Automatic sorting machine for chip inspection finished products and sorting process thereof

Abstract

The invention discloses an automatic sorting machine for finished chip detection and a sorting process thereof, which relates to the technical field of sorting machines, and comprises a bottom plate, wherein the top of the bottom plate is fixedly connected with a box body, the interior of the box body is provided with a sound insulation device for improving the detection effect, the interior of the box body is provided with a control device for controlling the detection time, and a telescopic device is fixedly connected with a side of the bottom plate close to the box body. When a chip frame brings the chip into a sonic wave detection slot, after the chip frame slides to a detection position and is fixed, a push plate continues to slide under the pushing action of an electric telescopic rod, so that the gas inside the piston slot is compressed when a connecting piston plate slides inside the piston slot, so that the gas enters the air pressure sliding slot through the ventilation slot, and pushes a lower sliding frame to slide downward to block the sonic wave detection slot, thereby avoiding the problem that the detection environment is not sealed. By sealing the environment, the interference of external environmental noise on the sonic wave detection can be effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of sorting machines, and in particular to an automatic sorting machine for detecting finished chips and a sorting process thereof. Background Art

[0002] A sorting machine is a device that uses advanced technology to automatically detect and sort items. It detects defects, contamination, damage and other problems on items based on sensing equipment to achieve fast and accurate sorting of items. Automatic sorting of items can maintain highly consistent performance and judgment standards to ensure product consistency and stability.

[0003] There are still many inconveniences in the use of current equipment;

[0004] The specific defects are as follows:

[0005] ① First, in the process of using acoustic wave sensors to detect chip defects, contamination, damage and other problems, since the detection environment is not closed, there are various noise sources around, such as the sound of mechanical operation, human voice, running water, etc. These noises have a large frequency span and propagate at different frequencies, which may overlap with the acoustic wave signal and interfere with the acoustic wave detection signal, reducing the accuracy and reliability of the detection. In addition, in a non-closed environment, the acoustic wave signal may undergo multiple reflections and refractions to form multiple propagation paths, thereby causing signal interference and superposition, resulting in errors in the detection results.

[0006] ② Secondly, in the process of using acoustic wave sensors to detect chip defects, contamination, damage and other problems, a large amount of data collection and processing is required, including the acquisition, analysis and interpretation of acoustic wave signals, which takes a long time. When the detection time is insufficient, the automatic sorting machine may not be able to fully and carefully detect and analyze each chip, resulting in the neglect of some minor defects or damages, thus affecting the quality and reliability of the product;

[0007] Therefore, the present invention proposes an automatic sorting machine for chip inspection finished products and a sorting process thereof to make up for and improve the deficiencies of the prior art. Summary of the invention

[0008] 1. Technical issues to be resolved

[0009] In view of the shortcomings of the prior art, such as the lack of sealing of the detection environment and insufficient detection time, the present invention provides an automatic sorting machine for chip detection finished products, which can effectively solve the above technical problems.

[0010] (II) Technical solution

[0011] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0012] The present invention discloses an automatic sorting machine for finished chip detection, comprising a bottom plate, a box body fixedly connected to the top of the bottom plate, a sound insulation device for improving detection effect arranged inside the box body, and a control device for controlling detection time arranged inside the box body.

[0013] Preferably, a telescopic device is fixedly connected to one side of the bottom plate close to the box body, an electric telescopic rod is fixedly connected to the one side of the telescopic device close to the box body, a telescopic device is provided at one end of the bottom plate away from the box body, a chip conveyor belt is provided on the right side of the bottom plate, the chip conveyor belt is located between the box body and the telescopic device, a separation conveyor belt is provided on the left side of the bottom plate, and the separation conveyor belt is located at the end of the bottom plate away from the telescopic device.

[0014] Preferably, the lower surface of the chip conveyor belt is at the same height as the upper surface of the bottom plate, and the upper surface of the separation conveyor belt is at the same height as the lower surface of the bottom plate.

