An electronic device

Abstract

The embodiment of the present application discloses an electronic device, which can be a mobile phone, a tablet, a computer or other electronic device. In the present application, a partial area of ​​the mainboard bracket can cover the first opening of the shielding frame, and be assembled with the shielding frame to form a shielding cover, without the need to separately process the shielding cover. This not only reduces the number of components of the electronic device and simplifies the structure of the electronic device, but also reduces the overall thickness and weight of the electronic device while satisfying the shielding function. Moreover, when the electronic components inside the shielding frame need to be repaired, it is only necessary to disassemble the mainboard bracket, and the repair is quick and convenient.

Description

Technical Field

[0001] The present application relates to the field of electronic products, and in particular to an electronic device. Background Art

[0002] The motherboard is an important component of electronic devices such as mobile phones, tablets, and laptops. Electronic components such as circuits and chips are installed on the motherboard. In order to maintain the normal operation of the electronic components inside and outside the motherboard, electronic devices usually also have a special shielding cover. Some of the electronic components on the motherboard are located in the inner cavity of the shielding cover.

[0003] At present, there are mainly the following ways to set up the shielding cover: the first is an integrated shielding cover, which is not easy to repair and cannot be used for electronic components with maintenance requirements. The cost of use is relatively high and the weight is relatively large. The second shielding cover is a split structure, including a shielding frame and a shielding cover. The shielding frame is a cylindrical shape with two ends open, one end is fixed to the mainboard, and the other end is fixedly connected to the shielding cover. Although the shielding cover of the split structure can be disassembled to facilitate the repair of the electronic components inside the shielding frame, the height of the shielding cover of the split structure in the direction perpendicular to the mainboard is relatively high, which leads to a relatively large overall thickness of the electronic device and a relatively large weight, which is not conducive to the development of thin and light electronic equipment, and the cost of use is relatively high. The third shielding cover includes a shielding frame and copper foil. The opening of the shielding frame away from the mainboard is sealed by copper foil. The copper foil is easily damaged and has a relatively low reliability. In addition, the copper foil has a relatively weak ability to resist external forces and has a relatively weak ability to protect electronic components.

[0004] Therefore, how to meet the requirements of lightweight design of electronic equipment while ensuring shielding reliability is a technical problem that needs to be solved urgently by technicians in this field. Summary of the invention

[0005] The embodiments of the present application provide an electronic device with a simple structure and meeting the requirements of lightweight and thin design.

[0006] The present application provides an electronic device, comprising a middle frame, a mainboard, a back cover, a mainboard bracket and a shielding frame; the mainboard and the back cover are connected to the middle frame, the mainboard bracket is located between the mainboard and the back cover, and the mainboard bracket is detachably connected to the middle frame;

[0007] The shielding frame includes a peripheral wall supported on the mainboard and enclosing a cavity for accommodating the electronic components to be shielded on the mainboard, and a side of the peripheral wall away from the mainboard also has a first opening communicating with the cavity;

[0008] The local area of ​​the mainboard bracket includes a metal layer, and the local area covers the first opening to form a shielding cover structure with the shielding frame.

[0009] In the embodiment of the present application, a partial area of ​​the mainboard bracket can cover the first opening of the shielding frame and be assembled with the shielding frame to form a shielding cover. There is no need to separately process the shielding cover. This not only reduces the number of components of the electronic device and simplifies the structure of the electronic device, but also reduces the overall thickness and weight of the electronic device while meeting the shielding function. Moreover, when the electronic components inside the shielding frame need to be repaired, it is only necessary to disassemble the mainboard bracket, and the repair is quick and convenient.

[0010] In one example, the motherboard bracket includes a plastic body, and the metal layer is connected and fixed to the plastic body. The main body of the motherboard bracket is a plastic body, and the weight of plastic is relatively light, which is conducive to reducing the weight of the electronic device. The part of the plastic body located outside the local area is provided with a structure that is detachably connected to the middle frame. In this example, the electronic components to be shielded can be repaired by disassembling the plastic body, which is convenient to use.

