A rectangular squaring device for monocrystalline silicon round bars

Abstract

The invention discloses a rectangular squaring device for a monocrystalline silicon round rod, belonging to the field of processing stones or stone-like materials; the device uses a rotatable placement seat as a carrier of the silicon material to be cut, and two wire cutting devices are arranged to cut simultaneously. Four mutually perpendicular surfaces can be cut through one rotation and two cuts, thereby speeding up the production speed.

Description

Technical Field

[0001] The invention relates to the field of processing stones or stone-like materials, and in particular to a device for rectangular squaring of a single crystal silicon round rod. Background Art

[0002] The forming of silicon rods includes the growth of silicon rods, that is, the single crystal silicon is in a molten state in the single crystal furnace, and the molten single crystal silicon is pulled and cooled by a pulling head to form a silicon rod. This process makes the head of the silicon rod conical and the end face of the tail wavy. In the later truncation process of the silicon rod, the head and tail of the silicon rod need to be cut off, and the middle part is retained for squaring. In order to improve the utilization rate of silicon rods, the cut silicon rod head and tail are generally cut manually to cut out a rectangular center material. Figure 1 As shown in the figure, part of the cut silicon rod head is cylindrical and part is conical. When cutting manually, the tip of the silicon rod head must first be placed upward, and four mutually perpendicular faces must be cut from top to bottom. Then, the tip of the silicon rod head must be placed horizontally, and the tip part must be cut off to obtain a rectangular center material. When cutting four mutually perpendicular faces, it is necessary to rotate 90° multiple times, which results in low production efficiency. Summary of the invention

[0003] The object of the present invention is to provide a device for rectangular squaring of a monocrystalline silicon round rod, which is used for re-cutting silicon material cut from a silicon rod.

[0004] The technical solution adopted by the present invention is as follows:

[0005] The present invention provides a rectangular squaring device for a monocrystalline silicon round rod, comprising a base, a rotatable placement seat is provided in the center of the base, the placement seat is used to place the cut silicon material, and can be rotated to a set angle; a wire cutting device is provided on each side of the placement seat, and the cutting wire of the wire cutting device can cut the cut silicon material placed on the placement seat from top to bottom.

[0006] In a possible design, the base is a T-shaped box as a whole, and the internal space of the base is divided into a first chamber in the middle and second chambers on both sides by two oppositely arranged first partitions; a first movable seat is set in the first chamber, and a rotatable placement seat is installed on the first movable seat; the first movable seat is driven to move by a first driving device.

[0007] In a possible design, the placement seat includes a transmission base, a first rotating seat, a placement plate, and a second drive motor; the transmission base is installed on the first movable seat, a rotatable first rotating seat is installed in the center of the transmission base, a gear ring is provided on the outer side of the first rotating seat, and the gear ring is engaged with a gear set in the transmission base; the gear in the transmission base is connected to the second drive motor, and the second drive motor drives the first rotating seat to rotate a set angle; a placement plate is installed on the upper surface of the first rotating seat.

[0008] In a possible design, a first vacuum suction cup is arranged in the center of the placement plate.

[0009] In a possible design, four positioning posts are arranged at the edge of the placement plate, and the four positioning posts are distributed in an array with the center of the placement plate as the center. The centers of the four positioning posts can clamp the cut silicon material on the placement plate.

[0010] In a possible design, a first frame is arranged behind the placement seat on the first movable seat, and a pressing mechanism is arranged on the top of the first frame, the pressing mechanism includes a pressing telescopic drive and a pressing head; the bottom end of the piston rod of the pressing telescopic drive is connected to the pressing head; the pressing mechanism is used to fix the cut silicon material from the top.

[0011] In a possible design, two second frames are symmetrically arranged on the rear side of the base and on both sides of the first chamber, and a first moving mechanism is arranged on each of the two second frames. A wire cutting device is installed on the first moving mechanism, and the first moving mechanism is used to drive the wire cutting device to move along the x-axis direction.

[0012] In one possible design, the wire cutting device includes a third frame, a lifting drive mechanism, a wire wheel frame, a wire wheel group, a cutting wire, and a cutting drive motor; the third frame is vertically installed on the first moving mechanism, and the lifting drive mechanism is installed on the third frame facing the placement seat side, the back of the wire wheel frame is connected to the lifting drive mechanism, and the wire wheel frame is driven up and down by the lifting drive mechanism; a wire wheel group is provided on the front of the wire wheel frame, and the cutting wire is wrapped around the wire wheel group, and the wire wheel group is connected to the cutting drive motor, and the cutting drive motor drives the wire wheel group to rotate, so that the cutting wire runs along a circular trajectory.

[0013] In a possible design, the wire wheel group includes four wire wheels distributed in a quadrilateral, namely a driving wire wheel, an adjusting wire wheel, a first cutting wire wheel, and a second cutting wire wheel; the four wire wheels are arranged at the four corners of the front side of the wire wheel frame; wherein a cutting space is formed between the lower two wire wheels; and the back side of the driving wire wheel is connected to the cutting drive motor.

