Lead frame and package assembly

Abstract

The present invention discloses a wire frame and a packaging component, wherein the wire frame includes: a frame body and a support plate. The frame body includes a connecting terminal, and the support plate is used to carry a chip, and the connecting terminal is connected to the chip through a wire. Wherein, the material of the support plate is a ceramic substrate, at least a part of the connecting terminal is arranged against the surface of the support plate, and the connecting terminal is fixedly connected to the support plate by glue. The wire frame of the present application can not only avoid the displacement of the connecting terminal during the process of welding the wire or the process of packaging by injection molding the packaging shell, realize precise positioning, improve the stability of the connection between the connecting terminal and the chip, and thus improve the quality of the product, but also reduce the overall thickness of the wire frame, which is conducive to the development trend of thinning and miniaturization of the packaging component.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to a lead frame and a packaging assembly. Background Art

[0002] Lead frames are widely used in the packaging of integrated circuits (ICs), discrete components and other electronic components. That is, the lead frame and the chip are packaged in a package shell, and the package shell is used to protect the chip. The lead frame includes a connection terminal and a support plate. The chip is set on the support plate. One end of the connection terminal is connected to the chip through a wire, and the other end of the connection terminal is connected to the external circuit. The lead frame provides mechanical support and electrical connection for the chip, and connects the chip to the external circuit.

[0003] In the prior art, the connecting terminal and the supporting plate are both made of conductive materials, and a gap needs to be set between the connecting terminal and the supporting plate so that the connecting terminal is suspended. In this way, not only is it easy for the connecting terminal to shift up and down or left and right during the process of welding the wires or the process of packaging by injection molding the packaging shell, but it is also difficult to achieve precise positioning of the connecting terminal and the supporting plate, which will also affect the connection stability of the chip and the quality of the product, but it also increases the overall thickness of the wire frame, which is not conducive to the development trend of thinning and miniaturization.

[0004] Therefore, the existing lead frame needs to be improved. Summary of the invention

[0005] The object of the present invention is to provide a lead frame and a packaging assembly, which can not only prevent the connection terminals from being offset during the process of welding wires or the process of packaging by injection molding a packaging shell, thereby achieving precise positioning and improving the stability of the connection between the connection terminals and the chip, thereby improving the quality of the product, but also reduce the overall thickness of the lead frame, which is conducive to the development trend of thinning and miniaturization of the packaging assembly.

[0006] The purpose of the present invention is achieved by the following technical solutions:

[0007] A wire frame, comprising:

[0008] A frame body, the frame body comprising connecting terminals;

[0009] A support plate, the support plate is used to carry the chip, and the connecting terminals are connected to the chip through wires;

[0010] The support plate is made of a ceramic substrate, at least a partial area of ​​the connection terminal is disposed in contact with the surface of the support plate, and the connection terminal is fixedly connected to the support plate by glue.

[0011] Preferably, a welding portion is provided on the connection terminal, the welding portion is connected to the chip via a wire, a side of the welding portion facing the support plate is arranged in contact with the surface of the support plate, and the welding portion is fixedly connected to the support plate by glue.

[0012] Preferably, a first welding layer is provided on the surface of the welding portion; and / or,

[0013] A second welding layer is provided at a position corresponding to the chip on the support plate to increase the bonding force between the support plate and the chip; and / or,

[0014] The support plate is provided with a groove, and at least a part of the glue is filled in the groove to increase the bonding force between the glue and the support plate; and / or,

[0015] The welding portion is used to connect the upper surface of the wire and is flush with the upper surface of the chip to shorten the length of the wire.

[0016] Preferably, the projection area of ​​the second welding layer on the support plate is larger than the projection area of ​​the chip on the support plate; and / or,

[0017] The thickness of the second welding layer is 1 to 20 μm; and / or,

[0018] The second soldering layer is a gold-tin alloy layer.

[0019] Preferably, the frame body further comprises a positioning terminal, a third welding layer is provided on the support plate, and the positioning terminal is connected to the support plate through the third welding layer.

