Memory bar heat dissipation device

Abstract

The present application discloses a memory bar heat dissipation device, which relates to the technical field of memory bars, and includes a first heat sink, a second heat sink, an operating bar and a fan, wherein the surfaces of the first heat sink and the second heat sink facing each other are provided with a silicone pad; the operating bar is connected to the first heat sink and the second heat sink, and the side of the operating bar is provided with an abutment portion, and the side walls of the first heat sink and the second heat sink are slidably provided with an abutment block; the fan is clamped and fixed by the abutment portion and the abutment block, and the operating bar includes a main body, and a first connecting bar and a second connecting bar slidably connected to the main body, the first connecting bar is connected to the first heat sink, and the second connecting bar is connected to the second heat sink; the operating bar also includes a driving member and a reset member, the driving member is used to drive the first connecting bar and the second connecting bar to move away from each other, and the reset member is used to drive the first connecting bar and the second connecting bar to move toward each other. The present application can better bring out the heat between the memory bar and the heat dissipation vest through the fan, thereby improving the heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the technical field of memory sticks, and in particular to a heat dissipation device for a memory stick. Background Art

[0002] The memory stick is an important component in the computer, also known as random access memory (RAM). It is a computer component that the CPU can address and read and write through the bus. It is an extension of the main memory in the history of personal computers, and now it has become the entire read-write memory. The memory stick is responsible for temporarily storing and providing data to the CPU for processing. It can be likened to a warehouse in a factory, storing raw materials to be processed (data) and work in progress (instructions).

[0003] Reference Figure 1 The memory stick 6 is a common memory stick currently, including a PCB board 66, a memory chip 61 integrated on the PCB board 66, a resistor 62, a capacitor 63, an SPD 64, and a pin 65 (gold finger) located at one end of the PCB board 66. The memory stick 6 is installed by inserting the pin 65 into the corresponding memory card slot of the host.

[0004] Because the memory stick needs to continuously read and write data during computer operation, the high-frequency working state will cause the current flow to increase, thereby generating more heat. Excessive temperature can easily affect the operating state of the memory stick and even shorten the service life of the memory stick. Therefore, it is very important to know how to dissipate the heat of the memory stick during computer use.

[0005] At present, the heat dissipation methods for memory sticks mainly include installing a heat sink vest on the memory stick to increase the heat dissipation area, and using a fan installed in the host for air cooling. However, since the fan is usually installed on the inner wall of the chassis, it is not easy to accurately blow air to the gap between the memory sticks for heat dissipation, resulting in the heat of the memory stick that is not in contact with the silicone pad of the heat sink vest being difficult to transfer out, thereby affecting the heat dissipation effect. Summary of the invention

[0006] In order to better remove the heat between the memory stick and the heat sink through a fan, thereby improving the heat dissipation effect, the present application provides a memory stick heat dissipation device.

[0007] The present application provides a memory module heat dissipation device, which adopts the following technical solution:

[0008] A memory bar heat dissipation device comprises a first heat sink and a second heat sink, wherein the first heat sink and the second heat sink are provided with a silicone pad for abutting against the memory bar on the surfaces facing each other; and further comprises:

[0009] An operation bar, the operation bar is located on the same side of the first heat sink and the second heat sink, and is used to connect with the first heat sink and the second heat sink, the side of the operation bar is provided with an abutment portion, and an abutment block is slidably connected on the side wall on the same side of the first heat sink and the second heat sink;

[0010] The fan is arranged on the same side of the first heat sink and the second heat sink, and the air outlet side faces the first heat sink and the second heat sink. The fan is clamped and fixed by the abutment portion and the abutment block.

[0011] By adopting the above technical solution, the outer wall of the memory stick (including the outer walls of each component) is in contact with the silicone pad, so that the heat on the memory stick can be transferred to the first heat sink and the second heat sink. The surfaces of the first heat sink and the second heat sink are exposed to the air, which increases the heat dissipation area and thus improves the heat dissipation effect.

[0012] The fan can be installed to the sides of the first heat sink and the second heat sink, and by moving the abutment block, the abutment portion and the abutment block can clamp the fan, and the fan outlet can face the gap between the first heat sink and the second heat sink. The wind blown by the fan can pass through the two surfaces of the first heat sink, the two surfaces of the second heat sink, and the upper and lower surfaces of the memory stick to take away the heat, thereby greatly improving the heat dissipation effect.

