Method, System, Device and Storage Medium for Determining Parameters of Dual-Side Heat Dissipation Encapsulation Device

Abstract

This application is applicable to the field of semiconductor technology, and provides a method, a system, a device and a storage medium for determining parameters of a double-sided heat dissipation packaging device. The method includes: using a performance prediction model to predict the structural performance to obtain the structural performance data of each design scheme, taking the minimization of the thermal stress value and the heat dissipation performance parameter as the goal, optimizing the performance of two or more design schemes of the double-sided heat dissipation packaging device to obtain the target design scheme, and then preparing a packaging structure sample; when it is tested that the performance of the packaging structure sample does not meet the requirements, changing the materials and / or dimensions of each structure as variables, and repeating the iteration until the performance of the packaging structure sample meets the requirements, and outputting the target design scheme that meets the requirements as the double-sided heat dissipation packaging device model for product preparation. It can reduce the dependence on the experience of developers, significantly reduce the product trial-and-error design process, thereby effectively shortening the product development cycle and reducing the development cost.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular, to a method, system, device, and storage medium for determining parameters of a double-sided heat dissipation packaging device. Background Art

[0002] With the evolution of power semiconductor devices towards high integration, high frequency, and miniaturization, the packaging density and operating speed of power devices continue to increase, resulting in an increase in chip power consumption and heat flux density. As a result, a large amount of heat energy is generated during the operation of power devices, making the need for efficient thermal management of power devices increasingly urgent. In view of this, the double-sided heat dissipation packaging technology, which can significantly improve the thermal performance of power devices, has become an inevitable trend in the development of power devices and their modules.

[0003] However, since the double-sided heat dissipation technology has not yet formed a unified industry standard and there are deficiencies in design theories and methods, the double-sided heat dissipation packaging technology faces several challenges. For example, double-sided heat dissipation packaging products all require unique structural designs to meet different performance requirements. During the product development process, the design and preparation processes of double-sided heat dissipation packaging products mainly rely on the experience of developers, often requiring continuous trial and error and iteration, resulting in a long design and development cycle and high design and development costs for the products. Summary of the Invention

[0004] The present invention provides a method, system, device, and storage medium for determining parameters of a double-sided heat dissipation packaging device to solve the problem that in the design and preparation processes of existing double-sided heat dissipation packaging products, continuous trial and error and iteration are required, resulting in a long product development cycle and high development costs.

[0005] In a first aspect, an embodiment of the present application provides a method for determining parameters of a double-sided heat dissipation packaging device, including:

[0006] Taking the materials and / or dimensions of each structure in the double-sided heat dissipation packaging device as variables, determining two or more design schemes for the double-sided heat dissipation packaging device;

[0007] Based on each design scheme, using a performance prediction model to predict the structural performance, obtaining the structural performance data of each design scheme, where the structural performance data includes the device thermal stress value and the heat dissipation performance parameters of each structure;

[0008] Taking the minimization of the thermal stress value and the heat dissipation performance parameters as the goal, performing performance optimization on two or more design schemes of the double-sided heat dissipation packaging device to obtain a target design scheme;

[0009] Based on the target design scheme, using a preset preparation method to prepare the double-sided heat dissipation packaging device to obtain a packaged structure sample;

[0010] When it is tested that the performance of the packaged structure sample does not meet the requirements, change the materials and / or dimensions of each structure to form two or more design schemes after parameter update, and optimize to obtain the target design scheme after parameter update, so as to re-prepare and test the packaged structure sample after parameter update until the performance of the packaged structure sample after parameter update meets the requirements, and output the target design scheme that meets the requirements as a double-sided heat dissipation packaged device model for product preparation.

[0011] Optionally, before changing the materials and / or dimensions of each structure to form two or more design schemes after parameter update, the method further includes:

[0012] Update the parameters of the performance prediction model based on the structural performance data of the target design scheme and the measured performance data of the packaged structure sample until the predicted structural performance data of the performance prediction model is consistent with the measured performance data;

[0013] Use the updated performance prediction model to re-predict the structural performance, and based on the re-predicted structural performance data of each design scheme, re-optimize the performance of each design scheme to obtain a new target design scheme;

[0014] Prepare a double-sided heat dissipation packaged device based on the new target design scheme to obtain a new packaged structure sample;

[0015] When it is tested that the performance of the new packaged structure sample does not meet the requirements, change the materials and / or dimensions of each structure to form two or more design schemes after parameter update.

[0016] In a second aspect, an embodiment of the present application provides a double-sided heat dissipation packaged device parameter determination system, including:

[0017] A parameter determination device, which uses the materials and / or dimensions of each structure in the double-sided heat dissipation packaged device as variables to determine two or more design schemes of the double-sided heat dissipation packaged device. Based on each design scheme, use a performance prediction model to predict the structural performance and obtain the structural performance data of each design scheme. The structural performance data includes the device thermal stress value and the heat dissipation performance parameters of each structure, and aims to minimize the thermal stress value and the heat dissipation performance parameters, and optimize the performance of two or more design schemes of the double-sided heat dissipation packaged device to obtain the target design scheme;

[0018] A sample preparation device, which is used to prepare a double-sided heat dissipation packaged device based on the target design scheme by using a preset preparation method to obtain a packaged structure sample;

[0019] A performance testing device, which is used to test the performance of the packaged structure sample, and when it is tested that the performance of the packaged structure sample meets the requirements, output the target design scheme that meets the requirements as a double-sided heat dissipation packaged device model for product preparation.

[0020] In a third aspect, an embodiment of the present application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the above-mentioned method for determining parameters of a double-sided heat dissipation packaging device are implemented, or the functions of each device in the above-mentioned system for determining parameters of a double-sided heat dissipation packaging device are realized.

[0021] In a fourth aspect, an embodiment of the present application provides a readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps of the above-mentioned method for determining parameters of a double-sided heat dissipation packaging device are implemented, or the functions of each device in the above-mentioned system for determining parameters of a double-sided heat dissipation packaging device are realized.

[0022] In a solution provided by the above-mentioned method, system, device, and storage medium for determining parameters of a double-sided heat dissipation packaging device, with the materials and / or dimensions of each structure in the double-sided heat dissipation packaging device as variables, two or more design schemes of the double-sided heat dissipation packaging device are determined; based on each design scheme, a performance prediction model is used to predict the structural performance, and the structural performance data of each design scheme is obtained; the structural performance data includes the device thermal stress value and the heat dissipation performance parameters of each structure, and with the goal of minimizing the thermal stress value and heat dissipation performance parameters, performance optimization is performed on two or more design schemes of the double-sided heat dissipation packaging device to obtain a target design scheme; based on the target design scheme, a preset preparation method is used to prepare the double-sided heat dissipation packaging device to obtain a packaged structure sample; when the performance of the tested packaged structure sample does not meet the requirements, the materials and / or dimensions of each structure are changed to form two or more design schemes with updated parameters, and the target design scheme with updated parameters is obtained through optimization, so as to re-prepare and test the packaged structure sample with updated parameters until the performance of the packaged structure sample with updated parameters meets the requirements, and the target design scheme that meets the requirements is output as a double-sided heat dissipation packaging device model for product preparation. In this embodiment, with the goal of minimizing the thermal stress value and heat dissipation performance parameters, performance optimization is performed on multiple design schemes. Only a small number of preparation tests and design parameter updates are required to obtain a parameter design scheme that meets the production target, which can reduce the dependence on the experience of developers, significantly reduce the product trial-and-error design process, effectively shorten the product development cycle, and reduce the development cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 It is a schematic structural diagram of a system for determining parameters of a double-sided heat dissipation packaging device in an embodiment of the present invention;

[0025] Figure 2 It is a schematic flow diagram of a method for determining parameters of a double-sided heat dissipation packaging device in an embodiment of the present invention;

[0026] Figure 3 It is an exploded view of a double-sided heat dissipation packaging device in an embodiment of the present invention;

[0027] Figure 4 It is Figure 2 a schematic implementation flow diagram of step S20 in;

[0028] Figure 5 It is Figure 2 a schematic implementation flow diagram of step S40 in;

[0029] Figure 6 It is a schematic structural diagram of a solderable coating device in an embodiment of the present invention;

[0030] Figure 7 It is a schematic structural diagram of an interconnection alignment welding device in an embodiment of the present invention;

[0031] Figure 8 It is Figure 1 a schematic structural diagram of the parameter determination device in;

[0032] Figure 9 It is a schematic structural diagram of an electronic device in an embodiment of the present invention.

[0033] Among them, the reference numerals in the figure are respectively:

[0034] 1 - Surface copper cladding layer of the upper DBC structure; 2 - Substrate ceramic layer of the upper DBC structure; 3 - Pattern copper cladding layer of the upper DBC structure; 4 - First solder layer; 5 - Spacer; 6 - Second solder layer; 7 - Power chip; 8 - Gate line; 9 - Third solder layer; 10 - Pattern copper cladding layer of the lower DBC structure; 11 - Substrate ceramic layer of the lower DBC structure; 12 - Surface copper cladding layer of the lower DBC structure; 13 - Terminal; 14 - Outer shell;

[0035] 21 - Upper cover plate; 22 - Lower base; 23 - Support rod; 31 - Base; 32 - Stud. Detailed implementation manners

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0037] It should be understood that when used in the specification and appended claims of the present invention, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations. It should also be understood that the term "and / or" as used in the specification and appended claims of the present invention refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0038] In addition, in the description of the specification and appended claims of the present invention, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0039] The reference to "one embodiment" or "some embodiments" etc. described in the specification of the present invention means that a specific feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present invention. Thus, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "comprising", "including", "having", and their variants all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0040] It should be understood that the magnitudes of the sequence numbers of the steps in the following embodiments do not mean the order of execution is prior or subsequent. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0041] To illustrate the technical solutions of the present invention, the following will be described through specific embodiments.

[0042] The method for determining the parameters of the double-sided heat dissipation packaging device provided by the embodiments of the present invention can be applied, for example, in Figure 1In the shown system for determining parameters of a double-sided heat dissipation packaging device, the system for determining parameters of a double-sided heat dissipation packaging device includes a parameter determination device, a sample preparation device, and a performance testing device. Among them, the sample preparation device and the performance testing device communicate with the parameter determination device respectively through a network or a cable. In other embodiments, the sample preparation device, the performance testing device, and the parameter determination device communicate with each other through a network or a cable.

