A cooling system based on semiconductor refrigeration

Abstract

The present invention relates to the field of semiconductor refrigeration technology, and specifically to a cooling system based on semiconductor refrigeration; it comprises a shell and a tube shell at the middle section of the inner side of the shell; the end of the tube shell extends to the outer side of the shell and is connected to a liquid inlet pipe and a liquid outlet pipe; both sides of the tube shell are connected to a semiconductor refrigerator; the upper port of the shell is connected to a fan; the semiconductor refrigerator is fixedly connected to a heat sink on the side away from the tube shell; the heat sink is provided with a heat sink groove on the side away from the semiconductor refrigerator; the heat sink groove is slidably connected to a heat sink along the length direction; the present invention arranges a first spring between adjacent heat sinks and the heat sinks can slide along the heat sink to cooperate, so that multiple heat sinks can maintain a heat sink gap for heat dissipation during the heat dissipation process, and can change the gap size to avoid getting stuck when encountering particulate matter, thereby ensuring that the cooling system can operate normally.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration, in particular to a cooling system based on semiconductor refrigeration. Background Art

[0002] The working principle of semiconductor refrigeration is based on the thermoelectric effect, which is a phenomenon in which heat is transferred in semiconductor materials through direct current. When direct current passes through a thermocouple composed of N-type and P-type semiconductor materials, one end absorbs heat (cold end) and the other end releases heat (hot end), thereby generating a temperature difference and achieving a cooling effect. This effect is called the Peltier effect and is the basis of semiconductor refrigeration. The cold end of the semiconductor refrigerator contacts the fluid shell that conveys the fluid, thereby cooling the fluid in the fluid shell, and the hot end of the semiconductor refrigerator is connected to the heat sink, and a fan is used to dissipate heat from the heat sink.

[0003] With the development of semiconductor refrigeration technology, semiconductors are widely used in optoelectronics, automotive electronics, welding processing and other fields. In the welding process, welding slag and debris are inevitable. Even if the air inlet of the fan is intercepted by a filter, some small foreign matter will be stuck in the gap position of the heat sink due to the disturbance of the fan. The gap between the heat sinks is generally fixed. The presence of foreign matter in the gap of the heat sink will cause the heat sink to be blocked, affecting the heat dissipation effect of the heat sink, and then affecting the normal operation of the semiconductor refrigerator. Summary of the invention

[0004] In order to make up for the shortcomings of the prior art, the present invention proposes a cooling system based on semiconductor refrigeration. The present invention arranges a first spring between adjacent heat sinks and the heat sinks can slide along the heat sink seat to cooperate with each other, so that multiple heat sinks can maintain a heat dissipation gap for heat dissipation during the heat dissipation process, and can change the gap size to avoid getting stuck when encountering particulate matter, thereby ensuring that the cooling system can operate normally.

[0005] The technical solution adopted by the present invention to solve its technical problems is: the cooling system based on semiconductor refrigeration described in the present invention includes a shell and a tube shell at the middle position of the inner side of the shell; the end of the tube shell extends to the outer side of the shell and is connected to a liquid inlet pipe and a liquid outlet pipe; both sides of the tube shell are connected to a semiconductor refrigerator; the upper port of the shell is connected to a fan; the semiconductor refrigerator is fixedly connected to a heat sink on the side away from the tube shell; a heat sink is provided with a heat dissipation groove on the side away from the semiconductor refrigerator; the heat dissipation groove is slidably connected to a heat sink along the length direction; the inner wall of the heat dissipation groove is fixedly connected to a slide rod along the length direction of the shell; the slide rod passes through the heat sink and is slidably connected to the heat sink; adjacent heat sinks are connected by a first spring; the first spring is sleeved on the outer wall of the slide rod; the gap between adjacent heat sinks can be increased after being compressed to overcome the corresponding first spring.

[0006] Preferably, there is a shifting gap between the edge of the heat sink away from the heat sink and the inner wall of the shell; a rotating rod is provided in the shifting gap; the rotating rod is rotatably connected to the inner wall of the shell; the outer wall of the shell is fixedly connected to the motor; the motor is connected to one end of the rotating rod; the outer wall of the rotating rod is fixedly connected to the shifting block; the gap between adjacent heat sinks can be expanded under the shifting of the shifting block.

