An IC chip automatic packaging inspection system and its use method

Abstract

The present invention discloses an IC chip automatic packaging inspection system and a method for using the same, which relates to the field of microelectronics technology, and includes an intelligent packaging module, which is used to monitor defects during chip packaging, reduce human influence, and improve packaging efficiency and accuracy; the intelligent packaging module includes: an identification and acquisition unit, a data detection unit, and a precise positioning unit, the identification and acquisition unit is connected to the data detection unit via a network interface, and the data detection unit is connected to the precise positioning unit via a wire. The present invention realizes the function of intelligent chip packaging by designing an intelligent packaging module, solves the problem of slow manual operation and easy error, and improves packaging efficiency and accuracy.

Description

Technical Field

[0001] The present invention relates to the field of microelectronics technology, and in particular to an IC chip automatic packaging inspection system and a use method thereof. Background Art

[0002] With the continuous advancement of automated production and technological development, the automated packaging of IC chips has become an important part of the electronics industry. Traditional IC chip packaging has errors and defects, and the production process is complicated, which can no longer meet the needs of modern electronic technology. With the advancement of science and technology and the development of society, the requirements for IC chip packaging in the field of electronic technology are getting higher and higher. It is hoped that the intelligent and automated IC chip packaging can be realized through advanced technical means to improve the efficiency and reliability of chip packaging.

[0003] Therefore, the present application proposes an IC chip automated packaging inspection system and a method of using the same to meet the urgent needs of IC chip packaging modernization, and to bring a more efficient and intelligent solution to the automated packaging of chips.

[0004] 1. Patent document CN114970441B discloses an automatic wiring method for IC chip packaging. The above patent achieves the maximum reduction of manual operations, saving time and efficiency. While ensuring the accuracy, it can also standardize the drawing format and reduce the later editing operations on the drawings. However, the above patent cannot realize the function of intelligent chip packaging.

[0005] 2. Patent document CN103797498B discloses an RFID tag and an automatic identification system. The above patent realizes that the RFID tag can ensure the communication distance even if it is small, and has heat resistance. It can also reduce the cost compared with the previous on-chip antenna and packaged tags. However, the above patent cannot realize the function of automating the chip packaging process.

[0006] 3. Patent document CN102263080B discloses a four-sided flat leadless three-IC chip package with double bumps and a production method thereof. The above patent realizes the reduction of the carrier, the inner pins extend inward of the carrier, and the bottom of the extended part is exposed to form a small bump. The pit at the bottom of the pin is larger, and the cylindrical exposed part is the same as the ordinary pin frame, which improves the matching of the chip and the carrier, and at the same time improves the product packaging quality and reliability. However, the above patent cannot realize the function of optimizing the image and repairing image defects.

[0007] 4. Patent document CN112978337B discloses an IC package chip discharging device. The above patent realizes that the push rod is in an "H"-shaped structure, connected to the push cylinder, and is provided with push rods parallel to each other. The thickness of the push rod is less than the thickness of the storage tube. The equipment has a high degree of automation, which is conducive to improving production efficiency. However, the above patent cannot realize the function of operator monitoring and management of the automation system.

[0008] In summary, the above patents cannot realize the functions of intelligent chip packaging, automation of the chip packaging process, image optimization and repair of image defects, and operator monitoring and management of the automated system, resulting in complex IC chip packaging process, low chip integration, easy defects, and slow packaging speed.

[0009] To this end, the present application proposes an IC chip automated packaging inspection system that can realize the functions of intelligent chip packaging, automation of the chip packaging process, image optimization and repair of image defects, and operator monitoring and management of the automated system. Summary of the invention

[0010] The purpose of the present invention is to provide an IC chip automated packaging and inspection system and a method of using the same, so as to solve the technical problems proposed in the above background technology that the functions of intelligent chip packaging, automation of the chip packaging process, image optimization and repair of image defects, and operator monitoring and management of the automated system cannot be realized, resulting in a complex IC chip packaging process, low chip integration, easy defects, and slow packaging speed.

