Wafer etching auxiliary device

Abstract

The invention discloses a wafer etching auxiliary device, which relates to the field of wafer etching technology and comprises a main body mechanism, wherein the main body mechanism comprises a support table, wherein the upper surface of the support table is respectively fixedly connected with a solution immersion box and a flushing box, and the bottom surface of the support table is fixedly connected with four support columns, and an auxiliary mechanism is arranged above the support table, wherein the auxiliary mechanism comprises an immersion unit, wherein the immersion unit is located inside the solution immersion box, and the immersion unit is used for immersing and decontaminating the surface of the wafer. The wafer etching auxiliary device, by arranging the immersion unit, can facilitate the reaction of the wafer with the chemical solution, facilitate the reaction of the chemical solvent with the residual pollutants on the surface of the wafer, and can conveniently use different chemical solvents according to the different pollutants on the surface of the wafer. Compared with large-scale automatic cleaning equipment, the cost and maintenance cost are relatively low, and the device is suitable for use with small batch wafers, wafers in special processes or research and development stages.

Description

Technical Field

[0001] The invention relates to the technical field of wafer etching, in particular to a wafer etching auxiliary device. Background Art

[0002] Wafer etching refers to the selective removal of unwanted materials from the wafer surface through chemical or physical methods to form specific patterns and structures on the wafer. During the etching process, etchants are usually used. These etchants will chemically react with specific materials on the wafer surface, or use physical methods such as ion bombardment to remove unwanted parts. During the wafer etching process, auxiliary devices are required to help the wafer optimize the etching process and improve the etching accuracy, efficiency and quality.

[0003] Before wafer etching, auxiliary devices are usually required to clean contaminants on the wafer surface to ensure the etching accuracy of the wafer during the etching process and reduce the presence of foreign matter and contaminants on the wafer surface, which may affect the uniformity of vacuum adsorption and cause insufficient local adsorption force, thereby causing factors of deviation. In the process of assisting in cleaning contaminants on the wafer surface, it is necessary to clean the contaminants on the wafer surface according to actual production needs. In existing semiconductor manufacturing, due to the large-scale production of wafers, automated cleaning equipment is usually used to assist in cleaning contaminants on the wafer surface. However, the cost and maintenance cost of automated cleaning equipment and process flow are relatively high, and are not suitable for use in small batches of wafers, special processes or wafers in the research and development stage. In these cases, the wafer output is small, large-scale automated cleaning equipment has large limitations, and there is a lack of corresponding small-scale cleaning equipment. When it is necessary to clean contaminants on the wafer surface, manual cleaning is still required.

[0004] Combining the above problems, we will find that it is difficult to avoid the above problems at the same time when using the existing wafer etching auxiliary devices on the market, and even if they can be solved, they need to be solved with the cooperation of external tools, which cannot achieve the desired effect. Therefore, we propose a wafer etching auxiliary device. Summary of the invention

[0005] The object of the present invention is to provide a wafer etching auxiliary device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a wafer etching auxiliary device, comprising a main body mechanism, the main body mechanism comprising a support table, the upper surface of the support table is respectively fixedly connected with a solution immersion box and a rinse box, the bottom surface of the support table is fixedly connected with four support columns, and an auxiliary mechanism is arranged above the support table;

[0007] The auxiliary mechanism comprises an immersion unit, which is located inside the solution immersion box and is used to immerse and decontaminate the surface of the wafer;

[0008] The auxiliary mechanism also includes a flushing unit, which is located inside the flushing box and is used in conjunction with the immersion unit to flush and dry the surface of the wafer;

[0009] A positioning mechanism is arranged outside the flushing unit, and the positioning mechanism is used in conjunction with an auxiliary mechanism to adjust the position of the wafer;

[0010] The immersion unit comprises a top frame plate, the inner wall of the top frame plate is fixedly connected to the left and right sides of the solution immersion box by bolts, the inner wall of the top frame plate is fixedly connected to an electric telescopic rod, the telescopic end of the electric telescopic rod is fixedly connected to an immersion shell, the interior of the immersion shell is slidably connected to an immersion frame, the inner wall of the immersion frame is fixedly connected to three inner connecting plates, the inner wall of each of the inner connecting plates is fixedly connected to a positioning frame, the interior of each of the inner connecting plates is clamped with a limiting plate, the bottom surface of each of the limiting plates is fixedly connected to a plurality of positioning feet, the bottom surface of each of the limiting plates is in contact with the upper surface of the positioning frame, the back of the solution immersion box is fixedly connected to a connecting pipe, a heating chamber is provided inside the solution immersion box, and the The inner wall of the heating chamber is fixedly connected with a heating wire, the inner wall of the top frame plate is fixedly connected with four solution tanks, the upper surface of each solution tank is fixedly connected with a liquid injection pipe, the top end of each liquid injection pipe passes through the top of the solution immersion tank, the bottom surface of each solution tank is fixedly connected with a liquid discharge pipe, the outer surface of each liquid discharge pipe is fixedly connected with a valve, the upper surface of the support platform is fixedly connected with a water storage tank, the inner wall of the water storage tank is fixedly connected with a first water pump, the input end of the first water pump passes through the interior of the water storage tank, the output end of the first water pump is fixedly connected with a connecting pipe, the end of the connecting pipe away from the first water pump is fixedly connected with one end of the connecting pipe, and the left side of the top frame plate is fixedly connected with a timer;