[0014] In a possible design, it also includes a material skin collecting device, which includes a fourth frame, a material skin rotating support seat is provided on the fourth frame, a telescopic material picking frame is provided on the material skin rotating support seat, a material picking telescopic rod is provided on the telescopic material picking frame, and a second vacuum suction cup is provided at the piston rod end of the telescopic material picking rod.

[0015] The beneficial effects of the present invention are as follows: the present invention provides a rectangular squaring device for a monocrystalline silicon round bar, which uses a rotatable placement seat as a carrier of the cut silicon material, and simultaneously sets two wire cutting devices for simultaneous cutting, and can cut four mutually perpendicular surfaces through one rotation and two cuttings, thereby speeding up the production speed. In addition, the device can be equipped with a material skin collection device to automatically recycle the cut material skin. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure shows the structure of four mutually perpendicular faces cut from the head of the silicon rod.

[0017] Figure 2 The three-dimensional structure of the device for opening the prescription in this application is shown. Figure 1 .

[0018] Figure 3 Shown is a detailed structural diagram of the base in an embodiment of the present application.

[0019] Figure 4 The figure shows a structure showing a synchronous belt transmission mechanism used as the first driving device in the present application.

[0020] Figure 5 Shown is a structural display diagram of the placement seat from the first perspective in an embodiment of the present application.

[0021] Figure 6 Shown is a structural display diagram of the placement seat from a second viewing angle in the embodiment of the present application.

[0022] Figure 7 Shown is a structural display diagram from a first perspective in which the placement seat is installed on the first movable seat.

[0023] Figure 8 Shown is a structural display diagram from a second perspective in which the placement seat is installed on the first movable seat.

[0024] Fig. 9 The structure of the top pressure head of this application is shown as follows Figure 1 .

[0025] Fig.10 The structure of the top pressure head of this application is shown as follows Figure 2 .

[0026] Fig.11 Shown is a structural display diagram of the left side wire cutting device of the present application.

[0027] Fig.12 Shown is a structural diagram of the improved cooling device of the present application.

[0028] Fig.13 Shown is a structural display diagram of the shell cover of the present application.

[0029] Fig.14 Shown is a diagram showing the layout of the material skin collection device of the present application.

[0030] Fig.15 Shown is a structural display diagram of the material skin collection device of the present application.

[0031] Fig.16 Shown is a detailed structural display diagram of the material skin collection device of the present application.

[0032] Fig.17 Shown is a structural display diagram of the movable door panel of the present application.

[0033] Fig.18 Shown is a layout diagram of the coolant supply equipment of the present application.

[0034] Description of reference numerals: silicon rod head 1, base 2, first partition 2.1, first chamber 2.2, second chamber 2.3, first guide rail 2.4, first movable seat 2.5, mounting through hole 2.51, water-blocking folding cover 2.6; placement seat 3, transmission base 3.1, first rotating seat 3.2, gear ring 3.21, placement plate 3.3, vertical section 3.31, cutting groove 3.32, hidden hole 3.33, second drive motor 3.4, first vacuum suction cup 3.5, positioning column 3.6, first telescopic cylinder 3.7; wire cutting device 4, First driving device 5, first driving wheel 5.1, first driven wheel 5.2, first synchronous belt 5.3, first driving motor 5.4, belt clamp 5.5; first frame 6, top pressure telescopic drive 7, top pressure head 8, first upper support plate 8.1, first connecting pipe 8.2, lower support ring 8.3, water spray pipe 8.4; second frame 9, first moving mechanism 10, second guide rail 10.1, second lead screw 10.2, third driving motor 10.3, moving support seat 10.4; third frame 11, wire wheel frame 12, wire wheel group 13, driving wire Wheel 13.1, adjusting wire wheel 13.2, first cutting wire wheel 13.3, second cutting wire wheel 13.4; cutting wire 14, cutting drive motor 15, third guide rail 16, third lead screw 17, fourth drive motor 18, cutting space 19, wire wheel support plate 20, fourth guide rail 21, wire wheel support seat 22, first drive telescopic cylinder 23, spray pipe 24, mobile pipe rack 24.1, fifth guide rail 25, second drive telescopic cylinder 26, shell cover 27, material taking port 27.1, fourth frame 28, material skin rotating support seat 29, overhead plate 2 9.1, second rotating seat 29.2, rotating drive motor 29.3, first articulated frame 29.4; telescopic material picking frame 30, first rotating arm assembly 30.1, first telescopic rod support seat 30.2, second telescopic rod support seat 30.3, spring 30.4, swing drive motor 30.5; material picking telescopic rod 31, second vacuum suction cup 32, waste box 33, piston rod support frame 34, limit groove 34.1, movable door panel 35, door panel notch 35.1, door panel telescopic rod 36, liquid storage tank 37, filter tank 38, infusion pump 39. DETAILED DESCRIPTION

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] See also Figure 1 The figure shows the structure of the silicon rod head 1 cut into four mutually perpendicular surfaces. The left side of the figure shows the cut silicon rod head 1. Part of the silicon rod head 1 is cylindrical and part is conical. When cutting manually, first place the tip of the silicon rod head 1 upwards and cut four mutually perpendicular surfaces from top to bottom ( Figure 1 The right side of the middle shows the structure after cutting). Then, the tip of the silicon rod head 1 is placed horizontally, and the tip part is cut off to obtain a rectangular center material. When cutting four mutually perpendicular surfaces, it is necessary to rotate 90° multiple times, which has low production efficiency.