[0043] Among them, the parameter determination device is used to determine two or more design schemes of the double-sided heat dissipation packaging device with the materials and / or dimensions of each structure in the double-sided heat dissipation packaging device as variables; based on each design scheme, use a performance prediction model to predict the structural performance, and obtain the structural performance data of each design scheme. The structural performance data includes the device thermal stress value and the heat dissipation performance parameters of each structure; with the goal of minimizing the thermal stress value and the heat dissipation performance parameters, perform performance optimization on two or more design schemes of the double-sided heat dissipation packaging device to obtain the target design scheme. The sample preparation device is used to prepare a double-sided heat dissipation packaging device using a preset preparation method based on the target design scheme to obtain a packaged structure sample. The performance testing device is used to test the performance of the packaged structure sample to obtain the measured performance data of the packaged structure sample, and test whether the performance of the packaged structure sample meets the requirements. When it is tested that the performance of the packaged structure sample meets the requirements, directly output the target design scheme that meets the requirements as the double-sided heat dissipation packaging device model for product preparation; when it is tested that the performance of the packaged structure sample meets the requirements, output the target design scheme that meets the requirements as the double-sided heat dissipation packaging device model for product preparation. When the performance testing device tests that the performance of the packaged structure sample does not meet the requirements, send a prompt that the performance does not meet the requirements to the parameter determination device and / or relevant personnel, so as to make subsequent structural parameter changes, sample preparation, and testing until it is tested that the performance of the packaged structure sample meets the requirements. For example, after receiving the prompt that the performance does not meet the requirements, the parameter determination device, that is, when it is determined that the performance of the packaged structure sample does not meet the requirements, changes the materials and / or dimensions of each structure to form two or more design schemes with updated parameters, and optimizes to obtain the target design scheme with updated parameters, and then sends the target design scheme with updated parameters to the sample preparation device for preparation to obtain a packaged structure sample with updated parameters; then test the packaged structure sample with updated parameters through the performance testing device. When the performance of the packaged structure sample with updated parameters meets the requirements, output the target design scheme that meets the requirements as the double-sided heat dissipation packaging device model for product preparation.

[0044] In this embodiment, taking the materials and / or dimensions of each structure in the double-sided heat dissipation packaging device as variables, two or more design schemes of the double-sided heat dissipation packaging device are determined; based on each design scheme, a performance prediction model is used to predict the structural performance, and the structural performance data of each design scheme are obtained; the structural performance data include the device thermal stress value and the heat dissipation performance parameters of each structure, and aiming at minimizing the thermal stress value and the heat dissipation performance parameters, performance optimization is carried out on two or more design schemes of the double-sided heat dissipation packaging device to obtain the target design scheme; based on the target design scheme, a preset preparation method is used to prepare the double-sided heat dissipation packaging device to obtain a packaging structure sample; when the performance of the tested packaging structure sample does not meet the requirements, the materials and / or dimensions of each structure are changed to form two or more design schemes with updated parameters, and the target design scheme with updated parameters is obtained through optimization, so as to re-prepare and test the packaging structure sample with updated parameters until the performance of the packaging structure sample with updated parameters meets the requirements, and the target design scheme that meets the requirements is output as the double-sided heat dissipation packaging device model for product preparation. In this embodiment, aiming at minimizing the thermal stress value and the heat dissipation performance parameters, performance optimization is carried out on multiple design schemes, and only a small number of preparation tests and design parameter updates are required to obtain a parameter design scheme that meets the production target, which can reduce the dependence on the experience of developers, significantly reduce the product trial-and-error design process, thereby effectively shortening the product development cycle and reducing the development cost.

[0045] In addition, during the process of iterative parameter change, taking the measured performance of the sample of the actual design scheme as feedback, the optimal double-sided heat dissipation packaging device model with a preparation process more suitable for the current requirements and product performance meeting the performance requirements can be obtained, improving the universality of the subsequent production products.

[0046] Among them, the sample preparation device includes each process preparation equipment or structure for preparing samples, and the performance testing device includes testing equipment for testing the performance of the packaging structure sample. In this embodiment, the double-sided heat dissipation packaging device parameter determination system includes a parameter determination device, a sample preparation device and a performance testing device, which is only for illustrative purposes. In other embodiments, the double-sided heat dissipation packaging device parameter determination system further includes a control device; the control device is used to control the sample preparation device to prepare a packaging structure sample and control the performance testing device to test the performance of the packaging structure sample. Among them, the control device can be the parameter determination device.

[0047] Among them, the parameter determination device can include but is not limited to various personal computers, laptop computers, smart phones, tablet computers and portable wearable devices. In other embodiments, the parameter determination device can also be a server, and the server can be implemented by an independent server or a server cluster composed of multiple servers.

[0048] In one embodiment, as Figure 2 shown, a method for determining parameters of a double-sided heat dissipation packaging device is provided. Taking the parameter determination device applied in Figure 1 as an example, the method includes the following steps:

[0049] S10: Taking the materials and / or dimensions of each structure in the double-sided heat dissipation packaging device as variables, determine two or more design schemes of the double-sided heat dissipation packaging device.

[0050] Among them, the structural design parameters include the materials and / or dimensions of each structure. Each structure in the double-sided heat dissipation packaging device includes structures such as pads, solder layers, substrate ceramic layers, and substrate copper-clad layers. That is, the design parameters of each structure in the design scheme include the design parameters of structures such as pads, solder layers, substrate ceramic layers, and substrate copper-clad layers.

[0051] After determining each structure included in the double-sided heat dissipation packaging device, the parameter determination device takes the materials and / or dimensions of each structure in the double-sided heat dissipation packaging device as variables, and randomly generates the design parameters (i.e., structural design parameters) of each structure in different design schemes, so as to obtain two or more design schemes of the double-sided heat dissipation packaging device.

[0052] For example, the materials of each structure can be selected first, and then the dimensions (such as thickness, surface area) of each structure are randomly selected as variables to obtain multiple design schemes. Among them, the materials of the corresponding structures in each design scheme are the same, but the dimensions are different. In other embodiments, the materials and dimensions of each structure can be randomly selected as variables at the same time to obtain two or more design schemes. At this time, the materials and dimensions of the corresponding structures in each design scheme may all be different.

[0053] S20: Based on each design scheme, use a performance prediction model to predict the structural performance, and obtain the structural performance data of each design scheme. The structural performance data includes the device thermal stress value and the heat dissipation performance parameters of each structure.

[0054] Then, the parameter determination device uses a performance prediction model to predict the structural performance based on each design scheme, and obtains the structural performance data. The structural performance data includes the device thermal stress value and the heat dissipation performance parameters of each structure.

[0055] Among them, the performance prediction model can be a neural network model based on deep learning. Using the performance prediction model to predict the structural performance has high accuracy and is fast.

[0056] S30: Taking the minimization of the thermal stress value and the heat dissipation performance parameters as the goal, perform performance optimization on two or more design schemes of the double-sided heat dissipation packaging device to obtain the target design scheme.

[0057] After obtaining the structural performance data of each design solution, the parameter determination device aims to minimize the thermal stress value and the heat dissipation performance parameter, and performs multi-objective performance optimization on two or more design solutions of the double-sided heat dissipation package device to obtain the target design solution. That is, the target design solution is the solution that optimally selects the thermal stress value and the heat dissipation performance parameter as a whole.

[0058] Among them, the heat dissipation performance parameter is used to measure the heat dissipation performance of the structure, and the thermal stress value refers to the stress generated by the structure due to temperature difference, which is used to measure the structural strength of the double-sided heat dissipation package device. After determining the heat dissipation performance parameter of each structure in each design solution and the device thermal stress value of each design solution, subsequent optimization can be performed based on the heat dissipation performance parameter and the device thermal stress value as the optimization objectives to iteratively optimize and obtain the final parameter design solution for the heat dissipation performance parameter and the structural strength.

[0059] For example, the heat dissipation performance parameter is the thermal resistance. Different design parameters (such as materials and dimensions) of each structure result in different thermal resistances of the structure, and the heat dissipation performance of the overall double-sided heat dissipation package device is also different. The smaller the thermal resistance, the better the heat dissipation performance of the structure. By using the thermal resistance values of each structure and the device thermal stress value of each design solution to characterize the structural performance of the double-sided heat dissipation package device in each design solution, the accuracy is higher, and a parameter design solution with better performance can be obtained.

[0060] S40: Based on the target design solution, use a preset preparation method to prepare the double-sided heat dissipation package device to obtain a packaged structure sample.

[0061] Then, based on the target design solution, the parameter determination device uses a preset preparation method to control the sample preparation device to prepare the double-sided heat dissipation package device to obtain a packaged structure sample, so that the parameters of each structure in the packaged structure sample are the same as those of the target design solution.

[0062] Among them, as Figure 3 shown, the structure of the double-sided heat dissipation package device, that is, the packaged structure sample, includes: an upper DBC (Direct Bond Copper) structure, a lower DBC structure, a power chip 7, and a housing 14; the lower DBC structure is provided with a positioning groove for accommodating the power chip 7, and the lower DBC structure is electrically connected to the gate line 8 of the power chip. Both the upper DBC structure and the lower DBC structure are provided with terminals 13. The upper DBC structure includes a substrate ceramic layer 2 and a substrate copper-clad layer (including a surface copper-clad layer 1 and a pattern copper-clad layer 3); the lower DBC structure includes a substrate ceramic layer 11 and a substrate copper-clad layer (including a surface copper-clad layer 12 and a pattern copper-clad layer 10). A solder layer (the first solder layer 4) is provided between the upper DBC structure and the spacer 5, and a solder layer (the second solder layer 6) is provided between the spacer 5 and the power chip 7. A solder layer (the third solder layer 9) is provided between the lower DBC structure and the power chip 7.

[0063] Correspondingly, the structural design parameters in each design scheme, that is, the structural design parameters in the target design scheme, include the design parameters of structures such as pads, solder layers, substrate ceramic layers, and substrate copper-clad layers. The design parameters include the materials and dimensions of each structure. According to the materials and dimensions of each structure in the target design scheme, a preset preparation method is used to control the sample preparation device to prepare a double-sided heat dissipation packaged device, and a packaged structure sample including the above structures is obtained.

