A mold and a method for manufacturing a multistage thermoelectric refrigeration device

Abstract

This invention provides a mold for fabricating multi-stage thermoelectric cooling devices, used for positioning the multi-stage thermoelectric cooling devices. The mold includes a base for supporting the multi-stage thermoelectric cooling devices and positioning components for positioning the multi-stage thermoelectric cooling devices. The multi-stage thermoelectric cooling devices include multiple sets of stacked single-stage thermoelectric cooling devices, and the positioning components include multiple sequentially adjacent single-stage positioning assemblies, each used to position each single-stage thermoelectric cooling device. This invention provides a mold and fabrication method for fabricating multi-stage thermoelectric cooling devices, which facilitates the assembly of multi-stage thermoelectric cooling devices, prevents displacement of each stage of the thermoelectric devices, fabricates multi-stage thermoelectric devices with reliable thermoelectric performance, reduces device assembly difficulty, improves production efficiency, requires only one reflow soldering to complete the device welding, improves device yield, and has a simple mold structure. Through this mold combination method, even n-stage devices can be further fabricated, demonstrating excellent practicality.

Description

Technical Field

[0001] This invention belongs to the field of thermoelectric device fabrication technology, and particularly relates to a mold and fabrication method for fabricating multi-stage thermoelectric refrigeration devices. Background Technology

[0002] Thermoelectric materials, as a new energy material, can realize the mutual conversion of electrical energy and thermal energy, and have broad application prospects in refrigeration, heat dissipation, and localized precise temperature control. At the device level, n-type and p-type thermoelectric materials are usually combined into units, and full-size thermoelectric devices are constructed from several units. Taking refrigeration applications as an example, in the face of working environments requiring larger cooling temperature differences and meeting different depths of cooling needs, multi-layer design and construction of thermoelectric refrigeration devices are required. Among them, the stage in contact with the heat sink is usually considered the "first stage". In order to achieve effective cooling, the cooling capacity of the nth stage in a multi-stage refrigeration device needs to be greater than or equal to the heat generation of the (n+1)th stage. Under the condition that the geometric dimensions of the thermoelectric arms of each stage are the same, the number of thermoelectric arm pairs of the nth stage is greater than the number of thermoelectric arm pairs of the (n+1)th stage. Therefore, multi-stage thermoelectric refrigeration devices often present a "pyramid" shape. The performance of the device is directly related to the thermoelectric figure of merit of the selected material. Currently, Bi2Te3-based, Mg3Bi2-based, and MgAgSb-based materials exhibit excellent room-temperature thermoelectric performance. Recent studies show that the room-temperature zT of n-type Bi2Te3-based materials can exceed 0.9 and approach 1.0, while that of p-type Bi2Te3-based materials can reach 1.4. The room-temperature zT of n-type Mg3Bi2-based materials and p-type MgAgSb-based materials can both reach 0.9. Thermoelectric cooling devices prepared by combining n-type and p-type Bi2Te3-based materials can achieve a maximum cooling temperature difference of 75K for a single-stage device, 92K for a two-stage device, 121K for a three-stage device, 129K for a four-stage device, and 141K for a five-stage device, all at a hot-end temperature of 300K. Today, multi-stage thermoelectric cooling devices are widely used in instruments, medical devices, and space exploration. For example, when infrared detectors operate at room temperature, the difference between the received signal and the environmental background is small, the response time of the components is long, and the working performance is poor. By using thermoelectric cooling devices to provide a stable low-temperature working environment, the working performance of infrared detectors can be improved. Multi-stage thermoelectric cooling devices can provide an even lower temperature environment, which can significantly improve the working performance of infrared detectors.

[0003] By designing and assembling multi-layer thermoelectric devices, the maximum cooling temperature difference of the devices can be further improved to meet the working requirements of large cooling temperature differences, and different layer stacking designs can meet different depth cooling requirements. Generally speaking, the assembly method of multi-stage thermoelectric devices is segmented and step-by-step assembly. After each stage of the device assembly is completed, welding is performed, and then the assembly of the next stage of the device is completed, ultimately realizing the fabrication of multi-stage thermoelectric devices. However, this fabrication method involves multiple welding processes. On the one hand, some thermoelectric materials with poor chemical stability, such as Mg3Bi2-based materials, will face the risk of thermoelectric performance degradation. On the other hand, because some thermoelectric arm connecting layer materials and their connection processes place higher demands on the welding process, multiple welding may cause interface problems at the connecting layer and expose the device joints to the risk of failure.