[0040] In order to solve the above technical problems, the present application provides a device for cutting a single crystal silicon rod into a rectangular square, which is used to cut a silicon rod head 1 into four mutually perpendicular surfaces. Figure 2 The three-dimensional structure of the device for opening the prescription in this application is shown. Figure 1The square cutting device includes a base 2, a rotatable placement seat 3 is provided in the center of the base 2, and the placement seat 3 is used to place the cut silicon material and can be rotated to a set angle, such as 90 degrees. A wire cutting device 4 is provided on each side of the placement seat 3, and the cutting wire 14 of the wire cutting device 4 can cut the cut silicon material placed on the placement seat 3 from top to bottom.

[0041] Taking the cutting of the silicon rod head 1 as an example, the working principle of the squaring equipment is as follows: the silicon rod head 1 is placed on the placement seat 3 with the tip facing upwards, and the wire cutting devices 4 on both sides perform the first cutting from top to bottom to cut out two parallel planes; then the placement seat 3 drives the silicon rod head 1 to rotate 90°; the wire cutting devices 4 on both sides perform the second cutting from top to bottom. The above process is performed to cut out four mutually perpendicular planes. After that, the cut material is removed and the tip is cut off to obtain a rectangular center material. Of course, the equipment of the present application can also be used to cut the tail of the silicon rod.

[0042] In a possible embodiment, the base 2 in the present application is designed as follows: Figure 3 The figure shows the detailed structure of the base 2 in the embodiment of the present application. The base 2 is a T-shaped box as a whole. The internal space of the base 2 is divided into a first chamber 2.2 in the middle and second chambers 2.3 on both sides by two first partitions 2.1 arranged opposite to each other. A first guide rail 2.4 is arranged on the upper edge of each of the two first partitions 2.1, and the two first guide rails 2.4 are parallel to each other. A first moving seat 2.5 is movably installed on the two first guide rails 2.4, and a rotatable placement seat 3 is installed on the first moving seat 2.5; the first moving seat 2.5 is driven to move by a first driving device 5.

[0043] The first drive device 5 can be any one of a screw drive mechanism, a synchronous belt drive mechanism, or a chain drive mechanism. Figure 4The structure diagram of the synchronous belt transmission mechanism used as the first driving device 5 in this application is shown. The bottom surface of the placement seat 3 is connected to the two first guide rails 2.4 on both sides through sliders. The synchronous belt transmission mechanism is installed in the first chamber 2.2; specifically, the synchronous belt transmission mechanism includes a first driving wheel 5.1, a first driven wheel 5.2, a first synchronous belt 5.3, and a first driving motor 5.4; the first driving wheel 5.1 and the first driven wheel 5.2 are arranged on the support seats on both sides of the first chamber 2.2, and the first synchronous belt 5.3 is annular and sleeved on the first driving wheel 5.1 and the first driven wheel 5.2; the first driving motor 5.4 is arranged below the first driving wheel 5.1, and the driving shaft of the first driving motor 5.4 is connected to the first driving wheel 5.1. The bottom surface of the placement seat 3 is connected to the first synchronous belt 5.3 through a belt clamp 5.5, and the placement seat 3 is pulled by the first synchronous belt 5.3 to move. The synchronous belt transmission mechanism shown in the figure can be replaced by a screw transmission mechanism or a chain transmission mechanism or a telescopic rod, etc. This application does not limit this. In this embodiment, the placement seat 3 can be moved forward from between the two wire cutting devices 4 to facilitate the placement of silicon materials. The second chambers 2.3 on both sides of the placement seat 3 of the present application are used to collect the cooling liquid sprayed during cutting.

[0044] In a possible embodiment, the rotatable placement seat 3 in the present application is designed as follows. Figure 5 The figure is a structural display diagram of the placement seat 3 from the first perspective in the embodiment of the present application. Figure 6 The figure shows the structure of the placement seat 3 from the second viewing angle in the embodiment of the present application. Figure 7 The figure shows a structure showing the placement seat 3 installed on the first moving seat 2.5 from a first perspective. Figure 8 The figure shows a structural display diagram from a second perspective in which the placement seat 3 is installed on the first movable seat 2.5.

