Automatic wafer guide device for ALD equipment

Abstract

The present invention relates to the technical field of automatic wafer guiding, and discloses an automatic wafer guiding device for ALD equipment, comprising a wafer guiding bin, a wafer storage bin, a preheating bin and a reaction bin fixedly connected to the wafer guiding bin, wherein the connection between the wafer guiding bin and the wafer storage bin, the preheating bin and the reaction bin is provided with a wafer guiding port, a wafer rack capable of adjusting the size according to the size of silicon wafers is provided in the wafer storage bin, a plurality of supporting sheets for placing silicon wafers are fixedly mounted on the wafer rack, magnetic strips are fixedly mounted on both sides of the wafer rack, and one end of each magnetic strip is arranged in an arc shape. The automatic wafer guiding device utilizes the attraction of the magnetic strip to the magnetic column to retract the magnetic column into a sliding member, and the card slot releases the limit on the magnetic column, and then after the arc surface of the magnetic column contacts the arc surface of the sliding member, the position of the sliding member is adjusted, and the supporting strip and the supporting block thereon are driven to move, so that the size of the supporting strip and the supporting block matches the size of the silicon wafer, and the silicon wafers of different sizes can be effectively limited.

Description

Technical Field

[0001] The present invention relates to the technical field of automatic wafer guiding, and in particular to an automatic wafer guiding device for ALD equipment. Background Art

[0002] ALD stands for Atomic Layer Deposition, which refers to atomic layer deposition technology. It is a thin film formation technology that uses continuous chemical reactions in the gas phase. It is similar to ordinary chemical deposition, but the chemical reaction of a new layer of atomic film is directly related to the previous layer, so as to ensure that only one layer of atoms is deposited each time. It forms a deposited film by alternately passing gas phase precursor pulses into the reactor and chemically adsorbing and reacting on the deposition substrate. Between the precursor pulses, the atomic layer deposition reactor needs to be cleaned with an inert gas. ALD has a self-limiting surface reaction, which means that when there is no adsorbable site on the surface, the reaction will stop naturally. ALD can control the film thickness and material at the atomic layer level to form an extremely thin and dense film, and the deposited layer has an extremely uniform thickness and excellent consistency.

[0003] Existing ALD equipment is usually equipped with an automatic wafer guide device, that is, an automatic silicon wafer loading and unloading device. With the advancement of technology, the sizes of silicon wafers are increasing. When silicon wafers of different batches are loaded and unloaded using the same size tray, the tray's supporting area is limited, and the machine may stop and start suddenly when driving the tray to move. As a result, the tray may not support the silicon wafer stably, and the silicon wafer may deviate when placed in the reaction chamber, causing the silicon wafer to wear or even break. For this reason, we propose an automatic wafer guide device for ALD equipment. Summary of the invention

[0004] The object of the present invention is to provide an automatic wafer guiding device for ALD equipment to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: an automatic wafer guide device for ALD equipment, comprising a wafer guide bin, a wafer storage bin, a preheating bin and a reaction bin fixedly connected to the wafer guide bin, a wafer guide port is provided at the connection between the wafer guide bin and the wafer storage bin, the preheating bin and the reaction bin, a wafer rack whose size can be adjusted according to the size of silicon wafers is provided in the wafer storage bin, a plurality of support sheets for placing silicon wafers are fixedly installed on the wafer rack, magnetic strips are fixedly installed on both sides of the wafer rack, and one end of each magnetic strip is arranged in an arc shape;

[0006] An electric turntable is fixedly installed in the guide film bin, a telescopic cylinder is fixedly installed on the electric turntable, a slide rail is fixedly installed on the output end of the telescopic cylinder, two sliding parts are symmetrically slidably installed in the slide rail, one end of each sliding part is also arranged in an arc shape, and the radius of the arc is larger than the radius of the arc at the end of the magnetic strip, a magnetic column attracted to the magnetic strip is slidably installed in each sliding part, a third spring is fixedly connected between one end of each magnetic column and the corresponding sliding part, a plurality of slots for limiting the magnetic column are arranged on the inner wall of the slide rail, a supporting bar is fixedly installed on each sliding part through an electric telescopic column, and a supporting block is slidably installed in each supporting bar.