[0011] The telescopic end of the electric telescopic rod is fixedly connected with a fixing ring, the bottom surface of the fixing ring is fixedly connected with the upper surface of the immersion shell, and the inner wall of each solution box is fixedly connected with a transparent plate;

[0012] The outer surface of the connecting pipe is fixedly connected with a positioning plate, the front of the positioning plate is fixedly connected with the back of the solution soaking box and the back of the water storage tank respectively, and the back of the solution soaking box is fixedly connected with a first drain pipe;

[0013] The upper surface and right side surface of the water storage tank are respectively fixedly connected with a water injection pipe and a second drainage pipe. The upper surface of the water storage tank is fixedly connected with three stabilizing plates, and the left side surface of each stabilizing plate is fixedly connected with the right side surface of the solution immersion box.

[0014] Preferably, the flushing unit includes a deionized water tank, the outer surface of the deionized water tank is fixedly connected to the inner wall of the flushing tank, a second water pump is fixedly connected to the inner wall of the deionized water tank, the input end of the second water pump passes through the interior of the deionized water tank, the output end of the second water pump is fixedly connected to a delivery pipe, a water collecting circle and two air collecting circles are arranged inside the flushing box, one end of the delivery pipe is fixedly connected to the outer surface of the water collecting circle, the outer surface of the water collecting circle is fixedly connected to ten water spray heads, three air inlet pipes and three exhaust pipes are fixedly connected to the inner walls of the solution immersion tank, respectively, the right ends of the three exhaust pipes are commonly fixedly connected to a circulation shell, the front of the circulation shell is fixedly connected to a ventilation pipe, the outer surface of the ventilation pipe is fixedly connected to an air pump, the two ends of the ventilation pipe away from the air pump pass through the flushing box and are fixedly connected to the outer surfaces of the two air collecting circles, the outer surface of each of the air collecting circles is fixedly connected to ten air nozzles, the upper surface of the support platform is provided with a circulation hole, the bottom surface of the support platform is fixedly connected to a collection box, and the upper surface of the support platform is fixedly connected to an observation platform.

[0015] Preferably, three fixed plates are fixedly connected to the upper surface of the circulation shell, the left side of each fixed plate is fixedly connected to the right side of the solution immersion box, the inner wall of each air inlet pipe is fixedly connected to a dust net, the inner wall of the collecting box is fixedly connected to an observation plate, and the front of the collecting box is fixedly connected to a discharge pipe.

[0016] Preferably, the outer surface of each of the air collecting rings and the outer surface of the water collecting ring are fixedly connected with four first reinforcement plates and two second reinforcement plates, and the outer surface of each of the first reinforcement plates and the outer surface of each of the second reinforcement plates are fixedly connected to the inner wall of the flushing box.

[0017] Preferably, two third reinforcement plates are fixedly connected to the outer surface of the delivery pipe, and the outer surface of each of the third reinforcement plates is fixedly connected to the inner wall of the flushing box.

[0018] Preferably, the positioning mechanism includes a stepper motor, the inner wall of the flushing box is rotatably connected to a transmission shaft via a bearing, the output end of the stepper motor is fixedly connected to the left end of the transmission shaft, the outer surface of the stepper motor is fixedly connected to the left side of the flushing box, the inner bottom wall of the flushing box is fixedly connected to a stabilizing shell, the stabilizing shell is rotatably connected to two guide shafts via a bearing, the transmission shaft is rotatably connected to the inner wall of the stabilizing shell via a bearing, each of the two ends of the guide shaft is fixedly connected to a first bevel gear, the end of the transmission shaft away from the stepper motor is fixedly connected to a second bevel gear, the flushing box is rotatably connected to two spiral shafts via a bearing, the top end of each spiral shaft passes through the top of the deionized water tank, the outer surface of each spiral shaft is fixedly connected to a third bevel gear, and the outer surface of each spiral shaft is spirally connected to a fourth bevel gear , wherein the outer surfaces of two of the first bevel gears are meshed with the outer surfaces of the second bevel gears, and the outer surfaces of the other two first bevel gears are meshed with the outer surfaces of two third bevel gears, and the outer surface of each of the spiral shafts is spirally connected with an adjustment plate, and a wafer placement seat is arranged inside the flushing box, and the back of the wafer placement seat is fixedly connected with a first connecting shaft, and the first connecting shaft is rotatably connected to the front of one of the adjustment plates through a bearing, and the front of the wafer placement seat is fixedly connected with a second connecting shaft, and the outer surface of the second connecting shaft is fixedly connected with a sealed bearing, and the front of the sealed bearing is fixedly connected to the back of another adjustment plate, and the outer surface of the second connecting shaft is fixedly connected with a fifth bevel gear, and the outer surface of the fifth bevel gear is meshed with the outer surface of the fourth bevel gear, and a closing plate is clamped inside the wafer placement seat.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention can facilitate the reaction of wafers with chemical solutions and the reaction of chemical solvents with residual pollutants on the surface of wafers by setting an immersion unit. Different chemical solvents can be used according to the different pollutants on the surface of wafers. Moreover, the device is relatively small in size and occupies relatively little space. Compared with large-scale automatic cleaning equipment, the cost of manufacturing and maintenance is relatively low. It is suitable for use in small batches of wafers, wafers in special processes or in the research and development stage, and can effectively cooperate with manual work to quickly clean the pollutants on the surface of wafers.

