Solder Paste Management System and Its Management Method

Abstract

The present invention relates to the technical field of solder paste management, and in particular to a solder paste management system and a management method. The system includes: a material taking information acquisition module for acquiring material taking requirement information, where the material taking requirement information includes information on the solder paste to be taken and the taking weight; an outbound calculation module for matching and selecting multiple storage location combinations that meet preset conditions in the warehousing database; the warehousing database stores refrigerated box codes and storage locations in each refrigerated box, the storage locations are used to place solder paste bottles, and the storage locations are correspondingly associated with usage information of the solder paste bottles currently stored at the storage locations, and the usage information includes the outbound times of the solder paste bottles, information on the solder paste in the bottles, and the weight of the solder paste in the bottles; a screening module for screening out the optimal storage location combination from the storage location combinations. This application has the effects of reducing inventory backlogs or shortages, optimizing inventory turnover, and reducing inventory costs.

Description

Technical Field

[0001] The present invention relates to the technical field of solder paste management, and in particular to a solder paste management system and a management method. Background Art

[0002] In the electronics manufacturing industry, solder paste, as a key material, is widely used in the welding process of electronic devices. Its quality stability and usage efficiency are directly related to the performance and reliability of electronic products. Therefore, the inbound and outbound management of solder paste is particularly important.

[0003] With the continuous progress of technology and the rapid development of the manufacturing industry, the traditional solder paste management method can no longer meet the needs of modern production. Advanced information technology and automation technology have been introduced into solder paste management. By adopting advanced scanning technology, database management systems, and intelligent analysis algorithms, accurate recording and monitoring of the inbound and outbound time of solder paste can be achieved. Specifically, when solder paste is put into storage, the barcode or QR code of the solder paste is scanned by a scanning gun to automatically record information such as the inbound time, model, batch number, etc., and store this information in the database. When solder paste is taken out of storage, information such as the outbound time and quantity is also recorded through scanning technology and compared with the inventory data in real time to ensure the accuracy and consistency of the data.

[0004] However, the foregoing management system only summarizes the data statistically and does not improve the actual inventory backlog and out-of-stock phenomena. Summary of the Invention

[0005] In order to reduce inventory backlog or out-of-stock phenomena, optimize inventory turnover, and reduce inventory costs, the present application provides a solder paste management system and a management method.

[0006] The above-mentioned first invention object of the present application is achieved through the following technical solutions:

[0007] A solder paste management system includes:

[0008] A material taking information acquisition module, configured to acquire material taking requirement information, where the material taking requirement information includes information about the solder paste to be taken and the weight of the material taken;

[0009] An outbound calculation module, configured to match and select multiple combinations of storage locations that meet preset conditions in a warehousing database; the warehousing database stores refrigerated box codes and storage locations in each refrigerated box, the storage locations are used to place solder paste bottles, and the storage locations are correspondingly associated with usage information of the solder paste bottles currently stored at the storage locations, and the usage information includes the outbound times of the solder paste bottles, information about the solder paste in the bottles, and the weight of the solder paste in the bottles; the meeting of the preset conditions means that the total weight of the solder paste in the bottles associated with the multiple storage locations in the combination of storage locations reaches the weight of the solder paste in the bottles and the number of storage locations is not redundant;

[0010] A screening module for screening out the optimal storage location combination from the storage location combinations.

[0011] In a preferred example, the present application can be further configured as follows: The screening module includes:

[0012] A first calculation unit for calculating, in each storage location combination, the number of storage locations associated with the outbound times reaching a first preset number; and calculating whether the average value of the outbound times associated with each storage location in each storage location combination reaches a second preset number;

[0013] A first selection unit for, if the number of storage locations reaches a preset number, selecting the storage location combination with the largest number of storage locations as the optimal storage location combination.

[0014] In a preferred example, the present application can be further configured as follows: The screening module includes:

[0015] A second selection unit for, if the number of storage locations does not reach the preset number and the average value reaches the second preset number, selecting the storage location combination with the largest average value as the optimal storage location combination;

[0016] A second calculation unit for, if the number of storage locations does not reach the preset number and the average value does not reach the second preset number, calculating the remaining weight of each storage location combination according to the picking weight.

[0017] In a preferred example, the present application can be further configured as follows: The screening module includes:

[0018] A judgment unit for judging whether there is a storage location combination in which the remaining weight falls within the common margin range.

[0019] In a preferred example, the present application can be further configured as follows: The screening module includes: A third selection unit for, if there is a storage location combination in which the remaining weight falls within the common margin range, selecting the storage location combination with the largest average value in the storage location combinations in which the remaining weight falls within the common margin range as the optimal storage location combination.

