Crystal oscillator carrier plate

Abstract

The present application discloses a crystal oscillator carrier plate, which is used to package crystal oscillator products, including a plurality of fixing holes for fixing a base, and receiving grooves corresponding to the fixing holes, wherein the receiving grooves are used to place and position the base. The crystal oscillator carrier plate is separately arranged, including a base plate and a cover plate, and the cover plate and the base plate are detachably connected; the receiving grooves are arranged on the cover plate, and the fixing holes are arranged on the base plate, which are divided into the cover plate and the base plate and are independently processed and manufactured. Compared with the prior art, this structure can better control the dimensional accuracy of the base plate and the cover plate, so that all products are on the same height plane, thereby ensuring the consistency of the products produced.

Description

Technical Field

[0001] The present application relates to the technical field of carrier plates, and in particular to a crystal oscillator carrier plate. Background Art

[0002] A crystal oscillator, also known as a crystal vibrator or a crystal resonator, includes a base and a cover, with a crystal arranged between the two, and a supporting portion for supporting the cover along the edge of the base. The base, cover and supporting portion form a closed space for protecting the crystal inside. The crystal, supporting portion and cover are all packaged based on the base, and are packaged through process steps such as gluing, crystal bonding, fine-tuning, sealing, and testing; and the carrying plate is used to carry the base for subsequent packaging. Therefore, only by ensuring the accuracy of the carrying plate supporting the base can the consistency of the produced products be achieved.

[0003] There are two types of crystal oscillator carriers: Figure 1 The first type is an integrated carrier plate, which is machined into a carrier plate that is compatible with the product according to the specifications of the crystal oscillator; the second type is divided into multiple layers for production, and a carrier plate is formed by positioning and superimposing. That is, on the basis of the above-mentioned integrated carrier plate, a loading plate is stacked to use for processing of various workpiece thicknesses. Since this method is a carrier plate formed by multi-layer superposition, it is easy to produce cumulative errors, so the accuracy is poor.

[0004] The integrated carrier plate of the first method has higher precision in processing the crystal oscillator than the superimposed carrier plate of the second method. However, it is difficult to ensure the size requirements between the bottom plane of the receiving groove and the bottom section of the carrier plate when processing the receiving groove, resulting in the bottom planes of the receiving grooves not being at the same height. It is still difficult to ensure higher precision requirements (such as the flatness and parallelism of the bottom plane of the receiving groove), which will affect the consistency of the produced crystal oscillator products. Summary of the invention

[0005] The present application provides a crystal oscillator carrier plate to solve the above-mentioned problem that the accuracy is difficult to ensure and the consistency of the produced products is poor, and adopts the following technical solutions:

[0006] A crystal oscillator carrier plate is used to package crystal oscillator products, including a plurality of fixing holes for fixing a base, and receiving grooves corresponding to the fixing holes, wherein the receiving grooves are used to place and position the base. The crystal oscillator carrier plate is separately arranged, including a base plate and a cover plate, and the cover plate and the base plate are detachably connected; the receiving grooves are arranged on the cover plate, and the fixing holes are arranged on the base plate, so as to facilitate the processing accuracy of the cover plate and the base plate.

[0007] Preferably, the crystal oscillator carrier plate is divided into the cover plate and the bottom plate from the bottom plane of the accommodating groove.

[0008] Preferably, the bottom plate and the cover plate are respectively provided with a plurality of corresponding through holes, and positioning components are correspondingly provided in the through holes to position the cover plate on the bottom plate so that the fixing holes correspond to the accommodating grooves.

[0009] Preferably, the cover plate and the bottom plate are respectively provided with a plurality of mounting holes, and corresponding fastening components are respectively provided in the mounting holes for connection.

[0010] Preferably, a first positioning hole and a second positioning hole are respectively provided on both sides of the cover plate, and the first positioning hole and the second positioning hole are used for positioning on the device.

[0011] Preferably, the cover plate and the bottom plate are both made of titanium alloy material.

[0012] Preferably, the fixing hole array is distributed on the bottom plate.

[0013] The beneficial effects of this application are:

[0014] (1) Compared with the prior art, the present application adopts a split structure, which divides the bottom plane of the receiving groove into a bottom plate containing fixing holes and a cover plate containing the receiving groove, and processes and manufactures them separately. Compared with the prior art, this structure can better control the accuracy of the bottom plate and the cover plate, so that all products are on the same height plane, thereby ensuring the consistency of the products produced.

[0015] (2) Since the present application adopts a split structure, it can be applied to products of different specifications by simply replacing the cover plate of the corresponding specifications and dimensions. Therefore, compared with the existing technology, it also greatly reduces the cost of producing the carrier plate, has relatively strong applicability, and is more convenient to replace in case of damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the prior art structure;

[0017] Figure 2 It is a schematic diagram of the crystal carrier plate assembly of the present application;

[0018] Figure 3 This application Figure 2 Sectional view at AA;

[0019] Figure 4 It is a schematic diagram of the bottom plate structure of the present application;

[0020] Figure 5 It is a schematic diagram of the cover structure of the present application.