[0064] S50: When it is tested that the performance of the packaged structure sample does not meet the requirements, change the materials and / or dimensions of each structure to form two or more design schemes with updated parameters, and optimize to obtain the target design scheme with updated parameters, so as to re-prepare and test the packaged structure sample with updated parameters until the performance of the packaged structure sample with updated parameters meets the requirements. Then, output the target design scheme that meets the requirements as the double-sided heat dissipation packaged device model for product preparation.

[0065] After obtaining the packaged structure sample, the parameter determination device controls the performance testing device to perform performance testing on the packaged structure sample to obtain the measured performance data of the packaged structure sample. When it is determined based on the measured performance data that the performance of the packaged structure sample does not meet the requirements, it means that the packaged structure sample designed by the original target design scheme has poor effects. The structural design parameters (i.e., materials and / or dimensions) of the double-sided heat dissipation packaged device can be changed to form two or more design schemes with updated parameters, and optimize to obtain the target design scheme with updated parameters, so as to re-prepare and test the packaged structure sample with updated parameters until the performance of the packaged structure sample with updated parameters meets the requirements. When it is tested that the performance of the packaged structure sample meets the requirements, it means that the structural design parameters in the current target design scheme meet the generation target. Then, the parameter determination device outputs the target design scheme that meets the requirements as the double-sided heat dissipation packaged device model for subsequent large-scale product preparation using this double-sided heat dissipation packaged device model.

[0066] In this embodiment, taking the materials and / or dimensions of each structure in the double-sided heat dissipation packaging device as variables, two or more design schemes of the double-sided heat dissipation packaging device are determined; based on each design scheme, a performance prediction model is used to predict the structural performance, and the structural performance data of each design scheme is obtained; the structural performance data includes the device thermal stress value and the heat dissipation performance parameters of each structure, and aiming at minimizing the thermal stress value and the heat dissipation performance parameters, performance optimization is carried out on two or more design schemes of the double-sided heat dissipation packaging device to obtain the target design scheme; based on the target design scheme, a preset preparation method is used to prepare the double-sided heat dissipation packaging device to obtain a packaging structure sample; when it is detected that the performance of the packaging structure sample does not meet the requirements, the materials and / or dimensions of each structure are changed to form two or more design schemes with updated parameters, and the target design scheme with updated parameters is obtained through optimization, so as to re-prepare and test the packaging structure sample with updated parameters until the performance of the packaging structure sample with updated parameters meets the requirements, and the target design scheme that meets the requirements is output as the double-sided heat dissipation packaging device model for product preparation. In this embodiment, aiming at minimizing the thermal stress value and the heat dissipation performance parameters, performance optimization is carried out on multiple design schemes, and only a small number of preparation tests and design parameter updates are required to obtain a parameter design scheme that meets the production target, which can reduce the dependence on the experience of developers, significantly reduce the product trial-and-error design process, thus effectively shortening the product development cycle and reducing the development cost.

[0067] In one embodiment, before step S40, that is, changing the materials and / or dimensions of each structure to form two or more design schemes with updated parameters, the method further specifically includes the following steps:

[0068] S61: Update the parameters of the performance prediction model based on the structural performance data of the target design scheme and the measured performance data of the packaging structure sample until the structural prediction data predicted by the performance prediction model is consistent with the measured performance data.

[0069] After obtaining the measured performance data of the packaging structure sample, when it is detected that the performance of the packaging structure sample does not meet the requirements, the parameter determination device updates the parameters of the performance prediction model based on the structural performance data of the target design scheme and the measured performance data of the packaging structure sample until the structural prediction data predicted by the performance prediction model is consistent with the measured performance data.

[0070] Specifically, when the structural performance data of the target design solution is inconsistent with or significantly different from the measured performance data of the package structure sample, it indicates that there may be a situation where the accuracy of the performance prediction model is insufficient, or the package structure sample designed by the original target design solution has poor effects. At this time, first update the parameters of the performance prediction model based on the structural performance data of the target design solution and the measured performance data of the package structure sample until the structural performance data predicted by the performance prediction model is consistent with the measured performance data, and the update operation is completed.

[0071] S62: Re-perform structural performance prediction using the updated performance prediction model, and re-optimize the performance of each design solution based on the structural performance data of each re-predicted design solution to obtain a new target design solution.

[0072] S63: Prepare a double-sided heat dissipation package device based on the new target design solution to obtain a new package structure sample.

[0073] Then, the parameter determination device uses the performance prediction model after parameter update, re-performs structural performance prediction using the updated performance prediction model, re-optimizes the performance of each design solution based on the structural performance data of each re-predicted design solution to obtain a new target design solution, and then prepares a double-sided heat dissipation package device based on the new target design solution to obtain a new package structure sample. That is, repeat the above steps S20 to S40 to obtain a new package structure sample.

[0074] Among them, the new target design solution may be different from the target design solution obtained in the previous step S30, that is, the new package structure sample has different design parameters such as materials and / or dimensions from the package structure sample obtained in step S40.

[0075] S64: When it is tested that the performance of the new package structure sample does not meet the requirements, change the materials and / or dimensions of each structure to form two or more design solutions after parameter update.

[0076] Then, perform performance tests on the new package structure samples. When it is tested that the performance of the new package structure samples does not meet the requirements, change the materials and / or dimensions of each structure to form two or more design schemes with updated parameters, and optimize to obtain the target design scheme with updated parameters, so as to re-prepare and test the package structure samples with updated parameters until the performance of the package structure samples with updated parameters meets the requirements, and output the target design scheme that meets the requirements as the double-sided heat dissipation package device model for product preparation. When the model prediction data is consistent with the measured data, if the performance of the package structure sample does not meet the requirements, it means that there is no problem with the model prediction accuracy for the time being. It may be affected by materials and / or dimensions, resulting in the structure performance not meeting the requirements. Only at this time, perform the above step S50. On the one hand, it can effectively eliminate the poor optimization effect caused by different model accuracies. On the other hand, perform model update during the scheme optimization process, which can improve the accuracy of the performance prediction model, thereby improving the accuracy of the scheme optimization, and further accelerating the search for the optimal design scheme.

[0077] In this embodiment, when it is tested that the performance of the package structure sample does not meet the requirements, update the parameters of the performance prediction model based on the structural performance data of the target design scheme and the measured performance data of the package structure sample until the predicted structural performance data of the performance prediction model is consistent with the measured performance data; use the updated performance prediction model to re-perform structural performance prediction, so as to re-optimize the performance of each design scheme based on the structural performance data of each re-predicted design scheme to obtain a new target design scheme; prepare a double-sided heat dissipation package device based on the new target design scheme to obtain a new package structure sample; when it is tested that the performance of the new package structure sample does not meet the requirements, change the materials and / or dimensions of each structure to form two or more design schemes with updated parameters. It can effectively eliminate the poor optimization effect caused by different model accuracies; perform model update during the scheme optimization process, which can improve the accuracy of the performance prediction model, thereby improving the accuracy of the scheme optimization, and further accelerating the search for the optimal design scheme.

[0078] In one embodiment, the structural performance data includes the heat dissipation performance parameters of each structure in each design scheme and the device thermal stress value of each design scheme. As Figure 4 shown, in step S20, that is, based on each design scheme, use the performance prediction model to perform structural performance prediction to obtain the structural performance data of each design scheme, which specifically includes the following steps:

[0079] S21: Determine the performance correlation parameters of each structure in each design scheme according to the materials and dimensions of each structure in each design scheme.

[0080] After obtaining multiple design solutions, the parameter determination device determines the performance correlation parameters of each structure in each design solution according to the materials and dimensions of each structure in each design solution. Among them, each structure in the design solution includes a solder layer, a substrate ceramic layer, a substrate copper-clad layer, and a spacer. That is, the parameter determination device needs the materials and dimensions corresponding to the solder layer, the substrate ceramic layer, the substrate copper-clad layer, and the spacer in each design solution, and determines the performance correlation parameters of the solder layer, the substrate ceramic layer, the substrate copper-clad layer, and the spacer in each design solution respectively. The dimensions of the structure include material thickness, size, etc.

[0081] Among them, the performance correlation parameters of the structure may include the material of the structure, the material thickness (i.e., the thickness of the structure), the material thermal conductivity, the equivalent heat conduction area, the material thermal expansion coefficient, the interface contact area, the total heat conduction coefficient, the material volume, the Young's modulus, etc. In other embodiments, to ensure the accuracy of the performance data of each structure in subsequent calculations, the performance correlation parameters of the structure may further include the solid shrinkage coefficient, the air gap coefficient, the radiation conduction coefficient, the average thermal conductivity of the two contact surfaces, the average roughness of the two contact surfaces, the surface root mean square roughness, the apparent contact pressure applied to the contact surface, the microhardness of the softer material on the contact surface, the Vickers display hardness correlation coefficient, the Brinell hardness, the material specific heat capacity, the material mass density, etc.

[0082] Among them, the equivalent heat conduction area is the cross-sectional area of the material through which heat flows, and can be directly represented by the cross-sectional area of the structure. The cross-sectional area is determined by the size of the structure. The interface contact area represents the contact area between this structure and the contact structure, and is determined by the size of this structure and the contact structure. The total heat conduction coefficient represents the total heat conduction coefficient of this structure, and is determined according to the specific structural state of this structure.

[0083] S22: Taking the performance correlation parameters of each structure in each design solution as inputs, using the performance prediction model to predict the structure performance of each design solution respectively, and obtaining the heat dissipation performance parameters of each structure in each design solution and the device thermal stress value of each design solution.

[0084] Then, the parameter determination device performs structure performance prediction using the performance prediction model based on the performance correlation parameters of each structure in each design solution, and determines the heat dissipation performance parameters of each structure in each design solution and the device thermal stress value of each design solution. Among them, the device thermal stress value represents the total thermal stress value of the double-sided heat dissipation package device constructed in this design solution.

[0085] The heat dissipation performance parameters are used to measure the heat dissipation performance of the structure, and the thermal stress value refers to the stress generated by the structure due to temperature differences, which is used to measure the structural strength of the double-sided heat dissipation packaging device. After determining the heat dissipation performance parameters of each structure in each design scheme and the device thermal stress value of each design scheme, subsequently, based on the heat dissipation performance parameters and the device thermal stress value as the optimization objectives, iterative optimization can be carried out to obtain the final parameter design scheme of the heat dissipation performance parameters and the structural strength.

