A method for preparing a curved high temperature resistant polymer precursor ceramic thin film sensor

Abstract

The present invention relates to the field of sensor technology, and in particular to a method for preparing a curved surface high temperature resistant polymer precursor ceramic thin film sensor. The method comprises the following steps: using a plane direct writing device to directly write a polymer precursor ceramic thin film pattern on a plane substrate surface that is easily soluble in water using a polymer precursor liquid containing a filler, placing the polymer precursor liquid in water to melt the plane substrate after solidification, rinsing the polymer precursor film and then fishing it out to dry it to obtain a discrete unsupported polymer precursor film; coating the polymer precursor liquid on the surface of the curved substrate to obtain a precursor liquid film; placing the discrete unsupported polymer precursor film on the precursor liquid film to conform to the curved surface, and pyrolyzing it after solidification to obtain a curved surface high temperature resistant polymer precursor ceramic thin film sensor. The method of the present invention does not require expensive equipment, has a simple process, low cost, and is easy to prepare on a large scale industrial basis, and is suitable for temperature and heat flow testing of curved high temperature components.

Description

Technical Field

[0001] The invention relates to the technical field of sensors, and in particular to a method for preparing a curved surface high-temperature resistant polymer precursor ceramic thin film sensor. Background Art

[0002] The acquisition of parameters such as surface temperature and heat flow in curved surfaces such as turbine blades is of great significance for health monitoring and component design verification. At present, the preparation of curved thin film sensors mainly adopts physical vapor deposition or chemical vapor deposition. For example, the Chinese invention patent with application number 201811300429.7 uses ion deposition to prepare curved thin film sensors. There are also reports on the use of five-axis printing platforms to prepare thin film sensors, such as the Chinese invention patent CN115900986A uses a five-axis printing system to prepare curved thin film temperature sensors. First, the above methods require expensive equipment and high costs. For example, vapor deposition requires special vapor deposition equipment, and the five-axis printing platform is also a very complex and expensive equipment; secondly, these methods have complex process steps, vapor deposition requires a special flexible template, target material preparation, and multiple targets are required to prepare a slightly uniform thin film, and the five-axis printing platform requires the model of the curved surface to be known in advance, and then a complex program is written; finally, the scope of application of these methods is limited. Thin film sensors can only be prepared on the surface of the surface, and thin film sensors cannot be prepared inside the cavity, so the scope of application is limited. Chinese invention patent CN117030043B uses a flexible screen printing method to prepare a polymer precursor ceramic thin film sensor on a curved surface. This method is costly and requires equipment such as lasers and a polyimide template. At the same time, this method is complex and requires the use of a laser to prepare the template. The template needs to be removed after printing, and the template removal process easily destroys the printed pattern, resulting in a low success rate for preparation.

[0003] Therefore, providing a method for preparing a curved high-temperature resistant polymer precursor ceramic thin film sensor with low preparation cost and simple process is of great significance to the field of sensor technology. Summary of the invention

[0004] Based on the above content, the present invention provides a method for preparing a curved high-temperature resistant polymer precursor ceramic thin film sensor.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] One of the technical solutions of the present invention is a method for preparing a curved high temperature resistant polymer precursor ceramic thin film sensor, comprising the following steps:

[0007] Using a plane direct writing device to directly write a polymer precursor ceramic film pattern on a plane substrate surface that is easily soluble in water with a polymer precursor liquid containing a filler, and solidifying the polymer precursor film to obtain a polymer precursor film;

[0008] Putting the polymer precursor film together with the planar substrate into water to melt the planar substrate, rinsing the polymer precursor film and then taking it out to dry, thereby obtaining a discrete unsupported polymer precursor film;

[0009] Coating a polymer precursor liquid on the surface of a curved substrate to obtain a precursor liquid film; placing the discrete unsupported polymer precursor film on the precursor liquid film so that the discrete unsupported polymer precursor film conforms to the curved surface of the curved substrate, and obtaining a polymer precursor film conforming to the curved surface adhered to the curved substrate after curing;

[0010] The curved surface conformal polymer precursor film and the curved surface substrate are pyrolyzed to obtain the curved surface high temperature resistant polymer precursor ceramic film sensor.

