, the array frame further includes a side plate, which is detachably provided on the frame body to cover the second installation groove.

[0019] Furthermore, the array frame also includes a bottom plate, and a third mounting groove connected to the second mounting groove is provided on the surface of the frame body facing away from the component frame. The bottom plate is detachably provided on the frame body to cover the third mounting groove.

[0020] Furthermore, a plurality of component frames are provided, and the plurality of component frames are sequentially arranged on the array frame, and the evaporation section of the externally attached heat pipe is connected to the plurality of component frames.

[0021] Furthermore, a phased array antenna is provided, including the heat dissipation structure of the phased array antenna as described above, wherein the antenna module includes:

[0022] The T / R assembly is provided on the assembly frame and is located in the array frame;

[0023] The antenna transmitting unit is arranged on the component frame and exposed from the array frame. The antenna transmitting unit is electrically connected to the T / R component.

[0024] Furthermore, it also includes a power supply module arranged on the array frame, and the T / R component and the antenna transmitting unit are electrically connected to the power supply module respectively.

[0025] Furthermore, it also includes a radio frequency module arranged on the array frame, the radio frequency module is located on the side of the array frame away from the antenna transmitting unit, and is electrically connected to the T / R component and the antenna transmitting unit.

[0026] Furthermore, a satellite platform is provided, comprising the phased array antenna as described above, wherein the satellite deck comprises:

[0027] a first deck, wherein a mounting hole is formed through the first deck, the embedded heat pipe network is embedded in the first deck, the projection of the first heat pipe on the first deck and the projection of the second heat pipe on the first deck are arranged to intersect, and the array frame and the component frame are arranged opposite to the mounting hole and are respectively connected to the first deck;

[0028] A second panel is spaced apart from the first panel and is located on a side of the array frame facing away from the first panel. The condensing section of the external heat pipe is connected to a surface of the second panel facing away from the first panel, and the antenna transmitting unit is exposed on a surface of the first panel facing away from the second panel.

[0029] Furthermore, it also includes a connecting panel, which connects the first panel and the second panel respectively.

[0030] The beneficial effects of the present invention are:

[0031] The heat dissipation structure of the phased array antenna of the present invention mounts the antenna module on the satellite deck via a support mechanism. The array frame and assembly frame of the support mechanism serve as a heat conduction bridge, working in conjunction with external heat pipes and a pre-buried heat pipe network to dissipate heat from the antenna module. On one hand, heat generated during antenna module operation can be directly transferred through the assembly frame to the external heat pipes. The external heat pipes absorb heat from the assembly frame and its surroundings through their evaporation sections and dissipate the heat to a cold space or the exterior of the satellite deck through their condensation sections, shortening the heat transfer path, reducing thermal resistance, and improving heat dissipation efficiency. On the other hand, heat generated during antenna module operation can be transferred through the assembly frame or array frame to the satellite deck. The satellite deck dissipates heat through the pre-buried heat pipe network embedded within it. The staggered arrangement of the first and second heat pipes allows heat absorbed on the satellite deck to be dissipated in all directions, optimizing the heat dissipation path. This not only accelerates heat dissipation but also helps reduce the temperature difference between the antenna module and the satellite deck, improving the satellite deck's adaptability to the antenna module.

[0032] The phased array antenna proposed in the present invention adopts the heat dissipation mechanism of the phased array antenna described above, thereby ensuring the heat dissipation performance of the phased array antenna and further ensuring the performance of the phased array antenna.

