A semiconductor electric heating plate and system

Abstract

The present invention relates to the technical field of semiconductor heating plates, and specifically to a semiconductor electric heating plate and system, including a base and a semiconductor electric heating plate; a plurality of lifting slots are evenly arranged on the semiconductor electric heating plate, and the lifting slots are evenly arranged around the axis of the semiconductor electric heating plate, and the semiconductor electric heating plate is evenly divided into a plurality of electric heating parts, each electric heating part is provided with a heating wire, and the electric heating wires in each electric heating part are connected in parallel, and a support seat is provided in the lifting slot for movement in the vertical direction, and a limit block is fixedly provided on the upper part of the support seat, and the limit blocks on all the support seats constitute a groove structure for placing a workpiece, and the support seat has the lowest position in its vertical movement stroke. The present invention can prevent the workpiece from falling during the heating process, and can also ensure that the workpiece can be removed smoothly after processing.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor heating discs, and in particular to a semiconductor electric heating disc and a system. Background Art

[0002] The heating principle of the semiconductor electric heating plate is to use the property of semiconductor materials that can heat up quickly after power is turned on to heat related products. In the process of producing semiconductor wafers, it is necessary to use a semiconductor electric heating plate to heat the semiconductor wafers, that is, to soft-bake the wafers after the glue coating process. The traditional heating process is a separate process, that is, after glue coating, the semiconductor wafer is moved to the semiconductor heating plate for heating. However, there is a distance between the glue coating station and the heating station, and the semiconductor wafers after glue coating need to be transported. The transportation process cannot be well utilized, resulting in low efficiency during soft baking.

[0003] Chinese patent application CN116489836A discloses a semiconductor heating plate structure, including: a heating support component, a limiting heat-conducting component and a wafer, the heating support component includes a bottom shell, a shell cover, an electric heating tube, a wafer carrier and a fan, the electric heating tube is arranged inside the bottom shell, the shell cover is installed on the top of the bottom shell, and the shell cover is provided with a first air outlet, the wafer carrier is fixedly arranged above the shell cover, the wafer carrier is provided with an annular groove, and the wafer carrier is provided with a strip groove in a radial position connected to the annular groove, the inner bottom wall of the annular groove is provided with a second air outlet matched with the first air outlet, the bottom of the bottom shell is provided with an air inlet, and the fan is installed inside the air inlet. The limiting heat-conducting component includes a limiting plate and a lifting part, the limiting plate is provided with a wafer limiting opening, and the wafer limiting opening is located above the wafer carrier, two groups of the lifting parts are respectively installed on both sides of the bottom shell, and the lifting part drives the limiting plate to rise and fall. The wafer is placed on the wafer carrier.

[0004] Although the above scheme utilizes the process of transportation to heat the semiconductor wafer, the entire mobile device is in an open state and the heating effect is low. It is difficult to achieve the desired effect by heating the semiconductor wafer only during the transportation process. In addition, due to the rapid heat dissipation, the power of the semiconductor electric heating plate needs to be increased accordingly. If the semiconductor electric heating plate is in a high-power working state for a long time, it will inevitably be damaged. In addition, since the semiconductor wafer is heated during transportation, the traditional semiconductor electric heating plate does not have a shielding unit. During transportation, the semiconductor wafer is prone to accidental falling. If a limit unit is directly set on the semiconductor electric heating plate to limit the semiconductor wafer to be transported, it will be inconvenient to take out the semiconductor wafer after processing is completed. Summary of the invention

[0005] In view of the above problems, a semiconductor electric heating plate and system are provided, firstly, the support seat is lowered to the lowest position in the vertical direction, at which time the upper end surface of the support seat is coplanar with the upper end surface of the semiconductor electric heating plate, and since all the support seats arranged on the semiconductor electric heating plates are lifted and lowered synchronously, the groove-shaped structure formed by the limit blocks arranged on the support seats does not change during the lifting and lowering process of the support seats, and when the upper end surface of the support seat is coplanar with the upper end surface of the semiconductor electric heating plate, the workpiece is placed in the groove-shaped structure, at which time the upper end surface of the semiconductor electric heating plate is in direct contact with the lower end surface of the workpiece, and the heating wires connected in parallel in the semiconductor electric heating plate are started, and the heating wires connected in parallel heat the workpiece, and the semiconductor electric heating plate moves along the extension direction of the base, and the semiconductor electric heating plate heats the workpiece during the time period of its own movement, and since the limit blocks are arranged on the upper part of the support seat, the workpiece placed on the upper part of the support seat is limited by the limit blocks, thus preventing the workpiece arranged on the support seat from being moved. When the workpiece is not supported by the support seat and the workpiece is lifted up and down by the support seat, even if a limit block is fixed on the semiconductor electric heating plate, the semiconductor wafer as the workpiece is relatively thin, and the related components connected to the upper end face of the semiconductor wafer after processing are not firm, which is not convenient for smooth removal. By lifting the support seat, the workpiece and the semiconductor electric heating plate can be separated smoothly, so that the workpiece can be lifted from the bottom of the workpiece by the mechanical claw, thus avoiding the workpiece from falling during the heating process, and at the same time ensuring that the workpiece can be smoothly removed after processing, avoiding the damage of the workpiece during the process of removing the workpiece.

