Chip assembly based automation process

Abstract

The present invention provides an automated process based on chip assembly, comprising the following steps: S1, vertically placing the chip through the card slot of the chip placement mechanism, and making the chip pins located in the card slot, and the chip shell is in an open state; S2, clamping the chip shell, and rotating 180° vertically after the chip is separated from the chip placement mechanism; S3, clamping the chip pins, and releasing the clamping of the chip shell; S4, moving the shell to the bottom of the chip shell; S5, lowering the height of the chip pins, and making the chip shell snap into the corresponding position in the shell. The automated process based on chip assembly provided by the present invention can improve production efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of chip assembly, and relates to an automated process based on chip assembly. Background Art

[0002] A chip is also called an integrated circuit, abbreviated as IC, or microcircuit, microchip, wafer / chip. In electronics, it is a way to miniaturize circuits (mainly semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of a semiconductor wafer.

[0003] At present, chips are used in many fields, such as many sensors in cars, such as car seat sensors, etc. Chips are not used alone, but in combination with a shell; secondly, chips usually include a chip shell and chip pins, and the chip shell and the shell are assembled into a whole when used; currently, manual assembly is mostly used, resulting in low production efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide an automated process based on chip assembly, aiming to solve the problem of low production efficiency.

[0005] In order to solve the above technical problems, the present invention provides an automated process based on chip assembly, comprising the following steps:

[0006] S1, vertically placing the chip through the card slot of the chip placement mechanism, with the chip pins located in the card slot and the chip housing in an open state;

[0007] S2, clamp the chip housing and rotate it 180° after the chip is separated from the chip placement mechanism;

[0008] S3, clamp the chip pins and release the clamping of the chip housing;

[0009] S4, the shell moves to the bottom of the chip housing;

[0010] S5, lowering the height of the chip pins and allowing the chip housing to be inserted into a corresponding position in the housing.

[0011] The present invention is further configured such that after the chip housing is clamped in S2, the height of the chip placement mechanism is lowered, so that the chip is separated from the chip placement mechanism, thereby facilitating the movement of the clamped chip.

[0012] The present invention is further configured such that the outer side of the card slot is adjacent to the chip vibration plate track, the chip vibration plate track is used to transport the chip into the card slot, and the chip placement mechanism has a fixed baffle on the side away from the chip vibration plate track, the baffle is used to prevent the chip in the card slot from being separated from the chip placement mechanism;

[0013] Before clamping the chip in S2, the chip placement mechanism moves in a direction perpendicular to the chip vibration plate track, and then moves vertically downward. During the movement of the chip placement mechanism, the end of the chip vibration plate track is blocked to prevent the subsequent chip on the chip vibration plate track from falling off;

[0014] At the same time, during the horizontal movement of the chip placement mechanism, both sides of the chip pins in the card slot are limited, and when the chip placement mechanism moves horizontally to the end, the chip housing is clamped.

[0015] The present invention is further configured that S2 includes:

[0016] S2-1, after clamping the chip housing, perform horizontal movement to separate the chip from the chip placement mechanism;

[0017] S2-2, insert the pins of the chip into the corresponding openings;

[0018] S2-3, press down the top of the chip housing to improve the consistency of chip position;

[0019] S2-4, the rotary clamping cylinder descends to clamp the chip housing;

[0020] S2-5, the rotary clamping cylinder rises and rotates 180°.

[0021] The present invention is further configured such that after S2-3, the following steps are further performed:

[0022] S2-3-1, the structure for pressing down the chip and the mechanism for clamping the chip housing are removed;

[0023] S2-3-2, after the chip shell is clamped, it is moved to the pin bending station to bend the pins to be bent;

[0024] S2-3-3, transfer the chip with bent pins to the next station, cut the pins to obtain the required length of pins;

[0025] S2-3-4, then transfer the chip with the cut pins to the pneumatic gripper, and the pneumatic gripper clamps the pins;

[0026] The chip clamped by the rotating clamping cylinder in S2-4 is the fixed chip in S2-3-4.

[0027] The present invention is further configured such that, in the S2-3-2 and the S2-3-3, the chip pins close to the chip housing are clamped to facilitate bending and cutting.

[0028] The present invention is further configured such that when a chip with bent chip pins is clamped, the structure for clamping the chip pins has a groove, and the bent chip pins are located in the groove, thereby preventing the bent chip pins from being deformed.