[0021] In the figure:

[0022] 100, a carrier plate;

[0023] 1. bottom plate, 10. convex plate, 11. fixing hole, 12. through hole, 13. first positioning hole, 14. second positioning hole;

[0024] 2. Cover plate, 21. Receiving groove, 22. Mounting hole. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described in the present application are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0026] The base serves as the basis for the crystal oscillator packaging and provides a stable supporting platform for the crystal in the crystal oscillator. The crystal oscillator carrier plate 100 serves as the basis for carrying the base for subsequent packaging. In order to ensure the consistency of mass-produced products, it is necessary to ensure that the base is in the same height plane. Therefore, there are high precision requirements for the dimensional deviation of the flatness and parallelism between the bottom plane of the receiving groove 21 on the carrier plate 100 and the bottom end face of the carrier plate 100. For example, the flatness and parallelism of the end faces of the bottom plate 1 and the cover plate 2 need to be maintained within 0.015mm. Only by ensuring the accuracy of the bottom plane of the receiving groove 21 that supports the base and making all the bases in the same plane on the carrier plate 100 can it be more conducive to ensuring the consistency of the produced products. However, it is difficult for traditional integrated or stacked carriers to ensure the accuracy requirements of the bottom plane of the receiving groove 21.

[0027] Combination Figures 1 to 3 , a crystal oscillator carrier plate is used to package crystal oscillator products. The crystal oscillator carrier plate 100 is a split structure, including a base plate 1 and a cover plate 2. In order to facilitate processing and to more easily ensure the dimensional accuracy requirements of the base plate 1 and the cover plate 2, one end surface of the cover plate 2 is fitted and assembled with one end surface of the base plate 1 as a whole. The base plate 1 and the cover plate 2 are disassembled and connected, and it is more convenient to replace a single damaged one, which can also save costs.

[0028] Compared with the existing integrated carrier plate 100, the carrier plate 100 of the present application is more flexible, and it is more convenient to replace it when it is damaged, and it can also reduce the replacement cost of the carrier plate 100; compared with the existing stacked carrier plate 100, the carrier plate 100 of the present application is more precise, and is relatively easy to assemble, without large cumulative errors.

[0029] Combination Figure 3The bottom plate 1 is provided with a plurality of fixing holes 11, and the fixing holes 11 pass through both ends of the bottom plate 1. The fixing holes 11 are used to adsorb and fix the base placed on the end surface of the bottom plate 1. When in use, the base can be adsorbed and attached to the bottom plate 1 by vacuum negative pressure to fix the base for subsequent packaging based on the base; wherein, the fixing holes 11 can be distributed in an array on the bottom plate 1.

[0030] Combination Figure 4 The cover plate 2 is provided with a plurality of receiving grooves 21, and the receiving grooves 21 correspond to the fixing holes 11 and are used to receive and locate the position of the base on the bottom plate 1; Figure 3 , the present application designs the carrier plate 100 to be split, specifically, the crystal oscillator carrier plate 100 of the present application is divided into the cover plate 2 and the bottom plate 1 from the bottom plane of the receiving groove 21, so that the cover plate 2 and the bottom plate 1 can be processed and manufactured separately, so that the dimensional accuracy of the bottom plate 1 and the cover plate 2 can be more easily guaranteed; compared with the existing integrated carrier plate 100, since there are a plurality of the receiving grooves 21 distributed on the carrier plate 100, since the receiving grooves 21 are irregular in shape and small in area, it is difficult to ensure the flatness of the bottom of the receiving groove 21 during processing and manufacturing, and it is difficult to ensure the flatness of each of the receiving grooves 21. The bottom plane of the accommodating groove 21 is in a horizontal plane at the same height, that is, it is difficult to ensure the dimensional accuracy between the bottom plane of the accommodating groove 21 and the bottom end face of the carrying plate 100; the stacked carrying plate 100 is stacked on the basis of the integrated carrying plate 100. Although it can meet the needs of products of different specifications, it will also produce a large cumulative error. The present application divides the bottom end face of the accommodating groove 21 into independent cover plates 2 and bottom plates 1, so it is more conducive to ensuring processing accuracy, reducing the plane error after processing, and allowing the base to be in a plane at the same height to ensure the consistency of subsequent products.