[0011] In one example, the plastic body includes a first region body and a second region body connected to each other, the local region body includes the first region body, and the metal layer is disposed on at least one surface of the first region body. The metal layer can be disposed only on one surface of the plastic layer, or can be disposed on both surfaces of the plastic layer at the same time. In this example, the local region body includes both the plastic layer and the metal layer, and the use strength is relatively high.

[0012] In one example, the metal layer is formed on the surface of the first region by spraying or plating process to form a metal film; the metal film structure is relatively light in weight while meeting the function of electromagnetic shielding, thus meeting the requirements of lightweight design of electronic equipment.

[0013] Alternatively, the metal layer is a metal plate, which has a relatively high strength.

[0014] In one example, the metal layer is located on the surface of the first region body close to the shielding frame body. In this embodiment, the shielding effect is better.

[0015] In one example, the local area includes a cover plate and an annular boss, the annular boss is connected to the surface of the cover plate facing the mainboard, the annular boss is located outside the peripheral wall of the shielding frame, and the surfaces of the cover plate and the annular boss are both provided with a metal layer. In this embodiment, the cover plate is located on the side of the shielding frame close to the back cover, the annular boss is located in the circumference of the shielding frame and can include part of the height or the entire height of the shielding frame, and the annular boss can improve the shielding effect and prevent shielding leakage.

[0016] In one example, along a first direction, the shielding frame includes a first end and a second end, the first end of the shielding frame is provided with a first bent edge, and the first bent edge fits with the cover plate, wherein the first direction is along the arrangement direction of the main board and the back cover. In this embodiment, the first bent edge and the cover plate have an overlapping portion, which can prevent shielding leakage.

[0017] In one example, a conductive pad is further included, the conductive pad has an elastic compression amount along the first direction, and the conductive pad is pressed between the first bent edge and the cover plate. This can prevent the signal of the electronic component from passing through the gap between the first bent edge and the cover plate, improve the shielding effect of this position, and avoid shielding leakage.

[0018] In one example, the conductive pad is conductive foam or conductive cloth, which is cheap and has good electromagnetic shielding effect.

[0019] In one example, the second end of the shielding frame is provided with a second bent edge, and the second bent edge is fitted and fixed to the mainboard. In this embodiment, the second bent edge is fitted and fixed to the mainboard, and the second bent edge is in surface contact with the mainboard. The shielding frame has high installation stability and is relatively stable in fixation, which can also improve the shielding effect between the second end of the shielding frame and the mainboard.

[0020] In one example, the annular boss and the peripheral wall of the shielding frame are detachably locked and connected. By locking the annular boss and the peripheral wall of the shielding frame, the cover plate can be pressed against the first bent edge, and the annular boss and the peripheral wall of the shielding frame are locked at the same time, which facilitates the setting of the locking structure.

[0021] In one example, the detachable lock includes a snap connection, one of the annular boss and the shielding frame is provided with a snap block, and the other is provided with a snap slot that cooperates with the snap block, and the snap block and the snap slot are snap-fitted together; this example has a simple structure, occupies little space, and is easy to install and disassemble.

[0022] Alternatively, the detachable locking is an interference fit or a screw connection, and this embodiment has reliable locking.

[0023] In one example, the annular boss has elastic deformation in radial direction so as to elastically abut against the peripheral wall in radial direction. The annular boss can be elastically deformed, which is convenient for installation. After installation, there is a clamping force between the annular boss and the peripheral wall, which is reliable in locking and can avoid shielding leakage.

[0024] In one example, the end of the annular boss close to the mainboard has a guiding slope so that the annular boss can be fitted into the shielding frame. The guiding slope facilitates the installation of the annular boss.

[0025] In one example, the area of ​​the local area body corresponding to the first opening has at least one protrusion extending toward the first opening. In this embodiment, the thickness of a part of the local area is increased to improve the use strength of the mainboard bracket.

[0026] In one example, along the first direction, the protrusion includes a first end and a second end, the first end is connected to the local area, and the second end extends from the first opening into the cavity and can support the mainboard; wherein the first direction is the arrangement direction of the mainboard and the back cover. Each protrusion can appropriately increase the contact area between the mainboard bracket and the mainboard, avoiding excessive pressure of the mainboard bracket on the shielding frame, thereby damaging the shielding frame or the mainboard.