[0007] The top end of the sliding panel also is provided with an interlocking structure, and the interlocking structure is provided with a spring, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base,

[0008] Preferably, a plurality of elastic blocks are fixedly mounted on the upper end of the baffle bar, and a plurality of arc grooves for limiting the elastic blocks are arranged on the lower end of the fixing plate.

[0009] Preferably, a fixed bar is slidably installed at the lower ends of the two supporting bars, and a limiting groove is provided at the lower end of each supporting bar for limiting the end of the fixed bar. A connecting rod is rotatably installed on each supporting block, and one end of each connecting rod is rotatably installed on the end of the corresponding fixed bar. A plurality of fourth springs are fixedly connected between the corresponding two supporting blocks.

[0010] Preferably, each end of the supporting block is located at the same horizontal plane as the upper surface of the supporting bar, and each end of the supporting block is fixedly mounted with a fixing column for limiting the position of the silicon wafer.

[0011] Preferably, a plurality of slide cylinders are fixedly mounted on the electric turntable, a plurality of air holes are provided at both ends of the slide cylinders, a plurality of fixed rods are fixedly mounted on the slide rails, the fixed rods correspond to the slide cylinders one by one and are slidably mounted inside the slide cylinders, and a piston is fixedly mounted at both ends of each of the fixed rods.

[0012] Preferably, a plurality of limiting columns are fixedly mounted on the support plate, and a plurality of limiting holes for limiting the limiting columns are arranged at the bottom of the sheet rack, and the limiting holes correspond to the limiting columns one by one.

[0013] Preferably, a plurality of limit blocks are fixedly mounted on the sleeve, and a plurality of guide grooves for limiting the limit blocks are arranged on the sliding column, and the guide grooves correspond to the limit blocks one by one.

[0014] Preferably, each of the sliding members is provided with a plurality of balls on both upper and lower sides, and the inner walls on both upper and lower sides of the slide rail are provided with sliding grooves for limiting the balls.

[0015] Preferably, a rubber block is fixedly mounted on the end of each magnetic column.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention utilizes the attraction of the magnetic strip to the magnetic column to retract the magnetic column into the sliding part, and the slot releases the limit on the magnetic column. After the arc surface of the magnetic column contacts the arc surface of the sliding part, the position of the sliding part is adjusted to drive the supporting strip and the supporting block thereon to move, so that the size of the supporting strip and the supporting block matches the size of the silicon wafer. At the same time, the connecting rods on both sides are pulled by the fixed strip to make the supporting blocks in the supporting strip move to both ends. The positions of the fixed columns on the supporting strips at both ends also match the size of the silicon wafer, which can effectively limit the silicon wafers of different sizes.

[0018] 2. The present invention utilizes the telescopic cylinder to drive the baffle to push the baffle, and drives the rack to move, so that the gear ring drives the ratchet to rotate, and through the pawl limiting the ratchet, the ratchet drives the pawl and the sleeve to rotate, and drives the sliding column to rotate, and through the thread groove limiting the threaded bar, the sliding column drives the support plate and the film rack to move upward, when the telescopic cylinder retracts, the rack drives the gear ring and the ratchet to reverse, the pawl rotates on the sleeve, and does not drive the sleeve to rotate, the sliding column and the support plate and the film rack will not move downward, so that each time the telescopic cylinder takes a film in the film storage bin, the film rack moves upward a fixed distance to facilitate film taking. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the sheet frame structure of the present invention;

[0021] Figure 3 This is a schematic diagram of the internal structure of the film storage bin of the present invention;

[0022] Figure 4 It is a schematic diagram of the sliding column structure of the present invention;

[0023] Figure 5 This is a schematic diagram of the internal structure of the device tank of the present invention;

[0024] Figure 6 It is a schematic diagram of the ratchet and pawl structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the internal structure of the film guide bin of the present invention;

[0026] Figure 8 It is a schematic diagram of the structure of the magnetic strip and the sliding member of the present invention;

[0027] Fig. 9 It is a schematic diagram of the slide rail structure of the present invention;

[0028] Fig.10 It is a schematic diagram of the structure of the sliding member of the present invention;

[0029] Fig.11 It is a schematic diagram of the internal structure of the support bar of the present invention;

[0030] Fig.12 It is a schematic diagram of the internal structure of the slide cylinder of the present invention.