[0015] Preferably, the sound insulation device includes a detection channel opened at the bottom of the box body, a sound wave detection groove is opened inside the box body, the detection channel is communicated with the sound wave detection groove, a push plate is slidably connected inside the detection channel, the push plate is fixedly connected to the electric telescopic rod, a piston groove is opened inside the push plate, a connecting piston plate is slidably connected inside the piston groove, a chip frame is slidably connected inside the sound wave detection groove, the chip frame is fixedly connected to the connecting piston plate, a sound wave detection groove is opened inside the box body, a sound wave sensor is fixedly connected to the top inner wall of the sound wave detection groove, a frame sliding groove is opened inside the box body, the frame sliding groove is communicated with the sound wave detection groove, a sliding frame is slidably connected inside the frame sliding groove, the sliding frame is in an inverted U-shape with an opening downward, and a frame card slot is opened at one end of the sliding frame close to the chip conveyor belt.

[0016] Preferably, the inner wall of the frame slot is in contact with the surface of the connecting piston plate.

[0017] Preferably, the control device includes a piston vent hole provided inside the connecting piston plate, the piston vent hole connects the piston groove and the detection channel, a vent groove is provided inside the box body, a vent outer frame is fixedly connected to the top of the connecting piston plate, an inner frame sliding groove is fixedly connected to the inside of the vent outer frame, a telescopic spring is fixedly connected to the bottom of the inner wall of the inner frame sliding groove, a vent inner frame is slidably connected to the inside of the inner frame sliding groove, the outer surface of the top of the vent inner frame is circular, the bottom of the vent inner frame is fixedly connected to the telescopic spring, the vent inner frame extends into the vent groove, a connecting channel is provided inside the vent inner frame, The pneumatic sliding groove is connected to the detection channel through the ventilation groove, and the connecting channel connects the ventilation groove and the piston vent hole. A pneumatic sliding groove is provided inside the box body, and the pneumatic sliding groove connects the ventilation groove and the frame sliding groove. A connecting sliding groove is provided on the upper surface of the sliding frame, and the connecting sliding groove penetrates the sliding frame. The pneumatic sliding groove is slidingly connected to the pneumatic sliding block inside, and the bottom of the pneumatic sliding block is fixedly connected to the connecting sliding plate, and the connecting sliding plate passes through the connecting sliding groove and enters the sliding frame. The end of the connecting sliding plate away from the pneumatic sliding block is fixedly connected to a supporting sliding plate, and a sliding plate groove is provided at the bottom of the inner wall of the frame sliding groove.

[0018] Preferably, support block slots are provided on both sides of the inner wall of the pneumatic sliding slot, a rebound spring is fixedly connected inside the support block slot, a support block is slidably connected inside the support block slot, and the support block is fixedly connected to one end of the rebound spring.

[0019] The chip detection finished product sorting process using an automatic sorting machine for chip detection finished products as described above includes the following steps:

[0020] S1, chip supply step, supplying the finished chips to be sorted into the automatic sorting machine, and inspecting them one by one using a conveying device;

[0021] S2, chip detection step, through the sound wave detection information, the sound wave detection will analyze and identify the shape, size and other characteristics of the chip according to the preset parameters and standards, so as to detect the possible defects, pollution, damage and other problems on the chip, and transmit the detected information to the classification equipment, which analyzes and processes the information and classifies the products according to the information;

[0022] S3, chip classification step, according to the detected defects or standards, the automatic sorting machine will classify the chips into qualified and unqualified products. When the detection information is transmitted to the classification equipment, qualified and unqualified products enter the sorting channel together. Qualified products can continue to flow into the next process, and unqualified products will swing under the swing arm controlled by the ultrasonic detection sensor, and thus be brought into the unqualified product conveyor belt for unified collection. Qualified products can continue to flow into the next process on the sorting conveyor belt.

[0023] Preferably, the acoustic wave detection sensor transmits information about the detected qualified products and unqualified products through wireless signals, and the classification device classifies the qualified products and unqualified products after receiving the wireless signals.

[0024] Preferably, after the chip sorting is completed, performance testing of unqualified products is required to distinguish whether the unqualified chips are discarded or repaired.

