Rotating mechanism and wafer cleaning device

Abstract

The present application provides a rotating mechanism and a wafer cleaning device, which relate to the field of wafer cleaning technology. The rotating mechanism includes: an outer end cover, an inner end cover, a rotating shaft and an annular pad. The outer end cover and the inner end cover are arranged on the rotating shaft, and the annular pad is clamped between the outer end cover and the inner end cover. A first flow channel is arranged in the rotating shaft, a second flow channel is arranged on the side opposite to the annular pad on the outer end cover, and a third flow channel is arranged on the side opposite to the annular pad on the inner end cover, and the first flow channel is connected to the second flow channel and the third flow channel respectively. The first flow channel is used to transport fluid to the second flow channel and the third flow channel respectively, and the fluid flows through the first side and the second side of the annular pad through the second flow channel and the third flow channel respectively, and flows out from the side of the annular pad away from the rotating shaft. This solution can prevent the wafer from being contaminated or worn.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of wafer cleaning technology, and in particular to a rotating mechanism and a wafer cleaning device. Background Art

[0002] In the semiconductor field, CMP (Chemical Mechanical Polishing) is one of the core processes in the wafer manufacturing process. Pollution and / or particulate matter will be introduced to the wafer surface after CMP, so the wafer needs to be cleaned, dried and other post-processing.

[0003] At present, a wafer scrubbing unit generally includes a driving module and a spraying module. The driving module drives the wafer to rotate, and the spraying module sprays a cleaning liquid onto the surface of the wafer for cleaning.

[0004] However, this solution causes the edge areas of the front and back sides of the wafer to collide and rub against the edge of the drive module during cleaning, causing particles on the drive module to spread along with the liquid near the edge of the wafer and reach the internal areas of the front and back sides of the wafer, causing the wafer to be contaminated or worn. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a rotating mechanism and a wafer cleaning device to at least solve some of the above problems.

[0006] According to a first aspect of an embodiment of the present application, a rotating mechanism is provided for a wafer cleaning device, the rotating mechanism comprising: an outer end cover, an inner end cover, a rotating shaft and an annular pad. The outer end cover and the inner end cover are arranged on the rotating shaft, and the annular pad is clamped between the outer end cover and the inner end cover. A first flow channel is arranged in the rotating shaft, a second flow channel is arranged on the side opposite to the annular pad on the outer end cover, and a third flow channel is arranged on the side opposite to the annular pad on the inner end cover, and the first flow channel is connected to the second flow channel and the third flow channel respectively. The first flow channel is used to transport fluid to the second flow channel and the third flow channel respectively, and the fluid flows through the first side and the second side of the annular pad respectively through the second flow channel and the third flow channel, and flows out from the side of the annular pad away from the rotating shaft.

[0007] In some specific embodiments of the present application, a first recessed area is provided on the side of the outer end cover opposite to the annular pad, the first recessed area and the annular pad constitute a first buffer chamber, the first buffer chamber is communicated with the second flow channel, and the fluid flowing out of the second flow channel enters the first buffer chamber. A second recessed area is provided on the side of the inner end cover opposite to the annular pad, the second recessed area and the annular pad constitute a second buffer chamber, the second buffer chamber is communicated with the third flow channel, and the fluid flowing out of the third flow channel enters the second buffer chamber.

[0008] In some specific embodiments of the present application, the first recessed area includes a plurality of first recessed areas, and the plurality of first recessed areas are evenly distributed along the circumference of the outer end cover. The second recessed area includes a plurality of second recessed areas, and the plurality of second recessed areas are evenly distributed along the circumference of the inner end cover.

[0009] In some specific embodiments of the present application, a first annular baffle is provided on the side surface of the outer end cover corresponding to the annular pad, the axis of the first annular baffle coincides with the axis of the outer end cover, and the radius of the first annular baffle is greater than or equal to the radius of the annular pad. A second annular baffle is provided on the side surface of the inner end cover corresponding to the annular pad, the axis of the second annular baffle coincides with the axis of the inner end cover, and the radius of the second annular baffle is greater than or equal to the radius of the annular pad.