[0027] In one example, the motherboard bracket and the motherboard are respectively provided with a coaxial first through hole and a second through hole, and the threaded component passes through the first through hole and the second through hole to connect to the middle frame. In this way, the motherboard bracket and the motherboard are locked to the middle frame at the same time by the same threaded component, the structure is simple, and the electronic device is relatively light. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of a three-dimensional structure of an electronic device provided as an example of the present application;

[0029] Figure 2 for Figure 1 A rear view of a partial structure of the electronic device shown;

[0030] Figure 3 for Figure 2 an exploded schematic diagram of the electronic device shown;

[0031] Figure 4 for Figure 1 A schematic diagram of the structure of a mainboard bracket in the electronic device shown;

[0032] Figure 5 for Figure 2 Middle AA section view;

[0033] Figure 6 This is a schematic diagram of the structure of an electronic device in another embodiment of the present application, with the cross-sectional view at the same position as Figure 2 The AA positions shown are the same;

[0034] Figure 7 This is a schematic diagram of the structure of an electronic device in another embodiment of the present application, with a cross-sectional view of the position and Figure 2 The AA positions shown are the same;

[0035] Figure 8 for Figure 1 Rear view with rear cover hidden.

[0036] in, Figures 1 to 8 The one-to-one correspondence between the reference numerals and component names is as follows:

[0037] 100 electronic devices;

[0038] 1 middle frame;

[0039] 2 display screen;

[0040] 3. Back cover;

[0041] 4 main board; 41 electronic component to be shielded; 42 electronic component; 43 second through hole;

[0042] 5 mainboard bracket; 50 plastic main body; 51 local area body; 511 metal layer; 512 first area body; 52 annular boss; 521 guide slope; 522 block; 53 protrusion; 54 first through hole; 55 bump;

[0043] 6 shielding frame; 6a containing cavity; 61 peripheral wall; 62 first bending edge; 621 slot; 63 second bending edge; 6a cavity; 64 first opening; 65 second opening; 7 conductive pad; 8 screw. Specific embodiments

[0044] In the description of this application, it should be noted that in the embodiments of this application, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0045] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship remains unchanged after the connection. "Rotational connection" means that the two are connected to each other and can rotate relative to each other after the connection. "Sliding connection" means that the two are connected to each other and can slide relative to each other after the connection.

[0046] The directional terms mentioned in the embodiments of the present application, such as "inside", "outside", etc., are only referenced to the directions of the drawings. Therefore, the directional terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, unless otherwise specified in the present application, the "multiple" mentioned in the present application refers to two or more.

[0047] In the description of the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0048] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0049] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0050] The electronic device provided in the embodiments of the present application may be a mobile phone, a tablet computer, a tablet computer accessory, a wearable device, a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA) and other mobile terminals, or may also be a digital camera, a SLR camera / micro-single camera, a sports camera, a gimbal camera, a drone and other professional shooting equipment. The embodiments of the present application do not impose any special restrictions on the specific form of the electronic device. For ease of understanding, the following description takes the electronic device as an example of a mobile phone.

[0051] Please refer to Figures 1 to 3 , Figure 1 A schematic diagram of a three-dimensional structure of an electronic device provided as an example of the present application; Figure 2 for Figure 1 A rear view of a partial structure of the electronic device shown; Figure 3 for Figure 2 An exploded schematic diagram of the electronic device shown.

[0052] The electronic device 100 provided in the embodiment of the present application includes a display screen 2, a middle frame 1 and a back cover 3. The middle frame 1 has two main functions. On the one hand, it provides a base for installing the components of the electronic device 100, and on the other hand, it provides protection for some components. The display screen 2 and the back cover 3 are located on both sides of the middle frame 1, and the motherboard 4, battery module and other electronic components of the electronic device are installed in the space surrounded by the middle frame 1 and the back cover 3. The material of the middle frame 1 is not limited here. In specific practice, technicians in this field can choose according to actual needs; for example, it can be made of metal, plastic, ceramic or glass.

