An electronic device

Abstract

An embodiment of the present application proposes an electronic device. The electronic device includes a first shell, a second shell, a reinforcement plate and a fan assembly. Specifically, the second shell is buckled with the first shell to form a storage space; the reinforcement plate is located in the storage space and is attached to the surface of the first shell facing the second shell; the fan assembly is located in the storage space and is arranged between the reinforcement plate and the second shell, and is used to circulate the gas inside the storage space and the external gas; the fan assembly includes a lower cover and an impeller; the lower cover is fixedly connected to the first shell, and together with the reinforcement plate, forms a storage space; the impeller is arranged in the storage space. The electronic device of the embodiment of the present application can reduce the overall thickness of the first shell by providing a reinforcement plate, thereby reducing the thickness of the electronic device. By providing the reinforcement plate, the rigidity of the first shell is enhanced, the normal operation of the fan assembly is ensured, and the miniaturization design of the electronic device is conducive.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device. Background Art

[0002] With the development of science and technology, people's requirements for the heat dissipation performance of electronic devices such as laptops are constantly increasing.

[0003] In the related art, the electronic device is usually cooled by a built-in fan assembly. For example: a laptop computer includes a first shell (D shell) and a second shell (C shell) that are interlocked; when the electronic device is in use, the first shell is located below the second shell, in contact with the desktop, etc., for supporting the electronic device; the second shell is used to carry the keyboard and touchpad of the laptop computer; the fan assembly is located between the first shell and the second shell; the fan assembly includes an upper cover, a lower cover and an impeller, wherein the lower cover is locked to the second shell, the lower cover and the upper cover are interlocked to form a receiving space, and the impeller is arranged in the receiving space; in the thickness direction of the electronic device, the impeller is spaced from the upper cover, and the upper cover is spaced from the first shell to ensure the normal operation of the fan assembly. In the thickness direction of the electronic device, there are two spacing distances, and the fan assembly occupies a large space, which is difficult to reduce, and is not conducive to the miniaturization design of the electronic device. Summary of the invention

[0004] The purpose of the embodiment of the present application is to provide an electronic device, which reduces the thickness of the electronic device, thereby facilitating the miniaturization design of the electronic device. The specific technical solution is as follows:

[0005] The embodiment of the present application proposes an electronic device, including a first shell, a second shell, a reinforcement plate and a fan assembly. Specifically, the second shell is buckled with the first shell to form a storage space; the reinforcement plate is located in the storage space and attached to the surface of the first shell facing the second shell; the fan assembly is located in the storage space and is arranged between the reinforcement plate and the second shell, and is used to circulate the gas inside the storage space and the external gas; the fan assembly includes a lower cover and an impeller; the lower cover is fixedly connected to the first shell and forms a storage space together with the reinforcement plate; the impeller is arranged in the storage space.

[0006] As can be seen from the above, the electronic device of the embodiment of the present application includes a first shell, a second shell, a reinforcement plate and a fan assembly, and the reinforcement plate and the fan assembly are arranged in the accommodating space formed by the first shell and the second shell; the fan assembly is arranged between the reinforcement plate and the second shell, and the fan assembly includes a lower cover and an impeller; the reinforcement plate is attached to the surface of the first shell facing the second shell, and the combination of the two increases the overall rigidity, thereby ensuring the good support of the first shell and the fan assembly at the corresponding position; in this way, when the overall thickness of the first shell is thinned, when the first shell and the fan assembly are squeezed by external force at the corresponding position, under the action of the reinforcement plate, the anti-extrusion ability of the first shell is enhanced, and it is not easy to deform, thereby ensuring that the fan assembly can work normally. The electronic device of the embodiment of the present application can reduce the overall thickness of the first shell by setting the reinforcement plate, thereby reducing the thickness of the electronic device, and by setting the reinforcement plate, the rigidity of the first shell is enhanced, ensuring the normal operation of the fan assembly, which is conducive to the miniaturization design of the electronic device. At the same time, compared with the fan assembly in the related art which includes both an upper cover and a lower cover, and there are two spacing distances between the impeller and the first shell, which occupies a larger space; the fan assembly of the embodiment of the present application only includes a lower cover and does not include an upper cover, which is beneficial to reducing the spacing distance between the impeller and the first shell, thereby facilitating the miniaturization design of the electronic device.

[0007] In some embodiments of the present application, a plurality of first air inlets are provided on the first housing;

[0008] The reinforcing plate is provided with a plurality of second air inlets, and the second air inlets are connected with the first air inlets;

[0009] The lower cover of the fan assembly is formed with a first air outlet to discharge the gas in the receiving space.

[0010] As can be seen from the above, the second air inlet is connected to the first air inlet, thereby ensuring that outside air can enter the receiving space formed by the fan assembly and the reinforcement plate, and the lower cover of the fan assembly is formed with a first air outlet, thereby ensuring that the gas in the receiving space can be discharged outwardly to ensure the circulation of the gas, thereby achieving the purpose of cooling. The opening method of the second air inlet is flexible, and can completely or partially match the first air inlet of the first shell, which is convenient for processing.