[0031] In the figure: 1-film guide bin; 2-film storage bin; 3-preheating bin; 4-reaction bin; 5-film rack; 6-supporting film; 7-limiting hole; 8-supporting plate; 9-limiting column; 10-guide bar; 11-sliding column; 12-guide groove; 13-thread bar; 14-thread groove; 15-film guide port; 16-baffle; 17-first spring; 18-device groove; 19-rack; 20-tooth ring; 21-ratchet; 22-pawl; 23-sleeve; 24-second spring; 25-limiting block; 26-electric turntable; 27-telescopic gas Cylinder; 28-slide rail; 29-slot; 30-slide groove; 31-fixed plate; 32-telescopic rod; 33-stop bar; 34-elastic block; 35-arc groove; 36-magnetic strip; 37-sliding piece; 38-ball; 39-third spring; 40-magnetic column; 41-rubber block; 42-electric telescopic column; 43-supporting bar; 44-limiting groove; 45-supporting block; 46-fixed column; 47-connecting rod; 48-fixed bar; 49-fourth spring; 50-slide cylinder; 51-air hole; 52-fixed rod; 53-piston. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-Figure 12 The present invention provides a technical solution: an automatic wafer guiding device for ALD equipment, comprising a wafer guiding chamber 1, a wafer storage chamber 2, a preheating chamber 3 and a reaction chamber 4 fixedly connected to the wafer guiding chamber 1 (the preheating chamber 3 and the reaction chamber 4 are both existing known structures, so the present invention will not be described in detail), a wafer guiding port 15 is provided at the connection between the wafer guiding chamber 1 and the wafer storage chamber 2, the preheating chamber 3 and the reaction chamber 4, a wafer rack 5 whose size can be adjusted according to the size of the silicon wafer is provided in the wafer storage chamber 2, and a plurality of supporting plates 6 for placing the silicon wafer are fixedly installed on the wafer rack 5. When the size of the placed silicon wafer does not match that of the wafer rack 5, the wafer rack 5 can be stretched or retracted horizontally according to the size of the silicon wafer, so that the horizontal width of the wafer rack 5 corresponds to the size of the silicon wafer, and the supporting plates 6 on both sides are fixedly installed on the wafer rack 5. The sheet 6 can support the silicon wafer, and the center of the silicon wafer coincides with the center of the sheet rack. Magnetic strips 36 are fixedly installed on both sides of the sheet rack 5, and one end of each magnetic strip 36 is set to be an arc shape. An electric turntable 26 is fixedly installed in the sheet guide bin 1, and a telescopic cylinder 27 is fixedly installed on the electric turntable 26. A slide rail 28 is fixedly installed on the output end of the telescopic cylinder 27. Two sliding members 37 are symmetrically slidably installed in the slide rail 28, and one end of each sliding member 37 is also set to be an arc shape, and its arc radius is greater than the radius of the arc at the end of the magnetic strip 36. A plurality of balls 38 are arranged on the upper and lower sides of each sliding member 37, and the inner walls on the upper and lower sides of the slide rail 28 are provided with slide grooves 30 for limiting the balls 38. Through the cooperation between the balls 38 and the slide grooves 30 In order to reduce the resistance of the sliding member 37 in the slide rail 28, a magnetic column 40 attracted by the magnetic strip 36 is slidably installed in each slide member 37, a rubber block 41 is fixedly installed at one end of each magnetic column 40, and a third spring 39 is fixedly connected between the other end of each magnetic column 40 and the corresponding slide member 37. A plurality of card slots 29 for limiting the magnetic column 40 are arranged on the inner wall of the slide rail 28. After the telescopic cylinder 27 is extended, it drives the end slide rail 28 and the slide member 37 to move toward the sheet frame 5. The magnetic column 40 in the slide member 37 is attracted and retracted by the magnetic strip 36 on the sheet frame 5, and the third spring 39 is compressed. At the same time, the card slot 29 releases the limit on the magnetic column 40, and then the arc surface of the magnetic strip 36 contacts the arc surface of the slide member 37. With the push of the telescopic cylinder 27, the sliding member 37 moves in the slide rail 28, and the top of its arc surface is aligned with the top of the arc surface of the magnetic strip 36, so that the spacing between the sliding members 37 is adjusted to match the size of the silicon wafer on the wafer rack 5. During the sliding process of the sliding member 37, a part of the rubber block 41 at the end of the magnetic column 40 is still located in the slot 29, so that the sliding member 37 is subjected to resistance during the sliding process. When the same size of wafer rack 5 is taken out for multiple times, the sliding member 37 is not easy to slide, thereby improving the stability of the sliding member 37. When the telescopic cylinder 27 retracts, the magnetic column 40 is separated from the magnetic attraction of the magnetic strip 36, and is re-extended into the corresponding slot 29 by the elastic force of the third spring 39, so that the sliding member 37 is fixed to the slide rail 28.