[0025] (III) Beneficial effects

[0026] Compared with the known public technology, the technical solution provided by the present invention has the following beneficial effects:

[0027] 1. The present invention uses a telescopic device in conjunction with a sound insulation device. When the chip enters the acoustic wave detection slot, it is fixed. The push plate continues to slide under the push of the electric telescopic rod, thereby compressing the air inside the piston slot, allowing the gas to enter the air pressure sliding slot through the ventilation slot. Under the push of the air pressure, the air pressure sliding block slides downward, thereby driving the sliding frame to slide downward to block the acoustic wave detection slot, thereby avoiding the problem of the detection environment not being sealed. By sealing the environment, the interference of external environmental noise on the acoustic wave detection can be effectively reduced. In addition, in a closed environment, the acoustic wave propagation path is relatively single, and there is no multi-path propagation interference problem caused by multiple reflections and refractions.

[0028] 2. The present invention uses a sound insulation device in conjunction with a control device. When the sliding frame completely slides downward to block the acoustic wave detection slot, the air pressure sliding block continues to slide downward to make the supporting sliding plate slide downward into the sliding plate slot. When the electric telescopic rod begins to retract, the air inside the air pressure sliding slot is drawn back, and the air pressure sliding block slides upward. Driven by the air pressure sliding block, the top of the supporting sliding plate fits with the sliding frame, driving the sliding frame to slide upward. The fitting process of the top of the supporting sliding plate and the sliding frame provides sufficient time for the acoustic wave sensor to detect the chip, thereby avoiding the disadvantage of insufficient detection time for the acoustic wave sensor to detect the chip. Sufficient detection time allows the automatic sorting machine to perform more in-depth detection and analysis on each chip, including subtle defects and problems, thereby improving the accuracy and coverage of defect detection and ensuring that all defective chips are sorted.

[0029] 3. The present invention uses a chip frame in conjunction with an electric telescopic rod. When the chip frame slides back under the pulling force of the electric telescopic rod, the end of the chip frame close to the separation conveyor belt is openable in one direction. Under the action of friction, the end of the chip frame close to the separation conveyor belt opens, and the detected chip will remain in the acoustic wave detection slot until the next chip is detected. The detected chip will be pushed out of the acoustic wave detection slot for sorting under the push of the chip frame, thereby avoiding the problem of contamination of the chip caused by manual delivery of the detected chip for sorting. Automating the chip detection and sorting process can greatly improve work efficiency. Automatic delivery for sorting can ensure that the chip enters the sorting link immediately after the detection is completed, reducing manual intervention and waiting time. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The invention is further described with respect to embodiments illustrated with the aid of the following drawings, in which:

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0033] Figure 3 It is a schematic diagram of the overall structure of the sound insulation device of the present invention;

[0034] Figure 4 For the present invention Figure 3 A partial enlarged view of middle A;

[0035] Figure 5 It is a schematic diagram of the overall structure of the control device of the present invention;

[0036] Figure 6 For the present invention Figure 5 A partial enlarged view of B in the middle;

[0037] Figure 7 It is a schematic diagram of the working state of the present invention.

[0038] The numbers in the figure represent:

[0039] 1. Bottom plate; 2. Box body; 3. Telescopic device; 4. Electric telescopic rod; 5. Chip conveyor belt; 6. Separation conveyor belt;

[0040] 7. Soundproofing device; 701. Pushing plate; 702. Piston groove; 703. Connecting piston plate; 704. Chip frame; 705. Sound wave sensor; 706. Frame sliding groove; 707. Sliding frame; 708. Detection channel; 709. Frame card slot; 710. Sound wave detection slot;

[0041] 8. Control device; 801. Ventilation groove; 802. Ventilation outer frame; 803. Inner frame sliding groove; 804. Telescopic spring; 805. Ventilation inner frame; 806. Connecting channel; 807. Air pressure sliding groove; 808. Air pressure sliding block; 809. Connecting sliding plate; 810. Connecting sliding groove; 811. Support sliding plate; 812. Support block slot; 813. Rebound spring; 814. Support block; 815. Piston vent; 816. Sliding plate slot. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0043] The present invention will be further described below in conjunction with the embodiments.