[0011] In some embodiments of the present application, the plurality of first air inlets and the plurality of second air inlets are arranged to completely overlap.

[0012] As can be seen from the above, such a setting is conducive to the flow of gas, thereby improving the heat dissipation efficiency, so that the fan assembly has a better cooling effect on the electronic equipment; and from the appearance point of view, the reinforcement plate and the first shell are integrated into one shape, and the reinforcement plate will not leak out, which is more beautiful.

[0013] In some embodiments of the present application, an orthographic projection of a formation area of ​​the plurality of second air inlets of the reinforcement plate on the first shell covers an orthographic projection of the impeller on the first shell.

[0014] As can be seen from the above, such a configuration is conducive to increasing the amount of gas entering the receiving space formed by the fan assembly and the reinforcement plate, thereby improving the heat dissipation efficiency.

[0015] In some embodiments of the present application, the minimum distance between two adjacent second air inlets is less than 1 mm;

[0016] The maximum opening size of the second air inlet has a numerical range of 0.5-0.8 mm.

[0017] From the above, it can be seen that in this way, both good heat dissipation performance and the aesthetics of the product can be guaranteed.

[0018] In some embodiments of the present application, the lower cover of the fan assembly includes:

[0019] An accommodating portion, used to form the accommodating space with the reinforcing plate;

[0020] The connecting portion is fixedly arranged on the outer side of the accommodating portion and is used for connecting with the first shell.

[0021] As can be seen from the above, the connection portion is arranged outside the accommodating portion, which does not affect the connection between the accommodating portion and the reinforcing plate, and is conducive to ensuring the sealing of the connection between the accommodating portion and the reinforcing plate, thereby ensuring the working stability of the fan assembly.

[0022] In some embodiments of the present application, the receiving portion of the lower cover includes:

[0023] A bottom plate, located between the reinforcing plate and the second shell, and spaced apart from the two;

[0024] The side plate is arranged around the bottom plate, extends from the bottom plate to the reinforcing plate, and is connected to the reinforcing plate; the side plate has a notch for forming the first air outlet.

[0025] As can be seen from the above, with such an arrangement, the reinforcing plate is directly connected to the side plate, and the reinforcing plate is equivalent to the upper cover of the fan assembly. There is no need to set up an additional upper cover, which is conducive to reducing the thickness of the electronic device.

[0026] In some embodiments of the present application, a third air inlet is formed on the bottom plate.

[0027] As can be seen from the above, the third air inlet and the second air inlet are arranged relatively to each other in the thickness direction of the electronic device, and the air intake directions of the third air inlet and the second air inlet are different, which is conducive to increasing the air intake volume, thereby achieving a better cooling effect.

[0028] In some embodiments of the present application, a support column is provided on the lower cover, and the support column extends from the bottom plate to the reinforcement plate, is spaced apart from the reinforcement plate, and is located between the impeller and the side plate.

[0029] It can be seen from the above that when the first shell is squeezed by the outside, the first shell and the reinforcement plate may be deformed and offset against the support column. The support column plays a supporting role, thereby leaving working space for the impeller, ensuring the normal rotation of the impeller, preventing abnormal noise, and thus ensuring the normal operation of the electronic equipment.

[0030] In some embodiments of the present application, the orthographic projection of the reinforcing plate on the first shell covers the orthographic projection of the accommodating portion of the lower cover on the first shell.

[0031] It can be seen from the above that the reinforcing plate covers the position where the fan assembly is set in the first shell, which can effectively prevent the fan assembly from being squeezed due to deformation of the first shell, thereby causing abnormal noise from the fan assembly.

[0032] In some embodiments of the present application, the thickness of the first shell is in the range of 0.4-0.8 mm;

[0033] The thickness of the reinforcing plate is in the range of 0.2-0.4 mm.

[0034] It can be seen from the above that within the above numerical range, the thickness of the electronic device can be effectively reduced while ensuring good support for the fan assembly.

[0035] In some embodiments of the present application, in the thickness direction of the electronic device, the impeller and the reinforcement plate are gap-fitted.

[0036] As can be seen from the above, such an arrangement can reduce the probability of the reinforcement plate deforming and squeezing the impeller, thereby causing abnormal noise.

[0037] In some embodiments of the present application, in the thickness direction of the electronic device, the distance between the impeller and the reinforcement plate has a numerical range of 0.6-1.2 mm.

[0038] It can be seen from the above that within this numerical range, the occurrence of abnormal noise can be reduced and the thickness of the electronic device can be reduced.

[0039] In some embodiments of the present application, a seal is provided between the reinforcing plate and the side plate.

[0040] As can be seen from the above, the seal can ensure the sealing of the connection between the lower cover and the reinforcement plate of the fan assembly, thereby ensuring the normal operation of the fan assembly and helping to improve the working stability of the electronic equipment.

[0041] In some embodiments of the present application, the reinforcement plate is made of stainless steel, titanium alloy or aluminum alloy.