[0011] Furthermore, the polymer precursor liquid is polysilazane or polysiloxane; the filler is conductive nanopowder, specifically titanium diboride nanopowder and / or zirconium diboride nanopowder.

[0012] Furthermore, the planar substrate is a substrate that is easily soluble in water, such as rock sugar or sodium chloride; other planar substrates that are easily soluble in water are also suitable for the present invention.

[0013] Furthermore, the curing in the process of preparing the polymer precursor film is specifically: standing in the air for 2 to 3 hours.

[0014] Furthermore, the curved substrate is an insulating ceramic, specifically aluminum oxide, silicon nitride, etc.

[0015] Furthermore, the curing during the preparation of the curved conformal polymer precursor film is specifically performed by standing in the air for 2 to 3 hours.

[0016] Furthermore, the pyrolysis is specifically as follows: under a vacuum degree of 10 to 700 Pa, the temperature is increased to 800 to 1400° C. at a heating rate of 5 to 10° C. / min, maintained for 1 to 2 hours, and then cooled to room temperature at a cooling rate of 5 to 10° C. / min.

[0017] Furthermore, before or after the pyrolysis, a step of preparing a lead wire is included. The lead wire is a platinum wire or a nickel-chromium wire, and the diameter of the lead wire is 0.1 to 0.5 mm.

[0018] The second technical solution of the present invention is a curved high-temperature resistant polymer precursor ceramic thin film sensor prepared according to the above-mentioned preparation method.

[0019] Furthermore, the thickness of the curved surface high temperature resistant polymer precursor ceramic film in the curved surface high temperature resistant polymer precursor ceramic film sensor is 5 μm to 50 μm.

[0020] A third technical solution of the present invention is the application of the above-mentioned curved surface high temperature resistant polymer precursor ceramic thin film sensor in testing the surface temperature and heat flow of curved surfaces.

[0021] A fourth technical solution of the present invention is a method for preparing a curved surface high temperature resistant polymer precursor ceramic thin film sensor using a plane direct writing device, which adopts the above-mentioned method for preparing a curved surface high temperature resistant polymer precursor ceramic thin film sensor.

[0022] Technical concept of the present invention:

[0023] A planar polymer precursor ceramic film pattern with a micron-level thickness is prepared on a planar substrate that is easily soluble in water, such as flat rock sugar, using the direct writing device in Chinese invention patent CN110962220B. After solidification, the substrate (rock sugar, etc.) is placed in water to melt to obtain a flexible discrete film. After rinsing in deionized water, the obtained discrete film is fished out and dried. An ultra-thin layer of pure precursor liquid such as polysilazane and polysiloxane is applied to the curved ceramic substrate, and then a flexible dry discrete film is placed on the precursor liquid on the curved ceramic substrate. The discrete film is gently pressed to conform to the curved surface, and the precursor liquid is left for a period of time to solidify. The discrete film adheres to the curved substrate through the pure precursor liquid, forming a curved conformal precursor film. In this way, there is no need to use a five-axis inkjet printing device, and only a planar direct writing device is needed to complete the curved conformal patterning of a complex curved surface sensor film.

[0024] Next, the curved surface conformal precursor film can be directly pyrolyzed in a low vacuum, and the pure ultra-thin precursor liquid film around the discrete film is transformed into oxides such as silicon dioxide with extremely high resistivity, and the discrete film is transformed into a curved surface conformal sensing film, and then the sensing film is wired for connection to obtain a curved surface sensor. It is also possible to use the method of Chinese invention patent CN117030043B to print a protective layer on the discrete film using curved screen printing, and then prepare solder joints, and pyrolyze the discrete film, solder joints and protective layer at one time to obtain a curved surface sensor.