[0007] Preferably, a plurality of the shift blocks correspond to the heat dissipation gaps formed by corresponding adjacent heat sinks; a plurality of the shift blocks are distributed in a spiral manner along the outer wall of the rotating rod; the number of spiral coils formed by the shift blocks under the distribution on the rotating rod is a single turn; and during the rotation of the rotating rod, some of the shift blocks can be driven to expand the heat dissipation gaps formed by some of the heat sinks.

[0008] Preferably, the heat sink is away from the edge of the heat sink and is fixedly connected to an extension bar at a position corresponding to the rotating rod; a single heat dissipation gap corresponds to two extension bars; the two extension bars are connected to the corresponding heat sink; the distance between the two extension bars corresponding to the heat dissipation gap decreases as the distance away from the heat sink; the shift block is in a diamond shape; the shift block can shift the two extension bars to expand the corresponding heat dissipation gap when the rotating rod rotates forward or reversely; the rotation of the rotating rod can drive the expansion of a single heat dissipation gap.

[0009] Preferably, a telescopic groove is provided on one side of the shift block away from the central axis of the rotating rod; the telescopic groove extends into the rotating rod; a telescopic rod is movably connected in the telescopic groove; the telescopic rod is connected to the bottom of the telescopic groove by a second spring; and the telescopic rod can pass through the heat dissipation gap as the rotating rod rotates.

[0010] Preferably, the inner wall of the shell is rotatably connected to the screw and fixed to the sliding rod; the sliding rod and the screw are arranged along the length direction of the shell; one end of the screw extends to the outside of the shell and is fixed to the driven gear; one end of the rotating rod is fixed to the driving gear; the driving gear is meshed with the driven gear through a transition gear; the rotating rotating rod can drive the screw to rotate; the outer wall of the screw is threadedly connected to the collection box; the collection box is located directly below the heat sink; the collection box is passed through by the sliding rod and is slidably connected to the sliding rod; the upper end of the collection box is an opening; the bottom wall of the collection box is hinged to the mesh door; the width of the collection box is adapted to the heat dissipation gap after expansion; the collection box corresponds to the heat dissipation gap driven by the shifting block under the transmission of the rotating rod.

[0011] Preferably, the depth of the collection box increases as it moves away from the rotating rod; the foreign matter on the bottom wall of the collection box moves closer to a deeper position under the action of gravity.

[0012] Preferably, the upper port of the collection box is connected to an elastic rope; the adjacent elastic ropes are arranged in parallel and close to each other; the elastic rope at the upper port of the collection box is bent and then restored when a foreign object passes through it.

[0013] The beneficial effects of the present invention are as follows:

[0014] 1. The present invention arranges a first spring between adjacent heat sinks and enables the heat sinks to slide along the heat sink seat to cooperate with each other, so that multiple heat sinks can maintain a heat dissipation gap for heat dissipation during the heat dissipation process, and can change the size of the gap to avoid getting stuck when encountering particulate matter, thereby ensuring that the cooling system can operate normally.

[0015] 2. The present invention drives the shifting block to shift the two extension bars by rotating the rotating rod to drive the two heat sinks away from each other, so that the heat dissipation gap formed by the two heat sinks can be actively expanded, further avoiding the jamming of foreign objects, thereby ensuring the heat dissipation effect of the heat sink; in addition, the present invention can expand multiple heat dissipation gaps in sequence under the pushing of the shifting block, thereby avoiding the jamming of the shell due to insufficient space caused by the simultaneous expansion of multiple heat dissipation gaps, thereby enabling the heat dissipation gaps to complete the expansion action smoothly, thereby ensuring the smooth operation of the cooling system.

[0016] 3. In the present invention, the collection box moves with the rotation of the rotating rod under the transmission of the screw and the slide rod. The collection box will correspond to the heat dissipation gap moved by the shifting block under the transmission. The width of the collection box is adapted to the heat dissipation gap after expansion, so that the existence of the collection box can collect foreign matter while not occupying a large space under the heat sink, so that the airflow passing effect of the heat sink, that is, the heat dissipation effect is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below in conjunction with the accompanying drawings and implementation modes.