[0053] The display screen 2 may be an organic light emitting diode display screen 2 or a liquid crystal display screen 2, etc. The display screen 2102 may be a flexible display screen 2 or a hard display screen 2, wherein the flexible display screen 2 may have a foldable function, and may cooperate with the structural design of the middle frame 1 to realize operations such as folding of the electronic device 100.

[0054] The display screen 2 not only has a display function, it usually also has a touch function, that is, the electronic device 100 can be operated by clicking on the display screen 2; alternatively, the display screen 2 can also only cover a local area on the front of the electronic device 100, which is also an option that can be adopted in specific practice. In this case, the display screen 2 can have a touch function or only have a display function. It can be understood that when it only has a display function, the area of ​​the middle frame 1 where the display screen 2102 is not set can be configured with corresponding buttons and other human-machine operating components to operate the electronic device 100. These human-machine operating components can be set at any position such as the front, back or side of the electronic device 100.

[0055] The display screen 2 may include a display module and a transparent cover plate 56, and the two may be fixedly connected by an adhesive layer. The display module can display images and videos, etc., and the display module may include structural layers such as a touch screen, a light-emitting layer, a backplane layer, and a substrate layer. The specific structure of the display module may be selected according to different products. The display module may adopt a liquid crystal display 2 (liquid crystal display, LCD), an organic light-emitting diode (organic light-emitting diode, OLED), an active matrix organic light-emitting diode or an active matrix organic light-emitting diode (active-matrix organic light emitting diode, AMOLED), a flexible light-emitting diode (flex light-emitting diode, FLED), a quantum dot light emitting diode (quantum dot light emitting diodes, QLED), etc. The transparent cover plate 56 covers the outside of the display module to protect the display module. The transparent cover plate 56 may be a glass cover plate 56, and of course it may also be other transparent materials that can play a protective function.

[0056] For a mobile phone, the mainboard 4 can be a PCB (Printed Circuit Board in English, printed circuit board in Chinese), which is composed of an insulating base plate, connecting wires and pads for assembling and welding electronic components, and has the dual functions of a conductive circuit and an insulating base plate. The mainboard 4 can be a single-sided board, and of course it can also be a double-sided board or a multi-layer board. It can replace complex wiring, can realize wiring and electrical connection or electrical insulation between various electronic parts, and provide the required electrical characteristics. The mainboard 4 is provided with power modules, core modules and other components, which will interfere with other components when working, so electromagnetic shielding is required. In addition to the above electronic components 41 to be shielded that require electromagnetic shielding, the mainboard also includes other electronic components 42 that do not need to be shielded.

[0057] In order to protect the related electronic components on the motherboard 4, a motherboard bracket 5 is usually provided between the motherboard 4 and the back cover 3. The motherboard bracket 5 is connected to the middle frame 1, that is, the motherboard bracket 5 is supported on the middle frame 1. The motherboard bracket 5 can be detachably connected to the middle frame 1, for example, detachably connected to the middle frame 1 through a threaded component, and the threaded component can be a bolt or a screw. The motherboard 4 is located between the motherboard bracket 5 and the middle frame 1. When one side of the back cover 3 is subjected to an external force, the external force is first transmitted to the motherboard bracket 5, and then transmitted to the middle frame 1 through the motherboard bracket 5. In this way, the external force can be prevented from being directly transmitted to the motherboard 4, thereby protecting the electronic components on the motherboard 4. The motherboard bracket 5 in the present application has a metal layer 511, and the motherboard bracket 5 can be completely a metal part. The motherboard bracket 5 of this structure has a relatively high use strength. Of course, the motherboard bracket 5 can also be a component of metal material and plastic material. The motherboard bracket 5 of this structure is relatively light in weight. Moreover, the motherboard bracket 5 can also be a component of metal material and other non-metallic materials.