[0004] Currently, only multi-stage thermoelectric cooling devices fabricated using a combination of n-type and p-type Bi2Te3-based materials are commercially available. Bi2Te3-based materials possess excellent chemical stability, making them less prone to performance degradation during device fabrication. For thermoelectric materials with poor chemical stability, and for the interface of the bonding layer which requires more sophisticated welding processes, multiple welding processes are the key constraint on the fabrication and optimization of multi-stage cooling devices. Directly assembling multi-stage thermoelectric cooling devices in a single step significantly increases the assembly difficulty. Designing a mold that enables integrated fabrication of multi-stage thermoelectric cooling devices is crucial for producing reliable multi-stage thermoelectric devices.

[0005] In summary, the existing multi-stage thermoelectric cooling devices have the following problems in the assembly process: (1) The more stages there are, the more difficult the assembly becomes; (2) The segmented, step-by-step assembly process is cumbersome and inefficient; the introduction of multiple welding processes in the segmented preparation of multi-stage thermoelectric cooling devices will lead to the risk of thermoelectric performance degradation for thermoelectric materials with poor chemical stability, further degrading the cooling performance of the device; (3) the introduction of multiple welding processes in the segmented preparation of multi-stage thermoelectric cooling devices may result in inconsistent quality of weld joints at different stages, leading to the failure of device joints with harsh welding conditions. Therefore, improvements are urgently needed from researchers. Summary of the Invention

[0006] The purpose of this invention is to overcome at least one of the shortcomings of the prior art and provide a mold and preparation method for preparing multi-stage thermoelectric refrigeration devices. This simplifies the assembly steps, greatly reduces the difficulty of device assembly, makes the construction of multi-stage thermoelectric refrigeration devices simpler and more convenient, improves construction efficiency and production efficiency, and is conducive to the preparation of multi-stage thermoelectric devices with reliable thermoelectric performance. It has good practicality.

[0007] The technical solution of this invention is: a mold for fabricating a multi-stage thermoelectric refrigeration device, used for positioning the multi-stage thermoelectric refrigeration device. The mold includes a base for supporting the multi-stage thermoelectric refrigeration device and positioning components for positioning the multi-stage thermoelectric refrigeration device. The multi-stage thermoelectric refrigeration device includes multiple sets of stacked single-stage thermoelectric refrigeration devices. The positioning components include multiple sequentially adjacent single-stage positioning assemblies, each used to position each single-stage thermoelectric refrigeration device. As a further improvement of this technical solution, the multi-stage thermoelectric refrigeration device includes at least a first-stage thermoelectric device and a second-stage thermoelectric device. The base has a mounting groove for mounting the first-stage thermoelectric device, and the second-stage thermoelectric device is mounted on the first-stage thermoelectric device.

[0008] The limiting component includes at least a first-level limiting component for limiting the first-level thermoelectric device and a second-level limiting component limited by the first-level limiting component and for limiting the second-level thermoelectric device. The first-level limiting component is connected to the base, and the second-level limiting component is connected to the first-level limiting component.

[0009] As a further improvement to this technical solution, the base is provided with a plurality of limiting holes and the plurality of limiting holes are arranged along the outer periphery of the mounting groove; the first-level limiting component includes a first limiting member disposed in each of the limiting holes and used for limiting each side of the first-level thermoelectric device; the second-level limiting component includes a second limiting member, the second limiting member including a limiting base plate at the bottom for connecting with the top of the first-level thermoelectric device, the limiting base plate having an insertion hole for the first limiting member to be inserted, and an abutment rod for abutting against the second-level thermoelectric device at one end of the limiting base plate near the second-level thermoelectric device.

[0010] As a further improvement to this technical solution, the limiting holes include two transverse limiting holes arranged in the transverse direction along the center of the mounting groove and two longitudinal limiting holes arranged in the longitudinal direction along the center of the mounting groove; the first limiting member and the second limiting member are each provided with four.

[0011] As a further improvement to this technical solution, a first limiting space for clamping the first-stage thermoelectric device is formed between the two first limiting members located in the same direction; a second limiting space for clamping the second-stage thermoelectric device is formed between the two second limiting members located in the same direction.

[0012] As a further improvement to this technical solution, a clearance groove is provided at the junction of two adjacent groove walls of the mounting groove to avoid the multi-stage thermoelectric refrigeration device; the clearance groove is connected to the mounting groove.

[0013] As a further improvement to this technical solution, the multi-stage thermoelectric cooling device includes a third-stage thermoelectric device mounted on the second-stage thermoelectric device; the limiting component also includes a third-stage limiting component, which includes a plurality of third-stage limiting members respectively used to abut against each side of the third-stage thermoelectric device.

