A dry etching device for circular wafer

Abstract

The invention discloses a dry etching device for circular wafers, and relates to the technical field of dry etching of circular wafers. The main body mechanism comprises a support frame, a connecting frame is fixedly installed on the upper surface of the support frame, an electric telescopic rod is fixedly installed on the inner top wall of the connecting frame, an etching device body is fixedly installed on the telescopic end of the electric telescopic rod, an etching table is fixedly installed on the upper surface of the support frame, an electrostatic adsorption disk is fixedly installed on the upper surface of the etching table, and a loading and unloading mechanism is arranged on the outer side of the support frame; the loading and unloading mechanism comprises a feeding unit, and the feeding unit is located on the outer side of the support frame. The dry etching device for circular wafers can place and transport the circular wafers by arranging the feeding unit of the loading and unloading mechanism, so that the circular wafers can be conveniently transported to the etching location, thereby eliminating the need for personnel to place the circular wafers, reducing the complexity of operations of the personnel, and improving the efficiency of etching the circular wafers.

Description

Technical Field

[0001] The invention relates to the technical field of circular wafer dry etching, in particular to a circular wafer dry etching device. Background Art

[0002] Dry etching uses plasma to etch thin films on the surface. When the gas exists in the form of plasma, it has two characteristics. On the one hand, the chemical activity of these gases in the plasma is much stronger than that under normal conditions. According to the different materials to be etched, choosing the right gas can react with the material faster to achieve the purpose of etching and removal. On the other hand, the electric field can be used to guide and accelerate the plasma so that it has a certain amount of energy. When it bombards the surface of the etched object, it will knock out the atoms of the etched material, thereby achieving the purpose of etching by physical energy transfer.

[0003] The dry etching device for circular wafers is a device used to create microstructures on circular wafers in semiconductor manufacturing. It uses plasma to remove materials. However, before etching the circular wafer, a separate cleaning device is required to clean the circular wafer and then place the circular wafer at the etching location. After etching, the circular wafer is removed and then the subsequent circular wafer to be processed is placed. This process will take a long time, which reduces the efficiency of feeding. To this end, we propose a dry etching device for circular wafers.

[0004] Combining the above problems, we will find that it is difficult to avoid the above problems at the same time when using the existing circular wafer dry etching devices on the market, and even if they can be solved, they need to be solved with the cooperation of external tools, which makes it impossible to achieve the desired effect. Therefore, we propose a circular wafer dry etching device. Summary of the invention

[0005] The object of the present invention is to provide a dry etching device for circular wafers to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a dry etching device for circular wafers, comprising a main body mechanism, the main body mechanism comprising a support frame, a connecting frame is fixedly installed on the upper surface of the support frame, an electric telescopic rod is fixedly installed on the inner top wall of the connecting frame, an etching device body is fixedly installed on the telescopic end of the electric telescopic rod, an etching table is fixedly installed on the upper surface of the support frame, an electrostatic adsorption plate is fixedly installed on the upper surface of the etching table, and a loading and unloading mechanism is arranged on the outer side of the support frame;

[0007] The loading and unloading mechanism includes a feeding unit, which is located outside the support frame and is used to transport and load the circular wafers;

[0008] The loading and unloading mechanism further includes a loading unit, which is located above the support frame and is used in conjunction with a feeding unit, and is used to transport and store the etched circular wafers;

[0009] A cleaning mechanism is arranged above the support frame, and the cleaning mechanism is used in conjunction with a loading and unloading mechanism, and is used to clean the circular wafer.

