A leveling tool and a leveling method of a magnetic assembly of a magnetron sputtering device

Abstract

This application discloses a leveling fixture and a method for leveling magnetic components in a magnetron sputtering device. The leveling fixture, used for horizontal adjustment of the magnetic components in the magnetron sputtering device, includes: a handheld part with a first connecting hole extending from the top to the bottom; a support part connected to the outer wall of the handheld part and surrounding it, used to support the upper electrode cavity sidewall of the magnetron sputtering device during leveling; the support part includes a cutout area for avoiding leveling elements and fastening screws of the upper magnetic component; a lifting shaft, movably disposed within the first connecting hole relative to the handheld part; and at least one measuring plate connected to the bottom end of the lifting shaft and extending horizontally away from the lifting shaft. The leveling fixture of this application simplifies and speeds up the leveling operation, improving production efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, specifically to a leveling tooling and a method for leveling magnetic components of a magnetron sputtering equipment. Background Technology

[0002] Physical vapor deposition (PVD) magnetron sputtering equipment is an important piece of equipment used for coating in the field of integrated circuit and LED manufacturing. Magnetic components are an important part of physical vapor deposition magnetron sputtering equipment. Figure 1 This is a schematic diagram of the upper electrode structure of an existing physical vapor deposition magnetron sputtering apparatus after the cover is opened, as shown below. Figure 1 As shown, the upper electrode structure mainly includes an upper electrode cavity (including a side wall 10a), a rotating shaft 20a, a fixed base 30a, and a magnetic component 40a disposed on the fixed base 30a. During the physical vapor deposition magnetron sputtering process, the target material 101a is fixed to the side wall 10a of the upper electrode cavity, and a gap, namely the target-magnetic distance Da, is provided between it and the magnetic component 40a.

[0003] Figure 2 This is a structural diagram of an existing magnetic component, combined with... Figure 1 and Figure 2 As shown, the rotating shaft 20a is connected to the hole 31a on the fixed base 30a. During operation, the rotating shaft 20a drives the fixed base 30a to rotate, which in turn drives the magnetic component 40a to rotate. Therefore, it is necessary to strictly control the target magnetic distance Da and ensure the levelness of the magnetic component 40a to prevent the rotating shaft 20a from breaking or jamming due to excessive torque caused by imbalance of the magnetic component 40a during production. The magnetic component 40a can be a magnetron assembly.

[0004] Please continue reading. Figure 1 and Figure 2 The magnetic component 40a includes a first annular cover plate 41a, a second annular cover plate 42a, a back plate 43a, and magnetic posts 44a sandwiched between the first annular cover plate 41a and the back plate 43a, and magnetic posts 44a sandwiched between the second annular cover plate 42a and the back plate 43a. Multiple leveling components 46a pass through the back plate 43a and are supported on the fixing base 30a, used to adjust the levelness of the magnetic component 40a. After leveling, the back plate 43a is locked and fixed to the fixing base 30a by fastening screws 45a.

[0005] Please see Figure 3 , Figure 3This is a structural diagram of an existing leveling fixture during leveling. Specifically, an aluminum fixture 102a (thickness D0) is supported on a side wall 10a. Then, a vernier caliper is used to measure the distance D between the upper surface of the aluminum fixture 102a and the upper surface of the magnetic component 40a. The target magnetic distance Da = D - D0. Multiple positions are measured. When Da at one or more positions exceeds the error range, the magnetic component 40a can be leveled by adjusting the leveling component 46a until Da at each position is within the error range. Then, it can be determined that the current position of the magnetic component 40a has been leveled and the target magnetic distance is the target value.

[0006] The above leveling method requires repeated measurement of the target magnetic distance, which not only results in multiple measurement errors but also slows down the adjustment process and seriously affects production efficiency. Summary of the Invention

[0007] To address the aforementioned technical problems, this application provides a leveling fixture and leveling method for magnetron sputtering equipment, which can improve the problem of slow speed and reduced production efficiency of existing leveling methods.