[0014] The present invention also provides a method for fabricating a multi-stage thermoelectric refrigeration device. The multi-stage thermoelectric refrigeration device is fabricated using the above-mentioned mold. Each stage of the thermoelectric device has a thermoelectric arm, a first ceramic substrate located on one side of the thermoelectric arm, and a second ceramic substrate located on the other side of the thermoelectric arm. The fabrication method includes building multiple sets of stacked single-stage thermoelectric refrigeration devices step by step, and using single-stage limiting components to limit the construction of each single-stage thermoelectric refrigeration device.

[0015] As a further improvement to this technical solution, the preparation method includes the following steps:

[0016] The steps for constructing the first-stage thermoelectric device include: placing a first ceramic substrate in the mounting groove, setting a first-stage thermoelectric arm on one side of the first ceramic substrate, and setting a second ceramic substrate on the other side of the first-stage thermoelectric arm to form a first-stage thermoelectric device.

[0017] The limiting step of the first-stage thermoelectric device involves connecting the first-stage limiting component to the base and limiting the first-stage thermoelectric device by setting the first-stage limiting component.

[0018] The steps for constructing a second-stage thermoelectric device include: setting a second-stage thermoelectric arm on the second ceramic substrate, and setting another second ceramic substrate on top of the second-stage thermoelectric arm to form a second-stage thermoelectric device;

[0019] The limiting step of the second-stage thermoelectric device involves connecting the second-stage limiting component to the first-stage limiting component, with the second-stage limiting component being limited by the first-stage limiting component. The second-stage thermoelectric device is limited by setting the second-stage limiting component.

[0020] As a further improvement to this technical solution, the preparation method further includes a reflow soldering step, which includes soldering the thermoelectric arms of each stage of the multi-stage thermoelectric refrigeration device to the adjacent first ceramic substrate and second ceramic substrate respectively.

[0021] The present invention provides a mold and a method for fabricating a multi-stage thermoelectric refrigeration device, which is used for limiting the multi-stage thermoelectric refrigeration device. The mold includes a base for supporting the multi-stage thermoelectric refrigeration device and a limiting component for limiting the multi-stage thermoelectric refrigeration device. The multi-stage thermoelectric refrigeration device includes multiple sets of stacked single-stage thermoelectric refrigeration devices. The limiting component includes multiple single-stage limiting components that are sequentially adjacent and are used to limit the position of each of the single-stage thermoelectric refrigeration devices. This invention provides a mold and manufacturing method for preparing multi-stage thermoelectric cooling devices. Through the limiting function of the limiting components in the mold, specifically through the limiting components of each single stage, the installation position of each single-stage thermoelectric cooling device is restricted, preventing displacement. This makes the assembly of multi-stage thermoelectric cooling devices simpler and more convenient, facilitating the preparation of multi-stage thermoelectric devices with reliable thermoelectric performance. It simplifies assembly steps, greatly reduces the difficulty of device assembly, and improves assembly and production efficiency. The device can be welded with only one reflow soldering operation, ensuring the consistency and reliability of the weld joint quality. It also facilitates control of the welding process while reducing the thermal impact on the device, thereby reducing the impact on material properties, interfaces, and substrate materials. This effectively avoids serious interface problems or even joint failure at the device weld joint, further reducing the degradation of thermoelectric performance of thermoelectric materials with poor chemical stability, and improving the device preparation yield. This mold can also be used to build even n-stage devices, demonstrating excellent practicality. Furthermore, the overall mold structure is simple, easy to operate, and low in cost, facilitating market application and promotion. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a mold for fabricating a multi-stage thermoelectric refrigeration device provided in an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the mold provided in this embodiment of the invention for preparing a multi-stage thermoelectric refrigeration device;

[0025] Figure 3 This is a schematic diagram of the base in a mold for preparing a multi-stage thermoelectric refrigeration device, provided by an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the second limiting member in a mold for preparing a multi-stage thermoelectric refrigeration device, provided by an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of a two-stage thermoelectric refrigeration device provided in an embodiment of the present invention.

[0028] Numbering on the map:

[0029] 100. Mold; 1. Base; 11. Mounting groove; 12. Clearance groove; 13. Limiting hole; 2. Limiting component; 21. First-level limiting component; 210. First limiting component; 22. Second limiting component; 221. Limiting base plate; 222. Insertion hole; 223. Abutment rod; 200. Second-level thermoelectric refrigeration device; 20a. First-level thermoelectric device; 20b. Second-level thermoelectric device. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0031] It should be noted that the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to direct setup or connection, or indirect setup or connection through centered components or centered structures.

[0032] Furthermore, in embodiments of this invention, terms such as "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, or in a conventional placement or usage state. These terms are merely for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the structures, features, devices, or elements referred to must have a specific orientation or positional relationship, nor that they must be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0033] The various specific technical features and embodiments described in the detailed embodiments can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the various specific technical features / embodiments in this invention will not be described separately.