[0045] The placement seat 3 includes a transmission base 3.1, a first rotating seat 3.2, a placement plate 3.3, and a second driving motor 3.4; Figure 5 , Figure 6 As shown in the figure, a rotatable first rotating seat 3.2 is installed in the center of the transmission base 3.1, and a gear ring 3.21 is provided on the outer side of the first rotating seat 3.2, and the gear ring 3.21 is meshed with the gear set in the transmission base 3.1; the gear in the transmission base 3.1 is connected to the second drive motor 3.4, and the second drive motor 3.4 drives the first rotating seat 3.2 to rotate a set angle. A placement plate 3.3 is installed on the upper surface of the first rotating seat 3.2. The placement plate 3.3 shown in the figure is a structure formed by symmetrically cutting off part of the arc of a circular plate, and the cut-off part forms two parallel vertical sections 3.31; two cutting grooves 3.32 perpendicular to the vertical sections 3.31 are formed on the upper surface of the placement plate 3.3, and the cutting grooves 3.32 are symmetrically distributed on both sides of the center of the placement plate 3.3.

[0046] like Figure 8As shown in , the first movable seat 2.5 is provided with a rectangular mounting through hole 2.51. Figure 7 As shown in FIG. 1 , the transmission base 3.1 is mounted at the mounting through hole 2.51 on the upper surface of the first moving base 2.5; the second driving motor 3.4 passes through the mounting through hole 2.51 and is located inside the first moving base 2.5.

[0047] like Figure 5 As shown in , in a possible embodiment, a first vacuum suction cup 3.5 may be further provided in the center of the placement plate 3.3, and the first vacuum suction cup 3.5 is used to absorb the bottom surface of the cut silicon material on the placement plate 3.3.

[0048] like Figure 5 As shown in FIG. 1 , in a possible embodiment, four positioning posts 3.6 are arranged on the edge of the placement plate 3.3. The four positioning posts 3.6 are arranged in an array with the center of the placement plate 3.3 as the center. The centers of the four positioning posts 3.6 can clamp the cut silicon material on the placement plate 3.3. The top of the positioning posts 3.6 is preferably designed to be conical, and the four positioning posts 3.6 can be retracted into the hidden holes 3.33 on the placement plate 3.3, as shown in FIG. Figure 6 As shown in , a first telescopic cylinder 3.7 is arranged in the hidden hole 3.33, and the top of the piston rod of the first telescopic cylinder 3.7 is connected to the positioning column 3.6.

[0049] like Figure 2 As shown in , in a possible embodiment, a foldable and unfoldable water-retaining folding cover 2.6 may be further provided on the front side of the first movable seat 2.5, and the water-retaining folding cover 2.6 is used to cover the first chamber 2.2 to prevent the coolant from entering the first chamber 2.2 during cutting.

[0050] like Figure 3 As shown in, in a possible embodiment, a first frame 6 can also be arranged behind the placement seat 3 on the first movable seat 2.5, and a top pressing mechanism is provided on the top of the first frame 6, which is used to fix the cut silicon material on the placement plate 3.3 from the top.

[0051] In a possible embodiment, the pressing mechanism includes a pressing telescopic drive 7 and a pressing head 8; the pressing telescopic drive 7 can be an electric telescopic cylinder or a pneumatic telescopic cylinder; the bottom end of the piston rod of the pressing telescopic drive 7 is connected to the pressing head 8. Fig. 9 The structure of the top pressure head 8 of the present application is shown as follows Figure 1 The top pressure head 8 shown in the figure includes a first upper support plate 8.1, a first connecting tube 8.2, and a lower supporting ring 8.3; the first upper support plate 8.1 is connected to the bottom end of the piston rod of the top pressure telescopic drive 7; a circular lower supporting ring 8.3 is arranged directly below the first upper support plate 8.1, and the first upper support plate 8.1 and the lower supporting ring 8.3 are connected by four first connecting tubes 8.2; the number of first connecting tubes 8.2 is not limited in this application, and this embodiment is only for illustration. Fig. 9 As shown in FIG. 8 , the lower supporting ring 8 . 3 is sleeved on the tip of the silicon rod head 1 .

[0052] In a possible embodiment, a coolant rinsing structure may also be provided on the top pressure head 8 . Fig.10 The structure of the top pressure head 8 of the present application is shown as follows Figure 2 A circular water spray pipe 8.4 is arranged outside the lower supporting ring 8.3, and a plurality of water outlets are arranged inwardly of the water spray pipe 8.4; the water spray pipe 8.4 can spray the tip of the silicon rod head 1 with cooling liquid. The water spray pipe 8.4 is connected to the cooling liquid supply device through a pipeline.

[0053] In a possible embodiment, the two wire cutting devices 4 can be configured to have a structure capable of adjusting the distance between them and the placement seat 3, so that the cutting position of the silicon material to be cut can be set.

[0054] For ease of understanding, this application Figure 3 A rectangular coordinate system is established in which the y-axis direction is the same as the moving direction of the placement seat 3, the x-axis direction is perpendicular to the y-axis direction in the horizontal plane, and the z-axis is perpendicular to the plane where the x-axis and the y-axis are located. The orientation descriptions in other views shall be based on the orientation defined by the coordinate system.