[0010] In some specific embodiments of the present application, the radius of the first annular baffle is greater than the radius of the annular pad, the first recessed area, the first annular baffle and the annular pad constitute the first buffer chamber, and the fluid in the first buffer chamber flows out from the gap between the annular pad and the first annular baffle. And / or, the radius of the second annular baffle is greater than the radius of the annular pad, the second recessed area, the second annular baffle and the annular pad constitute the second buffer chamber, and the fluid in the second buffer chamber flows out from the gap between the annular pad and the second annular baffle.

[0011] In some specific embodiments of the present application, the edge of the outer end cover is provided with a plurality of first notches along the circumferential direction, the first buffer chamber is connected to at least one of the first notches, and the fluid in the first buffer chamber flows out from the connected first notches. The edge of the inner end cover is provided with a plurality of second notches along the circumferential direction, the second buffer chamber is connected to at least one of the second notches, and the fluid in the second buffer chamber flows out from the connected second notches.

[0012] In some specific embodiments of the present application, the first flow channel includes a main flow channel and a branch flow channel, and the branch flow channel is used to connect the main flow channel with the second flow channel and the main flow channel with the third flow channel.

[0013] In some specific embodiments of the present application, the diameter range of the main flow channel includes 3~6.5mm, and the diameter range of the branch flow channel includes 1~1.5mm.

[0014] In some specific embodiments of the present application, the inner end cover is integrated with the rotating shaft.

[0015] According to a second aspect of an embodiment of the present application, a wafer cleaning device is provided, the wafer cleaning device comprising: a fluid supply module and at least one rotating mechanism as described in the first aspect above. The rotating mechanism is used to drive the wafer to rotate or detect the rotation speed of the wafer. The fluid supply module is used to control the fluid pressure so that the fluid flows into the first flow channel included in the rotating mechanism.

[0016] In the semiconductor field, wafer cleaning is a necessary process. Wafer cleaning is performed after each process procedure, resulting in a large amount of water consumption in wafer production, and deionized water is usually used for wafer cleaning, and the cost of producing deionized water is also very high. According to the above technical solution of the present application, a first flow channel is provided in the rotating shaft, a second flow channel is provided on the side opposite to the annular pad on the outer end cover, and a third flow channel is provided on the side opposite to the annular pad on the inner end cover. The first flow channel is connected to the second flow channel and the third flow channel respectively. When cleaning the wafer, a slight positive pressure of the fluid is maintained, and the fluid continues to flow outward from the second flow channel and the third flow channel. After flowing through the first side and the second side of the annular pad, the fluid flows out from the side of the annular pad away from the rotating shaft, thereby flushing the particles or other contaminants inside or on the edge of the rotating mechanism, and avoiding the wafer from being contaminated or worn. As a result, the yield of the wafer is improved, and the additional cleaning resources caused by the contamination or wear of the wafer are saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 is a schematic diagram of a rotating mechanism provided by an embodiment of the present application;

[0019] Figure 2 It is a side view of an outer end cover opposite to the annular gasket provided by an embodiment of the present application;

[0020] Figure 3 It is a schematic side view of the inner end cover opposite to the annular gasket provided by one embodiment of the present application;

[0021] Figure 4 is a partial cross-sectional schematic diagram of a rotating mechanism provided by an embodiment of the present application;

[0022] Figure 5 is a side view of the outer end cover opposite to the annular gasket provided in another embodiment of the present application;

[0023] Figure 6 is a schematic diagram of a first flow channel provided by an embodiment of the present application;

[0024] Figure 7 It is a schematic diagram of an inner end cover and a rotating shaft integrated into one body provided by an embodiment of the present application;

[0025] Figure 8 is a block diagram of a wafer cleaning device provided by an embodiment of the present application;

[0026] Fig. 9 This is a partial schematic diagram of a wafer cleaning device provided in one embodiment of the present application.