[0021] 2. The present invention provides a flushing unit, which can further flush the residual contaminants on the wafer surface on the basis of the immersion unit, and remove the residual chemical solution and dissolved contaminants on the wafer surface by plasma water, thereby effectively removing the contaminants on the wafer surface, ensuring the cleanliness of the wafer surface, facilitating the etching of the wafer, and effectively increasing the flushing effect. After the cleaning is completed by plasma water, the wafer surface is directly dried to increase the cleaning efficiency of the wafer.

[0022] 3. The present invention can cooperate with the immersion unit and the flushing unit by setting a positioning mechanism to further increase the integrity of the auxiliary structure cleaning, facilitate diversified angle adjustment of the wafer during the process of flushing and drying the wafer surface, facilitate uniform cleaning of the wafer surface, and effectively increase the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a structural schematic diagram of the second drainage pipe of the present invention;

[0025] Figure 3 It is a cross-sectional structural schematic diagram of the flushing box of the present invention;

[0026] Figure 4 It is a structural schematic diagram of the solution tank of the present invention;

[0027] Figure 5 It is a schematic diagram of the structure of the immersion shell of the present invention;

[0028] Figure 6 It is a structural schematic diagram of the positioning frame of the present invention;

[0029] Figure 7 It is a schematic diagram of the structure of the positioning foot of the present invention;

[0030] Figure 8 It is a schematic cross-sectional structure diagram of the solution soaking box of the present invention;

[0031] Fig. 9 It is a structural schematic diagram of the stepping motor of the present invention;

[0032] Fig.10 It is a structural schematic diagram of the deionized water tank of the present invention;

[0033] Fig.11 It is a structural schematic diagram of the spiral shaft of the present invention;

[0034] Fig.12 It is a structural schematic diagram of the air pump of the present invention.

[0035] In the figure: 1. main body; 11. support platform; 12. solution immersion tank; 13. flushing tank; 14. support column; 2. auxiliary mechanism; 21. immersion unit; 2101. water storage tank; 2102. water injection pipe; 2103. solution tank; 2104. electric telescopic rod; 2105. injection pipe; 2106. transparent plate; 2107. timer; 2108. stabilizing plate; 2109. connecting pipe; 2110. second drain pipe; 2111. first water pump; 2112. top Frame plate; 2113, fixing ring; 2114, positioning plate; 2115, valve; 2116, drain pipe; 2117, immersion shell; 2118, positioning frame; 2119, internal plate; 2120, immersion and extraction frame; 2121, limit plate; 2122, positioning foot; 2123, first drain pipe; 2124, connecting pipe; 2125, heating wire; 2126, heating chamber; 22, flushing unit; 2201, collection box; 2202, discharge pipe; 2203, observation platform; 2 204, air inlet pipe; 2205, air nozzle; 2206, observation plate; 2207, flow hole; 2208, deionized water tank; 2209, water collecting ring; 2210, second water pump; 2211, third reinforcement plate; 2212, vent pipe; 2213, air pump; 2214, air collecting ring; 2215, circulation shell; 2216, fixing plate; 2217, dustproof net; 2218, delivery pipe; 2219, sprinkler head; 2220, second reinforcement plate; 2221, first Reinforcement plate; 2222, exhaust pipe; 3, positioning mechanism; 301, stepping motor; 302, adjustment plate; 303, screw shaft; 304, closing plate; 305, wafer placement seat; 306, first connecting shaft; 307, second connecting shaft; 308, sealed bearing; 309, fourth bevel gear; 310, fifth bevel gear; 311, guide shaft; 312, first bevel gear; 313, third bevel gear; 314, second bevel gear; 315, stabilizing shell; 316, transmission shaft. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Example 1: Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8The present invention provides a technical solution: a wafer etching auxiliary device, comprising a main mechanism 1, the main mechanism 1 comprises a support table 11, the upper surface of the support table 11 is respectively fixedly connected with a solution immersion box 12 and a washing box 13, the bottom surface of the support table 11 is fixedly connected with four support columns 14, and an auxiliary mechanism 2 is arranged above the support table 11;

[0038] The auxiliary mechanism 2 includes an immersion unit 21 , which is located inside the solution immersion box 12 . The immersion unit 21 is used to immerse and decontaminate the surface of the wafer.