[0011] To achieve the above-mentioned object, the present invention provides the following technical solutions: an IC chip automatic packaging inspection system, comprising an intelligent packaging module, wherein the intelligent packaging module is used to monitor defect problems during chip packaging, reduce human influence, and improve packaging efficiency and accuracy;

[0012] The intelligent packaging module includes: an identification and collection unit, a data detection unit and a precise positioning unit, wherein the identification and collection unit is connected to the data detection unit via a network interface, and the data detection unit is connected to the precise positioning unit via a wired connection;

[0013] The identification and acquisition unit automatically captures the length, width and thickness of the detection chip and transmits them to the relevant module;

[0014] The data detection unit inspects the chip entering the system, observes the surface conditions, and checks for defects and abnormalities on the chip surface;

[0015] The precise positioning unit ensures the accuracy of the chip position during the packaging process, thereby improving the speed and efficiency of the chip packaging process.

[0016] Preferably, an automation module is designed in the smart packaging module, and the smart packaging module is connected to the automation module wirelessly, and the automation module is used to complete a large number of chip packaging in a short time to ensure the reliability and stability of the chip;

[0017] The automation module includes: an automatic grasping unit, a visual positioning unit and an automatic packaging unit, the automatic grasping unit and the visual positioning unit are connected via a wired connection, and the visual positioning unit and the automatic packaging unit are connected via a network interface;

[0018] The automatic grabbing unit uses a robot to automatically grab chips and packaging materials, and the drive system controls the work of each component to achieve automatic grabbing of chips;

[0019] The visual positioning unit takes a picture of the target object through an image pickup device, and then transmits the image to a corresponding computing unit;

[0020] The automatic packaging unit uses an automatic packaging machine to weld, bond and package the chips and packaging materials transferred by the robot.

[0021] Preferably, an image optimization module is designed in the smart packaging module, and the smart packaging module is connected to the image optimization module through a network interface. The image optimization module is used to repair image defects, make the collected chip image clearer, make the chip's detailed features more obvious, and ensure that the image has a good display effect on each device;

[0022] The image optimization module includes: an image recognition unit, an image processing unit and an image detection unit, the image recognition unit and the image processing unit are connected by wire, and the image processing unit and the image detection unit are connected by wire;

[0023] The image recognition unit converts the captured chip into an image signal by the image capture device, and then transmits it to the image processing system to extract the image features;

[0024] The image processing unit converts the image signal into a digital signal, extracts the characteristics of the target chip, screens and classifies the detected multiple areas, and finally determines the location and category of the chip in the image;

[0025] After feature extraction, the image detection unit predicts each area of ​​the detection image and determines the target chip to be detected in the area and the location information of the chip.

[0026] Preferably, a human-machine interaction module is designed in the intelligent packaging module, and the intelligent packaging module is connected to the human-machine interaction module through a circuit interface. The human-machine interaction module is used to facilitate operators to monitor and manage the automation system, discover problems in advance and solve them;

[0027] The human-computer interaction module includes: a monitoring unit, an early warning unit and a management unit. The monitoring unit and the early warning unit are connected via a network, and the early warning unit and the management unit are connected via a wireless connection.

[0028] The monitoring unit uses automatic monitoring instruments to monitor the chips in real time and uses image processing technology to monitor appearance defects;

[0029] The early warning unit collects and analyzes monitoring data. If the chip data does not meet the requirements, the early warning device flashes red;

[0030] After the management unit receives the signal from the flashing red light, the operator will perform a defect analysis on the problematic chip to ensure that the repaired chip meets the requirements.

[0031] Preferably, an electrical control module is designed in the automation module, which controls the operation of various components of the mechanical claw to achieve automatic grasping. The electrical control module obtains input electrical signals, filters and converts the collected signals, judges and makes decisions on the processed signals according to the set control logic, and generates corresponding control signals to drive the mechanical claw to automatically grasp chips and packaging materials.