[0027] Description of reference numerals:

[0028] 100: rotating mechanism; 101: outer end cover; 102: inner end cover; 103: rotating shaft; 104: annular pad; 105: first flow channel; 106: end cover gap; 107: third flow channel; 108: second flow channel; 109: second recessed area; 110: first recessed area; 111: first partition; 112: second partition; 113: first notch; 1011: first raised portion; 1021: second raised portion; 1012: first annular baffle; 1022: second annular baffle; 1051: main flow channel; 1052: branch flow channel;

[0029] 700: wafer cleaning device; 702: rotating mechanism; 704: fluid supply module;

[0030] 801: box; 802: wafer; 803: A driving wheel; 804: B driving wheel; 805: driven wheel. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and detailed described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0032] In the semiconductor field, CMP (Chemical Mechanical Polishing) is one of the core processes in the wafer manufacturing process. Pollution and / or particulate matter will be introduced to the wafer surface after CMP, so the wafer needs to be cleaned, dried and other post-processing. In the prior art, the scrubbing system used to clean the wafer generally includes a drive module and a spray module. The drive module drives the wafer to rotate, and the spray module sprays cleaning liquid on the surface of the wafer for cleaning. However, since the edge areas of the front and back sides of the wafer will collide and rub against the edge of the drive module during cleaning, the particulate matter of the drive module will spread with the liquid near the edge of the wafer and reach the internal areas of the front and back sides of the wafer, causing the wafer to be contaminated or worn.

[0033] In order to solve the above problems, an embodiment of the present application provides a rotating mechanism for a wafer cleaning device. The rotating mechanism is described in detail below through multiple embodiments.

[0034] Figure 1 FIG. 1 is a schematic diagram of a rotating mechanism according to an embodiment of the present application. Figure 1 As shown, the rotating mechanism 100 provided in the embodiment of the present application is used in a wafer cleaning device, and the rotating mechanism 100 includes: an outer end cover 101, an inner end cover 102, a rotating shaft 103 and an annular pad 104.

[0035] like Figure 1 As shown, the outer end cover 101 and the inner end cover 102 are arranged on the rotating shaft 103, and the annular pad 104 is clamped between the outer end cover 101 and the inner end cover 102. A first flow channel 105 is arranged in the rotating shaft 103, a second flow channel 108 is arranged on the side opposite to the annular pad 104 on the outer end cover 101, and a third flow channel 107 is arranged on the side opposite to the annular pad 104 on the inner end cover 102. The first flow channel 105 is connected with the second flow channel 108 and the third flow channel 107 respectively. The first flow channel 105 is used to transport fluid to the second flow channel 108 and the third flow channel 107 respectively, and the fluid flows through the first side and the second side of the annular pad 104 through the second flow channel 108 and the third flow channel 107 respectively, and flows out from the side of the annular pad 104 away from the rotating shaft.

[0036] Exemplarily, a mounting seat is provided on the rotating shaft 103, a bearing is installed inside the mounting seat, an outer end cover 101 and an inner end cover 102 are passed through the rotating shaft 103, and there are protrusions on the opposite sides of the outer end cover 101 and the inner end cover 102. The annular gasket 104 is sleeved on the outer periphery of the protrusion, and then the outer end cover 101 and the inner end cover 102 are matched to clamp the annular gasket 104, the outer ring pressure cover presses the outer ring of the bearing, and the locking nut is used to press the inner ring of the bearing.

[0037] When the wafer is cleaned, the side of the annular pad 104 away from the rotation axis contacts the edge of the wafer, and the outer end cover 101, the annular pad 104 and the inner end cover 102 rotate synchronously with the wafer around the axial direction of the rotation axis 103. By maintaining a slight positive pressure of the fluid, the fluid enters the first flow channel 105, and then flows into the second flow channel 108 and the third flow channel 107 respectively. After flowing through the first side surface and the second side surface of the annular pad 104, it flows out from the side of the annular pad 104 away from the rotation axis. The fluid speed is low, which can both rinse the wafer and not affect the wafer quality.

[0038] In the embodiment of the present application, the fluid is used to clean the wafer, and it can be water, chemical substances or any other appropriate fluid, which is not limited in the present application.

[0039] In the semiconductor field, wafer cleaning is a necessary process. Wafer cleaning is performed after each process procedure, resulting in a large amount of water consumption in the production of wafers, and deionized water is usually used for wafer cleaning, and the cost of producing deionized water is also very high. In an embodiment of the present application, a first flow channel is provided in the rotating shaft, a second flow channel is provided on the side opposite to the annular pad on the outer end cover, and a third flow channel is provided on the side opposite to the annular pad on the inner end cover. The first flow channel is connected to the second flow channel and the third flow channel respectively. When cleaning the wafer, a slight positive pressure of the fluid is maintained, and the fluid continues to flow outward from the second flow channel and the third flow channel. After flowing through the first side and the second side of the annular pad, it flows out from the side of the annular pad away from the rotating shaft, thereby flushing the particles or other contaminants inside or on the edge of the rotating mechanism, and avoiding the wafer from being contaminated or worn. As a result, the yield of the wafer is improved, and additional cleaning resources caused by wafer contamination or wear are saved.