[0044] Embodiments of the present invention

[0045] An automatic sorting machine for chip inspection of finished products in this embodiment, such as Figure 1-7 As shown, it includes a base plate 1, the top of the base plate 1 is fixedly connected to a box body 2, the interior of the box body 2 is provided with a sound insulation device 7 for improving the detection effect, the interior of the box body 2 is provided with a control device 8 for controlling the detection time, the side of the base plate 1 close to the box body 2 is fixedly connected to a telescopic device 3, the side of the telescopic device 3 close to the box body 2 is fixedly connected to an electric telescopic rod 4, the end of the base plate 1 away from the box body 2 is provided with the telescopic device 3, a chip conveyor belt 5 is provided on the right side of the base plate 1, the chip conveyor belt 5 is located between the box body 2 and the telescopic device 3, a separation conveyor belt 6 is provided on the left side of the base plate 1, the separation conveyor belt 6 is located at the end of the base plate 1 away from the telescopic device 3, the lower surface of the chip conveyor belt 5 is at the same height as the upper surface of the base plate 1, and the upper surface of the separation conveyor belt 6 is at the same height as the lower surface of the base plate 1, so that the chip can smoothly enter the chip frame 704.

[0046] The sound insulation device 7 includes a detection channel 708 opened at the bottom of the box body 2, a sound wave detection groove 710 is opened inside the box body 2, the detection channel 708 is communicated with the sound wave detection groove 710, the detection channel 708 is internally slidably connected with a push plate 701, the push plate 701 is fixedly connected to the electric telescopic rod 4, a piston groove 702 is opened inside the push plate 701, the piston groove 702 is internally slidably connected with a connecting piston plate 703, the detection channel 708 is internally slidably connected with a chip frame 704, the chip frame 704 is fixedly connected with the connecting piston plate 703, the box body 2 is internally opened with a sound wave detection groove 710, the top inner wall of the sound wave detection groove 710 is fixedly connected with a sound wave sensor 705, the box body 2 is internally opened with a frame sliding groove 706, the frame sliding groove 706 is communicated with the sound wave detection groove 710, the frame sliding groove 706 is internally slidably connected with a sliding frame 707, the sliding frame 707 is an inverted U-shape with an opening downward, and a frame card slot 709 is provided at one end of the sliding frame 707 close to the chip conveyor belt 5. When the chip frame 704 carries the chip into the acoustic wave detection slot 710, after the chip frame 704 slides to the detection position and is fixed, the push plate 701 continues to slide under the push of the electric telescopic rod 4, so that the connecting piston plate 703 slides inside the piston slot 702. When the connecting piston plate 703 slides inside the piston slot 702, the gas inside the piston slot 702 is compressed, so that the gas enters the air pressure sliding slot 807 through the ventilation slot 801. Under the push of the air pressure, the air pressure sliding block 808 slides downward, thereby driving the sliding frame 707 to slide downward to block the acoustic wave detection slot 710. The inner wall of the frame card slot 709 fits with the surface of the connecting piston plate 703, so that when the frame card slot 709 falls, a closed space is formed inside the acoustic wave detection slot 710.

