A warped wafer reflow heating device

Abstract

The invention relates to the technical field of semiconductor equipment, and discloses a warped wafer reflow heating device, comprising a heating upper cover, a spring pressure block structure, and a lower cavity structure. A first pressure ring and a second pressure ring are arranged at the bottom of the heating upper cover, the first pressure ring is located on the inner side of the second pressure ring, and the bottom of the first pressure ring and the second pressure ring are both provided with spring pressure block structures, the spring pressure block structure is used to squeeze the warped wafer, the spring pressure block structure comprises an elastic clamping component, an overload buffer component, a loading component and a guide pin, the guide pins are respectively located in the first pressure ring and the second pressure ring, and the elastic clamping component is located at the bottom of the guide pin inner cavity; when encountering a wafer with a large degree of warping, the elastic clamping component is compressed to a certain extent, in order to prevent the continuous downward pressure of the heating upper cover, resulting in excessive elastic potential energy condensed by the elastic clamping component, thereby causing damage to the warped wafer, to avoid that when the wafer is severely deformed, the wafer will be crushed during the sealing process of the upper and lower covers, which greatly affects the yield.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor equipment, and in particular to a warped wafer reflow heating device. Background Art

[0002] At present, the reflow process is an important process in the field of electronic manufacturing, mainly used for welding some tiny components. The reflow process is also used in the semiconductor advanced packaging process to process the pins of the formed chip. The traditional reflow process uses flux, which requires pre-coating of flux. After the reflow process, the flux needs to be cleaned. The process is complicated and the production cost is high. Nowadays, the semiconductor advanced packaging process uses a more advanced formic acid reflow process, which does not require spin coating and flux cleaning. It has the advantages of simple process, low cost and high production capacity. After undergoing multiple process steps, a large amount of stress will inevitably accumulate on the wafer, causing partial or complete warping of the wafer.

[0003] The reflow heating process requires the wafer to be placed on the lower plate of the heating chamber, the upper and lower plates are sealed, and then heated. However, when the wafer is severely deformed, the wafer will be crushed during the sealing process of the upper and lower covers, greatly affecting the yield; at the same time, due to the warping of the wafer, the heating of the wafer will be uneven, thus affecting the yield of the wafer. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a warped wafer reflow heating device, which has the advantages of compressing the elastic clamping component to a certain extent when encountering a wafer with a large degree of warping, so as to prevent the continuous downward pressure of the heated upper cover, causing the elastic potential energy condensed by the elastic clamping component to be too large, thereby causing damage to the warped wafer, and avoiding the problem that when the wafer is severely deformed, the wafer will be crushed during the sealing process of the upper and lower covers, which greatly affects the yield. It solves the problem that when the wafer is severely deformed, the wafer will be crushed during the sealing process of the upper and lower covers, which greatly affects the yield; at the same time, due to the warping of the wafer, the heating wafer will be heated unevenly, thereby affecting the yield of the wafer.

[0005] In order to solve the above-mentioned problem that when the wafer is severely deformed, the wafer will be crushed during the sealing process of the upper and lower covers, which greatly affects the yield; at the same time, due to the warping of the wafer, the heating of the wafer will cause uneven heating, thus affecting the yield of the wafer, the present invention provides the following technical solutions: a warped wafer reflow heating device, comprising a heating upper cover, a spring pressure block structure, and a lower cavity structure, the bottom of the heating upper cover is provided with a first pressure ring and a second pressure ring, the first pressure ring is located on the inner side of the second pressure ring, the bottom of the first pressure ring and the second pressure ring are both provided with a spring pressure block structure, the spring pressure block structure is used to squeeze the warped wafer, the spring pressure block structure includes an elastic clamping component, an overload buffer component Parts, loading components and guide pins, the guide pins are respectively located in the first pressure ring and the second pressure ring, the elastic clamping component is located at the bottom of the guide pin inner cavity, the overload buffer component is located above the elastic clamping component, and the loading component is located on the other side of the overload buffer component; an upper cover cavity is arranged above the heating upper cover, and a driving screw is arranged above the upper cover cavity; a lower cavity structure is arranged at the bottom of the heating upper cover, and a vacuum adsorption component is arranged inside the upper part of the lower cavity structure; the upper cover cavity is driven by the driving screw to drive the upper cover cavity to move toward the direction of the lower cavity structure, and the spring pressure block structure cooperates with the lower cavity structure to fix the warped wafer.