[0042] It can be seen from the above that the above materials all have good anti-extrusion ability. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other embodiments can be obtained based on these drawings without paying any creative work.

[0044] Figure 1 This is a schematic diagram of the structure of an electronic device according to the first embodiment of the present application;

[0045] Figure 2 A schematic structural diagram of a base of an electronic device according to a first embodiment of the present application from a first viewing angle;

[0046] Figure 3 A schematic structural diagram of a second viewing angle of a base of an electronic device according to a first embodiment of the present application;

[0047] Figure 4 This is a schematic diagram of the exploded structure of a base of an electronic device according to a first embodiment of the present application;

[0048] Figure 5 for Figure 2 A local enlarged schematic diagram of P;

[0049] Figure 6 A top view of a base of an electronic device according to a first embodiment of the present application (without the second housing);

[0050] Figure 7 for Figure 6 A local enlarged schematic diagram of Q;

[0051] Figure 8 A diagram showing the connection relationship between the fan assembly and the reinforcement plate from a first perspective in the first embodiment of the present application;

[0052] Fig. 9 A connection diagram of the fan assembly and the reinforcement plate in the first embodiment of the present application from a second viewing angle;

[0053] Fig.10 for Fig. 9 Schematic diagram of the decomposition structure;

[0054] Fig.11 for Figure 5 AA section view;

[0055] Fig.12 for Figure 5 BB cross-sectional view;

[0056] Fig.13 This is a schematic diagram of the position of the sealing member in the first embodiment of the present application;

[0057] Fig.14 This is a heat dissipation principle diagram of an electronic device according to the first embodiment of the present application;

[0058] Fig.15 This is the impeller force-displacement curve when no reinforcement plate is provided;

[0059] Fig.16 This is a screenshot of the display interface of the impeller contact stress cloud diagram when no reinforcement plate is set;

[0060] Fig.17 This is the impeller force-displacement curve when the reinforcement plate is set;

[0061] Fig.18 This is a screenshot of the display interface of the impeller contact stress cloud diagram when the reinforcement plate is set;

[0062] Fig.19 This is a schematic structural diagram of a base of an electronic device according to a second embodiment of the present application.

[0063] Description of reference numerals:

[0064] Base 10; screen component 20; display screen 21; screen shell 22; hinge assembly 30; first shell 100; metal part 101; non-metal part 102; first air inlet 110; second air outlet 120; second shell 200; sound outlet 210; touch pad position 220; keyboard position 230; USB interface 240; reinforcement plate 300; second air inlet 310; fan assembly 400; lower cover 410; accommodating part 411; bottom plate 4111; third air inlet 41111; side plate 4112; first air outlet 4113; connecting part 412; connecting hole 4121; support column 413; impeller 420; stator 430; rotor 440; FPC 450; seal 500; keyboard 600; touch pad 700; radiator 810; heat sink 820; heat pipe 830; screw 910. DETAILED DESCRIPTION

[0065] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0066] In order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second" and the like are used to distinguish the same items or similar items with substantially the same functions and effects. For example, the first swing arm and the second swing arm are used to distinguish different swing arms, and the order thereof is not limited. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and position, and the words "first", "second" and the like do not necessarily limit the difference.

[0067] It should be noted that, in this application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplarily" or "for example" in this application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0068] An embodiment of the present application provides an electronic device, which may include but is not limited to a laptop computer, a tablet computer, a mobile phone, a drone, a virtual reality (VR) device, a personal computer (PC), an ultra-mobile personal computer (UMPC), a handheld computer, a smart wearable device, a point of sales (POS), and other electronic devices with a fan assembly inside.

[0069] The structure of the electronic device in the embodiment of the present application is further described below by taking a laptop computer as an example.

[0070] like Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of an electronic device of the first embodiment of the present application, in which the electronic device is in an open state. The electronic device, such as a laptop computer, may include a base 10, a screen component 20, and a hinge assembly 30. The hinge assembly 30 is located at the connection between the screen component 20 and the base 10, so that the screen component 20 is rotatably connected to the base 10 through the hinge assembly 30 to change the shape of the laptop computer, thereby rotating the screen component 20 to a certain angle relative to the base 10, so that the electronic device is in an open state, or rotating the screen component 20 relative to the base 10 to overlap on the base 10, so that the electronic device is in a closed state.

[0071] like Figure 1As shown, the screen component 20 includes a display screen 21 and a screen housing 22, the display screen 21 includes a display surface and a non-display surface that are arranged oppositely, the screen housing 22 has an assembly cavity (not shown in the figure) that is adapted to the structure of the display screen 21, the display screen 21 is assembled in the assembly cavity, and together with the screen housing 22, the screen component 20 is formed. Among them, the screen housing 22 includes an A shell and a B shell, the A shell is located on the side away from the display screen 21, and the screen component 20 is arranged in the B shell.

