Display panel, method for manufacturing display panel, and electronic device

Abstract

A display panel, a method for preparing a display panel, and an electronic device provided in an embodiment of the present application relate to the field of display technology. The display panel includes a first display area and a second display area at least partially surrounding the first display area. The display panel includes an array substrate, an isolation structure, and a first encapsulation layer. At least part of the isolation structure encloses a first opening, the first encapsulation layer at least partially fills the first opening, and contacts with a side of at least part of the isolation structure close to the first opening. The first encapsulation layer includes a first embedded structure, and the first embedded structure is located in the first opening and contacts with the isolation structure. The present application increases the adhesion between the first encapsulation layer and the isolation structure by setting the first encapsulation layer filling the first opening to form a first embedded structure between the side of the isolation structure away from the isolation opening, thereby increasing the stability of the first encapsulation layer, and further improving the quality of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display panels.

[0003] However, there are still some problems with display panels that need to be solved urgently. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes:

[0005] An array substrate;

[0006] An isolation structure located at one side of the array substrate, at least a portion of the isolation structure encloses a first opening;

[0007] A first encapsulation layer at least partially fills the first opening and contacts at least part of the isolation structure on one side close to the first opening. The first encapsulation layer includes a first embedded structure located in the first opening and contacts the isolation structure.

[0008] In some possible implementations, the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence in a direction away from the array substrate, and the first embedded structure is in contact with side surfaces of the first isolation portion and the second isolation portion;

[0009] Preferably, the first embedded structure comprises a first embedded portion protruding in a direction close to the isolation structure;

[0010] Preferably, the first embedded portion is in contact with the first isolating portion;

[0011] Preferably, along a direction perpendicular to the array substrate, a thickness of the first embedded portion is equal to a height of the first isolation portion;

[0012] Preferably, the first embedded structure further comprises a first recessed portion recessed in a direction away from the isolation structure;

[0013] Preferably, the first recessed portion is located at a side of the first embedded portion away from the array substrate;

[0014] Preferably, a side of the first recessed portion close to the array substrate and a side of the first embedded portion away from the array substrate are arranged on the same plane;

[0015] Preferably, along a direction perpendicular to the array substrate, a height of the first recessed portion is equal to a height of the second isolation portion;

[0016] Preferably, the second isolation portion is embedded in the first recessed portion;

[0017] Preferably, the cross section of the first isolation portion along the thickness direction of the array substrate is a regular trapezoid;

[0018] Preferably, the orthographic projection of the first isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate;

[0019] Preferably, the orthographic projection of the side of the first isolating portion away from the array substrate on the array substrate is located within the orthographic projection of the second isolating portion on the array substrate;

[0020] Preferably, the orthographic projection shape of the first recessed portion on the array substrate is the same as the orthographic projection shape of the first embedded portion on the array substrate;

[0021] Preferably, the orthographic projection shape of the first recessed portion on the array substrate is the same as the orthographic projection shape of the first opening on the array substrate;

[0022] Preferably, the geometric center of the orthographic projection of the first recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the first embedded portion on the array substrate;

[0023] Preferably, the geometric center of the orthographic projection of the first recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the first opening on the array substrate;

[0024] Preferably, the orthographic projection of the first recessed portion on the array substrate is located within the orthographic projection of the first embedded portion on the array substrate.

[0025] In some possible implementations, the isolation structure includes a third isolation portion, a first isolation portion, and a second isolation portion which are sequentially stacked in a direction away from the array substrate, an orthographic projection of a side of the first isolation portion away from the array substrate on the array substrate is located within an orthographic projection of the second isolation portion on the array substrate, an orthographic projection of the first isolation portion on the array substrate is located within an orthographic projection of the third isolation portion on the array substrate, and the first embedded structure is in contact with side surfaces of the first isolation portion, the second isolation portion, and the third isolation portion;

[0026] Preferably, the first embedded structure comprises a second recessed portion recessed in a direction away from the isolation structure;

[0027] Preferably, along a direction perpendicular to the array substrate, a height of the second recessed portion is equal to a height of the third isolation portion;

[0028] Preferably, the third isolation portion is embedded in the second recessed portion;

[0029] Preferably, the first embedded structure further comprises a second embedded portion protruding in a direction close to the isolation structure;

[0030] Preferably, the second embedded portion is in contact with the first isolating portion;

[0031] Preferably, along a direction perpendicular to the array substrate, a thickness of the second embedded portion is equal to a height of the first isolation portion;

[0032] Preferably, the second embedded portion is located at a side of the second recessed portion away from the array substrate;

[0033] Preferably, a side of the second embedded portion close to the array substrate and a side of the second recessed portion away from the array substrate are arranged on the same plane;

[0034] Preferably, at least part of the isolation structure encloses an isolation opening, and the first embedded structure includes a third recessed portion recessed in a direction away from the isolation opening;

[0035] Preferably, along a direction perpendicular to the array substrate, a height of the third recessed portion is equal to a height of the second isolation portion;

[0036] Preferably, the second isolation portion is embedded in the third recessed portion;

[0037] Preferably, the third recessed portion is located on a side of the second embedded portion away from the array substrate;

[0038] Preferably, a side of the third recessed portion close to the array substrate is coplanar with a side of the second embedded portion away from the array substrate;

[0039] Preferably, the cross section of the first isolation portion along the thickness direction of the array substrate is a regular trapezoid;

[0040] Preferably, the orthographic projection of the first isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate;

[0041] Preferably, the orthographic projection of the third isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate;

[0042] Preferably, the orthographic projection of the third recessed portion on the array substrate is located within the orthographic projection of the second recessed portion on the array substrate;

[0043] Preferably, the orthographic projection of the third recessed portion on the array substrate is located within the orthographic projection of the second embedded portion on the array substrate;

[0044] Preferably, the orthographic projection of the second recessed portion on the array substrate is located within the orthographic projection of the second embedded portion on the array substrate;

[0045] Preferably, the orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the third recessed portion on the array substrate;

[0046] Preferably, the orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the second embedded portion on the array substrate;

[0047] Preferably, the orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the first opening on the array substrate;

[0048] Preferably, the geometric center of the orthographic projection of the second recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the third recessed portion on the array substrate;

[0049] Preferably, the geometric center of the orthographic projection of the second recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the second embedded portion on the array substrate;

[0050] Preferably, the geometric center of the orthographic projection of the second recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the first opening on the array substrate;

[0051] Preferably, the material of the third isolation part includes molybdenum metal; and / or the material of the first isolation part includes aluminum metal; and / or the material of the second isolation part includes titanium metal.

[0052] In some possible implementations, at least a portion of the isolation structure encloses an isolation opening, and the display panel further includes a light emitting unit at least partially located in the isolation opening;

[0053] Preferably, the orthographic projection of the isolation opening on the array substrate is outside the orthographic projection of the first opening on the array substrate;

[0054] Preferably, the isolation opening and the first opening are spaced apart;

[0055] Preferably, the display panel further comprises a second encapsulation layer located on a side of the light emitting unit away from the array substrate, the second encapsulation layer comprises a plurality of encapsulation units, at least some of the encapsulation units are located in the isolation opening and extend from a side of the isolation structure to a side of the isolation structure away from the array substrate;

[0056] Preferably, the first encapsulation layer further comprises a second embedded structure, and the second embedded structure is located in the isolation opening;

[0057] Preferably, the second embedded structure is in contact with a side of the packaging unit away from the array substrate;

[0058] Preferably, the distance from the side of the first embedded structure away from the array substrate to the array substrate is equal to the distance from the side of the second embedded structure away from the array substrate to the array substrate;

[0059] Preferably, along a direction away from the array substrate, a thickness of the first embedded structure is less than a thickness of the second embedded structure;

[0060] Preferably, the first encapsulation layer further comprises a base located on a side of the first embedded structure and the second embedded structure away from the array substrate, and the base is integrally formed with the first embedded structure and the second embedded structure;

[0061] Preferably, at least a portion of the first encapsulation layer is located on a side of the second encapsulation layer away from the array substrate;

[0062] Preferably, the material of the second encapsulation layer comprises inorganic material.

[0063] In some possible implementations, adjacent packaging units are spaced apart on a side of the isolation structure away from the array substrate;

[0064] Preferably, there is a gap between the packaging unit located at a side of the isolation structure away from the array substrate and a side of the isolation structure away from the array substrate;

[0065] Preferably, the first encapsulation layer fills the gap;

[0066] Preferably, the orthographic projection of the isolation structure on the array substrate is a mesh structure.