[0010] Preferably, the feeding unit includes a conveying frame, the front side of the conveying frame is fixedly connected to the back side of the supporting frame, the inner wall of the conveying frame is rotatably connected to two first rollers, the outer surfaces of the two first rollers are jointly transmission-connected to the first conveyor belt, the outer surface of the first conveyor belt contacts the inner wall of the conveying frame, and the outer surface of the first conveyor belt is fixedly installed with rectangular frames arranged at equal distances, the inner wall of each of the rectangular frames is slidably connected to a placing frame, the bottom surface of each of the placing frames is fixedly installed with a first force spring, and the bottom end of each of the first force springs is fixedly connected to the inner bottom wall of the rectangular frame, and two fixed frames are fixedly installed on the upper surface of the supporting frame, the inner wall of each of the fixed frames is rotatably connected to a threaded screw rod, the inner wall of each of the fixed frames is slidably connected to a movable block, the inner wall of each of the movable blocks is threadedly connected to the outer surface of the threaded screw rod, an L-shaped frame is fixedly installed on one side of each of the movable blocks, and a rubber strip is fixedly installed on the upper surface of each of the L-shaped frames, and two fixed plates are fixedly installed on the upper surface of the supporting frame, and the upper surface of each of the fixed plates is fixedly installed The transmission gear of the present invention is a gear shifting device, and the transmission gear of the present invention is a gear shifting device. The gear shifting device is a gear shifting device for transmitting the rotation of the transmission gear to the transmission gear of the present invention. The gear shifting device is a gear shifting device for transmitting the rotation of the transmission gear of the present invention.

[0011] Preferably, a bearing is fixedly mounted on the bottom end of the support rod, and the bottom surface of the bearing is fixedly connected to the inner bottom wall of the conveying frame.

[0012] Preferably, four first supporting legs are fixedly mounted on the bottom surface of the conveying frame, and a first grounding plate is fixedly mounted on the bottom end of each of the first supporting legs.

[0013] Preferably, two second supporting legs are fixedly mounted on the bottom surface of the supporting frame, and a second grounding plate is fixedly mounted on the bottom end of each of the second supporting legs.

[0014] Preferably, the unloading unit comprises a U-shaped frame, the bottom surface of the U-shaped frame is fixedly connected to the upper surface of the supporting frame, the inner side wall of the U-shaped frame is rotatably connected to the second roller, the inner side wall of the supporting frame is rotatably connected to the third roller, the outer surfaces of the second roller and the third roller are jointly transmission-connected to the second conveyor belt, the inner wall of the U-shaped frame is rotatably connected to the outer surfaces of two threaded screws, and the outer surface of the second conveyor belt is fixedly installed with equidistantly arranged storage plates, the outer surface of one of the threaded screws is fixedly installed with a limiting frame, the inner wall of the limiting frame is rotatably hinged with three second arc plates, and the outer surface of the limiting frame is fixedly installed with three third arc plates The gear train is connected to the gear of the second transmission gear of the present invention, and the gear train is connected to the gear of the second transmission gear of the present invention through the rotation axis.

[0015] Preferably, the outer surfaces of the second roller and the third roller are fixedly mounted with limit plates, and one side surface of each of the limit plates is in contact with the outer surface of the second conveyor belt.

[0016] Preferably, a protection box is fixedly mounted on the front side of the U-shaped frame, and an inner bottom wall of the protection box is fixedly connected to the bottom surface of the stepper motor.

[0017] Preferably, the cleaning mechanism includes an ultrasonic cleaning box, the bottom surface of which is fixedly connected to the upper surface of the support frame, two support plates are fixedly installed on the inner wall of the ultrasonic cleaning box, a second electromagnet is fixedly installed on the upper surface of each support plate, a drying box is fixedly installed on the upper surface of the support frame, and electric thermal resistance wires are fixedly installed on the inner top wall and inner bottom wall of the drying box.

[0018] Preferably, the front side of the ultrasonic cleaning box is fixedly connected with a liquid outlet pipe, and the outer surface of the liquid outlet pipe is sleeved with a sealing cover.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention can place and transport circular wafers by setting a feeding unit of the loading and unloading mechanism, making it convenient to transport the circular wafers to the etching site, thereby eliminating the need for personnel to place the circular wafers, reducing the complexity of the staff's operations and increasing the efficiency of circular wafer etching.

[0021] 2. The present invention provides a material unloading unit, which can cooperate with the material feeding unit to remove and store the etched circular wafers, thereby reducing time waste and increasing the unloading rate of the circular wafers.