[0013] Optionally, the facing surfaces of the first heat sink and the second heat sink are provided with air induction grooves, which penetrate perpendicularly to the blowing direction of the fan, and the silicone pad covers the air induction grooves, or is cut along the air induction grooves and located on both sides of the air induction grooves.

[0014] By adopting the above technical solution and setting an air induction groove, the outer wall of the memory stick and the first heat sink, as well as the outer wall of the memory stick and the second heat sink form a wider airflow channel, thereby improving the gas circulation rate and further improving the heat dissipation effect. The heat is guided to the silicone pad by wind, which further improves the thermal conductivity of the silicone pad and improves the heat dissipation effect.

[0015] Optionally, the operation bar includes a main body, a first connecting bar and a second connecting bar, the first connecting bar and the second connecting bar are both slidably connected to the main body, the first connecting bar and the first heat sink are detachably connected, and the second connecting bar and the second heat sink are detachably connected;

[0016] The operating bar further includes a driving member and a restoring member. The driving member is slidably connected to the main body and is used to drive the first connecting bar and the second connecting bar to move away from each other. The restoring member is used to drive the first connecting bar and the second connecting bar to move toward each other.

[0017] By adopting the above technical solution, when the driving member moves, the first heat sink and the second heat sink can be driven to move to adjust the gap between the first heat sink and the second heat sink, thereby facilitating the installation of the heat dissipation device and the memory stick; when the installation is completed, the silicone pad can clamp the memory stick and abut against the memory stick through the reset member, thereby facilitating the heat dissipation when the memory stick is working; since the first connecting bar and the first heat sink are detachably connected, and the second connecting bar and the second connecting bar are detachably connected, the first heat sink and the second heat sink can be disassembled and replaced to adapt to different types of memory sticks.

[0018] Optionally, a driving cavity is provided in the main body, the driving member comprises a conical portion located in the driving cavity, and a pushing portion with one end located outside the operating strip, and the ends of the first connecting strip and the second connecting strip abut against the outer wall of the conical portion;

[0019] The reset member is an elastic member disposed in the driving cavity, and when the driving member moves to push the first connecting strip and the second connecting strip to move, the elastic member is compressed to store elastic potential energy;

[0020] The outer wall of the main body is provided with a limiting groove for the end of the memory stick to be inserted.

[0021] By adopting the above technical solution, by pressing the pushing part, the conical part can simultaneously push the first connecting bar and the second connecting bar to move, and compress the elastic part to store elastic potential energy. When the pushing part is released, the second connecting bar and the first connecting bar can be reset, and the heat dissipation device can clamp and fix the memory bar. Since the limiting groove is provided, one end of the memory bar can be inserted into the limiting groove in advance for limiting, which also makes the clamping force of the silicone pad on the memory bar more stable.

[0022] Optionally, a slide groove is formed on the side walls of the first heat sink and the second heat sink, and the slide groove is a dovetail groove or an inverted T-shaped groove, and the abutment block can move along the slide groove to approach or move away from the abutment portion.

[0023] By adopting the above technical solution, the abutment block can adjust its position by moving along the slide groove, so that the heat dissipation device can be used to fix fans of different sizes and shapes, and because the slide groove is a dovetail groove or an inverted T-shaped groove, the abutment block is not easy to fall out of the slide groove.

[0024] Optionally, the abutment block includes a sliding portion located in the slide groove, and the sliding portion is provided with a pressing member that can move to abut against the inner wall of the slide groove.

[0025] By adopting the above technical solution, after the abutment block is slid to a suitable position, the clamping member is moved to abut the inner wall of the slide groove, thereby fixing the position of the abutment block, reducing the possibility of the fan falling due to gravity or vibration, and making the fan more stable.

[0026] Optionally, the pressing member passes through and is threadedly connected to the sliding portion, and an adjusting portion is provided at one end located outside the sliding groove.