[0067] In some possible implementations, the display panel further includes a pixel defining layer located on one side of the array substrate, the isolation structure is located on a side of the pixel defining layer away from the array substrate, and the first encapsulation layer filling the first opening is in contact with a side of the pixel defining layer away from the array substrate;

[0068] Preferably, the pixel defining layer comprises a plurality of pixel openings;

[0069] Preferably, at least a portion of the isolation structure encloses an isolation opening, and an orthographic projection of the pixel opening on the array substrate is located within an orthographic projection of the isolation opening on the array substrate;

[0070] Preferably, the pixel opening comprises a first pixel opening and a second pixel opening, and along a direction perpendicular to the array substrate, a depth of the first pixel opening is equal to a depth of the second pixel opening;

[0071] Preferably, along the arrangement direction of the pixel openings, the size of the orthographic projection of the first pixel openings on the array substrate is equal to the size of the orthographic projection of the second pixel openings on the array substrate;

[0072] Preferably, the pixel opening further includes a third pixel opening, and along a direction perpendicular to the array substrate, the depth of the third pixel opening is equal to the depth of the first pixel opening and the depth of the second pixel opening;

[0073] Preferably, along the arrangement direction of the pixel openings, the size of the orthographic projection of the first pixel opening on the array substrate is equal to the sizes of the orthographic projections of the second pixel opening and the third pixel opening on the array substrate;

[0074] Preferably, the isolation opening comprises a first isolation opening and a second isolation opening, and along a direction perpendicular to the array substrate, the first isolation opening and the second isolation opening have the same depth;

[0075] Preferably, along the arrangement direction of the isolation openings, the size of the orthographic projection of the first isolation openings on the array substrate is equal to the size of the orthographic projection of the second isolation openings on the array substrate;

[0076] Preferably, the isolation opening further includes a third isolation opening, and along a direction perpendicular to the array substrate, the depth of the third isolation opening is equal to the depths of the first isolation opening and the second isolation opening;

[0077] Preferably, along the arrangement direction of the isolation openings, the size of the orthographic projection of the first isolation opening on the array substrate is equal to the sizes of the orthographic projections of the second isolation opening and the third isolation opening on the array substrate;

[0078] Preferably, the first opening includes a first light-transmitting opening and a second light-transmitting opening, and along a direction perpendicular to the array substrate, the first light-transmitting opening and the second light-transmitting opening have the same depth;

[0079] Preferably, along the arrangement direction of the light-transmitting openings, the size of the orthographic projection of the first light-transmitting openings on the array substrate is equal to the size of the orthographic projection of the second light-transmitting openings on the array substrate;

[0080] Preferably, the light-transmitting opening further comprises a third light-transmitting opening, and along a direction perpendicular to the array substrate, the depth of the third light-transmitting opening is equal to the depths of the first light-transmitting opening and the second light-transmitting opening;

[0081] Preferably, along the arrangement direction of the light-transmitting openings, the size of the orthographic projection of the first light-transmitting opening on the array substrate is equal to the sizes of the orthographic projections of the second light-transmitting opening and the third light-transmitting opening on the array substrate.

[0082] In some possible implementations, the display panel further includes a pixel defining layer located on one side of the array substrate, and the pixel defining layer includes a plurality of pixel openings;

[0083] Preferably, the pixel opening comprises a first pixel opening and a second pixel opening, and along a direction perpendicular to the array substrate, the depths of the first pixel opening and the second pixel opening are not equal;

[0084] Preferably, along the arrangement direction of the pixel openings, the size of the orthographic projection of the first pixel openings on the array substrate is unequal to the size of the orthographic projection of the second pixel openings on the array substrate;

[0085] Preferably, the pixel opening further comprises a third pixel opening, and along a direction perpendicular to the array substrate, a depth of the third pixel opening is not equal to a depth of at least one of the first pixel opening and the second pixel opening;

[0086] Preferably, along the arrangement direction of the pixel openings, the size of the orthographic projection of the first pixel opening on the array substrate is not equal to the size of the orthographic projection of at least one of the second pixel opening and the third pixel opening on the array substrate;

[0087] Preferably, the isolation opening comprises a first isolation opening and a second isolation opening, and along a direction perpendicular to the array substrate, the depths of the first isolation opening and the second isolation opening are unequal;

[0088] Preferably, along the arrangement direction of the isolation openings, the size of the orthographic projection of the first isolation openings on the array substrate is unequal to the size of the orthographic projection of the second isolation openings on the array substrate;

[0089] Preferably, the isolation opening further comprises a third isolation opening, and along a direction perpendicular to the array substrate, the depth of the third isolation opening is not equal to the depth of at least one of the first isolation opening and the second isolation opening;

[0090] Preferably, along the arrangement direction of the isolation openings, the size of the orthographic projection of the first isolation opening on the array substrate is not equal to the size of the orthographic projection of at least one of the second isolation opening and the third isolation opening on the array substrate;

[0091] Preferably, the first opening includes a first light-transmitting opening and a second light-transmitting opening, and along a direction perpendicular to the array substrate, the depths of the first light-transmitting opening and the second light-transmitting opening are not equal;

[0092] Preferably, along the arrangement direction of the light-transmitting openings, the size of the orthographic projection of the first light-transmitting openings on the array substrate is unequal to the size of the orthographic projection of the second light-transmitting openings on the array substrate;

[0093] Preferably, the light-transmitting opening further comprises a third light-transmitting opening, and along a direction perpendicular to the array substrate, a depth of the third light-transmitting opening is not equal to a depth of at least one of the first light-transmitting opening and the second light-transmitting opening;

[0094] Preferably, along the arrangement direction of the light-transmitting openings, a size of an orthographic projection of the first light-transmitting opening on the array substrate is not equal to a size of an orthographic projection of at least one of the second light-transmitting opening and the third light-transmitting opening on the array substrate.

[0095] In some possible implementations, the pixel defining layer includes a groove on a side away from the array substrate, at least a portion of the groove is exposed in the first opening, and the first encapsulation layer extends into the groove;

[0096] Preferably, the number of the grooves is multiple;

[0097] Preferably, the orthographic projection of the groove on the array substrate is located within the orthographic projection of the first opening on the array substrate;

[0098] Preferably, the orthographic projection shape of the groove on the array substrate includes a circle or a polygon;

[0099] Preferably, the width of the orthographic projection of the groove on the array substrate is in the range of 2 μm-10 μm;

[0100] Preferably, the spacing between the orthographic projections of adjacent grooves on the array substrate is in the range of 2 μm-5 μm.

[0101] In some possible implementations, the light-emitting unit includes a first electrode, a light-emitting portion, and a second electrode that are at least partially located in the isolation opening and are sequentially stacked in a direction away from the array substrate, and the second electrode is electrically connected to the isolation structure.

[0102] In some possible implementations, the display panel further includes a third packaging layer located on a side of the first packaging layer away from the array substrate;

[0103] Preferably, the materials of the third encapsulation layer all include inorganic materials;

[0104] Preferably, the material of the first encapsulation layer includes organic material.

[0105] In some possible implementations, the present application further provides a display panel, the display panel comprising a first display area and a second display area at least partially surrounding the first display area, the display panel comprising:

[0106] An array substrate;

[0107] An isolation structure located on one side of the array substrate, at least part of the isolation structure encloses a first opening, and the first opening is located in the first display area; a first encapsulation layer, the first encapsulation layer at least partially fills the first opening and contacts with at least part of a side of the isolation structure close to the first opening; the first encapsulation layer includes a first embedded structure, and the first embedded structure is located in the first opening and contacts with the isolation structure.

[0108] In some possible implementations, the present application further provides a display panel, comprising:

[0109] An array substrate;

[0110] A pixel defining layer located at one side of the array substrate, wherein a side of the pixel defining layer away from the array substrate comprises a groove;

[0111] an isolation structure located at a side of the pixel defining layer away from the array substrate, wherein at least a portion of the isolation structure encloses a first opening, and at least a portion of the groove is exposed in the first opening;

[0112] A first encapsulation layer at least partially fills the first opening and extends into the groove.

[0113] In some possible implementations, the present application further provides a method for preparing a display panel, the method comprising:

[0114] Providing an array substrate;

[0115] An isolation structure is formed on one side of the array substrate, wherein at least a portion of the isolation structure encloses a first opening;

[0116] A first encapsulation layer is formed, the first encapsulation layer at least partially fills the first opening and contacts at least part of a side of the isolation structure close to the first opening, and a first embedded structure is formed between the first encapsulation layer and a side of the isolation structure close to the isolation opening.

[0117] In some possible implementations, the step of forming an isolation structure on one side of the array substrate includes:

[0118] forming a first electrode layer on one side of the array substrate, wherein the first electrode layer includes a plurality of first electrodes arranged at intervals;

[0119] forming a pixel defining layer on a side of the first electrode away from the array substrate, wherein the pixel defining layer includes a pixel opening and a groove;

[0120] An isolation structure is formed on a side of the pixel defining layer away from the array substrate.

[0121] In some possible implementations, the step of forming a pixel defining layer on a side of the first electrode away from the array substrate includes:

[0122] forming a pixel defining material layer on a side of the first electrode away from the array substrate;

[0123] A pixel opening and a groove are formed on the pixel defining material layer through a half-tone mask to form a pixel defining layer.

[0124] In some possible implementations, the present application further provides an electronic device, which includes the display panel described in the present application, or includes a display panel prepared by the method for preparing the display panel described in the present application.