[0055] like Figure 3 As shown, two second frames 9 are symmetrically arranged on the rear side of the base 2 and on both sides of the first chamber 2.2, and a first moving mechanism 10 for driving the wire cutting device 4 to move along the x-axis direction is arranged on each of the two second frames 9. The first moving mechanism 10 adopts a screw transmission mechanism; each first moving mechanism 10 includes two second guide rails 10.1, a second lead screw 10.2, a third drive motor 10.3, and a moving support seat 10.4; the two second guide rails 10.1 are arranged to extend in the x-axis direction, and the second lead screw 10.2 is installed in parallel in the middle of the two second guide rails 10.1, and the two ends of the second lead screw 10.2 are supported by bearing seats, and the outer end of the second lead screw 10.2 is connected to the third drive motor 10.3; the two sides of the bottom surface of the moving support seat 10.4 are connected to the two second guide rails 10.1 through sliders, and are connected to the second lead screw 10.2 through a nut connecting seat. The wire cutting device 4 is installed on the moving support seat 10.4.

[0056] In a possible embodiment, the structure of the wire cutting device 4 of the present application is as follows.

[0057] like Fig.11 What is shown is a structural display diagram of the wire cutting device 4 on the left side of the present application. The two wire cutting devices 4 are symmetrically arranged, and each wire cutting device 4 includes a third frame 11, a lifting drive mechanism, a wire wheel frame 12, a wire wheel group 13, a cutting wire 14, and a cutting drive motor 15.

[0058] The third frame 11 is vertically mounted on the mobile support seat 10.4. A vertical slot is provided on the side of the third frame 11 facing the placement seat 3. A lifting drive mechanism is installed in the slot. In a possible embodiment, the lifting drive mechanism adopts a screw transmission mechanism, including two third guide rails 16, a third screw 17, and a fourth drive motor 18; the two third guide rails 16 and the third screw 17 are vertically arranged in parallel; wherein the third screw 17 is installed in the middle and is located in the slot of the third frame 11; the top of the third screw 17 is connected to the fourth drive motor 18. The back of the wire wheel frame 12 is connected to the two third guide rails 16 through a slider, and is connected to the third screw 17 through a nut connection seat. The wire wheel frame 12 is driven by the lifting drive mechanism to move up and down.

[0059] like Fig.11 As shown in , the left side of the wire wheel frame 12 extends beyond the third frame 11, and a wire wheel group 13 is provided on the front of the wire wheel frame 12. The cutting wire 14 is surrounded by the wire wheel group 13, and the wire wheel group 13 is connected to the cutting drive motor 15. The cutting drive motor 15 drives the wire wheel group 13 to rotate, so that the cutting wire 14 runs along a circular trajectory, thereby cutting the silicon rod head 1. In a possible embodiment, the wire wheel group 13 includes four wire wheels distributed in a quadrilateral, which are named as the driving wire wheel 13.1, the adjusting wire wheel 13.2, the first cutting wire wheel 13.3, and the second cutting wire wheel 13.4 for the convenience of description. Fig.11 As shown in the figure, the driving wire wheel 13.1 is arranged at the upper right corner, the adjusting wire wheel 13.2 is arranged at the upper left corner, the first cutting wire wheel 13.3 is arranged at the lower left corner, and the second cutting wire wheel 13.4 is arranged at the lower right corner; the four wire wheels are arranged at the four corners of the front of the wire wheel frame 12; wherein, a cutting space 19 is formed between the two lower wire wheels. Specifically, two parallel wire wheel support plates 20 are arranged on the front of the wire wheel frame 12, and a cutting space 19 is formed between the two wire wheel support plates 20, and the width of the cutting space 19 is greater than the maximum diameter of the silicon rod head 1; the first cutting wire wheel 13.3 and the second cutting wire wheel 13.4 are installed at the bottom of the two wire wheel support plates 20. The back of the driving wire wheel 13.1 in the upper right corner is connected to the cutting drive motor 15, and the wire wheel drives the cutting wire 14 to run.

[0060] also, Fig.11The adjusting wire wheel 13.2 at the upper left corner is installed on the second moving mechanism, and the adjusting wire wheel 13.2 at the upper left corner is driven to move by the second moving mechanism, thereby adjusting the tension of the cutting line 14. In a possible embodiment, the second moving mechanism includes two fourth guide rails 21, a wire wheel support seat 22, and a first driving telescopic cylinder 23; the two fourth guide rails 21 are arranged in parallel, and the wire wheel support seat 22 is connected thereto through a slider; the adjusting wire wheel 13.2 at the upper left corner is installed on the wire wheel support seat 22; the first driving telescopic cylinder 23 is installed between the two fourth guide rails 21, and the piston rod end of the first driving telescopic cylinder 23 is connected to the back of the wire wheel support seat 22. The first driving telescopic cylinder 23 drives the adjusting wire wheel 13.2 at the upper left corner to push the cutting line 14 outward, thereby making the cutting line 14 tight.

[0061] In a possible embodiment, the wire reel frame 12 may be further provided with a spray pipe 24, and a spray hole is provided on the spray pipe 24, and the spray pipe 24 is used to spray the cooling liquid to the silicon rod head 1 on the placement seat 3. Fig.11 As shown in a specific embodiment, a spray pipe 24 is horizontally arranged above the first cutting wire wheel 13.3 and the second cutting wire wheel 13.4, and the back of the spray pipe 24 is connected to the coolant supply device through a pipeline.