[0058] Please refer to Figure 3 , Figures 5 to 7 , the electronic device provided in the embodiment of the present application also includes a shielding frame 6, the shielding frame 6 is a metal that can play a shielding role, and in the embodiment of the present application, the shielding frame 6 and the mainboard bracket 5 are split structures. That is to say, the shielding frame 6 and the mainboard bracket 5 are formed separately. The shielding frame 6 in the embodiment of the present application includes a peripheral wall 61, the peripheral wall 61 is supported on the mainboard 4, and the peripheral wall 61 surrounds a cavity 6a for accommodating the electronic components 41 to be shielded on the mainboard 4. Along the extension direction of the peripheral wall 61, the two ends of the peripheral wall 61 have openings, which are a first opening 64 and a second opening 65, respectively. The first opening 64 is away from the side of the mainboard 4, and the second opening 65 is close to the side of the mainboard 4. The electronic components to be shielded on the mainboard 4 enter the cavity 6a from the second opening 65. Of course, the second opening 65 surrounded by the peripheral wall 61 is related to the arrangement of the electronic components to be shielded on the mainboard 4, and can be determined according to the specific product. For example, the second opening 65 can be a rectangular structure or a circular or trapezoidal structure. The material of the shielding frame 6 can be any one of aluminum alloy, nickel silver, copper or copper alloy.

[0059] Please refer to Figure 4 , Figures 5 to 7In the embodiment of the present application, the local area body 51 of the mainboard bracket 5 includes a metal layer 511, and the local area body 51 covers the first opening 64 so as to form a shielding cover structure with the shielding frame 6. The mainboard bracket 5 and the shielding frame 6 can be connected in a detachable manner, for example, the mainboard bracket 5 and the shielding frame 6 are connected in a detachable manner by screws or bolts or snap connections or interference fits, so as to facilitate the later maintenance of the heat-generating electronic components in the cavity 6a. Of course, the mainboard bracket 5 and the shielding frame 6 can also be connected by bonding. The shielding cover structure can isolate the electronic components (not shown in the figure) in the cavity 6a located on the peripheral wall 61 of the mainboard 4 from the external environment, avoid mutual interference of signals between the electronic components in the cavity 6a and the components in the external environment when they are working, and ensure the normal operation of the electronic components in the cavity 6a and the components in the external environment.

[0060] From the above description, it can be seen that the local area 51 of the mainboard bracket 5 in the embodiment of the present application can cover the first opening 64 of the shielding frame 6, and be assembled with the shielding frame 6 to form a shielding cover, without the need to separately process the shielding cover. This not only reduces the number of components of the electronic device and simplifies the structure of the electronic device, but also reduces the overall thickness and weight of the electronic device while meeting the shielding function. Moreover, when the electronic components inside the shielding frame 6 need to be repaired, it is only necessary to disassemble the mainboard bracket 5, and the repair is quick and convenient.

[0061] In a specific electronic device, the thickness of the electronic device can be reduced by approximately 0.1 mm to 0.2 mm.

[0062] In the embodiment of the present application, the motherboard bracket 5 includes a plastic body 50, the metal layer 511 is connected and fixed to the plastic body 50, the plastic body 50 can generally include a first region body 512 and a second region body connected to each other, the local region body 51 includes the first region body 512 and the metal layer 511, and the part (second region body) of the plastic body 50 outside the local region body 51 is provided with a structure detachably connected to the middle frame 1. The position and number of the first region bodies 512 can be reasonably set according to the distribution of electronic components that need to be shielded on the motherboard 4.

[0063] In the above embodiment, the mainboard bracket 5 may only have the metal layer 511 in the first area 512 that forms the shielding cover structure with the shielding frame 6. In this example, the local area 51 includes both the plastic layer and the metal layer 511, and the use strength is relatively high. The mainboard bracket 5 is not provided with the metal layer 511 at other positions except the first area 512, and other positions may only have the plastic body 50, so that the weight of the mainboard bracket 5 is relatively light, the weight of the electronic device is reduced as much as possible, and the use strength of the mainboard bracket 5 meets the requirements.