[0025] The present invention discloses the following technical effects:

[0026] The present invention adopts a method based on planar direct writing printing-brushing to prepare thin film sensors such as curved surface polymer precursor ceramic thin film temperature or heat flow sensors. Compared with vapor deposition or five-axis direct writing or curved surface screen printing, it does not require expensive equipment, has a simple process, low cost, and is easy to prepare on a large scale industrially. It is suitable for temperature and heat flow testing of curved high-temperature components. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 The schematic diagram of the structure of the ceramic thin film temperature sensor prepared by the method of the present invention; in the figure, 1-curved substrate, 2-precursor liquid film, 3-discrete unsupported polymer precursor film, 4-soldering point, 5-lead, 6-lead, 7-soldering point.

[0029] Figure 2 This is an actual optical image of the curved ceramic thin film temperature sensor prepared in Example 1 of the present invention.

[0030] Figure 3 This is a physical optical image of the inner surface curved ceramic thin film temperature sensor prepared in Example 3 of the present invention.

[0031] Figure 4 This is an actual optical image of the curved ceramic thin film temperature sensor prepared in Example 2 of the present invention.

[0032] Figure 5 This is a real optical picture of the polymer precursor ceramic film directly printed on rock sugar in Example 1 of the present invention.

[0033] Figure 6 This is a real optical picture of the polymer precursor ceramic film (curved ceramic sensitive film) after vacuum pyrolysis in Example 1 of the present invention.

[0034] Figure 7 The three-round resistance variation test curve of the curved ceramic thin film temperature sensor prepared in Example 1 of the present invention.

[0035] Figure 8 This is a test curve of the resistance and temperature changes over time of the curved ceramic thin film temperature sensor prepared in Example 1 of the present invention.

[0036] Fig. 9 This is a test curve of the change of three-wheel resistance of the curved ceramic thin film temperature sensor prepared in Example 2 of the present invention with temperature.

[0037] Fig.10 This is a test curve of the resistance and temperature changes over time of the curved ceramic thin film temperature sensor prepared in Example 2 of the present invention. DETAILED DESCRIPTION

[0038] Various exemplary embodiments of the present invention will now be described in detail. This detailed description should not be considered as limiting the present invention, but should be understood as a more detailed description of certain aspects, features, and embodiments of the present invention.

[0039] It should be understood that the terms described in the present invention are only for describing a particular embodiment and are not intended to limit the present invention. In addition, for the numerical range in the present invention, it should be understood that each intermediate value between the upper and lower limits of the scope is also specifically disclosed. The intermediate value in any stated value or stated range, and each smaller range between any other stated value or intermediate value in the described range is also included in the present invention. The upper and lower limits of these smaller ranges can be independently included or excluded in the scope.

[0040] Unless otherwise indicated, all technical and scientific terms used herein have the same meanings as those generally understood by those skilled in the art. Although the present invention describes only preferred methods and materials, any methods and materials similar or equivalent to those described herein may also be used in the implementation or testing of the present invention. All documents mentioned in this specification are incorporated by reference to disclose and describe the methods and / or materials associated with the documents. In the event of a conflict with any incorporated document, the content of this specification shall prevail.

[0041] It will be apparent to those skilled in the art that various modifications and variations may be made to the specific embodiments of the present invention description without departing from the scope or spirit of the present invention. Other embodiments derived from the present invention description will be apparent to the skilled artisan. The present invention description and examples are exemplary only.