[0008] To address the aforementioned technical problems, in a first aspect, embodiments of this application provide a leveling fixture for horizontally adjusting the magnetic components of a magnetron sputtering device, comprising:

[0009] The hand-held part is provided with a first connecting hole extending from the top surface to the bottom surface;

[0010] A support portion, connected to the outer wall of the handheld portion and arranged around the handheld portion, is used to support the upper electrode cavity of the magnetron sputtering device on the side wall during leveling. The support portion includes a cutout area for avoiding the leveling member and fastening screw of the upper magnetic assembly.

[0011] The lifting shaft is vertically and flexibly disposed within the first connecting hole relative to the handheld part;

[0012] At least one measuring plate is connected to the bottom end of the lifting shaft and extends horizontally away from the lifting shaft.

[0013] Optionally, the leveling fixture may further include:

[0014] A lifting adjustment shaft is disposed in the first connecting hole and threadedly connected to the first connecting hole; the lifting adjustment shaft is provided with a second connecting hole extending from the top surface to the bottom surface, and the lifting shaft is connected to the second connecting hole;

[0015] An adjustment knob, connected to the top surface of the lifting adjustment shaft, is used to rotate the lifting adjustment shaft so that the lifting adjustment shaft can be raised or lowered relative to the handheld part.

[0016] Optionally, the leveling fixture further includes a dial, which is disposed on the handgrip and surrounds the lifting adjustment shaft, for indicating the distance the lifting adjustment shaft rises or falls after rotation.

[0017] Optionally, the lifting shaft is rotatably connected to the second connecting hole.

[0018] Optionally, the leveling fixture further includes an upper bearing and a lower bearing disposed in the second connecting hole;

[0019] The lifting shaft has a protrusion in the middle, and the lifting shaft is connected to the upper bearing and the lower bearing respectively, with the upper bearing and the lower bearing sandwiched between the upper and lower sides of the protrusion.

[0020] Optionally, the bottom surface of the support is provided with a recessed portion to avoid the measuring plate when the measuring plate rises or rotates with the lifting shaft.

[0021] Optionally, the support portion includes at least three support bars evenly distributed around the handgrip, one end of each support bar being connected to the outer wall of the handgrip, and the other end being used to support the side wall.

[0022] Secondly, embodiments of this application provide a method for leveling a magnetic component of a magnetron sputtering apparatus, applied to the leveling fixture described in the above embodiments, the leveling method comprising:

[0023] Step S110: Adjust the lifting shaft so that the distance between the bottom surface of the support and the bottom surface of the measuring plate is the target magnetic distance;

[0024] Step S120: Loosen the fastening screws of the magnetic component;

[0025] Step S130: Support the leveling fixture on the side wall;

[0026] Step S140: Check whether the bottom surface of the measuring plate is in contact with the top surface of the magnetic component;

[0027] Step S150: If the fit is good, tighten the fastening screws of the magnetic component to complete the leveling.

[0028] Optionally, step S150 includes:

[0029] Step S151: If they fit together, rotate the measuring plate by a preset angle using the lifting shaft.

[0030] Step S152: If the bottom surface of the measuring plate is in contact with the top surface of the magnetic component, tighten the fastening screws of the magnetic component to complete the leveling.

[0031] Optionally, step S140 may further include:

[0032] Step S160: If the magnetic components do not adhere properly, adjust the leveling mechanism of the magnetic components and return to step S140.

[0033] As described above, the leveling fixture of this application allows for pre-adjustment of the measuring plate's height via the lifting shaft, ensuring the distance between the bottom surface of the measuring plate and the bottom surface of the support portion is the target magnetic distance. The support portion of the leveling fixture is then supported on the side wall of the upper electrode cavity of the magnetron sputtering equipment. A plug gauge within the acceptable error range is then inserted between the bottom surface of the measuring plate and the top surface of the magnetic component. Multiple positions can be measured along the measuring plate, and the leveling fixture can be rotated to repeat measurements at other positions. If the plug gauge cannot be inserted at any position, it indicates that the current target magnetic distance meets the target value, and the magnetic component has been leveled. Compared to the traditional method of directly measuring the current target magnetic distance using vernier calipers, the leveling operation using the leveling fixture of this embodiment is simpler, avoids the measurement errors of vernier calipers, and saves debugging time, thereby improving production efficiency. Attached Figure Description

[0034] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0035] Figure 1 This is a schematic diagram of the upper electrode structure of an existing physical vapor deposition magnetron sputtering device after the cover is opened;

[0036] Figure 2 This is a schematic diagram of the structure of an existing magnetic component;

[0037] Figure 3 This is a structural diagram of an existing leveling fixture during leveling.