[0006] In order to solve the problems of the prior art, the present invention provides a semiconductor electric heating plate, comprising a base and a semiconductor electric heating plate moving along the extension direction of the base; a plurality of lifting grooves are evenly opened on the semiconductor electric heating plate, the lifting grooves are evenly arranged around the axis of the semiconductor electric heating plate, and the semiconductor electric heating plate is evenly divided into a plurality of electric heating parts, each electric heating part is provided with a heating wire, the electric heating wires in each electric heating part are connected in parallel, a support seat is provided in the lifting groove for movement in the vertical direction, a limit block is fixedly provided on the upper part of the support seat, the limit blocks on all the support seats constitute a groove structure for placing a workpiece, the support seat has a highest position and a lowest position in its vertical movement stroke, when the support seat is at the lowest position, the upper end face of the support seat is coplanar with the upper end face of the semiconductor electric heating plate, the lower part of the workpiece placed in the groove structure is in direct contact with the semiconductor electric heating plate, after the processing is completed, the support seat rises to the highest position in the vertical direction, and the workpiece is out of contact with the upper part of the semiconductor electric heating plate.

[0007] Preferably, an extension sleeve is fixedly provided at the bottom of the electric heating plate along the axial direction of the electric heating plate, a threaded groove is provided on the outer wall of the extension sleeve, the lifting sleeve is rotatably arranged on the periphery of the extension sleeve, the lifting sleeve is rotatably matched with the support seat and is synchronously lifted and lowered in the vertical direction, and the lifting sleeve is threadably matched with the extension sleeve.

[0008] Preferably, two cover shells are arranged on the upper part of the semiconductor electric heating plate along the width direction of the base. The two cover shells can move away from or approach each other along the width direction of the base. When the workpiece is placed on the semiconductor electric heating plate, the two cover shells approach each other and finally close to each other. The closed cover shells and the upper part of the semiconductor electric heating plate form a heating cavity. After processing, the two cover shells in the closed state move away from each other along the width direction of the base.

[0009] Preferably, a circulation unit is provided on the cover shell, the circulation unit includes a circulation pipe, two circulation pipes are provided, the two circulation pipes are respectively provided on the side walls of the two cover shells, the interior of the cover shell is connected with the circulation pipe, a connecting pipe is provided between the two circulation pipes, the two circulation pipes are connected to each other through the connecting pipe, an air pump is provided on one of the circulation pipes, and the air pump is started after the two cover shells are closed.

[0010] Preferably, a pushing unit for driving the two covers to move closer to or away from each other is provided at the lower part of the cover shell, and the pushing unit includes a turntable, which is arranged at the lower part of the semiconductor electric heating disk and rotates along the axis of the semiconductor electric heating disk, and two hinge columns are vertically fixed at the upper part of the turntable, and the two hinge columns are arranged around the axis of the turntable, and a pushing rod is hinged on the hinge column, and one end of the pushing rod away from the hinge column is hinged to the bottom of the cover shell, and a guide frame is provided at the lower part of the cover shell along the width direction of the base, and the cover shell slides with the guide frame along the width direction of the base.

[0011] Preferably, a driving unit for driving the turntable to rotate is arranged at the bottom of the turntable, and the driving unit comprises a gear ring, which is fixedly arranged at the bottom of the turntable along the axis of the turntable.

[0012] Preferably, a heat dissipation unit is arranged at the bottom of the extension sleeve, and the heat dissipation unit includes a heat dissipation shell covered on the bottom of the extension sleeve, the heat dissipation shell forms a heat dissipation cavity at the bottom of the extension sleeve, a fan is rotatably arranged at the bottom of the heat dissipation shell, an air inlet is opened on the side wall of the heat dissipation shell, and the fan is used to discharge the hot air in the heat dissipation cavity.