[0042] The words “include,” “including,” “have,” “contain,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0043] The first aspect of the present invention provides a method for preparing a curved surface high temperature resistant polymer precursor ceramic thin film sensor, comprising the following steps:

[0044] Using a plane direct writing device to directly write a polymer precursor ceramic film pattern on a plane substrate surface that is easily soluble in water with a polymer precursor liquid containing a filler, and solidifying the polymer precursor film to obtain a polymer precursor film;

[0045] Putting the polymer precursor film together with the planar substrate into water to melt the planar substrate, rinsing the polymer precursor film and then taking it out to dry, thereby obtaining a discrete unsupported polymer precursor film;

[0046] Coating a polymer precursor liquid on the surface of a curved substrate to obtain a precursor liquid film; placing the discrete unsupported polymer precursor film on the precursor liquid film so that the discrete unsupported polymer precursor film conforms to the curved surface of the curved substrate, and obtaining a polymer precursor film conforming to the curved surface adhered to the curved substrate after curing;

[0047] The curved surface conformal polymer precursor film and the curved surface substrate are pyrolyzed to obtain the curved surface high temperature resistant polymer precursor ceramic film sensor.

[0048] In some embodiments of the present invention, the method for preparing the curved high temperature resistant polymer precursor ceramic thin film sensor comprises the following steps:

[0049] ① Filling 10-30wt% of titanium diboride nanopowder and 10-20wt% of zirconium diboride nanopowder into a precursor liquid such as polysilazane or polysiloxane, and magnetically stirring for 1-2 hours to form a polymer precursor liquid containing fillers, and using a plane direct writing device to prepare a polymer precursor ceramic polymer film pattern with a line width of 0.1mm-0.5mm and a thickness of 3μm-50μm on a flat substrate such as crystal sugar that is easily soluble in water by a direct writing method. The pattern is determined according to the sensor type and design, and the polymer precursor film is placed in the air for 2-3 hours to solidify the polymer precursor film to obtain a solidified polymer precursor film;

[0050] ② Place the solidified polymer precursor film together with the substrate in deionized water for 5 to 10 minutes to melt the substrate and float the solidified polymer precursor film on the water surface to form a discrete precursor film. Rinse the film in deionized water and then remove the discrete precursor film with a filter. Spread the film on dust-free paper and dry it for 2 to 3 hours to obtain a dry discrete unsupported polymer precursor film.

[0051] ③ Use a brush to dip a precursor liquid such as polysilazane or polysiloxane without fillers, and apply a layer of 0.1-0.5 μm pure precursor liquid film on the ceramic curved surface substrate, place a separate unsupported polymer precursor film on the precursor liquid film on the ceramic curved surface, and gently press with a flexible filter to make the separate unsupported polymer precursor film conformal to the ceramic curved surface substrate, and then let it stand for 2-3 hours to solidify the precursor liquid film, and obtain a polymer precursor film with a curved surface conformal;

[0052] ④ Place the curved conformal polymer precursor film together with the curved substrate into a tube furnace, evacuate to a vacuum degree of 10-700 Pa, heat to 800-1400°C at a heating rate of (5-10)°C / min, keep warm for 1-2 hours, and then cool to room temperature at a cooling rate of (5-10)°C / min to obtain a curved ceramic sensitive film with a thickness of 3μm-50μm (composed of a composite material of SiCN, SiAlCN, SiBCN, SiOC, SiC, etc. and conductive powder), and then prepare leads;

[0053] Alternatively, a protective layer is directly written on a curved conformal polymer precursor film, and then a lead connection is prepared, and the curved conformal polymer precursor film, the protective layer and the lead connection are placed in a tube furnace, and the curved conformal polymer precursor film, the protective layer and the lead connection are pyrolyzed at one time to obtain a curved high temperature resistant polymer precursor ceramic film sensor;

[0054] Since the pure precursor liquid film is very thin, it is oxidized into a thin layer of SiO2 under low vacuum, which has no effect on the curved ceramic sensitive film pattern; then a high-temperature lead connection is prepared to obtain a curved high-temperature resistant polymer precursor ceramic thin film sensor. Curved screen printing can also be used to print a protective layer or thermal resistance layer on the curved conformal polymer precursor film, and then solder joints are prepared, and the discrete film, solder joints and protective layer are pyrolyzed at one time to obtain a curved high-temperature resistant polymer precursor ceramic thin film sensor.

