Laser device test fixture

Abstract

The present invention provides a laser device test fixture, which relates to the technical field of laser equipment. The laser device test fixture provided by the present invention comprises: an insulating base, a first electrode pressing plate, a second electrode pressing block and a refrigeration mechanism, wherein the insulating base is provided with an assembly top surface and an assembly side surface, and the upper edge of the assembly side surface is connected to the side edge of the assembly top surface; one side of the first electrode pressing plate is connected to the assembly side surface, and a part of the first electrode pressing plate is higher than the assembly top surface; the second electrode pressing block is slidably connected to the assembly top surface, and the second electrode pressing block can move toward or away from the first electrode pressing plate; and the refrigeration mechanism is connected to the other side of the first electrode pressing plate.

Description

Technical Field

[0001] The invention relates to the technical field of laser equipment, and in particular to a laser device testing fixture. Background Art

[0002] Semiconductor lasers have the advantages of small size, light weight, high photoelectric conversion efficiency, large energy, high reliability and low price. They have been widely used in industry, medicine, military and other fields. Due to changes in laser device process, performance testing of individual laser devices is required.

[0003] When the laser device is powered on, it will generate a lot of waste heat. Therefore, the laser device needs to be packaged on a heat sink for testing. The verification cycle is long, and the heat sink cannot be reused after use, so the verification cost is high. Summary of the invention

[0004] The purpose of the present invention is to provide a laser device testing fixture to alleviate the technical problem of high cost of existing laser device testing.

[0005] The present invention provides a laser device testing fixture, comprising:

[0006] An insulating base, wherein the insulating base is provided with an assembly top surface and an assembly side surface, and an upper edge of the assembly side surface is connected to a side edge of the assembly top surface;

[0007] A first electrode pressing plate, one side of which is connected to the mounting side surface, and a portion of which is higher than the mounting top surface;

[0008] a second electrode pressing block, the second electrode pressing block being slidably connected to the assembly top surface and capable of moving toward or away from the first electrode pressing plate;

[0009] A cooling mechanism is connected to the other side of the first electrode pressing plate.

[0010] Furthermore, a pull rod connected to the second electrode pressing block is provided on the insulating base, and is used to pull the second electrode pressing block away from the first electrode pressing plate;

[0011] A reset structure is provided between the second electrode pressing block and the insulating base, and the reset structure is used to make the second electrode pressing block have a tendency to move toward one side of the first electrode pressing plate.

[0012] Furthermore, the reset structure includes a slider slidably connected to the insulating base, a spring is provided between the slider and the insulating base, and the spring has a tendency to make the slider move toward one side of the first electrode pressure plate;

[0013] The second electrode pressing block and the pull rod are both connected to the sliding block.

[0014] Furthermore, the second electrode pressing block includes an abutment portion, and the abutment portion is located on the assembly top surface;

[0015] The abutting portion includes an upwardly directed avoidance slope, and in a direction from the second electrode pressing block toward the first electrode pressing plate, the avoidance slope is inclined toward a side close to the assembly top surface.

[0016] Furthermore, from the direction from the assembly top surface toward the bottom surface of the insulating base, the assembly side surface is inclined toward the direction close to the second electrode pressing block;

[0017] The front surface of the first electrode pressing plate has a protrusion protruding toward one side of the second electrode pressing block, and the surface of the protrusion used for abutting against the laser device is perpendicular to the assembly top surface.

[0018] Furthermore, the refrigeration mechanism includes a semiconductor refrigerator and a heat dissipation water block, the semiconductor refrigerator is connected to the side of the first electrode pressure plate facing away from the assembly side, and the heat dissipation water block is connected to the side of the semiconductor refrigerator facing away from the first electrode pressure plate, so that the semiconductor refrigerator is located between the first electrode pressure plate and the heat dissipation water block.

[0019] Furthermore, in the up-down direction, the center of the semiconductor cooler is located between the center of the first electrode platen and the top wall of the first electrode platen, and the top wall of the semiconductor cooler is higher than the top wall of the first electrode platen.