[0125] Compared with the prior art, this application has the following beneficial effects:

[0126] The present application provides a display panel, a method for preparing a display panel, and an electronic device. By setting the first packaging layer to include a first embedded structure, and the first embedded structure is located in the first opening and in contact with the isolation structure, the adhesion between the first packaging layer and the isolation structure can be increased, thereby increasing the stability of the first packaging layer and further improving the quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0127] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0128] Figure 1 A schematic top view of a display panel provided in an embodiment of the present application;

[0129] Figure 2 An enlarged schematic diagram of the first display area provided in an embodiment of the present application;

[0130] Figure 3 Provided in the embodiments of this application Figure 2 One of the cross-sectional diagrams at AA in the middle;

[0131] Figure 4 Provided in the embodiments of this application Figure 2 The second schematic diagram of the cross section at AA in the middle;

[0132] Figure 5 One of the cross-sectional schematic diagrams of the first embedded structure and the base being integrally formed in an embodiment of the present application;

[0133] Figure 6 Provided in the embodiments of this application Figure 2 The third schematic diagram of the cross section at AA in the middle;

[0134] Figure 7 The second cross-sectional schematic diagram of the first embedded structure and the base being integrally formed in one piece provided in the embodiment of the present application;

[0135] Figure 8 Provided in the embodiments of this application Figure 2 The fourth schematic diagram of the cross section at AA in the middle;

[0136] Fig. 9 A schematic top view of an isolation structure of a second display area provided in an embodiment of the present application;

[0137] Fig.10A cross-sectional schematic diagram of the first embedded structure, the second embedded structure and the base being integrally formed in an embodiment of the present application;

[0138] Fig.11 The isolation opening of the display panel provided in the embodiment of the present application includes a cross-sectional schematic diagram of a first isolation opening and a second isolation opening;

[0139] Fig.12 The isolation opening of the display panel provided in the embodiment of the present application further includes a cross-sectional schematic diagram of a third isolation opening;

[0140] Fig.13 One of the schematic top views of the first pixel opening, the second pixel opening, and the third pixel opening of the display panel provided in the embodiment of the present application;

[0141] Fig.14 One of the schematic top views of the first isolation opening, the second isolation opening and the third isolation opening of the display panel provided in the embodiment of the present application;

[0142] Fig.15 A second schematic top view of the first pixel opening, the second pixel opening, and the third pixel opening of the display panel provided in an embodiment of the present application;

[0143] Fig.16 A second schematic top view of the first isolation opening, the second isolation opening and the third isolation opening of the display panel provided in the embodiment of the present application;

[0144] Fig.17 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a first light-transmitting opening, a second light-transmitting opening and a third light-transmitting opening;

[0145] Fig.18 One of the schematic top views of the first light-transmitting opening, the second light-transmitting opening, and the third light-transmitting opening of the display panel provided in the embodiment of the present application;

[0146] Fig.19 A second schematic top view of the first light-transmitting opening, the second light-transmitting opening, and the third light-transmitting opening of the display panel provided in an embodiment of the present application;

[0147] Fig. 20 A schematic diagram of a process for preparing a display panel provided in an embodiment of the present application;

[0148] Fig.21 A cross-sectional schematic diagram of forming a first electrode layer on one side of an array substrate provided in an embodiment of the present application;

[0149] Fig. 22 A cross-sectional schematic diagram of a pixel defining material layer formed on a side of a first electrode away from an array substrate provided in an embodiment of the present application;

[0150] Fig.23 A cross-sectional schematic diagram of an isolation structure material layer formed on a side of a pixel defining material layer away from an array substrate provided in an embodiment of the present application;

[0151] Fig.24 A schematic cross-sectional view of the isolation structure material layer after patterning provided in an embodiment of the present application;

[0152] Fig.25 A schematic cross-sectional view of a pixel opening and a groove formed on a pixel defining material layer by a half-tone mask provided in an embodiment of the present application;

[0153] Fig.26 A cross-sectional schematic diagram of forming a light-emitting functional layer in an isolation opening according to an embodiment of the present application;

[0154] Fig. 27 A cross-sectional schematic diagram of a second electrode layer formed in an isolation opening and located on a side of the light-emitting functional layer away from the array substrate provided in an embodiment of the present application;

[0155] Fig.28 A cross-sectional schematic diagram of forming a second encapsulation layer on a side of the second electrode layer away from the array substrate provided in an embodiment of the present application.

[0156] Figure numerals: 1, isolation structure; 101, first isolation portion; 102, second isolation portion; 103, third isolation portion; 2, isolation opening; 21, first isolation opening; 22, second isolation opening; 23, third isolation opening; 3, first opening; 31, first light-transmitting opening; 32, second light-transmitting opening; 33, third light-transmitting opening; 4, light-emitting unit; 5, array substrate; 6, pixel defining layer; 61, pixel opening; 611, first pixel opening; 612, second pixel opening; 6 13. third pixel opening; 62. groove; 7. first electrode; 8. light-emitting portion; 9. second electrode; 10. first encapsulation layer; 11. second encapsulation layer; 111. encapsulation unit; 12. first embedded structure; 121. first embedded portion; 122. first recessed portion; 123. second recessed portion; 124. second embedded portion; 125. third recessed portion; 13. third encapsulation layer; 14. pixel defining material layer; 15. isolation structure material layer; 16. second embedded structure; 17. base. DETAILED DESCRIPTION

[0157] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0158] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0159] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0160] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the invention product is usually placed when in use, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0161] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0162] The display panel in the related art includes an array substrate, an isolation structure located at one side of the array substrate, a second encapsulation layer located at a side of the isolation structure away from the array substrate, and a first encapsulation layer located at a side of the second encapsulation layer and a part of the isolation structure away from the array substrate. The inventor has found through long-term research that the stability of the first encapsulation layer is not good enough, and it is easy to fall off, which will eventually affect the quality of the display panel.

[0163] In view of this, the present embodiment provides a solution that can improve the reliability of the display panel. The solution provided by the present embodiment is described in detail below.

[0164] See also Figure 1-Figure 3 This embodiment provides a display panel, which includes an array substrate 5, an isolation structure 1 and a first packaging layer 10.

[0165] The array substrate 5 may include a substrate and a plurality of drive units located on one side of the substrate, and each drive unit may include one or more semiconductor switch devices. The semiconductor switch device may be formed by the cooperation of a plurality of film layers in the array substrate 5, for example, the semiconductor switch device may be a thin film transistor formed by the cooperation of a plurality of film layers.

[0166] The isolation structure 1 is located on one side of the array substrate 5 , and at least a portion of the isolation structure 1 encloses a first opening 3 .

[0167] The composition, preparation and other contents of the isolation structure 1 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202311499823.9, 202310731471.9, and 202311091555.7 for reference.

[0168] The first encapsulation layer 10 at least partially fills the first opening 3 and contacts at least part of the isolation structure 1 on one side close to the first opening 3 . The first encapsulation layer 10 includes a first embedded structure 12 . The first embedded structure 12 is located in the first opening 3 and contacts the isolation structure 1 .

[0169] The first encapsulation layer 10 can be formed by inkjet printing, and the material of the first encapsulation layer 10 will flow into the first opening 3 to fill the first opening 3. The filling here can be to completely fill the first opening 3, or there can be a certain gap. Preferably, the first encapsulation layer 10 completely fills the first opening 3, and the first encapsulation layer 10 filling the first opening 3 forms a first embedded structure 12, so that the adhesion between the first encapsulation layer 10 and the isolation structure 1 can be increased. The material of the first encapsulation layer 10 has a high light transmittance, so that light can more easily pass through the first opening 3 to reach the position of the corresponding photosensitive device, so that the display panel can have a good transmittance.

[0170] The first encapsulation layer 10 will extend to contact the side of the isolation structure 1 close to the first opening 3, and the first embedded structure 12 located in the first opening 3 will contact the isolation structure 1. The first embedded structure 12 can increase the adhesion between the first encapsulation layer 10 and the isolation structure 1, thereby improving the stability of the first encapsulation layer 10 and making it less likely for the first encapsulation layer 10 to fall off, thereby ultimately improving the quality of the display panel.

[0171] Based on the above design, this embodiment increases the adhesion between the first encapsulation layer 10 and the isolation structure 1 by configuring the first encapsulation layer 10 to include a first embedded structure 12, and the first embedded structure 12 is located in the first opening 3 and in contact with the isolation structure 1, thereby increasing the stability of the first encapsulation layer 10 and further improving the quality of the display panel.

[0172] For some possible implementations, see again Figure 3, at least part of the isolation structure 1 is enclosed to form an isolation opening 2, the light-emitting unit 4 includes a first electrode 7, a light-emitting portion 8 and a second electrode 9 that are at least partly located in the isolation opening 2 and are stacked in sequence in a direction away from the array substrate 5, and the second electrode 9 is electrically connected to the isolation structure 1.

[0173] When forming the light-emitting functional layer, the light-emitting functional layer will be separated by the isolation structure 1 to form a plurality of light-emitting portions 8 arranged at intervals. When forming the second electrode layer, the second electrode layer will be separated by the isolation structure 1 to form a plurality of second electrodes 9 arranged at intervals. The isolation structure 1 includes a conductive material. The second electrode 9 is electrically connected to the isolation structure 1. A first electrode 7, a light-emitting portion 8 and a second electrode 9 form a light-emitting unit 4. Among them, the first electrode 7 is an anode and the second electrode 9 is a cathode.

[0174] Preferably, see again Figure 3 , the orthographic projection of the isolation opening 2 on the array substrate 5 is located outside the orthographic projection of the first opening 3 on the array substrate 5; the isolation opening 2 and the first opening 3 are arranged at intervals, and the orthographic projections of the isolation opening 2 and the first opening 3 on the array substrate 5 do not overlap.

[0175] Preferably, the first encapsulation layer 10 completely fills the first opening 3 , so that gas is not easily retained in the first opening 3 , and the adhesion between the first encapsulation layer 10 and the isolation structure 1 can be further increased, thereby improving the quality of the display panel.