[0020] Preferably, the upper surface of the welding portion of the connecting terminal is flush with the upper surface of the positioning terminal; and / or,

[0021] The number of the positioning terminals is four, and the four positioning terminals are respectively arranged close to the four corners of the support plate.

[0022] Preferably, the connecting terminal and the positioning terminal are connected to the same material strip; or,

[0023] The connecting terminal and the positioning terminal are cut from the same material strip.

[0024] Preferably, a first thinning area is provided at a position on the surface of the support plate corresponding to the connection terminal, so as to reduce the height of the connection terminal protruding from the support plate; and / or,

[0025] A second thinning area is provided at a position on the surface of the support plate corresponding to the positioning terminal to reduce the height of the positioning terminal protruding from the support plate; and / or,

[0026] A positioning groove is provided on the surface of the support plate at a position corresponding to the chip, and the positioning groove is used to position the chip; and / or,

[0027] The ceramic substrate is made of aluminum oxide or silicon nitride, and the conducting wire is a gold wire.

[0028] A packaging component comprises a lead frame, a chip and a packaging shell as described in any one of the above, wherein the chip is arranged on a support plate of the lead frame, the packaging shell covers at least part of the chip and at least part of the lead frame, and at least part of the connecting terminals are exposed from the packaging shell.

[0029] Preferably, the packaging shell is formed by injection molding, and the material of the packaging shell is a thermosetting material or a thermoplastic material.

[0030] Preferably, the packaging shell is made of epoxy resin or liquid crystal polymer material.

[0031] Compared with the prior art, the beneficial effects of the present invention include at least:

[0032] The lead frame and packaging assembly of the present invention fix the connection terminal to the support plate by glue, accurately position the connection terminal, ensure the flatness of the connection terminal, avoid the connection terminal from being offset in the up-down direction or the front-back-left-right direction during the process of welding the wire or the process of packaging by injection molding the packaging shell, improve the stability of the connection between the connection terminal and the chip, and thus improve the quality of the product. In addition, the thickness of the glue is thin, which can reduce the thickness of the lead frame as a whole, which is conducive to the development trend of thinning and miniaturization of the packaging assembly. By setting the material of the support plate to a ceramic substrate, since the ceramic substrate has good insulation performance, adjacent connection terminals will not short-circuit, and the connection terminals are directly placed against the surface of the support plate, which can not only reduce the thickness of the lead frame as a whole, which is conducive to the development trend of thinning and miniaturization of the packaging assembly, but also the support plate is in direct contact with the connection terminal, and the heat generated by the connection terminal during operation can also be directly dissipated, further improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the three-dimensional structure of the frame body in an embodiment of the present invention.

[0034] Figure 2 yes Figure 1 A local enlarged schematic diagram of point A in the middle.

[0035] Figure 3 It is a schematic diagram of the three-dimensional structure of the support plate in an embodiment of the present invention.

[0036] Figure 4 It is a schematic diagram of the three-dimensional structure of the packaging component of an embodiment of the present invention.

[0037] Figure 5 It is a schematic diagram of the planar structure of the packaging component of an embodiment of the present invention.

[0038] Figure 6 yes Figure 5 Schematic diagram of the cross section along the AA direction.

[0039] Figure 7 It is a schematic diagram of the three-dimensional structure of the packaging component of the embodiment of the present invention when the packaging shell is not provided.

[0040] Figure 8 It is a schematic diagram of the planar structure of the packaging component of the embodiment of the present invention when no packaging shell is provided.

[0041] Fig. 9 yes Figure 8 Schematic diagram of the cross section along direction BB.

[0042] In the figure: 100, packaging component; 1, lead frame; 11, frame body; 111, connecting terminal; 1111, welding part; 1112, first welding layer; 112, positioning terminal; 113, material strip; 12, support plate; 121, first side; 122, second side; 123, first side; 124, second side; 125, second welding layer; 126, groove; 127, third welding layer; 13, glue; 2, chip; 3, wire; 4, packaging shell. DETAILED DESCRIPTION

[0043] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0044] The words expressing positions and directions described in the present invention are all explained with reference to the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of the present invention.