[0020] Furthermore, the gap between the semiconductor refrigerator and the first electrode pressing plate is filled with thermal conductive silicone grease.

[0021] Furthermore, the area of ​​the side surface of the first electrode pressing plate connected to the assembly side surface is larger than the area of ​​the assembly side surface.

[0022] Furthermore, the insulating base is made of rubber.

[0023] The present invention has at least the following advantages or beneficial effects:

[0024] The laser device test fixture provided by the present invention comprises: an insulating base, a first electrode pressing plate, a second electrode pressing block and a cooling mechanism, wherein the insulating base is provided with an assembly top surface and an assembly side surface, and the upper edge of the assembly side surface is connected to the side edge of the assembly top surface; the front surface of the first electrode pressing plate is connected to the assembly side surface, and a part of the first electrode pressing plate is higher than the assembly top surface; the second electrode pressing block is slidably connected to the assembly top surface, and the second electrode pressing block can move toward or away from the first electrode pressing plate; and the cooling mechanism is connected to the back surface of the first electrode pressing plate.

[0025] Before the test, the laser device is placed on the assembly top surface of the insulating base and is located between the second electrode block and the first electrode platen. The second electrode block is driven to move toward the first electrode platen, so that the second electrode block and the first electrode platen clamp and fix the laser device and are electrically connected to the laser device. During the test, the heat generated by the first electrode platen is dissipated by the refrigeration mechanism. After the test is completed, the second electrode block is moved toward the side of the first electrode platen, and the next laser device is replaced, so as to achieve continuous testing. The test fixture can be used repeatedly, reducing the test cost. In addition, since in this embodiment, the first electrode platen is installed on the side of the insulating base, it can be set larger, the heat absorption effect is better, and the heat generated by the laser device can be absorbed more quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of a laser device test fixture provided in Example 1 of the present invention;

[0028] Figure 2 for Figure 1 A partial enlarged view of position A in the middle;

[0029] Figure 3 A side view of the laser device test fixture provided in Example 1 of the present invention;

[0030] Figure 4 A partial schematic diagram of a laser device testing fixture provided in Example 2 of the present invention.

[0031] Icon: 100-insulation base; 110-assembly top surface; 120-assembly side surface;

[0032] 200-first electrode pressing plate; 210-protrusion;

[0033] 300 - second electrode pressing block; 310 - abutment portion; 311 - avoidance slope;

[0034] 410-tie rod; 420-slider;

[0035] 510-semiconductor refrigerator; 520-heat dissipation block; 600-laser device. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0039] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0040] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0041] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Example 1

[0043] like Figure 1-Figure 3 As shown, the laser device test fixture provided by the present invention includes: an insulating base 100, a first electrode pressing plate 200, a second electrode pressing block 300 and a cooling mechanism. The first electrode pressing plate 200 can be a positive pressing plate or a negative pressing plate; when the first electrode pressing plate 200 is a positive pressing plate, the second electrode pressing block 300 is a negative pressing block; when the first electrode pressing plate 200 is a negative pressing plate, the second electrode pressing block 300 is a positive pressing block.

[0044] The material of the insulating base 100 can be rubber or polyetherketone (PEK), preferably rubber. The shape of the insulating base 100 is roughly a rectangular parallelepiped, and of course other regular or irregular shapes are also possible. The insulating base 100 is provided with an assembly top surface 110 and an assembly side surface 120, and the upper edge of the assembly side surface 120 is connected to the side edge of the assembly top surface 110. In this embodiment, the assembly top surface 110 is the upper surface of the insulating base 100, and the assembly side surface 120 is the right side surface of the insulating base 100. In this embodiment, the assembly top surface 110 and the assembly side surface 120 are vertically connected.

[0045] The prior art usually dissipates heat through the base, but in this embodiment, the insulating base 100 is made of insulating rubber, which has poor heat dissipation. The first electrode pressing plate 200 is arranged on the side, and the cooling mechanism directly contacts the first electrode pressing plate 200 to dissipate heat.