[0039] As a further limitation of the auxiliary mechanism 2 of the present invention, the immersion unit 21 includes a top frame plate 2112, the inner wall of the top frame plate 2112 is fixedly connected to the left and right sides of the solution immersion box 12 by bolts, the inner wall of the top frame plate 2112 is fixedly connected to the electric telescopic rod 2104, the telescopic end of the electric telescopic rod 2104 is fixedly connected to the immersion shell 2117, the interior of the immersion shell 2117 is slidably connected to the immersion rack 2120, the inner wall of the immersion rack 2120 is fixedly connected to three inner connecting plates 2119, the inner wall of each inner connecting plate 2119 is fixedly connected to a positioning frame 2118, and each inner connecting plate 211 9 are all clamped with a limit plate 2121, and the bottom surface of each limit plate 2121 is fixedly connected with a plurality of positioning feet 2122, and the bottom surface of each limit plate 2121 is in contact with the upper surface of the positioning frame 2118. The back of the solution immersion box 12 is fixedly connected with a connecting pipe 2124, and a heating chamber 2126 is provided inside the solution immersion box 12. The inner wall of the heating chamber 2126 is fixedly connected with a heating wire 2125. The inner wall of the top frame plate 2112 is fixedly connected with four solution boxes 2103, and the upper surface of each solution box 2103 is fixedly connected with an injection pipe 2105, and each injection pipe 2 The top of each solution tank 2103 is connected to the top of the solution immersion tank 12, the bottom of each solution tank 2103 is fixedly connected to a drain pipe 2116, the outer surface of each drain pipe 2116 is fixedly connected to a valve 2115, the upper surface of the support platform 11 is fixedly connected to a water storage tank 2101, the inner wall of the water storage tank 2101 is fixedly connected to a first water pump 2111, the input end of the first water pump 2111 is connected to the inside of the water storage tank 2101, the output end of the first water pump 2111 is fixedly connected to a connecting pipe 2109, and the end of the connecting pipe 2109 away from the first water pump 2111 is connected to the connecting pipe 2124 One end of the top frame plate 2112 is fixedly connected, and a timer 2107 is fixedly connected to the left side of the top frame plate 2112. By setting the immersion unit 21, it is convenient to react the wafer with the chemical solution, and it is convenient for the chemical solvent to react with the residual pollutants on the wafer surface. Different chemical solvents can be used according to the different pollutants on the wafer surface. In addition, the device is relatively small in size and occupies a relatively small space. Compared with large-scale automatic cleaning equipment, the cost and maintenance cost are relatively low. It is suitable for small batches of wafers, wafers in special processes or research and development stages, and can effectively cooperate with manual work to quickly clean the pollutants on the wafer surface;

[0040] See also Figure 4 and Figure 5The telescopic end of the electric telescopic rod 2104 is fixedly connected with a fixing ring 2113, the bottom surface of the fixing ring 2113 is fixedly connected with the upper surface of the immersion shell 2117, and the inner wall of each solution box 2103 is fixedly connected with a transparent plate 2106. Through the fixing ring 2113, it is convenient to increase the connection of the electric telescopic rod 2104 to prevent it from falling off. Through the transparent plate 2106, it is convenient to observe the solution inside the solution box 2103, so as to facilitate the addition and use of the solution;

[0041] See also Figure 2 , Figure 3 and Figure 8 The outer surface of the connecting pipe 2109 is fixedly connected with a positioning plate 2114, and the front of the positioning plate 2114 is fixedly connected with the back of the solution immersion box 12 and the back of the water storage tank 2101 respectively. The back of the solution immersion box 12 is fixedly connected with a first drain pipe 2123. Through the positioning plate 2114, the connecting pipe 2109 can be conveniently positioned, effectively increasing the fixing effect. Through the first drain pipe 2123, the solution immersion box 12 can be conveniently drained, effectively increasing the use effect;

[0042] See also Figure 1 and Figure 2 The upper surface and the right side of the water tank 2101 are respectively fixedly connected with a water injection pipe 2102 and a second drainage pipe 2110. The upper surface of the water tank 2101 is fixedly connected with three stabilizing plates 2108. The left side of each stabilizing plate 2108 is fixedly connected to the right side of the solution immersion tank 12. Through the water injection pipe 2102 and the second drainage pipe 2110, the water tank 2101 can be conveniently filled with water and drained, and its use is convenient. Through the stabilizing plate 2108, the stability of the water tank 2101 and the solution immersion tank 12 can be increased.

[0043] The specific implementation of this embodiment is as follows: first, the electric telescopic rod 2104, the first water pump 2111 and the heating wire 2125 are connected to the external power supply, four solution tanks 2103 are arranged inside the top frame plate 2112, and different types of chemical solutions, such as acid, alkali and organic solvent, can be injected into the four solution tanks 2103, and water is injected into the water tank 2101 through the water injection pipe 2102, and then the wafers are placed in the circular cavity of the positioning frame 2118 in sequence, and then the limiting plate 2121 is clamped in the inner plate 2119, and the positioning feet 2122 at the bottom of the inner plate 2119 are aligned with the surface of the wafer. The wafer is connected to the circular cavity of the positioning frame 2118 by surface contact, and the entire immersion frame 2120 is slidably connected to the immersion shell 2117. The first water pump 2111 is used to extract the water source in the water storage tank 2101, and the water source is injected into the solution immersion box 12 through the connecting pipe 2109 and the connecting pipe 2124. The water is injected into the solution immersion box 12 after one-third of the position is filled. The required chemical cleaning agent is determined according to the type and nature of the contaminants on the surface of the wafer. After the determination is completed, the valve 2115 is manually opened directly to allow the chemical solution to be directly injected into the solution immersion box 12 through the drain pipe 2116. After a certain amount of water is poured in, the valve 2115 is manually closed. The chemical solution is diffused and mixed in the water after direct contact with the water source. The electric telescopic rod 2104 is directly controlled to adjust the position of the immersion shell 2117 so that it drops to the bottom of the solution immersion box 12 and completely immerses the inside of the mixed chemical solution. The mixed chemical solvent directly immerses the surface of the wafer through the water inlet hole on the surface of the immersion shell 2117, the water inlet on the surface of the immersion rack 2120, the side water inlet hole of the internal plate 2119, the water inlet on the surface of the positioning rack 2118 and the through hole on the surface of the limit plate 2121. When the cleaning temperature needs to be controlled, the heating wire 2125 can be directly turned on. The heating wire 2125 is directly heated inside the heating chamber 2126 to heat the mixed chemical solution inside the solution immersion box 12. The temperature of the heating wire 2125 can be controlled by an external control unit, and timing is performed by the timer 2107 to facilitate sufficient contact and reaction between the wafer surface and the chemical solution. When the timing is completed, the position of the electric telescopic rod 2104 is directly adjusted to take out the wafer, and the next batch of wafers that need to be cleaned can be repeated according to the above steps. When the chemical solvent inside the solution immersion box 12 is used many times and needs to be replaced, it can be directly discharged through the first drain pipe 2123.