[0032] Preferably, an IC chip automated packaging inspection system according to claim 2 is characterized in that: an optical sensor and a position sensor are designed in the automation module, the optical sensor detects the thickness and surface quality of the packaging material, utilizes the electronic phenomenon generated by the chip under the irradiation of light, and determines the measurement result by measuring the propagation time of the laser pulse, the position sensor ensures that the chip is in the correct position during the packaging process, and the position sensor utilizes the change of the magnetic field to detect the position, provides accurate data for the control system, and realizes precise control operation.

[0033] Preferably, a convolutional neural network is designed in the image optimization module. The convolutional neural network takes the captured chip image as input data, extracts the features of the chip image through convolution operation, introduces nonlinearity, enhances the expression ability of the model, performs dimensionality reduction processing on the feature image to reduce the number of parameters, constructs a multi-layer network to extract more complex features, and converts the features into final output.

[0034] Preferably, an alarm device is designed in the human-computer interaction module, which can detect abnormal conditions in the packaging process in a timely manner. When an abnormal chip is detected, the red light of the alarm device flashes, which helps the operator to detect abnormal conditions in a timely manner and take countermeasures to ensure that the quality of chip packaging meets the requirements.

[0035] Preferably, the method of use comprises the following steps:

[0036] S1. Capturing chip images: The recognition and acquisition unit automatically captures the length, width and thickness of the detection chip and transmits them to related modules;

[0037] S2. Chip image optimization: The image optimization module repairs image defects, makes the chip's detailed features more obvious, and ensures that the image has a good display effect on all devices;

[0038] S3. Detect chip characteristics: The data detection unit inspects the chip entering the system, observes the surface conditions, and checks for defects and abnormalities on the chip surface;

[0039] S4. Chip packaging: The automatic packaging unit uses an automatic packaging machine to weld, bond and package the chips and packaging materials transferred by the robot.

[0040] Preferably, the method of use further comprises the following steps:

[0041] S21, after feature extraction, the image detection unit predicts each area of ​​the detection image and determines the target chip to be detected in the area and the location information of the chip;

[0042] S31. The early warning unit collects and analyzes monitoring data. If the chip data does not meet the requirements, the early warning device flashes a red light.

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] 1. The present invention realizes the function of intelligent chip packaging by designing an intelligent packaging module, solves the problem of slow manual operation and easy error, and improves the efficiency and accuracy of packaging;

[0045] 2. The present invention realizes the function of automating the chip packaging process by designing an automation module, reduces the influence of human factors on chip quality, and improves the accuracy of chip packaging;

[0046] 3. The present invention realizes the functions of image optimization and image defect repair by designing an image optimization module, solves the problem of unclear image capture during the packaging process, and improves the visibility of the detailed features of the chip in each module;

[0047] 4. The present invention realizes the functions of operator monitoring and management of the automated system by designing a human-machine interaction module, solves the problem of chip defects during the packaging process, and improves the quality of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 It is a schematic diagram of the intelligent packaging module of the present invention;

[0049] Figure 2It is a schematic diagram of the automation module of the present invention;

[0050] Figure 3 It is a schematic diagram of an image optimization module of the present invention;

[0051] Figure 4 It is a schematic diagram of a human-computer interaction module of the present invention;

[0052] Figure 5 is a schematic diagram of an electrical control module of the present invention;

[0053] Figure 6 is a schematic diagram of a sensor module of the present invention;

[0054] Figure 7 Schematic diagram of a convolutional neural network module of the present invention;

[0055] Figure 8 It is a schematic diagram of the system operation module of the present invention. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0057] Example 1

[0058] See also Figure 1 and Figure 8 , an embodiment provided by the present invention: an IC chip automatic packaging inspection system, comprising an intelligent packaging module, the intelligent packaging module is used to monitor the defect problems during chip packaging, reduce human influence, and improve the efficiency and accuracy of packaging;