[0018] Figure 1 is a stereogram of the present invention;

[0019] Figure 2 yes Figure 1 A three-dimensional image from another angle;

[0020] Figure 3 is a cross-sectional view of the present invention;

[0021] Figure 4 is a three-dimensional diagram of the present invention without the housing;

[0022] Figure 5 yes Figure 4 The enlarged view of point A in the middle;

[0023] Figure 6 is a three-dimensional diagram of a collection box in the present invention;

[0024] Figure 7 is a position diagram of the tube shell in the present invention;

[0025] Figure 8 yes Figure 7The enlarged view of point B in the middle;

[0026] Fig. 9 is a three-dimensional diagram of the transfer rod of the present invention;

[0027] Fig.10 yes Fig. 9 Enlarged view of point C in the middle;

[0028] Fig.11 is a cross-sectional view of the rotating rod of the present invention;

[0029] Fig.12 It is a position diagram of the semiconductor refrigerator in the present invention;

[0030] Fig.13 It is a three-dimensional diagram of the heat sink and the heat sink of the present invention;

[0031] Fig.14 yes Fig.13 Enlarged view of point D in the middle.

[0032] In the figure: housing 1, fan 11, motor 12, screw 13, slide bar 14, driven gear 15, transition gear 16, tube shell 2, liquid inlet pipe 21, liquid outlet pipe 22, semiconductor refrigerator 23, heat sink 3, heat sink 31, heat sink 32, slide bar 33, first spring 34, toggle gap 35, heat sink gap 36, extension strip 37, rotating rod 4, toggle block 41, telescopic slot 42, telescopic rod 43, second spring 44, driving gear 45, collection box 5, mesh door 51, elastic rope 52. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0034] like Figures 1 to 14 As shown, the present invention includes the following embodiments:

[0035] Embodiment 1:

[0036] A cooling system based on semiconductor refrigeration comprises a shell 1 and a tube shell 2 at the middle section of the inner side of the shell 1; the end of the tube shell 2 extends to the outer side of the shell 1 and is connected to a liquid inlet pipe 21 and a liquid outlet pipe 22; both sides of the tube shell 2 are connected to a semiconductor refrigerator 23; the upper port of the shell 1 is connected to a fan 11; the semiconductor refrigerator 23 is fixedly connected to a heat sink 3 on the side away from the tube shell 2; the heat sink 3 is provided with a heat dissipation groove 31 on the side away from the semiconductor refrigerator 23; the heat dissipation groove 31 is slidably connected to a heat sink 32 along the length direction; the inner wall of the heat dissipation groove 31 is fixedly connected to a slide bar 33 along the length direction of the shell 1; the slide bar 33 passes through the heat sink 32 and is slidably connected to the heat sink 32; adjacent heat sinks 32 are connected by a first spring 34; the first spring 34 is sleeved on the outer wall of the slide bar 33; the gap between adjacent heat sinks 32 can be increased after being compressed to overcome the corresponding first spring 34.