[0033] The satellite platform proposed in the present invention adopts the above-mentioned phased array antenna and the heat dissipation structure of the phased array antenna, which can reduce the temperature difference between the internal components of the phased array antenna and the satellite cabin, while reducing the satellite envelope size, saving the space occupied by the satellite during launch. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0035] Figure 1 A schematic diagram of the structure of the heat dissipation structure of the phased array antenna provided by an embodiment of the present invention applied to a satellite platform;

[0036] Figure 2 A schematic diagram of the structure of a pre-buried heat pipe network provided by an embodiment of the present invention when laid on a satellite platform;

[0037] Figure 3 Schematic diagram of the decomposed structure of the phased array antenna provided in an embodiment of the present invention Figure 1 ;

[0038] Figure 4 Schematic diagram of the component framework and T / R component structure provided in the embodiment of the present invention Figure 1 ;

[0039] Figure 5 Schematic diagram of the component framework and T / R component structure provided in the embodiment of the present invention Figure 2 ;

[0040] Figure 6 A schematic structural diagram of a phased array antenna provided in an embodiment of the present invention;

[0041] Figure 7 Schematic diagram of the decomposed structure of the phased array antenna provided in an embodiment of the present invention Figure 2 .

[0042] In the picture:

[0043] 100 - satellite cabin board; 101 - first cabin board; 102 - second cabin board; 103 - connection cabin board;

[0044] 200-antenna module; 201-T / R assembly; 2011-PA device; 202-antenna transmitting unit; 203-power module; 204-RF module;

[0045] 1-pre-buried heat pipe network; 11-first heat pipe; 12-second heat pipe;

[0046] 2-Support mechanism;

[0047] 21- array frame; 211- frame body; 2111- accommodating cavity; 2112- second mounting slot; 2113- third mounting slot; 212- connecting frame; 2121- connecting member; 2122- fixing member; 2123- reinforcing portion; 2124- groove; 213- side plate; 214- bottom plate;

[0048] 22-assembly frame; 221-support plate; 2211-first mounting slot; 222-connecting flange;

[0049] 3-external heat pipe; 31-condensation section; 32-evaporation section. DETAILED DESCRIPTION

[0050] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0051] In the description of the present invention, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the product is typically placed when in use. These terms are intended solely to facilitate the description of the present invention and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes or to distinguish between different structures or components and should not be construed as indicating or implying relative importance.

[0052] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed or detachable connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention.

[0053] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0054] See also Figures 1 to 3 This embodiment provides a heat dissipation structure for a phased array antenna, which is used to dissipate heat for a phased array antenna on a satellite platform. The satellite platform includes a satellite cabin panel 100. The heat dissipation structure of the phased array antenna includes a pre-buried heat pipe network 1, a support mechanism 2, and externally attached heat pipes 3. The pre-buried heat pipe network 1 includes a first heat pipe 11 and a second heat pipe 12 buried in the satellite cabin panel 100. The projection of the first heat pipe 11 on the satellite cabin panel 100 and the projection of the second heat pipe 12 on the satellite cabin panel 100 are arranged in an intersecting manner. The support mechanism 2 includes an array frame 21 for mounting an antenna module 200 and an assembly frame 22. The assembly frame 22 is disposed on the array frame 21, and the array frame 21 and the assembly frame 22 are respectively connected to the satellite cabin panel 100. The condenser section 31 of the externally attached heat pipe 3 is attached to the outer surface of the satellite cabin panel 100, and the evaporator section 32 of the externally attached heat pipe 3 is connected to the assembly frame 22.

[0055] The heat dissipation structure of the phased array antenna of this embodiment uses a support mechanism 2 to mount the antenna module 200 of the phased array antenna on the satellite cabin board 100. The array frame 21 and assembly frame 22 of the support mechanism 2 serve as a heat conduction bridge, working in conjunction with the external heat pipes 3 and the pre-buried heat pipe network 1 to dissipate heat from the antenna module 200. Heat generated by the antenna module 200 during operation is directly transferred through the assembly frame 22 to the external heat pipes 3. The external heat pipes 3 absorb heat from the assembly frame 22 and its surroundings through their evaporation sections 32 and dissipate the heat to a cold space or the outside of the satellite cabin board 100 through their condensation sections 31, reducing both conductive and contact thermal resistances and thereby improving heat dissipation efficiency. On the other hand, the heat generated by the antenna module 200 during operation can be conducted to the satellite cabin panel 100 through the component frame 22 or the array frame 21. The satellite cabin panel 100 uses the embedded heat pipe network 1 therein to dissipate heat. The first heat pipe 11 and the second heat pipe 12 are staggered to dissipate the heat absorbed by the satellite cabin panel 100 to the surrounding areas, thereby optimizing the heat dissipation path. This can not only speed up the heat dissipation, but also help to reduce the temperature difference between the antenna module 200 and the satellite cabin panel 100, thereby improving the adaptability of the satellite cabin panel 100 to the antenna module 200.