[0040] It should be noted that when the wafer is not cleaned, the fluid pressure can be increased, the fluid flow rate can be increased, and the rotating mechanism can be flushed independently.

[0041] In a feasible implementation, a first recessed area is provided on the side of the outer end cover opposite to the annular gasket, the first recessed area and the annular gasket form a first buffer chamber, the first buffer chamber is connected to the second flow channel, and the fluid flowing out of the second flow channel enters the first buffer chamber. A second recessed area is provided on the side of the inner end cover opposite to the annular gasket, the second recessed area and the annular gasket form a second buffer chamber, the second buffer chamber is connected to the third flow channel, and the fluid flowing out of the third flow channel enters the second buffer chamber.

[0042] Figure 2 This is a side view of the outer end cover opposite to the annular gasket. Figure 2As shown, the outer end cover 101 has a first protrusion 1011, the annular pad 104 is sleeved on the outer periphery of the first protrusion 1011 of the outer end cover, and the outer end cover 101 is also provided with a second flow channel 108 and a first recessed area 110. The space formed by the first recessed area 110 and the side of the annular pad 104 constitutes a first buffer chamber, and the first buffer chamber is connected to the second flow channel 108. When the wafer is cleaned, Figure 2 In the direction indicated by the middle arrow, the fluid enters the second flow channel 108 from the first flow channel 105, flows into the first buffer chamber, and then flows out from the side of the annular pad 104 away from the rotating shaft.

[0043] It should be noted that the present application does not limit the number of the first recessed areas 110. The first recessed areas 110 may include one or more. When the first recessed areas 110 may include multiple areas, such as Figure 2 As shown, the plurality of first recessed areas 110 are separated by first partitions 111 to facilitate fluid outflow. When the fluid is liquid, the liquid forms a liquid seal in the chamber between adjacent first partitions 111 to prevent particles or other contaminants from entering.

[0044] The inner end cover and the outer end cover have similar structures, but the structures of the two are not limited to be completely the same. Figure 3 This is a schematic diagram of the side view of the inner end cover opposite to the annular gasket. Figure 3 As shown, the inner end cover 102 has a second protrusion 1021, the annular pad 104 is sleeved on the outer periphery of the second protrusion 1021 of the inner end cover, and the inner end cover 102 is also provided with a third flow channel 107 and a second recessed area 109. The space formed by the second recessed area 109 and the side of the annular pad 104 constitutes a second buffer chamber, and the second buffer chamber is connected to the third flow channel 107. When the wafer is cleaned, Figure 3 In the direction indicated by the middle arrow, the fluid enters the third flow channel 107 from the first flow channel 105, flows into the second buffer chamber, and then flows out from the first notch 113 of the outer end cover 101 located on the side of the annular gasket 104 away from the rotating axis, or can flow out from the end cover gap 106 between the outer end cover 101 and the inner end cover 102 located on the side of the annular gasket 104 away from the rotating axis.

[0045] It should also be noted that the present application does not limit the number of the second recessed areas 109. The second recessed areas 109 may include one or more. When the second recessed areas 109 may include multiple areas, such as Figure 3 As shown, the plurality of second recessed areas 109 are separated by second partitions 112 to facilitate fluid outflow. When the fluid is liquid, the liquid forms a liquid seal in the chamber between adjacent second partitions 112 to prevent particles or other contaminants from entering.

[0046] In an embodiment of the present application, a first recessed area is provided on the side of the outer end cover opposite to the annular pad, and the first recessed area and the annular pad constitute a first buffer chamber. A second recessed area is provided on the side of the inner end cover opposite to the annular pad, and the second recessed area and the annular pad constitute a second buffer chamber. The fluid flowing out of the second flow channel and the third flow channel flows into the first buffer chamber and the second buffer chamber respectively. Since the first buffer chamber and the second buffer chamber can store relatively more fluid, the particles or other contaminants inside or on the edge of the wafer or rotating mechanism can be more fully flushed.