[0022] 3. The present invention is provided with a cleaning mechanism, which can cooperate with the loading and unloading mechanism to clean and dry the surface of the circular wafer before etching, so that there is no need to clean the circular wafer separately and then place it, thereby reducing the labor intensity of the staff and improving the efficiency of circular wafer etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a schematic structural diagram of a cross-section of the connecting frame of the present invention;

[0025] Figure 3 It is a schematic structural diagram of a cross-section of the support frame of the present invention;

[0026] Figure 4 It is a structural schematic diagram of the L-shaped frame of the present invention;

[0027] Figure 5 It is a schematic diagram of the structure of the conveying frame of the present invention in a rear cross-sectional view;

[0028] Figure 6 It is a schematic structural diagram of the first roller of the present invention;

[0029] Figure 7 For the present invention Figure 6 A partial enlarged view of the middle A;

[0030] Figure 8 It is a schematic diagram of the structure of the conveying frame of the present invention in a right side cross-sectional view;

[0031] Fig. 9 For the present invention Figure 8 A partial enlarged view of point B in the middle;

[0032] Fig.10It is a schematic structural diagram of the second conveyor belt of the present invention when viewed from above;

[0033] Fig.11 It is a structural schematic diagram of the rotating frame of the present invention from the right side.

[0034] In the figure: 1. main body; 11. support frame; 12. electric telescopic rod; 13. etching device body; 14. etching table; 15. electrostatic adsorption plate; 16. connecting frame; 2. loading and unloading mechanism; 21. feeding unit; 2101. conveying frame; 2102. first roller; 2103. first conveying belt; 2104. rectangular frame; 2105. first force spring; 2106. placing frame; 2107. fixing frame; 2108. threaded screw; 2109. movable block; 2110. L-shaped frame; 2111. rubber strip; 2112. fixing plate; 2113. first electromagnet; 2114. gear belt; 2115. rotating gear; 2116. stepping motor; 2117. rotating frame; 2118. first arc plate; 2119. second force spring; 2120. first gear; 2121. first bevel gear; 2122, second bevel gear; 2123, support rod; 2124, bearing; 2125, protection box; 2126, first support leg; 2127, first grounding plate; 2128, second support leg; 2129, second grounding plate; 22, unloading unit; 2201, U-shaped frame; 2202, second roller; 2203, third roller; 2204, second conveyor belt; 2205, storage plate; 220 6. Limiting frame; 2207. Second arc plate; 2208. Third force spring; 2209. Second gear; 2210. Third gear; 2211. Worm; 2212. Worm wheel; 2213. Limiting plate; 3. Cleaning mechanism; 301. Ultrasonic cleaning box; 302. Support plate; 303. Second electromagnet; 304. Drying box; 305. Electric heating resistance wire; 306. Liquid outlet pipe; 307. Sealing cover. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Example 1: Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.11 The present invention provides a technical solution: a dry etching device for circular wafers, comprising a main body mechanism 1, the main body mechanism 1 comprises a support frame 11, a connecting frame 16 is fixedly installed on the upper surface of the support frame 11, an electric telescopic rod 12 is fixedly installed on the inner top wall of the connecting frame 16, an etching device body 13 is fixedly installed on the telescopic end of the electric telescopic rod 12, an etching table 14 is fixedly installed on the upper surface of the support frame 11, an electrostatic adsorption plate 15 is fixedly installed on the upper surface of the etching table 14, and a loading and unloading mechanism 2 is arranged on the outer side of the support frame 11;

[0037] The loading and unloading mechanism 2 includes a feeding unit 21 . The feeding unit 21 is located outside the support frame 11 . The feeding unit 21 is used for conveying and loading circular wafers.