[0027] By adopting the above technical solution, the adjusting part is pressed against the rotating part, so that the pressing member moves against the inner wall of the slide groove and increases the friction between the sliding part and the inner wall of the slide groove, thereby locking the position of the sliding part.

[0028] Optionally, a movable groove is opened in the sliding part, the clamping piece is slidably connected in the movable groove, a pull rod is connected to the clamping piece, the pull rod passes through the sliding part and is connected to the adjustment part, a second spring is arranged between the inner wall of the movable groove and the clamping piece, and the second spring is sleeved outside the pull rod.

[0029] By adopting the above technical solution, the adjusting part is pulled to move the clamping piece into the movable groove and compress the second spring. After the abutment block is moved, the adjusting part is released so that the clamping piece is pressed against the inner wall of the slide groove under the action of the second spring, thereby locking the position of the abutment block.

[0030] Optionally, a first heat dissipation protrusion is provided at one end of the first heat dissipation fin away from the second heat dissipation fin, and a second heat dissipation protrusion is provided at one end of the second heat dissipation fin away from the first heat dissipation fin.

[0031] By adopting the above technical solution, the heat dissipation area is further increased, thereby improving the heat dissipation effect.

[0032] Optionally, a connection groove capable of being plugged into the first heat dissipation protrusion is formed at one end of the second heat dissipation protrusion away from the second heat dissipation fin, and the connection groove passes through along the blowing direction of the fan.

[0033] By adopting the above technical solution, when there is a need to install multiple memory sticks side by side at the same time, the first heat dissipation convex edge and the second heat dissipation convex edge can be connected by plugging and matching. At this time, the fan can be fixed on multiple heat dissipation vests at the same time to dissipate heat for multiple heat dissipation strips and heat dissipation vests at the same time;

[0034] Furthermore, the first heat dissipation protrusion and the second heat dissipation protrusion can move relatively after being plugged in, so as to facilitate installation and removal of the heat dissipation device.

[0035] In summary, the present application includes at least one of the following beneficial effects:

[0036] 1. The fan can be installed on the side of the heat sink by clamping, so that the fan can face the side of the heat sink, provide further heat dissipation for the heat sink and memory module, and the fan can be easily installed and removed and remain stable;

[0037] 2. Setting up air ducts to form a wider air flow channel can further improve the heat dissipation effect;

[0038] 3. By pressing the push portion, the first connecting bar and the second connecting bar can move away from each other, and by providing an elastic member, the first connecting bar and the second connecting bar can move toward each other to reset, so that the memory bar can be easily installed in the heat dissipation vest;

[0039] 4. The pressing piece can be moved to press against the inner wall of the slide groove, so that it can be locked after the abutment block moves, thereby improving the connection stability of the fan and being able to adapt to the use of fans of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a structural schematic diagram of a memory bar in the related art;

[0041] Figure 2 is a schematic cross-sectional structure diagram of Example 1 of the present application;

[0042] Figure 3 yes Figure 2 A schematic diagram of the enlarged structure at A in the middle;

[0043] Figure 4 is a side view schematic diagram showing the installation position of the fan in Example 1 of the present application;

[0044] Figure 5 It is a partial schematic diagram showing the installation structure of the abutment block in Example 1 of the present application;

[0045] Figure 6 It is a partial schematic diagram showing the installation structure of the abutment block in Example 2 of the present application;

[0046] Figure 7 This is a side view schematic diagram showing embodiment 3 of the present application when two sets of heat dissipation vests are used together.

[0047] Explanation of the reference numerals: 1. first heat sink; 11. silicone pad; 12. connecting edge; 13. first heat dissipation convex edge; 14. air inlet groove; 15. slide groove; 2. second heat sink; 21. second heat dissipation convex edge; 211. connecting groove; 3. operating strip; 31. main body; 311. driving cavity; 312. limiting groove; 313. abutting portion; 32. first connecting strip; 33. second connecting strip; 34. elastic member; 35. driving member; 351. conical portion; 352. pushing portion; 4. fan; 5. abutting block; 51. sliding portion; 511. movable groove; 52. pressing member; 53. adjusting portion; 54. pull rod; 55. second spring; 6. memory bar; 61. memory chip; 62. resistor; 63. capacitor; 64. SPD; 65. pin; 66. PCB board. DETAILED DESCRIPTION

[0048] The following is combined with Figure 2-7 This application is described in further detail.