[0013] Preferably, a second gear is provided on one side of the fan, and a transmission unit is provided at the second gear and the end of the fan. The second gear drives the fan to rotate through the transmission unit. A rack is provided on the base along the length direction of the base. The rack is located on one side of the second gear, and the rack and the second gear are meshed with each other.

[0014] Preferably, an air duct is provided at the air inlet of the heat dissipation shell, the air duct is arranged on the base along the length direction of the base, and one end of the air duct away from the air inlet is located at one end of the base in the length direction.

[0015] The invention also relates to a semiconductor electric heating system, comprising a glue dripping device, a glue leveling device and a semiconductor electric heating plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. First, make the support seat descend to the lowest position in the vertical direction. At this time, the upper end surface of the support seat is coplanar with the upper end surface of the semiconductor electric heating plate. Since all the support seats arranged on the semiconductor electric heating plate are lifted and lowered synchronously, the groove structure formed by the limit block arranged on the support seat does not change during the lifting process of the support seat. When the upper end surface of the support seat is coplanar with the upper end surface of the semiconductor electric heating plate, the workpiece is placed in the groove structure. At this time, the upper end surface of the semiconductor electric heating plate is in direct contact with the lower end surface of the workpiece, and the heating wires connected in parallel in the semiconductor electric heating plate are started. The parallel heating wires heat the workpiece, and the semiconductor electric heating plate moves along the extension direction of the base. The semiconductor electric heating plate heats the workpiece during the time period of its own movement. Since a limit block is arranged on the upper part of the support seat, the workpiece placed on the upper part of the support seat is limited by the limit block. In this way, the workpiece arranged on the support seat can be prevented from slipping. When the workpiece After the processing is completed, the semiconductor electric heating plate stops moving, and all the support seats on the lifting slot rise synchronously in the vertical direction. When the support seat rises to the highest position, the support seat stops moving. At this time, the workpiece located on the upper part of the support seat is separated from the upper end surface of the semiconductor electric heating plate, so that the workpiece can be easily removed. If the workpiece is not supported by the support seat and the workpiece is lifted and lowered by the support seat, even if a limit block is fixed on the semiconductor electric heating plate, since the semiconductor wafer as the workpiece is relatively thin, and the related components connected to the upper end surface of the semiconductor wafer after processing are not firm, it is not easy to remove it smoothly. By lifting the support seat, the workpiece can be separated from the semiconductor electric heating plate smoothly, so that the workpiece can be lifted from the bottom of the workpiece by a mechanical claw, thus avoiding the workpiece from falling during the heating process, and at the same time ensuring that the workpiece can be removed smoothly after processing, avoiding damage to the workpiece during the removal process.

[0018] 2. A cover is provided on the upper part of the semiconductor electric heating disk, that is, in the process of conveying the workpiece, the two cover shells located on the upper part of the semiconductor electric heating disk approach each other and gradually close, and the closed cover shells and the upper part of the semiconductor electric heating disk form a heating cavity. The heating cavity can prevent the semiconductor electric heating disk from rapidly diffusing heat to the outside when heating the workpiece. In this way, the heating power of the semiconductor electric heating disk can be reduced, thereby reducing energy consumption costs and avoiding waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional schematic diagram of a semiconductor electric heating plate.

[0020] Figure 2 The present invention is a three-dimensional schematic diagram of a semiconductor electric heating plate with the base removed.

[0021] Figure 3It is a semiconductor electric heating plate. Figure 2 A local enlarged schematic diagram of point A in the middle.

[0022] Figure 4 The present invention is a three-dimensional schematic diagram of a semiconductor electric heating plate with the base and the slide removed.

[0023] Figure 5 It is a semiconductor electric heating plate. Figure 4 A local enlarged schematic diagram of point B in the middle.

[0024] Figure 6 The present invention is a three-dimensional schematic diagram of a semiconductor electric heating plate with a support seat, a base and a slide removed.

[0025] Figure 7 It is a semiconductor electric heating plate. Figure 6 A partial enlarged schematic diagram of point C in the middle.

[0026] Figure 8 A cutaway 3D diagram of a semiconductor electric heating plate with the base and slide removed Figure 1 .

[0027] Fig. 9 It is a semiconductor electric heating plate. Figure 8 A partial enlarged schematic diagram of point D in the middle.

[0028] Fig.10 A cutaway 3D diagram of a semiconductor electric heating plate with the base and slide removed Figure 2 .