[0047] The control device 8 includes a piston vent hole 815 provided inside the connecting piston plate 703, the piston vent hole 815 connects the piston groove 702 and the detection channel 708, a vent groove 801 is provided inside the box body 2, a vent outer frame 802 is fixedly connected to the top of the connecting piston plate 703, an inner frame sliding groove 803 is fixedly connected to the inner part of the vent outer frame 802, a telescopic spring 804 is fixedly connected to the bottom of the inner wall of the inner frame sliding groove 803, a vent inner frame 805 is slidably connected to the inner part of the inner frame sliding groove 803, the bottom of the vent inner frame 805 is fixedly connected to the telescopic spring 804, the vent inner frame 805 extends into the vent groove 801, a connecting channel 806 is provided inside the vent inner frame 805, and the connecting channel 806 connects the vent groove 801 and the piston vent hole 815, the interior of the box body 2 is provided with an air pressure sliding groove 807, the air pressure sliding groove 807 is communicated with the detection channel 708 through the vent groove 801, the air pressure sliding groove 807 connects the vent groove 801 and the frame sliding groove 706, the upper surface of the sliding frame 707 is provided with a connecting sliding groove 810, the connecting sliding groove 810 penetrates the sliding frame 707, the air pressure sliding groove 807 is internally slidably connected to the air pressure sliding block 808, the bottom of the air pressure sliding block 808 is fixedly connected to the connecting sliding plate 809, the connecting sliding plate 809 passes through the connecting sliding groove 810 and enters the interior of the sliding frame 707, the end of the connecting sliding plate 809 away from the air pressure sliding block 808 is fixedly connected to the supporting sliding plate 811, the interior of the box body 2 A sliding plate groove 816 is provided in the part. When the sliding frame 707 completely slides downward to block the acoustic wave detection groove 710, the piston groove 702 has not yet slid to the top of the connecting piston plate 703, thereby pushing the air pressure sliding block 808 to continue to slide downward, so that the supporting sliding plate 811 supporting the sliding frame 707 slides downward into the sliding plate groove 816. When the electric telescopic rod 4 begins to retract, the connecting piston plate 703 begins to slide inside the piston groove 702 toward the end close to the box body 2, and the air inside the air pressure sliding groove 807 is sucked back, and the air pressure sliding block 808 slides upward by reducing the air pressure inside the air pressure sliding groove 807. Since the top of the supporting sliding plate 811 is not in contact with the sliding frame 707, the air pressure sliding block 808 Driven by this, the top of the support sliding plate 811 is fitted with the sliding frame 707, thereby driving the sliding frame 707 to slide upward, and the fitting process of the top of the support sliding plate 811 and the sliding frame 707 provides enough time for the sound wave sensor 705 to detect the chip, support block slots 812 are provided on both sides of the inner wall of the air pressure sliding groove 807, and a rebound spring 813 is fixedly connected inside the support block slot 812, and a support block 814 is slidably connected inside the support block slot 812, and the support block 814 is fixedly connected to one end of the rebound spring 813, limiting the air pressure sliding block 808 to be located at the top of the air pressure sliding groove 807 when not working, and the outer surface of the top of the ventilation inner frame 805 is circular, limiting the chip frame 704 to reach a suitable position.

[0048] The chip detection finished product sorting process using an automatic sorting machine for chip detection finished products as described above includes the following steps:

[0049] S1, chip supply step, supplying the finished chips to be sorted into the automatic sorting machine, and inspecting them one by one using a conveying device;

[0050] S2, chip detection step, through the sound wave detection information, the sound wave detection will analyze and identify the shape, size and other characteristics of the chip according to the preset parameters and standards, so as to detect the possible defects, pollution, damage and other problems on the chip, and transmit the detected information to the classification equipment, which analyzes and processes the information and classifies the products according to the information;

[0051] S3, chip classification step, according to the detected defects or standards, the automatic sorting machine will classify the chips into qualified and unqualified products. When the detection information is transmitted to the classification equipment, qualified and unqualified products enter the sorting channel together. Qualified products can continue to flow into the next process, and unqualified products will swing under the swing arm controlled by the ultrasonic detection sensor, and thus be brought into the unqualified product conveyor belt for unified collection. Qualified products can continue to flow into the next process on the sorting conveyor belt.

[0052] The ultrasonic detection sensor transmits the information about the qualified and unqualified products through wireless signals. After receiving the wireless signals, the classification equipment classifies the qualified and unqualified products to control the swing arm for sorting qualified and unqualified products. After the chip sorting is completed, the performance of the unqualified products needs to be tested to distinguish whether the unqualified chips are discarded or repaired and determine the cause of damage.

[0053] The complete working principle of the above embodiment is as follows:

[0054] During operation, after the chip enters the chip frame 704, the electric telescopic rod 4 pushes the push plate 701 to slide into the detection channel 708. When the push plate 701 enters the detection channel 708, since the outer surface of the top of the ventilation inner frame 805 is circular, the ventilation inner frame 805 is in a compressed state under the pressure of the box body 2, and the chip frame 704 will enter the acoustic wave detection groove 710 under the push of the connecting piston plate 703, until the ventilation inner frame 805 enters the ventilation groove 801 and the chip frame 704 reaches the specified position. After the chip frame 704 slides to the detection position and is fixed, The pushing plate 701 continues to slide under the push of the electric telescopic rod 4, so that the connecting piston plate 703 slides inside the piston groove 702. When the connecting piston plate 703 slides inside the piston groove 702, the gas inside the piston groove 702 will be compressed, so that the gas enters the air pressure sliding groove 807 through the ventilation groove 801. Under the push of air pressure, the air pressure sliding block 808 slides downward, thereby driving the sliding frame 707 to slide downward and cover the top of the chip frame 704, avoiding the problem of the detection environment not being sealed. By making the environment airtight, the interference of external environmental noise on sound wave detection can be effectively reduced.