[0056] The heat dissipation structure of the phased array antenna of this embodiment further includes a thermal control coating, which is disposed on the surface of the satellite cabin panel 100 to accelerate the heat dissipation of the satellite cabin panel 100 to the cold space.

[0057] Optionally, the thermal control coating sprayed on the surface of the satellite cabin panel 100 facing away from the support mechanism 2 is SR107-ZK white paint, which is used as a heat dissipation surface to dissipate the heat absorbed by the satellite cabin panel 100 and generated by the antenna module 200 during operation to a cold space.

[0058] Optionally, the thermal control coating sprayed on the surface of the satellite cabin panel 100 facing the support mechanism 2 is E51-M black paint, and the outer surface of the support mechanism 2, except for the contact surface with the satellite cabin panel 100 and the antenna module 200, is provided with SR107-ZK white paint with a heat dissipation effect, thereby increasing the radiation heat exchange between the satellite cabin panel 100 and the support mechanism 2, thereby improving the heat dissipation efficiency of the antenna module 200.

[0059] See also Figure 2 A plurality of first heat pipes 11 and a plurality of second heat pipes 12 are respectively provided, and the plurality of first heat pipes 11 are arranged at intervals along the axial direction of the second heat pipe 12, and the plurality of second heat pipes 12 are arranged at intervals along the axial direction of the first heat pipe 11, so that the plurality of first heat pipes 11 and the plurality of second heat pipes 12 cooperate to form a pre-buried heat pipe network 1 on the satellite cabin panel 100, thereby improving the temperature uniformity of the entire satellite cabin panel 100 and thereby improving the heat dissipation efficiency.

[0060] Alternatively, see Figure 2The projection of the first heat pipe 11 on the satellite cabin panel 100 and the projection of the second heat pipe 12 on the satellite cabin panel 100 are arranged at an angle of 90 degrees, so that the multiple first heat pipes 11 and the multiple second heat pipes 12 form an orthogonal pre-buried heat pipe network 1, thereby improving the heat conduction efficiency of the pre-buried heat pipe network 1, thereby improving the temperature uniformity of the heat dissipation surface on the satellite cabin panel 100.

[0061] See also Figures 3 to 5 The assembly frame 22 includes a support plate 221 and a connecting flange 222 disposed on the support plate 221. The support plate 221 is located within the array frame 21 and is used to mount the antenna module 200. The connecting flange 222 is located outside the array frame 21, with one side surface connected to the satellite cabin panel 100 and the other side surface connected to the array frame 21 and the external heat pipe 3. The connecting flange 222 disposed on the support plate 221 not only secures the assembly frame 22 to the array frame 21, but also allows the heat generated by the antenna module 200 on the support plate 221 during operation to be directly transferred to the external heat pipe 3 and the satellite cabin panel 100, thereby reducing both conductive and contact thermal resistances. Multiple heat dissipation paths simultaneously dissipate heat, thereby improving heat dissipation efficiency.