[0047] In a feasible implementation, the first recessed area includes a plurality of first recessed areas, which are evenly distributed along the circumferential direction of the outer end cover; the second recessed area includes a plurality of second recessed areas, which are evenly distributed along the circumferential direction of the inner end cover.

[0048] like Figure 2 and Figure 3 As shown, multiple first recessed areas 110 are evenly distributed along the circumferential direction of the outer end cover 101, and the multiple first recessed areas 110 are separated by first partitions 111. Multiple second recessed areas 109 are evenly distributed along the circumferential direction of the inner end cover 102, and the multiple second recessed areas 109 are separated by second partitions 112. The multiple first recessed areas 110 are respectively connected to the multiple second flow channels 108, and the multiple second recessed areas 109 are respectively connected to the multiple third flow channels 107. It should be noted that the figure is only exemplary, and the embodiment of the present application does not limit the number of the first recessed areas 110 and the second recessed areas 109, as long as they are evenly distributed.

[0049] In an embodiment of the present application, multiple first recessed areas are evenly distributed along the circumferential direction of the outer end cover, and multiple second recessed areas are evenly distributed along the circumferential direction of the inner end cover. When cleaning the wafer, the rotation of the rotating mechanism can remain stable and not eccentric, so that the friction force at the edge where the rotating mechanism contacts the wafer is more uniform, which facilitates the washing of the wafer.

[0050] In a feasible implementation, a first annular baffle is provided on the side of the outer end cover corresponding to the annular pad, the axis of the first annular baffle coincides with the axis of the outer end cover, and the radius of the first annular baffle is greater than or equal to the radius of the annular pad. A second annular baffle is provided on the side of the inner end cover corresponding to the annular pad, the axis of the second annular baffle coincides with the axis of the inner end cover, and the radius of the second annular baffle is greater than or equal to the radius of the annular pad.

[0051] Figure 4 is a partial cross-sectional diagram of the rotating mechanism. Figure 4As shown, the outer end cover 101 and the inner end cover 102 cooperate with each other to clamp the annular pad 104 in the middle, and a first annular baffle 1012 is provided on the side of the outer end cover 101 corresponding to the annular pad 104, and a second annular baffle 1022 is provided on the side of the inner end cover 102 corresponding to the annular pad 104. When cleaning the wafer, Figure 4 In the direction of the middle arrow, the fluid flows out from two sides of the annular gasket 104 , flows through the gaps between the first annular baffle 1012 and the second annular baffle 1022 and the annular gasket 104 , and then flows out from the outside of the annular gasket 104 .

[0052] In the embodiment of the present application, the first annular baffle and the second annular baffle are used to expose a smaller area of ​​the outer side of the annular pad, thereby reducing the possibility of particles or other contaminants being retained at the edge of the rotating mechanism. At the same time, the fluid flows through the gap between the first annular baffle and the second annular baffle and the annular pad to flush the wafer and the inside or edge of the rotating mechanism.

[0053] In one possible implementation, the radius of the first annular baffle is greater than the radius of the annular pad, the first recessed area, the first annular baffle and the annular pad constitute a first buffer chamber, and the fluid in the first buffer chamber flows out from the gap between the annular pad and the first annular baffle; and / or the radius of the second annular baffle is greater than the radius of the annular pad, the second recessed area, the second annular baffle and the annular pad constitute a second buffer chamber, and the fluid in the second buffer chamber flows out from the gap between the annular pad and the second annular baffle.

[0054] like Figure 4 As shown, on the outer end cover, the radius of the first annular baffle 1012 is greater than the radius of the annular pad 104, so as to ensure that there is a gap between the radius of the first annular baffle 1012 and the annular pad 104. At the same time, the first recessed area 110, the first annular baffle 1012 and the annular pad 104 form a space to constitute a first buffer chamber, so that the fluid in the first buffer chamber flows out from the gap between the first annular baffle 1012 and the annular pad 104.

[0055] Similarly, the radius of the second annular baffle 1022 on the inner end cover is greater than the radius of the annular pad 104, so as to ensure that there is a gap between the radius of the second annular baffle 1022 and the annular pad 104. At the same time, the second recessed area 109, the second annular baffle 1022 and the annular pad 104 form a space to constitute a second buffer chamber, so that the fluid in the second buffer chamber flows out from the gap between the radius of the second annular baffle 1022 and the annular pad 104.