[0176] For some possible implementations, see again Figure 3 The display panel further includes a second encapsulation layer 11 located on the side of the light emitting unit 4 away from the array substrate 5. The second encapsulation layer 11 includes a plurality of encapsulation units 111. At least some of the encapsulation units 111 are located in the isolation opening 2 and extend from the side of the isolation structure 1 toward the isolation opening 2 to the side of the isolation structure 1 away from the array substrate 5. Adjacent encapsulation units 111 are arranged at intervals on the side of the isolation structure 1 away from the array substrate 5. There is a gap between the encapsulation unit 111 located on the side of the isolation structure 1 away from the array substrate 5 and the side of the isolation structure 1 away from the array substrate 5. In this way, the encapsulation unit 111 can more easily encapsulate the corresponding light emitting unit 4 completely and independently.

[0177] Preferably, the first encapsulation layer 10 fills the gap, so that the first encapsulation layer 10 and the encapsulation unit 111 are more firmly fixed, thereby improving the stability of the first encapsulation layer 10 .

[0178] For some possible implementations, see again Figure 3The display panel also includes a pixel defining layer 6 located on one side of the array substrate 5, the isolation structure 1 is located on the side of the pixel defining layer 6 away from the array substrate 5, the first encapsulation layer 10 filling the first opening 3 is in contact with the side of the pixel defining layer 6 away from the array substrate 5, the pixel defining layer 6 includes a plurality of pixel openings 61, at least part of the light-emitting units 4 are located in the pixel openings 61, and the orthographic projection of the pixel opening 61 on the array substrate 5 is located within the orthographic projection of the isolation opening 2 on the array substrate 5.

[0179] The first opening 3 can expose part of the pixel defining layer 6 away from the side of the array substrate 5. When the first encapsulation layer 10 fills the first opening 3, the first encapsulation layer 10 can contact the side of the pixel defining layer 6 away from the array substrate 5. There is a certain adhesion force between the first encapsulation layer 10 and the side of the pixel defining layer 6 exposed by the first opening 3 away from the array substrate 5, thereby making the first encapsulation layer 10 more stable.

[0180] Preferably, the first encapsulation layer 10 completely fills the first opening 3. In this way, the stability of the first encapsulation layer 10 can be improved.

[0181] For some possible implementations, see Figure 4 The pixel defining layer 6 includes a groove 62 on one side away from the array substrate 5, at least part of the groove 62 is exposed in the first opening 3, the orthographic projections of the plurality of grooves 62 on the array substrate 5 are located within the orthographic projections of the first opening 3 on the array substrate 5, and the first encapsulation layer 10 extends into the groove 62.

[0182] When forming the pixel opening 61, a plurality of grooves 62 can be simultaneously formed on the side of the pixel defining layer 6 away from the array substrate 5, and at least one groove 62 is included at the position corresponding to the same first opening 3. In this way, the material of the first encapsulation layer 10 at the first opening 3 will flow into the groove 62, and finally the first encapsulation layer 10 filling the first opening 3 will be embedded in the groove 62, and a concave-convex structure will be formed between the first encapsulation layer 10 filling the first opening 3 and the side of the pixel defining layer 6 away from the array substrate 5, so that the adhesion between the first encapsulation layer 10 and the side of the pixel defining layer 6 away from the array substrate 5 can be further increased, and then the stability of the first encapsulation layer 10 can be further improved.

[0183] Preferably, there are a plurality of grooves 62 , so that the adhesion between the first encapsulation layer 10 and the pixel defining layer 6 can be further increased.

[0184] Preferably, the orthographic projection shape of the groove 62 on the array substrate 5 includes a circle or a polygon, such as a triangle, a quadrilateral, etc.

[0185] For some possible implementations, see again Figure 4, the width φ of the orthographic projection of the groove 62 on the array substrate 5 ranges from 2μm to 10μm, for example, the width φ can be 2μm, 3μm, 5μm, 7μm, 9μm or 10μm, etc. By properly setting the width φ of the groove 62, the number of grooves 62 can be properly set on the side of the pixel defining layer 6 away from the array substrate 5 at the first opening 3, so that the first encapsulation layer 10 and the pixel defining layer 6 have a greater adhesion.

[0186] Preferably, see again Figure 4 , the spacing L between the orthographic projections of adjacent grooves 62 on the array substrate 5 is in the range of 2 μm-5 μm, for example, the spacing L may be 2 μm, 3 μm, 4 μm, or 5 μm, etc. By properly setting the spacing L between the grooves 62, the number of the grooves 62 can be properly set on the side of the pixel defining layer 6 away from the array substrate 5 at the first opening 3, so that the first encapsulation layer 10 and the pixel defining layer 6 have a greater adhesion.

[0187] For some possible implementations, see again Figure 3 The isolation structure 1 includes a first isolation portion 101 and a second isolation portion 102 which are sequentially stacked in a direction away from the array substrate 5. The orthographic projection of the side of the first isolation portion 101 away from the array substrate 5 on the array substrate 5 is located within the orthographic projection of the second isolation portion 102 on the array substrate 5. The first embedded structure 12 contacts the side surfaces of the first isolation portion 101 and the second isolation portion 102. The second electrode 9 of the light-emitting unit 4 is electrically connected to the first isolation portion 101. Specifically, the orthographic projection of the side of the first isolation portion 101 away from the array substrate 5 on the array substrate 5 is located within the orthographic projection of the second isolation portion 102 on the array substrate 1.

[0188] Since the second isolation portion 102 is located on the side of the first isolation portion 101 away from the array substrate 5, and the lateral width of the second isolation portion 102 is greater than the lateral width of the first isolation portion 101, the second isolation portion 102 disconnects the light-emitting functional layer and the second electrode layer at the isolation structure 1. In this way, the isolation structure 1 formed by the first isolation portion 101 and the second isolation portion 102 can make it easier to package each light-emitting unit 4 independently.

[0189] The first isolation portion 101 includes a conductive material, and the second electrode 9 corresponding to the light emitting unit 4 extends to contact the side wall of the first isolation portion 101 to achieve electrical connection between the second electrode 9 corresponding to the light emitting unit 4 and the third isolation portion 103 .

[0190] Since the first isolation portion 101 and the second isolation portion 102 have different lateral extension lengths, an uneven structure will be formed on the side of the first isolation portion 101 and the second isolation portion 102 away from the isolation opening 2, and the material of the first encapsulation layer 10 will be embedded in the uneven structure of the first isolation portion 101 and the second isolation portion 102 away from the isolation opening 2, and finally form a first embedded structure 12, thereby increasing the adhesion between the first encapsulation layer 10 and the isolation structure 1 away from the isolation opening 2.

[0191] Preferably, in some embodiments, see Figure 5 The first embedded structure 12 includes a first embedded portion 121 protruding toward the direction close to the isolation structure 1; the first embedded portion 121 is in contact with the first isolation portion 101; along the direction perpendicular to the array substrate 5, the thickness of the first embedded portion 121 is equal to the height of the first isolation portion 101, and the first embedded portion 121 is formed between the first packaging layer 10 filling the first opening 3 and the first isolation portion 101.

[0192] The first embedded structure 12 also includes a first recessed portion 122 recessed in a direction away from the isolation structure 1, and the first recessed portion 122 is located on a side of the first embedded portion 121 away from the array substrate 5; a side of the first recessed portion 122 close to the array substrate 5 is coplanar with a side of the first embedded portion 121 away from the array substrate 5; along a direction perpendicular to the array substrate 5, a height of the first recessed portion 122 is equal to a height of the second isolation portion 102, and the second isolation portion 102 is embedded in the first recessed portion 122, forming a first recessed portion 122 between the first packaging layer 10 filling the first opening 3 and the second isolation portion 102.

[0193] In this way, the first packaging layer 10 filling the first opening 3 extends from the side of the first isolation part 101 to the side of the second isolation part 102 close to the array substrate 5, and then extends from the side of the second isolation part 102 to the side of the second isolation part 102 away from the array substrate 5, thereby increasing the adhesion between the first packaging layer 10 and the side of the isolation structure 1 away from the isolation opening 2.

[0194] Preferably, the cross section of the first isolation portion 101 along the thickness direction of the array substrate 5 is a regular trapezoid. In this way, it is easier to form the first embedded structure between the first encapsulation layer 10 and the isolation structure 1.

[0195] Preferably, the orthographic projection of the first isolation portion 101 on the array substrate 5 is located within the orthographic projection of the second isolation portion 102 on the array substrate 5. In this way, the light-emitting functional layer and the second electrode layer are more easily disconnected at the isolation structure 1.

[0196] Preferably, the orthographic projection shape of the first recessed portion 122 on the array substrate 5 is the same as the orthographic projection shape of the first embedded portion 121 on the array substrate 5, the orthographic projection shape of the first recessed portion 122 on the array substrate 5 is the same as the orthographic projection shape of the first opening 3 on the array substrate 5, the geometric center of the orthographic projection of the first recessed portion 122 on the array substrate 5 coincides with the geometric center of the orthographic projection of the first embedded portion 121 on the array substrate 5, the geometric center of the orthographic projection of the first recessed portion 122 on the array substrate 5 coincides with the geometric center of the orthographic projection of the first opening 3 on the array substrate 5, and the orthographic projection of the first recessed portion 122 on the array substrate 5 is located within the orthographic projection of the first embedded portion 121 on the array substrate 5. In this way, the structures of the peripheral side of the first embedded structure 12 are basically the same, so that the uniformity of the connection between the first embedded structure 12 and the isolation structure 1 at different positions can be improved, and finally the bonding force between the first encapsulation layer 10 and the isolation structure 1 can be further improved.