[0055] When the sliding frame 707 completely slides downward to cover the chip frame 704, the connecting piston plate 703 has not yet slid to the piston groove 702 near the end of the telescopic device 3, thereby pushing the air pressure sliding block 808 to continue to slide downward, so that the supporting sliding plate 811 of the supporting sliding frame 707 slides downward into the sliding plate groove 816. When the electric telescopic rod 4 begins to retract, the connecting piston plate 703 begins to slide inside the piston groove 702 toward the end near the box body 2, and the air inside the air pressure sliding groove 807 is sucked back, and the air pressure sliding block 808 slides upward by reducing the air pressure inside the air pressure sliding groove 807. Since the top of the supporting sliding plate 811 is not in contact with the sliding frame 707, the sliding frame 707 has no supporting sliding plate 811 to provide the upward sliding force. Driven by the air pressure sliding block 808, The top of the supporting sliding plate 811 fits with the sliding frame 707, thereby driving the sliding frame 707 to slide upward, and the fitting process of the top of the supporting sliding plate 811 and the sliding frame 707 provides sufficient time for the acoustic wave sensor 705 to detect the chip. When the chip detection is completed, the electric telescopic rod 4 retracts, and the chip frame 704 slides back under the pulling force of the electric telescopic rod 4. Since the end of the chip frame 704 close to the separation conveyor belt 6 is one-way openable, under the action of friction, the end of the chip frame 704 close to the separation conveyor belt 6 opens, and the detected chip will remain in the acoustic wave detection slot 710 until the next chip is detected. The detected chip will be squeezed out of the acoustic wave detection slot 710 for sorting under the push of the chip frame 704, avoiding the problem of manually sending the detected chips for sorting, thereby causing contamination of the chips.

[0056] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automatic sorting machine for chip inspection finished products, comprising a bottom plate (1), the top of the bottom plate (1) being fixedly connected to a box body (2), characterized in that: A sound insulation device (7) for improving the detection effect is arranged inside the box (2), and a control device (8) for controlling the detection time is arranged inside the box (2); The control device (8) comprises a piston vent hole (815) provided inside the connecting piston plate (703), the piston vent hole (815) communicating with the piston groove (702) and the detection channel (708), a vent groove (801) provided inside the box body (2), a vent outer frame (802) fixedly connected to the top of the connecting piston plate (703), an inner frame sliding groove (803) fixedly connected to the inside of the vent outer frame (802), and an inner wall bottom of the inner frame sliding groove (803) fixedly connected to the inner frame sliding groove (803). A telescopic spring (804) is provided, and a ventilating inner frame (805) is slidably connected inside the inner frame sliding groove (803), the top outer surface of the ventilating inner frame (805) is circular, the bottom of the ventilating inner frame (805) is fixedly connected to the telescopic spring (804), the ventilating inner frame (805) extends into the ventilating groove (801), and a connecting channel (806) is provided inside the ventilating inner frame (805), and the connecting channel (806) connects the ventilating groove (801) and the piston vent hole (815), The box body (2) is provided with an air pressure sliding groove (807) inside, the air pressure sliding groove (807) is communicated with the detection channel (708) through the ventilation groove (801), the air pressure sliding groove (807) connects the ventilation groove (801) and the frame sliding groove (706), the frame sliding groove (706) is slidably connected to the sliding frame (707), the upper surface of the sliding frame (707) is provided with a connecting sliding groove (810), and the connecting sliding groove (810) penetrates the sliding frame (707). 07), the pneumatic sliding groove (807) is internally slidably connected to the pneumatic sliding block (808), the bottom of the pneumatic sliding block (808) is fixedly connected to the connecting sliding plate (809), the connecting sliding plate (809) passes through the connecting sliding groove (810) and enters the interior of the sliding frame (707), the end of the connecting sliding plate (809) away from the pneumatic sliding block (808) is fixedly connected to the supporting sliding plate (811), and the bottom of the inner wall of the frame sliding groove (706) is provided with a sliding plate groove (816); Support block slots (812) are provided on both sides of the inner wall of the air pressure sliding slot (807), a rebound spring (813) is fixedly connected inside the support block slot (812), a support block (814) is slidably connected inside the support block slot (812), and the support block (814) is fixedly connected to one end of the rebound spring (813).