[0064] The plastic body 50 includes a plastic layer located in a local area 51, and a metal layer 511 is disposed on at least one surface of the plastic layer. The metal layer 511 can be disposed only on one surface of the plastic layer, or can be disposed on both surfaces of the plastic layer. The metal layer 511 can be a metal plate, or a metal film formed on the first area 512 of the plastic body 50 by spraying or coating process, that is, the local area 51 includes a plastic layer and a metal layer 511. The coating process can be a physical vapor deposition (PVD) process.

[0065] The metal film structure is relatively light in weight while meeting the electromagnetic shielding function, meeting the requirements of lightweight design of electronic equipment.

[0066] The metal layer 511 can also be directly connected to the plastic body 50 by a metal plate through bonding or welding or mechanical fixing. The metal plate can also be formed into one piece with the plastic body 50 during injection molding of the plastic body.

[0067] The metal layer 511 may be aluminum alloy or stainless steel, or a composite conductive film layer with one or more metals such as Al, Cr, Ni, Ag, Au, Cu as the base material, wherein the coating thickness of the metal film is ≥ 0.03 mm.

[0068] In the embodiment of the present application, the metal layer 511 is located on the surface of the first region 512 close to the shielding frame 6 , so that the shielding effect is better.

[0069] In the embodiment of the present application, the local area body 51 includes a cover plate 56 and an annular boss 52, the annular boss 52 is connected to the surface of the cover plate 56 facing the main board 4, the annular boss 52 is located outside the peripheral wall 61 of the shielding frame 6, and the surfaces of the cover plate 56 and the annular boss 52 are both provided with a metal layer 511. In this embodiment, the cover plate 56 is located on the side of the shielding frame 6 close to the back cover 3, the annular boss 52 is located on the circumference of the shielding frame 6 and can include part of the height or the entire height of the shielding frame 6. The annular boss 52 can enhance the shielding effect and prevent shielding leakage.

[0070] Along the first direction, the shielding frame 6 includes a first end and a second end, and the first end of the shielding frame 6 is provided with a first bent edge 62, and the first bent edge 62 is fitted with the cover plate 56, wherein the first direction is along the arrangement direction of the main board 4 and the back cover 3, and is roughly the thickness direction of the main board 4. In this embodiment, the first bent edge 62 and the cover plate 56 have an overlapping portion, which can prevent shielding leakage.

[0071] The length A of the first bending edge 62 can be greater than or equal to 0.8 mm, and the length of the first bending edge 62 can be reasonably selected according to the RF test verification of the specific product to meet the shielding requirements. The forming height C of the shielding frame 6 can be greater than or equal to 4*t, where t is the thickness of the shielding frame 6.

[0072] Theoretically, there is no gap between the first bent edge 62 and the cover plate 56, that is, the best spacing B between the two is zero. However, due to processing errors and assembly errors, there may be a gap between the first bent edge 62 and the cover plate 56, so the embodiment of the present application also has the following settings.

[0073] In the embodiment of the present application, the electronic device also includes a conductive pad 7. Along the first direction, the conductive pad 7 has an elastic compression amount. The conductive pad 7 is pressed between the first bending edge 62 and the cover plate 56. The conductive pad is an elastic material with conductive properties such as conductive foam or conductive cloth. In this way, the signal of the electronic component can be prevented from passing through the gap between the first bending edge 62 and the cover plate 56, thereby improving the shielding effect at this position and avoiding shielding leakage. The elastic conductive pad can also play a buffering role in the installation of the shielding frame 6 and the mainboard bracket 5. Taking the conductive pad as conductive foam as an example, the gap between the first bending edge 62 and the cover plate 56 is approximately equal to 40% to 60% of the thickness of the conductive foam.

[0074] In the embodiment of the present application, a second bending edge 63 is provided at the second end of the shielding frame 6. The second bending edge 63 is fitted and fixed to the mainboard 4. The second bending edge 63 is in surface contact with the mainboard 4. The shielding frame 6 has high installation stability and is relatively stably fixed. It can also improve the shielding effect between the second end of the shielding frame 6 and the mainboard 4.