[0006] Preferably, a downward pressing screw rod is arranged in the middle of the lower surface of the upper cover cavity, and the downward pressing screw rod is connected between the heating upper cover and the upper cover cavity. An electric heating wire is arranged in the heating upper cover, and an insulating plate is arranged above the electric heating wire. The upper cover cavity covers the heating upper cover, and a sealing ring is arranged on the lower side surface of the upper cover cavity.

[0007] Preferably, the spring pressure block structure also includes a connecting block, which is respectively installed on the lower surfaces of the first pressure ring and the second pressure ring, the guide pin is located in the middle of the connecting block and extends inside the first pressure ring and the second pressure ring, and the elastic clamping assembly is located at the bottom of the guide pin inner cavity and extends below the guide pin.

[0008] Preferably, the elastic clamping assembly includes a lower pressure rod, the lower pressure rod is located inside the guide pin, a clamping spring is arranged around the lower pressure rod, a clamping block is arranged at the bottom of the lower pressure rod, and one end of the clamping spring is connected to the clamping block.

[0009] Preferably, the overload buffer assembly includes an overload limit block, which is respectively located in the middle of the inner cavity on both sides of the guide pin, an overload cavity is provided inside the side wall of the guide pin, the overload limit block is slidably arranged inside the overload cavity, an overload spring is provided at the tail of the overload limit block, the overload spring is located between the overload limit block and the overload cavity, and the tail of the compression spring is arranged on one side of the overload limit block.

[0010] Preferably, an overload ring is provided at the other end of the compression spring, a wedge surface is provided on the inner side of the overload limit block, the overload ring is arranged opposite to the wedge surface on the overload limit block, a protective tube is provided on the outer side of the overload ring, and the protective tube is located on the outer side of the compression spring.

[0011] Preferably, the loading assembly includes a loading fixing rod, one end of the loading fixing rod is fixed to the bottom of the guide pin inner cavity, the other end of the loading fixing rod is located on one side of the overload buffer assembly, a loading spring is arranged around the bottom of the loading fixing rod, one end of the loading spring is fixed to the bottom of the guide pin inner cavity, a loading plate is arranged at the other end of the loading spring, a hole is arranged in the middle of the loading plate, and the loading plate is sleeved on the loading fixing rod.

[0012] Preferably, the lower cavity structure includes a support plate, which is located directly below the heating upper cover, a lower plate body is arranged below the support plate, the lower plate body matches the upper cover cavity, a sealing ring is arranged on the upper surface of the peripheral side of the lower plate body, a push rod is arranged at the bottom of the support plate, a guide column is arranged on the peripheral side of the push rod, a bellows is arranged on the outer side of the guide column, and the bellows is arranged between the support plate and the lower plate body.

[0013] Preferably, the vacuum adsorption assembly is located in the middle of the upper surface of the support plate, and the vacuum adsorption assembly includes a vacuum suction cup, and the vacuum suction cup is located above the support plate. The bottom of the vacuum suction cup is connected to a vacuum duct, and a vacuum joint is provided at the other end of the vacuum duct, and the vacuum joint is externally connected to a vacuum pump.

[0014] Compared with the prior art, the present invention provides a warped wafer reflow heating device, which has the following beneficial effects:

[0015] 1. The warped wafer reflow heating device drives the upper cover cavity to descend by driving the screw rod, and the upper cover cavity drives the heated upper cover to move downward together, so that the spring pressure block structure at the bottom of the heated upper cover is pressed down on the warped wafer. In the process of the spring pressure block structure pressing down the warped wafer, the elastic pressing component in the spring pressure block structure first contacts the warped wafer. As the heated upper cover continues to move downward, the elastic pressing component is compressed along the guide pin. When encountering a wafer with a large degree of warping, the elastic pressing component is compressed to a certain extent. In order to prevent the continuous downward pressure of the heated upper cover, the elastic potential energy condensed by the elastic pressing component is too large, thereby damaging the warped wafer, and to avoid that when the wafer is severely deformed, the wafer will be crushed during the sealing process of the upper and lower covers, which greatly affects the yield.