[0072] like Figure 1 As shown, the hinge assembly 30 can be located between the base 10 and the screen housing 22, and the base 10 can be rotatably connected to the screen housing 22 through the hinge assembly 30. Under the action of external force, the shape of the electronic device, such as a laptop computer, can be changed by rotating the screen member 20, so that the electronic device is in an open state or a closed state.

[0073] like Figure 1 and Figure 2 As shown, Figure 2 This is a schematic diagram of the structure of the base 10 of the electronic device of the first embodiment of the present application from the first perspective. The electronic device, such as a laptop computer, may also include a keyboard 600, a touchpad 700 and a circuit board (not shown in the figure). The base 10 includes a first shell 100 and a second shell 200. The first shell 100 and the second shell 200 are interlocked to form a storage space, and the circuit board can be arranged in the storage space. The keyboard 600 and the touchpad 700 are two different input modules in an electronic device such as a laptop computer. They can be embedded on the side of the base 10 facing the display screen 21, and are electrically connected to the circuit board to issue commands to the electronic device or input data. The second shell 200 can be provided with a keyboard position 230 and a touchpad position 220, which are used to set the keyboard 600 and the touchpad 700 respectively, which is a C shell of an electronic device such as a laptop computer. The first shell 100 is arranged relative to the keyboard 600 and the touchpad 700, which is a D shell of an electronic device such as a laptop computer.

[0074] A large number of electronic components (not shown in the figure) are usually arranged on the circuit board, such as the central processing unit (CPU). The CPU is the computing core and control core of the electronic device, and is mainly used for data processing and calculation in the electronic device. At the same time, the CPU is the main heating element in the electronic device, and it will generate a lot of heat during operation, which may even affect the use of the electronic device in severe cases.

[0075] With the development of science and technology, people's requirements for the heat dissipation performance of electronic devices such as laptops are constantly increasing. In the related art, the electronic device is usually cooled by a built-in fan assembly. The fan assembly is located between the first shell and the second shell; the fan assembly includes an upper cover, a lower cover and an impeller, wherein the lower cover is locked to the second shell, the lower cover and the upper cover are buckled together to form a receiving space, and the impeller is arranged in the receiving space; in the thickness direction of the electronic device, the impeller is spaced from the upper cover, and the upper cover is spaced from the first shell to ensure the normal operation of the fan assembly. In the thickness direction of the electronic device, there are two spacing distances, and the fan assembly occupies a large space, which is difficult to reduce, and is not conducive to the miniaturization design of the electronic device.

[0076] In order to solve the above technical problems, an embodiment of the present application proposes an electronic device.

[0077] like Figures 2 to 4 As shown, Figure 3 This is a schematic structural diagram of the base 10 of the electronic device according to the first embodiment of the present application from a second viewing angle. Figure 4 This is a schematic diagram of the exploded structure of the base 10 of the electronic device of the first embodiment of the present application. The electronic device of the embodiment of the present application includes a first shell 100, a second shell 200, a reinforcement plate 300 and a fan assembly 400. The second shell 200 is buckled with the first shell 100 to form a receiving space; the reinforcement plate 300 is located in the receiving space and attached to the surface of the first shell 100 facing the second shell 200; the fan assembly 400 is located in the receiving space and is arranged between the reinforcement plate 300 and the second shell 200, and is used to circulate the gas inside the receiving space and the external gas; the fan assembly 400 includes a lower cover 410 and an impeller 420; the lower cover 410 is fixedly connected to the first shell 100, and forms a receiving space together with the reinforcement plate 300; the impeller 420 is arranged in the receiving space.

[0078] The electronic device of the embodiment of the present application includes a first shell 100, a second shell 200, a reinforcement plate 300 and a fan assembly 400. The reinforcement plate 300 and the fan assembly 400 are arranged in a accommodating space formed by the first shell 100 and the second shell 200; the fan assembly 400 is arranged between the reinforcement plate 300 and the second shell 200, and the fan assembly 400 includes a lower cover 410 and an impeller 420; the reinforcement plate 300 is attached to the surface of the first shell 100 facing the second shell 200, and the combination of the two increases the overall rigidity, thereby ensuring good support for the corresponding parts of the first shell 100 and the fan assembly 400; in this way, when the overall thickness of the first shell 100 is thinned, when the corresponding parts of the first shell 100 and the fan assembly 400 are squeezed by external force, under the action of the reinforcement plate 300, the anti-extrusion ability of the first shell 100 is enhanced, and it is not easy to deform, thereby ensuring that the fan assembly 400 can work normally. The electronic device of the embodiment of the present application can reduce the overall thickness of the first housing 100 by setting the reinforcement plate 300, thereby reducing the thickness of the electronic device. By setting the reinforcement plate 300, the rigidity of the first housing 100 is enhanced, the normal operation of the fan assembly 400 is ensured, and the miniaturization design of the electronic device is facilitated. At the same time, compared with the fan assembly in the related art that includes both an upper cover and a lower cover, and there are two spacing distances between the impeller and the first housing, which occupies a large space; the fan assembly 400 of the embodiment of the present application only includes the lower cover 410, and does not include the upper cover, which is conducive to reducing the spacing distance between the impeller 420 and the first housing 100, thereby facilitating the miniaturization design of the electronic device.