[0086] In this embodiment, according to the materials and dimensions of each structure in each design scheme, the performance correlation parameters of each structure in each design scheme are determined. Furthermore, taking the performance correlation parameters of each structure in each design scheme as inputs, a performance prediction model is used to predict the structural performance of each design scheme, and the heat dissipation performance parameters of each structure in each design scheme and the device thermal stress value of each design scheme are obtained. The determination steps of the structural performance data of each design scheme are refined, providing an accurate data basis for subsequently determining the target design scheme with the best performance based on the structural performance data of each design scheme.

[0087] In one embodiment, the performance prediction model includes a thermal stress prediction layer and a thermal resistance prediction layer. The heat dissipation performance parameters of each structure include the thermal resistance values of each structure; the performance correlation parameters of each structure include the material thickness, material thermal expansion coefficient, material thermal conductivity, material volume, and equivalent heat conduction area of each structure. In step S22, that is, using the performance prediction model to predict the structural performance of each design scheme respectively, and obtaining the heat dissipation performance parameters of each structure in each design scheme and the device thermal stress value of each design scheme, specifically including the following steps:

[0088] S221: Based on the material thickness, material thermal conductivity, and equivalent heat conduction area of each structure in each design scheme, use the thermal resistance prediction layer to perform thermal resistance prediction to obtain the thermal resistance values of each structure in each design scheme.

[0089] S222: Based on the material thickness, material thermal expansion coefficient, material thermal conductivity, material volume, and equivalent heat conduction area of each structure in each design scheme, use the thermal stress prediction layer to perform thermal stress prediction to obtain the device thermal stress value of each design scheme.

[0090] Among them, the heat dissipation performance parameters of each structure include the thermal resistance values of each structure. The thermal resistance value is used to measure the heat dissipation performance of the structure, and the smaller the thermal resistance value, the better the heat dissipation performance; the thermal stress value refers to the stress generated by the structure due to temperature differences, and the device thermal stress value is used to measure the structural strength of the double-sided heat dissipation packaging device. Through the thermal resistance values of each structure and the device thermal stress value of each design scheme, the structural performance of the double-sided heat dissipation packaging device in each design scheme is characterized, with higher accuracy, and a parameter design scheme with better performance can be obtained.

[0091] Input the performance correlation parameters of each structure in the design scheme into the performance prediction model. Based on the material thickness, material thermal conductivity, and equivalent heat conduction area of each structure in the design scheme, use the thermal resistance prediction layer to predict the thermal resistance of each structure in the design scheme, and obtain the thermal resistance values of each structure in the design scheme; Based on the material thickness, material thermal expansion coefficient, material thermal conductivity, material volume, and equivalent heat conduction area of each structure in the design scheme, use the thermal stress prediction layer to predict the thermal stress of the structure composed of the overall design scheme, and obtain the device thermal stress value of the design scheme; By traversing all design schemes, the device thermal stress values of each design scheme and the thermal resistance values of each structure in each design scheme can be quickly obtained.

[0092] Among them, the thermal resistance prediction layer predicts the thermal resistance value of each structure through the following formula:

[0093] ;

[0094] ;

[0095] Among them, represents the thermal resistance value of structure . represents the material thickness of structure . represents the material thermal conductivity of structure . represents the equivalent heat conduction area of structure , that is, the material cross-sectional area through which heat flows through structure .

[0096] Among them, the thermal stress prediction layer determines the device thermal stress value of the design scheme through the following formula:

[0097] ;

[0098] ;

[0099] Among them, represents the device thermal stress value, that is, represents the total thermal stress value formed by each structure in the double-sided heat dissipation package device; represents the Young's modulus of structure ; represents the material volume of structure ; represents the thermal expansion coefficient of structure ; The material thickness of structure ; represents the number of structural layers in the double-sided heat dissipation package device, represents the serial number of this structure in the double-sided heat dissipation package device.

[0100] In this embodiment, based on the material thickness, material thermal conductivity, and equivalent heat conduction area of each structure in each design scheme, a thermal resistance prediction layer is used to predict the thermal resistance, and the thermal resistance values of each structure in each design scheme are obtained. Based on the material thickness, material thermal expansion coefficient, material thermal conductivity, material volume, and equivalent heat conduction area of each structure in each design scheme, a thermal stress prediction layer is used to predict the thermal stress, and the device thermal stress values of each design scheme are obtained. The specific process of using the performance prediction model to predict the structural performance of each design scheme respectively is clarified, and based on the material-related parameters and size of the structure, the accuracy of the structural performance is ensured.

[0101] In other embodiments, the heat dissipation performance parameters of each structure include the thermal resistance value and contact thermal resistance value of each structure. The contact thermal resistance refers to the thermal resistance between the surfaces when two structures are in contact, and is related to the heat transfer. The performance prediction model includes a thermal stress prediction layer, a thermal resistance prediction layer, and a contact thermal resistance prediction layer. That is, in step S22, it further includes: S223: Based on the interface contact area and total thermal conductivity of each structure in each design scheme, the contact thermal resistance prediction layer is used to predict the contact thermal resistance, and the contact thermal resistance values of each structure in each design scheme are obtained.

[0102] Among them, the contact thermal resistance prediction layer calculates the contact thermal resistance value of each structure through the following formula:

[0103] ;

[0104] Among them, represents the contact thermal resistance value of structure ; represents the interface contact area of structure , that is, the interface contact area of structure with the contacted structure; represents the total thermal conductivity of structure . The total thermal conductivity represents the total thermal conductivity of this structure, which is determined according to the specific structural state of this structure. For example, the total thermal conductivity can be composed of one or more of the solid shrinkage coefficient, air gap coefficient, and radiation conduction coefficient.

[0105] In this embodiment, the structural performance of the double-sided heat dissipation package device in each design scheme is characterized by the thermal resistance value and contact thermal resistance value of each structure, as well as the device thermal stress value of each design scheme, with higher accuracy, and a parameter design scheme with better performance can be obtained. When obtaining the target design scheme through subsequent iterative optimization, that is, in step S30, based on the structural performance data of each design scheme, minimizing the device thermal stress value, the thermal resistance value of the structure, and the contact thermal resistance value is used as the optimization output target, so as to iteratively obtain a parameter design scheme with better performance as the target design scheme.

[0106] In one embodiment, to improve the accuracy of the total thermal conductivity, the sum of the solid shrinkage coefficient, the air gap coefficient, and the radiative conductivity coefficient can be used as the total thermal conductivity. In other embodiments, it is necessary to determine the total thermal conductivity of each structure based on the contact surfaces of the structure with other structures, and then based on the average thermal conductivity of the two contact surfaces of the structure, the average roughness of the two contact surfaces, the mean square roughness of the surface, the apparent contact pressure applied on the contact surface, and the microhardness of the softer material of the contact surface, so as to further obtain a more accurate total thermal conductivity, thereby improving the accuracy of the contact thermal resistance value.

[0107] Among them, the total thermal conductivity of each structure is calculated by the following formula:

[0108] ;

[0109] Among them, represents the structure total thermal conductivity; represents the average thermal conductivity of the two contact surfaces of the structure; represents the average roughness of the two contact surfaces of the structure; represents the mean square roughness of the surface of the structure; represents the apparent contact pressure applied on the contact surface of the structure; represents the microhardness of the softer material of the contact surface of the structure.

[0110] Among them, can be calculated by the following formula:

[0111] ;

[0112] ;

[0113] ;

[0114] ;

[0115] ;

[0116] Among them, represents the apparent contact pressure applied on the contact surface of the structure; represents the microhardness of the softer material of the contact surface of the structure; represents the Vickers display hardness; 、 represents the Vickers display hardness correlation coefficient; represents the Brinell hardness.

[0117] In this embodiment, a more accurate total thermal conductivity is calculated through the relevant parameters of each structure, so as to improve the accuracy of the contact thermal resistance value, and then a target design solution with better performance can be obtained.

[0118] In other embodiments, if the contact pressure of each structure in the double-sided heat dissipation package device is very small according to each design solution, or the difference between the thermal resistance value of each structure in the target design solution and the actual thermal resistance of the packaged structure sample to be tested later is small, only the thermal resistance value of each structure and the device thermal stress value can be calculated as the structure performance data, that is, the calculation of the contact thermal resistance value is deleted to improve the calculation efficiency.

[0119] In another embodiment, the heat dissipation performance parameters of each structure further include the heat capacity value. The performance prediction model includes a thermal stress prediction layer, a thermal resistance prediction layer, a contact thermal resistance prediction layer, and a heat capacity prediction layer. That is, in step S22, it further includes: S224: Based on the specific heat capacity of the material, the mass density of the material, the material thickness, and the equivalent heat transfer area of each structure in each design solution, use the heat capacity prediction layer to perform heat capacity prediction to obtain the heat capacity value of each structure in each design solution.

[0120] Among them, the heat capacity prediction layer calculates the heat capacity value of each structure through the following formula:

[0121] ;

[0122] Among them, represents the heat capacity value of structure ; represents the specific heat capacity of the material of structure , represents the mass density of the material of structure , represents the material thickness of structure , represents the equivalent heat transfer area of structure .

[0123] In this embodiment, the structure performance of the double-sided heat dissipation package device in each design solution is characterized by the thermal resistance value, the contact thermal resistance value and / or the heat capacity value of each structure, and the device thermal stress value of each design solution, with higher accuracy. When the target design solution is obtained through subsequent iterative optimization, that is, in step S30, it is necessary to minimize the device thermal stress value, the thermal resistance value of the structure, the contact thermal resistance value and / or the heat capacity value based on the structure performance data of each design solution as the optimization output target, so as to iteratively obtain a parameter design solution with better performance as the target design solution.

[0124] In one embodiment, the heat dissipation performance parameter includes the thermal resistance value, that is, the structural performance data includes the thermal resistance values of each structure in the design scheme and the device thermal stress value of the design scheme. In step S30, that is, with the goal of minimizing the thermal stress value and the heat dissipation performance parameter, performance optimization is performed on two or more design schemes of the double-sided heat dissipation package device to obtain the target design scheme, which specifically includes the following steps:

[0125] S31: With the goal of minimizing the thermal resistance value and the device thermal stress value as the performance output goal, use the non-dominated sorting genetic algorithm to perform multi-objective optimization on multiple design schemes to obtain the target design scheme.