[0056] It should be noted that the rotating mechanism may include both the structure on the outer end cover and the structure on the inner end cover, or may include one of them, both of which can achieve flushing of the edge or interior of the wafer and the rotating mechanism, and this application does not limit this.

[0057] In the embodiment of the present application, by designing that the radius of the first annular baffle is larger than the radius of the annular pad and / or the radius of the second annular baffle on the inner end cover is larger than the radius of the annular pad, a gap exists between the first annular baffle and the annular pad and / or between the second annular baffle and the annular pad, so that the fluid in the first buffer chamber and / or the second buffer chamber flows out from the gap, thereby flushing the inside or edge of the wafer and the rotating mechanism.

[0058] In a possible implementation, a plurality of first notches are provided along the circumferential direction at the edge of the outer end cover, the first buffer chamber is connected to at least one of the first notches, and the fluid in the first buffer chamber flows out from the connected first notches. A plurality of second notches are provided along the circumferential direction at the edge of the inner end cover, the second buffer chamber is connected to at least one of the second notches, and the fluid in the second buffer chamber flows out from the connected second notches.

[0059] Figure 5 FIG. 1 is a side view of the outer end cover opposite to the annular gasket of another embodiment of the present application. Figure 5 As shown, the outer end cover 101 has a first protrusion 1011, the annular gasket 104 is sleeved on the first protrusion 1011 of the outer end cover, the outer end cover 101 is provided with a second flow channel 108, the side of the outer end cover 101 opposite to the annular gasket 104 is provided with a first recessed area 110 and a first annular baffle 1012, and the edge of the outer end cover 101 is provided with a plurality of first notches 113 along the circumferential direction, at least one of the first notches 113 is connected to the first buffer chamber, so that the fluid in the first buffer chamber flows out from the connected first notches 113. Specifically, the plurality of first notches 113 can be evenly distributed along the circumferential direction of the outer end cover 101.

[0060] It should be noted that the inner end cap is similar to the outer end cap in implementation, and the specific implementation method is referred to the outer end cap, which will not be described in detail here. Figure 2 As shown, the outer end cap can be Figure 5 As shown, at this time, the liquid Figure 5 The first notch 113 shown flows out, and this solution is also within the protection scope of the present application.

[0061] In the embodiment of the present application, a plurality of first notches are arranged along the circumferential direction at the edge of the outer end cover, and the first buffer chamber is connected to at least one of the first notches; a plurality of second notches are arranged along the circumferential direction at the edge of the inner end cover, and the second buffer chamber is connected to at least one of the second notches; when the wafer is cleaned, the fluid in the first buffer chamber and the second buffer chamber can flow out through the first notch and / or the second notch to flush the interior or edge of the wafer and the rotating mechanism.

[0062] In a possible implementation, the first flow channel includes a main flow channel and a branch flow channel, and the branch flow channel is used to connect the main flow channel and the second flow channel and the main flow channel and the third flow channel.

[0063] Figure 6 Schematic diagram of the first flow channel of an embodiment of the present application. Figure 6 As shown, a first flow channel 105 is provided in the rotating shaft 103, and the first flow channel 105 includes a main flow channel 1051 and a branch flow channel 1052. The main flow channel 1051 can be provided along the axial direction of the rotating shaft, and the main flow channel 1051 is connected with the second flow channel 108 on the outer end cover 101 and the third flow channel 107 on the inner end cover 102 through the branch flow channel 1052. Thus, the fluid can flow from the main flow channel 1051 through the branch flow channel 1052, and then flow into the second flow channel 108 and the third flow channel 107 respectively, and finally flow out from the side of the annular pad 104 away from the rotating shaft 103.

[0064] Specifically, the branch flow channels 1052 may include multiple branch flow channels 1052, and the multiple branch flow channels 1052 are respectively connected to the second flow channel 108 and the third flow channel 107. The multiple branch flow channels 1052 may be respectively perpendicular to the main flow channel 1051, or may respectively form an angle less than 90° with the main flow channel 1051.