[0046] like Figure 2 and Figure 3 As shown, the front of the first electrode platen 200 is attached to the assembly side surface 120, and a portion of the first electrode platen 200 is higher than the assembly top surface 110, and the raised portion is used for positioning and stopping and electrically connecting the laser device 600. The laser device 600 includes a chip and conductive heat sinks respectively arranged on both sides of the chip. In this embodiment, the front area of ​​the first electrode platen 200 is larger than the area of ​​the assembly side surface 120, thereby maximizing the area of ​​the first electrode platen 200, that is, increasing the heat dissipation area, and the heat generated between the laser device 600 and the first electrode platen 200 can be quickly conducted to the entire first electrode platen 200 to avoid excessive local temperature.

[0047] like Figure 3 As shown, the second electrode pressing block 300 is slidably connected to the assembly top surface 110 , and the second electrode pressing block 300 can move toward or away from the first electrode pressing plate 200 , so that the second electrode pressing block 300 and the first electrode pressing plate 200 clamp the laser device 600 .

[0048] The cooling mechanism is connected to the back side of the first electrode pressing plate 200, and the heat diffused to the entire first electrode pressing plate 200 is then absorbed by the cooling mechanism, so the heat dissipation effect is better.

[0049] Before the test, the laser device 600 is placed on the assembly top surface 110 of the insulating base 100 and is located between the second electrode pressing block 300 and the first electrode pressing plate 200, and the second electrode pressing block 300 is driven to move toward the first electrode pressing plate 200, so that the second electrode pressing block 300 and the first electrode pressing plate 200 clamp and fix the laser device 600 and are electrically connected to the laser device 600. During the test, the heat generated by the first electrode pressing plate 200 is dissipated by the refrigeration mechanism. After the test is completed, the second electrode pressing block 300 is moved toward the side away from the first electrode pressing plate 200, and the next laser device 600 is replaced, so as to realize continuous testing, and the test fixture can be used repeatedly, reducing the test cost. In addition, since in this embodiment, the first electrode pressing plate 200 is installed on the side of the insulating base 100, it can be set larger, the heat absorption effect is better, and the heat generated by the laser device 600 can be absorbed more quickly.

[0050] The insulating base 100 is provided with a pull rod 410 connected to the second electrode block 300, which is used to pull the second electrode block 300 away from the first electrode platen 200; a reset structure is provided between the second electrode block 300 and the insulating base 100, and the reset structure is used to make the second electrode block 300 have a tendency to move toward the side of the first electrode platen 200.

[0051] The user drags the second electrode block 300 away from the first electrode platen 200 through the pull rod 410. After the laser device 600 is placed, the pull rod 410 is released. Driven by the reset structure, the second electrode block 300 presses the laser device 600. In the left and right directions, the second electrode block 300 and the first electrode platen 200 form a stable clamping relationship for the laser device 600.

[0052] Specifically, the reset structure includes a slider 420 slidably connected to the insulating base 100, a spring is arranged between the slider 420 and the insulating base 100, and the spring has a tendency to move the slider 420 toward the side of the first electrode pressure plate 200; the second electrode pressure block 300 and the pull rod 410 are both connected to the slider 420.

[0053] A slide groove extending in the left-right direction is provided on the assembly top surface 110 of the insulating base 100, and the slider 420 is slidably connected in the slide groove. One end of the spring is connected to the insulating base 100, and the other end is connected to the right side wall of the slider 420, which can pull the slider 420 to move toward the first electrode pressing plate 200. The pull rod 410, the second electrode pressing block 300 and the slider 420 have the same motion state.

[0054] like Figure 2 As shown, the second electrode pressing block 300 includes a contact portion 310, which is located on the assembly top surface 110; the contact portion 310 includes an avoidance slope 311 facing upward, and from the second electrode pressing block 300 toward the first electrode pressing plate 200, the avoidance slope 311 is inclined toward the side close to the assembly top surface 110 to avoid the avoidance slope 311 blocking the light output of the laser device 600.