[0034] like Figure 1 and Figure 2As shown in the figure, an embodiment of the present invention provides a mold for fabricating a multi-stage thermoelectric refrigeration device, used for limiting the multi-stage thermoelectric refrigeration device. The mold includes a base 1 for supporting the multi-stage thermoelectric refrigeration device (e.g., ...). Figure 3 (as shown) and a limiting component 2 for limiting the multi-stage thermoelectric refrigeration device; the multi-stage thermoelectric refrigeration device includes multiple sets of stacked single-stage thermoelectric refrigeration devices, and the limiting component 2 includes multiple single-stage limiting components that are sequentially adjacent and are used to limit each of the single-stage thermoelectric refrigeration devices. This embodiment provides a mold for fabricating multi-stage thermoelectric cooling devices. Through the limiting function of the limiting component 2 in the mold 100, specifically through the limiting components of each single stage, the installation position of each single-stage thermoelectric cooling device is restricted, preventing displacement. This makes the assembly of multi-stage thermoelectric cooling devices simpler and more convenient, facilitating the fabrication of multi-stage thermoelectric devices with reliable thermoelectric performance. It simplifies assembly steps, greatly reduces the difficulty of device assembly, and improves assembly and production efficiency. Only one reflow soldering is required to complete the welding of the device. Single welding helps ensure the consistency and reliability of the weld joint quality, making it easier to control the welding process while reducing the thermal impact on the device, thereby reducing the impact on material properties, interfaces, and substrate materials. It can effectively prevent device failure caused by multiple welding operations. Through such mold construction, even n-stage devices can be further constructed, demonstrating excellent practicality.

[0035] In specific applications, the multi-stage thermoelectric cooling device is an N-stage thermoelectric cooling device that includes at least a first-stage thermoelectric device 20a and a second-stage thermoelectric device 20b, i.e., N≥2 and is an integer. The second-stage thermoelectric device 20b is stacked on top of the first-stage thermoelectric device 20a. The first-stage thermoelectric device 20a is mounted on the base 1. The base 1 has a mounting groove 11 for mounting the first-stage thermoelectric device 20a. The second-stage thermoelectric device 20b is mounted on the first-stage thermoelectric device 21. The limiting component 2 is provided with at least a first-stage limiting component 21 and a second-stage limiting component limited by the first-stage limiting component 21. The first-stage limiting component 21 limits the first-stage thermoelectric device 20a, and the second-stage limiting component limits the second-stage thermoelectric device 20b. The first-stage limiting component 21 is connected to the base 1, and the second-stage limiting component is connected to the first-stage limiting component 21.

[0036] Specifically, in some embodiments, the thermoelectric device located at the bottom is the M-th level thermoelectric device, and the thermoelectric device located above and adjacent to the M-th level thermoelectric device is the M+1-th level thermoelectric device, and the value of M is [1, ..., N-1] in sequence. The base 1 has a mounting groove 11 for mounting the first level thermoelectric device 20a; the limiting component 2 includes an M-th level limiting component for limiting the M-th level thermoelectric device and an M+1-th level limiting component for stacking the M+1-th level thermoelectric device at a set position above the M-th level thermoelectric device. More specifically, when N=2, M is 1, meaning the multi-stage thermoelectric refrigeration device is a two-stage thermoelectric refrigeration device, and the limiting component 2 includes a first-stage limiting component 21 and a second-stage limiting component; when N=3, the multi-stage thermoelectric refrigeration device is a three-stage thermoelectric refrigeration device, meaning M can take values ​​of 1 and 2 sequentially, and the limiting component 2 includes a first-stage limiting component 21, a second-stage limiting component, and a third-stage limiting component; when N is greater than 3, M can take values ​​of 1, 2, and 3 sequentially, and so on. Specifically, the M-th stage thermoelectric device is limited by the M-th stage limiting component, and the M+1-th stage thermoelectric device is limited by the M+1-th stage limiting component, so that each stage of the thermoelectric device can be limited; through such mold construction, even n-stage devices can be further constructed, making it highly practical.

[0037] Specifically, each of the single-stage thermoelectric cooling devices includes two opposing ceramic substrates and a thermoelectric arm sandwiched between the two ceramic substrates. Specifically, the ceramic substrates adjacent to each of the two adjacent thermoelectric cooling devices are shared substrates.