[0037] During operation, after the cooling system is applied to the corresponding equipment in the welding field, as the welding proceeds, debris and other particles will be generated in the surrounding environment, and the cooling system will work at the same time. After the fluid takes away the heat of the heat dissipated body, it will enter the tube shell 2 along the liquid inlet pipe 21. After the semiconductor refrigerator 23 is energized, one end will absorb heat and the other end will release heat. One end of the semiconductor refrigerator 23 will absorb the heat of the fluid in the tube shell 2 to cool the fluid in the tube shell 2, so that the fluid in the tube shell 2 is discharged along the liquid outlet pipe 22 and circulated in sequence, and the other end of the semiconductor refrigerator 23 will transfer the heat to the contacted heat sink 3, and the heat sink 3 will transfer the heat to the heat sink 32. As the fan 11 is started, the fan 11 will drive the surrounding gas to blow toward the heat sink 32, so that the heat on the heat sink 32 is taken away, and the heat dissipation of the heat sink 32 is achieved. The fan 11 blows the surrounding airflow from top to bottom toward the heat sink During the cooling process, the debris in the air is unlikely to be brought into the inner side of the housing 1 by the fan 11 under the airflow disturbance generated by the fan 11. The larger particles are intercepted by the filter on the fan 11, and the smaller particles are blown toward the heat sink 32 by the fan 11. The particles enter the heat dissipation gap 36 between the corresponding heat sinks 32. The particles squeeze the two heat sinks 32 to overcome the elastic force of the surrounding first spring 34, so that the heat sink 32 can slide along the slide bar 33 and the heat dissipation groove 31, so that the heat dissipation gap 36 becomes larger, so that the particles can smoothly pass through the heat dissipation gap 36. During the movement of the heat sink 32, the heat of the heat sink 3 can also be continuously transferred to the contacted heat sink 32, so that the heat sink 32 and the heat sink 3 can achieve good thermal conductivity. In the absence of particles in the heat dissipation gap 36, the heat dissipation effect of the heat sink 32 is guaranteed, so that the cooling system can operate normally.

[0038] The present invention arranges a first spring 34 between adjacent heat sinks 32 and enables the heat sinks 32 to slide along the heat sink seat 3, so that the plurality of heat sinks 32 can maintain a heat sink gap 36 for heat dissipation during the heat dissipation process, and can change the size of the gap to avoid getting stuck when encountering particulate matter, thereby ensuring that the cooling system can operate normally.

[0039] Embodiment 2:

[0040] There is a shifting gap 35 between the edge of the heat sink 32 away from the heat sink 3 and the inner wall of the shell 1; a rotating rod 4 is arranged in the shifting gap 35; the rotating rod 4 is rotatably connected to the inner wall of the shell 1; the outer wall of the shell 1 is fixedly connected to the motor 12; the motor 12 is connected to one end of the rotating rod 4; the outer wall of the rotating rod 4 is fixedly connected to the shifting block 41; the gap between adjacent heat sinks 32 can be opened when the shifting block 41 is shifted.

[0041] In this embodiment, the plurality of shift blocks 41 correspond to the heat dissipation gaps 36 formed by the corresponding adjacent heat sinks 32; the plurality of shift blocks 41 are distributed in a spiral manner along the outer wall of the rotating rod 4; the number of spiral coils formed by the shift blocks 41 under the distribution of the rotating rod 4 is a single turn; during the rotation of the rotating rod 4, some of the shift blocks 41 can be driven to open the heat dissipation gaps 36 formed by some of the heat sinks 32.

[0042] In this embodiment, the heat sink 32 is away from the edge of the heat sink 3 and is fixedly connected to the extension bar 37 at a position corresponding to the rotating rod 4; a single heat dissipation gap 36 corresponds to two extension bars 37; the two extension bars 37 are connected to the corresponding heat sink 32; the distance between the two extension bars 37 corresponding to the heat dissipation gap 36 decreases as the distance away from the heat sink 32; the shift block 41 is in a diamond shape; the shift block 41 can shift the two extension bars 37 to expand the corresponding heat dissipation gap 36 when the rotating rod 4 rotates forward or reversely; the rotation of the rotating rod 4 can drive the single heat dissipation gap 36 to expand.

[0043] In this embodiment, a telescopic groove 42 is provided on one side of the shift block 41 away from the central axis of the rotating rod 4; the telescopic groove 42 extends into the rotating rod 4; a telescopic rod 43 is movably connected in the telescopic groove 42; the telescopic rod 43 is connected to the bottom of the telescopic groove 42 by a second spring 44; the telescopic rod 43 can rotate with the rotating rod 4 and pass through the heat dissipation gap 36.