[0029] The present invention is further configured so that the rotating clamping cylinder, the mechanism for taking the chip from the slot, the mechanism for sending the chip to the bending station, the mechanism for sending the chip to the cutting station, and the mechanism for transferring the chip to the pneumatic clamp in S2-3-4 are simultaneously and synchronously translated horizontally.

[0030] The present invention is further configured such that the outer side of the support plate for supporting the shell is provided with a shell vibration plate track for delivering the shells one by one onto the support plate;

[0031] The side of the support plate facing away from the vibration plate track of the shell has a fixed position structure to prevent the shell from falling off the support plate;

[0032] A push block is provided on the upper side of the outer end of the support plate, and a termination plate is provided on the top of the inner end. The push block is used to push the shell on the support plate until it contacts the termination plate. When the push block pushes the shell, the side of the push block blocks the end of the shell vibration plate track to prevent other shells from falling off.

[0033] A lifting cylinder is provided below the support plate, and a plurality of limit rods are provided on the top of the lifting cylinder. A hole is provided on the support plate. The limit rods are raised under the driving action of the lifting cylinder, and limit rods are provided on all four sides of the shell at this time, wherein openings for the limit rods to pass through are provided at the end of the push block and the inner side of the end plate;

[0034] After the shell is limited by the limit rod, the upper pressure arm moves downward, and the pressure arm presses the two ends of the shell downward to fix the position of the shell;

[0035] After the chip and the shell are matched, the limit rod descends, the pressure arm moves upward, the push block is reset, and the cylinder located on the side of the support plate extends to push the shell assembled with the chip outward.

[0036] The present invention is further configured to capture and compare images of the shell in which the chip is assembled, analyze whether the chip is assembled correctly, and discharge the correct assembly downward through a qualified product track, and discharge the unqualified assembly downward through a unqualified product track.

[0037] Compared with the prior art, the present invention provides an automated process based on chip assembly, wherein the equipment for implementing this process is the "Chip Assembly Equipment" applied for by the company on the same day. When assembling the chip and the shell, firstly, the chip is placed vertically through the card slot of the chip placement mechanism, and the chip pins are located in the card slot, and the chip shell is in an open state; clamp the chip shell, and rotate 180° after the chip is separated from the chip placement mechanism; clamp the chip pins and release the clamping of the chip shell; move the shell to the bottom of the chip shell; lower the height of the chip pins, and make the chip shell snap into the corresponding position in the shell. Since the above assembly can be performed automatically only by the device, it can improve efficiency and also make the assembly effect better. DETAILED DESCRIPTION

[0038] The advantages and features of the present invention will become more apparent from the following description and claims.

[0039] An automated process based on chip assembly, comprising the following steps:

[0040] S1, vertically placing the chip through the card slot of the chip placement mechanism, with the chip pins located in the card slot and the chip housing in an open state;

[0041] S2, clamp the chip housing and rotate it 180° after the chip is separated from the chip placement mechanism;

[0042] S3, clamp the chip pins and release the clamping of the chip housing;

[0043] S4, the shell moves to the bottom of the chip housing;

[0044] S5, lowering the height of the chip pins and allowing the chip housing to be inserted into a corresponding position in the housing.

[0045] After the chip housing is clamped in S2, the height of the chip placement mechanism is lowered, so that the chip is separated from the chip placement mechanism, which facilitates the movement of the clamped chip.

[0046] The outer side of the card slot is adjacent to the chip vibration plate track, the chip vibration plate track is used to transport the chip into the card slot, and the chip placement mechanism has a fixed baffle on the side away from the chip vibration plate track, and the baffle is used to prevent the chip in the card slot from being separated from the chip placement mechanism;

[0047] Before clamping the chip in S2, the chip placement mechanism moves in a direction perpendicular to the chip vibration plate track, and then moves vertically downward. During the movement of the chip placement mechanism, the end of the chip vibration plate track is blocked to prevent the subsequent chip on the chip vibration plate track from falling off;

[0048] At the same time, during the horizontal movement of the chip placement mechanism, both sides of the chip pins in the card slot are limited, and when the chip placement mechanism moves horizontally to the end, the chip housing is clamped.

[0049] The S2 includes:

[0050] S2-1, after clamping the chip housing, perform horizontal movement to separate the chip from the chip placement mechanism;

[0051] S2-2, insert the pins of the chip into the corresponding openings;

[0052] S2-3, press down the top of the chip housing to improve the consistency of chip position;

[0053] S2-4, the rotary clamping cylinder descends to clamp the chip housing;

[0054] S2-5, the rotary clamping cylinder rises and rotates 180°.