[0197] For some possible implementations, see Figure 6 The isolation structure 1 includes a third isolation part 103, a first isolation part 101 and a second isolation part 102 which are sequentially stacked in a direction away from the array substrate 5. The orthographic projection of the side of the first isolation part 101 away from the array substrate 5 on the array substrate 5 is located within the orthographic projection of the second isolation part 102 on the array substrate 5. The orthographic projection of the first isolation part 101 on the array substrate 5 is located within the orthographic projection of the third isolation part 103 on the array substrate 5. The first embedded structure 12 is in contact with the side surfaces of the third isolation part 103, the first isolation part 101 and the second isolation part 102. The second electrode 9 of the light-emitting unit 4 is electrically connected to the third isolation part 103. The material of the third isolation part 103 includes molybdenum metal; and / or the material of the first isolation part 101 includes aluminum metal; and / or the material of the second isolation part 102 includes titanium metal.

[0198] Since the orthographic projection of the first isolation portion 101 on the array substrate 5 is located within the orthographic projection of the third isolation portion 103 on the array substrate 5, part of the third isolation portion 103 will be exposed relative to the first isolation portion 101, and the third isolation portion 103, the first isolation portion 101, and the second isolation portion 102 will form an uneven structure on the side away from the isolation opening 2. The material of the first encapsulation layer 10 will be embedded in the uneven structure of the third isolation portion 103, the first isolation portion 101, and the second isolation portion 102 on the side away from the isolation opening 2, and finally form a first embedded structure 12, thereby increasing the adhesion between the first encapsulation layer 10 and the isolation structure 1 on the side away from the isolation opening 2.

[0199] Preferably, see Figure 7In some other embodiments, the first embedded structure 12 includes a second recessed portion 123 recessed in a direction away from the isolation structure 1; along a direction perpendicular to the array substrate 5, the height of the second recessed portion 123 is equal to the height of the third isolation portion 103; the third isolation portion 103 is embedded in the second recessed portion 123; and a second recessed portion 123 is formed between the first packaging layer 10 filling the first opening 3 and the third isolation portion 103.

[0200] The first embedded structure 12 also includes a second embedded portion 124 protruding toward the direction close to the isolation structure 1, and the second embedded portion 124 is in contact with the first isolation portion 101; along the direction perpendicular to the array substrate 5, the thickness of the second embedded portion 124 is equal to the height of the first isolation portion 101; the second embedded portion 124 is located on the side of the second recessed portion 123 away from the array substrate 5; the side of the second embedded portion 124 close to the array substrate 5 is coplanar with the side of the second recessed portion 123 away from the array substrate 5; the second embedded portion 124 is formed between the first packaging layer 10 filling the first opening 3 and the first isolation portion 101.

[0201] The first embedded structure 12 includes a third recessed portion 125 recessed in a direction away from the isolation opening 2; along the direction perpendicular to the array substrate 5, the height of the third recessed portion 125 is equal to the height of the second isolation portion 102; the second isolation portion 102 is embedded in the third recessed portion 125; the third recessed portion 125 is located on the side of the second embedded portion 124 away from the array substrate 5; the side of the third recessed portion 125 close to the array substrate 5 is coplanar with the side of the second embedded portion 124 away from the array substrate 5; the third recessed portion 125 is formed between the first packaging layer 10 filling the first opening 3 and the second isolation portion 102.

[0202] In this way, the first packaging layer 10 filling the first opening 3 extends from the side of the third isolation part 103 to the side of the third isolation part 103 away from the array substrate 5, and then extends from the side of the first isolation part 101 to the side of the second isolation part 102 close to the array substrate 5, and finally extends from the side of the second isolation part 102 to the side of the second isolation part 102 away from the array substrate 5, thereby increasing the adhesion between the first packaging layer 10 and the side of the isolation structure 1 away from the isolation opening 2.

[0203] Preferably, the orthographic projection of the third isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate, the orthographic projection of the third recessed portion on the array substrate is located within the orthographic projection of the second recessed portion on the array substrate, the orthographic projection of the third recessed portion on the array substrate is located within the orthographic projection of the second embedded portion on the array substrate, the orthographic projection of the second recessed portion on the array substrate is located within the orthographic projection of the second embedded portion on the array substrate, the orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the third recessed portion on the array substrate, and the orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the third recessed portion on the array substrate. The orthographic projection shape of the second embedded portion on the array substrate is the same, the orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the first opening on the array substrate, the geometric center of the orthographic projection of the second recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the third recessed portion on the array substrate, the geometric center of the orthographic projection of the second recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the second embedded portion on the array substrate, and the geometric center of the orthographic projection of the second recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the first opening on the array substrate.

[0204] In this way, the structures around the first embedded structure 12 are substantially the same, thereby improving the uniformity of the connection between the first embedded structure 12 and the isolation structure 1 at different positions, and ultimately further improving the adhesion between the first encapsulation layer 10 and the isolation structure 1 .

[0205] For some possible implementations, see Figure 8 The display panel further includes a third encapsulation layer 13 located on a side of the first encapsulation layer 10 away from the array substrate 5. The materials of the second encapsulation layer 11 and the third encapsulation layer 13 both include inorganic materials, and the material of the first encapsulation layer 10 includes organic materials.

[0206] The second encapsulation layer 11, the first encapsulation layer 10 and the third encapsulation layer 13 form an encapsulation layer of the display panel, which can better encapsulate the display panel.

[0207] Preferably, see Fig. 9 The orthographic projection of the isolation structure 1 on the array substrate 5 is a mesh structure. In this way, it is easier to independently package the light-emitting unit 4.

[0208] For some possible implementations, see Fig.10The first packaging layer 10 also includes a second embedded structure 16, which is located in the isolation opening 2. The second embedded structure 16 contacts the side of the packaging unit 111 away from the array substrate 5. The distance from the side of the first embedded structure 12 away from the array substrate 5 to the array substrate 5 is equal to the distance from the side of the second embedded structure 16 away from the array substrate 5 to the array substrate 5. Along the direction away from the array substrate 5, the thickness of the first embedded structure 12 is less than the thickness of the second embedded structure 16. The first packaging layer 10 also includes a base 17 located on the side of the first embedded structure 12 and the second embedded structure 16 away from the array substrate 5, and the base 17 is integrally formed with the first embedded structure 12 and the second embedded structure 17.

[0209] By providing the second embedded structure 17 embedded in the isolation opening 2 , the adhesion between the first encapsulation layer 10 and the isolation structure 1 and the encapsulation unit 111 can be further improved, thereby further improving the stability of the first encapsulation layer 10 .

[0210] For some possible implementations, see Figure 11-Figure 14 The pixel opening 61 includes a first pixel opening 611 , a second pixel opening 612 and a third pixel opening 613 , and the isolation opening 2 includes a first isolation opening 21 , a second isolation opening 22 and a third isolation opening 23 .

[0211] In some embodiments, along a direction perpendicular to the array substrate 5 , a depth H1 of the first pixel opening 611 , a depth H2 of the second pixel opening 612 , and a depth H3 of the third pixel opening 613 are equal.

[0212] Along the arrangement direction of the pixel openings 61 , the size L1 of the orthographic projection of the first pixel opening 611 on the array substrate 5 , the size L2 of the orthographic projection of the second pixel opening 612 on the array substrate 5 , and the size L3 of the orthographic projection of the third pixel opening 613 on the array substrate 5 are equal.

[0213] Along the direction perpendicular to the array substrate 5 , the depth N1 of the first isolation opening 21 , the depth N2 of the second isolation opening 22 , and the depth N3 of the third isolation opening 23 are equal.

[0214] Along the arrangement direction of the isolation openings 2 , the size D1 of the orthographic projection of the first isolation openings 21 on the array substrate 5 , the size D2 of the orthographic projection of the second isolation openings 22 on the array substrate 5 , and the size D3 of the orthographic projection of the third isolation openings 23 on the array substrate 5 are equal.

[0215] Thus, in this embodiment, the second embedded structures 16 corresponding to different light-emitting units have the same shape and size.

[0216] In other embodiments, see Figure 11-Figure 12 , Figure 15-16, along the direction perpendicular to the array substrate 5, the depth of the first pixel opening 611 is not equal to the depth of at least one of the second pixel opening 612 and the third pixel opening 613, that is, the depth H1 of the first pixel opening 611 is not equal to the depth H2 of the second pixel opening 612 and / or the depth H3 of the third pixel opening 613.

[0217] Along the arrangement direction of the pixel openings 61, the size of the orthographic projection of the first pixel opening 611 on the array substrate 5 is not equal to the size of the orthographic projection of at least one of the second pixel opening 612 and the third pixel opening 613 on the array substrate 5, that is, the size L1 of the orthographic projection of the first pixel opening 611 on the array substrate 5 is not equal to the size L2 of the orthographic projection of the second pixel opening 612 on the array substrate 5 and / or the size L3 of the orthographic projection of the third pixel opening 613 on the array substrate 5.

[0218] Along the direction perpendicular to the array substrate 5, the depth of the first isolation opening 21 is not equal to the depth of the second isolation opening 22 and the depth of at least one of the third isolation opening 23, that is, the depth N1 of the first isolation opening 21 is not equal to the depth N2 of the second isolation opening 22 and / or the depth N3 of the third isolation opening 23.