[0029] The numbers in the figure are:

[0030] 1. Base; 11. Slide; 2. Semiconductor electric heating plate; 21. Heating wire; 22. Lifting slot; 23. Extension sleeve; 24. Lifting sleeve; 25. Cover; 26. Circulation unit; 261. Air pump; 262. Circulation pipe; 263. Connecting pipe; 27. Push unit; 271. Turntable; 272. Push rod; 273. Guide frame; 274. Follow-up rod; 275. Follow-up slot; 28. Drive unit; 281. Gear ring; 282. First gear; 283. Rotary drive; 3. Support seat; 31. Limit block; 4. Workpiece; 5. Heat dissipation unit; 51. Fan; 52. Heat dissipation shell; 521. Air inlet; 53. Transmission unit; 531. First synchronous wheel; 532. Second synchronous wheel; 533. Synchronous belt; 54. Second gear; 55. Rack; 56. Air duct. DETAILED DESCRIPTION

[0031] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0032] Reference Figure 1 , Figure 2 , Figure 7 and Fig.10 A semiconductor electric heating plate, comprising a base 1 and a semiconductor electric heating plate 2 moving along the extension direction of the base 1; a plurality of lifting grooves 22 are evenly opened on the semiconductor electric heating plate 2, the lifting grooves 22 are evenly arranged around the axis of the semiconductor electric heating plate 2, and the semiconductor electric heating plate 2 is evenly divided into a plurality of electric heating parts, each of which is provided with a heating wire 21, and the electric heating wires 21 in each electric heating part are connected in parallel, a support seat 3 is arranged to move in the vertical direction in the lifting groove 22, a limit block 31 is fixedly provided on the upper part of the support seat 3, and the limit blocks 31 on all the support seats 3 constitute a groove structure for placing a workpiece 4, and the support seat 3 has a highest position and a lowest position in its vertical movement stroke, when the support seat 3 is at the lowest position, the upper end face of the support seat 3 is coplanar with the upper end face of the semiconductor electric heating plate 2, and the lower part of the workpiece 4 placed in the groove structure is in direct contact with the semiconductor electric heating plate 2, and after the processing is completed, the support seat 3 rises to the highest position in the vertical direction, and the workpiece 4 is out of contact with the upper part of the semiconductor electric heating plate 2.

[0033] A slide 11 is provided on the base 1, and the slide 11 is used to drive the semiconductor electric heating disk 2 to move along the length direction of the base 1. In the prior art, when the semiconductor electric heating disk 2 heats the workpiece 4, for ease of understanding, the workpiece 4 is taken as an example of a semiconductor wafer, and for ease of description, the semiconductor wafer is referred to as the workpiece 4. In the traditional processing steps, when heating the workpiece 4, it is only necessary to place the workpiece 4 on the semiconductor electric heating disk 2 for heating, and the semiconductor electric heating disk 2 cannot be moved, but needs to be heated before entering the next process, and the heating time is long, and the transportation also takes time. In order to overcome the above-mentioned low work efficiency, in the existing production technology, usually in the process of transporting the workpiece 4 The workpiece 4 is heated during transportation, but the existing semiconductor electric heating plate 2 is mostly in a fully open state when heating the object, which can ensure that the workstation equipment corresponding to the process can be operated conveniently when it is transported to the designated process, but the heating efficiency is low, and the existing semiconductor electric heating plate 2 is a full circular structure, that is, the shape of the semiconductor electric heating plate 2 is completely flawless and is a complete circle, which causes the workpiece 4 in transportation to be unable to be limited and is prone to falling during transportation. At the same time, after the workpiece 4 is processed, the upper end surface of the semiconductor electric heating plate 2 is completely parallel to the horizontal plane, which makes it inconvenient to remove the workpiece 4 from the semiconductor electric heating plate 2. In order to solve the above problems, the electric heating plate is further improved, and the specific working principle is as follows First, the support seat 3 is lowered to the lowest position in the vertical direction. At this time, the upper end surface of the support seat 3 is coplanar with the upper end surface of the semiconductor electric heating plate 2. Since all the support seats 3 arranged on the semiconductor electric heating plate 2 are lifted and lowered synchronously, the groove structure formed by the limit block 31 arranged on the support seat 3 does not change during the lifting and lowering process of the support seat 3. When the upper end surface of the support seat 3 is coplanar with the upper end surface of the semiconductor electric heating plate 2, the workpiece 4 is placed in the groove structure. At this time, the upper end surface of the semiconductor electric heating plate 2 is in direct contact with the lower end surface of the workpiece 4, and the heating wires 21 connected in parallel in the semiconductor electric heating plate 2 are started. The heating wires 21 connected in parallel heat the workpiece 4, and the semiconductor electric heating plate 2 is extended along the extension direction of the base 1. The semiconductor electric heating disk 2 heats the workpiece 4 during the time period of its own movement, and since a limiting block 31 is provided on the upper portion of the support seat 3, the workpiece 4 placed on the upper portion of the support seat 3 is limited by the limiting block 31, thereby preventing the workpiece 4 set on the support seat 3 from slipping. When the workpiece 4 is processed, the semiconductor electric heating disk 2 stops moving, and all the support seats 3 on the lifting slot 22 rise synchronously in the vertical direction. When the support seat 3 rises to the highest position, the support seat 3 stops moving. At this time, the workpiece 4 located on the upper portion of the support seat 3 is separated from the upper end surface of the semiconductor electric heating disk 2, thereby making it easy to remove the workpiece 4. If the workpiece 4 is not supported by the support seat 3 and is driven to rise and fall by the support seat 3,Even if the limit block 31 is fixedly set on the semiconductor electric heating plate 2, since the semiconductor wafer as the workpiece 4 is relatively thin, and the related components connected to the upper end surface of the semiconductor wafer after processing are not firm, it is not easy to remove it smoothly. By lifting the support seat 3, the workpiece 4 can be separated from the semiconductor electric heating plate 2 smoothly, so that the workpiece 4 can be lifted from the bottom of the workpiece 4 by the mechanical claw, so that the workpiece 4 can be prevented from falling during the heating process, and at the same time, it can ensure that the workpiece 4 can be removed smoothly after processing, avoiding the damage of the workpiece 4 during the process of removing the workpiece 4.