[0079] It is understandable that when the fan assembly 400 is installed in the accommodation space formed by the first shell 100 and the second shell 200, it can be installed upside down, and the lower cover 410 is locked to the first shell 100 so that the lower cover 410 is located between the impeller 420 and the second shell 200.

[0080] Optionally, the reinforcing plate 300 may be fixed to the first shell 100 by glue dispensing.

[0081] In order to achieve the heat dissipation of the heating components on the circuit board by the fan assembly 400, Figure 3 As shown, the base 10 is provided with a first air inlet 110 and a second air outlet 120. A plurality of first air inlets 110 may be evenly arranged on the bottom wall of the first housing 100, and a plurality of second air outlets 120 may be evenly arranged on the side wall of the first housing 100. Optionally, the first air inlet 110 and the second air outlet 120 include but are not limited to circular through holes, strip through holes, polygonal through holes or through holes of other shapes.

[0082] like Figure 4As shown, the bottom shell of the base 10 may also be provided with interfaces such as a sound hole 210 and a USB interface 240. In the length direction of the electronic device, the sound hole 210 may be formed on both sides of the keyboard position 230 of the second shell 200. Such a setting is more conducive to the sound being clearly transmitted to the human ear; the USB interface 240 may be formed on the side wall of the first shell 100, and the number may be multiple.

[0083] In some embodiments of the present application, Figures 5 to 7 As shown, Figure 5 for Figure 2 A local enlarged schematic diagram of P, Figure 6 This is a top view of the base 10 of the electronic device of the first embodiment of the present application (without the second housing 200). Figure 7 for Figure 6 A partial enlarged schematic diagram of the Q portion of FIG. 1 shows that a plurality of first air inlets 110 are provided on the first housing 100; a plurality of second air inlets 310 are provided on the reinforcing plate 300, and the second air inlets 310 are connected to the first air inlets 110; Figure 8 As shown, Figure 8 This is a connection diagram of the fan assembly 400 and the reinforcement plate 300 in the first embodiment of the present application from a first perspective. The lower cover 410 of the fan assembly 400 is formed with a first air outlet 4113 so that the gas in the receiving space can be discharged therefrom.

[0084] The second air inlet 310 is connected to the first air inlet 110, thereby ensuring that outside air can enter the receiving space formed by the fan assembly 400 and the reinforcing plate 300. The lower cover 410 of the fan assembly 400 is formed with a first air outlet 4113, thereby ensuring that the gas in the receiving space can be discharged outwardly to ensure the circulation of the gas, thereby achieving the purpose of cooling. The opening method of the second air inlet 310 is flexible, and can completely match or partially match the first air inlet 110 of the first shell 100, which is convenient for processing.

[0085] In some embodiments of the present application, multiple first air inlets 110 and multiple second air inlets 310 are completely overlapped. Completely overlapped means that the first air inlets 110 and the second air inlets 310 have the same shape, are equal in size, and are arranged in the same position. Such an arrangement is conducive to the flow of gas, thereby improving the heat dissipation efficiency, so that the fan assembly 400 has a better cooling effect on the electronic device; and from the appearance point of view, the reinforcement plate 300 and the first shell 100 present an integrated shape, and the reinforcement plate 300 will not be leaked, which is more beautiful.

[0086] Return to reference Figure 6In the length direction of the electronic device, the formation range of the first air inlet 110 can be larger than the size of the reinforcement plate 300; in the width direction of the electronic device, the formation range of the first air inlet 110 can be smaller than the size of the reinforcement plate 300; in this way, while ensuring the air intake of the fan assembly 400, partial structures of the reinforcement plate 300 and the fan assembly 400 can be shielded, thereby enhancing the aesthetics of the electronic device.

[0087] In some embodiments of the present application, Figure 7 As shown, the orthographic projection of the reinforcing plate 300 on the first housing 100 covers the orthographic projection of the accommodating portion 411 of the lower cover 410 on the first housing 100, and the accommodating portion 411 is used to accommodate the impeller 420. In this way, the reinforcing plate 300 covers the position where the fan assembly 400 is set in the first housing 100, which can effectively prevent the fan assembly 400 from being squeezed due to the deformation of the first housing 100, thereby causing the fan assembly 400 to make abnormal noises.

[0088] Furthermore, in order to achieve a better reinforcement effect and reduce the occupied space, at the connection between the lower cover 410 and the reinforcement plate 300, the outer edge of the reinforcement plate 300 extends outward by 0.5-1 mm compared to the connection.

[0089] In some embodiments of the present application, Figures 7 to 9 As shown, Fig. 9 This is a connection diagram of the fan assembly 400 and the reinforcing plate 300 in the first embodiment of the present application from a second viewing angle, where the orthographic projection of the formation area of ​​the plurality of second air inlets 310 of the reinforcing plate 300 on the first housing 100 covers the orthographic projection of the impeller 420 on the first housing 100. This arrangement is conducive to increasing the amount of gas entering the receiving space formed by the fan assembly 400 and the reinforcing plate 300, thereby improving the heat dissipation efficiency.