[0038] As a further limitation of the loading and unloading mechanism 2 of the present invention, the feeding unit 21 includes a conveying frame 2101, the front of the conveying frame 2101 is fixedly connected to the back of the support frame 11, the inner wall of the conveying frame 2101 is rotatably connected to two first rollers 2102, the outer surfaces of the two first rollers 2102 are jointly transmission-connected to a first conveyor belt 2103, the outer surface of the first conveyor belt 2103 is in contact with the inner wall of the conveying frame 2101, and the outer surface of the first conveyor belt 2103 is fixedly installed with rectangular frames 2104 arranged at equal distances, the inner wall of each rectangular frame 2104 is slidably connected to a placing frame 2106, and the bottom surface of each placing frame 2106 is fixedly installed with a first force spring 2105, each first The bottom ends of the force springs 2105 are fixedly connected to the inner bottom wall of the rectangular frame 2104, and two fixing frames 2107 are fixedly installed on the upper surface of the support frame 11. The inner wall of each fixing frame 2107 is rotatably connected with a threaded screw 2108, and the inner wall of each fixing frame 2107 is slidably connected with a movable block 2109, and the inner wall of each movable block 2109 is threadedly connected to the outer surface of the threaded screw 2108. An L-shaped frame 2110 is fixedly installed on one side of each movable block 2109, and a rubber strip 2111 is fixedly installed on the upper surface of each L-shaped frame 2110. Two fixing plates 2112 are fixedly installed on the upper surface of the support frame 11, and the upper surface of each fixing plate 2112 is fixedly installed with a first An electromagnet 2113, a gear belt 2114 is arranged above the support frame 11, the inner wall of the gear belt 2114 is meshed with two rotating gears 2115, a stepper motor 2116 is arranged on the outer side of the gear belt 2114, the output end of the stepper motor 2116 power is fixedly connected to the front of one of the rotating gears 2115, the back of each rotating gear 2115 is fixedly connected to one end of a threaded screw 2108, one end of one of the threaded screws 2108 is fixedly installed with a rotating frame 2117, the outer surface of the rotating frame 2117 is rotatably connected to the inner wall of the fixed frame 2107, the inner wall of the rotating frame 2117 is rotatably hinged with three first arc plates 2118, the outer surface of the rotating frame 2117 Three second force springs 2119 are fixedly installed on the surface, and one end of each second force spring 2119 close to the first curved plate 2118 is fixedly connected to a side surface of the first curved plate 2118. The inner wall of the conveying frame 2101 is rotatably connected to the first gear 2120 through a rotating shaft. The outer surface of one of the first curved plates 2118 contacts the outer surface of the first gear 2120, and a first bevel gear 2121 is fixedly installed on the back of the first gear 2120. The outer surface of the first bevel gear 2121 is meshed with a second bevel gear 2122. A support rod 2123 is fixedly installed on the inner wall of the second bevel gear 2122, and the top of the support rod 2123 is fixedly connected to the bottom end of one of the first roller shafts 2102.

[0039] See also Figure 5A bearing 2124 is fixedly installed at the bottom end of the support rod 2123, and the bottom surface of the bearing 2124 is fixedly connected to the inner bottom wall of the conveying frame 2101. By setting the bearing 2124, the support rod 2123 can be supported, thereby preventing the support rod 2123 from deviating when rotating, thereby ensuring the stability of the support rod 2123 when rotating.

[0040] See also Figure 2 and Figure 3 Four first supporting legs 2126 are fixedly installed on the bottom surface of the conveying rack 2101, and a first grounding plate 2127 is fixedly installed on the bottom end of each first supporting leg 2126. By setting the first supporting legs 2126, the conveying rack 2101 can be supported, and the first grounding plate 2127 can increase the friction between the first supporting legs 2126 and the ground, thereby ensuring the stability of the conveying rack 2101.

[0041] See also Figure 1 Two second supporting legs 2128 are fixedly installed on the bottom surface of the support frame 11, and a second grounding plate 2129 is fixedly installed on the bottom end of each second supporting leg 2128. By setting the second supporting legs 2128, the support frame 11 can be supported, thereby preventing the support frame 11 from tilting. The second grounding plate 2129 can increase the contact area between the second supporting legs 2128 and the ground, thereby ensuring the stability of the support frame 11.