[0038] In some embodiments, the limiting component includes an M-level limiting component, which includes a plurality of M-level limiting members respectively used to abut against each side of the M-level thermoelectric device; the (M+1)-level limiting component includes a plurality of (M+1)-level limiting members connected to the M-level limiting member and used to abut against the (M+1)-level thermoelectric device. Specifically, for example, when M is 3, the multi-stage thermoelectric cooling device further includes a third-stage thermoelectric device and a third-level limiting component limited by the second-level limiting component and used to limit the third-stage thermoelectric device; each stage of the thermoelectric device has a corresponding limiting member for limiting, and the (M+1)-level limiting member and the M-level limiting member may have the same shape or similar shape, as can be seen in the following embodiments.

[0039] In some embodiments, the base 1 is provided with a plurality of limiting holes 13 and the plurality of limiting holes 13 are arranged along the outer periphery of the mounting groove 11; the first-level limiting component 21 includes a first limiting member 210 disposed in each of the limiting holes 13 and used for limiting the first-level thermoelectric device 20a; the second-level limiting component includes a second limiting member 22 (e.g., Figure 4As shown, the second limiting member 22 includes a limiting base plate 221 at its bottom for contacting the top of the first-stage thermoelectric device 20a. The limiting base plate 221 has an insertion hole 222 for the first limiting member 210 to be inserted into. An abutment rod 223 for abutting against the second-stage thermoelectric device 20b is provided at one end of the limiting base plate 221 near the second-stage thermoelectric device 20b. In this embodiment, the limiting base plate 221 and the abutment rod 223 are integrally connected. The first limiting member 210 is a cylindrical pin for insertion into the limiting hole 13. The shape of the limiting hole 13 is adapted to the cylindrical pin, and the limiting hole 13 can be a blind hole.

[0040] In some embodiments, the limiting holes 13 include two transverse limiting holes arranged in the transverse direction along the center of the mounting groove 11 and two longitudinal limiting holes arranged in the longitudinal direction along the center of the mounting groove 11. In this embodiment, four limiting holes 13 are provided, and four first limiting members 210 and four second limiting members 22 are provided respectively. A first limiting space for clamping the first-stage thermoelectric device 20a is formed between two first limiting members 210 located in the same direction; a second limiting space for clamping the second-stage thermoelectric device 20b is formed between two second limiting members 22 located in the same direction; by restricting the first-stage thermoelectric device 20a to the first limiting space and the second-stage thermoelectric device 20b to the second limiting space, the relative positions of the first-stage thermoelectric device 20a and the second-stage thermoelectric device 20b can be fixed to prevent displacement.

[0041] Specifically, when the number of stages of the multi-stage thermoelectric refrigeration device is three or more, the mold 100 includes a third limiting member, ..., the Nth limiting member, where N>3. The structure of the third limiting member, ..., the Nth limiting member can be the same as that of the second limiting member 22, or they can be similar but different in size, or they can all be different, and this should not be a limitation.

[0042] In specific applications, the mold 100 also has an adjustment structure for adjusting the distance between the two relative M-level limiting members. By adjusting the distance between the two relative M-level limiting members, the pressure between the two M-level limiting members and the M-level thermoelectric device can be adjusted. Alternatively, when release is required, the distance can be increased by adjusting the distance to release the pressure of the M-level limiting members on the thermoelectric device, so that the thermoelectric device can be removed from the mold 100. Of course, to facilitate the adjustment of the adjustment structure, the mounting groove 11 is used as a first-level thermoelectric device 20a. The limiting function can be omitted in other embodiments, or replaced by multiple (two as an example) limiting posts or limiting plates to limit the ceramic substrate in the first-stage thermoelectric device 20a. The two limiting posts are set on opposite sides of the first-stage thermoelectric device 20a and located in the longitudinal direction of the center of the first-stage thermoelectric device 20a. The two limiting posts are symmetrical with respect to the center of the first-stage thermoelectric device 20a. At this time, two limiting holes 13 can be set. The two limiting holes 13 are symmetrical with respect to the center of the first-stage thermoelectric device 20a. The two limiting holes 13 are set on opposite sides of the first-stage thermoelectric device 20a. Laterally located at the center of the first-stage thermoelectric device 20a; in one embodiment, the adjustment structure comprises multiple mounting positions, that is, each limiting hole 13 is divided into multiple limiting sub-holes, and the limiting component 2 can be inserted into different limiting sub-holes to adjust the limiting distance; in one embodiment, the adjustment structure comprises multiple snap-fit ​​structures provided on the inner wall of the limiting hole 13, the distance between the multiple snap-fit ​​structures can be set according to actual needs, and the outer side of the first limiting component 210 is provided with a snap-fit ​​part adapted to the snap-fit ​​structure, the snap-fit ​​structure The structure and the snap-fit ​​part can be set as a snap-fit ​​and a snap-fit ​​hole. By cooperating with different snap-fit ​​structures, the spacing can be adjusted. Of course, each limiting member, such as the second limiting member 22, the third limiting member, ..., the Nth limiting member, can be provided with an adjustment structure. This allows the pressure between the limiting member at different levels and the thermoelectric device at that level to be adjusted separately. That is, the spacing between two corresponding Mth level limiting members can be adjusted. Alternatively, by adjusting the first limiting member 210, the spacing between the two corresponding limiting members at each level can be adjusted at once, making adjustment convenient.