[0034] A supporting bar 43 is fixedly installed on each sliding member 37 through an electric telescopic column 42, and a supporting block 45 is slidably installed in each supporting bar 43. The end of each supporting block 45 is located at the same horizontal plane as the upper surface of the supporting bar 43, and a fixing column 46 for limiting the silicon wafer is fixedly installed on the end of each supporting block 45. A fixing bar 48 is slidably installed on the lower ends of the two supporting bars 43, and a limiting groove 44 for limiting the end of the fixing bar 48 is provided at the lower end of each supporting bar 43. A connecting rod 47 is rotatably installed on each supporting block 45, and one end of each connecting rod 47 is rotatably installed on the end of the corresponding fixing bar 48. A number of fourth springs 49 are fixedly connected between the corresponding two supporting blocks 45. The supporting bar 43 and the supporting block 45 extend synchronously with the sliding member 37 to support the silicon wafer. When the spacing between the sliding members 37 changes, the spacing between the two supporting bars 43 also changes. The two ends of the fixed bar 48 will change, and the two ends of the fixed bar 48 will slide in the limit groove 44, and drive the corresponding end of the connecting rod 47 to move, so that the two supporting blocks 45 in the supporting bar 43 will move relative to each other or move toward each other synchronously, and the fourth spring 49 will be stretched or compressed. Since the elastic force of the fourth spring 49 in the two supporting bars 43 is consistent, the supporting blocks 45 in the two supporting bars 43 will maintain a consistent movement amplitude, and the movement distances of the two ends of the fixed bar 48 in the limit groove 44 are also consistent. The spacing between the two supporting blocks 45 in the supporting bar 43 can be adjusted with the spacing between the two sliding parts 37 and conform to the size of the silicon wafer. The electric telescopic column 42 can push the supporting bar 43 and the supporting block 45 to move up and down, which is convenient for taking and placing the silicon wafer, and the fixed column 46 on the supporting bar 43 can fix the silicon wafer, reducing the possibility of the silicon wafer sliding when the telescopic cylinder 27 is started and stopped.