[0055] The preparation method of the lead wire comprises the following steps: 10wt% to 30wt% of titanium diboride nanopowder and 10wt% to 30wt% of zirconium diboride nanopowder are filled into a liquid polymer precursor ceramic precursor polysilazane (PSN) or polysiloxane (PSO) or polyborosilazane (PSNB), and magnetically stirred to form a slurry, and then applied to one end of a sodium chloride crystal lead wire (platinum wire) pre-placed therein, so that the diameter of the solder joint is less than 2mm and the thickness is less than 2mm, and then placed in the air for 3 to 4 hours, and then the solder joint is heated to a temperature of 100°C. After solidification, it is placed in deionized water, the sodium chloride crystals are dissolved, and the remaining solder joints connected to the leads (platinum wires) are placed in a drying oven for drying, and then placed in a tubular furnace and subjected to a pyrolysis method consistent with the polymer precursor film conformal to the curved surface to obtain ceramic solder joints connected to the leads (platinum wires). The slurry is applied to the pins of the curved ceramic sensitive film, and one side of the ceramic solder joints is pressed to the pins coated with the slurry, fixed with tape, and placed in a tubular furnace and heated to 800-900°C to obtain a curved high-temperature resistant polymer precursor ceramic film sensor.

[0056] The protective layer or thermal resistance layer is composed of a precursor liquid doped with a certain mass fraction of TiB2 nanopowder or nanopowder with good insulation properties such as BN, MgO, Al2O3, etc.

[0057] A second aspect of the present invention provides a curved surface high temperature resistant polymer precursor ceramic thin film sensor prepared according to the above-mentioned preparation method.

[0058] In some embodiments of the present invention, the thickness of the curved surface high temperature resistant polymer precursor ceramic film in the curved surface high temperature resistant polymer precursor ceramic film sensor is 5 μm to 30 μm.

[0059] If the thickness of the curved surface high temperature resistant polymer precursor ceramic film is too thick, the curved surface high temperature resistant polymer precursor ceramic film will become more brittle and thus cannot be conformal to the curved surface.

[0060] A third aspect of the present invention provides an application of the above-mentioned curved surface high temperature resistant polymer precursor ceramic thin film sensor in testing the surface temperature and heat flow of a curved surface.

[0061] A fourth aspect of the present invention provides a method for preparing a curved surface high temperature resistant polymer precursor ceramic thin film sensor using a plane direct writing device, using the above-mentioned method for preparing a curved surface high temperature resistant polymer precursor ceramic thin film sensor.

[0062] The present invention uses plane direct writing printing to print a polymer precursor ceramic film on a plane substrate that is easily soluble in water, such as crystal sugar or sodium chloride, to prepare a discrete film, and combines a brush coating process to form a curved film. Compared with the curved screen printing method, the cost is further reduced and the process is simple. The method of the present invention can place a flexible discrete polymer precursor film on a curved surface and an inner cavity, has a simple process and a wide range of applications. Compared with the curved film preparation processes such as five-axis printing, sputtering, and evaporation, the direct writing equipment is simple, the cost is reduced, no three-dimensional model of the curved object is required, and no template is required, and the process is simple.

[0063] The direct writing device described in the embodiment of the present invention adopts the direct writing device in Chinese invention patent CN110962220B.

[0064] The present invention is further described below by way of examples.

[0065] Example 1

[0066] ① Fill 20wt% titanium diboride nanopowder and 20wt% zirconium diboride nanopowder into polysilazane liquid, stir magnetically for 2 hours to form a polymer precursor liquid containing filler, and use a direct writing device to write a polymer precursor ceramic film pattern with a line width of 0.5mm and a thickness of 10μm on a flat rock sugar substrate with the polymer precursor liquid containing filler, and place it in the air for 2.5 hours (2 to 3 hours) to obtain a solidified polymer precursor film, such as Figure 5 shown.