[0016] 2. The warped wafer reflow heating device, at this time, the elastic clamping component condenses a large elastic potential energy, and its tail pushes the overload buffer component to push the overload buffer component to both sides. In this process, the elastic clamping component will be further compressed and condense a larger elastic potential energy. Then, after the overload buffer component is triggered, the elastic clamping component passes through the overload buffer component and contacts the loading component. At this time, after the heated upper cover heats the wafer for a period of time, the deformation of the warped wafer is alleviated, and the brittleness of the warped wafer is reduced at high temperature. Under the action of the loading component, a greater pressure can be used to press down the warped wafer. The warped wafer is deformed and fixed by the suction of the vacuum adsorption component and the pressure of the spring pressure block structure, and the heating process is performed, which solves the problem of uneven heating of the heated wafer due to the warping of the wafer, and therefore does not affect the yield of the wafer.

[0017] 3. The warped wafer reflow heating device is triggered by the overload buffer component, and the elastic clamping component passes through the overload buffer component and contacts the loading component. At this time, after the heated upper cover heats the wafer for a period of time, the deformation of the warped wafer is alleviated, and the brittleness of the warped wafer is reduced at high temperature. Under the action of the loading component, a greater pressure can be used to press down the warped wafer. The warped wafer is deformed and fixed by the suction force of the vacuum adsorption component and the pressure of the spring pressure block structure, and the heating process is carried out to prevent the wafer from moving during the heating process, which makes it impossible to locate the position where the wafer is placed when the subsequent external straight robot takes down the wafer.

[0018] 4. The warped wafer reflow heating device has a loading and fixing rod arranged at the bottom of the inner cavity of the guide pin. After the elastic clamping assembly passes through the overload buffer assembly, the loading and fixing rod extends into the overload ring in the elastic clamping assembly, and the overload ring contacts the loading plate. At this time, the loading and fixing rod is located between the clamping spring and the loading spring, which can prevent the clamping spring and the loading spring from shaking after being further compressed, making the spring pressure block structure unstable when pressing down the warped wafer; when the clamping spring and the loading spring continue to be compressed, the spring pressure block structure presses down and fixes the warped wafer with greater elastic potential energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall internal cross-sectional plan structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the cross-sectional plan structure of the heating upper cover and the internal structure of the upper cover cavity of the present invention;

[0021] Figure 3 It is a schematic diagram of the internal cross-sectional plan structure of the lower cavity structure of the present invention;

[0022] Figure 4 This is a schematic diagram of the planar structure of the heating upper cover of the present invention when viewed from above;

[0023] Figure 5 It is a schematic diagram of the internal cross-sectional three-dimensional structure of the spring pressure block structure of the present invention;

[0024] Figure 6 It is a schematic diagram of the internal cross-sectional plan structure of the spring pressure block structure of the present invention;

[0025] Figure 7 It is a schematic diagram of the top plan structure of the support plate of the present invention;

[0026] Figure 8 It is a schematic diagram of the internal cross-sectional plan structure of the support plate of the present invention.

[0027] In the figure: 1. heating upper cover; 11. upper cover cavity; 12. lower pressure screw rod; 13. electric heating wire; 3. lower cavity structure; 31. support plate; 32. lower plate body; 33. push rod; 34. guide column; 35. bellows; 4. first pressure ring; 5. second pressure ring; 6. spring pressure block structure; 61. elastic clamping assembly; 611. lower pressure rod; 612. compression spring; 613. clamping block; 614. overload ring; 615. protective tube; 62. overload buffer assembly; 621. overload limit block; 622. overload spring; 63. loading assembly; 631. loading fixing rod; 632. loading spring; 633. loading plate; 64. guide pin; 641. overload cavity; 65. connecting block; 7. vacuum adsorption assembly; 71. vacuum suction cup; 72. vacuum conduit; 73. vacuum joint. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-Figure 8A warped wafer reflow heating device comprises a heating upper cover 1, a spring pressure block structure 6, and a lower cavity structure 3. A first pressure ring 4 and a second pressure ring 5 are arranged at the bottom of the heating upper cover 1. The first pressure ring 4 is located inside the second pressure ring 5. The first pressure ring 4 and the second pressure ring 5 are both provided with a spring pressure block structure 6 at the bottom. The spring pressure block structure 6 is used to squeeze the warped wafer. The spring pressure block structure 6 comprises an elastic clamping component 61, an overload buffer component 62, a loading component 63 and a guide pin 64. The guide pin 64 is respectively located in the first pressure ring 4 and the second pressure ring 5. The elastic clamping component 61 is located at The guide pin 64 is at the bottom of the inner cavity, the overload buffer component 62 is located above the elastic clamping component 61, and the loading component 63 is located on the other side of the overload buffer component 62; an upper cover cavity 11 is arranged above the heating upper cover 1, and a driving screw is arranged above the upper cover cavity 11; a lower cavity structure 3 is arranged at the bottom of the heating upper cover 1, and a vacuum adsorption component 7 is arranged inside the upper part of the lower cavity structure 3; the upper cover cavity 11 is driven by the driving screw to drive the upper cover cavity 11 to move toward the direction of the lower cavity structure 3, and the spring pressure block structure 6 cooperates with the lower cavity structure 3 to fix the warped wafer.