[0035] A device slot 18 is provided in the film storage bin 2, a baffle 16 is slidably installed in the device slot 18, a plurality of first springs 17 are fixedly connected between the baffle 16 and the inner wall of the device slot 18, a fixed plate 31 is fixedly installed at the lower end of the slide rail 28, a baffle 33 cooperating with the baffle 16 is slidably installed at the lower end of the fixed plate 31, a plurality of telescopic rods 32 are fixedly connected between the baffle 33 and the slide rail 28, a plurality of elastic blocks 34 are fixedly installed at the upper end of the baffle 33, a plurality of arc grooves 35 for limiting the elastic blocks 34 are provided at the lower end of the fixed plate 31, when the telescopic cylinder 27 pushes the slide rail 28 to move, the fixed plate 31 and the baffle 33 will also move synchronously therewith, after the baffle 33 contacts the baffle 16, the elastic block 34 is limited by the arc groove 35, and the baffle 3 3 is subject to resistance. With the push of the telescopic cylinder 27, the baffle 16 slides along the installation groove 18 and compresses the first spring 17. When the baffle 16 moves to the end of the installation groove 18 and cannot move anymore, the elastic block 34 will be deformed and disengage from the limit of the arc groove 35, and the telescopic rod 32 will shrink. When the telescopic cylinder 27 retracts, the elastic force of the telescopic rod 32 will push the baffle 33 to reset, and the elastic block 34 will return to the arc groove 35 again, and the baffle 16 is also reset by the elastic force of the first spring 17. A rack 19 is fixedly installed on the baffle 16, and a toothed ring 20 meshing with the rack 19 is rotatably installed in the installation groove 18. A ratchet 21 is fixedly installed on the toothed ring 20. A sleeve 23 is also rotatably installed in the installation groove 18, and a sleeve 23 is rotatably installed on the inner wall of the sleeve 23. A pawl 22 cooperates with the ratchet 21, and a second spring 24 is fixedly connected between one end of the pawl 22 and the inner wall of the sleeve 23. A sliding column 11 is slidably installed on the sleeve 23, and a plurality of limit blocks 25 are fixedly installed on the sleeve 23. A plurality of guide grooves 12 for limiting the limit blocks 25 are provided on the sliding column 11, and the guide grooves 12 correspond to the limit blocks 25 one by one. A threaded strip 13 is fixedly installed at the lower end of the sliding column 11, and a threaded groove 14 cooperating with the threaded strip 13 is provided in the film storage bin 2. A support plate 8 for supporting the film rack 5 is rotatably installed on the upper end of the sliding column 11, and guide strips 10 for limiting the support plate 8 are fixedly installed on the inner walls on both sides of the film storage bin 2, and a plurality of limit columns 9 are fixedly installed on the support plate 8. A plurality of guide strips 13 for limiting the support plate 8 are provided at the bottom of the film rack 5. The limiting hole 7 for limiting the limiting column 9 corresponds to the limiting column 9 one by one. When the baffle 16 moves, it will drive the rack 19 to move synchronously, and through the meshing of the rack 19 and the toothed ring 20, the toothed ring 20 drives the ratchet 21 to rotate. The ratchet 21 is limited by the pawl 22, so that the ratchet 21 drives the pawl 22 and the sleeve 23 to rotate. Through the limitation of the upper limit block 25 of the sleeve 23 by the guide groove 12 on the slide column 11, the slide column 11 will rotate synchronously with the sleeve 23. At the same time, the threaded strip 13 at the lower end of the slide column 11 is limited by the threaded groove 14, which will make the slide column 11 rotate while pushing the support plate 8 to move upward. Through the limitation of the support plate 8 by the guide strip 10 and the limitation of the upper limit column 9 of the support plate 8 by the upper limit hole 7 of the sheet frame 5,The support plate 8 drives the sheet rack 5 to rise, and each time the telescopic cylinder 27 is pushed out, the support plate 8 and the sheet rack 5 will rise a fixed distance, which is convenient for taking the multi-layer silicon wafers on the sheet rack 5 one by one. When the baffle 16 is reset, it will also drive the rack 19 to reset, and drive the gear ring 20 and the ratchet 21 to reverse and reset. The pawl 22 will no longer limit the ratchet 21, and will rotate on the sleeve 23, so that the second spring 24 is compressed, and the sleeve 23 will not rotate in the opposite direction, and the slide column 11 will not push the sheet rack 5 to move. After the ratchet 21 is reversed, the pawl 22 is ejected by the elastic force of the second spring 24 to limit the ratchet 21 again.