[0067] ② Place the above-mentioned solidified polymer precursor film together with the substrate in deionized water for 5 minutes (5 to 10 minutes) to melt the substrate and allow the solidified polymer precursor film to float on the water surface. Rinse it in deionized water, then use a filter to remove the solidified polymer precursor film, spread it on dust-free paper and leave it to dry for 3 hours (2 to 3 hours) to obtain a discrete, unsupported polymer precursor film.

[0068] ③ Use a brush to dip into the polysilazane (or other polymers such as polysiloxane) precursor liquid that does not contain fillers, and brush it onto the outer surface of the curved alumina substrate to form a pure precursor liquid film with a thickness of about 0.3μm. Place the above-mentioned discrete unsupported polymer precursor film on the precursor liquid film, and gently press it with a flexible filter to make the discrete polymer precursor film conformal to the curved surface. Place it in the atmosphere and let it stand for 3 hours to solidify the precursor liquid film, thereby forming a polymer precursor film that is conformal to the curved surface and adheres to the alumina curved substrate.

[0069] ④ Place the above-mentioned curved conformal polymer precursor film together with the curved alumina substrate into a tube furnace, evacuate to 100Pa, heat to 900℃ at a heating rate of 5℃ / min, keep warm for 1 hour, and then cool to room temperature at a cooling rate of 5℃ / min to obtain a curved ceramic sensitive film with a thickness of about 10μm, as shown in FIG. Figure 6 shown.

[0070] ⑤ Preparation of lead connection: 20wt% titanium diboride nanopowder and 30wt% zirconium diboride nanopowder are filled into liquid polysilazane and magnetically stirred into slurry, which is then applied to a section of platinum wire pre-placed with sodium chloride crystals to make the solder joint 2mm in diameter and 2mm in thickness. The solder joint is placed in air for 4 hours to solidify, and then placed in deionized water to dissolve the sodium chloride crystals. The remaining solder joint connected to the platinum wire is placed in a drying oven for drying, and then placed in a tubular furnace for heating in accordance with the curved film (i.e., the heating method is the same as step ④) to obtain a ceramic solder joint connected to the platinum wire, and the slurry is applied to the pin of the above-mentioned curved ceramic sensitive film, and one side of the ceramic solder joint is pressed to the pin coated with the slurry, fixed with tape, and placed in a tubular furnace and heated to 900°C to obtain a curved high-temperature resistant polymer precursor ceramic thin film sensor (abbreviated as: curved ceramic thin film temperature sensor), such as Figure 2 shown.

[0071] The curved ceramic thin film temperature sensor ( Figure 2 Corresponding) is placed in a tube furnace for temperature resistance test, such as Figure 7 The figure shows three rounds of temperature cycle tests of the curved ceramic thin film temperature sensor. It can be seen that the test curve of resistance changing with temperature is almost a straight line, indicating that the sensor has good repeatability. Figure 8The resistance and temperature of the curved ceramic thin film temperature sensor change with time. It can be seen that the sensor responds significantly to temperature. Therefore, it is feasible to prepare a curved thin film sensor using the method of the present invention.

[0072] Example 2

[0073] ①Same as step ① in Example 1.

[0074] ②Same as step ② in Example 1.

[0075] ③Same as step ③ in Example 1.

[0076] ④ Print a layer of polymer precursor protective layer liquid film on the above-mentioned curved conformal polymer precursor film with screen printing, exposing the 2mm pin of the sensing film. The polymer precursor protective layer liquid is polysilazane filled with 30% by mass of titanium diboride nanopowder and 20% by mass of silicon nitride nanopowder and formed by 2 hours of magnetic stirring. Let it stand for 3 hours to wait for the polymer precursor protective layer liquid film to solidify, and then prepare the high-temperature lead. Put it in a tube furnace together with the curved alumina substrate, heat it to 900°C at a heating rate of 5°C / min, keep it warm for 1 hour, and then cool it to room temperature at a cooling rate of 5°C / min to obtain a single pyrolysis curved high-temperature resistant polymer precursor ceramic film sensor (abbreviated as: curved ceramic film temperature sensor), such as Figure 4 shown.