[0034] Reference Figure 8 and Fig. 9 An extension sleeve 23 is fixedly arranged at the bottom of the electric heating plate along the axial direction of the electric heating plate, a threaded groove is opened on the outer wall of the extension sleeve 23, a lifting sleeve 24 is rotatably sleeved on the outer periphery of the extension sleeve 23, the lifting sleeve 24 is rotatably matched with the support seat 3 and is synchronously lifted and lowered along the vertical direction, and the lifting sleeve 24 is threadably matched with the extension sleeve 23.

[0035] Since the lifting sleeve 24 is threadedly matched with the extension sleeve 23 , when the lifting sleeve 24 rotates, the lifting sleeve 24 and the support seat 3 are synchronously lifted and lowered in the vertical direction, so that the support seat 3 can be lifted and lowered in the vertical direction.

[0036] Reference Figure 4 and Figure 6 : Two cover shells 25 are arranged on the upper part of the semiconductor electric heating disk 2 along the width direction of the base 1. The two cover shells 25 can move away from or approach each other along the width direction of the base 1. When the workpiece 4 is placed on the semiconductor electric heating disk 2, the two cover shells 25 approach each other and finally close to each other. The closed cover shells 25 and the upper part of the semiconductor electric heating disk 2 form a heating cavity. After processing, the two cover shells 25 in the closed state move away from each other along the width direction of the base 1.

[0037] Before the cover 25 is set, when the semiconductor electric heating disk 2 heats the workpiece 4, the upper part of the semiconductor electric heating disk 2 is always in an open state. In this way, when the semiconductor electric heating disk 2 heats the workpiece 4, the power needs to be increased to ensure the heating effect. Since the lower part of the semiconductor wafer is in contact with the upper part of the semiconductor electric heating disk 2, the lower temperature of the semiconductor wafer serving as the workpiece 4 is higher than the upper temperature, and the temperature difference between the upper and lower parts is relatively obvious. In order to avoid the above situation, a cover 25 is set on the upper part of the semiconductor electric heating disk 2, that is, in the process of conveying the workpiece 4, the two cover shells 25 located on the upper part of the semiconductor electric heating disk 2 approach each other and gradually close. The closed cover shells 25 and the upper part of the semiconductor electric heating disk 2 form a heating chamber. The heating chamber can prevent the semiconductor electric heating disk 2 from quickly diffusing heat to the outside when heating the workpiece 4. In this way, the heating power of the semiconductor electric heating disk 2 can be reduced, thereby reducing energy consumption costs and avoiding waste of resources.

[0038] Reference Figure 4 and Figure 5 A circulation unit 26 is arranged on the cover shell 25, and the circulation unit 26 includes a circulation pipe 262. Two circulation pipes 262 are arranged, and the two circulation pipes 262 are respectively arranged on the side walls of the two cover shells 25. The interior of the cover shell 25 is connected with the circulation pipe 262. A connecting pipe 263 is arranged between the two circulation pipes 262. The two circulation pipes 262 are connected to each other through the connecting pipe 263. An air pump 261 is arranged on one of the circulation pipes 262. After the two cover shells 25 are closed, the air pump 261 is started.