[0049] Example 1

[0050] The present application discloses a memory module heat dissipation device, referring to Figure 2 and Figure 3 The heat dissipation device includes a heat dissipation vest and a fan 4. The heat dissipation vest includes a first heat sink 1, a second heat sink 2 and an operating strip 3. The first heat sink 1 and the second heat sink 2 are arranged in parallel, and the operating strip 3 is detachably connected to the first heat sink 1 and the second heat sink 2, and is located on the same side of the first heat sink 1 and the second heat sink 2; the operating strip 3, the first heat sink 1 and the second heat sink 2 form a U-shaped groove for clamping the memory bar 6. A heat-conducting silicone pad 11 is bonded to the facing surfaces of the first heat sink 1 and the second heat sink 2, which is used to abut against the outer wall of the memory bar 6 to guide the heat of the memory bar 6 to the first heat sink 1 and the second heat sink 2, thereby increasing the heat dissipation area and improving the heat dissipation effect.

[0051] The operating strip 3 includes a main body 31, and a first connecting strip 32 and a second connecting strip 33 slidably connected to the operating strip 3. A driving cavity 311 is formed in the main body 31. The first connecting strip 32 and the second connecting strip 33 are L-shaped, and one end is located in the driving cavity 311, and the other end passes through the main body 31 and is detachably connected to the first heat sink 1 or the second heat sink 2. Specifically, the ends of the first heat sink 1 and the second heat sink 2 are both provided with connecting edges 12, and the ends of the first connecting strip 32 and the second connecting strip 33 form grooves for plugging the connecting edges 12. After the connecting edges 12 and the grooves are plugged in, they can be connected by bolts. The first heat sink 1 and the second heat sink 2 are detachably connected to the operating strip 3, which is convenient for replacing the first heat sink 1 and the second heat sink 2 to adapt to memory bars 6 of different thicknesses and different structural types.

[0052] Reference Figure 2 and Figure 3 The operating bar 3 also includes a driving member 35 and a reset member. The driving member 35 is used to drive the first heat sink 1 and the second heat sink 2 to move away from each other to adjust the distance between the first heat sink 1 and the second heat sink 2, thereby facilitating the installation and removal of the memory bar 6. The reset member is used to drive the first heat sink 1 and the second heat sink 2 to move toward each other and drive the silicone pad 11 to press against the outer wall of the memory bar 6 to improve the heat conduction effect.

[0053] The driving member 35 is disposed through the main body 31, and includes a conical portion 351 located in the driving cavity 311, and a pushing portion 352 located outside the driving cavity 311. The driving member 35 can be driven to slide relative to the main body 31 by pressing the pushing portion 352. A limiting edge is provided on the outer wall of the driving member 35, and the moving distance of the driving member 35 can be limited by the limiting edge, and the driving member 35 is not easily separated from the main body 31. The first connecting bar 32 and the second connecting bar 33 are both slidably connected to the outer wall of the main body 31, and one end thereof abuts against the outer wall of the conical portion 351, so that when the driving member 35 moves, the first connecting bar 32 and the second connecting bar 33 can be driven to move away from each other at the same time.

[0054] The reset member includes an elastic member 34 located between the inner wall of the driving cavity 311 and the first connecting strip 32, and between the inner wall of the driving cavity 311 and the second connecting strip 33. Specifically, the elastic member 34 can be a first spring. When the first connecting strip 32 and the second connecting strip 33 move away from each other, the elastic member 34 is compressed. When the push portion 352 is released, the first connecting strip 32 and the second connecting strip 33 move toward each other through the reset force of the elastic member 34, that is, the first heat sink 1 and the second heat sink 2 move toward each other to clamp the memory bar 6. A limiting groove 312 is provided on the surface of the main body 31 close to the interval between the first heat sink 1 and the second heat sink 2, so that the end of the memory bar 6 can be inserted into the limiting groove 312 for positioning, and then the operating bar 3 can be operated. In this way, the memory bar 6 can be subjected to force more evenly, and it is not easy to deviate from the position due to the movement of the first heat sink 1 and the second heat sink 2, and it is also convenient for installation.