[0126] In this embodiment, the structural performance data of the design scheme at least includes the thermal resistance values of each structure in the design scheme and the device thermal stress value of each design scheme. The parameter determination device needs to perform multi-objective optimization on multiple design schemes based on the structural performance data of each design scheme, with the goal of minimizing the thermal resistance value and the device thermal stress value as the performance output goal, and use the non-dominated sorting genetic algorithm to obtain the target design scheme. By performing multi-objective optimization through the non-dominated sorting genetic algorithm, it has better performance in dealing with multi-objective optimization problems. For multiple optimization goals with different dimensions and difficult to unify measurement standards, it can handle the contradiction and incommensurability between the goals, so as to obtain the optimal combination method, that is, to obtain the optimal target design scheme.

[0127] In other embodiments, other optimization algorithms can also be used to perform iterative optimization on multiple design schemes. For example, according to actual needs, use multi-objective optimization algorithms such as hierarchical genetic algorithm, multi-objective particle swarm optimization, multi-objective differential evolution, multi-objective simulated annealing, multi-objective ant colony optimization, etc. to achieve the optimal selection of the parameter design scheme. In addition, other optimization algorithms can also be weighted average algorithms, that is, based on the weights of each performance in the design scheme, perform weighted averaging on each performance to obtain the total performance score of each design scheme, and then select the design scheme with the highest total performance score as the target design scheme.

[0128] In one embodiment, the structural performance data of the design scheme can include the thermal resistance value, contact thermal resistance value, and / or heat capacity value of each structure in the design scheme, and the device thermal stress value of the design scheme. In step S30, it can also be with the goal of minimizing the device thermal stress value, thermal resistance value, contact thermal resistance value, and / or heat capacity value as the performance output goal, and use the non-dominated sorting genetic algorithm to perform multi-objective optimization on multiple design schemes to obtain the target design scheme. A target design scheme with better performance can be obtained.

[0129] In one embodiment, in step S31, that is, with the goal of minimizing the thermal resistance value and the device thermal stress value as the performance output goal, use the non-dominated sorting genetic algorithm to perform multi-objective optimization on multiple design schemes to obtain the target design scheme, which specifically includes the following steps:

[0130] S311: Apply the fast non - dominated sorting algorithm to perform non - dominated sorting on multiple design solutions based on the thermal resistance values of each structure in each design solution and the device thermal stress values of each design solution, obtaining solution sorting data.

[0131] After obtaining multiple design solutions, the parameter determination device needs to apply the fast non - dominated sorting algorithm to perform non - dominated sorting on multiple design solutions based on the thermal resistance values (and contact thermal resistance values and / or heat capacity values) of each structure in each design solution, as well as the device thermal stress values of each design solution, obtaining solution sorting data.

[0132] It should be understood that if the design solution is represented by a solution, and solution A (design solution A) is not worse than solution B (design solution A) in terms of objective values such as thermal resistance values (and contact thermal resistance values and / or heat capacity values) and thermal stress values, and is better than B in at least one objective value, that is, at least one objective value of solution A is smaller than that of solution B, then solution A is called a non - dominated solution to solution B.

[0133] Specifically, apply the fast non - dominated sorting algorithm to perform non - dominated sorting on multiple design solutions based on the thermal resistance values of each structure in each design solution and the device thermal stress values of each design solution, obtaining solution sorting data, including: first, put all solutions into a list to form a solution set, and assign a level label to each solution, with the initial level being 1; then select a solution from the solution set as a reference solution. For each solution in the solution set, compare its thermal resistance values (and contact thermal resistance values and / or heat capacity) and thermal stress values to see if it non - dominates the reference solution; if so, increment its non - domination count by 1. Update the level of each solution according to the non - domination count. If the non - domination count of a solution is 0, set its level to the current maximum level plus 1; remove the solutions that have been classified as non - dominated from the solution set, and continuously repeat the above actions until all solutions are classified, obtaining solution sorting data.

[0134] In the solution sorting data, all design solutions are sorted through multiple levels. Each level includes multiple solutions (multiple design solutions). Among them, the solutions (design solutions) in the highest level form the Pareto - front solutions, that is, the design solutions in the highest level achieve the optimal balance of thermal resistance values (and contact thermal resistance values and / or heat capacity values) and thermal stress values. That is, if you want to improve one performance, the other performance will be more severely damaged. The fast non - dominated sorting algorithm is applicable to large - scale multi - objective optimization problems and has improved computational efficiency. Even when there are complex trade - off relationships between objective functions, it can stably find Pareto solutions.

[0135] S312: Based on the solution sorting data, determine the crowding distance between each design solution and its adjacent design solutions.

[0136] After obtaining the solution ranking data, the parameter determination device needs to determine the crowding distance between each design solution and its adjacent design solutions based on the solution ranking data.

[0137] Specifically, for each solution (design solution) at each level of the solution ranking data, calculate the distance between each solution and its adjacent solutions at the same level, that is, determine the distance between each design solution and its adjacent design solutions. Obtain the crowding distance of this solution, that is, the crowding distance between each design solution and its adjacent design solutions. Among them, the crowding distance is the sum of the distances between this solution and its adjacent solutions. The crowding distance is used to measure the crowding degree of each solution with other solutions in its neighborhood. The crowding distance helps to maintain the diversity of solutions and avoid the algorithm falling into local optima.

[0138] S313: Based on the solution ranking data and the crowding distance of each design solution, with minimizing the thermal resistance value and / or the device thermal stress value as the performance output objective, determine the target design solution among multiple design solutions.

[0139] After obtaining the crowding distance between each design solution and its adjacent design solutions, the parameter determination device adopts the elitist selection strategy. Based on the solution ranking data and the crowding distance of each design solution, with minimizing the thermal resistance value (and the contact thermal resistance value and / or the heat capacity value), and / or the device thermal stress value as the performance output objective, determine the target design solution among multiple design solutions. By retaining the elite individuals, the convergence speed of the algorithm can be accelerated and the search efficiency can be improved.

[0140] For example, based on the crowding distance between each design solution and its adjacent design solutions, determine multiple design solutions in the highest level of the solution ranking data, then determine the crowding distance of each design solution in the highest level, and select the design solution with the largest crowding distance in the highest level as the target design solution. Among them, the target design solution achieves the optimal balance of the thermal resistance value (contact thermal resistance value and / or heat capacity value) and the thermal stress value, that is, the target design solution can minimize the thermal resistance value (and the contact thermal resistance value and / or the heat capacity), and / or the device thermal stress value, and achieve the optimal structural performance.

[0141] In this embodiment, the fast non-dominated sorting algorithm is adopted. Based on the thermal resistance values of each structure in each design solution and the device thermal stress values of each design solution, perform non-dominated sorting on multiple design solutions to obtain the solution ranking data; based on the solution ranking data, determine the crowding distance between each design solution and its adjacent design solutions; based on the solution ranking data and the crowding distance of each design solution, with minimizing the thermal resistance value and the device thermal stress value as the performance output objective, determine the target design solution among multiple design solutions, which can obtain the best design solution with multi-objective balance and can also accelerate the convergence speed of the algorithm.

[0142] In one embodiment, the design parameters of each structure include the material and size of each structure, such as Figure 5As shown, in step S40, the double-sided heat dissipation packaging device is prepared by using a preset preparation method to obtain a packaging structure sample, which specifically includes the following steps:

[0143] S41: Based on the target design scheme, determine the materials and dimensions of each structure in the double-sided heat dissipation packaging device.

[0144] After obtaining the target design scheme, the parameter determination device will determine the materials and dimensions of each structure in the double-sided heat dissipation packaging device based on the target design scheme. Among them, each structure includes a solder layer, a substrate ceramic layer, a substrate copper-clad layer, and a spacer.

[0145] S42: Based on the materials and dimensions of the substrate ceramic layer and the spacer, perform material selection and cutting to obtain the substrate ceramic layer and the spacer.

[0146] Then, the parameter determination device will control the sample preparation device to perform material selection and cutting on the substrate ceramic layer and the spacer respectively based on the material and dimensions of the substrate ceramic layer and the material and dimensions of the spacer to obtain the substrate ceramic layer and the spacer.

[0147] Among them, the substrate ceramic layer includes an upper DBC ceramic layer and a lower DBC ceramic layer. The thickness range of the substrate ceramic layer is 0.25 - 1 mm, and the material of the substrate ceramic layer can be alumina Al2O3, silicon nitride Si3N4, aluminum nitride AlN, and other ceramic materials. The thickness range of the spacer is 1 - 5 mm, and the material of the spacer can be conductive metal materials such as copper, molybdenum, aluminum, nickel, silver, gold, and alloy materials composed of 2 or more of the above materials.

[0148] S43: Based on the materials and dimensions of the solder layer and the substrate copper-clad layer, perform coating and / or welding on the power chip, the substrate ceramic layer, and the spacer to form a packaging structure sample including the solder layer and the substrate copper-clad layer.

[0149] Then, the parameter determination device will control the sample preparation device to perform coating and / or welding on the power chip, the substrate ceramic layer, and the spacer based on the material and dimensions of the solder layer and the material and dimensions of the substrate copper-clad layer to form a packaging structure sample including the solder layer and the substrate copper-clad layer.

[0150] Among them, the packaging structure sample (i.e., the double-sided heat dissipation packaging device) includes two power chips. The power chip can be a traditional IGBT structure composed of Si IGBT + Si FRD, a hybrid IGBT structure composed of Si IGBT + SiC SBD, a GaN Cascode structure composed of GaN HEMT + Si MOSFET, a SiC half-bridge structure of SiC MOSFET + SiC MOSFET, and a combined structure of other 2 semiconductor power devices.

[0151] In this embodiment, based on the target design scheme, the materials and dimensions of each structure in the double-sided heat dissipation packaging device are determined. Each structure includes a solder layer, a substrate ceramic layer, a copper-clad layer of the substrate, and a spacer; based on the materials and dimensions of the substrate ceramic layer and the spacer, material selection and cutting are performed to obtain the substrate ceramic layer and the spacer; based on the materials and dimensions of the solder layer and the copper-clad layer of the substrate, coating and / or welding treatment is performed on the power chip, the substrate ceramic layer, and the spacer to form a packaging structure sample including the solder layer and the copper-clad layer of the substrate. Preparing the sample according to the materials and dimensions of each structure in the target design scheme can obtain a sample consistent with the parameters of the target design scheme, thereby ensuring the accuracy of the subsequent performance test results.