[0044] Example 2: Please refer to Fig. 9 , Fig.10 and Fig.12 The present invention provides a technical solution: a wafer etching auxiliary device. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. The auxiliary mechanism 2 also includes a flushing unit 22, which is located inside the flushing box 13. The flushing unit 22 is used in conjunction with the immersion unit 21. The flushing unit 22 is used to flush and dry the wafer surface.

[0045] As a further limitation of the auxiliary mechanism 2 of the present invention, the flushing unit 22 includes a deionized water tank 2208, the outer surface of the deionized water tank 2208 is fixedly connected to the inner wall of the flushing box 13, the inner wall of the deionized water tank 2208 is fixedly connected to a second water pump 2210, the input end of the second water pump 2210 passes through the interior of the deionized water tank 2208, the output end of the second water pump 2210 is fixedly connected to a delivery pipe 2218, a water collecting circle 2209 and two air collecting circles 2214 are provided inside the flushing box 13, one end of the delivery pipe 2218 is fixedly connected to the outer surface of the water collecting circle 2209, the outer surface of the water collecting circle 2209 is fixedly connected to ten water spray heads 2219, the inner wall of the solution immersion box 12 is respectively fixedly connected to three air inlet pipes 2204 and three exhaust pipes 2222, the right ends of the three exhaust pipes 2222 are commonly fixedly connected to a circulation shell 2215, the front of the circulation shell 2215 is fixedly connected to a ventilation pipe 2212, The outer surface of the air pipe 2212 is fixedly connected to an air pump 2213, and the two ends of the vent pipe 2212 away from the air pump 2213 pass through the flushing box 13 and are fixedly connected to the outer surfaces of the two air collecting rings 2214, and the outer surface of each air collecting ring 2214 is fixedly connected to ten air nozzles 2205, and the upper surface of the support table 11 is provided with a flow hole 2207, and the bottom surface of the support table 11 is fixedly connected to a collection box 2201, and the upper surface of the support table 11 is fixedly connected to an observation platform 2203. By setting up a flushing unit 22, residual contaminants on the surface of the wafer can be further flushed on the basis of the immersion unit 21, and residual chemical solutions and dissolved contaminants on the surface of the wafer can be removed by plasma water, and contaminants on the surface of the wafer can be further effectively removed, thereby ensuring the cleanliness of the wafer surface, facilitating etching of the wafer, and effectively increasing the flushing effect. After the cleaning by plasma water is completed, the surface of the wafer is directly dried to increase the cleaning efficiency of the wafer;

[0046] See also Figure 3 and Figure 8 , three fixing plates 2216 are fixedly connected to the upper surface of the circulation shell 2215, and the left side of each fixing plate 2216 is fixedly connected to the right side of the solution immersion box 12, and the inner wall of each air inlet pipe 2204 is fixedly connected to a dustproof net 2217, and the inner wall of the collecting box 2201 is fixedly connected to an observation plate 2206, and the front of the collecting box 2201 is fixedly connected to a discharge pipe 2202, and the connection between the circulation shell 2215 and the solution immersion box 12 can be conveniently increased through the fixing plate 2216 to prevent instability, and the dust in the air can be blocked through the dustproof net 2217 to effectively increase the filtering effect, and the collected liquid inside the collecting box 2201 can be conveniently observed through the observation plate 2206, and the liquid inside the collecting box 2201 can be conveniently discharged through the discharge pipe 2202;

[0047] See also Figure 3 and Fig.12 The outer surface of each air collecting ring 2214 and the outer surface of the water collecting ring 2209 are fixedly connected with four first reinforcing plates 2221 and two second reinforcing plates 2220. The outer surface of each first reinforcing plate 2221 and the outer surface of the second reinforcing plate 2220 are fixedly connected to the inner wall of the flushing box 13. The first reinforcing plates 2221 and the second reinforcing plates 2220 can effectively increase the stability of the air collecting ring 2214 and the water collecting ring 2209 to prevent them from falling off.