[0065] In an embodiment of the present application, the first flow channel includes a main flow channel and a branch flow channel, and the branch flow channel is used to connect the main flow channel and the second flow channel and the main flow channel and the third flow channel. Thus, the fluid flowing into the main flow channel flows through the branch flow channel, and then flows into the second flow channel and the third flow channel respectively, and finally flows out from the side of the annular pad away from the rotating axis, so as to achieve the purpose of flushing the wafer and the rotating mechanism.

[0066] In a possible implementation, the diameter of the main flow channel ranges from 3 to 6.5 mm, and the diameter of the branch flow channel ranges from 1 to 1.5 mm.

[0067] The main channel needs to deliver fluid to multiple branch channels. In order to prevent some branch channels from not receiving or receiving less fluid, the diameter range of the main channel can be set to be relatively large. For example, the diameter range of the main channel includes 3~6.5mm. Correspondingly, the diameter range of the branch channel is smaller than that of the main channel. For example, the diameter range of the branch channel includes 1~1.5mm. In this way, the fluid can be continuously delivered to multiple branch channels through the main channel.

[0068] In the embodiment of the present application, the diameter range of the main channel includes 3~6.5mm, and the diameter range of the branch channel includes 1~1.5mm. Since the diameter range of the main channel is larger than the diameter range of the branch channel, the fluid flowing out of the main channel is diverted to each branch channel, and then flows through the second channel and the third channel, and flows out from the side of the annular pad away from the rotating axis.

[0069] In a possible implementation, the inner end cover is integral with the rotating shaft.

[0070] Figure 7 FIG. 1 is a schematic diagram of an embodiment of the present application in which the inner end cover and the rotating shaft are integrated. Figure 7 As shown, the inner end cover 102 is integrated with the rotating shaft 103, wherein a main channel 1051 and a branch channel 1052 are provided, the main channel 1051 and the branch channel 1052 are connected, and the fluid in the main channel 1051 flows into the branch channel 1052, and then flows into the second channel and the third channel.

[0071] Specifically, the main channel 1051 and the branch channel 1052 may be perpendicular to each other or form an angle less than 90°.

[0072] In the embodiment of the present application, the inner end cover is integrated with the rotating shaft, which makes the structure of the rotating mechanism simpler and saves time and cost during installation.

[0073] Corresponding to the above-mentioned rotating mechanism embodiment, Figure 8 A block diagram of a wafer cleaning device according to an embodiment of the present application is shown. Figure 8 As shown, the wafer cleaning device 700 includes:

[0074] The rotating mechanism 702 is used to drive the wafer to rotate or detect the rotation speed of the wafer;

[0075] The fluid supply module 704 is used to control the fluid pressure so that the fluid flows into the first flow channel included in the rotating mechanism 702 .

[0076] Specifically, Fig. 9 A partial schematic diagram of a wafer cleaning device is shown. Fig. 9 As shown, the wafer cleaning device includes a box body 801, a driving wheel A 803, a driving wheel B 804 and a driven wheel 805, wherein the driving wheel A 803 and the driving wheel B 804 are used to support the wafer 802, and the driven wheel 805 is used to detect the rotation speed of the wafer. Any one or more of the driving wheel A 803, the driving wheel B 804 and the driven wheel 805 can adopt the rotating mechanism as described above, and the driving wheel A, the driving wheel B and / or the driven wheel adopting the rotating mechanism are also connected to the fluid supply module. When the wafer is cleaned, the fluid supply module controls the fluid pressure to make the fluid flow into the corresponding driving wheel A, the driving wheel B and / or the driven wheel, thereby cleaning the wafer.

[0077] It should be noted that the aforementioned rotating mechanism is applied to the wafer cleaning device of the embodiment of the present application. The specific contents and beneficial effects can be found in the description of the aforementioned rotating mechanism embodiment, which will not be repeated here.

[0078] In the description of this application, the terms "first" and "second" are only used to facilitate the description of different components or names, and cannot be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0079] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0080] It should be noted that although the specific embodiments of the present application are described in detail in conjunction with the accompanying drawings, this should not be construed as limiting the scope of protection of the present application. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of the present application.