[0075] In the embodiment of the present application, the annular boss 52 and the peripheral wall 61 of the shielding frame 6 are detachably locked and connected, for example, the two are detachably locked and connected by bolts or screws or bonding or interference fit or snap connection. By locking the annular boss 52 and the peripheral wall 61 of the shielding frame 6, the cover plate 56 can be pressed against the first bent edge 62, and the annular boss 52 and the peripheral wall 61 of the shielding frame 6 are locked at the same time, which is convenient for setting the locking structure.

[0076] In the embodiment of the present application, the detachable locking includes a snap-on connection, one of the annular boss 52 and the shielding frame 6 is provided with a snap block, and the other is provided with a snap groove that cooperates with the protrusion, and the snap block and the snap groove are snap-fitted; the accompanying drawings show the specific structure in which the snap block 522 is provided on the annular boss 52 and the snap groove 621 is provided on the peripheral wall 61. Conversely, it is also possible to provide a snap groove on the annular boss 52 and a snap block on the peripheral wall 61.

[0077] In the embodiment of the present application, the annular boss 52 has elastic deformation in the radial direction so as to elastically abut against the peripheral wall 61 in the radial direction. The annular boss 52 can be elastically deformed, which is convenient for installation. After installation, there is a clamping force between the annular boss 52 and the peripheral wall 61, which is reliable in locking and can avoid shielding leakage. The thickness E of the annular boss 52 is greater than or equal to 0.3 mm.

[0078] Furthermore, the end of the annular boss 52 close to the main board 4 has a guiding slope 521, so that the annular boss 52 can be mounted on the shielding frame 6. The angle of the guiding slope 521 can be set reasonably as long as it can be mounted conveniently.

[0079] In order to improve the use strength of the motherboard bracket 5, in the embodiment of the present application, the area of ​​the local area 51 corresponding to the first opening 64 has at least one protrusion 53 extending toward the first opening 64. That is, the thickness of the local area is increased to improve the use strength of the motherboard bracket 5.

[0080] In the embodiment of the present application, along the first direction, the protrusion 53 includes a first end and a second end, the first end is connected to the local area body 51, and the second end extends from the first opening 64 into the cavity and can be supported on the main board 4. The shape of the protrusion is not limited, it can be a column, the protrusion can be a column with the same cross section everywhere, of course, it can also be a body with non-uniform cross section, for example, the cross section of the end of the protrusion away from the main board 4 is relatively large. The protrusion can be a plastic part, which can be integrally formed with the plastic body 50, or it can be fixedly connected to the plastic body 50 by bonding or hot welding. Each protrusion can appropriately increase the contact area between the main board bracket 5 and the main board 4 to prevent the main board bracket 5 from exerting too much pressure on the shielding frame 6 and damaging the shielding frame 6 or the main board 4.

[0081] As described above, the projection of the mainboard 4 in the preset plane is located inside the projection of the mainboard bracket 5 in the preset plane, and the first plane is parallel to the plane where the mainboard 4 is located. The preset plane is parallel to the plane where the mainboard 4 is located.

[0082] In the embodiment of the present application, the mainboard bracket 5 and the mainboard 4 are respectively provided with a coaxial first through hole 54 and a second through hole 43, and the threaded component passes through the first through hole 54 and the second through hole 43 to connect to the middle frame 1. The threaded component can be a screw 8. In this way, the mainboard bracket 5 and the mainboard 4 are locked to the middle frame 1 at the same time by the same screw 8. The structure is simple and the weight of the electronic device is relatively light.

[0083] Figure 8 It is shown that the mainboard bracket 5 and the mainboard 4 are fastened to the middle frame by four screws 8, so that the inner surface of the mainboard bracket 5 and the shielding frame 6 are pressed and matched in the Z direction (ie, the S direction).

[0084] In order to improve the use strength of the mainboard bracket 5, the surface of the mainboard bracket 5 facing the mainboard 4 may also be provided with a protrusion 55, and the protrusion 55 is located on the outer periphery of the annular boss 52. Figure 4 As shown in FIG. 5 , the protrusions 55 are located at the four corners of the annular boss 52 , and the first through holes 54 are provided on the boss 55 .