[0039] When the cover 25 is set on the upper part of the semiconductor electric heating plate 2, although the heat in the heating chamber can be prevented from being dissipated after the two covers 25 are closed, it is worth noting that the temperature distribution in the heating chamber is still low in the upper part of the heating chamber and high in the lower part of the heating chamber. This is because the air in the heating chamber is in a non-flowing state, so the heat transfer is slow. In order to make the workpiece 4 heated more evenly when being heated, a circulation unit 26 is set on the cover 25, that is, when the two covers 25 are closed, the air pump 261 starts to start, and the air pump 261 draws the hot air in the heating chamber from the side wall of one of the covers 25, and inputs it into the heating chamber from the other cover 25 under the transportation of the circulation pipe 262 and the connecting pipe 263, so that the air in the heating chamber flows, so that the air in the heating chamber can be distributed more evenly, thereby ensuring the uniformity of the workpiece 4 after being heated.

[0040] Reference Figure 4 and Figure 8-Figure 10: A pushing unit 27 for driving the two covers 25 to move closer to or away from each other is arranged at the lower part of the cover shell 25, and the pushing unit 27 includes a turntable 271, and the turntable 271 is rotatably arranged at the lower part of the semiconductor electric heating disk 2 along the axis of the semiconductor electric heating disk 2, and two hinged columns are vertically fixed on the upper part of the turntable 271, and the two hinged columns are arranged around the axis of the turntable 271, and a pushing rod 272 is hinged on the hinged column, and one end of the pushing rod 272 away from the hinged column is hinged to the bottom of the cover shell 25, and a guide frame 273 is arranged at the lower part of the cover shell 25 along the width direction of the base 1, and the cover shell 25 slides with the guide frame 273 along the width direction of the base 1.

[0041] The pushing unit 27 also includes a follower rod 274, which is fixedly arranged on the turntable 271 in the vertical direction. A follower groove 275 is opened on the side wall of the lifting sleeve 24 in the vertical direction. The follower rod 274 is slidably arranged in the follower groove 275 in the vertical direction. When the turntable 271 rotates, the turntable 271 drives the lifting sleeve 24 to rotate synchronously through the follower rod 274. When the workpiece 4 needs to be placed on the semiconductor electric heating disk 2 or the workpiece 4 needs to be removed from the semiconductor electric heating disk 2, the turntable 271 rotates and pushes the cover shell 25 respectively through the two pushing rods 272. The two cover shells 25 are gradually separated under the push of the two pushing rods 272. In this way, when the two cover shells 25 are separated, the support seat 3 can be lifted by the lifting sleeve 24. When the two cover shells 25 are closed, the support seat 3 is driven down by the lifting sleeve 24.

[0042] Reference Figure 6-Figure 8 A driving unit 28 for driving the turntable 271 to rotate is arranged at the bottom of the turntable 271 . The driving unit 28 includes a gear ring 281 . The gear ring 281 is fixedly arranged at the bottom of the turntable 271 along the axis of the turntable 271 .

[0043] The driving unit 28 also includes a first gear 282 and a rotation driver 283. The first gear 282 is rotatably arranged on one side of the gear ring 281. The first gear 282 and the gear ring 281 are meshed with each other. A rotation driver 283 is fixedly arranged at the end of the first gear 282. The rotation driver 283 is preferably a servo motor. When the rotation driver 283 is started, the first gear 282 can drive the gear ring 281 to rotate, thereby causing the turntable 271 to rotate. The turntable 271 and the lifting sleeve 24 rotate synchronously. In this way, after the turntable 271 rotates, the cover shell 25 is pushed by the push rod 272. Under the push of the push rod 272, the two cover shells 25 are separated synchronously.

[0044] Reference Figure 2 , Figure 3 and Fig.10A heat dissipation unit 5 is arranged at the bottom of the extension sleeve 23, and the heat dissipation unit 5 includes a heat dissipation shell 52 covered at the bottom of the extension sleeve 23. The heat dissipation shell 52 forms a heat dissipation cavity at the bottom of the extension sleeve 23. A fan 51 is rotatably arranged at the bottom of the heat dissipation shell 52. An air inlet 521 is opened on the side wall of the heat dissipation shell 52. The fan 51 is used to discharge the hot air in the heat dissipation cavity.

[0045] The heating of the heating wire 21 in the semiconductor electric heating plate 2 needs to rely on the corresponding electronic control unit, and the electronic control unit is arranged at the bottom of the extension sleeve 23. The electronic control unit will generate a lot of heat during operation. In order to extend the service life of the electronic control unit, a heat dissipation shell 52 is covered at the bottom of the extension sleeve 23, and a fan 51 is arranged at the bottom of the heat dissipation shell 52. The hot air in the heat dissipation cavity is discharged by the rotating fan 51, thereby achieving a cooling effect on the electronic control unit.