[0059] The intelligent packaging module includes: an identification and collection unit, a data detection unit and a precise positioning unit, wherein the identification and collection unit is connected to the data detection unit via a network interface, and the data detection unit is connected to the precise positioning unit via a wired connection;

[0060] The identification and acquisition unit automatically captures the length, width and thickness of the detection chip and transmits them to the relevant module;

[0061] The data detection unit inspects the chip entering the system, observes the surface conditions, and checks for defects and abnormalities on the chip surface;

[0062] The precise positioning unit ensures the accuracy of the chip position during the packaging process, thereby improving the speed and efficiency of the chip packaging process;

[0063] Furthermore, after capturing the chip image, the length, width and thickness of the chip are detected using a laser rangefinder, and the acquired chip data is transmitted to the image optimization module. The image optimization module repairs the image defects, making the acquired chip image clearer and the detailed features of the chip more obvious. The chip entering the system is inspected to observe the surface flatness of the chip;

[0064] Use the camera and image processing technology to identify the location of the chip, set appropriate lighting, and ensure that the chip can be clearly photographed. The image optimization module improves the image quality, identifies the image boundaries, and finds the characteristics of the chip.

[0065] Example 2

[0066] See also Figure 6 and Figure 8 , an embodiment provided by the present invention: an IC chip automatic packaging inspection system, comprising an intelligent packaging module, the intelligent packaging module is used to monitor the defect problems during chip packaging, reduce human influence, and improve the efficiency and accuracy of packaging;

[0067] The intelligent packaging module comprises: a sensing unit, a guiding unit and a packaging unit, wherein the sensing unit is connected to the guiding unit mechanically, and the guiding unit is connected to the packaging unit magnetically;

[0068] The sensing unit senses the size of the chip through a sensor and selects the type of guide rail and slider suitable for chip packaging;

[0069] The guide unit ensures that the chip maintains accurate position and orientation during the packaging process;

[0070] The packaging unit enables the chip to be glued, welded and connected along the guide rails and sliders;

[0071] Furthermore, the sensor senses the size of the packaged chip, selects the guide rail and slider suitable for chip packaging, installs the guide rail on the packaging equipment, controls the movement of the slider by driving the motor to achieve chip positioning and movement, monitors and controls the speed of the slider in real time, and allows the chip to be glued, welded and connected along the guide rail and slider to ensure packaging quality.

[0072] Example 3

[0073] See also Figure 1 , Figure 4 and Figure 8, an embodiment provided by the present invention: an IC chip automatic packaging inspection system, including an intelligent packaging module and a human-computer interaction module, the intelligent packaging module is used to monitor the defect problems during chip packaging, reduce human influence, and improve the efficiency and accuracy of packaging, and the human-computer interaction module is used to facilitate operators to monitor and manage the automatic system, discover problems in advance and solve them;

[0074] Furthermore, the chips entering the system are inspected through the intelligent packaging module to observe the chip surface and check for defects and abnormalities. The automatic monitoring instrument in the human-computer interaction module monitors the chips in real time and uses image processing technology to monitor appearance defects. When a chip that does not meet the requirements is detected, the early warning device flashes a red light, and the operator analyzes and repairs the problematic chip.

[0075] Example 4

[0076] See also Figure 2 , Figure 5 and Figure 6 , an embodiment provided by the present invention: an IC chip automatic packaging inspection system, wherein the intelligent packaging module is designed with an automation module, the intelligent packaging module is wirelessly connected to the automation module, and the automation module is used to complete a large number of chip packaging in a short time to ensure the reliability and stability of the chip;

[0077] The automation module includes: an automatic grasping unit, a visual positioning unit and an automatic packaging unit, the automatic grasping unit and the visual positioning unit are connected via a wired connection, and the visual positioning unit and the automatic packaging unit are connected via a network interface;

[0078] The automatic grabbing unit uses a robot to automatically grab chips and packaging materials, and the drive system controls the work of each component to achieve automatic grabbing of chips;

[0079] The visual positioning unit takes a picture of the target object through an image pickup device, and then transmits the image to a corresponding computing unit;

[0080] The automatic packaging unit uses an automatic packaging machine to weld, bond and package the chips and packaging materials transferred by the robot;

[0081] Furthermore, the chip to be packaged enters the system, and the robot automatically grabs the chip and the packaging material and transmits them to the automatic packaging machine. The grabbing robot includes internal components, external components, exchange components, brush components, pneumatic components and electrical control modules. The robot can realize the rapid replacement of the exchange part, and the electrical control module controls the work of each component to realize the automatic grabbing of the chip.