[0219] Along the arrangement direction of the isolation openings 2, the size of the orthographic projection of the first isolation opening 21 on the array substrate 5 is not equal to the size of the orthographic projection of at least one of the second isolation opening 22 and the third isolation opening 23 on the array substrate 5, that is, the size D1 of the orthographic projection of the first isolation opening 21 on the array substrate 5 is not equal to the size D2 of the orthographic projection of the second isolation opening 22 on the array substrate 5 and / or the size D3 of the orthographic projection of the third isolation opening 23 on the array substrate 5.

[0220] Thus, in this embodiment, the shapes and sizes of the second embedded structures 16 corresponding to different light-emitting units are different.

[0221] For some possible implementations, see Fig.17 and Fig.18 The first opening 3 includes light-transmitting openings, and the light-transmitting openings include a first light-transmitting opening 31 , a second light-transmitting opening 32 and a third light-transmitting opening 33 .

[0222] In some embodiments, along a direction perpendicular to the array substrate 5 , a depth M1 of the first light-transmitting opening 31 , a depth M2 of the second light-transmitting opening 32 , and a depth M3 of the third light-transmitting opening 33 are equal.

[0223] Along the arrangement direction of the light-transmitting openings, the orthographic projection size W1 of the first light-transmitting opening 31 on the array substrate 5, the orthographic projection size W2 of the second light-transmitting opening 32 on the array substrate 5 and the orthographic projection size W3 of the third light-transmitting opening 33 on the array substrate 5 are equal.

[0224] Thus, in this embodiment, the shapes and sizes of the first embedded structures 12 corresponding to different light-emitting units are the same.

[0225] In other embodiments, see Fig.17 and Fig.19 , along the direction perpendicular to the array substrate 5, the depth of the first light-transmitting opening 31 is not equal to the depth M3 of at least one of the second light-transmitting opening 32 and the third light-transmitting opening 33, that is, the depth M1 of the first light-transmitting opening 31 is not equal to the depth M2 of the second light-transmitting opening 32 and / or the depth M3 of the third light-transmitting opening 33.

[0226] Along the arrangement direction of the light-transmitting openings, the size of the orthographic projection of the first light-transmitting opening 31 on the array substrate 5 is not equal to the size of the orthographic projection of at least one of the second light-transmitting opening 32 and the third light-transmitting opening 33 on the array substrate 5, that is, the size W1 of the orthographic projection of the first light-transmitting opening 31 on the array substrate 5 is not equal to the size W2 of the orthographic projection of the second light-transmitting opening 32 on the array substrate 5 and / or the size W3 of the orthographic projection of the third light-transmitting opening 33 on the array substrate 5.

[0227] Thus, in this embodiment, the shapes and sizes of the first embedded structures 12 corresponding to different light-emitting units are different.

[0228] In summary, the present application increases the adhesion between the first encapsulation layer 10 and the isolation structure 1 by configuring the first encapsulation layer 10 to include a first embedded structure 12, and the first embedded structure 12 is located in the first opening 3 and in contact with the isolation structure 1, thereby increasing the stability of the first encapsulation layer 10 and further improving the quality of the display panel.

[0229] For some possible implementations, see again Figure 1-Figure 3 The present application also provides another display panel, which includes a first display area AB and a second display area AA at least partially surrounding the first display area AB. The display panel includes an array substrate 5, an isolation structure 1 and a first encapsulation layer 10.

[0230] The isolation structure 1 is located on one side of the array substrate 5 . At least a portion of the isolation structure 1 encloses a first opening 3 . The first opening 3 is located in the first display area AB.

[0231] A photosensitive device is arranged at a position corresponding to the first display area AB, for example, a camera may be arranged, and light passes through the first opening 3 to reach the camera, so as to realize the camera function of the display panel.

[0232] The first encapsulation layer 10 at least partially fills the first opening 3 and contacts at least part of the isolation structure 1 on one side close to the first opening 3 . A first embedded structure 12 is formed between the first encapsulation layer 10 and the isolation structure 1 on one side close to the first opening 3 .

[0233] The first encapsulation layer 10 can be formed by inkjet printing. The material of the first encapsulation layer 10 will flow into the first opening 3 to completely fill the first opening 3. The material of the first encapsulation layer 10 has a high light transmittance. Therefore, light can more easily pass through the first opening 3 to reach the position of the corresponding photosensitive device, thereby making the display panel have better transmittance.

[0234] The first encapsulation layer 10 will extend to contact the side of the isolation structure 1 close to the first opening 3, and form a first embedded structure 12 between the side of the isolation structure 1 close to the first opening 3. The first embedded structure 12 can increase the adhesion between the first encapsulation layer 10 and the isolation structure 1, thereby improving the stability of the first encapsulation layer 10, making it less likely for the first encapsulation layer 10 to fall off, and ultimately improving the quality of the display panel.

[0235] For some possible implementations, see again Figure 4 The present application also provides another display panel, which includes an array substrate 5, a pixel defining layer 6, an isolation structure 1 and a first encapsulation layer 10.

[0236] The pixel defining layer 6 is located on one side of the array substrate 5 , and the side of the pixel defining layer 6 away from the array substrate 5 includes a groove 62 .

[0237] The isolation structure 1 is located on a side of the pixel defining layer 6 away from the array substrate 5 . At least a portion of the isolation structure 1 encloses the first opening 3 , and at least a portion of the groove 62 is exposed in the first opening 3 .

[0238] The display panel also includes a light-emitting unit 4 at least partially located in the isolation opening 2 and a second packaging layer 11 located on the side of the light-emitting unit 4 away from the array substrate 5. The second packaging layer 11 includes a plurality of packaging units 111. At least part of the packaging units 111 extend from the side of the isolation structure 1 to the side of the isolation structure 1 away from the array substrate 5. The side of the isolation structure 1 is the surface of the isolation structure 1 facing the isolation opening 2.

[0239] The first encapsulation layer 10 is located on a side of the second encapsulation layer 11 away from the array substrate 5 . The first encapsulation layer 10 at least partially fills the first opening 3 and extends into the groove 62 .

[0240] When forming the pixel opening 61, a plurality of grooves 62 can be simultaneously formed on the side of the pixel defining layer 6 away from the array substrate 5, and at least one groove 62 is included at the position corresponding to the same first opening 3. In this way, the material of the first encapsulation layer 10 at the first opening 3 will flow into the groove 62, and finally the first encapsulation layer 10 filling the first opening 3 will be embedded in the groove 62, and a concave-convex structure will be formed between the first encapsulation layer 10 filling the first opening 3 and the side of the pixel defining layer 6 away from the array substrate 5, so that the adhesion between the first encapsulation layer 10 and the side of the pixel defining layer 6 away from the array substrate 5 can be further increased, and then the stability of the first encapsulation layer 10 can be further improved.

[0241] For some possible implementations, see Fig. 20 The present application also provides a method for preparing a display panel, the display panel comprising a first display area AB and a second display area AA at least partially surrounding the first display area AB, the method comprising:

[0242] S10: providing an array substrate 5.

[0243] The array substrate 5 may include a substrate and a plurality of drive units located on one side of the substrate, and each drive unit may include one or more semiconductor switch devices. The semiconductor switch device may be formed by the cooperation of a plurality of film layers in the array substrate 5, for example, the semiconductor switch device may be a thin film transistor formed by the cooperation of a plurality of film layers.

[0244] S11: forming an isolation structure 1 on one side of the array substrate 5, wherein at least a portion of the isolation structure 1 encloses an isolation opening 2 and a first opening 3, and the first opening 3 is located in the first display area AB.

[0245] See also Fig.21 A first electrode layer is formed on one side of the array substrate 5 , and the first electrode layer includes a plurality of first electrodes 7 that are spaced apart from each other.

[0246] See also Fig. 22 A pixel defining material layer 14 is formed on a side of the first electrode 7 away from the array substrate 5 .

[0247] See also Fig.23 , an isolation structure material layer 15 is formed on a side of the pixel defining material layer 14 away from the array substrate 5 .

[0248] See also Fig.24 , the isolation structure material layer 15 is patterned to form an isolation structure 1.

[0249] See also Fig.25, a pixel opening 61 and a groove 62 are formed on the pixel defining material layer 14 through a half-tone mask to form a pixel defining layer 6. In this way, the pixel defining layer 6 can be formed on the side of the first electrode 7 away from the array substrate 5, and the isolation structure 1 can be formed on the side of the pixel defining layer 6 away from the array substrate 5.

[0250] By using a halftone mask, a groove 62 can be formed in the first display area AB while a pixel opening 61 is formed in the second display area AA. Thus, there is no need to set up a special process for forming the groove 62, thereby reducing the cost of manufacturing the display panel.

[0251] A light-emitting unit 4 is prepared, and at least a portion of the light-emitting unit 4 is located in the isolation opening 2 .

[0252] See also Fig.26 , a light-emitting functional layer is formed in the isolation opening 2 , the light-emitting functional layer is broken at the isolation structure 1 , and finally a light-emitting portion 8 is formed in the isolation opening 2 .

[0253] See also Fig. 27 A second electrode layer is formed in the isolation opening 2 on the side of the light-emitting functional layer away from the array substrate 5 , the second electrode layer is broken at the isolation structure 1 , and finally a second electrode 9 is formed in the isolation opening 2 , and the second electrode 9 extends to be electrically connected to the isolation structure 1 .

[0254] S12: forming a first encapsulation layer 10, wherein the first encapsulation layer 10 at least partially fills the first opening 3 and contacts at least part of the isolation structure 1 on one side close to the first opening 3, and the first encapsulation layer 10 comprises a first embedded structure 12, wherein the first embedded structure 12 is located in the first opening 3 and contacts the isolation structure 1.