[0090] In some embodiments of the present application, the minimum distance between two adjacent second air inlets 310 is less than 1 mm, and the maximum opening size of the second air inlet 310 is in the range of 0.5-0.8 mm. In this way, both good heat dissipation performance and product aesthetics can be ensured.

[0091] It is understandable that if Fig. 9 As shown, the shape of the second air inlet 310 can be circular, and the maximum opening size is the diameter of the circle. In some other embodiments of the present application, the second air inlet 310 can also be rectangular, and the maximum opening size is the length of the diagonal of the rectangle. Of course, the shape of the second air inlet 310 can also be elliptical, hexagonal or other shapes, which is not limited in the present application.

[0092] The configuration of the first air inlet 110 may be the same as the configuration of the second air inlet 310 , and will not be described in detail herein.

[0093] Optionally, the shape of the reinforcing plate 300 may be substantially consistent with the orthographic projection shape of the receiving portion 411 on the first housing 100; in order to facilitate processing, the shape of the reinforcing plate 300 may also be designed as follows: Fig. 9 and Fig.10 The shape shown is a rectangle with an arc at one end.

[0094] In some embodiments of the present application, Fig.10 and Fig.11 As shown, Fig.10 for Fig. 9 Schematic diagram of the decomposition structure, Fig.11 for Figure 5 In the AA cross-sectional view, the lower cover 410 of the fan assembly 400 includes a receiving portion 411 and a connecting portion 412. The receiving portion 411 is used to form a receiving space with the reinforcing plate 300; the connecting portion 412 is fixedly arranged on the outside of the receiving portion 411 and is used to connect with the first housing 100. The connecting portion 412 is arranged on the outside of the receiving portion 411, which does not affect the connection between the receiving portion 411 and the reinforcing plate 300, and is conducive to ensuring the sealing of the connection between the receiving portion 411 and the reinforcing plate 300, thereby ensuring the working stability of the fan assembly 400.

[0095] Alternatively, if Fig.10 and Fig.11 As shown, the number of the connecting parts 412 can be three, and the three connecting parts 412 are arranged at intervals. A connecting hole 4121 can be opened on each connecting part 412, and a screw 910 is passed through the connecting hole 4121; the first shell 100 may include a metal part 101 and a non-metal part 102, and the non-metal part 102 is located between the metal part 101 and the second shell 200; the non-metal part 102 can be plastic to facilitate its connection with other components. For example, the connecting part 412 can be fixedly connected to the non-metal part 102 of the first shell 100.

[0096] In some embodiments of the present application, Figures 10 to 12 As shown, Fig.12 for Figure 5 In the BB cross-sectional view, the receiving portion 411 of the lower cover 410 includes a bottom plate 4111 and a side plate 4112, wherein the bottom plate 4111 is located between the reinforcing plate 300 and the second shell 200 and is spaced apart from the two; the side plate 4112 is arranged around the bottom plate 4111 and extends from the bottom plate 4111 to the reinforcing plate 300 and is connected to the reinforcing plate 300; return to reference Figure 8 The side plate 4112 has a notch for forming a first air outlet 4113. In this configuration, the reinforcing plate 300 is directly connected to the side plate 4112, and the reinforcing plate 300 is equivalent to the upper cover of the fan assembly 400, and no additional upper cover is required, which is conducive to reducing the thickness of the electronic device.

[0097] Furthermore, in order to achieve a better reinforcement effect and reduce the occupied space, at the connection between the side plate 4112 and the reinforcement plate 300 , the outer edge of the reinforcement plate 300 extends outward by 0.5-1 mm compared to the side plate 4112 .

[0098] In some embodiments of the present application, continue to refer to Figure 8 A third air inlet 41111 is formed on the bottom plate 4111. Figure 8 The gas flow direction is shown in the figure, the gas enters the receiving space from the second air inlet 310 and the third air inlet 41111, and is discharged from the receiving space from the first air outlet 4113. The third air inlet 41111 and the second air inlet 310 are arranged opposite to each other in the thickness direction of the electronic device, and the third air inlet 41111 and the second air inlet 310 have different air intake directions, which is conducive to increasing the air intake volume, thereby achieving a better cooling effect.

[0099] In some embodiments of the present application, Fig.12 As shown, a support column 413 is provided on the lower cover 410, and the support column 413 extends from the bottom plate 4111 to the reinforcing plate 300, and is spaced apart from the reinforcing plate 300, and is located between the impeller 420 and the side plate 4112. In this way, when the first housing 100 is squeezed by the outside, the first housing 100 and the reinforcing plate 300 may be deformed and abut against the support column 413, and the support column 413 plays a supporting role, thereby leaving a working space for the impeller 420, ensuring the normal rotation of the impeller 420, preventing abnormal noise, and thus ensuring the normal operation of the electronic device.