[0055] In some other preferred embodiments of the present application, the elastic member 34 may be a metal spring, elastic plastic, etc.; the driving member 35 may also be connected to the main body 31 by a threaded connection, and the corresponding conical portion 351 at this time is a cone or a truncated cone; the first heat sink 1 and the second heat sink 2 may not be parallel, as long as they can clamp the memory stick 6.

[0056] Reference Figure 4 and Figure 5 A slide groove 15 is provided on the side wall of the same side of the first heat sink 1 and the second heat sink 2. The slide groove 15 is a dovetail groove or an inverted T-shaped groove, and its length direction faces the operation bar 3 and passes through the end of the first heat sink 1 or the second heat sink 2 away from the operation bar 3. The first heat sink 1 and the second heat sink 2 are both slidably connected with abutment blocks 5. This application takes the slide groove 15 as an inverted T-shaped groove as an example. Figure 4 and Figure 5The abutment block 5 includes a sliding portion 51 adapted to slide in the slide slot 15, and a pressing member 52 is slidably provided on the sliding portion 51. The pressing member 52 is a screw threadedly connected and passing through the sliding portion 51, and one end of the screw passes through the sliding portion 51 and is connected to the adjusting portion 53. When the abutment block 5 is moved along the slide slot 15 so that the abutment block 5 moves to a suitable position in a direction close to or away from the operation bar 3, the adjusting portion 53 is rotated so that the pressing member 52 abuts against the inner wall of the slide slot 15, and the position of the sliding portion 51 in the slide slot 15 is locked by the pressing force and the friction force. At this time, the abutment block 5 and the abutment portion 313 can be used to clamp the fan 4, and the heat dissipation vest and the memory bar 6 are further dissipated by the fan 4, and the heat guided from the memory bar 6 to the heat dissipation vest is blown away.

[0057] When the fan 4 is used for heat dissipation, since one end of the memory stick 6 is inserted into the memory slot and the other end is inserted into the limit groove 312, the position of the heat sink vest is fixed, and the friction between the clamping member 52 and the inner wall of the slide groove 15, as well as the reset member used to limit the elastic force of the first heat sink 1 and the second heat sink 2 as resistance, the possible vibration of the fan 4 can be limited.

[0058] Reference Figure 2 and Figure 4 , an air induction groove 14 is provided on the facing surfaces of the first heat sink 1 and the second heat sink 2, and the air induction groove 14 penetrates the first heat sink 1 or the second heat sink 2 in a direction perpendicular to the blowing direction of the fan 4, and the silicone pad 11 is cut along the air induction groove 14 and is located on both sides of the air induction groove 14. By providing the air induction groove 14, the outer wall of the memory bar 6 and the first heat sink 1, as well as the outer wall of the memory bar 6 and the second heat sink 2 form a wider air flow channel, thereby improving the gas circulation rate, and then improving the heat dissipation effect, and guiding the heat to the silicone pad 11 through the wind, and further improving the thermal conductivity of the silicone pad 11, and improving the heat dissipation effect. In other embodiments of the present application, the silicone pad 11 may not be cut by the air induction groove 14, and the wind from the fan 4 may also take away the heat from the first heat sink 1 or the second heat sink 2, and the silicone pad 11 when passing through the air induction groove 14.

[0059] The implementation principle of a memory bar heat dissipation device according to the embodiment of the present application is as follows: the outer wall of the memory bar 6 is in contact with the silicone pad 11, so that the heat on the memory bar 6 can be transferred to the first heat sink 1 and the second heat sink 2. The surfaces of the first heat sink 1 and the second heat sink 2 are exposed to the air, which increases the heat dissipation area and thus improves the heat dissipation effect.

[0060] The fan 4 can be installed to the sides of the first heat sink 1 and the second heat sink 2, and by moving the abutment block 5, the abutment portion 313 and the abutment block 5 can clamp the fan 4. The air outlet of the fan 4 can face the gap between the first heat sink 1 and the second heat sink 2. The wind blown by the fan 4 can pass through the two surfaces of the first heat sink 1, the two surfaces of the second heat sink 2, and the upper and lower surfaces of the memory stick 6 to take away the heat, thereby greatly improving the heat dissipation effect.