[0036] A plurality of slides 50 are fixedly mounted on the electric turntable 26, and a plurality of air holes 51 are provided at both ends of the slides 50. A plurality of fixed rods 52 are fixedly mounted on the slide rail 28, and the fixed rods 52 correspond to the slides 50 one by one and are slidably mounted inside the slides 50. A piston 53 is fixedly mounted at both ends of each fixed rod 52. When the slide rail 28 moves, the fixed rod 52 and the pistons 53 at both ends thereof will be driven to slide in the slide 50. When the telescopic cylinder 27 is started, only one air hole 51 at the end of the slide 50 can be used for air intake, so that the speed of the telescopic cylinder 27 is reduced when it is started. After a period of time after the start, the number of air intake holes 51 increases, and the telescopic cylinder 27 can move at a normal speed. When the telescopic cylinder 27 is about to stop, the air hole 51 at the other end of the telescopic cylinder 27 for air outlet will be reduced from multiple to one, thereby slowing down its stopping speed, avoiding the situation where the telescopic cylinder 27 stops suddenly and starts suddenly, and reducing the possibility of sliding of the silicon wafer during the picking and delivering process.

[0037] Specifically, after the electric turntable 26 adjusts the angle, the control telescopic cylinder 27 is extended to drive the end slide rail 28 and the sliding member 37 to move toward the film rack 5. The magnetic column 40 in the sliding member 37 is attracted and retracted by the magnetic strip 36 on the film rack 5, and the third spring 39 is compressed. At the same time, the card slot 29 releases the limit on the magnetic column 40, and then the arc surface of the magnetic strip 36 contacts the arc surface of the sliding member 37. With the push of the telescopic cylinder 27, the sliding member 37 moves in the slide rail 28, and the top of the arc surface is aligned with the top of the arc surface of the magnetic strip 36, so that the spacing between the sliding members 37 is adjusted to match the size of the silicon wafer on the film rack 5. During the sliding process of the sliding member 37, a part of the rubber block 41 at the end of the magnetic column 40 is still located in the card slot 29, so that the sliding member 37 The sliding process is subject to resistance. When the same size of sheet rack 5 is taken out multiple times, the sliding member 37 is not easy to slide, thereby improving the stability of the sliding member 37. When the telescopic cylinder 27 retracts, the magnetic column 40 is separated from the magnetic attraction of the magnetic strip 36 and re-extends into the corresponding card slot 29 under the elastic force of the third spring 39, so that the sliding member 37 is fixed to the slide rail 28. The supporting strip 43 and the supporting block 45 extend synchronously with the sliding member 37 to support the silicon wafer. When the spacing between the sliding members 37 changes, the spacing between the two supporting strips 43 will also change. The two ends of the fixed strip 48 will slide in the limiting groove 44 and drive one end of the corresponding connecting rod 47 to move, so that the two supporting blocks 45 in the supporting strip 43 move synchronously relative to each other or move synchronously toward each other, and the fourth The spring 49 is stretched or compressed. Since the elastic force of the fourth spring 49 in the two supporting bars 43 is consistent, the supporting blocks 45 in the two supporting bars 43 will maintain the same movement amplitude, and the moving distances of the two ends of the fixed bar 48 in the limit groove 44 are also consistent. The distance between the two supporting blocks 45 in the supporting bar 43 can be adjusted along with the distance between the two sliding members 37. When the telescopic cylinder 27 is started, only one air hole 51 at the end of the slide tube 50 can take in air, so that the speed of the telescopic cylinder 27 is reduced when it is started. After a period of time after the start, the number of air intake holes 51 increases, and the telescopic cylinder 27 can move at a normal speed. When the telescopic cylinder 27 is about to stop, the air hole 51 at the other end of the telescopic cylinder 27 will be reduced from multiple to one, slowing down its stopping speed. When the baffle 16 moves, it will drive the gear The toothed bar 19 moves synchronously, and the toothed ring 20 drives the ratchet 21 to rotate through the meshing of the toothed rack 19 and the toothed ring 20. The ratchet 21 is limited by the pawl 22, so that the ratchet 21 drives the pawl 22 and the sleeve 23 to rotate. The upper limit block 25 of the sleeve 23 is limited by the guide groove 12 on the slide post 11, and the slide post 11 will rotate synchronously with the sleeve 23. At the same time, the threaded bar 13 at the lower end of the slide post 11 is limited by the threaded groove 14, which will make the slide post 11 rotate while pushing the support plate 8 to move upward. The support plate 8 drives the sheet frame 5 to rise through the limitation of the support plate 8 by the guide bar 10 and the limitation of the upper limit post 9 of the support plate 8 by the upper limit hole 7 of the sheet frame 5. The telescopic cylinder 27 will