[0082] The image capture device takes pictures of the chips entering the system and transmits the images to various modules of the system for image processing. The automatic packaging machine welds, bonds and packages the chips and materials transmitted by the robot and performs real-time inspection of the packaging quality.

[0083] Example 5

[0084] See also Figure 3 and Figure 7 , an embodiment provided by the present invention: an IC chip automatic packaging inspection system, wherein an image optimization module is designed in the intelligent packaging module, the intelligent packaging module is connected to the image optimization module through a network interface, and the image optimization module is used to repair image defects, make the collected chip image clearer, make the chip's detailed features more obvious, and ensure that the image has a good display effect on each device;

[0085] The image optimization module includes: an image recognition unit, an image processing unit and an image detection unit, the image recognition unit and the image processing unit are connected by wire, and the image processing unit and the image detection unit are connected by wire;

[0086] The image recognition unit converts the captured chip into an image signal by the image capture device, and then transmits it to the image processing system to extract the image features;

[0087] The image processing unit converts the image signal into a digital signal, extracts the characteristics of the target chip, screens and classifies the detected multiple areas, and finally determines the location and category of the chip in the image;

[0088] After feature extraction, the image detection unit predicts each area of ​​the detection image and determines the target chip to be detected in the area and the location information of the chip;

[0089] Further, after capturing the image of the chip, the image processing system converts the chip into an image signal, the image processing system extracts the features of the image, and converts the image signal into a digital signal through the image sensor for processing, storage and transmission, and screens and classifies the multiple detected areas, and finally determines the position and category of the image chip, and makes predictions for each detected area;

[0090] After extracting the image features, the feature information is transmitted to the automation module, and the automatic packaging unit uses the chip's feature information to package the chip.

[0091] Example 6

[0092] See also Figure 3 and Figure 4, an embodiment provided by the present invention: an IC chip automated packaging inspection system, wherein a human-machine interaction module is designed in the intelligent packaging module, the intelligent packaging module is connected to the human-machine interaction module through a circuit interface, and the human-machine interaction module is used to facilitate operators to monitor and manage the automated system, discover problems in advance and solve them;

[0093] The human-computer interaction module includes: a monitoring unit, an early warning unit and a management unit. The monitoring unit and the early warning unit are connected via a network, and the early warning unit and the management unit are connected via a wireless connection.

[0094] The monitoring unit uses automatic monitoring instruments to monitor the chips in real time and uses image processing technology to monitor appearance defects;

[0095] The early warning unit collects and analyzes monitoring data. If the chip data does not meet the requirements, the early warning device flashes red;

[0096] After the management unit receives the signal of the flashing red light, the operator will conduct defect analysis on the problematic chip to ensure that the repaired chip meets the requirements;

[0097] Furthermore, image processing technology monitors the appearance defects of the chip in real time. The image signal transmitted to the human-computer interaction module through the image sensor is monitored and analyzed in real time by the image processing technology. When it is detected that the chip data does not meet the requirements, the red light of the early warning device will flash, and the operator will perform defect analysis on the problematic chip to ensure that the repaired chip meets the requirements.