[0061] Furthermore, when multiple memory sticks 6 need to be installed at the same time, multiple heat sinks can also be installed at the same time. At this time, the abutment blocks 5 on the first heat sink 1 and the second heat sink 2 can be selected, and the abutment portion 313 can be used to clamp the fan 4, so that the fan 4 can be selected in different sizes and shapes, and can dissipate heat for multiple memory sticks 6 at the same time.

[0062] Example 2

[0063] Reference Figure 4 and Figure 6 The difference between Example 2 and Example 1 of the present application is that a movable groove 511 is provided at the bottom of the sliding portion 51, and the clamping piece 52 is slidably connected in the movable groove 511. One end of the clamping piece 52 is fixedly connected to a pull rod 54, and one end of the pull rod 54 passes through the sliding portion 51 and out of the slide groove 15 and is fixedly connected to an adjusting portion 53. A second spring 55 sleeved on the outside of the pull rod 54 is fixed between the inner wall of the movable groove 511 and the clamping piece 52. When the user pulls the pull rod 54, the clamping piece 52 moves relative to the sliding portion 51 and no longer presses against the inner wall of the slide groove 15. At this time, the second spring 55 is compressed, and the operator can move the abutment block 5 to a suitable position and release the adjusting portion 53. The clamping piece 52 presses against the inner wall of the slide groove 15. At this time, the abutment block 5 and the abutment portion 313 can be used to clamp the fan 4, and the fan 4 is used to further dissipate the heat dissipation vest and the memory stick 6, and the heat guided from the memory stick 6 to the heat dissipation vest is blown away.

[0064] Example 3

[0065] Reference Figure 3 and Figure 7 , the difference between the embodiment 3 of the present application and the embodiments 1 and 2 is that a plurality of equally spaced first heat dissipation ridges 13 are fixedly connected to the end surface of the first heat sink 1 away from the second heat sink 2, and a wind channel parallel to the air induction groove 14 is formed between adjacent first heat dissipation ridges 13; a plurality of equally spaced second heat dissipation ridges 21 are fixedly connected to the end surface of the second heat sink 2 away from the first heat sink 1, and a wind channel parallel to the air induction groove 14 is formed between adjacent second heat dissipation ridges 21. By providing the first heat dissipation ridge 13 and the second heat dissipation ridge 21, the heat dissipation area can be further increased, and the wind blown by the fan 4 can move along the wind channel to take away the heat from the surfaces of the first heat sink 1 and the second heat sink 2.

[0066] Reference Figure 3 and Figure 7 The second heat dissipation protrusion 21 is penetrated and provided with a connection groove 211 for the first heat dissipation protrusion 13 to adapt and plug in along a direction parallel to the air inlet groove 14. When multiple memory sticks 6 need to be used at the same time, the adjacent first heat dissipation protrusions 13 can be plugged into the connection grooves 211 one by one and abutted against the inner wall of the connection groove 211, thereby realizing the connection between the two heat dissipation vests. If there is local uneven heat or different local heat dissipation effects, heat transfer can also be achieved through abutment, thereby improving the heat dissipation effect.

[0067] In addition, when the first heat dissipation convex edge 13 and the second heat dissipation convex edge 21 are connected, there may be a gap between the first heat dissipation convex edge 13 and the inner wall of the connecting groove 211 away from the long opening, forming an air duct for air flow, further improving the heat dissipation effect. In addition, the limit groove 312 may be set through the main body 31, at this time, the heat dissipation device can be quickly installed and disassembled by pressing the push portion 352 and sliding the heat dissipation vest. In addition, the gap between the first heat dissipation convex edge 13 and the connecting groove 211 can provide a movable space for the first heat sink 1 and the second heat sink 2; if the fan 4 is round, when the push portion 352 is pressed, the abutment block 5 can no longer press against the fan 4, thereby realizing the quick disassembly of the fan 4.