[0045] Reference Figures 1 to 9 The present invention provides a wire frame 1, which is used to install a chip 2. The wire frame 1 includes: a frame body 11 and a support plate 12, and the chip 2 can be set on the support plate 12.

[0046] Specifically, refer to Figure 1 , Figure 2 , Figure 7 The frame body 11 may include a connection terminal 111. One end of the connection terminal 111 may be electrically connected to the chip 2 through a wire 3. The wire 3 is, for example, a gold wire. The wire 3 may also be made of other materials. The other end of the connection terminal 111 may be electrically connected to an external circuit. The external circuit may be, for example, a circuit board. The chip 2 is electrically connected to the connection terminal 111 through the wire 3, and then electrically connected to the external circuit through the connection terminal 111, so that the chip 2 and the external circuit can communicate with each other. The number of the connection terminals 111 may be one or more, and each connection terminal 111 may be connected to one or more wires 3. The connection terminal 111 is preferably made of a conductive material, and is further preferably a metal material or an alloy material. The material of the connection terminal 111 is, for example, copper, copper-nickel alloy, etc.

[0047] Reference Figure 3 , Figure 7 , the support plate 12 can be a rectangular parallelepiped as a whole, and of course it can also be set to other shapes as needed. In this embodiment, the support plate 12 is a rectangular parallelepiped as a whole, and the support plate 12 has a first surface 121 and a second surface 122 that are arranged opposite to each other. The first surface 121 and the second surface 122 are preferably two surfaces with larger areas on the support plate 12. The chip 2 can be arranged on the first surface 121 of the support plate 12. The support plate 12 is used to carry the chip 2 and provide support for the chip 2. The chip 2 is preferably arranged near the center of the support plate 12. The connecting terminal 111 can be arranged around the support plate 12 and spaced from the support plate 12. Glue 13 can be arranged between the connecting terminal 111 and the support plate 12. The glue 13 is used to fix the connecting terminal 111 to the support plate 12, and at least part of the surface of the connecting terminal 111 is exposed from the glue 13, so that the connecting terminal 111 is electrically connected to the chip 2 through the wire 3, ensuring that the connecting terminal 111 is electrically connected to the chip 2 through the wire 3.

[0048] The material of the support plate 12 can be a ceramic substrate, which has excellent electrical insulation performance and high thermal conductivity, which can further improve the heat dissipation effect of the chip 2, and then dissipate the heat generated by the chip 2 when it is working, ensuring that the chip 2 can operate normally. In addition, the chip 2 usually uses semiconductor materials such as SiC (silicon carbide) or GaN (gallium nitride), which are closer to the thermal expansion coefficient materials of the ceramic substrate, so the deformation coefficients of the two are close during thermal expansion, and their matching performance is more stable. The ceramic substrate also has a certain structural strength to ensure that the support plate 12 can provide stable support for the chip 2 and ensure the stability of the position of the chip 2.

[0049] As a preferred embodiment, the material of the ceramic substrate may be aluminum oxide or silicon nitride. Aluminum oxide has a higher thermal conductivity, while silicon nitride has a higher structural strength.

[0050] In this embodiment, refer to Figure 7The connection terminal 111 can be arranged around the chip 2, and the end of the connection terminal 111 connected to the wire 3 is preferably arranged close to the chip 2, which can shorten the distance between the connection terminal 111 and the chip 2, thereby shortening the length of the wire 3. The end of the connection terminal 111 close to the chip 2 is preferably arranged above the first surface 121 of the support plate 12 and directly abuts against the first surface 121 of the support plate 12, that is, the side of the connection terminal 111 facing the support plate 12 is directly abutted against the first surface 121 of the support plate 12, and glue 13 is arranged between the connection terminal 111 and the support plate 12, and the glue 13 can fix the connection terminal 111 and the support plate 12, at least part of the upper surface of the connection terminal 111 is exposed from the glue 13, and the upper surface of the connection terminal 111 exposed from the glue 13 can be electrically connected to the chip 2 through the wire 3.