[0100] like Fig.10 and Fig.12 As shown, the fan assembly 400 also includes a stator 430 and a rotor 440. The stator 430 is fixedly connected to the lower cover 410 of the fan assembly 400, and the rotor 440 is connected to the center of the impeller 420. The FPC (Flexible Printed Circuit Board) 450 is respectively connected to the fan assembly 400 and the main board (not shown in the figure), and is used to drive the impeller 420, so that the impeller 420 rotates with the cooperation of the stator 430 and the rotor 440, thereby dissipating heat for the electronic equipment.

[0101] In some embodiments of the present application, the thickness of the first housing 100 is in the range of 0.4-0.8 mm, and the thickness of the reinforcing plate 300 is in the range of 0.2-0.4 mm. Within the above numerical range, the thickness of the electronic device can be effectively reduced while ensuring good support for the fan assembly 400.

[0102] In some embodiments of the present application, Fig.12As shown, in the thickness direction of the electronic device, the distance a between the impeller 420 and the bottom plate 4111 of the lower cover 410 has a value ranging from 0.6 to 1 mm.

[0103] In some embodiments of the present application, Fig.12 As shown, in the thickness direction of the electronic device, there is a clearance fit between the impeller 420 and the reinforcing plate 300. This arrangement can reduce the probability of the reinforcing plate 300 deforming and squeezing the impeller 420, thereby causing abnormal noise.

[0104] In some embodiments of the present application, Fig.12 As shown, in the thickness direction of the electronic device, the distance b between the impeller 420 and the reinforcing plate 300 has a value range of 0.6-1.2 mm. Within this value range, the occurrence of abnormal noise can be reduced and the thickness of the electronic device can be reduced.

[0105] The electronic device of the embodiment of the present application effectively utilizes the gap between the impeller 420 and the first housing 100, increases the space of the fan assembly 400, and improves the heat dissipation efficiency.

[0106] In some embodiments of the present application, Fig.12 As shown, a seal 500 is provided between the reinforcing plate 300 and the side plate 4112. The seal 500 can ensure the sealing of the connection between the lower cover 410 of the fan assembly 400 and the reinforcing plate 300, thereby ensuring the normal operation of the fan assembly 400 and improving the working stability of the electronic device. Optionally, the seal 500 can be adhesive or foam.

[0107] like Fig.13 As shown, Fig.13 This is a schematic diagram of the position of the seal 500 in the first embodiment of the present application. Specifically, the seal 500 can completely cover the surface of the side plate 4112 away from the bottom plate 4111 to achieve a better sealing effect.

[0108] In some embodiments of the present application, the reinforcing plate 300 is made of stainless steel, titanium alloy, or aluminum alloy, all of which have good anti-extrusion capabilities.

[0109] like Fig.14 As shown, Fig.14 This is a heat dissipation principle diagram of an electronic device of the first embodiment of the present application. The electronic device, such as a laptop computer, may also include a heat dissipation plate 820, a heat pipe 830, and a radiator 810. The heat dissipation plate 820, the heat pipe 830, and the radiator 810 are all located in the accommodation space of the base 10. The radiator 810 may be arranged at the first air outlet ( Fig.14The heat sink 820 can be covered on a heating element (not shown in the figure), such as a CPU, so as to absorb the heat from the CPU through heat conduction and dissipate the heat from the CPU. One end of the heat pipe 830 is connected to the heat sink 820, and the other end is inserted into the radiator 810, so as to transfer the heat from the CPU absorbed by the heat sink 820 to the radiator 810 through the heat pipe 830. The air volume generated by the fan assembly 400 during operation takes away the heat from the radiator 810, thereby achieving heat dissipation of the heating element on the circuit board and improving the heat dissipation effect of the electronic device.

[0110] Optionally, the radiator 810 may include but is not limited to a fin radiator, the heat sink 820 may include but is not limited to a heat sink or a heat block made of metal, and the heat pipe 830 may include but is not limited to a copper tube, an aluminum tube or other tubular structures with good thermal conductivity.

[0111] In order to further illustrate that the reinforcing plate 300 in the embodiment of the present application can improve the anti-extrusion ability of the electronic device, simulations are performed for the cases where the reinforcing plate 300 is provided and the cases where the reinforcing plate 300 is not provided, respectively, and an extrusion force is applied to the center position of the impeller 420, and the simulation results obtained are as follows:

[0112] Fig.15 is a force-displacement curve diagram of the impeller 420 when the reinforcing plate 300 is not provided, Fig.16 This is a screenshot of the display interface of the contact stress cloud diagram of the impeller 420 when the reinforcement plate 300 is not provided. Fig.15 As shown, the vertical axis represents the magnitude of the extrusion force (Force), and the horizontal axis represents the displacement distance (Displacement), that is, the deformation amount caused by the extrusion force. When the extrusion force is 50N, the displacement distance is 1.38mm. At this time, the contact area between the impeller 420 and the first housing 100 is large, as shown in FIG. Fig.16 As shown, the larger the contact area, the more obvious the light-colored spot at the center of the impeller 420 is, and at this time the fan assembly 400 will produce abnormal noise.