[0046] Reference Figure 3 , Figure 8 and Fig.10 : A second gear 54 is provided on one side of the fan 51, and a transmission unit 53 is provided at the ends of the second gear 54 and the fan 51. The second gear 54 drives the fan 51 to rotate through the transmission unit 53. A rack 55 is provided on the base 1 along the length direction of the base 1. The rack 55 is located on one side of the second gear 54, and the rack 55 and the second gear 54 are meshed with each other.

[0047] The semiconductor electric heating plate 2 is arranged on the guide frame 273, and the guide frame 273 is arranged on the slide 11. The slide 11 is used to drive the guide frame 273 to move along the length direction of the base 1. The second gear 54 is rotatably arranged at the lower part of the guide frame 273. The second gear 54 moves synchronously with the guide frame 273 along the length direction of the base 1. When the slide 11 drives the guide frame 273 to move along the length direction of the base 1, the second gear 54 can roll on one side of the rack 55. In this way, when the second gear 54 rotates, the second gear 54 drives the fan 51 to rotate through the transmission unit 53. The transmission unit 53 includes a first synchronous wheel 531, a second synchronous wheel 532 and a synchronous belt 533. The first synchronous wheel 531 is fixedly arranged on the fan 51. At the bottom of the fan 51, the second synchronous wheel 532 is fixedly arranged on the upper end of the second gear 54, the diameter of the second synchronous wheel 532 is larger than the diameter of the first synchronous wheel 531, and a synchronous belt 533 is sleeved on the first synchronous wheel 531 and the second synchronous wheel 532, and the synchronous belt 533 is respectively matched with the first synchronous wheel 531 and the second synchronous wheel 532 for transmission. When the second gear 54 rotates, since the diameter of the first synchronous wheel 531 is smaller than the diameter of the second synchronous wheel 532, the rotation speed of the fan 51 fixedly connected to the first synchronous wheel 531 will be greater than the rotation speed of the second gear 54, so that the use of the motor can be reduced, which not only avoids the need to set a separate motor to drive the fan 51, but also reduces the subsequent maintenance cost.

[0048] Reference Figure 1 and Figure 2 An air duct 56 is provided at the air inlet 521 of the heat dissipation shell 52. The air duct 56 is provided on the base 1 along the length direction of the base 1. An end of the air duct 56 away from the air inlet 521 is located at one end of the base 1 in the length direction.

[0049] Since the temperature around the semiconductor electric heating plate 2 is relatively high, if the air inlet 521 on the heat dissipation shell 52 directly draws air around the semiconductor electric heating plate 2, the air exhausted by the fan 51 will be re-sucked into the air inlet 521, thus resulting in a poor cooling effect. The end of the air duct 56 away from the air inlet 521 is arranged at the end of the base 1, so that the air inlet 521 can draw in the outside air with a lower temperature, thereby ensuring the cooling effect. The air duct 56 is preferably a corrugated tube.

[0050] Reference Figure 1-Figure 10 : The present invention also relates to a semiconductor electric heating system, including a glue dripping device, a glue leveling device and a semiconductor electric heating plate.

[0051] After the glue dripping and glue leveling processes, the semiconductor wafer is placed on a semiconductor electric heating plate for heating and soft baking.

[0052] The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A semiconductor electric heating plate, comprising a base (1) and a semiconductor electric heating plate (2) moving along an extension direction of the base (1); It is characterized in that A plurality of lifting grooves (22) are evenly arranged on the semiconductor electric heating disk (2), the lifting grooves (22) are evenly arranged around the axis of the semiconductor electric heating disk (2), and the semiconductor electric heating disk (2) is evenly divided into a plurality of electric heating parts, each electric heating part is provided with a heating wire (21), the electric heating wires (21) in each electric heating part are connected in parallel, a support seat (3) is arranged in the lifting groove (22) to move in the vertical direction, a limit block (31) is fixedly arranged on the upper part of the support seat (3), and all the support seats (3) are provided with a plurality of electric heating parts. The limit block (31) forms a groove structure for placing the workpiece (4), and the support seat (3) has a highest position and a lowest position in its travel along the vertical direction. When the support seat (3) is at the lowest position, the upper end surface of the support seat (3) is coplanar with the upper end surface of the semiconductor electric heating plate (2), and the lower part of the workpiece (4) placed in the groove structure is in direct contact with the semiconductor electric heating plate (2). After the processing is completed, the support seat (3) rises to the highest position in the vertical direction, and the workpiece (4) is out of contact with the upper part of the semiconductor electric heating plate (2); Two cover shells (25) are arranged on the upper part of the semiconductor electric heating disk (2) along the width direction of the base (1); the two cover shells (25) can move away from or approach each other along the width direction of the base (1); when the workpiece (4) is placed on the semiconductor electric heating disk (2), the two cover shells (25) move closer to each other and eventually close to each other; the closed cover shells (25) and the upper part of the semiconductor electric heating disk (2) form a heating cavity; after processing, the two cover shells (25) in the closed state move away from each other along the width direction of the base (1).