[0055] The S2-3 also has:

[0056] S2-3-1, the structure for pressing down the chip and the mechanism for clamping the chip housing are removed;

[0057] S2-3-2, after the chip shell is clamped, it is moved to the pin bending station to bend the pins to be bent;

[0058] S2-3-3, transfer the chip with bent pins to the next station, cut the pins to obtain the required length of pins;

[0059] S2-3-4, then transfer the chip with the cut pins to the pneumatic gripper, and the pneumatic gripper clamps the pins;

[0060] The chip clamped by the rotating clamping cylinder in S2-4 is the fixed chip in S2-3-4.

[0061] In the S2-3-2 and S2-3-3, the chip pins close to the chip housing are clamped to facilitate bending and cutting.

[0062] When clamping a chip with bent chip pins, the structure for clamping the chip pins has a groove, and the bent chip pins are located in the groove, so as to prevent the bent chip pins from being deformed.

[0063] The rotating clamping cylinder, the mechanism for taking the chip from the slot, the mechanism for sending the chip to the bending station, the mechanism for sending the chip to the cutting station, and the mechanism for transferring the chip to the pneumatic clamp in S2-3-4 are simultaneously and synchronously translated horizontally.

[0064] The outer side of the support plate for supporting the shell is provided with a shell vibration plate track for sending the shells onto the support plate one by one;

[0065] The side of the support plate facing away from the vibration plate track of the shell has a fixed position structure to prevent the shell from falling off the support plate;

[0066] A push block is provided on the upper side of the outer end of the support plate, and a termination plate is provided on the top of the inner end. The push block is used to push the shell on the support plate until it contacts the termination plate. When the push block pushes the shell, the side of the push block blocks the end of the shell vibration plate track to prevent other shells from falling off.

[0067] A lifting cylinder is provided below the support plate, and a plurality of limit rods are provided on the top of the lifting cylinder. A hole is provided on the support plate. The limit rods are raised under the driving action of the lifting cylinder, and limit rods are provided on all four sides of the shell at this time, wherein openings for the limit rods to pass through are provided at the end of the push block and the inner side of the end plate;

[0068] After the shell is limited by the limit rod, the upper pressure arm moves downward, and the pressure arm presses the two ends of the shell downward to fix the position of the shell;

[0069] After the chip and the shell are matched, the limit rod descends, the pressure arm moves upward, the push block is reset, and the cylinder located on the side of the support plate extends to push the shell assembled with the chip outward.

[0070] The shell with the chip assembled is imaged and compared to analyze whether the chip is assembled correctly. The correct assembly is discharged downward through the qualified product track, and the unqualified assembly is discharged downward through the unqualified product track.

[0071] The present invention provides an automated process based on chip assembly, wherein the equipment for implementing this process is the "Chip Assembly Equipment" applied for by the company on the same day. When assembling the chip and the shell, firstly, the chip is placed vertically through the card slot of the chip placement mechanism, and the chip pins are located in the card slot, and the chip shell is in an open state; the chip shell is clamped and rotated 180° after the chip is separated from the chip placement mechanism; the chip pins are clamped and the clamping of the chip shell is released; the shell is moved to the bottom of the chip shell; the height of the chip pins is lowered, and the chip shell is clipped into the corresponding position in the shell. Since the above assembly can be performed automatically only by the device, it can improve efficiency and also make the assembly effect better.

[0072] During assembly, the chip vibration plate first transports the chip onto the chip vibration plate track, and the chip at the end is inserted into the card slot (there is a fixed baffle on the outside of the card slot to prevent the chip in the card slot from falling off); then the cylinder pushes the block with the card slot to move horizontally, and after the movement, the structure with the card slot blocks the end of the chip vibration plate track, and the subsequent chips cannot continue to move;

[0073] Then the chip moves to the side of the chip vibration plate track and is clamped by a pneumatic finger; then the mechanism with a slot descends to separate the chip from the chip placement mechanism (the two sides of the chip pins are limited during the horizontal movement of the chip);