[0044] When working, when the cooling system is working, the fan 11 works under the control of the controller. The fan 11 will take away the heat on the heat sink 32 during the rotation process. At the same time, the controller will control the motor 12 to rotate. The motor 12 will drive the rotating rod 4 to rotate in the shifting gap 35 on the inner side of the shell 1. The rotating rotating rod 4 will drive the shifting block 41 on the outer wall to rotate synchronously. The multiple shifting blocks 41 are distributed in a spiral along the outer wall of the rotating rod 4, and the number of spiral turns formed by the shifting blocks 41 on the outer wall of the rotating rod 4 is a single turn. In this way, during the rotation process of the rotating rod 4, only one of the shifting blocks 41 will be driven to contact with the corresponding extension strip 37. Since the shift block 41 is in a diamond shape, the shift block 41 can enter between the two corresponding extension bars 37 during the forward or reverse rotation of the rotating rod 4. The two extension bars 37 corresponding to the heat dissipation gap 36 move away from each other under the shifting of the shift block 41. The two extension bars 37 drive the heat dissipation fins 32 connected to each other to move away from each other, so that the corresponding heat dissipation gap 36 is actively expanded. Compared with the original passive expansion, it is avoided that the chips are stuck in the heat dissipation gap 36 and cause blockage. During the expansion of the heat dissipation gap 36, the chips are not clamped by the heat dissipation fins 32 on both sides and fall smoothly. During the rotation of the rotating rod 4, only one chip is removed at a time. The thermal gap 36 is expanded, and other heat dissipation gaps 36 are reduced under the pressure, so that the heat dissipation gap 36 can be expanded smoothly, and the situation that the space in the housing 1 is insufficient and stuck due to the simultaneous expansion of multiple heat dissipation gaps 36 can be avoided; in addition, since the distance between the extension bars 37 on two adjacent heat dissipation fins 32 decreases as they move away from the heat dissipation fins 32, the two heat dissipation fins 32 will be further expanded in the process of the shifting block 41 shifting the corresponding two extension bars 37, thereby improving the expansion effect of the heat dissipation gap 36, so that foreign matter in the heat dissipation gap 36 can be further smoothly dropped; when the rotating rod 4 drives the shifting block 41 around the center During the rotation of the shaft, the rotating rod 4 will drive the telescopic rod 43 on the shifting block 41 to move around the central axis. The telescopic rod 43 will enter the corresponding heat dissipation gap 36 as the rotating rod 4 rotates, thereby shifting the foreign matter in the heat dissipation gap 36, so that the foreign matter is further dropped off under the shifting of the telescopic rod 43. When the telescopic rod 43 contacts the inner wall of the housing 1 as the rotating rod 4, the end of the telescopic rod 43 is compressed and will overcome the second spring 44 and retract into the telescopic groove 42. In this way, the shifting block 41 is shifted toward the heat dissipation gap 36 again under the rotation of the rotating rod 4, and the telescopic rod 43 is extended again in the telescopic groove 42 under the action of the second spring 44.

[0045] In this embodiment, the rotating rod 4 rotates to drive the shifting block 41 to shift the two extension strips 37 to drive the two heat sinks 32 away from each other, so that the heat dissipation gap 36 formed by the two heat sinks 32 can be actively expanded, further avoiding the jamming of foreign objects, thereby ensuring the heat dissipation effect of the heat sink 32; in addition, the present invention enables multiple heat dissipation gaps 36 to expand in sequence under the movement of the shifting block 41, thereby avoiding the simultaneous expansion of multiple heat dissipation gaps 36 and causing insufficient space in the shell 1 to jam, thereby allowing the heat dissipation gap 36 to successfully complete the expansion action, thereby ensuring the smooth operation of the cooling system.

[0046] Embodiment 3:

[0047] The inner wall of the shell 1 is rotatably connected to the screw 13 and fixed to the slide bar 14; the slide bar 14 and the screw 13 are arranged along the length direction of the shell 1; one end of the screw 13 extends to the outside of the shell 1 and is fixed to the driven gear 15; one end of the rotating rod 4 is fixed to the driving gear 45; the driving gear 45 is meshed with the driven gear 15 through the transition gear 16 for transmission; the rotating rotating rod 4 can drive the screw 13 to rotate; the outer wall of the screw 13 is threadedly connected to the collection box 5; the collection box 5 is located directly below the heat sink 32; the collection box 5 is passed through by the slide bar 14 and is slidably connected to the slide bar 14; the upper end of the collection box 5 is open; the bottom wall of the collection box 5 is hinged to the mesh door 51; the width of the collection box 5 is adapted to the heat dissipation gap 36 after expansion; the collection box 5 corresponds to the heat dissipation gap 36 driven by the shift block 41 under the transmission of the rotating rod 4.