[0020] In a preferred example, the present application can be further configured as follows: The screening module further includes:

[0021] A fourth selection unit for, if not, selecting the storage location combination with the largest average value as the optimal storage location combination.

[0022] The second invention object of the present application is achieved by the following technical solutions:

[0023] A solder paste management method, including:

[0024] Obtain the material fetching requirement information, which includes the solder paste information to be fetched and the fetching weight;

[0025] Match and select multiple storage location combinations that meet the preset conditions in the warehousing database according to the material fetching requirement information;

[0026] Screen out the optimal storage location combination from the storage location combinations.

[0027] In a preferred example, the present application can be further configured as: screening out the optimal storage location combination from the storage location combinations, including:

[0028] Calculate the number of storage locations in each storage location combination where the associated outbound times reach the first preset number of times; calculate whether the average value of the outbound times associated with each storage location in each storage location combination reaches the second preset number of times;

[0029] If the number of storage locations reaches the preset number, select the storage location combination with the largest number of storage locations as the optimal storage location combination;

[0030] If the number of storage locations does not reach the preset number and the average value reaches the second preset number of times, select the storage location combination with the largest average value as the optimal storage location combination.

[0031] In a preferred example, the present application can be further configured as: the solder paste management method further includes:

[0032] If the number of storage locations does not reach the preset number and the average value does not reach the second preset number of times, calculate the remaining weight of each storage location combination according to the fetching weight;

[0033] Judge whether there is a storage location combination where the remaining weight falls within the common margin range;

[0034] If there is a storage location combination where the remaining weight falls within the common margin range, select the storage location combination with the largest average value in the storage location combinations where the remaining weight falls within the common margin range as the optimal storage location combination.

[0035] In summary, the present application includes at least one of the following beneficial technical effects:

[0036] 1. It can effectively solve key problems such as inventory optimization, quality control, implementation of the first-in-first-out principle, reduction of waste, improvement of management efficiency and decision-making support, thereby bringing actual economic benefits and management benefits to the enterprise. And it helps to avoid inventory backlogs or shortages, optimize inventory turnover, and reduce inventory costs;

[0037] 2. By reasonably arranging the warehousing order and location, ensure that the solder paste warehoused first is used first, avoid the quality decline caused by long-term storage, and accurately predict the solder paste demand to avoid waste caused by excessive procurement. At the same time, adjust the warehousing plan in a timely manner according to the outbound data, which can also reduce the loss of expiration and scrapping caused by inventory backlog. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a schematic diagram of the modules of the solder paste management system in an embodiment of the present application;

[0039] Figure 2 is a schematic diagram of the modules of the solder paste management system in another embodiment of the present application;

[0040] Figure 3 is a flowchart of the implementation of the solder paste management method in an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0041] The following describes exemplary embodiments of the present application with reference to the accompanying drawings. Various details of the embodiments of the present application are included to facilitate understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted below.

[0042] It should be noted that the terms "first", "second", etc. in the present invention are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure.

[0043] In addition, the term "and / or" herein is merely a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after, unless otherwise specified.

[0044] Figure 1 is a schematic diagram of the modules of the solder paste management system according to the first embodiment of the present application, as Figure 1As shown in the figure, the solder paste management system includes a material taking information acquisition module, an outbound calculation module, and a screening module. Among them, the material taking information acquisition module is used to acquire material taking requirement information, and the material taking requirement information includes the solder paste information to be taken and the material taking weight. Specifically, the management system provides a client, and the staff can log in to the account to input the material taking requirement information, input the solder paste information to be taken, such as name and model, and can also add information such as the supplier to make it more detailed. The material taking weight is measured in grams.

[0045] The outbound calculation module is used to match and select multiple storage location combinations that meet the preset conditions in the warehouse database according to the material taking requirement information.

[0046] It can be understood that the system is built-in with a warehouse database, and the warehouse database stores the cold storage box codes and the storage locations in each cold storage box. For example, there are multiple cold storage boxes stored in the cabinet, and the corresponding codes in the system are #1, #2, #3, etc. The storage locations in the cold storage box are fixed, for example, presented in the form of a nine-square grid.