[0062] Fig.11 In the embodiment, the spray pipe 24 is fixed in position. When cutting starts, the spray pipe 24 is far away from the silicon rod head 1; the spray pipe 24 gradually approaches the silicon rod head 1 as cutting proceeds downward. Such a structural design makes the cooling effect slightly poor at the beginning of cutting. To this end, in a possible embodiment, an improved cooling device is provided. Fig.12 The figure shows the structure of the improved cooling device of the present application. The spray pipe 24 is arranged on the third moving mechanism, and the third moving mechanism drives the spray pipe 24 to move up and down, so that the spray pipe 24 can maintain a relatively close distance with the silicon rod head 1. The third moving mechanism includes a mobile pipe rack 24.1, two fifth guide rails 25, and a second driving telescopic cylinder 26; the two fifth guide rails 25 are arranged on the front of the two wire wheel support plates 20, and the mobile pipe rack 24.1 is connected to the two fifth guide rails 25 through a slider; the front of the mobile pipe rack 24.1 is connected to the spray pipe 24, and the back of the mobile pipe rack 24.1 is connected to the piston rod of the second driving telescopic cylinder 26; the second driving telescopic cylinder 26 is installed on the crossbeam at the top of the two wire wheel support plates 20.

[0063] In a possible embodiment, a housing 27 is installed on the base 2, and the above-mentioned wire cutting device 4 and other structures are arranged inside the housing 27. Fig.13 The structure of the shell cover 27 of the present application is shown in FIG. 2 . An opening is provided on the front side of the shell cover 27 for taking in and placing materials.

[0064] In a possible embodiment, the prescription device of the present application may also be provided with a material skin collection device, such as Fig.14The figure shows the arrangement position of the material skin collecting device of the present application, and a material skin collecting device is arranged on each side of the shell cover 27. The material skin collecting device is used to collect the cut material skin and place it in the waste box 33.

[0065] like Fig.15 The structure of the material skin collecting device of the present application is shown in the figure. The material skin collecting device includes a fourth frame 28 arranged outside the box body, a material skin rotating support seat 29 is arranged on the fourth frame 28, a telescopic material picking frame 30 is arranged on the material skin rotating support seat 29, a material picking telescopic rod 31 is arranged on the telescopic material picking frame 30, and a second vacuum suction cup 32 is arranged at the end of the piston rod of the material picking telescopic rod 31. The piston rod of the material picking telescopic rod 31 can pass through the material picking port 27.1 on the shell cover 27, and the second vacuum suction cup 32 arranged at its end is used to absorb the cut material skin; after the material skin is completely cut, the material picking telescopic rod 31 grabs the material skin and moves it out from the material picking port 27.1.

[0066] like Fig.14 As shown in , in a possible embodiment, a waste box 33 is placed on the front side of the material skin collecting device, and the top of the waste box 33 is open; the rotating support seat in the material skin collecting device rotates so that the material skin adsorbed by the end of the material taking telescopic rod 31 is located at the top opening of the waste box 33, and then the material skin is released and falls into the waste box 33.

[0067] like Fig.16 The figure shows the detailed structure of the material skin collection device of the present application. In a possible embodiment, the material skin rotating support seat 29 includes an overhead plate 29.1 in the shape of a Chinese character "J". A second rotating seat 29.2 is arranged in the center of the overhead plate 29.1. The second rotating seat 29.2 is driven to rotate by a rotating drive motor 29.3. Two first articulated frames 29.4 are symmetrically arranged on the upper surface of the second rotating seat 29.2. A first rotating arm assembly 30.1 is arranged between the two first articulated frames 29.4. The first rotating arm assembly 30.1 is composed of two rotating arms arranged opposite to each other. One end of the first rotating arm assembly 30.1 is hinged between the two first articulated frames 29.4, and the other end is rotatably connected to the first telescopic rod support seat 30.2. The cylinder barrel of the material-collecting telescopic rod 31 is fixed on the first telescopic rod support seat 30.2. The second telescopic rod support seat 30.3 is installed on the rear side of the cylinder barrel of the material-collecting telescopic rod 31; the bottom of the second telescopic rod support seat 30.3 is connected to the second rotating seat 29.2 through two symmetrically arranged springs 30.4. In addition, a swing drive motor 30.5 is arranged outside the first articulated frame 29.4, and a drive shaft of the swing drive motor 30.5 is connected to the first rotating arm assembly 30.1. The swing drive motor 30.5 can control the angle of the material taking telescopic rod 31.

[0068] like Fig.16As shown in FIG. 1 , in a possible embodiment, a piston rod support frame 34 is further provided at the front side of the material skin rotation support seat 29, and a limit groove 34.1 is provided at the side of the piston rod support frame 34. The piston rod of the material taking telescopic rod 31 can be horizontally stuck in the limit groove 34.1; at this time, the piston rod of the material taking telescopic rod 31 is aligned with the cut silicon material on the placement seat 3.