[0152] Specifically, after obtaining the substrate ceramic layer and the spacer, in step S43, that is, controlling the sample preparation device to perform coating and / or welding treatment on the power chip, the substrate ceramic layer, and the spacer to form a packaging structure sample including the solder layer and the copper-clad layer of the substrate, specifically including the following steps:

[0153] The first step: Controlling the cleaning equipment to clean the materials.

[0154] The sample preparation device includes a cleaning equipment, and the parameter determination device can control the cleaning equipment to clean the substrate ceramic layer, the spacer, the power chip, and other materials. During the material cleaning process, a variety of chemical reagents will be used to remove various contaminants on the material surface, such as particles, organic substances, metal ions, and oxides, etc. The following are cleaning examples: Using ammonia water mixed with hydrogen peroxide and water to form an APM (also known as SC-1) cleaning solution for removing surface particles and organic contaminants. Then, the surface of the material is rinsed with deionized water to remove the residual chemical reagents and contaminants. In addition, hydrofluoric acid can also be used to remove silicon dioxide and other oxides. Hydrochloric acid mixed with hydrogen peroxide and water forms an HPM (also known as SC-2) cleaning solution for removing metal ions. Sulfuric acid mixed with hydrogen peroxide and water forms an SPM (also known as SC-3) cleaning solution for removing organic contaminants. The cleaning process can be selected according to the dirtiness degree and requirements of the materials.

[0155] The second step: Controlling the copper-cladding equipment to perform copper-cladding treatment on the substrate ceramic layer to obtain an upper DBC structure and a lower DBC structure.

[0156] The substrate ceramic layer includes an upper DBC ceramic layer and a lower DBC ceramic layer. Among them, a positioning groove for placing the power chip is provided on the lower DBC ceramic layer. The sample preparation device includes a copper-cladding device. The parameter determination device controls the copper-cladding device of the sample preparation device according to the materials and dimensions of the surface copper-cladding layer and the pattern copper-cladding layer, and performs surface copper-cladding and pattern copper-cladding treatments on the upper DBC ceramic layer to form an upper DBC structure including a surface copper-cladding layer and a pattern copper-cladding layer, and performs surface copper-cladding and pattern copper-cladding treatments on the lower DBC ceramic layer to form a lower DBC structure including a surface copper-cladding layer and a pattern copper-cladding layer.

[0157] Among them, the thickness range of the surface copper-cladding layer and the pattern copper-cladding layer is 0.127 mm - 0.5 mm. Surface treatments such as electroless nickel plating: 3μm - 7μm, electroless silver plating: 0.1μm - 0.6μm, or electroless gold plating: 0.01 - 0.05um can be performed on the surface of the surface copper-cladding layer. The surface of the pattern copper-cladding layer has a topological structure pattern designed according to the product. The width of the copper between the patterns in the pattern copper-cladding layer is 0.35mm - 0.7mm. The pattern pitch in the pattern copper-cladding layer is associated with the copper layer thickness. The thicker the pattern copper-cladding layer, the greater the required distance between the patterns. A thicker copper layer can carry a larger current and improve its heat conduction ability, but at the same time increases the manufacturing cost and size.

[0158] Step 3: Control the solderable coating device and the magnetron sputtering equipment to perform solderable coating on the power chip and the spacer.

[0159] Since the upper surface pads of the power chip (composed of AlCu, Ti, TiN, etc.) and some spacers (such as molybdenum spacers) usually do not have solderability, it is necessary to perform solderable coating on the power chip and the spacers. Among them, the sample preparation device includes a grasping device (such as a robotic arm), a solderable coating device, and a magnetron sputtering equipment. The solderable coating device can be used to perform solderable coating on the power chip and the spacers, which is convenient for operation.

[0160] The solderable coating device such as Figure 6As shown in the figure, the solderable coating device consists of an upper cover plate 21, a lower base 22, a support rod 23, and screws (not shown). Among them, the lower base 22 is provided with two or more placement stations, and each placement station is designed according to the thickness and size of the power chip and the spacer, so that the power chip and the spacer can be closely placed therein. There are grooves beside each placement station to facilitate the removal of the chip and the spacer by controlling a sample preparation device (such as using tweezers). The upper cover plate 21 is perforated according to the size of the area where the power chip and the spacer need to be solderably coated. After the power chip and the spacer are placed in the corresponding placement stations on the lower base 22 by the grasping device, the upper cover plate 21 and the lower base 22 are fixed using screws. Subsequently, the solderable coating device is placed into a magnetron sputtering device using the support rod 23. The support rod 23 is a structure connecting the coating device and the magnetron sputtering device. One end of the support rod 23 with threads is connected to the lower base 22, and the other end is inserted into the sputtering area of the magnetron sputtering device. Finally, the magnetron sputtering device is controlled to perform solderable coating on the power chip and the spacer on the solderable coating device.

[0161] In this embodiment, the preferred coating scheme is as follows: Use a 4-inch copper target with a purity of 99.999%, and evacuate the vacuum to 10-5 Pa. The sputtering power of the magnetron sputtering device is 300 W, the deposition time is 25 minutes, and 30 sccm of argon gas is introduced during the sputtering of the magnetron sputtering device. After the magnetron sputtering device finishes sputtering, a copper film about 3 microns thick will be formed on the surfaces of the power chip and the spacer, having good solderability.

[0162] Step 4: Control the printing equipment to print solder on the lower DBC structure, and control the pick-and-place machine to mount the power chip on the lower DBC structure. After the power chip is mounted on the lower DBC structure, control the silver sintering furnace to perform power chip soldering to obtain a lower DBC structure containing the power chip, and there is a solder layer between the power chip and the lower DBC structure.

[0163] Among them, the sample preparation device includes a stencil, printing equipment, a pick-and-place machine, and a silver sintering furnace. The parameter determination device places the lower DBC structure on the designed stencil through the grasping device, and prints solder on the chip welding area (positioning groove area) on the surface of the lower DBC structure through the printing equipment; then, control the pick-and-place machine to mount the power chip on the solder in the positioning groove area of the lower DBC structure, and then put the lower DBC structure and the power chip after placement into the silver sintering furnace to complete sintering, obtaining a lower DBC structure containing the power chip, and there is a solder layer between the power chip and the lower DBC structure.

[0164] Among them, the sintering process menu of the silver sintering furnace is set as follows: the vacuum value is 0.7 KPa, the sintering temperature is 250 °C, the sintering time is 6 min, the sintering pressure is 20 MPa, and water cooling is 5 min.

[0165] Among them, the thickness range of the solder layer is 50 - 150 microns. The material of the solder layer can be various lead-containing solders and solder pads, such as Pb-Sn type and Pb-Ag type; the material of the solder layer can also be lead-free solders and solder pads, such as Sn-Ag-Cu type, Sn-Cu type, Sn-Zn type, Sn-Ag type; in other embodiments, the material of the solder layer can also be various sintered solders, such as pressure silver paste, non-pressure silver paste, silver film, copper paste, copper film, etc.

[0166] Step 5: Control the wire bonding equipment to perform gate wire bonding on the lower DBC structure and the power chip, realizing the electrical connection between the gate of the power chip and the lower DBC structure.

[0167] The sample preparation device includes wire bonding equipment. Control the wire bonding equipment to perform gate wire bonding on the lower DBC structure and the power chip to form gate wires. The electrical connection between the gate of the power chip and the lower DBC structure is realized through 8 mil aluminum wires. Among them, when wire bonding, it is necessary to ensure that the arc height of the lead wire (gate wire) is less than the overall height of the power chip and the buffer layer (spacer block), otherwise the lead wire will contact the surface of the upper DBC structure, resulting in short circuit failure of the chip circuit.

[0168] Step 6: Control the printing equipment to print solder on the upper DBC structure, and control the pick-and-place machine to mount the spacer block on the upper DBC structure. After mounting the spacer block on the upper DBC structure, control the vacuum reflow furnace to perform spacer block welding to obtain the upper DBC structure with the spacer block welded, and there is a solder layer between the spacer block and the upper DBC structure.

[0169] The parameter determination device places the upper DBC structure on the designed stencil through the gripping device, and prints solder on the solder-welding area of the spacer block on the surface of the upper DBC structure. Then, control the pick-and-place machine to mount the spacer block on the solder on the solder-welding area of the upper DBC structure, and put the mounted spacer block and the upper DBC structure into the vacuum reflow furnace to complete welding, obtaining the upper DBC structure with the spacer block welded, and there is a solder layer between the spacer block and the upper DBC structure.

[0170] Among them, the welding process menu of the vacuum reflow furnace is as follows: the heating rate is 2°C / min, the sintering temperature is 250°C, the sintering time is 1 min, the sintering atmosphere is a formic acid-nitrogen mixed atmosphere, and non-pressure sintering.

[0171] Among them, the thickness range of the solder layer is 50 - 150 microns. The material of the solder layer can be various lead-containing solders and solder pads, such as Pb-Sn type and Pb-Ag type; the material of the solder layer can also be lead-free solders and solder pads, such as Sn-Ag-Cu type, Sn-Cu type, Sn-Zn type, Sn-Ag type; in other embodiments, the material of the solder layer can also be various sintered solders, such as pressure silver paste, non-pressure silver paste, silver film, copper paste, copper film, etc.

[0172] Step 7: Control the ultrasonic terminal welder to weld the power terminals to the designated positions of the upper DBC structure and the lower DBC structure respectively, realizing terminal connection.

[0173] The sample preparation device includes an ultrasonic terminal welder. Control the ultrasonic terminal welder to weld the power terminals to the upper DBC structure containing pads and to the designated positions of the lower DBC structure accommodating the power chip, realizing terminal connection.

[0174] Step 8: Control the interconnection alignment welding device to mutually combine the upper DBC structure and the lower DBC structure after terminal connection to obtain an initial package structure, in which a solder layer is formed between the power chip and the pads.