[0048] See also Fig. 9 Two third reinforcement plates 2211 are fixedly connected to the outer surface of the delivery pipe 2218, and the outer surface of each third reinforcement plate 2211 is fixedly connected to the inner wall of the flushing box 13. The third reinforcement plates 2211 can effectively increase the stability of the delivery pipe 2218 and avoid shaking of the delivery pipe 2218 due to unstable water pressure.

[0049] The specific implementation of this embodiment is as follows: first connect the air pump 2213 and the second water pump 2210 to the external power supply, first inject deionized water into the deionized water tank 2208 through the water inlet of the deionized water tank 2208, directly move the wafer that has completed the chemical reaction to the bottom of the rinse tank 13 through the positioning mechanism 3, so that the wafer is located in the middle of the water collecting circle 2209, directly extract the deionized water in the deionized water tank 2208 through the second water pump 2210, and deliver the deionized water to the water collecting circle 2209 through the delivery pipe 2218, and then spray the deionized water on the surface of the wafer through the spray head 2219 on the surface of the water collecting circle 2209 to remove the residual chemical solution and dissolved pollutants on the surface of the wafer. After the rinsing is completed, lift the wafer to the middle of the air collecting circle 2214, and directly use the air pump 2213 to generate suction The hot air inside the heating chamber 2126 is extracted by force, and the hot air enters the air collecting circle 2214 through the circulation shell 2215 and the ventilation pipe 2212, and is sprayed on the surface of the wafer through the air nozzle 2205 for drying. When the heat inside the heating chamber 2126 is extracted, the outside air can enter the heating chamber 2126 through the air inlet pipe 2204, so that air circulates continuously, and the heat generated by the heating wire 2125 is directly recycled to dry the surface of the wafer, thereby improving resource utilization and recycling energy. This device is suitable for small batch wafers, special processes or wafers in the research and development stage. After drying, they are taken out and placed on the observation table 2203 for observation. After they are completely removed, they can be directly etched. If there are any contaminants that have not been cleaned up, they can be directly cleaned again.

[0050] Example 3: Please refer to Fig.11The present invention provides a technical solution: a wafer etching auxiliary device. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. A positioning mechanism 3 is arranged on the outside of the flushing unit 22. The positioning mechanism 3 is used in conjunction with the auxiliary mechanism 2. The positioning mechanism 3 is used to adjust the position of the wafer.

[0051] As a further limitation of the auxiliary mechanism 2 of the present invention, the positioning mechanism 3 includes a stepper motor 301, the inner wall of the flushing box 13 is rotatably connected to a transmission shaft 316 through a bearing, the output end of the stepper motor 301 is fixedly connected to the left end of the transmission shaft 316, the outer surface of the stepper motor 301 is fixedly connected to the left side of the flushing box 13, the inner bottom wall of the flushing box 13 is fixedly connected to a stabilizing shell 315, the stabilizing shell 315 is rotatably connected to two guide shafts 311 through a bearing, the transmission shaft 316 is rotatably connected to the inner wall of the stabilizing shell 315 through a bearing, and both ends of each guide shaft 311 are fixedly connected. The first bevel gear 312 is fixedly connected to the first bevel gear 314, and the end of the transmission shaft 316 away from the stepping motor 301 is fixedly connected to the second bevel gear 314. The flushing box 13 is rotatably connected to the two spiral shafts 303 through the bearing, and the top of each spiral shaft 303 penetrates the top of the deionized water tank 2208. The outer surface of each spiral shaft 303 is fixedly connected to the third bevel gear 313, and the outer surface of each spiral shaft 303 is spirally connected to the fourth bevel gear 309, wherein the outer surfaces of the two first bevel gears 312 are meshed with the outer surfaces of the second bevel gear 314, and the other two first bevel gears are meshed with the outer surfaces of the second bevel gears 314. The outer surface of the wheel 312 meshes with the outer surfaces of the two third bevel gears 313. The outer surface of each spiral shaft 303 is spirally connected to an adjustment plate 302. A wafer placement seat 305 is arranged inside the washing box 13. The back of the wafer placement seat 305 is fixedly connected to a first connecting shaft 306. The first connecting shaft 306 is rotatably connected to the front of one of the adjustment plates 302 through a bearing. The front of the wafer placement seat 305 is fixedly connected to a second connecting shaft 307. The outer surface of the second connecting shaft 307 is fixedly connected to a sealed bearing 308. The front of the sealed bearing 308 is fixedly connected to the other The back of an adjustment plate 302 is fixedly connected, the outer surface of the second connecting shaft 307 is fixedly connected with a fifth bevel gear 310, the outer surface of the fifth bevel gear 310 is meshed with the outer surface of the fourth bevel gear 309, and the interior of the wafer placement seat 305 is clamped with a closing plate 304. By setting the positioning mechanism 3, it can cooperate with the immersion unit 21 and the flushing unit 22 to further increase the integrity of the auxiliary structure cleaning, facilitate the diversified angle adjustment of the wafer during the process of flushing and drying the wafer surface, facilitate uniform cleaning of the wafer surface, and effectively increase the cleaning effect;