[0042] The specific implementation method of this embodiment is as follows: when it is necessary to etch a circular wafer, the circular wafer is first placed on the placement rack 2106, with every two placement racks 2106 supporting one circular wafer. The user uses an external control switch and a power supply to start the stepper motor 2116, and the power provided by the stepper motor 2116 can drive one of the rotating gears 2115 to rotate counterclockwise, thereby driving the gear belt 2114 to rotate, so that the rotating gear 2115 can drive the threaded screw 2108 to rotate, and the threaded screw 2108 can rotate counterclockwise to drive the movable block 2109 to move toward the conveying rack 2101, and the threaded screw 2108 can drive the rotating gear 2115 to rotate counterclockwise. The movable frame 2117 rotates, so that the first arc plate 2118 can drive the first gear 2120 to rotate, and the rotation of the first gear 2120 can drive the first bevel gear 2121 to rotate, so that the first bevel gear 2121 can drive the second bevel gear 2122 to rotate, and the second bevel gear 2122 can drive the support rod 2123 to drive the first roller 2102 to rotate, and the rotation of the first roller 2102 can drive the first conveyor belt 2103 to convey the circular wafer. When the movable block 2109 drives the L-shaped frame 2110 to move to the edge of the fixed frame 2107, the circular wafer just moves to the top of the L-shaped frame 2110, and the material of the placement frame 2106 The material is iron, and the adsorption force provided by the first electromagnet 2113 can drive the placement rack 2106 to move downward, so that the circular wafer can be transported downward to the rubber strip 2111 on the L-shaped rack 2110, and then the stepper motor 2116 drives the threaded screw 2108 to rotate clockwise, so that the L-shaped rack 2110 can drive the circular wafer to move, and the first electromagnet 2113 stops working. The elastic force provided by the first force spring 2105 can drive the placement rack 2106 to return to its original position. When the first electromagnet 2113 adsorbs the placement rack 2106, the first force spring 2105 realizes the buffering of the descending process, which increases the stability of the placement rack 2106 when it moves downward. When the threaded screw 2108 rotates clockwise, the arc surface of the first arc plate 2118 contacts the first gear 2120, and the elastic force provided by the second force spring 2119 can buffer the first arc plate 2118, so that the first arc plate 2118 will not drive the first gear 2120 to rotate. The movement of the L-shaped frame 2110 can drive the circular wafer to the electrostatic adsorption disk 15, and the electrostatic adsorption disk 15 can adsorb and limit the circular wafer, thereby preventing the circular wafer from shifting during etching. The power provided by the electric telescopic rod 12 can drive the etching device body 13 to move downward, so that the etching device body 13 can seal the circular wafer inside for etching.

[0043] Example 2: Please refer to Figure 1 , Figure 8 , Fig. 9 and Fig.10The present invention provides a technical solution: a dry etching device for circular wafers. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. The loading and unloading mechanism 2 also includes a loading and unloading unit 22, which is located above the support frame 11. The loading and unloading unit 22 is used in conjunction with the feeding unit 21. The loading and unloading unit 22 is used to transport and store the etched circular wafers.

[0044] As a further limitation of the loading and unloading mechanism 2 of the present invention, the unloading unit 22 includes a U-shaped frame 2201, the bottom surface of the U-shaped frame 2201 is fixedly connected to the upper surface of the support frame 11, the inner side wall of the U-shaped frame 2201 is rotatably connected to the second roller 2202, the inner side wall of the support frame 11 is rotatably connected to the third roller 2203, the outer surfaces of the second roller 2202 and the third roller 2203 are jointly transmission-connected to the second conveyor belt 2204, the inner wall of the U-shaped frame 2201 is rotatably connected to the outer surfaces of two threaded screws 2108, the outer surface of the second conveyor belt 2204 is fixedly installed with equidistantly arranged storage plates 2205, the outer surface of one of the threaded screws 2108 is fixedly installed with a limiting frame 2206, the inner wall of the limiting frame 2206 is rotatably hinged with three second arc plates 2207, and the outer surface of the limiting frame 2206 is fixedly installed There are three third force springs 2208, and one end of each third force spring 2208 close to the second arc plate 2207 is fixedly connected to a side surface of the second arc plate 2207 close to the third force spring 2208. The inner wall of the support frame 11 is rotatably connected to the second gear 2209 through a rotating shaft. The outer surface of one of the second arc plates 2207 contacts the outer surface of the second gear 2209, and the outer surface of the second gear 2209 is meshed with a third gear 2210. The outer surface of the third gear 2210 is rotatably connected to the inner wall of the support frame 11 through a rotating shaft. A worm 2211 is fixedly installed on the back of the third gear 2210, and one end of the worm 2211 is rotatably connected to the inner wall of the support frame 11, and a worm wheel 2212 is meshed on the outer surface of the worm 2211. The left side of the worm wheel 2212 is fixedly connected to the right end of the third roller shaft 2203.

[0045] See also Figure 8 and Fig.10 The outer surfaces of the second roller 2202 and the third roller 2203 are fixedly installed with limiting plates 2213, and one side of each limiting plate 2213 is in contact with the outer surface of the second conveyor belt 2204. By setting the limiting plates 2213, the second conveyor belt 2204 can be limited, thereby preventing the second conveyor belt 2204 from moving on the second roller 2202 and the third roller 2203, thereby ensuring the smooth rotation of the second conveyor belt 2204.