[0062] See also Figure 1 and Figure 3 The array frame 21 includes a frame body 211 and a connecting frame 212 disposed on the outer surface of the frame body 211. The connecting frame 212 is connected to the satellite cabin board 100. The support plate 221 is located in the frame body 211, and the connecting flange 222 is connected to the connecting frame 212. Connecting the satellite cabin board 100 via the connecting frame 212 not only allows the array frame 21 to be installed on the satellite cabin board 100, but also allows the assembly frame 22 to be fixed in conjunction with the connecting flange 222 to provide a firm and stable support for the antenna module 200. Furthermore, the connecting frame 212, connected to the satellite cabin board 100, can also transfer some of the heat generated by the antenna module 200 disposed on the array frame 21 during operation to the satellite cabin board 100 for dissipation. Furthermore, the proximity of the connecting frame 212 to the connecting flange 222 allows the externally attached heat pipe 3 to be used for auxiliary heat dissipation, thereby improving the heat dissipation effect.

[0063] See also Figure 4 A plurality of first mounting grooves 2211 are provided on the support plate 221, and the plurality of first mounting grooves 2211 are distributed at intervals on the support plate 221. The high-heat-consumption components in the antenna module 200 are installed through the plurality of first mounting grooves 2211, so that the high-heat-consumption components can directly transfer heat through the connecting flange 222, shortening the heat dissipation path of the high-heat-consumption components in the antenna module 200, realizing a reasonable and optimized arrangement of the antenna module 200, and further improving the heat dissipation effect.

[0064] See also Figure 3 and Figure 6The connecting frame 212 includes a connector 2121 disposed on the outer surface of the frame body 211 and a fixing member 2122 connected to the top of the connector 2121. The connector 2121 is provided with a groove 2124. A portion of the connecting flange 222 is accommodated in the groove 2124 and connected to the connector 2121. The other portion of the connecting flange 222 extends out of the groove 2124 to connect to the external heat pipe 3. The fixing member 2122 connects the frame body 211 and the satellite cabin panel 100 respectively. The fixing member 2122 not only strengthens the electrical connection between the connecting member 2121 and the frame body 211, but also accelerates heat dissipation through its contact with the satellite cabin panel 100. By cooperating with the connecting piece 2121 and the groove 2124 opened thereon, the surface of the connecting flange 222 used for connecting to the satellite cabin panel 100 will not protrude from the groove 2124. Optionally, the surface of the connecting flange 222 facing away from the external heat pipe 3 is flush with the surface of the fixing piece 2122 facing away from the external heat pipe 3, so as to ensure that the connecting flange 222 and the fixing piece 2122 are evenly and flatly connected to the satellite cabin panel 100 without any gap, thereby ensuring the heat conduction effect between the support mechanism 2 and the satellite cabin panel 100.

[0065] Optionally, a mounting hole is provided through the bottom of the groove 2124 , and a fastener, such as a screw, can be passed through the mounting hole to fasten the connecting flange 222 and the connecting member 2121 .

[0066] See also Figure 6 and Figure 7 The connecting frame 212 also includes a reinforcing portion 2123 arranged on the outer surface of the frame body 211. The reinforcing portion 2123 is a block with a right-angled triangle cross-section. The reinforcing portion 2123 is connected to the bottom of the connecting member 2121 to reinforce the bottom of the connecting member 2121 and ensure the connection strength between the connecting member 2121 and the frame body 211.

[0067] Optionally, two connecting frames 212 are provided, and the two connecting frames 212 are respectively provided on both sides of the frame body 211, so that the frame body 211 is balanced and firmly mounted on the satellite cabin board 100. Optionally, a fixing piece 2122 and a reinforcement part 2123 are provided at both ends of the connecting piece 2121 of each connecting frame 212 to further ensure the connection strength.

[0068] Alternatively, see Figure 1 There are two external heat pipes 3, and a connecting flange 222 is provided at both ends of the support plate 221 of each component frame 22. Each connecting flange 222 is connected to a connecting frame 212 and an external heat pipe 3, so as to realize heat dissipation from both sides of the support mechanism 2 and improve the heat dissipation efficiency.