[0069] In order to prevent the coolant from splashing out from the material taking port 27.1 during cutting, in a possible embodiment, a movable door plate 35 that can be raised and lowered is provided inside the housing 27 and above the material taking port 27.1. Fig.17 The movable door panel 35 is shown in the structural diagram of the present application. The movable door panel 35 is installed on two vertically arranged guide rails. The movable door panel 35 is driven to move up and down by two door panel telescopic rods 36. The movable door panel 35 is also provided with a

[0070] The door panel notch 35.1 through which the piston rod of the material taking telescopic rod 31 passes.

[0071] In a possible embodiment, the prescription device further includes a cooling liquid supply device. Fig.18 The figure shows the layout of the coolant supply device of the present application. The coolant supply device is arranged behind the base 2. The coolant supply device includes a liquid storage tank 37, a filter tank 38, and an infusion pump 39. The liquid storage tank 37 stores coolant, and the liquid outlet of the liquid storage tank 37 is connected to the filter tank 38 and the infusion pump 39 in sequence through a pipeline, and the infusion pump 39 is connected to the watering pipe 8.4 and the spray pipe 24 through a pipeline.

[0072] See also Fig.14 Understand, taking cutting the silicon rod head as an example, the general workflow of the prescription equipment of this application is as follows:

[0073] The first cutting process is as follows: the squared silicon rod head is placed on the placement seat 3, the first vacuum suction cup 3.5 and the positioning column 3.6 on the placement seat 3 fix the bottom of the silicon rod head, and the top pressing mechanism fixes the tip of the silicon rod head from the top; then the placement seat 3 moves to the cutting station between the two wire cutting devices 4; the two wire cutting devices 4 move toward the middle so that the cutting line 14 is located at the cutting position set by the program; the second vacuum suction cup 32 of the material taking telescopic rod 31 in the material skin collection device enters the shell cover 27 and adsorbs on the surface of the material skin to be cut; the cutting line 14 moves downward to cut the silicon rod head while circulating, and sprays coolant on the cutting part during the cutting process. During cutting, the movable door plate 35 is closed to prevent the coolant from splashing outward. The cutting line 14 cuts to the bottom of the silicon rod head, and then the cutting line 14 moves upward to exit the cutting gap and hangs above the silicon rod head, waiting for the second cutting. Stop spraying coolant after cutting.

[0074] First time of taking out the material skin: the positioning column 3.6 on the placement seat 3 is retracted into the placement plate 3.3, and the movable door plate 35 is opened upward; the material taking telescopic rod 31 takes out the two cut material skins from the material taking openings 27.1 on both sides, and then rotates and puts them into the waste box 33.

[0075] The second cutting process is as follows: the pressing mechanism moves upward to release the tip of the silicon rod head; the placement seat 3 rotates 90°. The pressing mechanism moves downward to fix the tip of the silicon rod head again; the second vacuum suction cup 32 of the material taking telescopic rod 31 in the material skin collection device enters the shell cover 27 and adsorbs on the surface of the other two material skins to be cut; the movable door plate 35 is closed; the two wire cutting devices 4 can move closer or farther, so as to adjust the cutting position again; the two cutting positions in this application can be the same or different. After that, the two wire cutting devices 4 perform secondary cutting.

[0076] After the secondary cutting is completed, the second material skin is removed, and then the cut material moves forward to the front shell opening to replace new silicon material.