[0255] See also Fig.28 A second encapsulation layer 11 is formed on a side of the second electrode layer away from the array substrate 5. During the patterning process of the light-emitting unit 4, the second encapsulation layer 11 is disconnected at the isolation structure 1 to form an encapsulation unit 111. The encapsulation unit 111 can completely and independently encapsulate the corresponding light-emitting unit 4, thereby improving the display characteristics of the display panel.

[0256] Please see again Figure 4 A first packaging layer 10 is formed on the side of the second packaging layer 11 away from the array substrate 5. The first packaging layer 10 extends into the isolation opening 2. The first packaging layer 10 extending into the isolation opening 2 forms a first embedded structure 12. The first embedded structure 12 contacts the isolation structure 1. The first embedded structure 12 can increase the adhesion between the first packaging layer 10 and the isolation structure 1.

[0257] The material of the first encapsulation layer 10 at the first opening 3 will flow into the groove 62, and finally the first encapsulation layer 10 filling the first opening 3 will be embedded in the groove 62, and a concave-convex structure will be formed between the first encapsulation layer 10 filling the first opening 3 and the side of the pixel defining layer 6 away from the array substrate 5, and the concave-convex structure can increase the adhesion between the first encapsulation layer 10 and the pixel defining layer. Finally, the stability of the first encapsulation layer 10 can be improved, so that the first encapsulation layer 10 is not prone to falling off, etc., thereby improving the quality of the display panel formed by this method.

[0258] In some possible implementations, the present application further provides an electronic device, the electronic device comprising the display panel of the present application, or comprising a display panel prepared by the method for preparing a display panel of the present application. The electronic device may include a device with image processing capabilities, such as a server, a personal computer, a notebook computer, etc. Since the electronic device comprises the display panel of the present application, the quality of the electronic device is higher.

[0259] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0260] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: An array substrate; An isolation structure located at one side of the array substrate, at least a portion of the isolation structure encloses a first opening; a first encapsulation layer, the first encapsulation layer at least partially filling the first opening and contacting at least part of a side of the isolation structure close to the first opening, the first encapsulation layer comprising a first embedded structure, the first embedded structure being located in the first opening and contacting the isolation structure; The isolation structure comprises a third isolation portion, a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the array substrate, and the first embedded structure is in contact with side surfaces of the first isolation portion and the second isolation portion; The first embedded structure includes a first embedded portion or a second embedded portion protruding in a direction close to the isolation structure, and the first embedded structure also includes a first recessed portion and a second recessed portion recessed in a direction away from the isolation structure; The first embedded portion contacts the first isolation portion, the second isolation portion is embedded in the first recessed portion, and the third isolation portion is embedded in the second recessed portion.

2. The display panel according to claim 1, characterized in that: Along a direction perpendicular to the array substrate, a thickness of the first embedded portion is equal to a height of the first isolation portion.

3. The display panel according to claim 1, characterized in that: The first recessed portion is located at a side of the first embedded portion away from the array substrate; The side of the first recessed portion close to the array substrate is coplanar with the side of the first embedded portion away from the array substrate; along the direction perpendicular to the array substrate, the height of the first recessed portion is equal to the height of the second isolation portion.

4. The display panel according to claim 1, characterized in that: The cross section of the first isolation portion along the thickness direction of the array substrate is a regular trapezoid; The orthographic projection of the first isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate; The orthographic projection of a side of the first isolating portion away from the array substrate on the array substrate is located within the orthographic projection of the second isolating portion on the array substrate.

5. The display panel according to claim 3, characterized in that: The orthographic projection shape of the first recessed portion on the array substrate is the same as the orthographic projection shape of the first embedded portion on the array substrate; and / or, the orthographic projection shape of the first recessed portion on the array substrate is the same as the orthographic projection shape of the first opening on the array substrate; And / or, the geometric center of the orthographic projection of the first recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the first embedded portion on the array substrate; And / or, the geometric center of the orthographic projection of the first recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the first opening on the array substrate; And / or, the orthographic projection of the first recessed portion on the array substrate is located within the orthographic projection of the first embedded portion on the array substrate.

6. The display panel according to claim 1, characterized in that: The orthographic projection of the first isolation portion on the array substrate is located within the orthographic projection of the third isolation portion on the array substrate, and the first embedded structure contacts side surfaces of the first isolation portion, the second isolation portion, and the third isolation portion.

7. The display panel according to claim 6, characterized in that: Along a direction perpendicular to the array substrate, a height of the second recessed portion is equal to a height of the third isolation portion; The second embedded portion is in contact with the first isolation portion; Along a direction perpendicular to the array substrate, a thickness of the second embedded portion is equal to a height of the first isolation portion; The second embedded portion is located at a side of the second recessed portion away from the array substrate; A side of the second embedded portion close to the array substrate is coplanar with a side of the second recessed portion away from the array substrate.

8. The display panel according to claim 7, characterized in that: At least part of the isolation structure encloses an isolation opening, and the first embedded structure includes a third recessed portion recessed in a direction away from the isolation opening; Along a direction perpendicular to the array substrate, a height of the third recessed portion is equal to a height of the second isolation portion; The second isolation portion is embedded in the third recessed portion; The third recessed portion is located at a side of the second embedded portion away from the array substrate; A side of the third recessed portion close to the array substrate is coplanar with a side of the second embedded portion away from the array substrate.

9. The display panel according to claim 8, characterized in that: The cross section of the first isolation portion along the thickness direction of the array substrate is a regular trapezoid; The orthographic projection of the first isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate; The orthographic projection of the third isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate; The orthographic projection of the third recessed portion on the array substrate is located within the orthographic projection of the second recessed portion on the array substrate; The orthographic projection of the third recessed portion on the array substrate is located within the orthographic projection of the second embedded portion on the array substrate; The orthographic projection of the second recessed portion on the array substrate is located within the orthographic projection of the second embedded portion on the array substrate; The orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the third recessed portion on the array substrate.

10. The display panel according to claim 8, characterized in that: The orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the second embedded portion on the array substrate; And / or, the orthographic projection shape of the second recessed portion on the array substrate is the same as the orthographic projection shape of the first opening on the array substrate; and / or, the geometric center of the orthographic projection of the second recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the third recessed portion on the array substrate; And / or, the geometric center of the orthographic projection of the second recessed portion on the array substrate coincides with the geometric center of the orthographic projection of the second embedded portion on the array substrate; And / or, a geometric center of an orthographic projection of the second recessed portion on the array substrate coincides with a geometric center of an orthographic projection of the first opening on the array substrate.

11. The display panel according to claim 1, characterized in that: At least a portion of the isolation structure encloses an isolation opening, and the display panel further includes a light emitting unit at least partially located in the isolation opening; The orthographic projection of the isolation opening on the array substrate is outside the orthographic projection of the first opening on the array substrate; The isolation opening and the first opening are arranged at intervals; The light emitting unit includes a first electrode, a light emitting portion, and a second electrode which are at least partially located in the isolation opening and are sequentially stacked in a direction away from the array substrate, and the second electrode is electrically connected to the isolation structure.

12. The display panel according to claim 11, characterized in that: The display panel further comprises a second encapsulation layer located on a side of the light emitting unit away from the array substrate, the second encapsulation layer comprising a plurality of encapsulation units, at least some of which are located in the isolation opening and extend from a side of the isolation structure to a side of the isolation structure away from the array substrate; The display panel further comprises a third packaging layer located on a side of the first packaging layer away from the array substrate; The materials of the third encapsulation layer all include inorganic materials; And / or, the material of the first encapsulation layer includes organic material.

13. The display panel according to claim 11, characterized in that: The display panel further comprises a second encapsulation layer located at a side of the light emitting unit away from the array substrate, the second encapsulation layer comprises a plurality of encapsulation units, the first encapsulation layer further comprises a second embedded structure, and the second embedded structure is located in the isolation opening; The second embedded structure is in contact with a side of the packaging unit away from the array substrate; The distance between the side of the first embedded structure away from the array substrate and the array substrate is equal to the distance between the side of the second embedded structure away from the array substrate and the array substrate; Along a direction away from the array substrate, a thickness of the first embedded structure is smaller than a thickness of the second embedded structure.

14. The display panel according to claim 13, characterized in that: The first encapsulation layer further includes a base located on a side of the first embedded structure and the second embedded structure away from the array substrate, and the base is integrally formed with the first embedded structure and the second embedded structure.

15. The display panel according to claim 12, characterized in that: At least a portion of the first encapsulation layer is located on a side of the second encapsulation layer away from the array substrate; The materials of the second encapsulation layer all include inorganic materials; Adjacent packaging units are arranged at intervals on a side of the isolation structure away from the array substrate; A gap is formed between the packaging unit located at a side of the isolation structure away from the array substrate and the side of the isolation structure away from the array substrate; The first encapsulation layer fills the gap.

16. The display panel according to claim 1, characterized in that: The display panel further includes a pixel defining layer located at one side of the array substrate, the isolation structure is located at a side of the pixel defining layer away from the array substrate, and the first encapsulation layer filling the first opening is in contact with the side of the pixel defining layer away from the array substrate; The pixel definition layer includes a plurality of pixel openings; At least a portion of the isolation structure encloses an isolation opening, and an orthographic projection of the pixel opening on the array substrate is located within an orthographic projection of the isolation opening on the array substrate.