[0069] See also Figure 3The frame body 211 is provided with a receiving cavity 2111 and a second mounting groove 2112 connected to the receiving cavity 2111. The support plate 221 is accommodated in the receiving cavity 2111, and the connecting flange 222 extends out of the receiving cavity 2111. The second mounting groove 2112 is used to mount some components of the antenna module 200. This allows the various components of the antenna module 200 to be dispersed across the assembly frame 22 and the array frame 21, which helps to disperse the heat generated during operation of the antenna module 200.

[0070] See also Figure 3 and Figure 7 The array frame 21 also includes a side panel 213, which is detachably arranged on the frame body 211 to cover the second mounting groove 2112. The side panel 213 protects the antenna module 200 from damage and also facilitates the disassembly and replacement of components of the antenna module 200.

[0071] See also Figure 7 The array frame 21 also includes a bottom plate 214. A third mounting slot 2113, which communicates with the second mounting slot 2112, is provided on the surface of the frame body 211 facing away from the assembly frame 22. The third mounting slot 2113 is used to mount some components of the antenna module 200. This allows the various components of the antenna module 200 to be dispersed across the assembly frame 22 and the array frame 21, facilitating the dissipation of heat generated by the antenna module 200 during operation. The bottom plate 214 is provided on the frame body 211 to cover the third mounting slot 2113. This protects the antenna module 200 from damage and facilitates the removal and replacement of components in the antenna module 200.

[0072] See also Figure 3 and Figure 4 There are multiple component frames 22, and the multiple component frames 22 are arranged in sequence on the array frame 21. The evaporation sections 32 of the external heat pipes 3 are respectively connected to the multiple component frames 22. Multiple groups of high heat consumption devices of the antenna module 200 can be installed through the multiple component frames 22 to ensure the normal operation of the antenna module 200, and the external heat pipes 3 and multiple connecting flanges 222 are used to cooperate to accelerate the centralized heat dissipation efficiency.

[0073] Optionally, both the component frame 22 and the array frame 21 can be made of aluminum alloy with a thermal conductivity coefficient of up to 201W / m / K. At the same time, thermal conductive installation is adopted between the component frame 22 and the array frame 21 and the satellite cabin panel 100, as well as between the array frame 21 and the satellite cabin panel 100, such as welding or thermal conductive metal mounting parts.

[0074] Optionally, the first heat pipe 11 , the second heat pipe 12 and the external heat pipe 3 in this embodiment are all I-shaped double-hole ammonia axial groove heat pipes, and the pipe material is aluminum alloy.

[0075] This embodiment also provides a phased array antenna, see Figures 3 to 7 The phased array antenna includes the above-mentioned heat dissipation structure of the phased array antenna, wherein the antenna module 200 of the phased array antenna includes a T / R component 201 and an antenna transmitting unit 202. The T / R component 201 is arranged in a first mounting groove 2211 on a support plate 221 of a component frame 22 and is located in an array frame 21. The power consumption of the T / R component 201 is mainly concentrated in a PA (Power Amplifier) ​​device 2011 in the T / R component 201. The antenna transmitting unit 202 is arranged on the support plate 221 of the component frame 22 and is exposed to the array frame 21. At the same time, the antenna transmitting unit 202 is electrically connected to the T / R component 201. The T / R component 201 and the antenna transmitting unit 202 of the antenna module 200 are mounted and supported by the array frame 21 and the component frame 22, and heat is dissipated from the T / R component 201 and the antenna transmitting unit 202 by means of an external heat pipe 3 and a pre-buried heat pipe network 1.

[0076] See also Figure 3 and Figure 7 The phased array antenna of this embodiment further includes a power module 203 disposed on the array frame 21. The power module 203 is electrically connected to the T / R assembly 201 and the antenna transmitting unit 202. Optionally, the power module 203 is mounted in a second mounting slot 2112 on the array frame 21, allowing heat generated by the power module 203 during operation to be conducted both through the array frame 21 and through the interconnected accommodating cavity 2111 to the assembly frame 22 for dissipation.