[0098] Example 7

[0099] See also Figure 3 and Figure 7 , an embodiment provided by the present invention: an IC chip automated packaging inspection system, wherein a convolutional neural network is designed in the image optimization module, the convolutional neural network takes the captured chip image as input data, extracts the features of the chip image through convolution operation, introduces nonlinearity, enhances the expression ability of the model, performs dimensionality reduction processing on the feature image to reduce the number of parameters, constructs a multi-layer network to extract more complex features, and converts the features into final output;

[0100] Furthermore, the convolutional neural network includes a convolutional layer, a linear rectification layer, a pooling layer, and a fully connected layer. The convolutional layer is composed of multiple convolutional units. The parameters of each convolutional unit are optimized by the back propagation algorithm. The algorithm formula of the convolutional layer is: Z = W*X+b, where * represents the convolution operation, W is the convolution kernel, X is the input image, and b is the bias term;

[0101] Linear rectification is the activation function operation using the ReLu function of linear rectification. The algorithm formula of the ReLu function is F(x)=max(0,x), where x is the input value and F(x) is the output value of the ReLu function. When the input value is greater than or equal to 0, the output of the ReLu function is the input value itself. When the input value is less than 0, the output of the ReLu function is 0.

[0102] After convolution, the image still has many dimensional features. The pooling layer divides the feature matrix into several individual blocks to reduce the dimension. The fully connected layer combines all local features into vector representations. The formula of the fully connected layer is Y=Wx+b, where Y is the output, W is the weight coefficient, x is the input, and b is the bias term.

[0103] Working principle: First, the packaged chip enters the system, and the recognition and acquisition unit automatically captures the length, width and thickness of the detection chip and transmits it to the relevant module;

[0104] Then, the image optimization module is used to repair image defects, making the chip's detailed features more obvious and ensuring that the image has a good display effect on all devices. After feature extraction, the image detection unit predicts each area of ​​the detection image and determines the target chip to be detected in the area and the location information of the chip;

[0105] Finally, when the early warning unit detects an abnormal chip, the red light of the alarm device flashes. The operator discovers the abnormal situation in time and takes countermeasures to repair the chip. The automatic packaging unit uses an automatic packaging machine to weld, bond and package the chips and packaging materials transferred by the robot.

[0106] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An IC chip automated packaging inspection system, characterized in that: It includes an intelligent packaging module, which is used to monitor chip packaging defects, reduce human influence, and improve packaging efficiency and accuracy; The intelligent packaging module includes: an identification and collection unit, a data detection unit and a precise positioning unit, wherein the identification and collection unit is connected to the data detection unit via a network interface, and the data detection unit is connected to the precise positioning unit via a wired connection; The identification and acquisition unit automatically captures the length, width and thickness of the detection chip and transmits them to the relevant module; The data detection unit inspects the chip entering the system, observes the surface conditions, and checks for defects and abnormalities on the chip surface; The precise positioning unit ensures the accuracy of the chip position during the packaging process, thereby improving the speed and efficiency of the chip packaging process; The intelligent packaging module is designed with an automation module, which is wirelessly connected to the automation module. The automation module is used to complete a large number of chip packaging in a short time to ensure the reliability and stability of the chip; The automation module includes: an automatic grasping unit, a visual positioning unit and an automatic packaging unit. The automatic grasping unit is connected to the visual positioning unit through a wired connection, and the visual positioning unit is connected to the automatic packaging unit through a network interface. The automatic grabbing unit uses a robot to automatically grab chips and packaging materials, and the drive system controls the work of each component to achieve automatic grabbing of chips; The visual positioning unit takes a picture of the target object through an image pickup device, and then transmits the image to a corresponding computing unit; The automatic packaging unit uses an automatic packaging machine to weld, bond and package the chips and packaging materials transferred by the robot; An image optimization module is designed in the smart packaging module. The smart packaging module is connected to the image optimization module through a network interface. The image optimization module is used to repair image defects, make the collected chip image clearer, make the chip's detailed features more obvious, and ensure that the image has a good display effect on each device; The image optimization module includes: an image recognition unit, an image processing unit and an image detection unit, the image recognition unit and the image processing unit are connected by wire, and the image processing unit and the image detection unit are connected by wire; The image recognition unit converts the captured chip into an image signal by the image capture device, and then transmits it to the image processing system to extract the image features; The image processing unit converts the image signal into a digital signal, extracts the characteristics of the target chip, screens and classifies the detected multiple areas, and finally determines the location and category of the chip in the image; After feature extraction, the image detection unit predicts each area of ​​the detection image and determines the target chip to be detected in the area and the location information of the chip; A human-machine interaction module is designed in the intelligent packaging module. The intelligent packaging module is connected to the human-machine interaction module through a circuit interface. The human-machine interaction module is used to facilitate operators to monitor and manage the automation system, discover problems in advance and solve them; The human-computer interaction module includes: a monitoring unit, an early warning unit and a management unit. The monitoring unit and the early warning unit are connected via a network, and the early warning unit and the management unit are connected via a wireless connection. The monitoring unit uses automatic monitoring instruments to monitor the chips in real time and uses image processing technology to monitor appearance defects; The early warning unit collects and analyzes monitoring data. If the chip data does not meet the requirements, the early warning device flashes red; After the management unit receives the signal from the flashing red light, the operator will perform a defect analysis on the problematic chip to ensure that the repaired chip meets the requirements.