[0043] In some embodiments, the limiting component includes a multi-level limiting frame component, with each level of the limiting frame component disposed on the outer periphery of each level of thermoelectric refrigeration device. Each level of the limiting frame component has an abutting wall that abuts against the outer side of each level of thermoelectric refrigeration device. Specifically, the multi-level limiting frame component includes a first-level limiting frame component, which can be a limiting frame with an outer periphery adapted to the first-level thermoelectric device 20a. The multi-level limiting frame component also includes a second-level limiting frame component, which can include a connecting frame for connecting to the top of the limiting frame and a pressing member connected to the connecting frame for pressing against the second-level thermoelectric device 20b. Specifically, the connecting frame is generally frame-shaped with a groove at the bottom for the limiting frame to be inserted into. The pressing member can be integrally connected to the connecting frame and can be a cantilever. Of course, the mold may also include a third-level limiting frame component, which may have the same structure as the second-level limiting frame component, and the specific size may be adjusted accordingly; by using such a mold 100, even n-level devices can be further constructed.

[0044] In some embodiments, a clearance groove 12 is provided at the junction of two adjacent groove walls of the mounting groove 11 to avoid the multi-stage thermoelectric refrigeration device; the clearance groove 12 is connected to the mounting groove 11. In this embodiment, the mounting groove 11 is quadrilateral, and four clearance grooves 12 are provided, respectively located at the included angles of the mounting groove 11, to facilitate the demolding and removal of the entire thermoelectric device.

[0045] Specifically, such as Figure 1 and Figure 2 As shown, in the mold 100 provided in this embodiment, the length and width of the square groove (i.e., mounting groove 11) in the middle of the base 1 are consistent with the length and width of the lower ceramic substrate. Four circular grooves (i.e., clearance grooves 12) are machined at the four corners of the groove to facilitate the insertion and removal of the substrate and the device. At the same time, four hollow frustum grooves (i.e., limiting holes 13) are machined on the outer side of the four sides of the square groove to provide space for inserting the pin (i.e., the first limiting member 210). The hole (i.e., the insertion hole 222) in the positioning rod (i.e., the second limiting member 22) is racetrack-shaped and consistent with the geometric shape and size of the pin's platform.

[0046] This invention also provides a method for fabricating a multi-stage thermoelectric refrigeration device. The multi-stage thermoelectric refrigeration device is fabricated using the mold 100 described above. Each stage of the thermoelectric device has a thermoelectric arm, a first ceramic substrate located on one side of the thermoelectric arm, and a second ceramic substrate located on the other side of the thermoelectric arm. The fabrication method includes building multiple sets of stacked single-stage thermoelectric refrigeration devices step by step, and using single-stage limiting components to limit the construction of each single-stage thermoelectric refrigeration device.

[0047] In some embodiments, the preparation method includes at least the following steps:

[0048] The steps for constructing the first-stage thermoelectric device include: placing a first ceramic substrate in the mounting groove 11, setting a first-stage thermoelectric arm on one side of the first ceramic substrate, and setting a second ceramic substrate on the other side of the first-stage thermoelectric arm to form a first-stage thermoelectric device 20a; specifically, solder paste is coated on the corresponding ceramic substrate, which has a certain adhesion effect on the thermoelectric particles in the thermoelectric arm and is not easy to move.

[0049] The limiting step of the first-stage thermoelectric device involves connecting the first-stage limiting component 21 to the base 1 and limiting the first-stage thermoelectric device 20a by setting the first-stage limiting component 21.

[0050] The steps for constructing the second-stage thermoelectric device include: setting a second-stage thermoelectric arm on the second ceramic substrate, and setting another second ceramic substrate on top of the second-stage thermoelectric arm to form a second-stage thermoelectric device 20b; specifically, the lower ceramic substrate of the first-stage thermoelectric device 20a and the upper ceramic substrate of the second-stage thermoelectric device 20b are the same ceramic substrate.

[0051] The limiting step of the second-stage thermoelectric device involves connecting the second-stage limiting component to the first-stage limiting component 21, and limiting the second-stage limiting component by the first-stage limiting component 21. The second-stage thermoelectric device 20b is limited by setting the second-stage limiting component.