[0038] Figure 4 This is a top view of a leveling fixture provided in an embodiment of this application;

[0039] Figure 5 yes Figure 4 A schematic diagram of the leveling fixture from below;

[0040] Figure 6 yes Figure 4 A cross-sectional structural diagram of the leveling fixture;

[0041] Figure 7 This is a structural schematic diagram of a leveling fixture during leveling, provided in an embodiment of this application.

[0042] Figure 8 This is a flowchart illustrating a leveling method provided in an embodiment of this application.

[0043] The realization of the objectives, functional features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation

[0044] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0045] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0046] It should be further understood that the terms "comprising" or "including" indicate the presence of the stated features, steps, operations, elements, components, items, types, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, types, and / or groups. The terms "or," "and / or," and "comprising at least one of the following," as used in this application, can be interpreted as inclusive, or mean any one or any combination thereof. For example, "comprising at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C," and similarly, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C." Exceptions to this definition only occur when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0047] It should be understood that although the terms first, second, third, etc., may be used in this document to describe various types of information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this document, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the singular forms “a,” “an,” and “the” used in this document are intended to also include the plural forms, unless the context indicates otherwise.

[0048] It should be understood that the terms "top", "bottom", "upper", "lower", "vertical", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application.

[0049] For ease of description, the following embodiments are all illustrated using an orthogonal space formed by a horizontal plane and a vertical direction as an example. This premise should not be construed as a limitation of this application.

[0050] Figure 4 This is a top view schematic diagram of a leveling fixture provided in an embodiment of this application. Figure 5 yes Figure 4 A bottom-view structural diagram of the leveling fixture. Figure 6 yes Figure 4 A sectional structural diagram of the leveling fixture, combined with... Figures 4 to 6 As shown, the leveling fixture can be used to adjust the horizontal position of the magnetic component 40a of the magnetron sputtering equipment, and specifically includes: a handheld part 10, a support part 20, a lifting shaft 30 and at least one measuring plate 40.

[0051] The handle 10 is used for gripping, installing, and adjusting the leveling fixture. The handle 10 can be cylindrical, dumbbell-shaped, hexahedral, or other irregular shapes, etc., and this embodiment does not impose any particular limitation. The handle 10 has a first connecting hole 11 extending from the top surface to the bottom surface (see [reference]). Figure 6 Taking the handle 10 as a cylindrical shape as an example, the first connecting hole 11 can be coaxially set with the handle 10.

[0052] The support portion 20 is connected to the outer wall of the handheld portion 10 and is disposed around the handheld portion 10 for supporting the side wall 10a of the upper electrode cavity of the magnetron sputtering device during leveling. The support portion 20 includes a cutout area for avoiding the leveling member 46a and the fastening screw 45a of the magnetic assembly 40a. For example, the support portion 20 can be a support plate, with the handheld portion 10 disposed on the top surface of the support plate, and a solid cutout area provided on the top surface of the support plate in the area directly opposite the leveling member 46a and the fastening screw 45a. As an example, the support portion 20 can be a support ring connected to the handheld portion 10 by connecting ribs, so that there is an annular contact surface between the support portion 20 and the side wall 10a of the upper electrode cavity, and the area between the connecting ribs constitutes the cutout area. Preferably, as Figure 4 and Figure 5 As shown, the support portion 20 may include at least three support strips 21 evenly distributed around the handle portion 10. One end of the support strip 21 is connected to the outer wall of the handle portion 10, and the other end is used to support the side wall 10a. The support portion structure of this embodiment can provide stable support for the leveling fixture while making the entire leveling fixture lightweight.

[0053] The lifting shaft 30 is vertically and flexibly disposed in the first connecting hole 11 relative to the handheld part 10. The measuring plate 40 is connected to the bottom end of the lifting shaft 30, for example, it can be fixed to the end of the lifting shaft 30 by screws 41. The measuring plate 40 extends horizontally from the lifting shaft 30 in a direction away from the lifting shaft 30. The height of the measuring plate 40 can be adjusted by raising or lowering the lifting shaft 30. One, two, or more measuring plates 40 can be provided, and this embodiment is not limited thereto.