[0077] See also Figure 7 The phased array antenna of this embodiment further includes a radio frequency module 204 disposed on the array frame 21. The radio frequency module 204 is located on the side of the array frame 21 facing away from the antenna transmitting unit 202 and is electrically connected to the T / R assembly 201 and the antenna transmitting unit 202. Optionally, the radio frequency module 204 is mounted in the third mounting slot 2113 of the array frame 21, so that heat generated by the radio frequency module 204 during operation can be conducted both through the array frame 21 and through the interconnected second mounting slot 2112 and the accommodating cavity 2111 to the assembly frame 22 for dissipation.

[0078] This embodiment also provides a satellite platform, see Figure 1 and Figure 2 The satellite platform includes the above-mentioned phased array antenna, wherein the satellite cabin panel 100 of the satellite platform includes a first cabin panel 101, a second cabin panel 102 and a connecting cabin panel 103, the second cabin panel 102 is spaced apart from the first cabin panel 101, and the connecting cabin panel 103 respectively connects part of the first cabin panel 101 and part of the second cabin panel 102, that is, there is a flow opening between the first cabin panel 101 and the second cabin panel 102.

[0079] Optionally, a mounting hole is formed through the first deck 101, and a pre-buried heat pipe network 1 is embedded in the first deck 101. The projection of the first heat pipe 11 on the first deck 101 intersects with the projection of the second heat pipe 12 on the first deck 101. The array frame 21 and the assembly frame 22 are positioned opposite the mounting hole and are respectively connected to the first deck 101. Simultaneously, portions of the first heat pipe 11 and the second heat pipe 12 are positioned adjacent to the mounting hole so that the portion of the connecting flange 222 extending from the groove 2124 faces the first heat pipe 11, accelerating heat dissipation. This structural arrangement allows the array frame 21 and the assembly frame 22 to transfer heat generated by the antenna module 200 mounted thereon during operation to the first deck 101, which then dissipates the heat to the surrounding area using the pre-buried heat pipe network 1 embedded therein.

[0080] Optionally, the second deck 102 is located on the side of the array frame 21 facing away from the first deck 101, the condensing section 31 of the external heat pipe 3 is connected to the surface of the second deck 102 facing away from the first deck 101, and the antenna transmitting unit 202 is exposed on the surface of the first deck 101 facing away from the second deck 102, thereby transmitting and receiving electrical signals. By coordinating the positions of the first deck 101 and the second deck 102, the heat generated by the antenna module 200 during operation can be directly transferred to the external heat pipe 3 through the component frame 22. The external heat pipe 3 absorbs heat from the component frame 22 and its surroundings through its evaporating section 32, and dissipates the heat to the cold space or the side of the second deck 102 facing away from the first deck 101 through its condensing section 31, so that the heat is dissipated, avoiding affecting the antenna module 200 located between the first deck 101 and the second deck 102, thereby accelerating heat dissipation.

[0081] The satellite platform in this embodiment is equipped with a phased array antenna and a heat dissipation structure for the phased array antenna through the cooperation of the first cabin 101, the second cabin 102 and the connecting cabin 103. This not only significantly reduces the temperature difference between the internal components of the phased array antenna and the satellite cabin, but also improves the adaptability of the satellite cabin 100 to the antenna module. At the same time, when the phased array antenna is installed, only the antenna transmitting unit 202 is exposed outside the first cabin 101, and the other parts are located between the first cabin 101 and the second cabin 102, thereby reducing the satellite envelope size and saving the space occupied by the satellite during launch.

[0082] Optionally, SR107-ZK white paint is sprayed on the surfaces of the first cabin panel 101, the second cabin panel 102 and the connecting cabin panel 103 facing away from the support mechanism 2 to serve as heat dissipation surfaces, thereby dissipating the heat absorbed by the satellite cabin panel 100 and generated during the operation of the antenna module 200 to a cold space.