[0074] Then the first pneumatic finger moves the chip horizontally to the second pneumatic finger, the clamping structure of which has an opening (i.e., the opening in S2-1); the opening clamps the chip pins (not completely clamped), the first pneumatic finger is released, and the upper cylinder presses downward on the chip shell through the block at the bottom of the piston rod, so that the bottom of the shell hits the top of the clamping structure, so that all the chips can reach the same position;

[0075] Then the first pneumatic finger moves away, and the third pneumatic finger comes over to clamp the chip shell of the chip on the second pneumatic finger, and moves the chip to the bending station after translation; at this station, the chip pins close to the chip shell are first clamped on both sides, and then there is an inclined movable block that tilts upward to bend the chip pins that need to be bent, wherein the bending process usually makes the chip pins Z-shaped, so a Z-shaped channel or space is formed between the structure for clamping the chip pins and the movable block, so that the bent chip pins can have the desired shape;

[0076] After the bending is completed, the chip is still kept in position until the fourth pneumatic finger clamps the chip shell of the bent chip and moves it horizontally to the next cutting station; at this station, the straight chip pins close to the chip shell and the bent chip pins are clamped, and a horizontal cutting knife moves to form a shearing effect with one of the clamping blocks to cut all the chip pins into the required length;

[0077] Then, the position of the cut chip is maintained, and the fifth pneumatic finger is activated to clamp the chip shell of the cut chip and then move horizontally to the pneumatic clamping claw, and the pneumatic clamping claw clamps the bent chip pins; then, the fifth pneumatic finger is activated, and the rotary clamping cylinder moves to the top of the pneumatic clamping claw, and then the rotary clamping cylinder descends to clamp the chip shell of the chip on the pneumatic clamping claw; during clamping, there are two adjacent blocks on the clamping block on one side of the rotary clamping cylinder, and during the clamping process, both sides of the chip shell are attached to the inner walls of the two blocks, and the two ends are against the two clamping blocks, so that the angle and position of the chip are kept stable;

[0078] Then the rotary clamping cylinder rises and rotates 180°, then moves in the direction away from the card slot and moves to the bottom of the sixth pneumatic finger. After the sixth pneumatic finger descends, it clamps the upward chip pins (when clamping the bent chip pins, the clamping mechanism is provided with grooves for the bent chip pins to be clamped in). Then the rotary clamping cylinder is opened and moved horizontally. After that, the sixth pneumatic finger descends under the action of the cylinder or electric push rod and inserts the chip into the corresponding position of the shell.

[0079] The first pneumatic finger, the third pneumatic finger, the fourth pneumatic finger, the fifth pneumatic finger and the rotary clamping cylinder (and the cylinder or electric push rod used to lift the rotary clamping cylinder) are all synchronized and move simultaneously. In this way, during each reciprocating motion, a chip undergoes operations such as chip removal, chip bending, and chip cutting. In this way, a chip is assembled into the shell in each activity cycle, greatly improving production efficiency. At the same time, the multiple pneumatic fingers only need one drive structure to achieve synchronous reciprocating motion, which not only reduces the cost of the equipment, but also enables the equipment to operate at high speed and automatically.

[0080] The conveying of the shell to the designated position is also carried out automatically; first, the outer end of the shell vibration plate track is connected to a vibration plate for conveying the shell, and then the shell at the end is pushed onto the support plate by the shell behind. The outer side of the support plate has a fixed position structure, which not only prevents the shell from falling, but also allows only one shell on the support plate; after the sensor senses the shell, the push block moves forward, which pushes the shell on the support plate to contact the end plate, and at the same time, the side of the push block blocks the end of the shell vibration plate track;

[0081] Then the cylinder below raises all the limit rods, and after the limit rods pass through the holes on the support plate, they hit the periphery of the shell; then the pressing arm descends under the action of the cylinder and presses on both ends of the shell, so that the position of the shell is fixed, and the chip above can be directly assembled when it descends;

[0082] After the assembly is completed, the limit rod drops, and the cylinder on the side pushes the assembled structure to the side. The camera above takes a picture and compares it to determine whether the combination is qualified; qualified products are pushed forward and fall directly; unqualified products are pushed down by the side cylinder.