[0030] When in use, the warped wafer is placed on top of the vacuum adsorption component 7 inside the lower cavity structure 3 by an external manipulator. At this time, the vacuum adsorption component 7 adsorbs the warped wafer to achieve preliminary fixation, and then the upper cover cavity 11 is driven and lowered by the driving screw, and the upper cover cavity 11 drives the heating upper cover 1 to move downward together, so that the spring pressure block structure 6 at the bottom of the heating upper cover 1 is pressed down on the warped wafer. In the process of the spring pressure block structure 6 pressing down the warped wafer, the elastic clamping component 61 in the spring pressure block structure 6 first contacts the warped wafer. As the heating upper cover 1 continues to move downward, the elastic clamping component 61 is compressed along the guide pin 64. When encountering a wafer with a large degree of warping, the elastic clamping component 61 is compressed to a certain extent. In order to prevent the continuous downward pressure of the heating upper cover 1, causing the elastic potential energy condensed by the elastic clamping component 61 to be too large, thereby causing damage to the warped wafer, at this time, the elastic clamping component 61 condenses a large elastic potential energy, and its tail pushes the overload buffer component 62 to push the overload buffer The component 62 is pushed to both sides. During this process, the elastic clamping component 61 will be further compressed and condense greater elastic potential energy. Then, after the overload buffer component 62 is triggered, the elastic clamping component 61 passes through the overload buffer component 62 and contacts the loading component 63. At this time, after the heating cover 1 heats the wafer for a period of time, the deformation of the warped wafer is alleviated, and the brittleness of the warped wafer is reduced at high temperature. Under the action of the loading component 63, a greater pressure can be used to press the warped wafer down. The warped wafer is deformed and fixed by the suction of the vacuum adsorption component 7 and the pressure of the spring pressure block structure 6, and the heating process is carried out. When the process is completed, the heating cover 1 rises upward through the drive of the driving screw. At this time, the spring pressure block structure 6 begins to recover until it slowly leaves the wafer surface. At this time, the vacuum is disconnected, and the external robot takes out the wafer after the heating process and carries out the next process.

[0031] Furthermore, a pressing screw rod 12 is provided in the middle of the lower surface of the upper cover cavity 11, and the pressing screw rod 12 is connected between the heating upper cover 1 and the upper cover cavity 11. An electric heating wire 13 is provided in the heating upper cover 1, and a heat insulation plate is provided above the electric heating wire 13. The upper cover cavity 11 is covered above the heating upper cover 1, and a sealing ring is provided on the lower surface of the circumference of the upper cover cavity 11; through the pressing screw rod 12 provided on the lower surface of the upper cover cavity 11, after the warped wafer has been subjected to a period of heating process treatment, the degree of warping is alleviated. At this time, the pressing screw rod 12 drives the heating upper cover 1 to move toward the wafer so as to better perform the heating process treatment on the wafer. During the heating treatment, the electric heating wire 13 provided in the heating upper cover 1 heats the wafer, and at the same time, the closed space formed by the upper cover cavity 11 and the lower cavity structure 3 prevents heat loss.

[0032] Furthermore, the spring pressure block structure 6 also includes a connecting block 65, and the connecting block 65 is respectively installed on the lower surface of the first pressure ring 4 and the second pressure ring 5, the guide pin 64 is located in the middle of the connecting block 65, and extends inside the first pressure ring 4 and the second pressure ring 5, and the elastic clamping component 61 is located at the bottom of the inner cavity of the guide pin 64 and extends below the guide pin 64; the spring pressure block structure 6 is respectively installed inside the first pressure ring 4 and the second pressure ring 5 through the connecting block 65 and the guide pin 64, and after the elastic clamping component 61 contacts the warped wafer, the elastic clamping component 61 is compressed toward the inside of the guide pin 64.