[0054] Please see Figure 7 , Figure 7This is a schematic diagram of the structure of a leveling fixture provided in this application embodiment during leveling. In application, the height of the measuring plate 40 can be pre-adjusted by raising and lowering the lifting shaft 30, so that the distance between the bottom surface of the measuring plate 40 and the bottom surface of the support part 20 is the target magnetic distance Da. Then, the support part 20 of the leveling fixture is supported on the side wall 10a of the upper electrode cavity of the magnetron sputtering equipment. A plug gauge within the error range is then inserted between the bottom surface of the measuring plate 40 and the top surface of the magnetic component 40a (the top surface of the first annular cover plate 41a or the second annular cover plate 42a). Multiple positions can be measured along the measuring plate 40. The leveling fixture can also be rotated by an angle to repeat the measurement at other positions. If the plug gauge cannot be inserted at each position, it indicates that the current target magnetic distance meets the target value, and the magnetic component 40a has been leveled. Compared with the traditional method of directly measuring the current target magnetic distance using vernier calipers, the leveling operation using the leveling fixture of this embodiment is simpler, avoids the measurement error of vernier calipers, and saves debugging time, thereby improving production efficiency.

[0055] In one embodiment, this application provides a method for adjusting the lifting of a lifting shaft. Please refer to the following: Figure 4 and Figure 6 The leveling fixture may also include a lifting adjustment shaft 50 and an adjustment knob 60. The lifting adjustment shaft 50 is disposed within and threadedly connected to the first connecting hole 11. The lifting adjustment shaft 50 has a second connecting hole 51 extending from the top surface to the bottom surface. The lifting shaft 30 is connected to the second connecting hole 51; for example, the lifting shaft 30 may be fixedly disposed within the second connecting hole 51. The adjustment knob 60 is connected to the top surface of the lifting adjustment shaft 50 and is used to rotate the lifting adjustment shaft 50, causing the lifting adjustment shaft 50 to rise or fall relative to the handheld part 10. The lifting shaft 30 rises or falls together with the lifting adjustment shaft 50 to adjust the height of the measuring plate 40. As an example, the leveling fixture may also include a dial 70; please refer to further details. Figure 4 A dial 70 is mounted on the handgrip 10 and surrounds the lifting adjustment shaft 50, used to indicate the distance the lifting adjustment shaft 50 rises or falls after rotation.

[0056] In this embodiment, the height of the measuring plate 40 is adjusted by rotating the lifting adjustment shaft 50. The thread adjustment has high precision, and the thread structure can be designed accordingly as needed. For example, the adjustment precision can be 0.1mm.

[0057] It should be noted that in the above embodiment, the lifting shaft 30 can be fixedly connected to the second connecting hole 51 of the lifting adjustment shaft 50. However, when measuring other positions, it is necessary to lift the entire leveling fixture, rotate it by an angle, and then support the support part 20 of the leveling fixture on the side wall 10a, which is inconvenient. Therefore, as a preferred example, the lifting shaft 30 is rotatably connected to the second connecting hole 51, for example, the lifting shaft 30 can be connected to the second connecting hole 51 through a bearing. When measuring other positions, the measuring plate 40 can be manually moved directly, and the measuring plate 40 rotates relative to the support part 20 to the target position through the lifting shaft 30, making the operation simpler.

[0058] As an example, please see Figures 4-6 Alternatively, a sealing cover 12 can be provided at the bottom of the handheld part 10 to cover the first connecting hole 11 from the bottom. At the same time, a through hole is opened in the sealing cover 12 to avoid the lifting shaft 30, so that the lifting shaft 30 can be lifted or rotated.

[0059] For the best options, please continue reading. Figure 6 The leveling fixture may also include an upper bearing 81 and a lower bearing 82 disposed in the second connecting hole 51. A protrusion 31 is provided in the middle of the lifting shaft 30; for example, the protrusion 31 may be a cylinder surrounding the lifting shaft 30. The lifting shaft 30 is connected to the upper bearing 81 and the lower bearing 82 respectively, and the upper bearing 81 and the lower bearing 82 are sandwiched between the upper and lower sides of the protrusion 31. The verticality of the lifting shaft 30 can be ensured by the two bearings (upper bearing 81 and lower bearing 82), preventing large measurement errors caused by the eccentricity of the lifting shaft 30.