[0047] The storage location is used to place the solder paste bottle. When the staff enters the warehouse, they place the solder paste bottle in the storage location according to the specifications to complete the warehousing operation. The storage location is correspondingly associated with the usage information of the solder paste bottle currently stored at the storage location. The usage information includes the outbound times of the solder paste bottle, the solder paste information in the bottle, and the weight of the solder paste in the bottle. Specifically, weighing sensors are provided at each storage location in the cold storage box. When the solder paste bottle is placed at the storage location, the weighing sensor at the storage location weighs the solder paste bottle, and the weight of the solder paste in the bottle can be obtained after removing the tare weight of the bottle.

[0048] The top of the solder paste bottle has a dynamic QR code, and a scanning and writing device is provided at the top inside the cold storage box. The scanning and writing device is used to scan the dynamic QR code to identify the outbound times of each solder paste bottle and the solder paste information in the bottle. Specifically, the number and position of the scanning and writing devices are set corresponding to the number and position of the storage locations to achieve one-to-one scanning, reading, and information writing. After the system determines the optimal storage location combination, the scanning and writing device writes a new outbound time to the dynamic QR code.

[0049] Among them, meeting the preset conditions means that the total weight of the solder paste in the bottles associated with multiple storage locations in the storage location combination reaches the weight of the solder paste in the bottle and the number of storage locations is not redundant.

[0050] It can be understood that the number of storage locations corresponds to the number of solder paste bottles. Non-redundant means that if any one of the storage locations in the storage location combination is deducted, the total weight of the solder paste in the bottle does not reach the material taking weight.

[0051] The screening module is used to screen out the optimal storage location combination from the storage location combinations.

[0052] Combined with Figure 2, specifically, the screening module includes a first calculation unit, a first selection unit, a second selection unit, a second calculation unit, a judgment unit, a third selection unit, and a fourth selection unit.

[0053] Among them, the first calculation unit is used to calculate the number of storage positions whose associated outbound times reach the first preset number in each storage position combination; calculate whether the average value of the outbound times associated with each storage position in each storage position combination reaches the second preset number.

[0054] Specifically, the aforementioned scanning and writing device writes the new outbound times of the dynamic two-dimensional code into the dynamic two-dimensional code corresponding to the top of the solder paste bottle. For example, the dynamic two-dimensional code on the solder paste bottle cap can scan the updated correct information during the next scan. For example, a certain solder paste bottle has been taken 2 times. During a certain material taking process, if the selected optimal storage position combination includes this solder paste bottle, the corresponding scanning and writing device will write 3 times into the dynamic two-dimensional code of this solder paste bottle to achieve the update.

[0055] The first selection unit is used to select the storage position combination with the largest number of storage positions as the optimal storage position combination if the number of storage positions reaches the preset number.

[0056] The second selection unit is used to select the storage position combination with the largest average value as the optimal storage position combination if the number of storage positions does not reach the preset number and the average value reaches the second preset number.

[0057] The first preset number is set to 2 times, and the second preset number is set to 1 time. It can be understood that generally speaking, if the solder paste bottle is taken out and used more than 3 times, it is not recommended to use it again. Therefore, the first preset number is set to 2 times. The preset number can be generated according to the material taking weight, and it is proportional to the material taking weight. It can be understood that the more the required material taking weight, the more the corresponding number of bottles. Therefore, only the value of the preset number can be adjusted floatingly, which can effectively give priority to using the solder paste bottles in the warehouse that are about to exceed the available times.

[0058] Similarly, if there are not many solder paste bottles used more than 2 times, but the average outbound value of the storage position combination is large and the average outbound times exceed 1 time, then the storage position combination with the largest average value is used as the optimal storage position combination, which can also effectively give priority to using the solder paste bottles in the warehouse that are about to exceed the available times.

[0059] Moreover, if the scanning and writing device scans that the use and outbound of the solder paste bottle reach 3 times, it will send a prompt message to remind the staff or mark the use information of this solder paste bottle as unavailable.

[0060] A second calculation unit, configured to calculate the remaining weight of each storage location combination based on the material taking weight if the number of storage locations does not reach the preset number and the average value does not reach the second preset number of times.

[0061] A judgment unit, configured to judge whether there is a storage location combination whose remaining weight falls within the common allowance range.

[0062] Specifically, calculating the remaining weight of each storage location combination based on the material taking weight is the difference between the total weight of the solder paste in the bottles of each storage location combination and the material taking weight. The common allowance range is obtained through calculating the common allowance, and the common allowance is obtained by analyzing the historical outbound data. The difference between the required material taking weight and the total weight of the actual outbound solder paste in the bottles in the historical outbound records is counted to obtain the allowance of one outbound record. The allowance value with a relatively high proportion of occurrences is used as the common allowance. If the proportion of occurrences exceeds the preset proportion of 10%, it is regarded as the common allowance. For example, 30g and 60g, and then a certain floating value is provided. For example, 5g, then 25 - 35g and 55 - 65g are the common allowance ranges.