[0083] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0084] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. An automated process based on chip assembly, characterized in that: The following steps are involved: S1, vertically placing the chip through the card slot of the chip placement mechanism, with the chip pins located in the card slot and the chip housing in an open state; S2, clamp the chip housing and rotate it 180° after the chip is separated from the chip placement mechanism; S3, clamp the chip pins and release the clamping of the chip housing; S4, the shell moves to the bottom of the chip housing; S5, lowering the height of the chip pins and allowing the chip housing to be inserted into a corresponding position in the housing; After the chip housing is clamped in S2, the height of the chip placement mechanism is lowered, so that the chip is separated from the chip placement mechanism, which facilitates the movement of the clamped chip; The outer side of the card slot is adjacent to the chip vibration plate track, the chip vibration plate track is used to transport the chip into the card slot, and the chip placement mechanism has a fixed baffle on the side away from the chip vibration plate track, and the baffle is used to prevent the chip in the card slot from being separated from the chip placement mechanism; Before clamping the chip in S2, the chip placement mechanism moves in a direction perpendicular to the chip vibration plate track, and then moves vertically downward. During the movement of the chip placement mechanism, the end of the chip vibration plate track is blocked to prevent the subsequent chip on the chip vibration plate track from falling off; At the same time, during the horizontal movement of the chip placement mechanism, both sides of the chip pins in the card slot are limited, and when the chip placement mechanism moves horizontally to the end, the chip housing is clamped.

2. The automated process based on chip assembly according to claim 1, characterized in that: The S2 includes: S2-1, after clamping the chip housing, perform horizontal movement to separate the chip from the chip placement mechanism; S2-2, insert the pins of the chip into the corresponding openings; S2-3, press down the top of the chip housing to improve the consistency of chip position; S2-4, the rotary clamping cylinder descends to clamp the chip housing; S2-5, the rotary clamping cylinder rises and rotates 180°.

3. The automated process based on chip assembly according to claim 2, characterized in that: The S2-3 also has: S2-3-1, the structure for pressing down the chip and the mechanism for clamping the chip housing are removed; S2-3-2, after the chip shell is clamped, it is moved to the pin bending station to bend the pins to be bent; S2-3-3, transfer the chip with bent pins to the next station, cut the pins to obtain the required length of pins; S2-3-4, then transfer the chip with the cut pins to the pneumatic gripper, and the pneumatic gripper clamps the pins; The chip clamped by the rotating clamping cylinder in S2-4 is the fixed chip in S2-3-4.

4. The automated process based on chip assembly according to claim 3, characterized in that: In the S2-3-2 and S2-3-3, the chip pins close to the chip housing are clamped to facilitate bending and cutting.

5. The automated process based on chip assembly according to claim 4, characterized in that: When clamping a chip with bent chip pins, the structure for clamping the chip pins has a groove, and the bent chip pins are located in the groove, so as to prevent the bent chip pins from being deformed.

6. The automated process based on chip assembly according to claim 5, characterized in that: The rotating clamping cylinder, the mechanism for taking the chip from the slot, the mechanism for sending the chip to the bending station, the mechanism for sending the chip to the cutting station, and the mechanism for transferring the chip to the pneumatic clamp in S2-3-4 are simultaneously and synchronously translated horizontally.

7. The automated process based on chip assembly according to claim 1, characterized in that: The outer side of the support plate for supporting the shell is provided with a shell vibration plate track for sending the shells onto the support plate one by one; The side of the support plate facing away from the vibration plate track of the shell has a fixed position structure to prevent the shell from falling off the support plate; A push block is provided on the upper side of the outer end of the support plate, and a termination plate is provided on the top of the inner end. The push block is used to push the shell on the support plate until it contacts the termination plate. When the push block pushes the shell, the side of the push block blocks the end of the shell vibration plate track to prevent other shells from falling off. A lifting cylinder is provided below the support plate, and a plurality of limit rods are provided on the top of the lifting cylinder. A hole is provided on the support plate. The limit rods are raised under the driving action of the lifting cylinder, and limit rods are provided on all four sides of the shell at this time, wherein openings for the limit rods to pass through are provided at the end of the push block and the inner side of the end plate; After the shell is limited by the limit rod, the upper pressure arm moves downward, and the pressure arm presses the two ends of the shell downward to fix the position of the shell; After the chip and the shell are matched, the limit rod descends, the pressure arm moves upward, the push block is reset, and the cylinder located on the side of the support plate extends to push the shell assembled with the chip outward.

8. The automated process based on chip assembly according to claim 7, characterized in that: The shell with the chip assembled is imaged and compared to analyze whether the chip is assembled correctly. The correct assembly is discharged downward through the qualified product track, and the unqualified assembly is discharged downward through the unqualified product track.