[0051] Reference Figure 3 , Figure 7 The support plate 12 has a first side 123 and a second side 124 opposite to each other. The first side 123 and the second side 124 of the support plate 12 may be provided with glue 13. The chip 2 may be provided between the glue 13 located on the first side 123 of the support plate 12 and the glue 13 located on the second side 124 of the support plate 12, that is, the chip 2 is provided between the first side 123 of the support plate 12 and the second side 124 of the support plate 12. The glue 13 located on the first side 123 of the support plate 12 may be provided in a whole section or divided into multiple sections. The number of glues 13 located on the second side 124 of the support plate 12 may also be provided in a whole section or divided into multiple sections. The glue 13 located on the first side 123 of the support plate 12 and the glue 13 located on the second side 124 of the support plate 12 may also be connected to each other to form a whole.

[0052] As a preferred method, refer to Figure 3 , Figure 6 , Figure 7 , Fig. 9 , the support plate 12 may be provided with a groove 126, that is, the groove 126 is provided on the first surface 121 of the support plate 12, part of the glue 13 may be filled in the groove 126, and the groove 126 may increase the contact area between the glue 13 and the support plate 12, so as to increase the bonding force between the glue 13 and the support plate 12. The groove 126 may be an undercut structure or a special-shaped structure, that is, the width of the groove 126 does not gradually decrease from the opening of the groove 126 to the bottom of the groove 126, but the width of the groove 126 gradually increases from the opening of the groove 126 to the bottom of the groove 126, or the width of the groove 126 sometimes increases and sometimes decreases from the opening of the groove 126 to the bottom of the groove 126, that is, the side wall of the groove 126 is uneven, so that the bonding force between the glue 13 and the support plate 12 can be further increased to prevent the glue 13 from separating from the support plate 12.

[0053] In the present application, the connection terminal 111 is fixedly connected to the support plate 12 by glue 13, the connection terminal 111 is accurately positioned, and the flatness of the connection terminal 111 is ensured, so as to avoid the connection terminal 111 from being offset in the up-down direction or the front-back-left-right direction during the welding of the wire 3 or the packaging of the injection molding package shell 4, thereby improving the stability of the connection between the connection terminal 111 and the chip 2, and thus improving the quality of the product. In addition, the thickness of the glue 13 is relatively thin, which can reduce the thickness of the lead frame 1 as a whole, which is conducive to the development trend of thinning and miniaturization of the package assembly 100. By setting the material of the support plate 12 as a ceramic substrate, since the ceramic substrate has good insulation performance, the adjacent connection terminals 111 will not short-circuit, and the connection terminals 111 are directly attached to the surface of the support plate 12, which can not only reduce the thickness of the lead frame 1 as a whole, which is conducive to the development trend of thinning and miniaturization of the package assembly 100, but also the support plate 12 is directly in contact with the connection terminal 111, and the heat generated by the connection terminal 111 during the working process can also be directly dissipated, further improving the heat dissipation effect.

[0054] In a specific embodiment, referring to Figure 2 , Figure 7 , a welding portion 1111 may be provided on the connection terminal 111, and the side of the welding portion 1111 facing the support plate 12 is arranged close to the surface of the support plate 12, and the welding portion 1111 is fixedly connected to the support plate 12 by glue 13, that is, glue 13 may be provided between the welding portion 1111 and the support plate 12, and at least part of the surface of the welding portion 1111 is exposed from the glue 13, so that the welding portion 1111 is connected to the chip 2 through the wire 3. The welding portion 1111 is preferably provided at one end of the connection terminal 111 close to the chip 2, so that the distance between the welding portion 1111 and the chip 2 can be shortened, thereby shortening the length of the wire 3. The welding part 1111 is preferably arranged above the first surface 121 of the support plate 12 and is directly attached to the support plate 12. Glue 13 is arranged below the welding part 1111. The glue 13 fixes the welding part 1111 and the support plate 12, accurately positions the welding part 1111, and ensures the flatness of the welding part 1111, thereby preventing the welding part 1111 from shifting up and down or forward and backward and left and right during the welding of the wire 3 or the packaging of the injection molding packaging shell 4, thereby improving the stability of the connection between the welding part 1111 and the chip 2, and thus improving the quality of the product. In addition, the thickness of the glue 13 is relatively thin, and the welding part 1111 is directly attached to the surface of the support plate 12, which can reduce the overall thickness of the lead frame 1, which is conducive to the development trend of thinning and miniaturization of the packaging component 100.