[0033] Furthermore, the elastic clamping assembly 61 includes a lower pressure rod 611, which is located inside the guide pin 64, and a clamping spring 612 is arranged around the lower pressure rod 611, and a clamping block 613 is arranged at the bottom of the lower pressure rod 611, and one end of the clamping spring 612 is connected to the clamping block 613; through the lower pressure rod 611 and under the action of the clamping spring 612, after the clamping block 613 at the bottom of the lower pressure rod 611 contacts the warped wafer, the clamping block 613 pushes the lower pressure rod 611 to move upward and compresses the clamping spring 612, so that the clamping spring 612 is compressed, and the elastic potential energy of the clamping spring 612 presses the warped wafer downward through the clamping block 613, so that the warped wafer can be more firmly fixed on the bottom of the heated upper cover 1.

[0034] Furthermore, the overload buffer assembly 62 includes an overload limit block 621, which is respectively located in the middle of the inner cavity on both sides of the guide pin 64, and an overload cavity 641 is arranged inside the side wall of the guide pin 64. The overload limit block 621 is slidably arranged inside the overload cavity 641, and an overload spring 622 is arranged at the tail of the overload limit block 621. The overload spring 622 is located between the overload limit block 621 and the overload cavity 641, and the tail of the compression spring 612 is arranged on one side of the overload limit block 621; through the overload limit block 621 arranged in the middle of the inner cavity on both sides of the guide pin 64, after the elastic compression assembly 61 is over-compressed, the elastic compression assembly 61 squeezes the overload limit block 621, so that the overload limit block 621 pushes the overload spring 622 to the side, so that the overload spring 622 is compressed in the overload cavity 641.

[0035] Furthermore, an overload ring 614 is provided at the other end of the compression spring 612, a wedge-shaped surface is provided on the inner side of the overload limit block 621, the overload ring 614 is arranged opposite to the wedge-shaped surface on the overload limit block 621, a protective tube 615 is provided on the outer side of the overload ring 614, and the protective tube 615 is located on the outer side of the compression spring 612; through the overload ring 614 provided at the tail of the compression spring 612, when the compression spring 612 is compressed to a certain extent and its elastic potential energy is needed, the overload ring 614 pushes the wedge-shaped surface on the overload limit block 621, so that the overload limit block 621 moves to both sides and compresses the overload spring 622. At this time, the elastic compression component 61 is In order to be able to completely push the overload limit block 621 into the overload cavity 641, the elastic clamping component 61 continues to compress until the protective tube 615 outside the overload ring 614 is no longer obstructed by the overload limit block 621, and the elastic clamping component 61 continues to move toward the loading component 63 above the overload buffer component 62, so that the elastic clamping component 61 is slowly released to avoid crushing the warped wafer. As the heated upper cover 1 continues to heat the warped wafer, the warped wafer can withstand greater pressure to complete the recovery of the warped wafer deformation. At this time, the elastic clamping component 61 and the loading component 63 are compressed at the same time, so that their elastic potential energy becomes larger, thereby pressing down on the warped wafer to restore the deformation.

[0036] Furthermore, the loading assembly 63 includes a loading fixing rod 631, one end of which is fixed to the bottom of the inner cavity of the guide pin 64, and the other end of which is located on one side of the overload buffer assembly 62. A loading spring 632 is arranged on the peripheral side of the bottom of the loading fixing rod 631, one end of which is fixed to the bottom of the inner cavity of the guide pin 64, and a loading plate 633 is arranged on the other end of the loading spring 632. A hole is arranged in the middle of the loading plate 633, and the loading plate 633 is sleeved on the loading fixing rod 631; by being arranged at the bottom of the inner cavity of the guide pin 64 Loading fixing rod 631, when the elastic clamping assembly 61 passes through the overload buffer assembly 62, the loading fixing rod 631 extends into the overload ring 614 in the elastic clamping assembly 61, and the overload ring 614 contacts the loading plate 633. At this time, the loading fixing rod 631 is located between the clamping spring 612 and the loading spring 632, which can prevent the clamping spring 612 and the loading spring 632 from shaking after continuing to be compressed, making the spring pressure block structure 6 unstable when pressing down the warped wafer; when the clamping spring 612 and the loading spring 632 continue to be compressed, the spring pressure block structure 6 presses down and fixes the warped wafer with greater elastic potential energy.