[0048] In this embodiment, the depth of the collecting box 5 increases as it moves away from the rotating rod 4; the foreign matter on the bottom wall of the collecting box 5 moves closer to a deeper position under the action of gravity.

[0049] In this embodiment, the upper end of the collection box 5 is connected to an elastic rope 52; the adjacent elastic ropes 52 are arranged in parallel and close to each other; the elastic rope 52 at the upper end of the collection box 5 is bent and then restored when a foreign object passes through it.

[0050] During operation, when the motor 12 drives the rotating rod 4 to rotate, the rotating rod 4 will drive the driving gear 45 at the end to rotate, and the driving gear 45 will drive the meshing transition gear 16 to rotate during the rotation, and the meshing driven gear 15 will drive the screw 13 to rotate during the rotation of the driven gear 15, and the screw 13 will drive the collection box 5 connected with the threaded transmission to slide along the slide bar 14. The moving position of the collection box 5 corresponds to the position of the corresponding expanded heat dissipation gap 36. In this way, when the corresponding heat dissipation gap 36 is expanded, the foreign matter will move downward under the action of wind force and its own gravity. Since the collection box 5 is located directly below the corresponding heat dissipation gap 36, the foreign matter The foreign matter will move toward the inside of the collection box 5. Since the upper end of the collection box 5 is connected in parallel to the elastic rope 52, the foreign matter will squeeze the elastic rope 52 when entering the inner side of the collection box 5. The corresponding elastic rope 52 will bend to form a gap after being compressed, so that the foreign matter can pass through the elastic rope 52 and enter the collection box 5 along the upper end of the collection box 5. Since the bottom wall of the collection box 5 is hinged to the mesh door 51 that can be opened and closed, the airflow from top to bottom can drive the foreign matter into the collection box 5 and pass through the holes on the mesh door 51. The foreign matter entering the collection box 5 rebounds during the collision. The foreign matter rebounding upward cannot be ejected due to the interception and shielding of the elastic rope 52, thereby realizing the collection of foreign matter falling from the heat dissipation gap 36. This prevents foreign matter from falling at the lower port of the shell 1 and being screwed in again by the fan 11, thereby preventing secondary blockage of the heat sink 32, and further improving the stability of the cooling system; in addition, the depth of the collection box 5 increases as it moves away from the rotating rod 4, so the foreign matter in the collection box 5 will be gathered at a deeper position under the action of gravity, so that the holes on the mesh door 51 at a shallower position in the collection box 5 are exposed, thereby ensuring smooth airflow in the vertical direction of the collection box 5; the width of the collection box 5 is adapted to the expanded heat dissipation gap 36, so that the existence of the collection box 5 can collect foreign matter while not occupying a large space under the heat sink 32, so that the airflow through the heat sink 32, i.e., the heat dissipation The thermal effect is guaranteed; the collection box 5 moves with the rotation of the rotating rod 4 under the transmission of the screw 13 and the slide rod 14, and the collection box 5 will correspond to the heat dissipation gap 36 moved by the shift block 41 under the transmission, and will rotate in the opposite direction under the control of the motor 12 after the rotating rod 4 completes one circle of rotation, and the motor 12 will rotate back and forth, so that the collection box 5 will move back and forth along the axial direction of the slide rod 14, thus ensuring that the collection box 5 corresponds to the position of the expanded heat dissipation gap 36; after the foreign matter in the collection box 5 accumulates to a certain extent, the motor 12 is stopped, and the mesh door 51 is opened to expose the bottom of the collection box 5, and the foreign matter in the collection box 5 is discharged. The foreign matter in the collection box 5 needs to be cleaned regularly to ensure the collection effect of the collection box 5.