[0055] The number of the welding parts 1111 may be one or more. In the present embodiment, the number of the welding parts 1111 is multiple, and the multiple welding parts 1111 are arranged at intervals. The multiple welding parts 1111 can be divided into two columns, each column can include one or more welding parts 1111, and the two columns of welding parts 1111 are respectively arranged on the first side 123 of the support plate 12 and the second side 124 of the support plate 12. In the present embodiment, the number of the welding parts 1111 is six, and each column has three welding parts 1111, and the two columns of welding parts 1111 can be symmetrically arranged.

[0056] As a preferred method, the upper surface of the welding part 1111 used to connect the wire 3 is flush with the upper surface of the chip 2 to shorten the length of the wire 3. In other words, the upper surface of the welding part 1111 and the upper surface of the chip 2 are on the same horizontal plane, which can further shorten the distance between the upper surface of the welding part 1111 and the upper surface of the chip 2, thereby further shortening the length of the wire 3, which can not only reduce the amount of wire 3 used and reduce the manufacturing cost of the product, but also shorten the signal transmission path, reduce the loss of the transmission signal, reduce the current loss, etc., thereby improving the performance of the product.

[0057] Reference Figure 2 , Figure 7 , the surface of the welding part 1111 may be provided with a first welding layer 1112, the first welding layer 1112 is, for example, a silver layer, which may be formed by electroplating or chemical plating, etc., the first welding layer 1112 may increase the welding performance of the welding part 1111, be more conducive to welding the wire 3 to the welding part 1111, and enhance the stability and reliability of the connection between the wire 3 and the welding part 1111. When the surface of the welding part 1111 is provided with the first welding layer 1112, the first welding layer 1112 is used to connect the upper surface of the wire 3 and the upper surface of the chip 2 to be flush, so as to shorten the length of the wire 3. That is to say, the upper surface of the first welding layer 1112 and the upper surface of the chip 2 are on the same horizontal plane, which can further shorten the distance between the upper surface of the first welding layer 1112 and the upper surface of the chip 2, thereby further shortening the length of the wire 3.

[0058] Reference Figure 3, a second welding layer 125 may be provided at a position corresponding to the support plate 12 and the chip 2, that is, the second welding layer 125 is provided on the first surface 121 of the support plate 12, and the second welding layer 125 may also increase the welding performance of the support plate 12, so as to increase the bonding force between the support plate 12 and the chip 2, thereby enhancing the stability and reliability of the connection between the support plate 12 and the chip 2. In this embodiment, after the chip 2 is welded to the second welding layer 125, the upper surface of the first welding layer 1111 on the connecting terminal 111 is in the same horizontal plane or approximately in the same horizontal plane as the upper surface of the chip 2, which can further shorten the distance between the upper surface of the first welding layer 1112 and the upper surface of the chip 2, thereby further shortening the length of the wire 3.

[0059] The projection area of ​​the second welding layer 125 on the support plate 12 is preferably larger than the projection area of ​​the chip 2 on the support plate 12, that is, the area of ​​the second welding layer 125 is larger than the area of ​​the chip 2, so that the chip 2 can be fully in contact with the second welding layer 125, reducing the precision requirement for aligning the chip 2 with the second welding layer 125, and making it easier to produce. The second welding layer 125 can be formed by DPC process (Direct Plating Copper), electroplating or chemical plating, and the thickness of the second welding layer 125 is 1 to 20 μm. Compared with the connection between the support plate 12 and the chip 2 through silver glue, the present application no longer needs to apply and control the thickness of the silver glue, and can accurately control the precision of the combination of the chip 2 and the support plate 12, greatly improving the performance and quality of the product.