[0055] The cross-sectional shape of the abutment portion 310 can be a trapezoid, and its cross-section is respectively perpendicular to the assembly top surface 110 and the assembly side surface 120. The upward surface of the abutment portion 310 is an avoidance slope 311. The laser device 600 clamped between the first electrode pressing plate 200 and the second electrode pressing block 300 emits light upward. The laser device 600 has a certain divergence angle. The avoidance slope 311 can avoid the light emitted by the laser device 600 to a certain extent, thereby making the test accuracy higher. Preferably, the lowest edge of the avoidance slope 311 is lower than or flush with the light emitting surface of the laser device 600, so as to minimize interference with the light.

[0056] The refrigeration mechanism includes a semiconductor cooler 510 and a heat dissipation water block 520. The semiconductor cooler 510 is connected to the back side of the first electrode pressure plate 200, and the heat dissipation water block 520 is connected to the side of the semiconductor cooler 510 facing away from the first electrode pressure plate 200, so that the semiconductor cooler 510 is located between the first electrode pressure plate 200 and the heat dissipation water block 520.

[0057] The semiconductor refrigerator 510 is in the form of a sheet and is sandwiched between the first electrode platen 200 and the heat dissipation water block 520. The cold end of the semiconductor refrigerator 510 is in contact with the first electrode platen 200, and the hot end is in contact with the heat dissipation water block 520. The semiconductor refrigerator 510 transfers the heat on the first electrode platen 200 to the heat dissipation water block 520. A circulating water flow is arranged inside the heat dissipation water block 520, and the circulating water flow takes away the heat on the heat dissipation water block 520. The semiconductor refrigerator 510 is a prior art and will not be described in detail here. The semiconductor refrigerator 510 and the heat dissipation water block 520 transfer the heat on the first electrode platen 200 by actively dissipating heat, thereby improving the heat dissipation efficiency of the first electrode platen 200.

[0058] The heat dissipation and water flow block 520, the first electrode pressing plate 200 and the insulating base 100 are provided with mounting screw holes correspondingly. After the screws are passed through the heat dissipation and water flow block 520, the first electrode pressing plate 200 and the insulating base 100 in sequence, the first electrode pressing plate 200 and the heat dissipation and water flow block 520 are respectively fixed to the insulating base 100. In the front-to-back direction, the length of the semiconductor refrigerator 510 is less than the length of the heat dissipation and water flow block 520, and the mounting screws will not pass through the semiconductor refrigerator 510. The semiconductor refrigerator 510 is clamped and fixed between the first electrode pressing plate 200 and the heat dissipation and water flow block 520.

[0059] In the up and down direction, the center of the semiconductor cooler 510 is located between the center of the first electrode platen 200 and the top wall of the first electrode platen 200 , and the top wall of the semiconductor cooler 510 is higher than the top wall of the first electrode platen 200 .

[0060] In this embodiment, the first electrode platen 200 and the cooling mechanism are placed sideways to increase the area of ​​the first electrode platen 200. Furthermore, the semiconductor cooler 510 can be placed on top to form a misalignment with the first electrode platen 200, because the heat dissipation capacity of the middle position of the semiconductor cooler 510 is better than that of the edge position, so the middle position of the semiconductor cooler 510 is closer to the heat source, that is, the position where the laser device 600 and the first electrode platen 200 contact, which can achieve a better heat dissipation effect.

[0061] Furthermore, the gap between the semiconductor cooler 510 and the first electrode pressing plate 200 is filled with thermal conductive silicone grease.

[0062] Example 2

[0063] like Figure 4As shown, the difference from Example 1 is that, in this embodiment, the assembly side surface 120 is inclined. Specifically, from the direction of the assembly top surface 110 toward the bottom surface of the insulating base 100, the assembly side surface 120 is inclined toward the direction close to the second electrode pressing block 300, and the first electrode pressing plate 200 attached to the assembly side surface 120 is also inclined relative to the up and down direction to avoid blocking the light output of the laser device 600.