drive the support plate 8 and the sheet frame 5 to rise a fixed distance each time it is pushed out.It is convenient to take out the multi-layer silicon wafers on the wafer rack 5 one by one. When the baffle 16 is reset, it will also drive the rack 19 to reset, and drive the gear ring 20 and the ratchet 21 to reverse and reset. The pawl 22 will no longer limit the ratchet 21, and will rotate on the sleeve 23, so that the second spring 24 is compressed, and the sleeve 23 will not rotate in the opposite direction, and the slide column 11 will not push the wafer rack 5 to move. After the ratchet 21 is reversed, the pawl 22 is ejected by the elastic force of the second spring 24 to limit the ratchet 21 again. When the telescopic cylinder 27 pushes the slide rail 28 to move, the fixed plate 31 and the baffle 33 will also move synchronously with it. After the baffle 33 contacts the baffle 16, the arc groove 35 limits the elastic block 34, and the baffle The strip 33 is subject to resistance. With the push of the telescopic cylinder 27, the baffle 16 slides along the device groove 18 and compresses the first spring 17. When the baffle 16 moves to the end of the device groove 18 and cannot move anymore, the elastic block 34 will deform and break away from the limit of the arc groove 35, and the telescopic rod 32 will shrink. When the telescopic cylinder 27 retracts, the elastic force of the telescopic rod 32 will push the baffle 33 to reset and return the elastic block 34 to the arc groove 35 again. The baffle 16 is also reset by the elastic force of the first spring 17. After the wafer is taken out of the wafer storage bin 2, the electric turntable 26 will rotate to send the silicon wafer into the preheating bin 3. After the preheating is completed, it will be taken out again and sent to the reaction bin 4, and then enter the wafer storage bin 2 again to take the wafer.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic wafer guide device for an ALD device, comprising a wafer guide chamber (1), a wafer storage chamber (2) fixedly connected to the wafer guide chamber (1), a preheating chamber (3) and a reaction chamber (4), characterized in that: The connection between the wafer guide bin (1) and the wafer storage bin (2), the preheating bin (3) and the reaction bin (4) is provided with a wafer guide port (15); the wafer storage bin (2) is provided with a wafer rack (5) whose size can be adjusted according to the size of the silicon wafer; a plurality of support sheets (6) for placing the silicon wafers are fixedly mounted on the wafer rack (5); magnetic strips (36) are fixedly mounted on both sides of the wafer rack (5); one end of each magnetic strip (36) is arranged to be in an arc shape; An electric turntable (26) is fixedly installed in the guide film bin (1), a telescopic cylinder (27) is fixedly installed on the electric turntable (26), a slide rail (28) is fixedly installed at the output end of the telescopic cylinder (27), two sliding members (37) are symmetrically slidably installed in the slide rail (28), one end of each sliding member (37) is also arranged in an arc shape, and the radius of the arc is larger than the radius of the arc at the end of the magnetic strip (36), and each sliding member (37) is slidably installed in A magnetic column (40) attracted to the magnetic strip (36) is provided, a third spring (39) is fixedly connected between one end of each magnetic column (40) and the corresponding sliding member (37), a plurality of slots (29) for limiting the magnetic column (40) are provided on the inner wall of the slide rail (28), a supporting bar (43) is fixedly installed on each sliding member (37) via an electric telescopic column (42), and a supporting block (45) is slidably installed in each supporting bar (43); The film storage bin (2) is provided with a device groove (18), a baffle (16) is slidably mounted in the device groove (18), a plurality of first springs (17) are fixedly connected between the baffle (16) and the inner wall of the device groove (18), a fixed plate (31) is fixedly mounted at the lower end of the slide rail (28), a baffle bar (33) matching with the baffle (16) is slidably mounted at the lower end of the fixed plate (31), a plurality of telescopic rods (32) are fixedly connected between the baffle bar (33) and the slide rail (28), a rack (19) is fixedly mounted on the baffle (16), a toothed ring (20) meshing with the toothed ring (19) is rotatably mounted in the device groove (18), and a ratchet (21) is fixedly mounted on the toothed ring (20). ), a sleeve (23) is rotatably mounted in the device groove (18), a pawl (22) cooperating with the ratchet (21) is rotatably mounted on the inner wall of the sleeve (23), a second spring (24) is fixedly connected between one end of the pawl (22) and the inner wall of the sleeve (23), a slide column (11) is slidably mounted on the sleeve (23), a threaded strip (13) is fixedly mounted on the lower end of the slide column (11), a threaded groove (14) cooperating with the threaded strip (13) is provided in the film storage bin (2), a support plate (8) for supporting the film rack (5) is rotatably mounted on the upper end of the slide column (11), and guide strips (10) for limiting the support plate (8) are fixedly mounted on the inner walls on both sides of the film storage bin (2).