[0031] In summary, the present application divides the carrier plate 100 into the bottom plate 1 and the cover plate 2 at the bottom plane of the receiving groove 21. The two end surface areas of the cover plate 2 and the bottom plate 1 are larger, so the processing accuracy requirements such as surface flatness and parallelism can be better guaranteed during processing and manufacturing; because the carrier plate 100 is divided from the bottom plane of the receiving groove 21, when in use, the cover plate 2 is assembled on the bottom plate 1. At this time, the end surface of the bottom plate 1 and the cover plate 2 that are in contact with each other is the end surface supporting the base, which increases the processing area. Compared with the existing integrated carrier plate 100, the area of ​​the ground plane of the receiving groove 21 is larger. Using the matching end surface as the unified reference of each base is more conducive to making the base located in the same horizontal plane, while ensuring the consistency of the produced products. At the same time, for products of different specifications, there is no need to re-manufacture a new carrier plate 100 as a whole. It is only necessary to manufacture the corresponding cover plate 2 according to the products of different specifications, which greatly reduces the production cost and has high applicability and versatility.

[0032] Combination Figure 3 and Figure 4 The cover plate 2 and the base plate 1 are provided with corresponding through holes 12. Specifically, the through holes 12 include a first through hole provided on the cover plate 2 and a second through hole provided on the base plate 1. Positioning components are provided in the first through hole and the second through hole. The positioning components may be positioning pins. The positioning components are used to determine the position of the cover plate on the base plate, so that the receiving groove 21 is aligned with the fixing hole 11, and the cover plate 2 and the base plate 1 can be preliminarily fixed.

[0033] The cover plate 2 and the base plate 1 are respectively provided with a plurality of mounting holes 22, wherein the mounting holes 22 include a first mounting hole and a second mounting hole respectively provided on the cover plate 2 and the base plate 1, and corresponding fastening components are provided in the mounting holes 22 to connect the cover plate 2 and the base plate 1, and the fastening components can be locking screws, and the mounting holes 22 are evenly distributed on the cover plate 2 and the base plate 1, so that the cover plate 2 and the base plate 1 fit tightly together.

[0034] Among them, the base plate 1 and the cover plate 2 can be made of titanium alloy materials. Preferably, the base plate 1 and the cover plate 2 are both made of titanium alloy materials. Titanium alloy materials have the characteristics of high strength, corrosion resistance, high heat resistance and not easy to deform. They are not easy to deform during production or use, can ensure their precision requirements, and can greatly improve the service life of the carrier plate.

[0035] In order to facilitate the positioning of the carrier plate on the equipment, the cover plate 2 and the base plate 1 are provided with a first positioning hole 13 and a second positioning hole 14 on both sides (in the length direction), wherein the first positioning hole 13 and the second positioning hole 14 can both be round holes, waist-shaped holes, or a round hole matched with a positioning hole. In the present embodiment, the first positioning hole 13 is a waist-shaped hole, and the second positioning hole 14 is a round hole.

[0036] In some embodiments, convex plates 10 are respectively provided on both sides (in the width direction) of the bottom plate 1 , and the convex plates 10 extend outward from the bottom plate 1 to cooperate with the moving mechanism of the device to facilitate the movement of the carrier plate on the device.

Claims

1. A crystal oscillator carrier plate, used to package a crystal oscillator product, comprising a plurality of fixing holes for fixing a base, and receiving grooves corresponding to the fixing holes, wherein the receiving grooves are used to place and position the base, and characterized in that: The crystal oscillator carrier plate is separately arranged, including a base plate and a cover plate, and the cover plate and the base plate are detachably connected; the receiving groove is arranged on the cover plate, and the fixing hole is arranged on the base plate; the receiving groove is connected to the fixing hole, and the base located on the receiving groove can be vacuum adsorbed through the fixing hole.

2. The crystal oscillator carrier plate according to claim 1, characterized in that: The crystal oscillator carrier plate is divided into the cover plate and the bottom plate from the bottom plane of the accommodating groove.

3. The crystal oscillator carrier plate according to claim 1, characterized in that: The bottom plate and the cover plate are respectively provided with a plurality of corresponding through holes, and positioning components are correspondingly arranged in the through holes to position the cover plate on the bottom plate so that the fixing holes correspond to the accommodating grooves.

4. The crystal oscillator carrier plate according to claim 1, characterized in that: The cover plate and the bottom plate are respectively provided with a plurality of mounting holes, and corresponding fastening components are respectively provided in the mounting holes for connection.

5. The crystal oscillator carrier plate according to claim 1, characterized in that: A first positioning hole and a second positioning hole are respectively provided on both sides of the cover plate, and the first positioning hole and the second positioning hole are used for positioning on the device.

6. The crystal oscillator carrier plate according to claim 1, characterized in that: The cover plate and the bottom plate are both made of titanium alloy.

7. The crystal oscillator carrier plate according to claim 1, characterized in that: The fixing hole array is distributed on the bottom plate.

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