[0085] In the embodiment of the present application, the middle frame 1 has an installation cavity opening toward the back cover 3, the mainboard 4 is located inside the installation cavity, and the mainboard bracket 5 is detachably installed in the opening. Figure 8 As shown, the middle frame 1 also has a battery compartment 1a for placing batteries.

[0086] Specific examples are used herein to illustrate the principles and implementation methods of the present application, and the description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An electronic device, characterized in that: It includes a middle frame, a mainboard, a back cover, a mainboard bracket and a shielding frame; the mainboard and the back cover are connected to the middle frame, the mainboard bracket is located between the mainboard and the back cover, and the mainboard bracket is detachably connected to the middle frame; The shielding frame comprises a peripheral wall supported on the mainboard and surrounding a cavity for accommodating the electronic components to be shielded on the mainboard, and the side of the peripheral wall away from the mainboard also has a first opening communicating with the cavity; The local area of ​​the mainboard bracket includes a metal layer, and the local area covers the first opening to form a shielding cover structure with the shielding frame; The local area body includes a cover plate and an annular boss, the annular boss is connected to the surface of the cover plate facing the main board, the annular boss is located outside the peripheral wall of the shielding frame, and the surfaces of the cover plate and the annular boss are both provided with the metal layer.

2. The electronic device according to claim 1, wherein: The mainboard bracket includes a plastic body, the metal layer is connected and fixed to the plastic body, and a portion of the plastic body located outside the local area is provided with a structure detachably connected to the middle frame.

3. The electronic device according to claim 2, characterized in that: The plastic body includes a first region and a second region connected to each other, the local region includes the first region, and the metal layer is disposed on at least one surface of the first region.

4. The electronic device according to claim 3, characterized in that: The metal layer is a metal film formed on the surface of the first region by spraying or coating process; Alternatively, the metal layer is a metal plate.

5. The electronic device according to claim 4, characterized in that: The metal layer is located on a surface of the first region close to the shielding frame.

6. The electronic device according to claim 1, wherein: Along a first direction, the shielding frame includes a first end and a second end, the first end of the shielding frame is provided with a first bending edge, and the first bending edge fits with the cover plate, wherein the first direction is along the arrangement direction of the main board and the back cover.

7. The electronic device according to claim 6, characterized in that: It also includes a conductive pad, which has elastic compression along the first direction and is pressed between the first bending edge and the cover plate.

8. The electronic device according to claim 7, characterized in that: The conductive pad is conductive foam or conductive cloth.

9. The electronic device according to claim 6, characterized in that: The second end of the shielding frame is provided with a second bent edge, and the second bent edge is fitted and fixed to the mainboard.

10. The electronic device according to claim 1, wherein: The annular boss and the peripheral wall of the shielding frame are detachably locked and connected.

11. The electronic device according to claim 10, characterized in that: The detachable locking comprises a snap connection, one of the annular boss and the shielding frame is provided with a snap block, and the other is provided with a snap groove matched with the snap block, and the snap block and the snap groove are snap-fitted; Alternatively, the detachable locking is an interference fit or a screw connection.

12. The electronic device according to claim 1, wherein: The annular boss has elastic deformation in radial direction so as to elastically abut against the peripheral wall in radial direction.

13. The electronic device according to claim 12, characterized in that: The end of the annular boss close to the main board has a guiding slope so that the annular boss can be sleeved on the shielding frame.

14. The electronic device according to any one of claims 1 to 13, characterized in that: The area of ​​the local region corresponding to the first opening has a protrusion extending toward the first opening.

15. The electronic device according to claim 14, characterized in that: Along the first direction, the protrusion includes a first end and a second end, the first end is connected to the local area body, and the second end extends from the first opening into the cavity and can be supported on the main board; wherein the first direction is the arrangement direction of the main board and the back cover.

16. The electronic device according to any one of claims 1 to 13, characterized in that: The mainboard bracket and the mainboard are respectively provided with a coaxial first through hole and a second through hole, and a threaded component passes through the first through hole and the second through hole to connect with the middle frame.

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