[0037] Furthermore, the lower cavity structure 3 includes a support plate 31, the support plate 31 is located directly below the heating upper cover 1, a lower plate body 32 is arranged below the support plate 31, the lower plate body 32 matches the upper cover cavity 11, a sealing ring is arranged on the upper surface of the peripheral side of the lower plate body 32, a push rod 33 is arranged at the bottom of the support plate 31, a guide column 34 is arranged on the peripheral side of the push rod 33, a bellows 35 is arranged on the outer side of the guide column 34, and the bellows 35 is located between the support plate 31 and the lower plate body 32; the support plate 31 arranged directly below the heating upper cover 1 cooperates with vacuum adsorption Component 7 supports the warped wafer. When the driving screw drives the upper cover cavity 11 to move downward, the upper cover cavity 11 is merged with the lower plate body 32 under the support plate 31 to form a closed space, and then the heated upper cover 1 is used to heat the warped wafer. When the warped wafer becomes larger, the push rod 33 at the bottom of the support plate 31 drives the support plate 31 to move downward, so that the space between the support plate 31 and the heated upper cover 1 is sufficient to safely place the warped wafer, so as to avoid the warped wafer being directly crushed by the heated upper cover 1 and the support plate 31 when the lower plate body 32 merges with the upper cover cavity 11 due to the warped wafer becoming larger.

[0038] Furthermore, the vacuum adsorption component 7 is located in the middle of the upper surface of the support plate 31, and the vacuum adsorption component 7 includes a vacuum suction cup 71. The vacuum suction cup 71 is located above the support plate 31. The bottom of the vacuum suction cup 71 is connected to a vacuum duct 72. The other end of the vacuum duct 72 is provided with a vacuum connector 73, and the vacuum connector 73 is externally connected to a vacuum pump; the warped wafer is initially adsorbed and fixed by the vacuum suction cup 71.

[0039] Working principle: When in use, an external manipulator places the warped wafer on top of the vacuum adsorption component 7 inside the lower chamber structure 3. At this time, the warped wafer is initially adsorbed and fixed by the vacuum suction cup 71 to achieve initial fixation. Then, the upper cover chamber 11 is driven and lowered by the driving screw. The upper cover chamber 11 drives the heated upper cover 1 to move downward together, so that the upper cover chamber 11 is combined with the lower plate 32 under the support plate 31 to form a closed space, and then the heated upper cover 1 is used to heat the warped wafer. When the warped wafer becomes larger, the support plate 31 is driven downward by the push rod 33 at the bottom of the support plate 31, so that the support plate 31 and the heated upper cover 1 are connected. The space between them is sufficient to safely place the warped wafer, so as to avoid the warped wafer becoming larger and being directly crushed by the heated upper cover 1 and the supporting plate 31 when the lower plate 32 and the upper cover cavity 11 are merged; and the warping degree of the warped wafer can be alleviated after a period of heating process treatment by the lower pressing screw 12 arranged on the lower surface of the upper cover cavity 11. At this time, the lower pressing screw 12 drives the heated upper cover 1 to move toward the wafer, so as to better perform the heating process treatment on the wafer. During the heating treatment, the electric heating wire 13 arranged in the heated upper cover 1 heats the wafer, and at the same time, the closed space formed by the upper cover cavity 11 and the lower cavity structure 3 prevents heat loss;

[0040] Then, the spring pressure block structure 6 at the bottom of the heating upper cover 1 is pressed down on the warped wafer. In the process of the spring pressure block structure 6 pressing down the warped wafer, the elastic pressing component 61 in the spring pressure block structure 6 first contacts the warped wafer. As the heating upper cover 1 continues to move downward, the elastic pressing component 61 is compressed along the guide pin 64. Through the lower pressing rod 611 and under the action of the pressing spring 612, after the pressing block 613 at the bottom of the lower pressing rod 611 contacts the warped wafer, the pressing block 613 pushes the lower pressing rod 611 to move upward and compresses the pressing spring 612, so that the pressing spring 612 is compressed. The elastic potential energy of the pressing spring 612 presses the warped wafer downward through the pressing block 613, so that the warped wafer can be more firmly fixed on the bottom of the heating upper cover 1.