[0063] A third selection unit, configured to, if there is a storage location combination whose remaining weight falls within the common allowance range, select the storage location combination with the largest average value in the storage location combinations whose remaining weight falls within the common allowance range as the optimal storage location combination

[0064] A fourth selection unit, configured to, if not, select the storage location combination with the largest average value as the optimal storage location combination.

[0065] It can be understood that preferentially selecting the storage location combination with the remaining weight within the common allowance range is convenient for better matching the next outbound when reusing the remaining stock for subsequent return to the warehouse, reducing accumulation.

[0066] By managing the outbound according to the above solder paste outbound rules, key problems such as inventory optimization, quality control, implementation of the first-in-first-out principle, reduction of waste, improvement of management efficiency and decision-making support can be effectively solved, thus bringing actual economic benefits and management benefits to the enterprise. And it helps to avoid inventory backlog or out-of-stock phenomena, optimize inventory turnover, and reduce inventory costs.

[0067] This application also provides a solder paste management method, referring to Figure 3 , including:

[0068] S1. Obtain the material taking requirement information, where the material taking requirement information includes the information of the solder paste to be taken and the material taking weight;

[0069] S2. Match and select multiple storage location combinations that meet the preset conditions in the warehousing database according to the material taking requirement information;

[0070] S3. Screen out the optimal storage location combination from the storage location combinations.

[0071] Among them, S3 includes:

[0072] S31. Calculate the number of storage locations whose associated outbound times reach the first preset number in each combination of storage locations; calculate whether the average value of the outbound times associated with each storage location in each combination of storage locations reaches the second preset number;

[0073] S32. If the number of storage locations reaches the preset number, select the combination of storage locations with the largest number of storage locations as the optimal combination of storage locations;

[0074] S33. If the number of storage locations does not reach the preset number and the average value reaches the second preset number, select the combination of storage locations with the largest average value as the optimal combination of storage locations.

[0075] S34. If the number of storage locations does not reach the preset number and the average value does not reach the second preset number, calculate the remaining weight of each combination of storage locations according to the picking weight;

[0076] S35. Determine whether there is a combination of storage locations where the remaining weight falls within the common allowance range;

[0077] S36. If there is a combination of storage locations where the remaining weight falls within the common allowance range, select the combination of storage locations with the largest average value in the combination of storage locations where the remaining weight falls within the common allowance range as the optimal combination of storage locations.

[0078] For the specific limitations of the solder paste management method, reference can be made to the limitations of the solder paste management system in the above text, which will not be elaborated here. Each step of the above solder paste management method can be implemented in whole or in part by software, hardware, and their combination.

[0079] The various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, dedicated ASICs (Application Specific Integrated Circuits), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: implemented in one or more computer programs, which can be executed and / or interpreted on a programmable system including at least one programmable processor. The programmable processor can be a dedicated or general programmable processor, and can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0080] These computing procedures (also referred to as programs, software, software applications, or code) include machine instructions for a programmable processor and can implement these computing procedures using high-level procedural and / or object-oriented programming languages, and / or assembly / machine languages. As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, apparatus, and / or device (e.g., a magnetic disk, an optical disk, a memory, a programmable logic device (PLD)) for providing machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal for providing machine instructions and / or data to a programmable processor.

[0081] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, speech input, or tactile input).

[0082] The systems and techniques described herein can be implemented in a computing system including backend components (e.g., as a data server), or a computing system including middleware components (e.g., an application server), or a computing system including frontend components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system including any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected to each other by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0083] It should be understood that various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in this application can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this application can be achieved, and no limitation is made herein.

[0084] The above specific embodiments do not constitute a limitation on the protection scope of this application. Those skilled in the art should understand that various modifications, combinations, sub - combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims

1. A solder paste management system, characterized in that, Including: A material fetching information acquisition module, which is used to acquire material fetching requirement information, and the material fetching requirement information includes the solder paste information to be fetched and the fetching weight; An outbound calculation module, which is used to match and select multiple storage location combinations that meet preset conditions in the warehousing database; the warehousing database stores the refrigerated box codes and the storage locations in each refrigerated box; Among them, the storage location is used to place the solder paste bottle, and the storage location is correspondingly associated with the usage information of the solder paste bottle currently stored at the storage location, and the usage information includes the outbound times of the solder paste bottle, the solder paste information in the bottle and the solder paste weight in the bottle; Among them, the meeting the preset conditions means that the total weight of the solder paste in the bottles associated with the multiple storage locations in the storage location combination reaches the solder paste weight in the bottle and the number of storage locations is not redundant; The non-redundancy means that if any one of the storage locations in the storage location combination is deducted, the total weight of the solder paste in the bottle does not reach the fetching weight; A screening module, which is used to screen out the optimal storage location combination from the storage location combinations; The screening module includes: A first calculation unit, which is used to calculate the number of storage locations whose associated outbound times reach the first preset number in each storage location combination; calculate whether the average value of the outbound times associated with each storage location in each storage location combination reaches the second preset number; A first selection unit, which is used to select the storage location combination with the largest number of storage locations as the optimal storage location combination if the number of storage locations reaches the preset number; the preset number is generated according to the fetching weight and is proportional to the fetching weight; A second selection unit, which is used to select the storage location combination with the largest average value as the optimal storage location combination if the number of storage locations does not reach the preset number and the average value reaches the second preset number; A second calculation unit, which is used to calculate the remaining weight of each storage location combination according to the fetching weight if the number of storage locations does not reach the preset number and the average value does not reach the second preset number; A judgment unit, which is used to judge whether there is a storage location combination whose remaining weight falls within the common margin range. The remaining weight of the storage location combination is the difference between the total weight of the solder paste in the bottles of the storage location combination and the fetching weight; A third selection unit, which is used to select the storage location combination with the largest average value as the optimal storage location combination from the storage location combinations whose remaining weight falls within the common margin range if there is a storage location combination whose remaining weight falls within the common margin range; The common margin range is obtained through common margin calculation. The common margin is obtained by analyzing historical outbound data. The difference between the required fetching weight and the total weight of the actual outbound solder paste in the bottles in the historical outbound records is counted to obtain the margin of one outbound record. The margin value that appears with a proportion exceeding the preset proportion of 10% is used as the common margin. If the proportion exceeds the preset proportion of 10%, it is regarded as the common margin. Based on the common margin and the floating value, the common margin range is obtained.

2. The solder paste management system according to claim 1, wherein The screening module further includes: a fourth selection unit, which is used to select the storage location combination with the largest average value as the optimal storage location combination if not.

3. The solder paste management system according to claim 1, wherein The top of the solder paste bottle has a dynamic QR code. Weighing sensors are provided at each storage location in the refrigerator. A scanning and writing device is provided at the top inside the refrigerator, which is used to scan the dynamic QR code to identify the number of times the solder paste bottles are taken out of the warehouse and the solder paste information in the bottles. After determining the optimal storage location combination, the scanning and writing device writes a new number of times of taking out of the warehouse to the dynamic QR code.

4. The management method of the solder paste management system according to any one of claims 1-3, characterized in that, The solder paste management method includes: Obtaining material taking requirement information, where the material taking requirement information includes the solder paste information to be taken and the material taking weight; Matching and selecting multiple storage location combinations that meet the preset conditions in the warehouse database according to the material taking requirement information; Screening out the optimal storage location combination from the storage location combinations, including: Calculating the number of storage locations whose associated number of times of taking out of the warehouse reaches the first preset number in each storage location combination; calculating whether the average value of the associated number of times of taking out of the warehouse of each storage location in each storage location combination reaches the second preset number; If the number of storage locations reaches the preset number, select the storage location combination with the largest number of storage locations as the optimal storage location combination; If the number of storage locations does not reach the preset number and the average value reaches the second preset number, select the storage location combination with the largest average value as the optimal storage location combination; The solder paste management method further includes: if the number of storage locations does not reach the preset number and the average value does not reach the second preset number, calculate the remaining weight of each storage location combination according to the material taking weight; Judge whether there is a storage location combination whose remaining weight falls within the common margin range. The remaining weight of the storage location combination is the difference between the total weight of the solder paste in the bottles of the storage location combination and the material taking weight; If there is a storage location combination whose remaining weight falls within the common margin range, select the storage location combination with the largest average value in the storage location combinations whose remaining weight falls within the common margin range as the optimal storage location combination; The common margin range is obtained by calculating the common margin. The common margin is obtained by analyzing the historical warehouse-out data. The difference between the required material taking weight and the total weight of the actual warehouse-out solder paste in the bottles in the historical warehouse-out records is counted to obtain the margin of one warehouse-out record. The margin value that appears with a proportion exceeding the preset proportion of 10% is used as the common margin. If the proportion exceeds the preset proportion of 10%, it is regarded as the common margin. Based on the common margin and the floating value, the common margin range is obtained.

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