[0175] Among them, the sample preparation device includes an interconnection alignment welding device. As Figure 7 shown, the interconnection alignment welding device includes a base 31 and four studs 32. Among them, the positions of the four studs 32 are set according to the sizes of the upper DBC structure and the lower DBC structure. Each stud 32 can closely fit the upper DBC structure and the lower DBC structure, and the four studs 32 are respectively located at the central positions of the four sides of the upper DBC structure (lower DBC structure).

[0176] The parameter determination device, through the gripping device, sequentially places the lower DBC structure, the solder sheet with trimmed size, and the upper DBC structure into the interconnection alignment welding device as Figure 7 shown, and then places the interconnection alignment welding device and the structures thereon as a whole into a vacuum reflow furnace to complete welding, obtaining a preliminarily formed package structure. The size of the solder sheet is the same as that of the lower DBC structure.

[0177] First, control the mounter to place the solder sheet on the area to be welded of the lower DBC structure (generally the surfaces of the power chip and the pads), and then tighten three of the studs 32 in the interconnection alignment welding device to closely place the lower DBC structure therein. Next, place the upper DBC structure into the interconnection alignment welding device as well. Since the layout designs of the DBC structures are corresponding, when the three studs 32 of the fixed interconnection alignment welding device are tightened, at this time, the upper DBC structure and the lower DBC structure automatically complete the alignment operation. After placing the upper DBC structure and the lower DBC structure, tighten the fourth stud 32 of the interconnection alignment welding device to fix the overall structure. At this time, weights with a certain pressure can also be placed on the upper DBC structure to provide the pressure during welding. Finally, place the interconnection alignment welding device and the structures thereon as a whole into a vacuum reflow furnace to complete welding, obtaining a preliminarily formed initial package structure and realizing the electrical interconnection of the upper and lower DBC structures. A solder layer is formed between the power chip and the pads in this initial package structure.

[0178] Among them, the soldering process menu of the vacuum reflow furnace is as follows: the heating rate is 2 °C / min, the sintering temperature is 250 °C, the sintering time is 1 min, the sintering atmosphere is a formic acid-nitrogen mixed atmosphere, and it is sintered without pressure or under pressure.

[0179] The ninth step: Control the sample preparation device to perform insulation encapsulation on the initial encapsulation structure to obtain an encapsulation structure sample.

[0180] Among them, the sample preparation device includes a pouring and cooling device. Control the pouring and cooling device to fill the internal gap of the initial encapsulation structure with resin to achieve insulation encapsulation, and form an encapsulation structure sample after cooling and solidification.

[0181] Among them, the materials and dimensions of each structure in the above encapsulation structure sample are the same as those of each structure in the target design scheme.

[0182] In this embodiment, the specific preparation process of the encapsulation structure sample is clarified through the above steps. The sample can be prepared strictly according to the materials and dimensions of each structure in the target design scheme, and a sample consistent with the parameters of the target design scheme can be obtained, thereby ensuring the accuracy of the subsequent performance test results. In addition, the preparation process of the encapsulation structure sample is restricted by the currently achievable product process, and double-sided heat dissipation encapsulation devices can be prepared using the same or similar processes later, ensuring mass production.

[0183] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The order of execution of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0184] In one embodiment, a parameter determination device is provided. The parameter determination device corresponds one-to-one with the double-sided heat dissipation encapsulation device parameter determination method in the above embodiment. As Figure 8 shown, the parameter determination device includes a parameter determination module 801, a performance prediction module 802, a scheme optimization module 803, a first control module 804, and a second control module 805. The detailed descriptions of each functional module are as follows:

[0185] The parameter determination module 801 is used to determine two or more design schemes of the double-sided heat dissipation encapsulation device with the materials and / or dimensions of each structure in the double-sided heat dissipation encapsulation device as variables;

[0186] The performance prediction module 802 is based on each design scheme and uses a performance prediction model to predict the structural performance, and obtains the structural performance data of each design scheme. The structural performance data includes the device thermal stress value and the heat dissipation performance parameters of each structure;

[0187] The solution optimization module 803 performs performance optimization on two or more design solutions of the double-sided heat dissipation packaging device with the goal of minimizing the thermal stress value and heat dissipation performance parameters, and obtains the target design solution;

[0188] The first control module 804 is used to control the sample preparation device to prepare the double-sided heat dissipation packaging device based on the target design solution by using a preset preparation method, and obtain a packaged structure sample;

[0189] The second control module 805 is used to control the performance test module to perform performance tests on the packaged structure samples, and when the performance of the packaged structure samples is tested to not meet the requirements, change the materials and / or dimensions of each structure to form two or more design solutions after parameter update, and optimize to obtain the target design solution after parameter update, so as to re-prepare and test the packaged structure samples after parameter update until the performance of the packaged structure samples after parameter update meets the requirements, and output the target design solution that meets the requirements as the double-sided heat dissipation packaging device model for product preparation.

[0190] Optionally, before changing the two or more design solutions after parameter update of the materials and / or dimensions of each structure, the parameter determination module 801 is further used for:

[0191] Update the parameters of the performance prediction model based on the structural performance data of the target design solution and the measured performance data of the packaged structure samples until the structural pre-performance data predicted by the performance prediction model is consistent with the measured performance data;

[0192] Use the updated performance prediction model to re-perform structural performance prediction, so as to re-optimize the performance of each design solution based on the structural performance data of each re-predicted design solution, and obtain a new target design solution;

[0193] Prepare the double-sided heat dissipation packaging device based on the new target design solution, and obtain a new packaged structure sample;

[0194] When the performance of the new packaged structure sample is tested to not meet the requirements, change the two or more design solutions after parameter update of the materials and / or dimensions of each structure.

[0195] Optionally, the performance prediction module 802 is specifically used for:

[0196] Determine the performance correlation parameters of each structure in each design solution according to the materials and dimensions of each structure in each design solution, and each structure includes a solder layer, a substrate ceramic layer, a substrate copper-clad layer, and a spacer;

[0197] Taking the performance correlation parameters of each structure in each of the design solutions as inputs, using the performance prediction model to predict the structural performance of each of the design solutions respectively, and obtaining the heat dissipation performance parameters of each structure in each of the design solutions and the device thermal stress values of each of the design solutions.

[0198] Optionally, the heat dissipation performance parameter includes a thermal resistance value, and the performance correlation parameters include material thickness, material thermal expansion coefficient, material thermal conductivity, and equivalent heat conduction area; the performance prediction model includes a thermal stress prediction layer and a thermal resistance prediction layer; the performance prediction module 802 is specifically further configured to:

[0199] Based on the material thickness, material thermal conductivity, and equivalent heat conduction area of each structure in each design solution, using the thermal resistance prediction layer to perform thermal resistance prediction, and obtaining the thermal resistance values of each structure in each design solution;

[0200] Based on the material thickness, material thermal expansion coefficient, material thermal conductivity, and equivalent heat conduction area of each structure in each design solution, using the thermal stress prediction layer to perform thermal stress prediction, and obtaining the device thermal stress values of each design solution.

[0201] Optionally, the heat dissipation performance parameter includes a thermal resistance value, and the solution optimization module 803 is specifically configured to:

[0202] Taking the minimization of the thermal resistance value and the device thermal stress value as the performance output target, using the non-dominated sorting genetic algorithm to perform multi-objective optimization on multiple design solutions, and obtaining the target design solution.

[0203] Optionally, the solution optimization module 803 is specifically further configured to:

[0204] Using the fast non-dominated sorting algorithm, based on the thermal resistance values of each structure in each design solution and the device thermal stress values of each design solution, performing non-dominated sorting on multiple design solutions, and obtaining the solution sorting data;

[0205] Based on the solution sorting data, determining the crowding distance between each design solution and its adjacent design solutions;

[0206] Based on the solution sorting data and the crowding distance of each design solution, taking the minimization of the thermal resistance value and / or the device thermal stress value as the performance output target, and determining the target design solution among multiple design solutions.

[0207] Optionally, the design parameters of each structure include the material and size of each structure, and the first control module 804 is specifically configured to:

[0208] Based on the target design solution, determining the material and size of each structure in the double-sided heat dissipation packaging device, and each structure includes a solder layer, a substrate ceramic layer, a substrate copper-clad layer, and a spacer;

[0209] Based on the materials and dimensions of the substrate ceramic layer and the spacer, material selection and cutting are carried out to obtain the substrate ceramic layer and the spacer;

[0210] Based on the materials and dimensions of the solder layer and the copper-clad substrate layer, the sample preparation device is controlled to perform coating and / or welding treatments on the power chip, the substrate ceramic layer and the spacer to form a packaged structure sample including the solder layer and the copper-clad substrate layer.

[0211] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units, due to the same concept as the method embodiment of the present application, for their specific functions and the technical effects brought, reference can be specifically made to the method embodiment part, and details will not be repeated here.

[0212] Those skilled in the art can clearly understand that, for the convenience and conciseness of description, only the above-mentioned division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated in a processing unit, or each unit exists physically alone, or two or more units are integrated in one unit. The above integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of the present application. The specific working process of the units and modules in the above system can refer to the corresponding process in the foregoing method embodiment, and details will not be repeated here.

[0213] In one embodiment, a parameter determination device is provided. The electronic device can be a computer device, which includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database is used to store the data used and generated by the above-mentioned method for determining the parameters of the double-sided heat dissipation packaging device. The network interface is used to communicate with external devices through a network connection. When the computer program is executed by the processor, it implements a method for determining the parameters of a double-sided heat dissipation packaging device.

[0214] The embodiment of the present application also provides an electronic device, such as Figure 9As shown, the electronic device includes: at least one processor, a memory, and a computer program stored in the memory and executable on the at least one processor. When the processor executes the computer program, the steps in any of the above method embodiments are implemented, or when the processor executes the computer program, the functions of each module / unit in the above device embodiments are implemented.

[0215] Exemplarily, the computer program can be divided into one or more modules / units. The one or more modules / units are stored in the memory and executed by the processor to complete the present application. The one or more modules / units can be a series of computer program instruction segments capable of performing specific functions, and these instruction segments are used to describe the execution process of the computer program in the electronic device.

[0216] Those skilled in the art can understand that Figure 9 merely examples of the electronic device, which do not constitute a limitation on the electronic device. It may include more or fewer components than shown in the figure, or combine certain components, or different components. For example, the electronic device may further include input / output devices, network access devices, buses, etc.