[0046] See also Figure 8A protection box 2125 is fixedly installed on the front of the U-shaped frame 2201, and the inner bottom wall of the protection box 2125 is fixedly connected to the bottom surface of the stepper motor 2116. The protection box 2125 can support and protect the stepper motor 2116, thereby preventing the stepper motor 2116 from shaking or deviating during operation, thereby ensuring the normal operation of the stepper motor 2116.

[0047] The specific implementation of this embodiment is as follows: when the etching of the circular wafer is completed, the electric telescopic rod 12 drives the etching device body 13 to move upward, the electrostatic adsorption disk 15 stops working, the stepping motor 2116 drives the threaded screw 2108 to rotate clockwise, the height of the L-shaped frame 2110 is consistent with the height of the electrostatic adsorption disk 15, the rubber strip 2111 can increase the friction between the L-shaped frame 2110 and the circular wafer, so that the L-shaped frame 2110 drives the etched circular wafer to move toward the U-shaped frame 2201, the clockwise rotation of the threaded screw 2108 can drive the limit frame 2206 to rotate clockwise, so that the second arc plate 2207 can drive the second gear 2209 to rotate, the rotation of the second gear 2209 can drive the third gear 2210 to rotate, and the rotation of the third gear 2210 can drive the worm 2 211 rotates, the rotation of the worm 2211 can drive the worm wheel 2212 to rotate, the rotation of the worm wheel 2212 can drive the third roller 2203 to rotate, so that the second conveyor belt 2204 can drive the storage plate 2205 to move, and when the L-shaped frame 2110 drives the circular wafer to move to the second conveyor belt 2204, the storage plate 2205 just lifts the etched circular wafer placed on the L-shaped frame 2110 upward, so that the storage plate 2205 can store the etched circular wafer, and when the threaded screw 2108 rotates counterclockwise, the arc surface of the second arc plate 2207 contacts the second gear 2209, and the elastic force provided by the third force spring 2208 can buffer the second arc plate 2207, so that the second arc plate 2207 will not drive the first gear 2120 to rotate.

[0048] Example 3: Please refer to Figure 1 , Figure 2 and Figure 3 The present invention provides a technical solution: a dry etching device for circular wafers. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. A cleaning mechanism 3 is arranged above the support frame 11. The cleaning mechanism 3 is used in conjunction with the loading and unloading mechanism 2. The cleaning mechanism 3 is used to clean the circular wafer.

[0049] As a further limitation of the cleaning mechanism 3 of the present invention, the cleaning mechanism 3 includes an ultrasonic cleaning box 301, the bottom surface of the ultrasonic cleaning box 301 is fixedly connected to the upper surface of the support frame 11, two support plates 302 are fixedly installed on the inner wall of the ultrasonic cleaning box 301, and a second electromagnet 303 is fixedly installed on the upper surface of each support plate 302. A drying box 304 is fixedly installed on the upper surface of the support frame 11, and electric thermal resistance wires 305 are fixedly installed on the inner top wall and the inner bottom wall of the drying box 304.

[0050] See also Figure 3 The front of the ultrasonic cleaning box 301 is fixedly connected with a liquid outlet pipe 306, and the outer surface of the liquid outlet pipe 306 is sleeved with a sealing cover 307. By setting the liquid outlet pipe 306, the cleaning solution inside the ultrasonic cleaning box 301 can be discharged outward, so as to facilitate the replacement of the cleaning solution. The sealing cover 307 can seal the liquid outlet pipe 306 to prevent the cleaning solution from being automatically discharged.

[0051] The specific implementation of this embodiment is as follows: a cleaning solution for cleaning circular wafers can be placed inside the ultrasonic cleaning box 301. When the circular wafer moves into the ultrasonic cleaning box 301, the second electromagnet 303 can adsorb the mounting rack 2106 downward, so that the circular wafer can enter the cleaning solution. The circular wafer can be cleaned by ultrasonic vibration cleaning. After cleaning, the circular wafer can follow the mounting rack 2106 to move into the drying box 304. The heat provided by the electric thermal resistance wire 305 can be used to dry the cleaned circular wafer, thereby preventing the solution from adhering to the surface of the circular wafer and affecting etching. Therefore, there is no need to clean and place the circular wafer separately, thereby reducing the labor intensity of the staff and increasing the efficiency of circular wafer etching.