[0052] The specific implementation of this embodiment is as follows: first, the stepper motor 301 is connected to the external power supply. When the immersion reaction of the wafer with the chemical solvent is completed, it can be placed on the wafer placement seat 305. The wafer is adjusted by the adjustment mechanism 3 to facilitate the cleaning and drying of the wafer. The wafer is directly placed on the wafer placement seat 305 and is limited by the closing plate 304 clamped on the wafer placement seat 305. When the wafer needs to be adjusted up and down, the stepper motor 301 can be directly used to drive the transmission shaft 316 to rotate. The transmission shaft 316 drives the second bevel gear 314 to rotate. The second bevel gear 314 directly drives the two first bevel gears 312 inside the stabilizing shell 315 to rotate. The two first bevel gears 312 inside the stabilizing shell 315 are driven to rotate through the guide shaft 311. The third bevel gear 313 is driven to rotate through the two first bevel gears 312 outside the stabilizing shell 315. The two spiral shafts 303 are directly driven to rotate through the third bevel gear 313. The spiral connection with the adjustment plate 302 directly drives the adjustment plate 302 to adjust up and down, and the wafer placement seat 305 is driven to adjust up and down through the two adjustment plates 302, and then the spiral shaft 303 drives the fourth bevel gear 309 to move up and down on the spiral shaft 303 in a spiral lifting manner, and the fifth bevel gear 310 is driven to rotate in a spiral ascending manner on the spiral shaft 303. The speed of the fourth bevel gear 309 to move up and down is consistent with the speed of the adjustment plate 302 to move up and down, and the fifth bevel gear 310 is driven to rotate during the movement. The fifth bevel gear 310 can be directly rotated inside the sealed bearing 308 through the second connecting shaft 307, so that the back side of the wafer placement seat 305 rotates on one of the adjustment plates 302 through the first connecting shaft 306, and further while the wafer is adjusted up and down through the wafer placement seat 305, the wafer is flipped and adjusted, thereby increasing the diversified adjustment of the wafer, facilitating the increase of the rinsing efficiency and drying efficiency of the wafer, and effectively increasing the use effect.

[0053] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0054] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer etching auxiliary device, comprising a main body mechanism (1), Features: The main mechanism (1) comprises a support platform (11), the upper surface of the support platform (11) being fixedly connected to a solution soaking box (12) and a flushing box (13), the bottom surface of the support platform (11) being fixedly connected to four support columns (14), and an auxiliary mechanism (2) being arranged above the support platform (11); The auxiliary mechanism (2) comprises an immersion unit (21), the immersion unit (21) being located inside the solution immersion box (12), and the immersion unit (21) being used to immerse and decontaminate the surface of the wafer; The auxiliary mechanism (2) further comprises a flushing unit (22), the flushing unit (22) being located inside the flushing box (13), the flushing unit (22) being used in conjunction with the immersion unit (21), and the flushing unit (22) being used to flush and dry the surface of the wafer; A positioning mechanism (3) is arranged outside the flushing unit (22), the positioning mechanism (3) is used in conjunction with the auxiliary mechanism (2), and the positioning mechanism (3) is used to adjust the position of the wafer; The immersion unit (21) comprises a top frame plate (2112), the inner wall of the top frame plate (2112) being fixedly connected to the left and right side surfaces of the solution immersion box (12) by means of bolts, the inner wall of the top frame plate (2112) being fixedly connected to an electric telescopic rod (2104), the telescopic end of the electric telescopic rod (2104) being fixedly connected to an immersion shell (2117), the interior of the immersion shell (2117) being slidably connected to an immersion rack (2120), the inner wall of the immersion rack (2120) being fixedly connected to three inner connecting plates (2119), each of the inner connecting plates (2119) The inner wall of the connecting plate (2119) is fixedly connected to a positioning frame (2118), the interior of each of the inner connecting plates (2119) is clamped with a limiting plate (2121), the bottom surface of each of the limiting plates (2121) is fixedly connected to a plurality of positioning feet (2122), the bottom surface of each of the limiting plates (2121) is in contact with the upper surface of the positioning frame (2118), the back of the solution immersion box (12) is fixedly connected to a connecting pipe (2124), the interior of the solution immersion box (12) is provided with a heating chamber (2126), and the heating chamber (2126) is provided with a heating chamber (2126). The inner wall of the top frame plate (2112) is fixedly connected to a heating wire (2125), the inner wall of the top frame plate (2112) is fixedly connected to four solution boxes (2103), the upper surface of each solution box (2103) is fixedly connected to a liquid injection pipe (2105), the top end of each liquid injection pipe (2105) penetrates to the top of the solution immersion box (12), the bottom surface of each solution box (2103) is fixedly connected to a liquid discharge pipe (2116), the outer surface of each liquid discharge pipe (2116) is fixedly connected to a valve (2115), and the support platform ( 11) is fixedly connected to the upper surface of a water tank (2101), the inner wall of the water tank (2101) is fixedly connected to a first water pump (2111), the input end of the first water pump (2111) penetrates into the interior of the water tank (2101), the output end of the first water pump (2111) is fixedly connected to a connecting pipe (2109), one end of the connecting pipe (2109) away from the first water pump (2111) is fixedly connected to one end of a connecting pipe (2124), and the left side of the top frame plate (2112) is fixedly connected to a timer (2107); The telescopic end of the electric telescopic rod (2104) is fixedly connected to a fixing ring (2113), the bottom surface of the fixing ring (2113) is fixedly connected to the upper surface of the immersion shell (2117), and the inner wall of each solution box (2103) is fixedly connected to a transparent plate (2106); The outer surface of the connecting pipe (2109) is fixedly connected to a positioning plate (2114); the front side of the positioning plate (2114) is fixedly connected to the back side of the solution soaking box (12) and the back side of the water storage tank (2101), respectively; and the back side of the solution soaking box (12) is fixedly connected to a first drain pipe (2123); The upper surface and right side surface of the water storage tank (2101) are respectively fixedly connected to a water injection pipe (2102) and a second drainage pipe (2110), and the upper surface of the water storage tank (2101) is fixedly connected to three stabilizing plates (2108), and the left side surface of each stabilizing plate (2108) is fixedly connected to the right side surface of the solution soaking tank (12).