[0217] The memory can be an internal storage unit of the electronic device, such as the hard disk or memory of the electronic device. The memory can also be an external storage device of the electronic device, such as a plug-in hard disk, a smart memory card, a secure digital card, a flash card, etc. equipped on the electronic device. Further, the memory can also include both the internal storage unit and the external storage device of the electronic device.

[0218] The embodiment of the present application also provides a readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in the above method embodiments can be implemented.

[0219] The embodiment of the present application provides a computer program product. When the computer program product runs on an electronic device, the electronic device is enabled to implement the steps in the above method embodiments when executed.

[0220] When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, to implement all or part of the processes in the above-described embodiment methods of this application, a computer program can be used to instruct the relevant hardware to complete. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of the above-described method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file, or some intermediate form, etc. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the photographing device / terminal device, recording medium, computer memory, read-only memory, random access memory, electrical carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk, or an optical disc, etc. In some jurisdictions, according to legislation and patent practice, the computer-readable medium cannot be an electrical carrier signal and a telecommunication signal.

[0221] In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0222] Those of ordinary skill in the art can realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0223] In the embodiments provided in this application, it should be understood that the disclosed device / equipment and method can be implemented in other ways. For example, the device / equipment embodiments described above are only illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the devices or units can be in electrical, mechanical, or other forms.

[0224] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included within the protection scope of the present application.

Claims

1. A method for determining parameters of a double-sided heat dissipation packaging device, characterized in that: include: Determine two or more design schemes of the double-sided heat dissipation packaging device by taking the material and / or size of each structure in the double-sided heat dissipation packaging device as variables; Based on each of the design schemes, a performance prediction model is used to predict the structural performance to obtain structural performance data of each of the design schemes, wherein the structural performance data includes a device thermal stress value and a heat dissipation performance parameter of each of the structures; With the goal of minimizing the thermal stress value and the heat dissipation performance parameter, two or more design schemes of the double-sided heat dissipation packaging device are optimized for performance to obtain a target design scheme; Based on the target design scheme, a preset preparation method is used to prepare the double-sided heat dissipation packaging device to obtain a packaging structure sample; When it is tested that the performance of the packaging structure sample does not meet the requirements, the material and / or size of each structure is changed to form two or more design schemes after parameter update, and the target design scheme after parameter update is obtained by optimization, so as to re-prepare and test the packaging structure sample after parameter update, until the performance of the packaging structure sample after parameter update meets the requirements, and the target design scheme that meets the requirements is output as a double-sided heat dissipation packaging device model for product preparation; The heat dissipation performance parameter includes a thermal resistance value, and two or more design schemes of the double-sided heat dissipation packaging device are optimized for performance to obtain a target design scheme, including: minimizing the thermal resistance value and the device thermal stress value as the performance output target, using a non-dominant sorting genetic algorithm to perform multi-objective optimization on multiple design schemes to obtain the target design scheme; The method of using a non-dominated sorting genetic algorithm to perform multi-objective optimization on the multiple design schemes to obtain the target design scheme includes: using a fast non-dominated sorting algorithm to perform non-dominated sorting on the multiple design schemes based on the thermal resistance value of each structure in each design scheme and the device thermal stress value of each design scheme to obtain scheme sorting data; determining the crowding distance between each design scheme and the adjacent design scheme based on the scheme sorting data; determining the target design scheme from the multiple design schemes based on the scheme sorting data and the crowding distance of each design scheme, with minimizing the thermal resistance value and / or the device thermal stress value as the performance output target; The design scheme is represented by a solution, and the fast non-dominated sorting algorithm is used to perform non-dominated sorting on the multiple design schemes based on the thermal resistance value of each structure in each design scheme and the device thermal stress value of each design scheme to obtain scheme sorting data, including: putting all the solutions into a list to form a solution set, and assigning a level label to each solution, with an initial level of 1; selecting a solution from the solution set as a reference solution, and for each solution in the solution set, comparing the thermal resistance value and the thermal stress value to see whether they are non-dominated reference solutions; if so, adding 1 to its non-dominated count value; updating the level of each solution according to the non-dominated count, and if the non-dominated count of a solution is 0, setting its level to the current maximum level plus 1; removing solutions that have been classified as non-dominated from the solution set until all solutions are classified to obtain the scheme sorting data.

2. The method for determining parameters of a double-sided heat dissipation packaging device according to claim 1, characterized in that: Before changing the material and / or size of each structure to form two or more design schemes after parameter update, the method further includes: Updating the parameters of the performance prediction model based on the structural performance data of the target design solution and the measured performance data of the packaging structure sample until the structural performance data predicted by the performance prediction model is consistent with the measured performance data; Re-predicting the structural performance using the updated performance prediction model, re-optimizing the performance of each design scheme based on the re-predicted structural performance data of each design scheme, and obtaining a new target design scheme; Preparing the double-sided heat dissipation packaging device based on the new target design scheme to obtain a new packaging structure sample; When it is found that the performance of the new packaging structure sample does not meet the requirements, the material and / or size of each structure is changed to form two or more design schemes after parameter update.

3. The method for determining parameters of a double-sided heat dissipation packaging device according to claim 1, characterized in that: Based on each of the design schemes, a performance prediction model is used to predict the structural performance to obtain the structural performance data of each of the design schemes, including: Determining performance-related parameters of each structure in each design solution according to the material and size of each structure in each design solution; The performance correlation parameters of each structure in each design scheme are taken as input, and the performance prediction model is used to predict the structural performance of each design scheme respectively, so as to obtain the heat dissipation performance parameters of each structure in each design scheme and the device thermal stress value of each design scheme.

4. The method for determining parameters of a double-sided heat dissipation packaging device as claimed in claim 3, characterized in that: The performance-related parameters include material thickness, material thermal expansion coefficient, material thermal conductivity and equivalent heat conduction area; the performance prediction model includes a thermal stress prediction layer and a thermal resistance prediction layer, and the performance prediction model is used to predict the structural performance of each design scheme, and the heat dissipation performance parameters of each structure in each design scheme and the device thermal stress value of each design scheme are obtained, including: Based on the material thickness, material thermal conductivity and equivalent heat conduction area of ​​each structure in each design solution, the thermal resistance prediction layer is used to perform thermal resistance prediction to obtain the thermal resistance value of each structure in each design solution; Based on the material thickness, material thermal expansion coefficient, material thermal conductivity and equivalent heat conduction area of ​​each structure in each design scheme, thermal stress prediction is performed using the thermal stress prediction layer to obtain the device thermal stress value of each design scheme.

5. The method for determining parameters of a double-sided heat dissipation packaging device according to any one of claims 1 to 4, characterized in that: The method of preparing the double-sided heat dissipation packaging device by using a preset preparation method to obtain a packaging structure sample includes: Based on the target design scheme, determining the material and size of each structure in the double-sided heat dissipation packaging device, each structure comprising a solder layer, a substrate ceramic layer, a substrate copper clad layer and a pad; Based on the material and size of the substrate ceramic layer and the pad, material selection and cutting are performed to obtain the substrate ceramic layer and the pad; Based on the materials and dimensions of the solder layer and the substrate copper clad layer, the power chip, the substrate ceramic layer and the pad are plated and / or welded to form the packaging structure sample including the solder layer and the substrate copper clad layer.

6. A double-sided heat dissipation packaging device parameter determination system, characterized in that: include: A parameter determination device, for determining two or more design schemes of a double-sided heat dissipation packaging device using the material and / or size of each structure in the double-sided heat dissipation packaging device as a variable, and based on each of the design schemes, using a performance prediction model to predict the structural performance to obtain structural performance data of each of the design schemes, the structural performance data including the device thermal stress value and the heat dissipation performance parameters of each of the structures, the heat dissipation performance parameters including thermal resistance values, and with the goal of minimizing the thermal stress value and the heat dissipation performance parameters, performing performance optimization on the two or more design schemes of the double-sided heat dissipation packaging device to obtain a target design scheme, including: with the goal of minimizing the thermal resistance value and the device thermal stress value, using a non-dominant sorting genetic algorithm to perform multi-objective optimization on multiple design schemes to obtain the target design scheme; The method of using a non-dominated sorting genetic algorithm to perform multi-objective optimization on the multiple design schemes to obtain the target design scheme includes: using a fast non-dominated sorting algorithm to perform non-dominated sorting on the multiple design schemes based on the thermal resistance value of each structure in each design scheme and the device thermal stress value of each design scheme to obtain scheme sorting data; determining the crowding distance between each design scheme and the adjacent design scheme based on the scheme sorting data; determining the target design scheme from the multiple design schemes based on the scheme sorting data and the crowding distance of each design scheme, with minimizing the thermal resistance value and / or the device thermal stress value as the performance output target; The design scheme is represented by a solution, and the fast non-dominated sorting algorithm is used to perform non-dominated sorting on the multiple design schemes based on the thermal resistance value of each structure in each design scheme and the device thermal stress value of each design scheme to obtain scheme sorting data, including: putting all the solutions into a list to form a solution set, and assigning a level label to each solution, with an initial level of 1; selecting a solution from the solution set as a reference solution, and for each solution in the solution set, comparing the thermal resistance value and the thermal stress value to see whether they are non-dominated reference solutions; if so, adding 1 to its non-dominated count value; updating the level of each solution according to the non-dominated count, and if the non-dominated count of a solution is 0, setting its level to the current maximum level plus 1; removing solutions that have been classified as non-dominated from the solution set until all solutions are classified to obtain the scheme sorting data; A sample preparation device, used to prepare the double-sided heat dissipation packaging device based on the target design scheme by using a preset preparation method to obtain a packaging structure sample; The performance testing device is used to perform performance testing on the packaging structure sample, and when it is tested that the performance of the packaging structure sample meets the requirements, output the target design scheme that meets the requirements as a double-sided heat dissipation packaging device model for product preparation.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, it implements the steps of the method for determining parameters of a double-sided heat dissipation packaging device as described in any one of claims 1 to 5, or implements the functions of each device in the system for determining parameters of a double-sided heat dissipation packaging device as described in claim 6.

8. A readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the method for determining parameters of a double-sided heat dissipation packaging device as described in any one of claims 1 to 5 are implemented, or the functions of each device in the system for determining parameters of a double-sided heat dissipation packaging device as described in claim 6 are implemented.

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