[0064] Furthermore, in order to prevent the inclined first electrode pressing plate 200 from unstablely clamping the laser device 600, a protrusion 210 protruding toward the second electrode pressing block 300 is provided on the front side of the first electrode pressing plate 200. The cross-sectional shape of the protrusion 210 may be a trapezoid. The surface of the protrusion 210 that is used to abut against the laser device 600 is perpendicular to the assembly top surface 110. The two parallel surfaces clamp the laser device 600, and the clamping of the laser device 600 is more stable.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser device test fixture, the laser device (600) comprising a chip and conductive heat sinks respectively arranged on both sides of the chip, characterized in that: include: An insulating base (100), wherein the insulating base (100) is provided with an assembly top surface (110) and an assembly side surface (120), and the upper edge of the assembly side surface (120) is connected to the side edge of the assembly top surface (110); a first electrode pressing plate (200), one side of the first electrode pressing plate (200) being connected to the assembly side surface (120), and a portion of the first electrode pressing plate (200) being higher than the assembly top surface (110); a second electrode pressing block (300), the second electrode pressing block (300) being slidably connected to the assembly top surface (110), and the second electrode pressing block (300) being capable of moving toward or away from the first electrode pressing plate (200); The second electrode pressing block (300) and the first electrode pressing plate (200) clamp and fix the laser device (600) and are electrically connected to the laser device (600); The area of ​​the side surface of the first electrode pressing plate (200) connected to the assembly side surface (120) is larger than the area of ​​the assembly side surface (120); A refrigeration mechanism, the refrigeration mechanism is connected to the other side of the first electrode pressing plate (200).

2. The laser device test fixture according to claim 1, characterized in that: The insulating base (100) is provided with a pull rod (410) connected to the second electrode pressing block (300), and the pull rod (410) is used to pull the second electrode pressing block (300) away from the first electrode pressing plate (200); A reset structure is provided between the second electrode pressing block (300) and the insulating base (100), and the reset structure is used to make the second electrode pressing block (300) have a tendency to move towards one side of the first electrode pressing plate (200).

3. The laser device test fixture according to claim 2, characterized in that: The reset structure comprises a slider (420) slidably connected to the insulating base (100), a spring being arranged between the slider (420) and the insulating base (100), the spring having a tendency to make the slider (420) move towards one side of the first electrode pressing plate (200); The second electrode pressing block (300) and the pull rod (410) are both connected to the sliding block (420).

4. The laser device test fixture according to claim 1, characterized in that: The second electrode pressing block (300) comprises an abutment portion (310), and the abutment portion (310) is located on the assembly top surface (110); The abutment portion (310) comprises an upwardly directed avoidance slope (311), and in a direction from the second electrode pressing block (300) toward the first electrode pressing plate (200), the avoidance slope (311) is inclined toward a side close to the assembly top surface (110).

5. The laser device test fixture according to claim 1, characterized in that: From the direction from the assembly top surface (110) toward the bottom surface of the insulating base (100), the assembly side surface (120) is inclined toward a direction close to the second electrode pressing block (300); The front surface of the first electrode pressing plate (200) has a protrusion (210) protruding toward one side of the second electrode pressing block (300), and the surface of the protrusion (210) used for abutting against the laser device (600) is perpendicular to the assembly top surface (110).

6. The laser device test fixture according to claim 1, characterized in that: The refrigeration mechanism comprises a semiconductor cooler (510) and a heat dissipation and water flow block (520); the semiconductor cooler (510) is connected to a side of the first electrode pressing plate (200) that faces away from the assembly side (120); and the heat dissipation and water flow block (520) is connected to a side of the semiconductor cooler (510) that faces away from the first electrode pressing plate (200), so that the semiconductor cooler (510) is located between the first electrode pressing plate (200) and the heat dissipation and water flow block (520).

7. The laser device test fixture according to claim 6, characterized in that: In the up-down direction, the center of the semiconductor cooler (510) is located between the center of the first electrode pressing plate (200) and the top wall of the first electrode pressing plate (200), and the top wall of the semiconductor cooler (510) is higher than the top wall of the first electrode pressing plate (200).

8. The laser device test fixture according to claim 6, characterized in that: The gap between the semiconductor cooler (510) and the first electrode pressing plate (200) is filled with thermally conductive silicone grease.

9. The laser device test fixture according to claim 1, characterized in that: The insulating base (100) is made of rubber.

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