[0041] When encountering a wafer with a large degree of warping, the elastic clamping component 61 is compressed to a certain extent. In order to prevent the heated upper cover 1 from being continuously pressed down, causing the elastic potential energy condensed by the elastic clamping component 61 to be too large, thereby causing damage to the warped wafer, the elastic clamping component 61 condenses a large elastic potential energy at this time, and its tail pushes the overload buffer component 62, pushing the overload buffer component 62 to both sides. In this process, the elastic clamping component 61 will be further compressed and condense a larger elastic potential energy; through the overload limit blocks 621 set in the middle of the inner cavity on both sides of the guide pin 64, after the elastic clamping component 61 is over-compressed, the elastic clamping component 61 squeezes the overload limit block 621, so that the overload limit block 621 pushes the overload spring 622 to the side, so that the overload spring 622 is compressed in the overload cavity 641; when the clamping spring 612 is compressed to a certain extent, its elastic potential energy is required When the overload limit block 621 is in a state of being pressed, the overload ring 614 pushes the wedge-shaped surface on the overload limit block 621, causing the overload limit block 621 to move to both sides and compressing the overload spring 622. At this time, in order to fully push the overload limit block 621 into the overload cavity 641, the elastic pressing component 61 continues to compress until the protective tube 615 outside the overload ring 614 is no longer obstructed by the overload limit block 621. Then, the elastic pressing component 61 continues to move toward the loading component 63 above the overload buffer component 62, and then the elastic pressing component 61 is slowly released to avoid crushing the warped wafer. As the heated upper cover 1 continues to heat the warped wafer, the warped wafer can withstand greater pressure to complete the recovery of the warped wafer deformation. At this time, the elastic pressing component 61 and the loading component 63 are compressed at the same time, causing their elastic potential energies to increase, thereby pressing down the warped wafer to restore the deformation.

[0042] Then, after the overload buffer component 62 is triggered, the elastic pressing component 61 passes through the overload buffer component 62 and contacts the loading component 63. At this time, after the heated upper cover 1 heats the wafer for a period of time, the deformation of the warped wafer is alleviated, and the brittleness of the warped wafer is reduced at high temperature. Under the action of the loading component 63, a greater pressure can be used to press the warped wafer down. The warped wafer is deformed and fixed by the suction of the vacuum adsorption component 7 and the pressure of the spring pressure block structure 6, and the heating process is carried out;

[0043] In the above process, through the loading and fixing rod 631 set at the bottom of the inner cavity of the guide pin 64, when the elastic clamping assembly 61 passes through the overload buffer assembly 62, the loading and fixing rod 631 extends into the overload ring 614 in the elastic clamping assembly 61, and the overload ring 614 contacts the loading plate 633. At this time, the loading and fixing rod 631 is located between the clamping spring 612 and the loading spring 632, which can prevent the clamping spring 612 and the loading spring 632 from shaking after being further compressed, making the spring pressure block structure 6 unstable in pressing down the warped wafer; when the clamping spring 612 and the loading spring 632 are further compressed, the spring pressure block structure 6 presses down and fixes the warped wafer with greater elastic potential energy;

[0044] When the process is finished, the heating cover 1 rises upward through the drive screw, and the spring pressure block structure 6 begins to recover until it slowly leaves the wafer surface. At this time, the vacuum is disconnected, and the external robot takes out the wafer after the heating process and performs the next process.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A warped wafer reflow heating device, comprising a heating upper cover (1), a spring pressure block structure (6), and a lower cavity structure (3), characterized in that: A first pressing ring (4) and a second pressing ring (5) are arranged at the bottom of the heating upper cover (1); the first pressing ring (4) is located inside the second pressing ring (5); a spring pressing block structure (6) is arranged at the bottom of the first pressing ring (4) and the second pressing ring (5); the spring pressing block structure (6) is used to extrude the warped wafer; the spring pressing block structure (6) comprises an elastic pressing component (61), an overload buffer component (62), a loading component (63) and a guide pin (64); the guide pin (64) is located inside the first pressing ring (4) and the second pressing ring (5), respectively; the elastic pressing component (61) is located at the bottom of the inner cavity of the guide pin (64); the overload buffer component (62) and the loading component (63) are arranged ...). The overload buffer component (62) is located above the elastic pressing component (61), and the loading component (63) is located on the other side of the overload buffer component (62); an upper cover cavity (11) is arranged above the heating upper cover (1), and a driving screw is arranged above the upper cover cavity (11); a lower cavity structure (3) is arranged at the bottom of the heating upper cover (1), and a vacuum adsorption component (7) is arranged inside the upper part of the lower cavity structure (3); the upper cover cavity (11) is driven by the driving screw to move the upper cover cavity (11) in the direction of the lower cavity structure (3), and the spring pressure block structure (6) cooperates with the lower cavity structure (3) to fix the warped wafer.