[0052] In some embodiments, the fabrication method further includes a single reflow soldering step. The multi-stage thermoelectric cooling device is an N-stage thermoelectric cooling device. The single reflow soldering step includes welding the thermoelectric arms of each stage of the N-stage thermoelectric cooling device to adjacent first and second ceramic substrates, respectively. Specifically, the reflow soldering step can be completed after the N-stage thermoelectric cooling device is removed from the mold 100. In this embodiment, the reflow soldering is completed before the device is removed from the mold 100. The overall welding of the device can be completed in one reflow soldering step, which simplifies the device fabrication process. Furthermore, the welding process quality is consistent and guaranteed, which is beneficial for obtaining a thermoelectric device with stable performance.

[0053] In some embodiments, the multi-stage thermoelectric cooling device is an N-stage thermoelectric cooling device. When the number of stages of the N-stage thermoelectric cooling device is 3 or more, the preparation method further includes the steps of constructing the (M+1)th stage thermoelectric cooling device and limiting the (M+1)th stage thermoelectric device, wherein the value of M is [2, ..., N-1] in sequence. Each stage thermoelectric cooling device is followed by the corresponding limiting thermoelectric cooling device, and so on, to construct an N-stage thermoelectric cooling device.

[0054] Specifically, using a secondary thermoelectric refrigeration device 200 (such as...) Figure 5Taking the setup shown as an example, firstly, multiple n-type thermoelectric particles and multiple p-type thermoelectric particles are arranged in an array on a ceramic substrate (i.e., the first ceramic substrate) coated with solder paste, according to predetermined positions. Then, the ceramic substrate (i.e., the first ceramic substrate) is placed into the base 1 of the mold 100 to form the lower substrate of the first-stage thermoelectric device 20a. Next, four frustum-shaped pins (i.e., the first limiting member 210) are inserted into the frustum-shaped holes (i.e., the limiting holes 13) of the substrate base 1. Once again, n-type thermoelectric particles and p-type thermoelectric particles are arranged in an array on the ceramic substrate coated with solder paste, according to predetermined positions. With the positioning of the four frustum-shaped pins, the ceramic substrate (i.e., the second ceramic substrate) is placed on the thermoelectric particle array of the first-stage thermoelectric device 20a to form the upper substrate of the first-stage thermoelectric device 20a. Then, four perforated positioning rods (i.e., the second limiting member 22) are fitted into the four frustum-shaped pins. Meanwhile, the distance between each pair of mirror-arranged positioning rods is consistent with the length or width of the upper substrate of the second stage of the device. Subsequently, the ceramic substrate coated with solder paste is placed on the thermoelectric particle array of the first stage of the device according to the positioning of the perforated positioning rod (i.e., the second limiting member 22), forming the upper substrate of the second-stage thermoelectric device 20b. Finally, the perforated positioning rod is removed first, then the pin is removed, and then the multi-stage device is removed from the base 1. The second-stage thermoelectric cooling device 200 is then fabricated by a single reflow soldering, or the second-stage thermoelectric cooling device 200 is removed from the mold 100 after a single reflow soldering.

[0055] Based on the design concept of the mold 100, it is possible to continue to design and provide positioning rods with holes (i.e., the third limiting part, ..., the Nth limiting part), so as to realize the construction of three-level, four-level to N-level thermoelectric refrigeration devices, greatly reducing the assembly difficulty of multi-level thermoelectric refrigeration devices, and realizing the one-step welding of multi-level thermoelectric refrigeration devices to complete the preparation of thermoelectric devices.