[0060] In one embodiment, please refer to... Figure 6 The bottom surface of the support portion 20 may also be provided with a recess 22 to avoid the measuring plate 40 when it rises or rotates with the lifting shaft 30. For example, when the measuring plate 40 rises with the lifting shaft 30, it can be housed in the recess 22, thereby raising the lower limit of the target magnetic distance setting. When the recess 22 can completely accommodate the measuring plate 40 in the thickness direction, the minimum lower limit of the target magnetic distance setting can be 0. In addition, when the measuring plate 40 rotates with the lifting shaft 30 and rotates to directly below the support portion 20, the recess 22 can avoid the measuring plate 40, allowing the measuring plate 40 to rotate freely 360°.

[0061] Based on the leveling fixtures described in the above embodiments, this application also provides a method for leveling the magnetic components of a magnetron sputtering apparatus. Please refer to [link to relevant documentation]. Figure 8 , Figure 8 This is a flowchart illustrating a leveling method provided in an embodiment of this application. The leveling method includes:

[0062] Step S110: Adjust the lifting shaft so that the distance between the bottom surface of the support and the bottom surface of the measuring plate is the target magnetic distance.

[0063] Step S120: Loosen the fastening screws of the magnetic component.

[0064] During the leveling of the magnetic component 40a, first adjust the lifting shaft 30 so that the distance between the bottom surface of the support 20 and the bottom surface of the measuring plate 40 is the target magnetic distance. Simultaneously, loosen the fastening screws 45a of the magnetic component 40a. This allows for the operation of the leveling component 46a on the magnetic component 40a to level it if the magnetic component 40a is found to be not level during the leveling process. It should be noted that steps S110 and S120 in this embodiment are not sequential; for example, step S120 can be performed first, followed by step S110.

[0065] Step S130: Support the leveling fixture on the side wall of the upper electrode cavity.

[0066] Step S140: Check whether the bottom surface of the measuring plate and the top surface of the magnetic component are in contact.

[0067] Please combine Figure 7 After adjusting the distance between the bottom surface of the support part 20 of the leveling fixture and the bottom surface of the measuring plate 40 to the target magnetic distance and supporting the support part 20 of the leveling fixture on the side wall 10a, if the position of the magnetic component 40a conforms to the target magnetic distance and remains horizontal, check whether the bottom surface of the measuring plate 40 and the top surface of the magnetic component 40a are in contact. For example, a 0.1mm plug gauge can be used for detection, and multiple positions can be measured.

[0068] Step S150: If the fit is good, tighten the screws of the magnetic component to complete the leveling.

[0069] If the plug gauge cannot be inserted into the gap between the bottom surface of the measuring plate 40 and the top surface of the magnetic component 40a, it can be determined that the two are in contact. Then, tighten the fastening screw 45a of the magnetic component 40a to lock and fix the back plate 43a of the magnetic component 40a to the fixing seat 30a, and the leveling is completed.

[0070] As an example, step S150 may include:

[0071] Step S151: If they fit together, the measuring plate 40 is rotated by a preset angle via the lifting shaft 30.

[0072] Step S152: If the bottom surface of the measuring plate 40 is in contact with the top surface of the magnetic component, tighten the fastening screws of the magnetic component to complete the leveling.

[0073] If the plug gauge cannot fit into the gap between the bottom surface of the measuring plate 40 and the top surface of the magnetic component, the measuring plate 40 can be rotated by the lifting shaft 30 at a preset angle to check other positions of the magnetic component 40a. This can further verify whether the bottom surface of the measuring plate 40 and the top surface of the magnetic component are in contact. For example, after the initial test, it can be rotated 30° for a second test, and after the second test, it can be rotated 60° for a third test, and so on. If the result of each test indicates that the bottom surface of the measuring plate 40 and the top surface of the magnetic component 40a are in contact, the fastening screw 45a of the magnetic component 40a can be tightened to complete the leveling.

[0074] The leveling method in this embodiment does not require the use of vernier calipers to determine whether the target magnetic distance meets the target value and whether the magnetic component 40a remains horizontal. Instead, it only requires the use of a plug gauge for intuitive judgment, thus avoiding the measurement error of vernier calipers and saving debugging time to improve production efficiency.