2. The warped wafer reflow heating device according to claim 1, characterized in that: A pressing screw rod (12) is arranged in the middle of the lower surface of the upper cover cavity (11), and the pressing screw rod (12) is connected between the heating upper cover (1) and the upper cover cavity (11). An electric heating wire (13) is arranged in the heating upper cover (1), and a heat insulation plate is arranged above the electric heating wire (13). The upper cover cavity (11) covers the upper part of the heating upper cover (1), and a sealing ring is arranged on the lower side surface of the upper cover cavity (11).

3. The warped wafer reflow heating device according to claim 1, characterized in that: The spring pressure block structure (6) also includes a connecting block (65), and the connecting block (65) is respectively installed on the lower surface of the first pressure ring (4) and the second pressure ring (5). The guide pin (64) is located in the middle of the connecting block (65) and extends inside the first pressure ring (4) and the second pressure ring (5). The elastic clamping component (61) is located at the bottom of the inner cavity of the guide pin (64) and extends below the guide pin (64).

4. The warped wafer reflow heating device according to claim 1, characterized in that: The elastic clamping assembly (61) comprises a lower clamping rod (611), wherein the lower clamping rod (611) is located inside the guide pin (64), a clamping spring (612) is arranged around the lower clamping rod (611), a clamping block (613) is arranged at the bottom of the lower clamping rod (611), and one end of the clamping spring (612) is connected to the clamping block (613).

5. The warped wafer reflow heating device according to claim 4, characterized in that: The overload buffer assembly (62) comprises an overload limit block (621), the overload limit blocks (621) are respectively located in the middle of the inner cavity on both sides of the guide pin (64), an overload cavity (641) is arranged inside the side wall of the guide pin (64), the overload limit block (621) is slidably arranged inside the overload cavity (641), an overload spring (622) is arranged at the tail of the overload limit block (621), the overload spring (622) is located between the overload limit block (621) and the overload cavity (641), and the tail of the compression spring (612) is arranged on one side of the overload limit block (621).

6. The warped wafer reflow heating device according to claim 5, characterized in that: An overload ring (614) is provided at the other end of the compression spring (612), a wedge-shaped surface is provided on the inner side of the overload limit block (621), the overload ring (614) and the wedge-shaped surface on the overload limit block (621) are arranged opposite to each other, a protective tube (615) is provided on the outer side of the overload ring (614), and the protective tube (615) is located on the outer side of the compression spring (612).

7. The warped wafer reflow heating device according to claim 6, characterized in that: The loading assembly (63) comprises a loading fixing rod (631), one end of the loading fixing rod (631) is fixed to the bottom of the inner cavity of the guide pin (64), the other end of the loading fixing rod (631) is located on one side of the overload buffer assembly (62), a loading spring (632) is arranged around the bottom of the loading fixing rod (631), one end of the loading spring (632) is fixed to the bottom of the inner cavity of the guide pin (64), the other end of the loading spring (632) is arranged with a loading plate (633), a hole is arranged in the middle of the loading plate (633), and the loading plate (633) is sleeved on the loading fixing rod (631).

8. The warped wafer reflow heating device according to claim 1, characterized in that: The lower cavity structure (3) comprises a support plate (31), the support plate (31) being located directly below the heating upper cover (1), a lower plate body (32) being arranged below the support plate (31), the lower plate body (32) being matched with the upper cover cavity (11), a sealing ring being arranged on the upper surface of the peripheral side of the lower plate body (32), a push rod (33) being arranged at the bottom of the support plate (31), a guide column (34) being arranged on the peripheral side of the push rod (33), a bellows (35) being arranged on the outer side of the guide column (34), and the bellows (35) being arranged between the support plate (31) and the lower plate body (32).

9. The warped wafer reflow heating device according to claim 8, characterized in that: The vacuum adsorption assembly (7) is located in the middle of the upper surface of the support plate (31), and the vacuum adsorption assembly (7) comprises a vacuum suction cup (71). The vacuum suction cup (71) is located above the support plate (31), and a vacuum conduit (72) is connected to the bottom of the vacuum suction cup (71). A vacuum joint (73) is provided at the other end of the vacuum conduit (72), and the vacuum joint (73) is externally connected to a vacuum pump.

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