[0060] The second welding layer 125 is preferably a gold-tin alloy layer, which may include an adhesion layer (not shown), a barrier layer (not shown), a gold-tin layer (not shown) and a protective layer (not shown), wherein the adhesion layer is a titanium layer, the barrier layer is a platinum layer, and the protective layer is a gold layer. The adhesion layer is arranged on the upper surface of the support plate 12, and the barrier layer is arranged between the adhesion layer and the gold-tin layer. The barrier layer can prevent the mutual diffusion between the gold-tin layer above the barrier layer and the adhesion layer below, causing the change of the gold-tin ratio in the gold-tin layer, thereby affecting the welding effect. Eutectic is formed between gold and tin, so that the chip 2 can be welded together by directly contacting and heating with the gold-tin alloy layer without the need for additional solder, which greatly improves the convenience of welding, thus reducing the difficulty of combining and fixing the chip 2 with the support plate 12, and the combination process is faster, which improves the production efficiency of welding. The protective layer is plated on the outer surface of the gold-tin layer, and the protective layer is used to prevent the gold-tin layer from oxidizing.

[0061] In a specific embodiment, referring to Figure 2 , Figure 3 , Figure 7The frame body 11 may also include a positioning terminal 112. A third welding layer 127 may be provided on the first surface 121 of the support plate 12. The third welding layer 127 may include one or more of a copper layer and a tin layer. The third welding layer 127 may be formed by a DPC process (Direct Plating Copper), electroplating or chemical plating, and the positioning terminal 112 is connected to the support plate 12 through the third welding layer 127. The positioning terminal 112 and the third welding layer 127 may be fixedly connected by laser welding or tin soldering. The number of the positioning terminals 112 is preferably four, and the four positioning terminals 112 are preferably respectively arranged near the four corners of the support plate 12, and correspondingly, the third welding layers 127 are respectively arranged near the four corners of the support plate 12. Compared with the riveting of the through hole of the positioning terminal 112 and the riveted column of the support plate 12, the positioning terminal 112 of the present application is fixedly connected to the third welding layer 127 of the support plate 12 by welding, avoiding the matching gap between the riveted column and the through hole. In this way, the fixed connection between the support plate 12 and the positioning terminal 112 can be achieved more accurately, and there is no need for rivets protruding upward, which simplifies the production process and reduces the production cost. It can also reduce the overall thickness of the lead frame 1, which is conducive to the development trend of thinning and miniaturization of the packaging component 100.

[0062] As a preferred method, refer to Figure 2 , Figure 7 The upper surface of the welding portion 1111 of the connecting terminal 111 is flush with the upper surface of the positioning terminal 112, that is, the upper surface of the welding portion 1111 of the connecting terminal 111 is coplanar with the upper surface of the positioning terminal 112. This can reduce the overall thickness of the lead frame 1, which is beneficial to the development trend of thinning and miniaturization of the packaging component 100.

[0063] The connecting terminal 111 can be a flat plate structure as a whole, and the positioning terminal 112 can also be a flat plate structure as a whole. The thickness of the connecting terminal 111 and the thickness of the positioning terminal 112 are preferably the same or approximately the same, which is easier to manufacture, can reduce manufacturing costs and is easy to control accuracy.

[0064] A height difference of different heights can be formed between the welding portion 1111 of the connection terminal 111 and the fixing portion 1121 of the positioning terminal 112, that is, the welding portion 1111 and the fixing portion 1121 can be on different horizontal planes. In this embodiment, in the thickness direction of the support plate 12, the welding portion 1111 can be located above the fixing portion 1121, that is, the fixing portion 1121 is closer to the support plate 12. By adjusting the height of the welding portion 1111, the upper surface of the welding portion 1111 is kept consistent with the upper surface of the chip 2, so that the two ends of the wire 3 can always be kept on the same horizontal plane, shortening the length of the wire 3.