2. The automatic sorting machine for chip inspection finished products according to claim 1, characterized in that: A telescopic device (3) is fixedly connected to the side of the bottom plate (1) close to the box body (2), and an electric telescopic rod (4) is fixedly connected to the side of the telescopic device (3) close to the box body (2). The telescopic device (3) is arranged at the end of the bottom plate (1) away from the box body (2). A chip conveyor belt (5) is arranged on the right side of the bottom plate (1), and the chip conveyor belt (5) is located between the box body (2) and the telescopic device (3). A separation conveyor belt (6) is arranged on the left side of the bottom plate (1), and the separation conveyor belt (6) is located at the end of the bottom plate (1) away from the telescopic device (3).

3. The automatic sorting machine for chip inspection finished products according to claim 2, characterized in that: The lower surface of the chip conveyor belt (5) is at the same height as the upper surface of the bottom plate (1), and the upper surface of the separation conveyor belt (6) is at the same height as the lower surface of the bottom plate (1).

4. The automatic sorting machine for chip inspection finished products according to claim 2, characterized in that: The sound insulation device (7) comprises a detection channel (708) provided at the bottom of the box body (2); a sound wave detection groove (710) is provided inside the box body (2); the detection channel (708) is communicated with the sound wave detection groove (710); a push plate (701) is slidably connected inside the detection channel (708); the push plate (701) is fixedly connected to the electric telescopic rod (4); a piston groove (702) is provided inside the push plate (701); a connecting piston plate (703) is slidably connected inside the piston groove (702); the sound wave A chip frame (704) is slidably connected inside the detection groove (710), and the chip frame (704) is fixedly connected to the connecting piston plate (703). A sound wave sensor (705) is fixedly connected to the top inner wall of the sound wave detection groove (710). A frame sliding groove (706) is provided inside the box body (2), and the frame sliding groove (706) is connected to the sound wave detection groove (710). The sliding frame (707) is in an inverted U-shape with an opening facing downward, and a frame card slot (709) is provided at one end of the sliding frame (707) close to the chip conveyor belt (5).

5. The automatic sorting machine for chip inspection finished products according to claim 4, characterized in that: The inner wall of the frame slot (709) is in contact with the surface of the connecting piston plate (703).

6. A chip inspection finished product sorting process using an automatic sorting machine for chip inspection finished products as described in any one of claims 1 to 5, characterized in that: The steps include: S1, chip supply step, supplying the finished chips to be sorted into the automatic sorting machine, and inspecting them one by one using a conveying device; S2, chip detection step, through the sound wave detection information, the sound wave detection will analyze and identify the shape, size and other characteristics of the chip according to the preset parameters and standards, so as to detect the possible defects, pollution, damage and other problems on the chip, and transmit the detected information to the classification equipment, which analyzes and processes the information and classifies the products according to the information; S3, chip classification step, according to the detected defects or standards, the automatic sorting machine will classify the chips into qualified and unqualified products. When the detection information is transmitted to the classification equipment, qualified and unqualified products enter the sorting channel together. Qualified products can continue to flow into the next process, and unqualified products will swing under the swing arm controlled by the ultrasonic detection sensor, and thus be brought into the unqualified product conveyor belt for unified collection. Qualified products can continue to flow into the next process on the sorting conveyor belt.

7. A chip detection finished product sorting process according to claim 6, characterized in that: The acoustic wave detection sensor transmits the information about the detected qualified products and unqualified products through wireless signals, and the classification device classifies the qualified products and unqualified products after receiving the wireless signals.

8. A chip inspection finished product sorting process according to claim 6, characterized in that: After the chip sorting is completed, it is necessary to perform performance testing on the unqualified products to distinguish whether the unqualified chips should be discarded or repaired.

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