[0056] This invention provides a mold and preparation method for fabricating multi-stage thermoelectric cooling devices. The Mth-stage thermoelectric device is limited by a limiting component, and the M+1th-stage thermoelectric device is limited by a limiting component, and so on, until an N-stage thermoelectric cooling device is formed. The limiting component 2 in the mold 100 makes the construction of multi-stage thermoelectric cooling devices simpler and more convenient, facilitating the fabrication of multi-stage thermoelectric devices with reliable thermoelectric performance. It simplifies assembly steps, greatly reduces the difficulty of device assembly, and improves construction and production efficiency. Only one reflow soldering is required to complete the welding of the device. One-time welding helps ensure the consistency and reliability of the weld joint quality, makes it easier to control the welding process, and reduces the thermal impact on the device, thereby reducing the impact on material properties, interfaces, and substrate materials. It can effectively prevent device failure caused by multiple welding operations. This mold construction method can further construct even n-stage devices, demonstrating excellent practicality.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A mold for fabricating multi-stage thermoelectric refrigeration devices, used for limiting the movement of the multi-stage thermoelectric refrigeration devices, characterized in that, The mold includes a base for supporting a multi-stage thermoelectric refrigeration device and a limiting component for limiting the multi-stage thermoelectric refrigeration device; the multi-stage thermoelectric refrigeration device includes multiple sets of stacked single-stage thermoelectric refrigeration devices, and the limiting component includes multiple single-stage limiting components that are sequentially adjacent and respectively used to limit each of the single-stage thermoelectric refrigeration devices. The multi-stage thermoelectric cooling device includes at least a first-stage thermoelectric device and a second-stage thermoelectric device; the base has a mounting groove for mounting the first-stage thermoelectric device, and the second-stage thermoelectric device is mounted on the first-stage thermoelectric device. The limiting component includes at least a first-level limiting component for limiting the first-level thermoelectric device, and a second-level limiting component limited by the first-level limiting component and for limiting the second-level thermoelectric device. The first-level limiting component is connected to the base, and the second-level limiting component is connected to the first-level limiting component. The base is provided with a plurality of limiting holes and the plurality of limiting holes are arranged along the outer periphery of the mounting groove; the first-level limiting component includes a first limiting member disposed in each of the limiting holes and used for limiting each side of the first-level thermoelectric device; The second-level limiting component includes a second limiting member, which includes a limiting base plate at the bottom for contacting the top of the first-level thermoelectric device. The limiting base plate has an insertion hole for the first limiting member to be inserted into, and an abutment rod for abutting against the second-level thermoelectric device is provided at one end of the limiting base plate near the second-level thermoelectric device. The multi-stage thermoelectric cooling device includes a third-stage thermoelectric device mounted on the second-stage thermoelectric device; the limiting component further includes a third-stage limiting component, which includes a plurality of third-stage limiting members respectively used to abut against each side of the third-stage thermoelectric device; The first limiting member is a cylindrical pin; when the number of stages of the multi-stage thermoelectric refrigeration device is three or more, the mold includes a third limiting member, the structure of which is the same as that of the second limiting member.

2. The mold as described in claim 1, characterized in that, The limiting holes include two transverse limiting holes arranged in the transverse direction along the center of the mounting groove and two longitudinal limiting holes arranged in the longitudinal direction along the center of the mounting groove; the first limiting member and the second limiting member are each provided with four.

3. The mold as described in claim 2, characterized in that, A first limiting space for clamping the first-stage thermoelectric device is formed between two first limiting members located in the same direction; a second limiting space for clamping the second-stage thermoelectric device is formed between two second limiting members located in the same direction.

4. The mold as described in claim 1, characterized in that, The mounting slot has a clearance groove at the junction of two adjacent slot walls to avoid the multi-stage thermoelectric refrigeration device; the clearance groove is connected to the mounting slot.

5. A method for fabricating a multi-stage thermoelectric refrigeration device, comprising fabricating the multi-stage thermoelectric refrigeration device using a mold as described in any one of claims 1 to 4, wherein each stage of the thermoelectric device has a thermoelectric arm, a first ceramic substrate located on one side of the thermoelectric arm, and a second ceramic substrate located on the other side of the thermoelectric arm, characterized in that, The preparation method includes building multiple sets of stacked single-stage thermoelectric refrigeration devices in stages, and using single-stage limiting components to limit the position of each of the built single-stage thermoelectric refrigeration devices.

6. The preparation method according to claim 5, characterized in that, The preparation method includes the following steps: The steps for constructing the first-stage thermoelectric device include: placing a first ceramic substrate in the mounting groove, setting a first-stage thermoelectric arm on one side of the first ceramic substrate, and setting a second ceramic substrate on the other side of the first-stage thermoelectric arm to form a first-stage thermoelectric device. The limiting step of the first-stage thermoelectric device involves connecting the first-stage limiting component to the base and limiting the first-stage thermoelectric device by setting the first-stage limiting component. The steps for constructing a second-stage thermoelectric device include: setting a second-stage thermoelectric arm on the second ceramic substrate, and setting another second ceramic substrate on top of the second-stage thermoelectric arm to form a second-stage thermoelectric device; The limiting step of the second-stage thermoelectric device involves connecting the second-stage limiting component to the first-stage limiting component, with the second-stage limiting component being limited by the first-stage limiting component. The second-stage thermoelectric device is limited by setting the second-stage limiting component.

7. The preparation method according to claim 6, characterized in that, The preparation method further includes a reflow soldering step, which involves soldering the thermoelectric arms of each stage of the multi-stage thermoelectric refrigeration device to the adjacent first ceramic substrate and second ceramic substrate.

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