[0065] Reference Figure 1 , Figure 2 The connecting terminal 111 and the positioning terminal 112 can be connected to the same material strip 113, and the material strip 113 can connect the connecting terminal 111 and the positioning terminal 112 together, which not only facilitates automated production and improves production efficiency, but also avoids the position of the connecting terminal 111 and the positioning terminal 112 from being offset during the manufacturing process.

[0066] Reference Figure 1 , Figure 2 The connecting terminal 111 and the positioning terminal 112 can also be cut from the same material strip 113, which can further improve the position accuracy of the connecting terminal 111 and the positioning terminal 112. The cutting method includes one or more of laser cutting, stamping cutting, etc.

[0067] The material strip 113 connects the connecting terminal 111 and the positioning terminal 112 together. When the positioning terminal 112 is fixedly connected to the support plate 12, that is, the relative position between the positioning terminal 112 and the support plate 12 is determined, the positioning terminal 112 can limit the connecting terminal 111 through the material strip 113, thereby limiting the relative position between the connecting terminal 111 and the support plate 12.

[0068] In a specific embodiment, a first thinning area (not shown) may be provided at a position on the surface of the support plate 12 corresponding to the connection terminal 111 to reduce the height of the connection terminal 111 protruding from the support plate 12. That is, the first thinning area is recessed in the surface of the support plate 12, and a part of the connection terminal 111 may be provided in the first thinning area, which not only reduces the height of the connection terminal 111 protruding from the support plate 12, thereby reducing the overall thickness of the lead frame 1, which is conducive to the development trend of thinning and miniaturization of the package component 100, but also adjusts the height of the upper surface of the connection terminal 111 used for connecting the wire 3, so that the upper surface of the connection terminal 111 used for connecting the wire 3 is arranged flush with the upper surface of the chip 2, so as to shorten the length of the wire 3.

[0069] A second thinning area (not shown) may be provided at a position on the surface of the support plate 12 corresponding to the positioning terminal 112 to reduce the height of the positioning terminal 112 protruding from the support plate 12. In other words, the second thinning area is recessed in the surface of the support plate 12, and a part of the positioning terminal 112 may be provided in the second thinning area, which not only reduces the height of the positioning terminal 112 protruding from the support plate 12, but also reduces the overall thickness of the lead frame 1, which is conducive to the development trend of thinning and miniaturization of the package assembly 100.

[0070] A positioning groove (not shown) may be provided at the position corresponding to the chip 2 on the surface of the support plate 12, and the positioning groove is used to position the chip 2. In the process of installing the chip 2 on the support plate 12, the positioning groove can provide precise positioning and improve the accuracy of the installation position of the chip 2. The projection area of ​​the positioning groove on the support plate 12 is larger than the projection area of ​​the chip 2 on the support plate 12, and the second welding layer 125 can be provided in the positioning groove. The positioning groove can be protruding from the surface of the support plate 12, or it can be recessed in the surface of the support plate 12, or it can be flush with the surface of the support plate 12. In this embodiment, the positioning groove is recessed in the surface of the support plate 12, and a part of the chip 2 can be provided in the positioning groove, which can not only reduce the height of the chip 2 protruding from the support plate 12, which is conducive to the development trend of thinning and miniaturization of the packaging component 100, but also can adjust the height of the upper surface of the chip 2 so that the upper surface of the chip 2 is flush with the upper surface of the connection terminal 111 for connecting the wire 3, so as to shorten the length of the wire 3.

[0071] Reference Figures 4 to 9 The present invention further provides a packaging assembly 100, comprising the above-mentioned lead frame 1, chip 2 and packaging shell 4, wherein the chip 2 is arranged on the support plate 12 of the lead frame 1, the packaging shell 4 can be formed by injection molding, the packaging shell 4 covers at least part of the chip 2 and at least part of the lead frame 1, and at least part of the connection terminal 111 is exposed from the packaging shell 4. In this embodiment, the chip 2 is completely covered by the packaging shell 4, so that the chip 2 is better protected, and part of the connection terminal 111 is exposed from the packaging shell 4 to ensure that the connection terminal 111 can be electrically connected to the external circuit.