[0068] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A memory bar heat dissipation device, comprising a first heat sink (1) and a second heat sink (2), wherein the first heat sink (1) and the second heat sink (2) are provided with a silicone pad (11) on the surfaces facing each other for contacting with the memory bar (6); characterized in that: Also includes: An operating strip (3), the operating strip (3) being located on the same side of the first heat sink (1) and the second heat sink (2) and being used to connect with the first heat sink (1) and the second heat sink (2), an abutment portion (313) being provided on the side of the operating strip (3), and an abutment block (5) being slidably connected on the side wall on the same side of the first heat sink (1) and the second heat sink (2); A fan (4), the fan (4) being arranged on the same side of the first heat sink (1) and the second heat sink (2), with the air outlet side facing the first heat sink (1) and the second heat sink (2), and the fan (4) being clamped and fixed by the abutment portion (313) and the abutment block (5); The operating bar (3) comprises a main body (31), a first connecting bar (32) and a second connecting bar (33); the first connecting bar (32) and the second connecting bar (33) are both slidably connected to the main body (31); the first connecting bar (32) and the first heat sink (1) are detachably connected; and the second connecting bar (33) and the second heat sink (2) are detachably connected; The operating bar (3) further comprises a driving member (35) and a resetting member, wherein the driving member (35) is slidably connected to the main body (31) and is used to drive the first connecting bar (32) and the second connecting bar (33) to move away from each other, and the resetting member is used to drive the first connecting bar (32) and the second connecting bar (33) to move towards each other; The surfaces of the first heat sink (1) and the second heat sink (2) facing each other are provided with air induction grooves (14), the air induction grooves (14) are through-through in a direction perpendicular to the blowing direction of the fan (4), and the silicone pad (11) covers the air induction grooves (14), or is cut along the air induction grooves (14) and is located on both sides of the air induction grooves (14).

2. A memory bar heat dissipation device according to claim 1, characterized in that: A driving cavity (311) is provided in the main body (31), the driving member (35) comprises a conical portion (351) located in the driving cavity (311), and a pushing portion (352) with one end located outside the operating strip (3), and the ends of the first connecting strip (32) and the second connecting strip (33) abut against the outer wall of the conical portion (351); The reset member is an elastic member (34) disposed in the drive cavity (311); when the drive member (35) moves to push the first connecting strip (32) and the second connecting strip (33) to move, the elastic member (34) is compressed to store elastic potential energy; The outer wall of the main body (31) is provided with a limiting groove (312) for the end of the memory stick (6) to be inserted into.

3. The memory bar heat dissipation device according to claim 1, characterized in that: The side walls of the first heat sink (1) and the second heat sink (2) are provided with sliding grooves (15), the sliding grooves (15) being dovetail grooves or inverted T-shaped grooves, and the abutment block (5) can move along the sliding grooves (15) to approach or move away from the abutment portion (313).

4. A memory bar heat dissipation device according to claim 3, characterized in that: The abutment block (5) comprises a sliding portion (51) located in the slide groove (15), and a pressing member (52) is provided on the sliding portion (51) and is movable to abut against the inner wall of the slide groove (15).

5. The memory bar heat dissipation device according to claim 4, characterized in that: The pressing member (52) passes through and is threadedly connected to the sliding portion (51), and an adjusting portion (53) is provided at one end located outside the sliding groove (15).

6. The memory bar heat dissipation device according to claim 4, characterized in that: A movable groove (511) is provided in the sliding portion (51), and the clamping member (52) is slidably connected in the movable groove (511). One end of the clamping member (52) is connected to a pull rod (54), and the pull rod (54) passes through the sliding portion (51) and is connected to the adjusting portion (53). A second spring (55) is provided between the inner wall of the movable groove (511) and the clamping member (52), and the second spring (55) is sleeved outside the pull rod (54).

7. A memory bar heat dissipation device according to claim 1 or 2, characterized in that: A first heat dissipation ridge (13) is provided at one end of the first heat dissipation fin (1) away from the second heat dissipation fin (2), and a second heat dissipation ridge (21) is provided at one end of the second heat dissipation fin (2) away from the first heat dissipation fin (1).

8. The memory bar heat dissipation device according to claim 7, characterized in that: A connection groove (211) capable of being plugged into the first heat dissipation ridge (13) is formed at one end of the second heat dissipation ridge (21) away from the second heat dissipation fin (2), and the connection groove (211) is continuous along the blowing direction of the fan (4).

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