[0051] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate directions or positional relationships based on the attached Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it cannot be understood as limiting the scope of protection of the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0052] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A cooling system based on semiconductor refrigeration, comprising a shell and a tube shell in the middle of the inner side of the shell; the end of the tube shell extends to the outer side of the shell and is connected to a liquid inlet pipe and a liquid outlet pipe; both sides of the tube shell are connected to a semiconductor refrigerator; the upper port of the shell is connected to a fan; characterized in that: The semiconductor refrigerator is fixedly connected to a heat sink on one side away from the tube shell; a heat sink is provided with a heat sink on one side away from the semiconductor refrigerator; the heat sink is slidably connected to a heat sink along the length direction; the inner wall of the heat sink is fixedly connected to a slide bar along the length direction of the shell; the slide bar passes through the heat sink and is slidably connected to the heat sink; adjacent heat sinks are connected by a first spring; the first spring is sleeved on the outer wall of the slide bar; the gap between adjacent heat sinks can be increased by overcoming the corresponding first spring after being compressed; There is a shifting gap between the edge of the heat sink away from the heat sink and the inner wall of the shell; a rotating rod is arranged in the shifting gap; the rotating rod is rotatably connected to the inner wall of the shell; the outer wall of the shell is fixedly connected to the motor; the motor is connected to one end of the rotating rod; the outer wall of the rotating rod is fixedly connected to the shifting block; the gap between adjacent heat sinks can be expanded by the shifting of the shifting block; The plurality of shifting blocks correspond to the heat dissipation gaps formed by the corresponding adjacent heat sinks; the plurality of shifting blocks are distributed in a spiral manner along the outer wall of the rotating rod; the number of spiral coils formed by the shifting blocks under the distribution of the rotating rod is a single turn; during the rotation of the rotating rod, some of the shifting blocks can be driven to expand the heat dissipation gaps formed by some of the heat sinks.

2. A cooling system based on semiconductor refrigeration according to claim 1, characterized in that: The heat sink is away from the edge of the heat sink and is fixedly connected to an extension bar at a position corresponding to the rotating rod; a single heat dissipation gap corresponds to two extension bars; the two extension bars are connected to the corresponding heat sink; the distance between the two extension bars corresponding to the heat dissipation gap decreases as the distance away from the heat sink; the shift block is in a diamond shape; the shift block can shift the two extension bars to expand the corresponding heat dissipation gap when the rotating rod rotates forward or reversely; the rotation of the rotating rod can drive the expansion of a single heat dissipation gap.

3. A cooling system based on semiconductor refrigeration according to claim 2, characterized in that: The shift block is provided with a telescopic slot on one side away from the central axis of the rotating rod; the telescopic slot extends into the rotating rod; the telescopic rod is movably connected in the telescopic slot; the telescopic rod is connected to the bottom of the telescopic slot via a second spring; the telescopic rod can pass through the heat dissipation gap as the rotating rod rotates.

4. A cooling system based on semiconductor refrigeration according to claim 2, characterized in that: The inner wall of the shell is rotatably connected to the screw and fixed to the sliding rod; the sliding rod and the screw are arranged along the length direction of the shell; one end of the screw extends to the outside of the shell and is fixed to the driven gear; one end of the rotating rod is fixed to the driving gear; the driving gear is meshed with the driven gear through the transition gear; the rotating rotating rod can drive the screw to rotate; the outer wall of the screw is threadedly connected to the collection box; the collection box is located directly below the heat sink; the collection box is passed through by the sliding rod and is slidably connected to the sliding rod; the upper end of the collection box is an opening; the bottom wall of the collection box is hinged to the mesh door; the width of the collection box is adapted to the heat dissipation gap after expansion; the collection box corresponds to the heat dissipation gap driven by the shifting block under the transmission of the rotating rod.

5. A cooling system based on semiconductor refrigeration according to claim 4, characterized in that: The depth of the collection box increases as it moves away from the rotating rod; the foreign matter on the bottom wall of the collection box moves closer to a deeper position under the action of gravity.

6. A cooling system based on semiconductor refrigeration according to claim 5, characterized in that: The upper port of the collection box is connected to an elastic rope; the adjacent elastic ropes are arranged in parallel and close to each other; the elastic rope at the upper port of the collection box is bent and then restored when a foreign object passes through it.

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