[0075] In one embodiment, step S140 may be followed by:

[0076] Step S160: If not properly aligned, adjust the leveling component of the magnetic assembly and return to step S140.

[0077] For example, if a plug gauge can be inserted into a certain position, it means that the bottom surface of the measuring plate 40 is not in contact with the top surface of the magnetic component 40a. At this time, the leveling component 46a of the magnetic component 40a can be adjusted, and then return to step 140 to determine whether the bottom surface of the measuring plate 40 and the top surface of the magnetic component 40a are in contact.

[0078] The above provides a detailed description of a leveling fixture and a leveling method for the magnetic components of a magnetron sputtering apparatus provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. It should be noted that the descriptions of each embodiment in this application have different focuses; parts not described in detail in a particular embodiment can be referred to in the relevant descriptions of other embodiments.

[0079] The technical features of the present application can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0080] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A leveling fixture for horizontally adjusting the magnetic components of a magnetron sputtering equipment, characterized in that, include: The hand-held part is provided with a first connecting hole extending from the top surface to the bottom surface; A support portion is connected to the outer wall of the handheld portion and is disposed around the handheld portion for supporting the upper electrode cavity of the magnetron sputtering device on the side wall during leveling. The support portion includes a cutout area for avoiding the leveling member and fastening screw of the magnetic assembly. The lifting shaft is vertically and flexibly disposed in the first connecting hole relative to the handheld part; At least one measuring plate is connected to the bottom end of the lifting shaft and extends horizontally away from the lifting shaft.

2. The leveling fixture according to claim 1, characterized in that, Also includes: A lifting adjustment shaft is disposed in the first connecting hole and is threadedly connected to the first connecting hole; The lifting adjustment shaft is provided with a second connecting hole extending from the top surface to the bottom surface, and the lifting shaft is connected to the second connecting hole; An adjustment knob, connected to the top surface of the lifting adjustment shaft, is used to rotate the lifting adjustment shaft so that the lifting adjustment shaft can be raised or lowered relative to the handheld part.

3. The leveling fixture according to claim 2, characterized in that, It also includes a dial, which is disposed on the handgrip and surrounds the lifting adjustment shaft, for indicating the distance the lifting adjustment shaft rises or falls after rotation.

4. The leveling fixture according to claim 2, characterized in that, The lifting shaft is rotatably connected to the second connecting hole.

5. The leveling fixture according to claim 4, characterized in that, It also includes an upper bearing and a lower bearing disposed in the second connecting hole; The lifting shaft has a protrusion in the middle, and the lifting shaft is connected to the upper bearing and the lower bearing respectively, with the upper bearing and the lower bearing sandwiched between the upper and lower sides of the protrusion.

6. The leveling fixture according to claim 4, characterized in that, The bottom surface of the support is provided with a recessed portion, which is used to avoid the measuring plate when the measuring plate rises or rotates with the lifting shaft.

7. The leveling fixture according to any one of claims 1-6, characterized in that, The support portion includes at least three support bars evenly distributed around the handgrip portion. One end of each support bar is connected to the outer wall of the handgrip portion, and the other end is used to support the side wall.

8. A method for leveling a magnetic component in a magnetron sputtering apparatus, characterized in that, The leveling fixture described in any one of claims 1-7, the leveling method comprising: Step S110: Adjust the lifting shaft so that the distance between the bottom surface of the support and the bottom surface of the measuring plate is the target magnetic distance; Step S120: Loosen the fastening screws of the magnetic component; Step S130: Support the leveling fixture on the side wall; Step S140: Check whether the bottom surface of the measuring plate is in contact with the top surface of the magnetic component; Step S150: If the fit is good, tighten the fastening screws of the magnetic component to complete the leveling.

9. The leveling method according to claim 8, characterized in that, Step S150 includes: Step S151: If they fit together, rotate the measuring plate by a preset angle using the lifting shaft. Step S152: If the bottom surface of the measuring plate is in contact with the top surface of the magnetic component, tighten the fastening screws of the magnetic component to complete the leveling.

10. The leveling method according to claim 8, characterized in that, Following step S140, the following is also included: Step S160: If the magnetic components do not adhere properly, adjust the leveling mechanism of the magnetic components and return to step S140.

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