[0052] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0053] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dry etching device for circular wafers, comprising a main body (1), characterized in that: The main mechanism (1) comprises a support frame (11), a connecting frame (16) is fixedly mounted on the upper surface of the support frame (11), an electric telescopic rod (12) is fixedly mounted on the inner top wall of the connecting frame (16), an etching device body (13) is fixedly mounted on the telescopic end of the electric telescopic rod (12), an etching table (14) is fixedly mounted on the upper surface of the support frame (11), an electrostatic adsorption plate (15) is fixedly mounted on the upper surface of the etching table (14), and a loading and unloading mechanism (2) is arranged on the outer side of the support frame (11); The loading and unloading mechanism (2) comprises a feeding unit (21), the feeding unit (21) is located outside the support frame (11), and the feeding unit (21) is used to transport and load circular wafers; The loading and unloading mechanism (2) further comprises a loading unit (22), the loading unit (22) being located above the support frame (11), the loading unit (22) being used in conjunction with the feeding unit (21), and the loading unit (22) being used to transport and store the etched circular wafers; A cleaning mechanism (3) is arranged above the support frame (11), and the cleaning mechanism (3) is used in conjunction with the loading and unloading mechanism (2), and the cleaning mechanism (3) is used to clean and dry the surface of the circular wafer before etching; The feeding unit (21) comprises a conveying frame (2101), the front side of the conveying frame (2101) is fixedly connected to the back side of the support frame (11), the inner wall of the conveying frame (2101) is rotatably connected to two first rollers (2102), the outer surfaces of the two first rollers (2102) are jointly transmission-connected to a first conveyor belt (2103), the outer surface of the first conveyor belt (2103) is in contact with the inner wall of the conveying frame (2101), and the outer surface of the first conveyor belt (2103) is fixedly installed with rectangular frames (2104) arranged at equal distances, the inner wall of each of the rectangular frames (2104) is slidably connected to a placing frame (2106), and the bottom surface of each of the placing frames (2106) is fixedly installed with a first conveyor belt (2103). A first force-bearing spring (2105) is installed, and the bottom end of each of the first force-bearing springs (2105) is fixedly connected to the inner bottom wall of the rectangular frame (2104); two fixing frames (2107) are fixedly installed on the upper surface of the support frame (11); the inner wall of each of the fixing frames (2107) is rotatably connected to a threaded screw (2108); the inner wall of each of the fixing frames (2107) is slidably connected to a movable block (2109); the inner wall of each of the movable blocks (2109) is threadedly connected to the outer surface of the threaded screw (2108); an L-shaped frame (2110) is fixedly installed on one side of each of the movable blocks (2109); and a rubber strip (2110) is fixedly installed on the upper surface of each of the L-shaped frames (2110). 2111), two fixing plates (2112) are fixedly mounted on the upper surface of the support frame (11), and a first electromagnet (2113) is fixedly mounted on the upper surface of each fixing plate (2112), a gear belt (2114) is arranged above the support frame (11), and two rotating gears (2115) are meshed on the inner wall of the gear belt (2114), and a stepping motor (2116) is arranged on the outer side of the gear belt (2114), and the output end of the power of the stepping motor (2116) is fixedly connected to the front side of one of the rotating gears (2115), and the back side of each of the rotating gears (2115) is fixedly connected to one end of the threaded screw (2108), and one of the threaded screws (21108) is fixedly connected to the front side of the rotating gears (2115). 08) is fixedly mounted with a rotating frame (2117) at one end, the outer surface of the rotating frame (2117) is rotatably connected to the inner wall of the fixed frame (2107), the inner wall of the rotating frame (2117) is rotatably hinged with three first arc plates (2118), the outer surface of the rotating frame (2117) is fixedly mounted with three second force springs (2119), one end of each of the second force springs (2119) close to the first arc plate (2118) is fixedly connected to a side surface of the first arc plate (2118), the inner wall of the conveying frame (2101) is rotatably connected with a first gear (2120), the outer surface of one of the first arc plates (2118) is in contact with the outer surface of the first gear (2120),A first bevel gear (2121) is fixedly mounted on the back of the first gear (2120), a second bevel gear (2122) is meshed on the outer surface of the first bevel gear (2121), a support rod (2123) is fixedly mounted on the inner wall of the second bevel gear (2122), and the top end of the support rod (2123) is fixedly connected to the bottom end of one of the first roller shafts (2102); The unloading unit (22) comprises a U-shaped frame (2201), the bottom surface of the U-shaped frame (2201) is fixedly connected to the upper surface of the support frame (11), the inner side wall of the U-shaped frame (2201) is rotatably connected to a second roller (2202), the inner side wall of the support frame (11) is rotatably connected to a third roller (2203), the outer surfaces of the second roller (2202) and the third roller (2203) are jointly transmission-connected to a second conveyor belt (2204), and the U-shaped frame The inner wall of (2201) is rotatably connected to the outer surfaces of the two threaded screws (2108); the outer surface of the second conveyor belt (2204) is fixedly installed with storage plates (2205) arranged at equal distances; the outer surface of one of the threaded screws (2108) is fixedly installed with a limit frame (2206); the inner wall of the limit frame (2206) is rotatably hinged with three second arc plates (2207); the outer surface of the limit frame (2206) is fixedly installed with three third force springs (2208), one end of each of the third force-bearing springs (2208) close to the second arc-shaped plate (2207) is fixedly connected to a side surface of the second arc-shaped plate (2207) close to the third force-bearing spring (2208), and the inner wall of the support frame (11) is rotatably connected to a second gear (2209) via a rotating shaft, wherein the outer surface of one of the second arc-shaped plates (2207) contacts the outer surface of the second gear (2209), and the outer surface of the second gear (2209) meshes with the outer surface of the second gear (2209). A third gear (2210) is provided, the outer surface of the third gear (2210) being rotatably connected to the inner wall of the support frame (11) via a rotating shaft, a worm (2211) being fixedly mounted on the back of the third gear (2210), one end of the worm (2211) being rotatably connected to the inner wall of the support frame (11), a worm wheel (2212) being meshed on the outer surface of the worm (2211), and a left side surface of the worm wheel (2212) being fixedly connected to the right end of the third roller shaft (2203); The cleaning mechanism (3) comprises an ultrasonic cleaning box (301), the bottom surface of the ultrasonic cleaning box (301) being fixedly connected to the upper surface of the support frame (11), two support plates (302) being fixedly mounted on the inner wall of the ultrasonic cleaning box (301), a second electromagnet (303) being fixedly mounted on the upper surface of each support plate (302), a drying box (304) being fixedly mounted on the upper surface of the support frame (11), and electric heating resistance wires (305) being fixedly mounted on the inner top wall and inner bottom wall of the drying box (304).