[0083] Optionally, the surfaces of the first cabin plate 101, the second cabin plate 102 and the connecting cabin plate 103 facing away from the support mechanism 2 are sprayed with E51-M black paint, and the outer surfaces of the support mechanism 2 except the contact surface with the first cabin plate 101 and the antenna module 200 are provided with SR107-ZK white paint with a heat dissipation effect, thereby increasing the radiation heat exchange between the first cabin plate 101, the second cabin plate 102, the connecting cabin plate 103 and the support mechanism 2, thereby improving the heat dissipation efficiency of the antenna module 200.

[0084] Optionally, the first cabin panel 101, the second cabin panel 102 and the connecting cabin panel 103 in this embodiment are aluminum skin aluminum honeycomb panels, wherein the skin thickness is 0.5 mm and the honeycomb thickness is 10 mm.

[0085] The phased array antenna and satellite platform in this embodiment use Thermal Destop software to model the actual on-orbit state of the phased array antenna, set corresponding orbital parameters, and perform steady-state thermal analysis under extreme high-temperature conditions. The results show that the mounting surface temperature of the satellite cabin panel 100, which is used to secure the phased array antenna, is approximately 40 degrees Celsius, and the maximum temperature of the PA device 2011 is approximately 89.7 degrees Celsius, meeting the temperature requirements with a margin.

[0086] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A heat dissipation structure of a phased array antenna, used for dissipating heat from a phased array antenna of a satellite platform, wherein the satellite platform comprises a satellite cabin panel (100), characterized in that: include: A pre-buried heat pipe network (1) comprises a first heat pipe (11) and a second heat pipe (12) buried in the satellite cabin panel (100), wherein a projection of the first heat pipe (11) on the satellite cabin panel (100) and a projection of the second heat pipe (12) on the satellite cabin panel (100) are arranged crosswise; A support mechanism (2), the support mechanism (2) comprising an array surface frame (21) and a component frame (22) for mounting an antenna module (200), the component frame (22) being arranged on the array surface frame (21), the array surface frame (21) and the component frame (22) being respectively connected to the satellite cabin panel (100); An externally attached heat pipe (3), wherein a condensation section (31) of the externally attached heat pipe (3) is attached to the outer surface of the satellite cabin panel (100), and an evaporation section (32) of the externally attached heat pipe (3) is connected to the component frame (22); It also includes a thermal control coating, which is arranged on the surface of the satellite cabin panel (100); The component frame (22) comprises a support plate (221) and a connection flange (222) arranged on the support plate (221); the support plate (221) is located in the array frame (21); the connection flange (222) is located outside the array frame (21); one side surface of the connection flange is connected to the satellite cabin panel (100); and the other side surface is connected to both the array frame (21) and the external heat pipe (3); The array frame (21) comprises a frame body (211) and a connecting frame (212) arranged on the outer surface of the frame body (211); the connecting frame (212) is connected to the satellite cabin panel (100); the support plate (221) is located in the frame body (211); and the connecting flange (222) is connected to the connecting frame (212).

2. The heat dissipation structure of the phased array antenna according to claim 1, characterized in that: A plurality of the first heat pipes (11) and a plurality of the second heat pipes (12) are respectively provided, wherein the plurality of the first heat pipes (11) are arranged at intervals along the axial direction of the second heat pipe (12), and the plurality of the second heat pipes (12) are arranged at intervals along the axial direction of the first heat pipe (11).

3. The heat dissipation structure of the phased array antenna according to claim 1, characterized in that: A plurality of first mounting grooves (2211) are provided on the support plate (221), and the plurality of first mounting grooves (2211) are distributed at intervals on the support plate (221).