2. The automatic wafer guide device for ALD equipment according to claim 1, characterized in that: A plurality of elastic blocks (34) are fixedly mounted on the upper end of the blocking bar (33), and a plurality of arc-shaped grooves (35) for limiting the elastic blocks (34) are arranged on the lower end of the fixing plate (31).

3. The automatic wafer guide device for ALD equipment according to claim 1, characterized in that: A fixing bar (48) is slidably mounted on the lower ends of the two supporting bars (43), and a limiting groove (44) for limiting the end of the fixing bar (48) is provided at the lower end of each supporting bar (43). A connecting rod (47) is rotatably mounted on each supporting block (45), and one end of each connecting rod (47) is rotatably mounted on the end of the corresponding fixing bar (48). A plurality of fourth springs (49) are fixedly connected between the corresponding two supporting blocks (45).

4. The automatic wafer guide device for ALD equipment according to claim 3, characterized in that: The end of each supporting block (45) is located at the same horizontal plane as the upper surface of the supporting bar (43), and a fixing column (46) for limiting the position of the silicon wafer is fixedly mounted on the end of each supporting block (45).

5. The automatic wafer guide device for ALD equipment according to claim 1, characterized in that: A plurality of slide cylinders (50) are fixedly mounted on the electric turntable (26), and a plurality of air holes (51) are provided at both ends of the slide cylinders (50). A plurality of fixed rods (52) are fixedly mounted on the slide rail (28), and the fixed rods (52) correspond to the slide cylinders (50) one by one and are slidably mounted inside the slide cylinders (50). A piston (53) is fixedly mounted at both ends of each of the fixed rods (52).

6. The automatic wafer guide device for ALD equipment according to claim 1, characterized in that: A plurality of limiting columns (9) are fixedly mounted on the support plate (8), and a plurality of limiting holes (7) for limiting the limiting columns (9) are arranged at the bottom of the sheet frame (5), wherein the limiting holes (7) correspond one to one with the limiting columns (9).

7. The automatic wafer guide device for ALD equipment according to claim 1, characterized in that: A plurality of limit blocks (25) are fixedly mounted on the sleeve (23), and a plurality of guide grooves (12) for limiting the limit blocks (25) are provided on the slide column (11), wherein the guide grooves (12) correspond one to one with the limit blocks (25).

8. The automatic wafer guide device for ALD equipment according to claim 1, characterized in that: A plurality of balls (38) are provided on the upper and lower sides of each sliding member (37), and sliding grooves (30) for limiting the position of the balls (38) are provided on the upper and lower inner walls of the slide rail (28).

9. The automatic wafer guide device for ALD equipment according to claim 1, characterized in that: A rubber block (41) is fixedly mounted on the end of each magnetic column (40).

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