[0081] The examples of the embodiments of the present application are intended to concisely illustrate the technical features of the embodiments of the present application so that those skilled in the art can intuitively understand the technical features of the embodiments of the present application, and are not intended to be improper limitations of the embodiments of the present application.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A rotating mechanism for a vertical wafer cleaning device, characterized in that: The rotating mechanism comprises: an outer end cover, an inner end cover, a rotating shaft and an annular pad; The outer end cover and the inner end cover are arranged on the rotating shaft, and the annular gasket is clamped between the outer end cover and the inner end cover; A first flow channel is provided in the rotating shaft, a second flow channel is provided on the side of the outer end cover opposite to the annular gasket, a third flow channel is provided on the side of the inner end cover opposite to the annular gasket, and the first flow channel is communicated with the second flow channel and the third flow channel respectively; The first flow channel is used to transport fluid to the second flow channel and the third flow channel respectively, and the fluid flows through the first side surface and the second side surface of the annular pad through the second flow channel and the third flow channel respectively, and flows out from the side of the annular pad away from the rotating axis, wherein when the wafer is cleaned, the fluid is kept at a slight positive pressure to flush the inside or edge of the rotating mechanism, and the slight positive pressure makes the fluid speed so low that it does not affect the wafer quality; The first flow channel includes a main flow channel and a branch flow channel, the branch flow channel is used to connect the main flow channel with the second flow channel and the main flow channel with the third flow channel, the main flow channel has a diameter range of 3 to 6.5 mm, and the branch flow channel has a diameter range of 1 to 1.5 mm.

2. The rotating mechanism according to claim 1, characterized in that: A first recessed area is provided on the side of the outer end cover opposite to the annular gasket, the first recessed area and the annular gasket form a first buffer chamber, the first buffer chamber is communicated with the second flow channel, and the fluid flowing out of the second flow channel enters the first buffer chamber; A second recessed area is provided on the side of the inner end cover opposite to the annular gasket. The second recessed area and the annular gasket form a second buffer chamber. The second buffer chamber is connected to the third flow channel, and the fluid flowing out of the third flow channel enters the second buffer chamber.

3. The rotating mechanism according to claim 2, characterized in that: The first recessed areas include a plurality of first recessed areas, and the plurality of first recessed areas are evenly distributed along the circumferential direction of the outer end cover; The second recessed areas include a plurality of areas, and the plurality of second recessed areas are evenly distributed along the circumferential direction of the inner end cover.

4. The rotating mechanism according to claim 3, characterized in that: A first annular baffle is provided on the side of the outer end cover corresponding to the annular pad, the axis of the first annular baffle coincides with the axis of the outer end cover, and the radius of the first annular baffle is greater than or equal to the radius of the annular pad; A second annular baffle is provided on the side surface of the inner end cover corresponding to the annular pad, the axis of the second annular baffle coincides with the axis of the inner end cover, and the radius of the second annular baffle is greater than or equal to the radius of the annular pad.

5. The rotating mechanism according to claim 4, characterized in that: The radius of the first annular baffle is greater than the radius of the annular pad, the first recessed area, the first annular baffle and the annular pad constitute the first buffer chamber, and the fluid in the first buffer chamber flows out from the gap between the annular pad and the first annular baffle; and / or, The radius of the second annular baffle is greater than that of the annular pad. The second recessed area, the second annular baffle and the annular pad constitute the second buffer chamber. The fluid in the second buffer chamber flows out from the gap between the annular pad and the second annular baffle.

6. The rotating mechanism according to claim 4, characterized in that: The edge of the outer end cover is provided with a plurality of first notches along the circumferential direction, the first buffer chamber is connected with at least one of the first notches, and the fluid in the first buffer chamber flows out from the connected first notches; The edge of the inner end cover is provided with a plurality of second notches along the circumferential direction, the second buffer chamber is connected with at least one of the second notches, and the fluid in the second buffer chamber flows out from the connected second notches.

7. The rotating mechanism according to any one of claims 1 to 6, characterized in that: The inner end cover is integral with the rotating shaft.

8. A wafer cleaning device, characterized in that: The wafer cleaning device comprises: a fluid supply module and at least one rotating mechanism as claimed in any one of claims 1 to 7; The rotating mechanism is used to drive the wafer to rotate or detect the rotation speed of the wafer; The fluid supply module is used to control the fluid pressure so that the fluid flows into the first flow channel included in the rotating mechanism.

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