2. A semiconductor electric heating plate according to claim 1, characterized in that: An extension sleeve (23) is fixedly arranged at the bottom of the electric heating plate along the axial direction of the electric heating plate, a threaded groove is provided on the outer wall of the extension sleeve (23), a lifting sleeve (24) is rotatably sleeved on the outer periphery of the extension sleeve (23), the lifting sleeve (24) and the support seat (3) are rotatably matched and synchronously lifted and lowered in the vertical direction, and the lifting sleeve (24) and the extension sleeve (23) are threadably matched.

3. A semiconductor electric heating plate according to claim 1, characterized in that: A circulation unit (26) is arranged on the cover shell (25), and the circulation unit (26) comprises a circulation pipe (262). Two circulation pipes (262) are arranged, and the two circulation pipes (262) are arranged on the side walls of the two cover shells (25) respectively. The interior of the cover shell (25) is connected to the circulation pipe (262). A connecting pipe (263) is arranged between the two circulation pipes (262). The two circulation pipes (262) are connected to each other through the connecting pipe (263). An air pump (261) is arranged on one of the circulation pipes (262). After the two cover shells (25) are closed, the air pump (261) is started.

4. A semiconductor electric heating plate according to claim 1, characterized in that: A pushing unit (27) is provided at the lower part of the cover shell (25) for driving the two cover shells (25) to move closer to or away from each other. The pushing unit (27) comprises a turntable (271). The turntable (271) is arranged at the lower part of the semiconductor electric heating disk (2) so as to rotate along the axis of the semiconductor electric heating disk (2). Two hinged columns are vertically fixedly provided at the upper part of the turntable (271). The two hinged columns are arranged around the axis of the turntable (271). A pushing rod (272) is hingedly connected to the hinged column. One end of the pushing rod (272) away from the hinged column is hingedly connected to the bottom of the cover shell (25). A guide frame (273) is provided at the lower part of the cover shell (25) along the width direction of the base (1). The cover shell (25) is slidably matched with the guide frame (273) along the width direction of the base (1).

5. A semiconductor electric heating plate according to claim 4, characterized in that: A driving unit (28) for driving the rotating disk (271) to rotate is arranged at the bottom of the rotating disk (271), and the driving unit (28) comprises a gear ring (281), and the gear ring (281) is fixedly arranged at the bottom of the rotating disk (271) along the axis of the rotating disk (271).

6. A semiconductor electric heating plate according to claim 2, characterized in that: A heat dissipation unit (5) is arranged at the bottom of the extension sleeve (23), the heat dissipation unit (5) comprising a heat dissipation shell (52) arranged on the bottom of the extension sleeve (23), the heat dissipation shell (52) forming a heat dissipation cavity at the bottom of the extension sleeve (23), a fan (51) being rotatably arranged at the bottom of the heat dissipation shell (52), an air inlet (521) being provided on a side wall of the heat dissipation shell (52), and the fan (51) being used to discharge hot air in the heat dissipation cavity.

7. A semiconductor electric heating plate according to claim 6, characterized in that: A second gear (54) is provided on one side of the fan (51), a transmission unit (53) is provided at the end of the second gear (54) and the fan (51), the second gear (54) drives the fan (51) to rotate through the transmission unit (53), a rack (55) is provided on the base (1) along the length direction of the base (1), the rack (55) is located on one side of the second gear (54), and the rack (55) and the second gear (54) are meshed with each other.

8. The semiconductor electric heating plate according to claim 6, characterized in that: An air guide duct (56) is provided at the air inlet (521) of the heat dissipation shell (52), the air guide duct (56) being provided on the base (1) along the length direction of the base (1), and an end of the air guide duct (56) away from the air inlet (521) being located at one end of the base (1) in the length direction.

9. A semiconductor electric heating system, characterized in that: It comprises a glue dripping device, a glue leveling device and a semiconductor electric heating plate as described in any one of claims 1-8.

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