[0072] The material of the packaging shell 4 can be a thermoplastic material, and the thermoplastic material is preferably epoxy resin. Epoxy resin has good bonding, sealing and heat dissipation properties, thereby achieving better packaging performance for the lead frame 1 and the chip 2.

[0073] The material of the packaging shell 4 can also be a thermosetting material, and the thermosetting material is preferably a liquid crystal polymer (LCP). The LCP material softens and melts when heated, has a simple molding process, good injection molding properties, and better plasticity, so it can better fix the lead frame 1 and the chip 2 together. At the same time, for the thinner the thickness of the packaging component 100, the better the mechanical properties of the LCP material and the higher the molding accuracy. In addition, the high temperature resistance of the packaging component 100 is generally required to be higher than 175 degrees, and the thermal deformation temperature of the LCP material can reach up to 400°C, so it also has good high temperature resistance.

[0074] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, substitute and modify the above embodiments within the scope of the invention without departing from the principles and purpose of the present invention. All such changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A wire frame, characterized in that: include: A frame body, the frame body comprising a connecting terminal, a welding portion is provided on the connecting terminal, and a first welding layer is provided on a surface of the welding portion; A support plate, the support plate having a first surface and a second surface arranged opposite to each other, the support plate being used to carry a chip, the welding portion of the connection terminal being connected to the chip through a wire, a second welding layer being arranged at a position corresponding to the chip on the first surface of the support plate to increase the bonding force between the support plate and the chip, the second welding layer being a gold-tin alloy layer; Among them, the material of the support plate is a ceramic substrate, a groove is arranged on the first surface of the support plate, at least part of the glue is filled in the groove, the welding part is fixedly connected to the support plate by glue, at least a part of the area of ​​the welding part facing the first surface of the support plate is arranged in contact with the surface of the support plate, so that the welding part is in direct contact with the support plate, and when the lead frame is packaged in a packaging shell, at least part of the second surface of the support plate is exposed from the packaging shell.

2. The lead frame according to claim 1, characterized in that The welding portion is used to connect the upper surface of the wire and is flush with the upper surface of the chip to shorten the length of the wire.

3. The lead frame according to claim 1, characterized in that The projection area of ​​the second welding layer on the support plate is larger than the projection area of ​​the chip on the support plate; and / or, The thickness of the second welding layer is 1-20 μm.

4. The lead frame according to claim 1, characterized in that: The frame body further includes a positioning terminal. A third welding layer is disposed on the support plate. The positioning terminal is connected to the support plate through the third welding layer.

5. The lead frame according to claim 4, characterized in that The upper surface of the welding portion of the connecting terminal is flush with the upper surface of the positioning terminal; and / or, The number of the positioning terminals is four, and the four positioning terminals are respectively arranged close to the four corners of the support plate.

6. The lead frame according to claim 4, characterized in that The connecting terminal and the positioning terminal are connected to the same material strip; or, The connecting terminal and the positioning terminal are cut from the same material strip.

7. The lead frame according to claim 4, characterized in that A first thinning area is provided at a position on the surface of the support plate corresponding to the connection terminal to reduce the height of the connection terminal protruding from the support plate; and / or, A second thinning area is provided at a position on the surface of the support plate corresponding to the positioning terminal to reduce the height of the positioning terminal protruding from the support plate; and / or, A positioning groove is provided on the surface of the support plate at a position corresponding to the chip, and the positioning groove is used to position the chip; and / or, The ceramic substrate is made of aluminum oxide or silicon nitride, and the conducting wire is a gold wire.

8. A packaging component, characterized in that: It comprises a lead frame, a chip and a packaging shell as described in any one of claims 1 to 7, wherein the chip is arranged on a support plate of the lead frame, the packaging shell covers at least part of the chip and at least part of the lead frame, and at least part of the connecting terminals are exposed from the packaging shell.

9. The packaging assembly according to claim 8, characterized in that: The packaging shell is formed by injection molding, and the material of the packaging shell is a thermosetting material or a thermoplastic material.

10. The packaging assembly according to claim 8, characterized in that: The packaging shell is made of epoxy resin or liquid crystal polymer material.

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