17. The display panel according to claim 16, characterized in that: The pixel opening comprises a first pixel opening and a second pixel opening, and along a direction perpendicular to the array substrate, a depth of the first pixel opening is equal to a depth of the second pixel opening; and / or, along the arrangement direction of the pixel openings, the size of the orthographic projection of the first pixel openings on the array substrate is equal to the size of the orthographic projection of the second pixel openings on the array substrate; And / or, the pixel opening further includes a third pixel opening, and along a direction perpendicular to the array substrate, the depth of the third pixel opening is equal to the depth of the first pixel opening and the depth of the second pixel opening; And / or, along the arrangement direction of the pixel openings, the size of the orthographic projection of the first pixel opening on the array substrate is equal to the sizes of the orthographic projections of the second pixel opening and the third pixel opening on the array substrate; And / or, the isolation opening comprises a first isolation opening and a second isolation opening, and along a direction perpendicular to the array substrate, the first isolation opening and the second isolation opening have the same depth; and / or, along the arrangement direction of the isolation openings, the size of the orthographic projection of the first isolation openings on the array substrate is equal to the size of the orthographic projection of the second isolation openings on the array substrate; And / or, the isolation opening further includes a third isolation opening, and along a direction perpendicular to the array substrate, the depth of the third isolation opening is equal to the depths of the first isolation opening and the second isolation opening; And / or, along the arrangement direction of the isolation openings, the size of the orthographic projection of the first isolation opening on the array substrate is equal to the sizes of the orthographic projections of the second isolation opening and the third isolation opening on the array substrate.

18. The display panel according to claim 1, characterized in that: The first opening includes a light-transmitting opening, and the light-transmitting opening includes a first light-transmitting opening and a second light-transmitting opening, and along a direction perpendicular to the array substrate, the first light-transmitting opening and the second light-transmitting opening have the same depth; And / or, along the arrangement direction of the light-transmitting openings, the size of the orthographic projection of the first light-transmitting openings on the array substrate is equal to the size of the orthographic projection of the second light-transmitting openings on the array substrate; And / or, the light-transmitting opening further includes a third light-transmitting opening, and along a direction perpendicular to the array substrate, the depth of the third light-transmitting opening is equal to the depths of the first light-transmitting opening and the second light-transmitting opening; And / or, along the arrangement direction of the light-transmitting openings, the size of the orthographic projection of the first light-transmitting opening on the array substrate is equal to the sizes of the orthographic projections of the second light-transmitting opening and the third light-transmitting opening on the array substrate.

19. The display panel according to claim 16, characterized in that: The pixel opening comprises a first pixel opening and a second pixel opening, and along a direction perpendicular to the array substrate, the depths of the first pixel opening and the second pixel opening are unequal; and / or, along the arrangement direction of the pixel openings, the size of the orthographic projection of the first pixel openings on the array substrate is unequal to the size of the orthographic projection of the second pixel openings on the array substrate; And / or, the pixel opening further includes a third pixel opening, and along a direction perpendicular to the array substrate, a depth of the third pixel opening is not equal to a depth of at least one of the first pixel opening and the second pixel opening; and / or, along the arrangement direction of the pixel openings, a size of an orthographic projection of the first pixel opening on the array substrate is not equal to a size of an orthographic projection of at least one of the second pixel opening and the third pixel opening on the array substrate; And / or, the isolation opening comprises a first isolation opening and a second isolation opening, and along a direction perpendicular to the array substrate, the first isolation opening and the second isolation opening have different depths; and / or, along the arrangement direction of the isolation openings, the size of the orthographic projection of the first isolation openings on the array substrate is unequal to the size of the orthographic projection of the second isolation openings on the array substrate; And / or, the isolation opening further includes a third isolation opening, and along a direction perpendicular to the array substrate, the depth of the third isolation opening is not equal to the depth of at least one of the first isolation opening and the second isolation opening; And / or, along the arrangement direction of the isolation openings, the size of the orthographic projection of the first isolation opening on the array substrate is not equal to the size of the orthographic projection of at least one of the second isolation opening and the third isolation opening on the array substrate.

20. The display panel according to claim 1, characterized in that: The first opening includes a light-transmitting opening, and the light-transmitting opening includes a first light-transmitting opening and a second light-transmitting opening, and along a direction perpendicular to the array substrate, the depths of the first light-transmitting opening and the second light-transmitting opening are not equal; and / or, along the arrangement direction of the light-transmitting openings, the size of the orthographic projection of the first light-transmitting openings on the array substrate and the size of the orthographic projection of the second light-transmitting openings on the array substrate are not equal; And / or, the light-transmitting opening further includes a third light-transmitting opening, and along a direction perpendicular to the array substrate, a depth of the third light-transmitting opening is not equal to a depth of at least one of the first light-transmitting opening and the second light-transmitting opening; And / or, along the arrangement direction of the light-transmitting openings, the size of the orthographic projection of the first light-transmitting opening on the array substrate is not equal to the size of the orthographic projection of at least one of the second light-transmitting opening and the third light-transmitting opening on the array substrate.

21. The display panel according to claim 16 or 19, characterized in that: The pixel defining layer comprises a groove on a side away from the array substrate, at least a portion of the groove is exposed in the first opening, and the first encapsulation layer extends into the groove.

22. The display panel according to claim 21, characterized in that: The number of the grooves is multiple; The orthographic projection of the groove on the array substrate is located within the orthographic projection of the first opening on the array substrate; The orthographic projection shape of the groove on the array substrate includes a circle or a polygon; And / or, the width of the orthographic projection of the groove on the array substrate is in the range of 2 μm-10 μm; And / or, the spacing between orthographic projections of adjacent grooves on the array substrate is in a range of 2 μm-5 μm.

23. A display panel, characterized in that: The display panel includes a first display area and a second display area at least partially surrounding the first display area, and the display panel includes: An array substrate; An isolation structure located at one side of the array substrate, at least a portion of the isolation structure encloses a first opening, and the first opening is located in the first display area; a first encapsulation layer, the first encapsulation layer at least partially filling the first opening and contacting at least part of a side of the isolation structure close to the first opening; the first encapsulation layer includes a first embedded structure, the first embedded structure is located in the first opening and contacting the isolation structure; The isolation structure comprises a third isolation portion, a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the array substrate, and the first embedded structure is in contact with side surfaces of the first isolation portion and the second isolation portion; The first embedded structure includes a first embedded portion or a second embedded portion protruding in a direction close to the isolation structure, and the first embedded structure also includes a first recessed portion and a second recessed portion recessed in a direction away from the isolation structure; The first embedded portion contacts the first isolation portion, the second isolation portion is embedded in the first recessed portion, and the third isolation portion is embedded in the second recessed portion.

24. A display panel, characterized in that: The display panel comprises: An array substrate; A pixel defining layer located at one side of the array substrate, wherein a side of the pixel defining layer away from the array substrate comprises a groove; an isolation structure located at a side of the pixel defining layer away from the array substrate, wherein at least a portion of the isolation structure encloses a first opening, and at least a portion of the groove is exposed in the first opening; a first encapsulation layer, the first encapsulation layer at least partially filling the first opening and extending into the groove; Wherein, the first encapsulation layer includes a first embedded structure, the first embedded structure is located in the first opening and the groove and contacts the isolation structure; The isolation structure comprises a third isolation portion, a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the array substrate, and the first embedded structure is in contact with side surfaces of the first isolation portion and the second isolation portion; The first embedded structure includes a first embedded portion or a second embedded portion protruding in a direction close to the isolation structure, and the first embedded structure also includes a first recessed portion and a second recessed portion recessed in a direction away from the isolation structure; The first embedded portion contacts the first isolation portion, the second isolation portion is embedded in the first recessed portion, and the third isolation portion is embedded in the second recessed portion.

25. A method for preparing a display panel, characterized in that: The method comprises: Providing an array substrate; An isolation structure is formed on one side of the array substrate, wherein at least a portion of the isolation structure encloses a first opening; A first encapsulation layer is formed, the first encapsulation layer at least partially fills the first opening and contacts at least part of the isolation structure on one side close to the first opening, the first encapsulation layer includes a first embedded structure, the first embedded structure is located in the first opening and contacts the isolation structure; the isolation structure includes a third isolation part, a first isolation part and a second isolation part stacked in sequence in a direction away from the array substrate, the first embedded structure contacts the side surfaces of the first isolation part and the second isolation part; the first embedded structure includes a first embedded part or a second embedded part protruding in a direction close to the isolation structure, the first embedded structure also includes a first recessed part and a second recessed part recessed in a direction away from the isolation structure; the first embedded part contacts the first isolation part, the second isolation part is embedded in the first recessed part, and the third isolation part is embedded in the second recessed part.

26. The method for preparing a display panel according to claim 25, characterized in that: The step of forming an isolation structure on one side of the array substrate includes: forming a first electrode layer on one side of the array substrate, wherein the first electrode layer includes a plurality of first electrodes arranged at intervals; forming a pixel defining layer on a side of the first electrode away from the array substrate, wherein the pixel defining layer includes a pixel opening and a groove; forming an isolation structure on a side of the pixel defining layer away from the array substrate; The step of forming a pixel defining layer on a side of the first electrode away from the array substrate comprises: forming a pixel defining material layer on a side of the first electrode away from the array substrate; A pixel opening and a groove are formed on the pixel defining material layer through a half-tone mask to form a pixel defining layer.

27. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 24, or comprises a display panel prepared by the method for preparing a display panel according to claim 25 or 26.

Images