[0113] Fig.17 The force-displacement curve of the impeller 420 when the reinforcing plate 300 is set is shown in FIG. 1 . When the extrusion pressure is 50 N, the displacement is 0.98 mm. It can be seen that the deformation after the reinforcing plate 300 is set is much smaller than the deformation when the reinforcing plate 300 is not set. Fig.18 This is a screenshot of the display interface of the contact stress cloud diagram of the impeller 420 when the reinforcing plate 300 is provided. At this time, the contact area between the impeller 420 and the reinforcing plate 300 is much smaller than when the reinforcing plate 300 is not provided.

[0114] It can be seen from this that the anti-extrusion capability of the electronic device in the embodiment of the present application is greatly improved, and the anti-extrusion capability of the fan assembly 400 is improved by (1.38-0.98) / 1.38=28.99%.

[0115] It is to be understood that the structure illustrated in the embodiments of the present application does not constitute a specific limitation on electronic devices such as laptop computers. In other embodiments of the present application, the electronic device may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0116] like Fig.19 As shown, Fig.19 This is a structural diagram of a base 10 of an electronic device according to a second embodiment of the present application. In the second embodiment of the present application, there may be two fan assemblies 400, and the two fan assemblies 400 are arranged at intervals to achieve a better heat dissipation effect.

[0117] It should be noted that the structure of the electronic device may vary with the type of the electronic device. For example, when the electronic device is a tablet computer, the display screen 21 may be embedded in the surface of the base 10 , and the circuit board is also disposed in the accommodation space of the base 10 .

[0118] It should be noted that in the examples and description of this patent, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one" do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0119] Although the present application has been illustrated and described with reference to certain preferred embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present application.

Claims

1. An electronic device, characterized in that: include: A first housing, wherein the first housing is used to support the electronic device; A second shell, buckled with the first shell to form a receiving space; A reinforcing plate, located in the accommodation space and attached to a surface of the first shell facing the second shell; A fan assembly is located in the accommodating space and is arranged between the reinforcement plate and the second shell, and is used to circulate the gas inside the accommodating space and the external gas; the fan assembly includes a lower cover and an impeller; the lower cover is fixedly connected to the first shell and forms a accommodating space together with the reinforcement plate; the impeller is arranged in the accommodating space; the impeller is connected to the lower cover and has a clearance fit with the reinforcement plate in the thickness direction of the electronic device.

2. The electronic device according to claim 1, characterized in that: The first shell is provided with a plurality of first air inlets; The reinforcing plate is provided with a plurality of second air inlets, and the second air inlets are connected with the first air inlets; The lower cover of the fan assembly is formed with a first air outlet to discharge the gas in the receiving space.

3. The electronic device according to claim 2, characterized in that: The multiple first air inlets and the multiple second air inlets are arranged to completely overlap.

4. The electronic device according to claim 2, characterized in that: The orthographic projection of the area where the plurality of second air inlets of the reinforcing plate are formed on the first shell covers the orthographic projection of the impeller on the first shell.

5. The electronic device according to claim 2, characterized in that: The minimum distance between two adjacent second air inlets is less than 1 mm; The maximum opening size of the second air inlet has a numerical range of 0.5-0.8 mm.

6. The electronic device according to any one of claims 2 to 5, characterized in that: The lower cover of the fan assembly comprises: An accommodating portion, used to form the accommodating space with the reinforcing plate; The connecting portion is fixedly arranged on the outer side of the accommodating portion and is used for connecting with the first shell.

7. The electronic device according to claim 6, characterized in that: The receiving portion of the lower cover comprises: A bottom plate, located between the reinforcing plate and the second shell, and spaced apart from the two; The side plate is arranged around the bottom plate, extends from the bottom plate to the reinforcing plate, and is connected to the reinforcing plate; the side plate has a notch for forming the first air outlet.

8. The electronic device according to claim 7, characterized in that: A third air inlet is formed on the bottom plate.

9. The electronic device according to claim 7, characterized in that: The lower cover is provided with a support column, which extends from the bottom plate to the reinforcement plate, is spaced apart from the reinforcement plate, and is located between the impeller and the side plate.

10. The electronic device according to claim 6, characterized in that: The orthographic projection of the reinforcing plate on the first shell covers the orthographic projection of the accommodating portion of the lower cover on the first shell.

11. The electronic device according to claim 1, characterized in that: The thickness of the first shell is in the range of 0.4-0.8 mm; The thickness of the reinforcing plate is in the range of 0.2-0.4 mm.

12. The electronic device according to claim 1, characterized in that: In the thickness direction of the electronic device, the distance between the impeller and the reinforcement plate has a value ranging from 0.6 to 1.2 mm.

13. The electronic device according to claim 7, characterized in that: A sealing member is provided between the reinforcing plate and the side plate.

14. The electronic device according to claim 1, characterized in that: The reinforcement plate is made of stainless steel, titanium alloy or aluminum alloy.

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