2. The IC chip automatic packaging inspection system according to claim 1, characterized in that: An electrical control module is designed in the automation module. The electrical control module controls the operation of various components of the mechanical claw to achieve automatic grasping. The electrical control module obtains input electrical signals, filters and converts the collected signals, judges and makes decisions on the processed signals according to the set control logic, and generates corresponding control signals to drive the mechanical claw to automatically grasp chips and packaging materials.

3. The IC chip automatic packaging inspection system according to claim 1, characterized in that: The automation module is designed with optical sensors and position sensors. The optical sensor detects the thickness and surface quality of the packaging material, utilizes the electronic phenomenon generated by the chip under the irradiation of light, and determines the measurement result by measuring the propagation time of the laser pulse. The position sensor ensures that the chip is in the correct position during the packaging process. The position sensor uses the change of the magnetic field to detect the position, provide accurate data for the control system, and realize precise control operation.

4. The IC chip automatic packaging inspection system according to claim 1, characterized in that: The image optimization module is designed with a convolutional neural network, which takes the captured chip image as input data, extracts the features of the chip image through convolution operation, introduces nonlinearity, enhances the expression ability of the model, performs dimensionality reduction processing on the feature image to reduce the number of parameters, constructs a multi-layer network to extract more complex features, and converts the features into the final output.

5. The IC chip automatic packaging inspection system according to claim 1, characterized in that: An alarm device is designed in the human-computer interaction module. The alarm device detects abnormal conditions in the packaging process in a timely manner. When an abnormal chip is detected, the red light of the alarm device flashes, which helps the operator to detect abnormal conditions in a timely manner and take countermeasures to ensure that the quality of chip packaging meets the requirements.

6. A method for using an IC chip automatic packaging and inspection system, applicable to an IC chip automatic packaging and inspection system according to any one of claims 1 to 5, characterized in that: The method of use comprises the following steps: S1. Capturing chip images: The recognition and acquisition unit automatically captures the length, width and thickness of the detection chip and transmits them to related modules; S2. Chip image optimization: The image optimization module repairs image defects, makes the chip's detailed features more obvious, and ensures that the image has a good display effect on all devices; S3. Detect chip characteristics: The data detection unit inspects the chip entering the system, observes the surface conditions, and checks for defects and abnormalities on the chip surface; S4. Chip packaging: The automatic packaging unit uses an automatic packaging machine to weld, bond and package the chips and packaging materials transferred by the robot.

7. The method for using the IC chip automatic packaging inspection system according to claim 6, characterized in that: The method of use also includes the following steps: S21, after feature extraction, the image detection unit predicts each area of ​​the detection image and determines the target chip to be detected in the area and the location information of the chip; S31. The early warning unit collects and analyzes monitoring data. If the chip data does not meet the requirements, the early warning device flashes a red light.

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