[0077] The curved ceramic thin film temperature sensor ( Figure 4 Corresponding) is placed in a tube furnace for temperature resistance test, such as Fig. 9 The figure shows three rounds of temperature cycle tests of the curved ceramic thin film temperature sensor. It can be seen that the test curve of resistance changing with temperature is almost a straight line, indicating that the sensor has good repeatability. Fig.10 The test curve of the resistance and temperature of the curved ceramic thin film temperature sensor changing with time shows that the curved ceramic thin film temperature sensor has an obvious response to temperature.

[0078] Example 3

[0079] The only difference from Example 1 is that in step ③, the precursor liquid film is brushed onto the curved surface of the inner surface of the alumina, and the remaining steps and parameters are the same as those of Example 1. The curved surface high temperature resistant polymer precursor ceramic thin film sensor prepared in this example is a thin film temperature sensor on the inner surface of a curved ceramic substrate. The actual photo is shown in FIG. Figure 3 shown.

[0080] In summary, it can be seen that it is feasible to prepare curved surface ceramic thin film temperature sensors using the method of the present invention.

[0081] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A method for preparing a curved high temperature resistant polymer precursor ceramic thin film sensor, It is characterized in that The following steps are involved: Using a plane direct writing device to directly write a polymer precursor liquid containing fillers on a plane substrate surface that is easily soluble in water to form a polymer precursor ceramic thin film pattern with a line width of 0.1 mm to 0.5 mm and a thickness of 3 μm to 50 μm, and solidify it to obtain a polymer precursor film; Putting the polymer precursor film together with the planar substrate into water to melt the planar substrate, rinsing the polymer precursor film and then taking it out to dry, thereby obtaining a discrete unsupported polymer precursor film; The polymer precursor liquid is coated on the surface of the curved substrate to obtain a precursor liquid film with a thickness of 0.1 to 0.5 μm; the discrete unsupported polymer precursor film is placed on the precursor liquid film so that the discrete unsupported polymer precursor film is conformal to the curved surface of the curved substrate, and after curing, a polymer precursor film conformal to the curved surface adhered to the curved substrate is obtained; Pyrolyzing the curved surface conformal polymer precursor film together with the curved surface substrate to obtain the curved surface high temperature resistant polymer precursor ceramic film sensor; The thickness of the curved surface high temperature resistant polymer precursor ceramic film in the curved surface high temperature resistant polymer precursor ceramic film sensor is 5 μm to 50 μm; The polymer precursor liquid is polysilazane or polysiloxane; the filler is titanium diboride nanopowder and / or zirconium diboride nanopowder.

2. The method for preparing the curved high temperature resistant polymer precursor ceramic thin film sensor according to claim 1, It is characterized in that The planar substrate is rock sugar or sodium chloride.

3. The method for preparing the curved high temperature resistant polymer precursor ceramic thin film sensor according to claim 1, It is characterized in that The curved substrate is insulating ceramic.

4. The method for preparing the curved high temperature resistant polymer precursor ceramic thin film sensor according to claim 1, It is characterized in that The pyrolysis is specifically as follows: under a vacuum degree of 10-700 Pa, the temperature is raised to 800-1400° C. at a heating rate of 5-10° C. / min, kept at that temperature for 1-2 hours, and then cooled to room temperature at a cooling rate of 5-10° C. / min.

5. The method for preparing the curved surface high temperature resistant polymer precursor ceramic thin film sensor according to claim 1, It is characterized in that The method also includes a step of preparing a lead before or after the pyrolysis.

6. A curved surface high temperature resistant polymer precursor ceramic thin film sensor prepared according to the preparation method according to any one of claims 1 to 5.

7. Application of the curved surface high temperature resistant polymer precursor ceramic thin film sensor as claimed in claim 6 in testing the surface temperature and heat flow of curved surfaces.

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