2. A circular wafer dry etching device according to claim 1, characterized in that: A bearing (2124) is fixedly mounted on the bottom end of the support rod (2123), and the bottom surface of the bearing (2124) is fixedly connected to the inner bottom wall of the conveying frame (2101).

3. The dry etching device for circular wafer according to claim 1, characterized in that: Four first supporting legs (2126) are fixedly mounted on the bottom surface of the conveying frame (2101), and a first grounding plate (2127) is fixedly mounted on the bottom end of each of the first supporting legs (2126).

4. The dry etching device for circular wafer according to claim 1, characterized in that: Two second supporting legs (2128) are fixedly mounted on the bottom surface of the supporting frame (11), and a second grounding plate (2129) is fixedly mounted on the bottom end of each second supporting leg (2128).

5. The dry etching device for circular wafer according to claim 1, characterized in that: Limiting plates (2213) are fixedly mounted on the outer surfaces of the second roller (2202) and the third roller (2203), and one side surface of each of the limiting plates (2213) is in contact with the outer surface of the second conveyor belt (2204).

6. The dry etching device for circular wafer according to claim 1, characterized in that: A protection box (2125) is fixedly mounted on the front of the U-shaped frame (2201), and an inner bottom wall of the protection box (2125) is fixedly connected to the bottom surface of the stepping motor (2116).

7. The dry etching device for circular wafer according to claim 1, characterized in that: The front side of the ultrasonic cleaning box (301) is fixedly connected to a liquid outlet pipe (306), and the outer surface of the liquid outlet pipe (306) is sleeved with a sealing cover (307).

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