[0077] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. A device for square-cutting a single crystal silicon round bar, characterized in that: The invention comprises a base (2), wherein a rotatable placement seat (3) is provided in the center of the base (2), the placement seat (3) is used to place the silicon material to be cut and can be rotated to a set angle; a wire cutting device (4) is provided on each side of the placement seat (3), and a cutting wire (14) of the wire cutting device (4) can cut the silicon material to be cut placed on the placement seat (3) from top to bottom; the base (2) is a T-shaped box as a whole, and the internal space of the base (2) is divided into a first chamber (2.2) in the middle and second chambers (2.3) on both sides by two first partitions (2.1) arranged opposite to each other; the first chamber (2.2) is provided with a first movable seat (2.5), and the rotatable placement seat (3) is installed on the first movable seat (2.5); the first movable seat ( 2.5) is driven to move by a first driving device (5); a first frame (6) is arranged behind the placement seat (3) on the first movable seat (2.5); a top pressing mechanism is arranged on the top of the first frame (6), and the top pressing mechanism comprises a top pressing telescopic drive (7) and a top pressing head (8); the bottom end of the piston rod of the top pressing telescopic drive (7) is connected to the top pressing head (8); the top pressing head (8) comprises a first upper support plate (8.1), a first connecting pipe (8.2), and a lower supporting ring (8.3); the first upper support plate (8.1) is connected to the bottom end of the piston rod of the top pressing telescopic drive (7); a circular lower supporting ring (8.3) is arranged directly below the first upper support plate (8.1), and a space between the first upper support plate (8.1) and the lower supporting ring (8.3) is provided. The lower support ring (8.3) is connected via a first connecting pipe (8.2); the lower support ring (8.3) can be sleeved on the tip of the silicon rod head (1); a circular water spray pipe (8.4) is provided on the outer side of the lower support ring (8.3), and the water spray pipe (8.4) is provided with a water outlet facing inward; the water spray pipe (8.4) is connected to the coolant supply device via a pipeline; and also includes a skin collection device, the skin collection device includes a fourth frame (28), a skin rotating support seat (29) is provided on the fourth frame (28), a telescopic material collection frame (30) is provided on the skin rotating support seat (29), a material collection telescopic rod (31) is provided on the telescopic material collection frame (30), and a second vacuum suction cup (32) is provided at the piston rod end of the material collection telescopic rod (31); the skin rotating support seat (29) includes An overhead plate (29.1) is in the shape of a Chinese character "J". A second rotating seat (29.2) is arranged in the center of the overhead plate (29.1). The second rotating seat (29.2) is driven to rotate by a rotating drive motor (29.3). Two first articulated frames (29.4) are symmetrically arranged on the upper surface of the second rotating seat (29.2). A first rotating arm assembly (30.1) is arranged between the two first articulated frames (29.4). The first rotating arm assembly (30.1) is composed of two rotating arms arranged opposite to each other. One end of the first rotating arm assembly (30.1) is hinged between the two first articulated frames (29.4), and the other end is rotatably connected to the first telescopic rod support seat (30.2). The cylinder of the material taking telescopic rod (31) is fixed to the first telescopic rod support seat (30.2); a second telescopic rod support seat (30.3) is installed on the rear side of the cylinder of the material-retrieving telescopic rod (31); the bottom of the second telescopic rod support seat (30.3) is connected to the second rotating seat (29.2) through two symmetrically arranged springs (30.4); a swing drive motor (30.5) is arranged on the outside of the first articulated frame (29.4), the drive shaft of the swing drive motor (30.5) is connected to the first rotating arm assembly (30.1), and the swing drive motor (30.5) is used to control the angle of the material-retrieving telescopic rod (31). .

2. The single crystal silicon round bar rectangular squaring equipment according to claim 1, characterized in that: The placement seat (3) comprises a transmission base (3.1), a first rotating seat (3.2), a placement plate (3.3), and a second drive motor (3.4); the transmission base (3.1) is mounted on the first moving seat (2.5); a rotatable first rotating seat (3.2) is mounted in the center of the transmission base (3.1); a gear ring (3.21) is disposed on the outer side of the first rotating seat (3.2); the gear ring (3.21) meshes with a gear disposed in the transmission base (3.1); the gear in the transmission base (3.1) is connected to the second drive motor (3.4), and the second drive motor (3.4) drives the first rotating seat (3.2) to rotate to a set angle; and the placement plate (3.3) is mounted on the upper surface of the first rotating seat (3.2).

3. The rectangular squaring equipment for single crystal silicon round bars according to claim 2, characterized in that: A first vacuum suction cup (3.5) is arranged in the center of the placement plate (3.3).

4. The rectangular squaring equipment for single crystal silicon round bars according to claim 2, characterized in that: Four positioning columns (3.6) are arranged on the edge of the placement plate (3.3), and the four positioning columns (3.6) are distributed in an array with the center of the placement plate (3.3) as the center. The centers of the four positioning columns (3.6) can clamp the cut silicon material on the placement plate (3.3).

5. The rectangular squaring equipment for single crystal silicon round bars according to claim 1, characterized in that: Two second frames (9) are symmetrically arranged on the rear side of the base (2) and on both sides of the first chamber (2.2), and a first moving mechanism (10) is arranged on each of the two second frames (9). A wire cutting device (4) is installed on the first moving mechanism (10), and the first moving mechanism (10) is used to drive the wire cutting device (4) to move along the x-axis direction.

6. The rectangular squaring equipment for single crystal silicon round bars according to claim 5, characterized in that: The wire cutting device (4) comprises a third frame (11), a lifting drive mechanism, a wire wheel frame (12), a wire wheel group (13), a cutting wire (14), and a cutting drive motor (15); the third frame (11) is vertically mounted on the first moving mechanism (10); the lifting drive mechanism is mounted on the side of the third frame (11) facing the placement seat (3); the back of the wire wheel frame (12) is connected to the lifting drive mechanism; the wire wheel frame (12) is driven by the lifting drive mechanism to move up and down; the front of the wire wheel frame (12) is provided with a wire wheel group (13); the wire wheel group (13) surrounds the cutting wire (14); the wire wheel group (13) is connected to the cutting drive motor (15); the cutting drive motor (15) drives the wire wheel group (13) to rotate, so that the cutting wire (14) runs along a circular track.

7. The rectangular squaring equipment for single crystal silicon round bars according to claim 6, characterized in that: The wire wheel assembly (13) comprises four wire wheels distributed in a quadrilateral, namely a driving wire wheel (13.1), an adjusting wire wheel (13.2), a first cutting wire wheel (13.3), and a second cutting wire wheel (13.4); the four wire wheels are arranged at four corners on the front side of the wire wheel frame (12); a cutting space (19) is formed between the lower two wire wheels; and the back side of the driving wire wheel (13.1) is connected to a cutting drive motor (15).

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