4. The heat dissipation structure of the phased array antenna according to claim 1, characterized in that: The connecting frame (212) comprises a connecting piece (2121) arranged on the outer side of the frame body (211) and a fixing piece (2122) connected to the connecting piece (2121); the connecting piece (2121) is provided with a groove (2124); a part of the connecting flange (222) is accommodated in the groove (2124) and connected to the connecting piece (2121); the other part extends out of the groove (2124) and is connected to the external heat pipe (3); the fixing piece (2122) is connected to both the frame body (211) and the satellite cabin panel (100).

5. The heat dissipation structure of the phased array antenna according to claim 4, characterized in that: The connecting frame (212) further comprises a reinforcing portion (2123) arranged on the outer side of the frame body (211), and the reinforcing portion (2123) is connected to the bottom of the connecting piece (2121).

6. The heat dissipation structure of the phased array antenna according to claim 1, characterized in that: Two connecting frames (212) are provided, and the two connecting frames (212) are respectively provided on two sides of the frame body (211).

7. The heat dissipation structure of the phased array antenna according to claim 1, characterized in that: The frame body (211) is provided with a receiving cavity (2111) and a second mounting groove (2112) connected to the receiving cavity (2111); the support plate (221) is received in the receiving cavity (2111); and the connecting flange (222) extends out of the receiving cavity (2111).

8. The heat dissipation structure of the phased array antenna according to claim 7, characterized in that: The array frame (21) further comprises a side plate (213), wherein the side plate (213) is detachably arranged on the frame body (211) to cover the second installation groove (2112).

9. The heat dissipation structure of the phased array antenna according to claim 7, characterized in that: The array frame (21) further comprises a bottom plate (214); a third mounting groove (2113) connected to the second mounting groove (2112) is provided on a surface of the frame body (211) facing away from the component frame (22); and the bottom plate (214) is detachably arranged on the frame body (211) to cover the third mounting groove (2113).

10. The heat dissipation structure of the phased array antenna according to any one of claims 1 to 9, characterized in that: A plurality of the component frames (22) are provided, and the plurality of the component frames (22) are arranged in sequence on the array frame (21), and the evaporation section (32) of the externally attached heat pipe (3) is connected to the plurality of the component frames (22).

11. A phased array antenna, characterized in that: Comprising the heat dissipation structure of the phased array antenna according to claim 10, the antenna module (200) comprises: A T / R component (201) is arranged on the component frame (22) and is located in the array frame (21); An antenna transmitting unit (202) is arranged on the component frame (22) and exposed from the array frame (21); the antenna transmitting unit (202) is electrically connected to the T / R component (201).

12. The phased array antenna according to claim 11, characterized in that: It also comprises a power module (203) arranged on the array frame (21), and the T / R component (201) and the antenna transmitting unit (202) are respectively electrically connected to the power module (203).

13. The phased array antenna according to claim 11, characterized in that: It also includes a radio frequency module (204) arranged on the array frame (21), the radio frequency module (204) being located on a side of the array frame (21) away from the antenna transmitting unit (202), and being electrically connected to the T / R component (201) and the antenna transmitting unit (202).

14. A satellite platform, characterized in that: The phased array antenna according to any one of claims 11 to 13, wherein the satellite cabin panel (100) comprises: A first deck (101), wherein a mounting hole is formed through the first deck (101), the pre-buried heat pipe network (1) is buried in the first deck (101), a projection of the first heat pipe (11) on the first deck (101) and a projection of the second heat pipe (12) on the first deck (101) are arranged to intersect, and an array frame (21) and a component frame (22) are arranged opposite to the mounting hole and are respectively connected to the first deck (101); A second deck (102), the second deck (102) being spaced apart from the first deck (101) and being located on a side of the array frame (21) facing away from the first deck (101), the condensation section (31) of the externally attached heat pipe (3) being connected to a surface of the second deck (102) facing away from the first deck (101), and the antenna transmitting unit (202) being exposed on a surface of the first deck (101) facing away from the second deck (102).

15. The satellite platform according to claim 14, characterized in that: It also includes a connecting panel (103), wherein the connecting panel (103) connects the first panel (101) and the second panel (102).

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