2. A wafer etching auxiliary device according to claim 1, Features: The flushing unit (22) comprises a deionized water tank (2208), the outer surface of the deionized water tank (2208) being fixedly connected to the inner wall of the flushing tank (13), the inner wall of the deionized water tank (2208) being fixedly connected to a second water pump (2210), the input end of the second water pump (2210) extending into the interior of the deionized water tank (2208), the output end of the second water pump (2210) being fixedly connected to a delivery pipe (2218), the interior of the flushing tank (13) being provided with a water collecting ring (2209) and two air collecting rings (2214), one end of the delivery pipe (2218) being fixedly connected to the outer surface of the water collecting ring (2209), the outer surface of the water collecting ring (2209) being fixedly connected to ten water spray heads (2219), and the inner wall of the solution soaking tank (12) being fixedly connected to three air inlets (2214) and three air inlets (2214). The support platform (11) is provided with a flow hole (2207), the bottom surface of the support platform (11) is fixedly connected to a collection box (2201), and the top surface of the support platform (11) is fixedly connected to an observation platform (2203).

3. A wafer etching auxiliary device according to claim 2, Features: The upper surface of the circulation shell (2215) is fixedly connected to three fixed plates (2216), the left side of each fixed plate (2216) is fixedly connected to the right side of the solution immersion box (12), the inner wall of each air inlet pipe (2204) is fixedly connected to a dustproof net (2217), the inner wall of the collection box (2201) is fixedly connected to an observation plate (2206), and the front of the collection box (2201) is fixedly connected to a discharge pipe (2202).

4. A wafer etching auxiliary device according to claim 2, Features: The outer surface of each of the air collecting rings (2214) and the outer surface of the water collecting ring (2209) are fixedly connected to four first reinforcing plates (2221) and two second reinforcing plates (2220), and the outer surface of each of the first reinforcing plates (2221) and the outer surface of the second reinforcing plates (2220) are fixedly connected to the inner wall of the flushing box (13).

5. A wafer etching auxiliary device according to claim 2, Features: Two third reinforcement plates (2211) are fixedly connected to the outer surface of the delivery pipe (2218), and the outer surface of each of the third reinforcement plates (2211) is fixedly connected to the inner wall of the flushing box (13).

6. The wafer etching auxiliary device according to claim 1, Features: The positioning mechanism (3) comprises a stepper motor (301); the inner wall of the flushing box (13) is rotatably connected to a transmission shaft (316) via a bearing; the output end of the stepper motor (301) is fixedly connected to the left end of the transmission shaft (316); the outer surface of the stepper motor (301) is fixedly connected to the left side of the flushing box (13); the inner bottom wall of the flushing box (13) is fixedly connected to a stabilizing shell (315); the stabilizing shell (315) is rotatably connected to two guide shafts (311) via a bearing; the transmission shaft (316) is rotatably connected to the inner wall of the stabilizing shell (315) via a bearing. The first bevel gear (312) is fixedly connected to both ends of each guide shaft (311), the end of the transmission shaft (316) away from the stepping motor (301) is fixedly connected to the second bevel gear (314), the flushing box (13) is rotatably connected to two spiral shafts (303) via a bearing, the top end of each spiral shaft (303) penetrates above the deionized water tank (2208), the outer surface of each spiral shaft (303) is fixedly connected to the third bevel gear (313), and the outer surface of each spiral shaft (303) is spirally connected to the fourth bevel gear (314). 09), wherein the outer surfaces of two of the first bevel gears (312) mesh with the outer surfaces of the second bevel gears (314), and the outer surfaces of the other two of the first bevel gears (312) mesh with the outer surfaces of the two third bevel gears (313), and the outer surface of each of the spiral shafts (303) is spirally connected to an adjustment plate (302), and a wafer placement seat (305) is provided inside the washing box (13), and the back of the wafer placement seat (305) is fixedly connected to a first connecting shaft (306), and the first connecting shaft (306) is connected to one of the adjustment plates (302) through a bearing. ), the front side of the wafer placement seat (305) is rotatably connected to the front side thereof, the front side of the wafer placement seat (305) is fixedly connected to a second connecting shaft (307), the outer surface of the second connecting shaft (307) is fixedly connected to a sealed bearing (308), the front side of the sealed bearing (308) is fixedly connected to the back side of another adjustment plate (302), the outer surface of the second connecting shaft (307) is fixedly connected to a fifth bevel gear (310), the outer surface of the fifth bevel gear (310) is meshed with the outer surface of the fourth bevel gear (309), and a closing plate (304) is clamped inside the wafer placement seat (305).

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